CN112475528A - A reprocess reflow soldering anchor clamps for 5G communication product - Google Patents

A reprocess reflow soldering anchor clamps for 5G communication product Download PDF

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Publication number
CN112475528A
CN112475528A CN202011547713.1A CN202011547713A CN112475528A CN 112475528 A CN112475528 A CN 112475528A CN 202011547713 A CN202011547713 A CN 202011547713A CN 112475528 A CN112475528 A CN 112475528A
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CN
China
Prior art keywords
product
limiting
reflow soldering
hole
limiting block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011547713.1A
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Chinese (zh)
Inventor
康健
王聪
邵绵香
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Flextronics Technology Suzhou Co Ltd
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Flextronics Technology Suzhou Co Ltd
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Filing date
Publication date
Application filed by Flextronics Technology Suzhou Co Ltd filed Critical Flextronics Technology Suzhou Co Ltd
Priority to CN202011547713.1A priority Critical patent/CN112475528A/en
Publication of CN112475528A publication Critical patent/CN112475528A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/087Soldering or brazing jigs, fixtures or clamping means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a repair reflow soldering clamp for a 5G communication product, which comprises: the fixture comprises a fixture body, a reinforcing rib, a profiling mounting groove, a positioning hole, a positioning pin and a limiting assembly, wherein the profiling mounting groove is formed in the fixture body, the reinforcing rib is arranged at the bottom of the profiling mounting groove, the positioning hole is formed in the reinforcing rib, and the lower portion of the positioning pin penetrates through a hole in a product and is detachably connected with the positioning hole. Through the mode, the repair reflow soldering fixture for the 5G communication product can achieve the purpose that secondary furnace passing is completed through the fixture under the condition that no board edge exists after PCBA board cutting, the repair rate is improved, and the production cost is reduced.

Description

A reprocess reflow soldering anchor clamps for 5G communication product
Technical Field
The invention relates to the field of electronic industry assembly, in particular to a repair reflow soldering clamp for a 5G communication product.
Background
In recent years, with the development of 5G communication, the attention of 5G communication products is increasing, and the demand is rapidly increasing, and PCBA is a common communication product, but when problems occur in the PCBA during production, the PCBA without board edges cannot be processed by secondary over-reflow soldering.
Disclosure of Invention
The invention mainly solves the technical problem of providing a repair reflow soldering fixture for 5G communication products, which has the advantages of high reliability, accurate positioning, compact structure and the like, and has wide market prospect in the application and popularization of electronic industry assembly equipment.
In order to solve the technical problems, the invention adopts a technical scheme that:
provided is a rework reflow soldering jig for a 5G communication product, including: a clamp body, a reinforcing rib, a profiling installation groove, a positioning hole, a positioning pin and a limiting component,
the profile modeling installation groove is arranged in the clamp body, the reinforcing rib is arranged at the bottom of the profile modeling installation groove, the positioning hole is arranged on the reinforcing rib, the lower part of the positioning pin passes through the hole on the product and is detachably connected with the positioning hole,
the limiting component comprises a limiting block, a limiting connecting rod and a limiting hole, the limiting hole is arranged on the top surface of the clamp body, the lower part of the limiting connecting rod is rotatably connected with the limiting hole, the upper part of the limiting connecting rod is connected with one end of the limiting block, the bottom surface of the limiting block is contacted with the top surface of the clamp body,
when the limiting block moves to the upper part of the profiling installation groove, the limiting block is tightly pressed on the top surface of the product to lock the product and prevent the product from moving up and down; when the limiting block leaves the profiling installation groove, the limiting block is separated from the product to unlock the product so as to carry out loading and unloading on the product.
In a preferred embodiment of the invention, the contour mounting groove and the reinforcing rib are matched to bear a product, so that the top surface of the product is flush with the top surface of the clamp body.
In a preferred embodiment of the present invention, the reinforcing rib is provided with a plurality of positioning holes.
In a preferred embodiment of the present invention, the limit connecting rod and the limit hole are in threaded connection.
In a preferred embodiment of the present invention, the clamp body is provided with an avoiding groove.
The invention has the beneficial effects that: the secondary furnace passing can be completed through the fixture under the condition that no plate edge exists after the PCBA cuts the plate, the repair rate is improved, and the production cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural diagram of a repair reflow soldering fixture for a 5G communication product according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention includes:
the utility model provides a reprocess reflow soldering anchor clamps for 5G communication product, has cut the PCBA of board through the anchor clamps is fixed, uses the spacing PCBA that bears of anchor clamps, has realized that no flange limit PCBA accomplishes the secondary and has crossed reflow soldering and accomplish BGA and reprocess, and its structure includes: the fixture comprises a fixture body 1, a reinforcing rib 2, a profiling installation groove 3, a positioning hole 4, a positioning pin and a limiting assembly.
The profile modeling mounting groove set up in this is internal to the anchor clamps, the strengthening rib set up in the bottom of profile modeling mounting groove, when using, the PCBA board that does not have the flange limit is placed in the profile modeling mounting groove to by the bottom surface of strengthening rib bearing product, make the top surface of product and the top surface of anchor clamps body flush.
The locating hole set up in on the strengthening rib, the hole on the product is passed to the lower part of locating pin to can dismantle with the locating hole and be connected, further fix a position the product, place the product and produce the displacement in the course of working, improve accurate nature.
The limiting assembly comprises a limiting block 6, a limiting connecting rod 7 and a limiting hole, the limiting hole is formed in the top surface of the fixture body, the lower portion of the limiting connecting rod is rotatably connected with the limiting hole, the upper portion of the limiting connecting rod is connected with one end of the limiting block, the bottom surface of the limiting block is in contact with the top surface of the fixture body, and therefore the limiting block can compress a product in the profiling installation groove.
Wherein, the limiting connecting rod and the limiting hole can be in threaded connection.
When the limiting block moves to the upper part of the profiling installation groove, the limiting block is tightly pressed on the top surface of the product to lock the product and prevent the product from moving up and down; when the limiting block leaves the profiling installation groove, the limiting block is separated from the product to unlock the product so as to carry out loading and unloading on the product.
Through locating pin and stopper mode, fixed PCBA prevents that secondary backward flow PCB from being heated and producing the deformation and lead to the product to reprocess the unsuccessful product of causing and scrap.
The use steps of the rework reflow soldering fixture for 5G communication products comprise:
the first step is as follows: taking a repair reflow soldering fixture and a positioning pin, placing a workbench, and opening a limiting block;
the second step is that: placing the PCBA with the BGA on the fixture body through the profiling mounting groove with the front side facing upwards;
the third step: locking the PCBA positioning pin and the PCBA limiting block;
the fourth step: placing the BTU chain on a reflow furnace to wait for reflow;
the fifth step: after reflow soldering is finished, waiting for cooling, and taking out the PCBA to finish the BGA repair;
the invention discloses a repair reflow soldering fixture for a 5G communication product, which has the beneficial effects that:
1. the fixture can complete secondary furnace passing under the condition that no plate edge exists after the PCBA cuts the plate, so that the repair rate is improved;
2. material scrap caused by process defects and process problems is eliminated, and production cost is reduced.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (5)

1. A rework reflow soldering fixture for 5G communication products, comprising: a clamp body, a reinforcing rib, a profiling installation groove, a positioning hole, a positioning pin and a limiting component,
the profile modeling installation groove is arranged in the clamp body, the reinforcing rib is arranged at the bottom of the profile modeling installation groove, the positioning hole is arranged on the reinforcing rib, the lower part of the positioning pin passes through the hole on the product and is detachably connected with the positioning hole,
the limiting component comprises a limiting block, a limiting connecting rod and a limiting hole, the limiting hole is arranged on the top surface of the clamp body, the lower part of the limiting connecting rod is rotatably connected with the limiting hole, the upper part of the limiting connecting rod is connected with one end of the limiting block, the bottom surface of the limiting block is contacted with the top surface of the clamp body,
when the limiting block moves to the upper part of the profiling installation groove, the limiting block is tightly pressed on the top surface of the product to lock the product and prevent the product from moving up and down; when the limiting block leaves the profiling installation groove, the limiting block is separated from the product to unlock the product so as to carry out loading and unloading on the product.
2. A rework reflow soldering jig for 5G communication products according to claim 1, wherein the profile mounting groove and the reinforcing bars cooperate to carry the product such that the top surface of the product is flush with the top surface of the jig body.
3. A repair reflow soldering jig for 5G communication products according to claim 1, wherein the reinforcing bar is provided with a plurality of positioning holes.
4. A repair reflow soldering jig for 5G communication products according to claim 1, wherein the limit connecting rod and the limit hole are in threaded connection.
5. A repair reflow soldering jig for 5G communication products according to claim 1, wherein the jig body is provided with an avoiding groove.
CN202011547713.1A 2020-12-24 2020-12-24 A reprocess reflow soldering anchor clamps for 5G communication product Pending CN112475528A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011547713.1A CN112475528A (en) 2020-12-24 2020-12-24 A reprocess reflow soldering anchor clamps for 5G communication product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011547713.1A CN112475528A (en) 2020-12-24 2020-12-24 A reprocess reflow soldering anchor clamps for 5G communication product

Publications (1)

Publication Number Publication Date
CN112475528A true CN112475528A (en) 2021-03-12

Family

ID=74915595

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011547713.1A Pending CN112475528A (en) 2020-12-24 2020-12-24 A reprocess reflow soldering anchor clamps for 5G communication product

Country Status (1)

Country Link
CN (1) CN112475528A (en)

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