JP3142934U - Circuit board reflow jig - Google Patents

Circuit board reflow jig Download PDF

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Publication number
JP3142934U
JP3142934U JP2008002493U JP2008002493U JP3142934U JP 3142934 U JP3142934 U JP 3142934U JP 2008002493 U JP2008002493 U JP 2008002493U JP 2008002493 U JP2008002493 U JP 2008002493U JP 3142934 U JP3142934 U JP 3142934U
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reflow
guide pin
plate
pallet
circuit board
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洋一 阿部
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Nippon Mektron KK
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Abstract

【課題】フレキシブルプリント基板に部品実装する際の、はんだペースト印刷〜部品実装マウント〜はんだリフローまでの工程において、フレキシブルプリント基板を位置決め仮固定するための回路基板のリフロー治具を提供する。
【解決手段】板状パレット1からガイドピン2を突出させ、バネ機構3によってガイドピン2が下に押し下げることが可能である。また、板状パレット1には貫通する吸引穴10が多数設けられるとともに、バネ機構下部にも貫通穴9が設けられている。このバネ機構内部はシリンダー構造を有しており、貫通穴9から真空吸引するとガイドピン2が下降するように構成される。さらに、非貫通の印刷ベッドとの位置決め勘合穴8が板状パレット1の周囲に複数設けられているリフロー治具4を用いる。
【選択図】図1
Provided is a circuit board reflow jig for positioning and temporarily fixing a flexible printed circuit board in steps from solder paste printing to component mounting mounting to solder reflow when components are mounted on a flexible printed circuit board.
A guide pin 2 protrudes from a plate-like pallet 1 and the guide pin 2 can be pushed down by a spring mechanism 3. Further, the plate-like pallet 1 is provided with a number of through holes 10 penetrating therethrough, and the through holes 9 are also provided at the lower part of the spring mechanism. The inside of the spring mechanism has a cylinder structure, and is configured such that the guide pin 2 descends when vacuumed from the through hole 9. Further, a reflow jig 4 in which a plurality of positioning fitting holes 8 with a non-penetrating printing bed is provided around the plate-like pallet 1 is used.
[Selection] Figure 1

Description

本考案は、フレキシブルプリント基板(FPC)に部品実装するときの、はんだペースト印刷〜部品実装マウント〜はんだリフローまでの工程において、FPCを位置決め仮固定するための回路基板のリフロー治具に関する。   The present invention relates to a circuit board reflow jig for temporarily positioning an FPC in a process from solder paste printing to component mounting mounting to solder reflow when mounting components on a flexible printed circuit board (FPC).

近年は基板表面にチップ部品を実装することが主流となっている。チップ部品を実装する方法としては、基板を位置決め固定してはんだペーストを印刷し、マウンターで部品を基板に載せてリフロー炉を通すことで基板と部品を導通接続する。   In recent years, mounting chip components on the substrate surface has become the mainstream. As a method of mounting a chip component, the substrate is positioned and fixed, a solder paste is printed, the component is mounted on the substrate with a mounter, and the substrate and the component are conductively connected by passing through a reflow furnace.

この印刷〜部品実装マウント〜はんだリフローまでの工程において、同一のリフロー治具に基板を固定して流工するようにすれば、基板のハンドリング機会が削減できて位置合わせも容易になる。さらに、繰り返し用いることができるリフロー治具であれば生産性も良い。具体的には、上記を満足できるリフロー治具が理想である。しかし、このようなリフロー治具は従来存在しなかった。   In the process from printing to component mounting to solder reflow, if the substrate is fixed to the same reflow jig and flow-processed, the handling opportunity of the substrate can be reduced and the alignment becomes easy. Furthermore, productivity is good if it is a reflow jig which can be used repeatedly. Specifically, a reflow jig that can satisfy the above is ideal. However, there has been no such reflow jig.

特許文献1(特許第2517040号公報)の従来例に、板状のパレットから位置決め用ガイドピンが突出しているリフロー治具が示されている。このガイドピンに基板を挿通して位置決め固定するようになっている。     The conventional example of Patent Document 1 (Japanese Patent No. 2517040) shows a reflow jig in which positioning guide pins protrude from a plate-shaped pallet. The substrate is inserted into the guide pins and fixed.

しかし、特許文献1にも記載の通り、ガイドピンの突出によって印刷版との間隔が開けざるを得ないために印刷版との密着性が悪くなる問題がある。そこで、特許文献1ではガイドピンを用いずに、接着剤によってパレットに基板を固定する方法を採用している。   However, as described in Patent Document 1, there is a problem that the adhesiveness with the printing plate is deteriorated because the protrusions of the guide pins inevitably leave a gap with the printing plate. Therefore, Patent Document 1 employs a method of fixing a substrate to a pallet with an adhesive without using guide pins.

しかし、FPCなどの薄い基板では、リフロー後にリフロー治具から基板を取り出す際に、接着剤によって基板が固定されているので引き剥がすときに基板の折れや変形が生じてしまう。近年では加熱によって接着力が弱くなる接着剤もあるが、リフロー後に接着剤が剥がれて異物となって基板に残ることもあり、洗浄が必要となる。   However, in the case of a thin substrate such as an FPC, when the substrate is taken out from the reflow jig after reflow, the substrate is fixed by an adhesive, so that the substrate is bent or deformed when it is peeled off. In recent years, there are adhesives whose adhesive strength is weakened by heating, but after the reflow, the adhesive is peeled off and may become a foreign substance and remain on the substrate, which requires cleaning.

そこで、印刷〜部品実装マウント〜はんだリフローまでガイドピンを用いて基板を位置決め固定し続けるようにするために、図3に示されるリフロー治具4が用いられる。このリフロー治具は、板状パレット1からガイドピン2が突出しており、バネ機構3によってガイドピン2が下に押し下げることが可能となっている。   Therefore, the reflow jig 4 shown in FIG. 3 is used in order to keep the substrate positioned and fixed using the guide pins from printing to component mounting mount to solder reflow. In this reflow jig, the guide pin 2 protrudes from the plate-like pallet 1, and the guide pin 2 can be pushed down by the spring mechanism 3.

図3のようにガイドピン2にFPC5を挿通して位置決め固定し、はんだペースト印刷時には図4のようにスキージ7圧によってガイドピン2が図示下側に押し下げられ、印刷版6がFPC5に密着可能となっている。印刷後はFPC5をこのリフロー治具4に載置固定したまま部品実装マウント〜はんだリフローまでの工程を流工することができる。しかも、接着剤を用いる必要がないので、リフロー後に基板を取り出す際にも引き剥がす力は加わらず、基板の折れや変形が生じてしまうことはないし再利用も容易である。   As shown in FIG. 3, the FPC 5 is inserted into the guide pin 2 and positioned and fixed, and when printing the solder paste, the guide pin 2 is pushed down by the squeegee 7 pressure as shown in FIG. 4, and the printing plate 6 can be in close contact with the FPC 5 It has become. After printing, the steps from component mounting to solder reflow can be flown while the FPC 5 is placed and fixed on the reflow jig 4. In addition, since it is not necessary to use an adhesive, a peeling force is not applied even when the substrate is taken out after reflow, and the substrate is not bent or deformed and can be easily reused.

しかし、ガイドピン2が印刷版6に当接して押し下げられる機構となっているため、印刷版6が損傷してしまうことがある。印刷するはんだペーストの厚みを制御するためには印刷版6の厚みを変える必要があり、特に薄い印刷版6を用いる必要がある場合には印刷版6の損傷が著しくなる。
特許第2517040号公報
However, the printing plate 6 may be damaged because the guide pin 2 comes into contact with the printing plate 6 and is pushed down. In order to control the thickness of the solder paste to be printed, it is necessary to change the thickness of the printing plate 6, and particularly when the thin printing plate 6 needs to be used, the printing plate 6 is significantly damaged.
Japanese Patent No. 2517040

そこで、本考案は、粘着剤を用いずに繰り返し再利用可能であり、はんだペースト印刷〜部品実装マウント〜はんだリフローまでの工程において、確実にFPCを支持、固定できるものであって、しかも、ガイドピンが印刷版に当接して、印刷版が損傷してしまう不具合を回避できる回路基板のリフロー治具を提供するものである。     Therefore, the present invention can be reused repeatedly without using an adhesive, and can reliably support and fix the FPC in the process from solder paste printing to component mounting mounting to solder reflow. It is an object of the present invention to provide a circuit board reflow jig capable of avoiding a problem in which a pin comes into contact with a printing plate and the printing plate is damaged.

板状パレットからガイドピンが突出しており、バネ機構によってガイドピンが下に押し下げることが可能となっている。また、板状パレットには貫通する吸引穴が多数設けられるとともに、バネ機構下部にも貫通穴が設けられている。このバネ機構内部はシリンダー構造を有しており、貫通穴から真空吸引するとガイドピンが下降するようになっている。さらに、非貫通の印刷ベッドとの位置決め勘合穴が板状パレットの周囲に複数設けられているリフロー治具を用いることで、はんだペースト印刷〜部品実装マウント〜はんだリフローまでの工程では、突出したガイドピンによって粘着剤を用いなくても確実にFPCを支持、固定できる。粘着剤を用いないので、このリフロー治具は何の前処理を施すことなく繰り返し再利用が可能となる。さらに、はんだペースト印刷工程ではガイドピンが下降するので、ガイドピンが印刷版に当接して、印刷版が損傷してしまう不具合を回避することができる。     A guide pin protrudes from the plate pallet, and the guide pin can be pushed down by a spring mechanism. The plate-like pallet is provided with a large number of suction holes that penetrate therethrough, and the through holes are also provided in the lower part of the spring mechanism. The inside of the spring mechanism has a cylinder structure, and the guide pin is lowered when vacuum is sucked from the through hole. Furthermore, by using a reflow jig in which a plurality of positioning fitting holes with a non-penetrating printing bed are provided around the plate-shaped pallet, a protruding guide is used in the processes from solder paste printing to component mounting mount to solder reflow. The FPC can be reliably supported and fixed without using an adhesive with a pin. Since no adhesive is used, the reflow jig can be reused repeatedly without any pretreatment. Furthermore, since the guide pin descends in the solder paste printing process, it is possible to avoid the problem that the guide pin comes into contact with the printing plate and the printing plate is damaged.

本考案によれば、粘着剤を用いずに繰り返し再利用可能であり、はんだペースト印刷〜部品実装マウント〜はんだリフローまでの工程において、確実にFPCを支持、固定でき、また、ガイドピンが印刷版に当接して、印刷版が損傷してしまう不具合を回避することができる回路基板のリフロー治具を提供することが可能となる。   According to the present invention, it can be reused repeatedly without using an adhesive, and the FPC can be reliably supported and fixed in the processes from solder paste printing to component mounting mounting to solder reflow, and the guide pin is a printing plate. It is possible to provide a reflow jig for a circuit board that can avoid a problem that the printing plate is damaged due to contact with the plate.

以下、図示の実施例を参照しながら本考案を更に説明する。図1に本考案の位置決め搬送治具としての回路基板のリフロー治具を示す。図1のリフロー治具4にFPC5を載置固定したものを印刷ベッド11に載置した状態が図2である。印刷ベッド11とリフロー治具4とは、位置決め用勘合穴8によって位置決めされる。印刷ベッド11の吸引穴12,13,14はバネ機構3下部の貫通穴9が設けられている箇所に設定され、吸引穴13は板状パレット1に貫通する吸引穴10と同じ箇所に設定される。さらに、板状パレット1に貫通穴が設けられていない箇所にも吸引穴14が設定されている。   The present invention will be further described below with reference to the illustrated embodiments. FIG. 1 shows a circuit board reflow jig as a positioning and conveying jig of the present invention. FIG. 2 shows a state in which the FPC 5 placed and fixed on the reflow jig 4 in FIG. 1 is placed on the print bed 11. The printing bed 11 and the reflow jig 4 are positioned by the positioning fitting holes 8. The suction holes 12, 13, 14 of the printing bed 11 are set at locations where the through holes 9 are provided at the lower part of the spring mechanism 3, and the suction holes 13 are set at the same locations as the suction holes 10 that penetrate the plate-like pallet 1. The Furthermore, suction holes 14 are also set in places where the through-holes are not provided in the plate-like pallet 1.

この状態で図示しない真空ポンプによって真空吸引すると、FPC5は吸引穴13によって、また、リフロー治具4は吸引穴14によって吸引固定されることになる。それと同時に吸引穴12によってガイドピンが下降する。   When vacuum suction is performed with a vacuum pump (not shown) in this state, the FPC 5 is sucked and fixed by the suction hole 13 and the reflow jig 4 is sucked and fixed by the suction hole 14. At the same time, the guide pin is lowered by the suction hole 12.

この状態ではガイドピン2はFPC5より図示上側に突出しておらず、はんだペースト印刷時にガイドピン2が印刷版6に当接せずに版を損傷させることはない。   In this state, the guide pin 2 does not protrude upward from the FPC 5 in the drawing, and the guide pin 2 does not come into contact with the printing plate 6 during printing of the solder paste, and the plate is not damaged.

印刷が終了して真空吸引を解除すると、印刷ベッド11からリフロー治具4の固定が解除されるとともに、バネ機構3によってガイドピン2が上昇する。以下、FPC5をこのリフロー治具4に載置固定したまま部品実装マウント〜はんだリフローまでの工程を流工することができる。   When the vacuum suction is released after the printing is completed, the reflow jig 4 is released from the print bed 11 and the guide pin 2 is raised by the spring mechanism 3. Hereinafter, the steps from component mounting to solder reflow can be flown while the FPC 5 is placed and fixed on the reflow jig 4.

本考案の一実施例による回路基板のリフロー治具の図。The figure of the reflow jig of the circuit board by one example of the present invention. 本考案の一実施例によるリフロー治具を用いたはんだペースト印刷時の動作を示す図。The figure which shows the operation | movement at the time of the solder paste printing using the reflow jig | tool by one Example of this invention. 従来のリフロー治具の図。The figure of the conventional reflow jig. 従来のリフロー治具における問題点の説明図。Explanatory drawing of the problem in the conventional reflow jig.

符号の説明Explanation of symbols

1 板状パレット
2 ガイドピン
3 バネ機構
4 リフロー治具
5 FPC
6 印刷版
7 スキージ
8 勘合穴
9 貫通穴
10 吸引穴
11 印刷ベッド
1 Plate Pallet 2 Guide Pin 3 Spring Mechanism 4 Reflow Jig 5 FPC
6 Printing plate 7 Squeegee 8 Fitting hole 9 Through hole 10 Suction hole 11 Printing bed

Claims (1)

板状パレットからガイドピンを突出させ、バネ機構によって前記ガイドピンが下に押し下げることが可能に構成し、前記板状パレットには貫通する吸引穴が多数設けられるとともに、前記バネ機構下部にも貫通穴が設けられ、このバネ機構内部はシリンダー構造を有しており、前記貫通穴から真空吸引すると前記ガイドピンが下降するように構成され、非貫通の印刷ベッドとの位置決め勘合穴が前記板状パレットの周囲に複数設けられていることを特徴とする回路基板のリフロー治具。     The guide pin protrudes from the plate-like pallet, and the guide pin can be pushed down by a spring mechanism. The plate-like pallet is provided with a number of suction holes that penetrate, and also penetrates the lower part of the spring mechanism. A hole is provided, and the spring mechanism has a cylinder structure, and is configured such that the guide pin descends when vacuum is sucked from the through hole, and the positioning fitting hole with the non-through printing bed is the plate-like shape. A circuit board reflow jig, wherein a plurality of reflow jigs are provided around a pallet.
JP2008002493U 2008-04-18 2008-04-18 Circuit board reflow jig Expired - Lifetime JP3142934U (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103949919A (en) * 2014-05-26 2014-07-30 苏州夏恩机械有限公司 Positioning clamp of pin hole
CN104690577A (en) * 2015-01-26 2015-06-10 天津大学 Sucking supporting head provided with rigid and flexible supports and used for machining grids of thin-walled workpiece
CN106976303A (en) * 2017-03-28 2017-07-25 华勤通讯技术有限公司 A kind of printing fixture for circuit board, excessively furnace carrier and circuit board printing device
CN107949175A (en) * 2018-01-03 2018-04-20 环维电子(上海)有限公司 Circuit board fixing mechanism, transfer system, surface mount production line and method
CN110977076A (en) * 2019-12-27 2020-04-10 京信通信技术(广州)有限公司 Reflow soldering positioning welding tool
CN112171083A (en) * 2020-09-27 2021-01-05 嘉兴艾可镭光电科技有限公司 Picosecond laser automatic cutting equipment
CN112289720A (en) * 2020-09-17 2021-01-29 江苏长电科技股份有限公司 Composite primary-secondary carrier plate and using method
CN115056163A (en) * 2022-06-29 2022-09-16 和信精密科技(吴江)有限公司 Accurate clamping positioning system

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103949919A (en) * 2014-05-26 2014-07-30 苏州夏恩机械有限公司 Positioning clamp of pin hole
CN104690577A (en) * 2015-01-26 2015-06-10 天津大学 Sucking supporting head provided with rigid and flexible supports and used for machining grids of thin-walled workpiece
CN104690577B (en) * 2015-01-26 2017-01-18 天津大学 Sucking supporting head provided with rigid and flexible supports and used for machining grids of thin-walled workpiece
CN106976303A (en) * 2017-03-28 2017-07-25 华勤通讯技术有限公司 A kind of printing fixture for circuit board, excessively furnace carrier and circuit board printing device
CN107949175A (en) * 2018-01-03 2018-04-20 环维电子(上海)有限公司 Circuit board fixing mechanism, transfer system, surface mount production line and method
CN107949175B (en) * 2018-01-03 2024-05-03 环维电子(上海)有限公司 Circuit board fixing mechanism, transfer system, surface mounting production line and method
CN110977076A (en) * 2019-12-27 2020-04-10 京信通信技术(广州)有限公司 Reflow soldering positioning welding tool
CN112289720A (en) * 2020-09-17 2021-01-29 江苏长电科技股份有限公司 Composite primary-secondary carrier plate and using method
CN112289720B (en) * 2020-09-17 2024-04-09 江苏长电科技股份有限公司 Composite type primary-secondary carrier plate and application method thereof
CN112171083A (en) * 2020-09-27 2021-01-05 嘉兴艾可镭光电科技有限公司 Picosecond laser automatic cutting equipment
CN115056163A (en) * 2022-06-29 2022-09-16 和信精密科技(吴江)有限公司 Accurate clamping positioning system

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