JP2002204065A - Jig plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid warping a mounting board, improve the reliability for surface-mounting components on the mounting board, miniaturize products and reduce the cost. SOLUTION: The jig plate 1 has a plate 2 having a board setting hole 3 for setting a mounting board A, a positioning hole 4 formed around the mounting hole 3 for positioning a bent projective component D, escape holes 5 for escaping components E on the mounting board A backside at the bottom of the board setting hole 3 of the plate 2, and a through-hole 6 passing through the plate 2. With the mounting board A set in the board setting hole 3 of the jig plate 1, a tape F is pasted to the backside of the plate 2 and the backside of the mounting board A facing the through-hole 6, thereby fixing the mounting board A to the plate 1 to reinforce it enough to prevent the board A from warping.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig plate suitable for use in a manufacturing process of a board for mounting parts on a mounting board.

[0002]

2. Description of the Related Art Generally, when components are mounted on a mounting board as a manufacturing process of the board, the mounting board itself is transported using a transport conveyor, and a printing process, an adhesive application process, The mounting process and the reflow process are sequentially performed.

[0003] In the printing step, the mounting substrate being transported is temporarily lifted from the transport conveyer, and in this state, a thin plate-like mask is placed on the surface of the mounting substrate, and cream solder or the like is mounted on the mounting substrate through the mask. Apply to the surface of. In the adhesive application step, an adhesive is applied to a position on the mounting board where components are to be mounted. Further, in the component mounting step, the component is mounted on the surface of the mounting board using a mounter or the like, and the component is fixed to the mounting board with an adhesive. In the reflow process, the cream solder applied in the printing process is melted to join the component-side electrode and the substrate-side electrode, thereby manufacturing a product such as an electronic module in which the component is mounted on a mounting board.

[0004] In addition, in the above-mentioned conventional mounting equipment, a product (mounting board) is limited by restrictions on the equipment and the like.
In the range of 3 mm outside the area, no components can be mounted, and the area outside the mounting board is dead space. For this reason,
In the prior art, the mounting substrate was formed larger than necessary.

[0005]

However, as the mounting substrate, a thin substrate having a thickness of, for example, about 0.5 mm may be used. For this reason, when the mounting substrate is placed on the transport conveyor and various processes are performed as in the above-described related art, the mounting substrate tends to be warped.
When the mounting board is warped, a gap is formed between the mask and the mounting board in the printing process, so that the cream solder enters the gap and the amount of the cream solder applied to the mounting board increases. become. As a result, there is a problem that the adjacent electrodes are joined by the molten cream solder, and the electrodes are short-circuited.

In general, in an adhesive application step and a component mounting step, a position at which a component is mounted (adhesive is applied) is measured, for example, by measuring a distance from a positioning mark provided at a corner or the like of a mounting board. Is determined. However, when the mounting board is warped, the distance from the positioning mark to the position at which the component is mounted changes, so that the mounting position of the component shifts and the electrode of the component cannot be joined to the electrode of the mounting substrate. There is.

Further, in the component mounting step, the component is mounted on the mounting substrate by pressing the component against the mounting substrate with a mounter or the like. However, there is also a problem that when a component is placed on a portion having a large warp such as near a corner of the mounting board and the component is pressed against the board, the component is displaced along the inclination of the mounting board.

Further, in the mounting equipment according to the prior art, the area of 3 mm outside the mounting substrate becomes a dead space.
It is necessary to previously form a large mounting substrate, which hinders miniaturization of the product and increases the manufacturing cost.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described problems, and an object of the present invention is to prevent warpage of a mounting board, improve reliability when components are surface-mounted on the mounting board, and
An object of the present invention is to provide a jig plate capable of reducing the size and cost of a product.

[0010]

According to a first aspect of the present invention, there is provided a jig plate for mounting a component on a back surface of a mounting board on which a component is mounted on a front surface of the mounting plate. It is formed in a concave groove shape having a shape corresponding to the outer shape of the substrate, and is constituted by a substrate mounting hole for mounting the mounting substrate on the plate in a substrate manufacturing process.

With this configuration, by mounting the mounting board in the board mounting hole of the plate, the plate can be fixed in a state of being overlapped on the back side of the mounting board. For this reason, the mounting substrate can be reinforced by the plate, and the mounting substrate can be prevented from warping.

Further, even when there is a dead space where components cannot be mounted due to restrictions on mounting equipment, etc.,
A portion of the plate surrounding the substrate mounting hole can be used as a dead space. Therefore, components can be mounted over the entire surface of the mounting board irrespective of the restrictions on the mounting equipment.

According to a second aspect of the present invention, the plate is provided with a component escape hole located at the bottom side of the board mounting hole for allowing a component mounted on the back surface of the mounting board to escape.

Thus, even when the component is mounted on the back surface of the mounted component, the component protruding from the back surface of the mounting board can be inserted into the component relief hole. For this reason, for example, even when lifting the mounting board from the transport conveyor in the printing process, regardless of the arrangement of the components attached to the back surface of the mounting board,
In order to correct the warpage of the plate or the like at an arbitrary position on the back surface of the plate, for example, a backup pin is brought into contact with the plate and the plate can be supported by the backup pin. As a result, even when the plate bends and deforms together with the mounting board, the backup pin can be reliably arranged at a position that compensates for the bending deformation, and a printing process can be performed on the mounting board in a substantially planar state.

Further, even when the heat capacity of the entire mounting board is increased by the components provided on the back surface of the mounting board, the heat capacity can be reduced by the component relief holes provided on the plate. Therefore, by forming a component relief hole according to the external shape of the component, the entire heat capacity of the plate and the mounting substrate can be made uniform regardless of the size of the component, and the mounting substrate in the reflow process can be made uniform. It is possible to suppress the temperature variation for each component and to reliably connect the component to the mounting board.

A third aspect of the present invention is that the plate is provided with a protruding part positioning hole having a shape corresponding to the outer shape of the protruding part for positioning the protruding part protruding from the mounting board.

Thus, even when a component protruding from the mounting board toward the plate is mounted, the protruding part of the component can be arranged in the protruding component positioning hole, and the component can be positioned.

A fourth aspect of the present invention resides in that the substrate mounting hole is set to have a depth dimension substantially equal to or smaller than the thickness dimension of the mounting substrate.

Thus, when the mounting substrate is placed in the substrate mounting hole of the plate, the surface of the mounting substrate and the surface of the plate are arranged flush with each other or the surface of the mounting substrate protrudes from the surface of the plate. be able to. Therefore, in the printing process, the mask can be placed on the surface of the mounting board in close contact with the surface, and cream solder or the like can be applied to a predetermined position of the mounting board.

When the depth dimension of the board mounting hole is set to a value substantially equal to the thickness dimension of the mounting board, even when mounting a component projecting from the mounting board toward the plate,
The protruding part of the part can be supported by the plate surface.

A fifth aspect of the present invention resides in that a plurality of plates having the same shape are prepared, and each of the plates has a substrate mounting hole having a shape corresponding to a mounting substrate having a different outer shape.

Thus, the mounting boards having different shapes can be respectively mounted on the plates having the board mounting holes according to the outer shape. At this time, since the plates are formed in the same shape, the difference in the outer shape of the mounting board can be compensated for by the plates. For this reason,
When transported by the transport conveyor, the entire shape consisting of the plate and the mounting substrate can be made uniform, and the mounting substrate of a different outer shape is transported using the same transport conveyor,
Components can be surface mounted.

Further, the difference in heat capacity based on the difference in outer shape of the mounting board can be compensated for by the plate. For this reason, since the entire heat capacity composed of the plate and the mounting board can be made uniform, it is possible to suppress the temperature variation between the mounting boards in the reflow process, and to reliably join the components to the mounting board.

According to a sixth aspect of the present invention, the plate is provided with a through hole located at the bottom side of the substrate mounting hole and penetrating the plate, and partially inserted into the through hole on the back side of the plate. A tape is stuck, and the mounting substrate is temporarily fixed to the plate using the tape.

Thus, the tape can be adhered to the back side of the plate, and a part of the tape can be inserted into the through hole to adhere to the mounting substrate. For this reason, the mounting substrate can be temporarily fixed to the plate using the tape.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a jig plate according to the present invention will be described in detail with reference to the accompanying drawings. Here, FIG. 1 to FIG. 8 show a first embodiment.

In the drawing, A is a mounting board to which the embodiment of the present invention is applied. The mounting board A is formed in, for example, a substantially rectangular flat plate shape, and has a component B, a linear protruding component C, A bent protruding part D is mounted, and a part E is mounted on the back side.

The linear protruding component C has a flat bottom surface and extends linearly, and a part thereof protrudes outward from the end surface of the mounting board A. On the other hand, the bent protruding part D is
The tip bends toward the back side of the mounting board A, and the bent portion protrudes outside the end face of the mounting board A.

Reference numeral 1 denotes a jig plate used for surface-mounting the component B and the protruding components C and D on the mounting board A. The jig plate 1 has a plate 2 described later and a concave portion formed in the plate 2. It is roughly constituted by a substrate mounting hole 3, a protruding component positioning hole 4, a component relief hole 5, and the like.

Reference numeral 2 denotes a plate which forms the outer shape of the jig plate 1. The plate 2 is formed in a substantially rectangular plate shape using, for example, an insulating resin material. Also, plate 2
The area is formed larger than the area of the mounting substrate A, for example, and covers the entire back surface of the mounting substrate A.
Then, the plate 2 is formed in a frame shape surrounding the hole bottom 2A, which is located on the center portion side and has a thin wall bottom portion 2A provided with a substrate mounting hole 3 described later and is located on the outer peripheral edge side. And a thick frame portion 2B.

Reference numeral 3 denotes a substrate mounting hole located in the center of the plate 2 and formed in a concave groove shape. The substrate mounting hole 3 has a substantially square bottomed shape corresponding to the outer shape of the mounting substrate A. It is formed as a hole, the bottom side of which is the hole bottom 2A of the plate 2. Further, the depth of the substrate mounting hole 3 is set to a value substantially equal to the thickness of the mounting substrate A, for example. Thus, in a state where the mounting substrate A is accommodated in the substrate mounting hole 3, the surface of the mounting substrate A and the surface of the frame portion 2B of the plate 2 are substantially flush with each other. For this reason, when attaching the linear projecting component C projecting outward from the mounting board A (toward the frame portion 2B side of the plate 2), the frame portion 2B
Thereby, the linear projecting part C can be supported.

When the linear projecting component C is not mounted, the depth of the board mounting hole 3 may be set to a value smaller than the thickness of the mounting board A. In this case, when the mounting board A is placed in the board mounting hole 3 of the plate 2, the surface of the mounting board A is arranged so as to protrude from the surface of the frame 2 B of the plate 2.

Reference numeral 4 denotes a protruding component positioning hole provided around the board mounting hole 3 and provided in the frame portion 2B of the plate 2. The protruding component positioning hole 4 is located outside the mounting board A (the frame of the plate 2). (Part 2B side) is disposed at a position corresponding to the bent protruding part D attached in a state of protruding toward the part 2B).
The protruding component positioning hole 4 has a bent protruding component D having a portion protruding from the front surface of the mounting board A toward the back surface.
Is formed in the frame portion 2B of the plate 2 so as to correspond to the outer shape of the plate 2, and is formed, for example, in a rectangular groove shape shallower than the substrate mounting hole 3. The projecting component positioning hole 4 prevents the frame portion 2B of the plate 2 from interfering with the projecting component D and positions the projecting component D when the projecting component D is surface-mounted. It is.

Since the linear projecting part C has a flat bottom surface and does not interfere with the frame 2B of the plate 2, there is no need to provide a projecting part positioning hole corresponding to the linear projecting part C. .

Reference numerals 5 and 5 denote component relief holes located at the bottom of the substrate mounting hole 3 and provided in the hole bottom 2A of the plate 2. Each of the component relief holes 5 is provided on the back surface of the mounting substrate A during surface mounting. The component E is placed at a position corresponding to the component E to be mounted in advance.
Is formed, for example, as a substantially square hole with a bottom. The component escape hole 5 accommodates and escapes the component E in a state in which the mounting board A is mounted on the jig plate 1, and prevents the hole bottom 2 A of the plate 2 from interfering with the component E and soldering. It has a function to prevent parts from falling during the attaching method.

Reference numeral 6 denotes a through hole provided in the center of the plate 2 and penetrating through the hole bottom 2A.
For example, it is formed with a substantially circular opening. And
The back surface of the mounting board A is exposed inside the through hole 6. For this reason, as shown in FIG. 2, a heat-resistant adhesive tape F is attached to the back surface of the plate 2 and a part thereof is partially inserted into the through hole 6 and attached to the back surface of the mounting board A. can do. Thus, the mounting substrate A can be temporarily fixed to the jig plate 1 using the tape F.

The jig plate 1 according to the present embodiment has the above-described configuration. Next, a method of surface-mounting the component B and the like on the mounting board A using the jig plate 1 will be described with reference to FIGS. I will explain it.

First, as shown in FIG. 2, the mounting substrate A is mounted in the substrate mounting hole 3 of the jig plate 1. In this state,
The tape F is attached to the back surface of the plate 2, and a part of the tape F is attached to the mounting board A through the through hole 6. Thus, the mounting substrate A is temporarily fixed to the jig plate 1.

Next, as shown in FIG. 3, the jig plate 1 on which the mounting board A is mounted is placed on the conveyor 11. Then, the jig plate 11 is transported by the transport conveyor 11, and a printing process, an adhesive application process, a component mounting process, and a reflow process described below are sequentially performed as a substrate manufacturing process during the transport.

First, in the printing step, the elevating device 12 is raised, and the elevating device 12
And the jig plate 1 is temporarily lifted from the conveyor 11 and, in this state, a thin plate-shaped mask 13 made of, for example, a metal material is placed on the surface of the mounting board A and the jig plate 1 (see FIG. 8). ). And the mask 13
Then, the cream solder 14 is applied to the surface of the mounting board A through the process, and the cream solder 14 is attached to an electrode pad (not shown) located on the surface of the mounting board A. Thereafter, the elevating device 12 is lowered to move the jig plate 1 to the transport conveyor 1.
Return to the top.

Next, in the adhesive application step, the lifting device 12
The jig plate 1 is lifted from the conveyor 11 by using. Then, after the adhesive 15 is applied to positions on the surface of the mounting board A corresponding to the parts B and the protruding parts C and D, the lifting / lowering device 2 is lowered to return the jig plate 1 onto the conveyor 11.

Next, in the component mounting step, the jig plate 1 is lifted from the conveyor 11 by using the elevating device 12, and the component is mounted on the surface of the mounting substrate A by using the mounter 16 or the like as shown in FIGS. B, the protruding components C and D are attached, and the component B and the protruding components C and D are fixed to the mounting board A by the adhesive 15. Thereafter, the elevating device 12 is lowered to return the jig plate 1 onto the conveyor 11.

Finally, in the reflow step, the mounting board A is inserted together with the jig plate 1 into a reflow furnace 17 (heating furnace), and the cream solder 14 applied in the printing step is melted to make parts B, protruding parts C and D And the electrode pads on the mounting board A side are joined. Then, jig plate 1
The mounting substrate A can be manufactured by removing the mounting substrate A from the surface and mounting the component B and the protruding components C and D on the surface.

Thus, in the present embodiment, the plate 2
Since the substrate mounting hole 3 is provided on the mounting substrate A, the mounting substrate A is mounted on the substrate mounting hole 3 so that the plate 2 can be fixed in a state where the plate 2 is superimposed on the back surface side of the mounting substrate A. Therefore, the mounting board A can be reinforced by the plate 2 to prevent the mounting board A from warping.
4 can be prevented from being short-circuited between the electrodes, and the component B and the protruding components C and D can be attached to the mounting board A in a state where they are aligned with high precision.

That is, when the component B and the protruding components C and D are mounted directly on the mounting board A 'as in the comparative example shown in FIG. 9, the thin mounting board A' itself is deformed in advance. There is. Further, when the mounting board A 'is supported by the elevating device 12, the central portion of the mounting substrate A' which does not contact the elevating device 12 may be lowered and deformed into a curved shape. For this reason, a gap is formed between the flat mask and the mounting board A 'in the printing process, so that the cream solder enters the gap, the amount of the cream solder increases, and a short circuit occurs between adjacent electrodes. There is.

Further, when the mounting board A 'is warped, the distance from the positioning mark (not shown) on the mounting board A' to the position where the component B and the protruding components C and D are mounted is different from when the warping does not occur. In this case, there is a problem that the mounting position of the component B or the like is shifted, and the electrodes of the component B or the like cannot be joined to the electrodes of the mounting board A '.

Further, when the component B and the projecting components C and D are mounted on the warped portion of the mounting board A 'in the component mounting step, the component B and the like are displaced along the inclination of the mounting board A'. There is also a problem.

On the other hand, in the present embodiment, as shown in FIGS. 3 to 8, surface mounting is performed with the mounting substrate A mounted on the jig plate 1, so that the mounting substrate A may be warped. In addition, the short circuit between the electrodes due to the increase of the cream solder 14 can be prevented, and the parts B, the protruding parts C and D can be prevented.
Can be mounted on the mounting board A in a state where the is positioned with high precision. As a result, it is possible to improve the reliability of the mounting board A after the components are mounted, and to increase the degree of integration of the components B and the like.

Further, as shown in the comparative example of FIG. 9, in the prior art, the mounting board A 'is formed large in advance, and a disposal board portion 18 for supporting the protruding components C and D at the time of surface mounting is provided. Then, after the reflow process is completed, the mounting substrate A 'is cut along a V-shaped groove cut or formed in advance as secondary processing.
And the discarded board part 18 is removed from the mounting board A ′. For this reason, it is necessary to provide the mounting substrate A 'with the discarded substrate portion 18 which is removed after the components are mounted, and the cost of the mounting substrate A' increases, which causes a problem that the manufacturing cost increases. After removing the discarded substrate portion 18,
Burrs and the like due to cutting and the like tend to occur around the mounting substrate A '. For this reason, there is a problem in the prior art that it is difficult to apply to a product in which the outer shape accuracy of the mounting board A 'is required, such as when a mounting board to be arranged in a narrow space is arranged.

On the other hand, in the present embodiment, the depth dimension of the board mounting hole 3 is set to a value substantially equal to the thickness dimension of the mounting board A, so that the surface of the mounting board A and the frame 2
The surface B can be arranged flush with the surface B. Therefore, even when the linear projecting component C projecting from the mounting board A toward the plate 2 is mounted, the linear projecting component C can be supported by the surface of the frame 2B of the plate 2.

As a result, the mounting substrate A does not need to be provided with the discarded substrate portion 18 serving as a dead space unlike the comparative example, so that the component B and the protruding components C and D are provided on the entire surface of the mounting substrate A. Can be arranged, and the manufacturing cost can be reduced. Further, since it is not necessary to perform secondary processing such as cutting on the mounting board A, productivity can be improved and the outer shape accuracy of the mounting board A can be improved.

Further, since the protruding component positioning hole 4 is provided in the plate 2, even when the bending protruding component D extending along the end surface side of the mounting board A is mounted, the bending protruding component D is inserted into the protruding component positioning hole 4. The bent protruding part D can be positioned and positioned. Further, since the bent protruding parts D can be arranged on the surface of the mounting substrate A without providing the disposal substrate portion 18 on the mounting substrate A, productivity can be improved and manufacturing costs can be reduced.

Further, as shown in the comparative example shown in FIG. 9, when the mounting board A 'is bent and deformed (warped), the mounting board A' is supported from the back side by a backup pin on a largely warped portion of the mounting board A '. A method of correcting warpage is employed. However, when the component E is attached to the back surface of the mounting board A ', the component E interferes, so that the backup pin cannot be arranged at an arbitrary position, and there is a problem that the warp cannot be sufficiently corrected. .

However, in this embodiment, since the plate 2 is provided with the bottomed component escape hole 5 for accommodating the component E attached to the back surface of the mounting board A, when the jig plate 1 is bent and deformed. However, as shown in FIG. 8, the backup pin 19 can be brought into contact with an arbitrary position on the back surface of the jig plate 1, and the backup pin 19 can compensate for the bending deformation (warpage) of the jig plate 1.

Even when the heat capacity of the entire mounting board A increases due to the component E provided on the back surface of the mounting board A, the heat capacity can be reduced by the component escape hole 5 provided in the plate 2. For this reason, by forming the component relief hole 5 corresponding to the external shape of the component, the entire heat capacity composed of the plate 2 and the mounting board A can be made uniform irrespective of the size of the component. Of the temperature of each mounting board A of the
Etc. can be securely joined.

In the prior art, when the central portion of the mounting substrate A 'projects downward and curves as in the comparative example shown in FIG. 9, the backup pins and the like are brought into contact with the back surface of the mounting substrate A'. This compensates for the warpage of the mounting board A '. However, when the central portion of the mounting board A 'protrudes upward and curves, there is a problem that the warpage of the mounting board A' cannot be compensated.

On the other hand, in the present embodiment, since the plate 2 is provided with the through hole 6, the tape F is attached to the back surface of the plate 2 and a part thereof is inserted into the through hole 6. Affix to the mounting substrate A and use the tape F to mount the mounting substrate A
Can be temporarily fixed to the plate 2. For this reason, even when the center portion side of the mounting substrate A projects upward and curves as compared with the outer peripheral side, the mounting substrate A is pressed against the plate 2 using the tape F, and the warpage of the mounting substrate A is corrected to substantially reduce the warpage. They can be arranged in a plane.

Further, in this embodiment, since the frame 2B surrounding the substrate mounting hole 3 is formed in the plate 2, even when a dead space in which components cannot be mounted due to restrictions on mounting equipment or the like occurs. , The frame 2B can be used for the dead space. For this reason, the component B can be mounted over the entire surface of the mounting board A irrespective of the restrictions on the mounting equipment and the like, and the production cost can be reduced by reducing the number of materials. Further, since a dead space can be omitted from the mounting substrate A, the size of the product can be reduced.

Next, FIGS. 10 to 12 show a second embodiment. The feature of this embodiment is that a plurality of plates having the same shape are prepared, and each plate has a different outer shape. The substrate mounting holes having different shapes are formed in accordance with the plurality of mounting substrates A1 and A2. In this embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

Reference numeral 21 denotes one jig plate according to the present embodiment. The jig plate 21 includes a plate 22 and the plate 22 similarly to the jig plate 1 according to the first embodiment.
Is formed by a substrate mounting hole 23 formed in the substrate.

The plate 22 has a substantially rectangular plate shape, and its outer shape is formed larger than one mounting board A1. The plate 22, like the plate 2 according to the first embodiment, includes a thin hole bottom 22A and a thick frame 22B surrounding the hole bottom 22A.

The substrate mounting hole 23 is formed in a polygonal shape corresponding to the mounting substrate A1, and its depth dimension is set to a value substantially equal to the thickness dimension of the mounting substrate A1. Further, the mounting substrate A1 is attached to the bottom of the hole 22A of the plate 22 with a heat-resistant adhesive tape (not shown).
A through-hole 24 is provided for fixing the hole.

Reference numeral 31 denotes another jig plate according to the present embodiment. The jig plate 31 includes a plate 32 and a substrate mounting hole 33 formed in the plate 32, like the jig plate 21.

The plate 32 is formed in the same shape having the same vertical and horizontal lengths as the plate 22, and has an outer shape larger than that of the other mounting substrate A2. The plate 32, like the plate 2 according to the first embodiment, includes a thin hole bottom 32A and a thick frame 32B surrounding the hole bottom 32A.

The board mounting hole 33 is formed in a shape having a partially arcuate outer shape corresponding to the mounting board A2, and its depth dimension is set to a value substantially equal to the thickness dimension of the mounting board A2. Is set. Further, a through hole 34 for fixing the mounting substrate A2 to the plate 32 is formed in the center of the plate 32 with a heat-resistant adhesive tape (not shown).

Thus, in the present embodiment, the same operation and effect as in the first embodiment can be obtained. However, in the present embodiment, the plates 22 and 32 are formed in the same shape, and the plates 22 and 32 are substrates on which the mounting substrates A1 and A2 can be mounted corresponding to the mounting substrates A1 and A2 having different external shapes. Since the mounting holes 23 and 33 are respectively formed, the mounting substrates A1 and A2 are attached to the jig plates 21 and 31 so that the difference in the shape of the mounting substrates A1 and A2 can be reduced.
2, 32.

For this reason, as shown in FIG. 11, even when the mounting substrates A1 and A2 have different shapes when being conveyed by the conveyer 11, the entire shape composed of the plates 22 and 32 is made uniform (unified). Thus, a plurality of types of mounting boards A1 and A2 having different external shapes can be transported by using the same transport conveyor 11, and components can be surface-mounted. As a result, even if the vertical and horizontal lengths of the mounting boards A1 and A2 are different, the width of the conveyor 11 is indicated by an arrow a.
Since there is no need to adjust in the direction, the conveyor 1
The surface mounting of components can be performed continuously without stopping 1 or the like, and productivity can be improved.

Further, since the mounting substrate A2 has a circular arc shape like the mounting substrate A2, the mounting substrate A2 is rotated as it is and it is difficult to transfer the mounting substrate A2. It can be formed into a substantially square shape, and the components can be surface-mounted on a mounting board having a special shape such as a circular shape by using the single conveyor 11.

Further, the overall heat capacity of the plate 22 and the mounting board A1 and the entire heat capacity of the plate 32 and the mounting board A2 can be made substantially uniform.
It is possible to suppress temperature variations between the mounting boards A1 and A2 in the reflow process, and to reliably join components to the mounting boards A1 and A2.

In each of the above embodiments, each of the projecting part positioning hole 4 and the part escape hole 5 is formed to have a bottomed shape. However, the projecting part positioning hole, the part A relief hole may be formed.

In each of the above embodiments, the mounting substrates A, A1, A2 are fixed to the jig plates 1, 21,
Although the fixing substrate is temporarily fixed to the mounting plate 31, the mounting substrate may be fixed to the jig plate using other fixing means.

[0072]

As described above in detail, according to the first aspect of the present invention, since the plate is provided with the substrate mounting hole for mounting the mounting substrate, the mounting substrate is mounted in the substrate mounting hole of the plate. Thereby, the plate can be fixed in a state where the plate is superimposed on the back surface side of the mounting board. For this reason, the mounting substrate can be reinforced by the plate, and the mounting substrate can be prevented from warping. In addition, since a portion of the plate surrounding the board mounting hole can be used as a dead space, components can be mounted over the entire surface of the mounting board regardless of restrictions on mounting equipment and the like. Can be reduced in size and cost.

According to the second aspect of the present invention, since the plate is provided with the component escape hole for accommodating the component mounted on the back surface of the mounting board, even when the component is mounted on the back surface of the mounting component, The part protruding from the back surface of this can be escaped by the part escape hole. Therefore, even when the mounting board is lifted from the conveyor in the printing process, the adhesive application process, and the component mounting process, the plate or the like may be warped at an arbitrary position on the back surface of the plate regardless of the arrangement of the components mounted on the back surface of the mounting board. For example, a backup pin can be abutted and the plate can be supported by the backup pin. As a result, even when the plate bends and deforms together with the mounting substrate, the backup pin can be reliably disposed at a position that compensates for the bending deformation, and a printing process or the like can be performed on the mounting substrate in a substantially planar state.

Further, even when the heat capacity of the entire mounting board is increased by the components provided on the back surface of the mounting board, the heat capacity can be reduced by the component relief holes provided on the plate. Therefore, by forming a component relief hole according to the external shape of the component, the entire heat capacity of the plate and the mounting substrate can be made uniform regardless of the size of the component, and the mounting substrate in the reflow process can be made uniform. Variations in temperature for each component can be suppressed, and components can be securely joined to the mounting board.

According to the third aspect of the present invention, since the plate is provided with the protruding component positioning hole for positioning the component protruding from the mounting board, even when the component protruding from the mounting board toward the plate is mounted, the component can be mounted. By disposing the protruding part in the protruding part positioning hole, interference between the protruding part and the plate can be prevented, and the protruding part can be positioned. This eliminates the need to provide a discarded substrate portion on the mounting substrate, thereby reducing manufacturing costs. In addition, secondary processing for removing the discarded substrate portion can be omitted, productivity can be improved, and the outer shape accuracy of the mounting substrate can be increased.

According to the fourth aspect of the present invention, the depth dimension of the board mounting hole is set to be substantially equal to the thickness dimension of the mounting board or smaller than the thickness dimension of the mounting board. And the surface of the plate can be arranged flush with each other, or the surface of the mounting substrate projects from the surface of the plate. Therefore, in the printing process, the mask can be placed on the surface of the mounting board in close contact with the surface, and cream solder or the like can be applied to a predetermined position of the mounting board.

When the depth dimension of the board mounting hole is set to a value substantially equal to the thickness dimension of the mounting board, even when mounting a component projecting from the mounting board toward the plate,
The protruding part of the part can be supported by the plate surface. For this reason, the protruding component can be surface-mounted on the mounting board without providing the discarded board portion, and the manufacturing cost can be reduced, and the secondary processing can be omitted, and the productivity can be improved.

According to the fifth aspect of the present invention, a plurality of plates having the same shape are prepared, and each plate is provided with a board mounting hole having a shape corresponding to the outer shape of a mounting board having a different outer shape. The difference in the shape of the substrate can be compensated for by the plate. For this reason, when transported by the transport conveyor, the entire shape consisting of the plate and the mounting substrate can be made uniform, and multiple types of mounting substrates having different external shapes are transported using the same transport conveyor, and the components are surface-mounted. can do.

Further, the total heat capacity of the plate and the mounting board can be made uniform, the temperature variation of each mounting board in the reflow process can be suppressed, and the components can be securely joined to the mounting board. .

According to the sixth aspect of the present invention, since the plate is provided with a through hole which is located at the bottom side of the substrate mounting hole and penetrates the plate, the tape is stuck to the back side of the plate, and The part can be inserted into the through hole and attached to the mounting board. For this reason, the mounting substrate can be temporarily fixed to the plate using the tape.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a jig plate according to a first embodiment together with a mounting board.

FIG. 2 is a perspective view showing a state in which a mounting board is mounted on a jig plate according to the first embodiment.

FIG. 3 is a front view showing a manufacturing process of a board for mounting components on a mounting board by mounting a jig plate on a transport conveyor according to the first embodiment;

FIG. 4 is a perspective view showing a state where components and protruding components are surface-mounted on a mounting board in a component mounting step.

FIG. 5 is a plan view showing a jig plate, a mounting board, and the like in FIG. 4;

6 is an enlarged cross-sectional view showing a jig plate, a mounting board, and the like as viewed from a direction indicated by arrows VI-VI in FIG.

FIG. 7 is an enlarged cross-sectional view showing a jig plate, a mounting board, and the like as viewed from the direction of arrows VII-VII in FIG.

FIG. 8 is an enlarged sectional view of a position similar to FIG. 6 showing a state where the jig plate is lifted by a printing process.

FIG. 9 is an enlarged cross-sectional view showing a state where components are mounted on a mounting board as a comparative example.

FIG. 10 is a perspective view showing one jig plate according to a second embodiment together with a mounting board.

FIG. 11 is a perspective view showing another jig plate according to the second embodiment together with a mounting board.

FIG. 12 is a perspective view showing a state in which two jig plates according to the second embodiment are mounted on a conveyor.

[Explanation of symbols]

 1,21,31 Jig plate 2,22,32 Plate 3,23,33 Board mounting hole 4 Projection component positioning hole 5 Component relief hole 6,24,34 Through hole A Mounting board B, E component C Linear projection component D Bending protruding part F Tape

Continued on the front page (72) Inventor Naohide Miyata 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term in Murata Manufacturing Co., Ltd. 5E313 AA11 AA23 DD12 DD13 FG06 5E319 AA03 AA08 AB01 AB05 BB05 CC33 CD29 CD46 GG05

Claims (6)

[Claims] 1. A plate mounted on the back side of a mounting board on which components are mounted on a front surface, and a concave groove is formed on the plate with a shape corresponding to the outer shape of the mounting board. And a substrate mounting hole for mounting on the plate. 2. The jig according to claim 1, wherein the plate is provided with a component escape hole located at a bottom side of the board mounting hole for allowing a component mounted on a back surface of the mounting board to escape. plate. 3. The plate according to claim 1, wherein the plate is provided with a protruding part positioning hole having a shape corresponding to an outer shape of the protruding part for positioning the protruding part protruding from the mounting board. Jig plate. 4. The substrate mounting hole has a depth dimension substantially equal to a thickness dimension of the mounting substrate or a value smaller than a thickness dimension of the mounting substrate. 2
Or the jig plate according to 3. 5. The apparatus according to claim 1, wherein a plurality of said plates are prepared in the same shape, and said plate mounting holes are respectively formed in said plates in shapes corresponding to mounting substrates having different outer shapes. The jig plate according to 2, 3, or 4. 6. The plate is provided with a through hole located at the bottom side of the substrate mounting hole and penetrating the plate, and a tape partially inserted into the through hole is provided on the back side of the plate. Attached, the mounting substrate is configured to be temporarily fixed to the plate using the tape, claim 1,
The jig plate according to 2, 3, 4 or 5.