JP2007221003A - Flexible printed substrate carrying carrier, solder print device and component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible printed substrate carrying carrier which can stably support a flexible printed substrate for double-sided mounting, a solder print device and a component mounting device. <P>SOLUTION: Recesses 16a to 16d for storing surface mounting members 3a to 3d mounted in a lower surface of an FPC1 are formed in an upper surface 12a of an FPC carrying carrier 10. The depth of each of the recesses 16a to 16d is formed equal to the thickness of the surface mounting members 3a to 3d to be stored. When an FPC1 is mounted on the FPC carrying carrier 10, a lower part of each of the surface mounting members 3a to 3d is mounted horizontally in contact with a bottom surface of the recesses 16a to 16d. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a flexible printed board conveyance carrier, a solder printing apparatus, and a component mounting apparatus, and more particularly to a flexible printed board conveyance carrier, a solder printing apparatus, and a component mounting apparatus that handle a flexible printed board for double-sided mounting.

  Unlike rigid boards, flexible printed boards are thin and easy to bend, so surface mount components such as electronic devices are usually mounted using a carrier carrier.

  The mounting of the surface mounting component is performed by first screen-printing cream solder on the upper surface of the flexible printed circuit board. This solder printing is a soldering method suitable for mounting surface-mounted components with high density. The flexible printed circuit board is thin and bendable, but since it is supported by the transport carrier, it can maintain a flat state even when pressed with a squeegee from above during printing, and solder printing can be performed reliably. . And a surface mounting component is attached on the flexible printed circuit board by which cream solder was screen-printed in this way, and a reflow process is performed. The surface mount component is connected to the flexible printed circuit board by this reflow process.

  In the case of single-sided mounting, component mounting is completed by the above steps. In the case of double-sided mounting, the same process is performed on the back side surface to mount surface-mounted components. At this time, the flexible printed circuit board is reversed and placed on a transport carrier to perform component mounting.

  However, when the flexible printed circuit board is turned over, the surface-mounted component mounted earlier directly hits the transport carrier and may be damaged.

Therefore, conventionally, the thickness of the transport carrier is formed to be thicker than the thickness of the surface mount component, and an opening for receiving the surface mount component is formed in the transport carrier, and the surface mount component is accommodated in the opening, Surface mount components were prevented from interfering with the carrier (Patent Document 1).
JP-A-10-276000

  However, since the lower part of the surface-mounted component is not supported at all in the transport carrier described in Patent Document 1, when pressing with a squeegee from the top during solder printing, the substrate bends at the opening and the necessary amount of solder is secured. There was a problem that it was impossible.

  In addition, since the thickness of the transport carrier has to be formed larger than the thickness of the surface-mounted component, there is a problem that it cannot be installed in a solder printing apparatus or a component mounting apparatus as it is.

  The present invention has been made in view of such circumstances, and provides a flexible printed board transport carrier, a solder printing apparatus, and a component mounting apparatus that can stably support a flexible printed board for double-sided mounting. Objective.

  In order to achieve the above object, the invention according to claim 1 is mounted on the lower surface of the flexible printed circuit board on the upper surface in the flexible printed circuit board carrier on which the flexible printed circuit board for double-sided mounting is placed on the upper surface. Provided is a flexible printed circuit board transport carrier comprising a recess for housing a component, the recess having a depth corresponding to the component thickness of the accommodated component, and supporting the component on the bottom surface.

  According to the first aspect of the present invention, the concave portion for accommodating the component mounted on the lower surface of the flexible printed circuit board is formed on the upper surface, and when the flexible printed circuit board is placed, the concave portion is disposed on the lower surface of the flexible printed circuit board. The parts are accommodated in this recess. The component housed in the recess is supported from below with the tip (lower end) in contact with the bottom surface of the recess. Thereby, for example, even when pressed with a squeegee at the time of solder printing, the flexible printed board does not bend at the component installation portion, and stable printing can be performed.

  In order to achieve the above object, the invention according to claim 2 is formed on a carrier board on which the flexible printed circuit board is placed on an upper surface, a base board on which the carrier board is placed on an upper surface, and the carrier board A through hole that accommodates a component mounted on the lower surface of the flexible printed circuit board, and a support that is formed in the base board and supports the component accommodated in the through hole from below. 2. The flexible printed circuit board carrier according to claim 1, wherein when the carrier board is placed on the upper surface of the base board, the through hole and the support portion are integrated to form the concave portion. .

  According to the second aspect of the present invention, the carrier is composed of the base board and the carrier board, and when the carrier board is placed on the base board, the carrier carrier is formed in the through hole and the base board formed in the carrier board. The support portion is integrated with each other to form a recess. Since the carrier board can be separated from the base board, the flexible printed circuit board can be placed on the carrier board alone. Thus, for example, even if the thickness of the integrated product does not meet the board thickness specification in a solder printing device or component mounting device, the solder printing can be performed by removing and using only the carrier board. It can be set in a device or a component mounting device. In this case, the function of the base board, that is, the function of supporting the component housed in the through hole of the carrier board from below is provided on the device side for setting the carrier board, such as a solder printing device or a component mounting device. Therefore, stable solder printing and component mounting can be performed.

  The invention according to claim 3 is characterized in that, in order to achieve the object, a cushioning member is disposed on the bottom surface of the recess, and the component is supported via the cushioning member. A flexible printed circuit board carrier is provided.

  According to the invention which concerns on Claim 3, a buffer member is arrange | positioned at the bottom face of a recessed part, and components are supported through this buffer member. Thereby, damage of components can be prevented effectively.

  The invention according to claim 4 is characterized in that, in order to achieve the above object, the buffer member is an elastic body that does not affect the components to be supported. provide.

  According to the invention which concerns on Claim 4, the buffer member which supports components is comprised with the elastic body which does not affect components.

  The invention according to claim 5 is characterized in that, in order to achieve the above object, the cushioning member is a rubber that does not affect the parts to be supported, and is less than the hardness of a squeegee used during solder printing. The flexible printed circuit board conveyance carrier of Claim 3 is provided.

  According to the fifth aspect of the present invention, the cushioning member that supports the component is a rubber that does not affect the component, and is configured to have a hardness equal to or less than the hardness of the squeegee used during solder printing.

  The invention according to claim 6 is characterized in that, in order to achieve the object, the buffer member supports the part by making point contact or line contact with the part. A flexible printed circuit board carrier is provided.

  According to the invention which concerns on Claim 6, the buffer member which supports components supports a component by making point contact or line contact to components.

  In order to achieve the above object, the invention according to claim 7 is to place a flexible printed board for double-sided mounting on a carrier board, set the carrier board on a suction block, and In the solder printing apparatus for printing solder on the upper surface, a through hole for accommodating a component formed on the carrier board and mounted on the lower surface of the flexible printed circuit board, and a component thickness of the component accommodated in the through hole Corresponding to the difference between the thickness of the carrier board and the through hole on the suction block is formed as a concave part, a convex part or a flat part, and the part accommodated in the through hole is viewed from below. Provided is a solder printing apparatus comprising a supporting portion for supporting.

  According to the seventh aspect of the invention, when the flexible printed board is placed on the carrier board, the components mounted on the lower surface of the flexible printed board are accommodated in the through holes formed in the carrier board. When the carrier board on which the flexible printed circuit board is placed is set on the suction block, the components accommodated in the through holes are supported from below by the support portion formed on the suction block. Thereby, even if a flexible printed circuit board is pressed with a squeegee at the time of solder printing, a flexible printed circuit board does not bend in the installation part of components, and stable printing can be performed.

  The invention according to claim 8 is characterized in that, in order to achieve the object, a buffer member is disposed on the support portion, and the component is supported from below via the buffer member. A solder printing apparatus is provided.

  According to the invention which concerns on Claim 8, a buffer member is arrange | positioned at a support part and components are supported via this buffer member. Thereby, damage of components can be prevented effectively.

  The invention according to claim 9 provides the solder printing apparatus according to claim 8, wherein, in order to achieve the object, the buffer member is an elastic body that does not affect the components to be supported. .

  According to the ninth aspect of the present invention, the buffer member that supports the component is formed of an elastic body that does not affect the component.

  The invention according to claim 10 is characterized in that, in order to achieve the above object, the cushioning member is a rubber that does not affect the components to be supported, and is less than the hardness of a squeegee used during solder printing. A solder printing apparatus according to claim 8 is provided.

  According to the invention which concerns on Claim 10, the buffer member which supports components is the rubber | gum which does not affect components, Comprising: It is below the hardness of the squeegee used at the time of solder printing.

  The invention according to claim 11 is characterized in that, in order to achieve the object, the buffer member supports the part by making point contact or line contact with the part. A solder printing apparatus is provided.

  According to the eleventh aspect of the present invention, the cushioning member that supports the component supports the component by making point contact or line contact with the component.

  In order to achieve the above object, the invention according to claim 12 is characterized in that a flexible printed circuit board for double-sided mounting is placed on a carrier board, the carrier board is set on a suction block, and the flexible printed circuit board In a component mounting apparatus that mounts components on the upper surface, a through hole that accommodates a component that is formed on the carrier board and is mounted on the lower surface of the flexible printed circuit board, and a component thickness of the component that is accommodated in the through hole Corresponding to the difference between the thickness of the carrier board and the through hole on the suction block is formed as a concave part, a convex part or a flat part, and the part accommodated in the through hole is viewed from below. There is provided a component mounting apparatus comprising a supporting portion for supporting.

  According to the twelfth aspect of the present invention, when the flexible printed circuit board is placed on the carrier board, the components mounted on the lower surface of the flexible printed circuit board are accommodated in the through holes formed in the carrier board. When the carrier board on which the flexible printed board is placed is set on the suction block, the lower part of the component accommodated in the through hole is supported by the support portion formed on the suction block. As a result, the flexible printed circuit board does not bend at the component installation portion during component mounting, and stable component mounting can be performed.

  The invention according to claim 13 is characterized in that, in order to achieve the object, a buffer member is disposed on the support portion, and the component is supported from below via the buffer member. A component mounting apparatus is provided.

  According to the thirteenth aspect of the present invention, the buffer member is disposed on the support portion, and the component is supported via the buffer member. Thereby, damage of components can be prevented effectively.

  The invention according to claim 14 provides the component mounting apparatus according to claim 12, wherein, in order to achieve the object, the buffer member is an elastic body that does not affect the components to be supported. .

  According to the fourteenth aspect of the present invention, the buffer member that supports the component is formed of an elastic body that does not affect the component.

  The invention according to claim 15 is the component according to claim 13 or 14, wherein, in order to achieve the object, the cushioning member supports the component in a point contact or a line contact with the component. A mounting apparatus is provided.

  According to the fifteenth aspect of the present invention, the buffer member that supports the component supports the component by making point contact or line contact with the component.

  ADVANTAGE OF THE INVENTION According to this invention, the flexible printed circuit board for double-sided mounting can be supported stably, and solder printing and component mounting can be performed stably.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a best mode for carrying out a flexible printed circuit board carrier, a solder printer, and a component mounting apparatus according to the present invention will be described with reference to the accompanying drawings.

  First, an outline of a process for mounting surface-mounted components such as electronic devices on both surfaces of a flexible printed circuit board (hereinafter abbreviated as FPC) will be described.

  As described above, since the FPC is thin and easy to bend, it is placed on the FPC carrier and each process is performed. First, cream solder is printed on the upper surface of the FPC placed on the FPC carrier. Next, the surface mounting member is attached to the solder printing portion by the component mounting apparatus. Then, the reflow processing is performed by the reflow apparatus, and the surface mount component attached to the solder printing portion is connected to the FPC. The component mounting on one side is completed through the above steps. Next, the FPC placed on the FPC transport carrier is reversed, and the FPC is placed on the FPC transport carrier with the surface on which the surface mount components are mounted facing down. The cream solder is printed on the upper surface of the FPC that is reversed and placed on the FPC carrier. Then, the surface mounting member is attached to the solder printing portion by the component mounting apparatus, and the surface mounting component attached to the solder printing portion is connected to the FPC after being reflowed by the reflow apparatus. The component mounting on both sides of the FPC is completed through the above steps.

  By the way, in the FPC for double-sided mounting as described above, after the component mounting on one side is finished, if the FPC is reversed and placed on the FPC carrier again, the surface-mounted component mounted first is Direct contact with the top surface of the FPC carrier. If solder printing or the like is performed in this state, the surface-mounted component that has been mounted may be damaged. On the other hand, even if an opening is simply formed in the FPC carrier and the previously mounted surface-mounted components are accommodated, the board may bend at the opening of the FPC carrier and not be able to secure the necessary amount of solder during solder printing. There is.

  Therefore, the FPC carrier of the present embodiment has a recess on the surface (upper surface) on which the FPC is placed, and the surface mount component is accommodated in the recess and the surface mount component accommodated on the bottom surface of the recess is viewed from below. It is configured to support. Hereinafter, the configuration of the FPC carrier according to the present embodiment will be described in detail.

  FIG. 1 and FIG. 2 are a plan view and a side sectional view showing the configuration of the FPC carrier according to the present embodiment, respectively. 3 and 4 are a plan view and a side view of the FPC on which the FPC transport carrier of the present embodiment is placed, respectively.

  As shown in FIGS. 3 and 4, the FPC 1 has finished component mounting on one side, and the surface mounting components 3 a to 3 d are connected to predetermined positions on the lower surface 2 b. In the figure, reference numeral 4 denotes a positioning hole, and the positioning hole 4 is used to position the FPC 1 with respect to the FPC transport carrier 10.

  As shown in FIGS. 1 and 2, the FPC carrier 10 is formed of a rectangular flat plate made of, for example, stainless steel or aluminum. The FPC 1 is placed on the upper surface 12 a of the FPC transport carrier 10.

  A plurality of positioning pins 14 are erected at a predetermined position on the upper surface 12 a of the FPC carrier 10, and the FPC 1 is positioned and placed by fitting the positioning holes 4 to the positioning pins 14.

  In this way, the upper surface 12a of the FPC carrier 10 on which the FPC 1 is positioned and placed is formed with recesses 16a to 16d for receiving the surface mount components 3a to 3d mounted on the lower surface 2b of the FPC 1 to be placed. Has been. The recesses 16a to 16d are formed as recesses having an inner peripheral shape slightly larger than the outer peripheral shape of the surface mount components 3a to 3d to be accommodated, and the thicknesses of the surface mount components 3a to 3d to be accommodated ( It is formed with a depth corresponding to the component thickness.

  That is, for example, the recess 16a that accommodates the surface mount component 3a is formed with the same depth Ha as the thickness Ha of the surface mount component 3a, and the recess 16b that accommodates the surface mount component 3b is formed on the surface mount component 3b. It is formed with the same depth Hb as the thickness Hb. The recess 16c that accommodates the surface mount component 3c is formed with the same depth Hc as the thickness Hc of the surface mount component 3c, and the recess 16d that accommodates the surface mount component 3d is the thickness of the surface mount component 3d. It is formed with the same depth Hd as Hd.

  In this way, the depths Ha, Hb, Hc, Hd of the recesses 16a-16d formed in the FPC transport carrier 10 are the same as the thicknesses Ha, Hb, Hc, Hd of the surface mount components 3a-3d that are to be accommodated. Thus, when the FPC 1 is placed on the FPC transport carrier 10, the tips (lower portions) of the surface mount components 3a to 3d accommodated in the recesses 16a to 16d abut against the bottom surfaces of the recesses 16a to 16d. The FPC 1 is horizontally supported by the upper surface 12a of the FPC transport carrier 10 with the tips of the surface mount components 3a to 3d being in contact with the bottom surfaces of the recesses 16a to 16d.

  The FPC carrier 10 according to the present embodiment is configured as described above. In FIG. 1, reference numeral 18 denotes a positioning hole of the FPC transport carrier 10, and the positioning hole 18 is used to position the FPC transport carrier 10 with respect to a solder printing apparatus, a component mounting apparatus, or the like. That is, in the solder printing device and the component mounting device, a positioning pin is erected on the FPC carrier carrier installation portion (suction block), and the positioning hole 18 formed in the FPC carrier 10 is fitted to the positioning pin. Thus, the FPC carrier 10 is positioned.

  The operation of the FPC carrier 10 of the present embodiment configured as described above is as follows.

  The FPC 1 that has finished component mounting on one side is placed on the FPC carrier 10 with the surface 2b on which the surface mounting components 3a to 3d are mounted facing down.

  At this time, the FPC 1 is placed by fitting the positioning holes 4 formed at predetermined positions with the positioning pins 14 formed on the FPC transport carrier 10. As a result, the FPC 1 is positioned and placed with respect to the FPC carrier 10.

  When the FPC 1 is placed on the FPC transport carrier 10, the surface mount components 3 a to 3 d mounted on the lower surface 2 b of the FPC 1 are accommodated in the recesses 16 a to 16 d formed on the upper surface of the FPC transport carrier 10.

  Here, in the FPC transport carrier 10 of the present embodiment, the depths of the recesses 16a to 16d are formed to be the same as the thickness of the surface mount components 3a to 3d to be accommodated. When the surface mount components 3a to 3d are accommodated, the tip portions (lower portions) of the accommodated surface mount components 3a to 3d come into contact with the bottom surfaces of the recesses 16a to 16d. That is, the surface-mounted components 3a to 3d mounted on the lower surface 2b of the FPC 1 are supported from below on the bottom surfaces of the recesses 16a to 16d.

  As a result, as shown in FIG. 5, the FPC 1 is horizontally placed on the upper surface 12 a of the FPC transport carrier 10 with almost the entire surface supported. That is, the area other than the installation portion of each surface mount component 3a to 3d is supported by the upper surface 12a of the FPC carrier 10, and the installation portions of the surface mount components 3a to 3d are the recesses 16a to 16d in the surface mount components 3a to 3d. It is supported in contact with the bottom surface.

  As a result, when performing solder printing by screen printing, even if the upper surface 2a of the FPC 1 is pressed with a squeegee, the FPC 1 does not bend, so the necessary amount of solder can be ensured. Thereby, stable solder printing can be performed. Similarly, since the FPC 1 does not bend during component mounting, the surface-mounted component can be securely attached, and stable component mounting can be performed.

  In the FPC carrier 10 according to the above embodiment, the lower portions of the surface mount components 3a to 3d accommodated in the recesses 16a to 16d are directly applied to and supported by the bottom surfaces of the recesses 16a to 16d. It is good also as a structure which arrange | positions a buffer member and supports the surface mount components accommodated in the recessed part via this buffer member.

  FIG. 6 is a side cross-sectional view of an FPC transport carrier in which a buffer member is disposed on the bottom surface of the recess.

  As shown in the figure, buffer members 20a to 20d having a predetermined thickness (α) are arranged on the bottom surfaces of the recesses 16a to 16d formed on the top surface of the FPC carrier 10.

Since the buffer members 20a to 20d are arranged in this manner, the recesses 16a to 16d formed on the upper surface of the FPC transport carrier 10 are formed deeper by the thickness of the buffer members 20a to 20d. That is, the recess 16a that accommodates the surface-mounted component 3a is formed with a depth Ha ₁ (= Ha + α) obtained by adding the thickness Ha of the surface-mounted component 3a and the thickness α of the buffer member 20a. Is formed at a depth Hb ₁ (= Hb + α) obtained by adding the thickness Hb of the surface-mounted component 3b and the thickness α of the buffer member 20b. The recess 16c that accommodates the surface mount component 3c is formed with a depth Hc ₁ (= Hc + α) obtained by adding the thickness Hc of the surface mount component 3c and the thickness α of the buffer member 20c. Is formed with a depth Hd ₁ (= Hd + α) obtained by adding the thickness Hd of the surface mount component 3d and the thickness α of the buffer member 20d.

  Thus, as shown in FIG. 7, when the FPC 1 is placed on the FPC transport carrier 10, the tip (lower part) of each of the surface mount components 3a to 3d is disposed on the bottom surface of each of the recesses 16a to 16d. It is supported horizontally while in contact with 20a to 20d.

  As described above, the surface mounting components 3a to 3d are supported via the buffer members 20a, 20b, 20c, and 20d, so that an excessive force applied to the surface mounting components 3a to 3d can be released. It is possible to effectively prevent the components 3a to 3d from being damaged.

  Since the buffer member directly supports the surface mount component, it is preferable to use a buffer member that does not affect the surface mount component to be supported. For example, a rubber-based cushioning material can be used, and natural rubber, urethane rubber, silicon rubber, nitrile rubber, or the like can be used. That is, any material that can reduce the stress applied to the surface-mounted component may be used, and it is preferable to use a material having a hardness lower than that of the squeegee rubber. In addition, a member having elasticity such as a leaf spring or a spring can be used as the buffer member as long as it can reduce the stress applied to the surface-mounted component.

  In addition, when performing a reflow process, it is preferable to comprise a buffer member using the material which can endure a reflow process.

  Moreover, when performing solder printing by screen printing, it is preferable to use a buffer member having a rubber hardness equal to or less than the rubber hardness of the squeegee used during solder printing. In general, the urethane rubber used in the squeegee has a rubber hardness of 70 to 90 degrees. Therefore, it is preferable to use natural rubber, urethane rubber, silicon rubber, nitrile rubber or the like having a rubber hardness of less than that.

 The buffer member is preferably configured to be in point contact or line contact with the surface-mounted component in order to further reduce the buffer.

  For example, as shown in FIG. 8 (a), a slit may be formed in the rubber plate so as to be in line contact with the surface mount component, or it is formed in a cylindrical shape as shown in FIG. 8 (b). It is also possible to construct such a rubber rod that is made to stand and make point contact with the surface-mounted component.

  FIG. 9 is a side cross-sectional view showing the configuration of the second embodiment of the FPC carrier according to the present invention.

  As shown in the figure, the FPC carrier 40 according to the second embodiment is composed of a carrier board 42 and a base board 44, and is formed so as to be divided vertically. The carrier board 42 and the base board 44 are formed of a rectangular flat plate made of stainless steel or aluminum, for example, and are integrated by placing the carrier board 42 on the base board 44.

  The carrier board 42 is positioned and placed on the upper surface 44a of the base board 44 by fitting a positioning hole 46 formed at a predetermined position with a positioning pin 48 erected on the upper surface 44a of the base board 44. The The FPC 1 is placed on the upper surface 42 a of the carrier board 42.

  A plurality of positioning pins 50 are erected at predetermined positions on the upper surface 42a of the carrier board 42, and the FPC 1 is positioned and placed on the carrier board by fitting the positioning holes 4 to the positioning pins 50. Is done.

  The carrier board 42 on which the FPC 1 is positioned and placed in this way is formed with through holes 52a to 52d for accommodating the surface mount components 3a to 3d mounted on the lower surface 2b of the FPC 1 to be placed. . The through holes 52a to 52d are formed with an inner peripheral shape slightly larger than the outer peripheral shape of the surface mount components 3a to 3d to be accommodated.

  On the other hand, the base board 44 is formed with support portions 54a to 54d that support the surface mount components 3a to 3d accommodated in the through holes 52a to 52d of the carrier board 42 from below. The support portions 54a to 54d penetrate through the base board according to the thickness (component thickness) of the surface mount components 3a to 3d accommodated in the through holes 52a to 52d and the thickness (plate thickness) of the carrier board 42. It is formed as a concave part, a convex part, or a flat part at the position where the hole is arranged.

  That is, when the thickness (component thickness) of the surface mount components 3a to 3d accommodated in the through holes 52a to 52d is smaller than the thickness (plate thickness) of the carrier board 42, the surface mount components 3a to 3d are formed as convex portions and are thick. In some cases, it is formed as a recess. In addition, when the thicknesses of the surface mount components 3a to 3d accommodated in the through holes 52a to 52d are the same as the thickness of the carrier board 42, they are formed as flat portions.

  In the case of the example shown in FIG. 9, the support portion 54 a that supports the surface mount component 3 a accommodated in the through hole 52 a has a thickness Ha of the surface mount component 3 a accommodated in the through hole 52 a. Since it is thinner than Ho, the support part 54a is formed as a convex part protruding into the through hole 52a. In this case, the thickness of the support portion 54a is a value obtained by subtracting the thickness Ha of the surface mount component 3a accommodated in the through hole 52a from the thickness Ho of the carrier board 52 (Ho-Ha).

  Since the thickness Hb of the surface mount component 3b accommodated in the through hole 52b is smaller than the thickness Ho of the carrier board 52, the support portion 54b that supports the surface mount component 3b accommodated in the through hole 52b is also supported. Is formed as a protrusion protruding into the through hole 52b. In this case, the thickness of the support portion 54b is a value obtained by subtracting the thickness Hb of the surface mount component 3b accommodated in the through hole 52b from the thickness Ho of the carrier board 52 (Ho-Ha).

  On the other hand, the support portion 54c that supports the surface mount component 3c accommodated in the through hole 52c has a thickness Hc of the surface mount component 3c accommodated in the through hole 52c larger than the thickness Ho of the carrier board 52. The support portion 54c is formed as a recess communicated with the through hole 52b. In this case, the depth of the support portion 54c is a value (Hc−Ho) obtained by subtracting the thickness Ho of the carrier board 52 from the thickness Hc of the surface mount component 3c accommodated in the through hole 52c.

  The support portion 54d that supports the surface mount component 3d accommodated in the through hole 52d supports the thickness Hd of the surface mount component 3d accommodated in the through hole 52d because it is the same as the thickness Ho of the carrier board 52. The part 54d is formed as a flat part.

  Thus, the base board 44 is formed with support portions 54a to 54d that support the surface mount components 3a to 3d accommodated in the through holes 52a to 52d of the carrier board 42 from the lower side.

  As a result, when the carrier board 42 is placed on the base board 44, the through holes 52a to 52d formed in the carrier board 42 are integrated with the support portions 54a to 54d formed in the base board 44, so that the surface mount component Recesses 56a to 56d for accommodating 3a to 3d are formed. Since the concave portions 56a to 56d are formed corresponding to the thicknesses Ha, Hb, Hc, and Hd of the surface mount components 3a to 3d to be accommodated, when the FPC 1 is placed on the FPC transport carrier 10, each surface mount component 3a is formed. The tip (lower part) of 3d comes into contact with the bottom surfaces of the recesses 56a-56d, that is, the support parts 54a-54d. The FPC 1 is horizontally supported on the upper surface of the FPC carrier 40, that is, the upper surface 42 a of the carrier board 42 with the tips of the surface mount components 3 a to 3 d being in contact with the bottom surfaces of the recesses 56 a to 56 d.

  The FPC carrier 40 according to the present embodiment is configured as described above. Although not shown, positioning holes are also formed at predetermined positions in the FPC transport carrier 40 of the present embodiment, and positioning with respect to a solder printing device, a component mounting device, or the like is performed using the positioning holes. Is called.

  The operation of the FPC carrier 40 according to the present embodiment configured as described above is as follows.

  First, the carrier board 42 is placed on the base board 44 and the carrier board 42 and the base board 44 are integrated. At this time, the positioning holes 46 formed in the carrier board 42 are fitted and placed on the positioning pins 48 erected on the base board 44. Thus, the carrier board 42 is positioned and placed on the base board 44 and integrated with the base board 44.

  When the carrier board 42 is placed on the base board 44, the through holes 52a to 52d formed in the carrier board 42 are integrated with the support portions 54a to 54d formed in the base board 44, and the recesses 56a to 56d are formed on the upper surface. It is formed. In this state, the FPC 1 that has finished the component mounting on one side is placed on the carrier board 42.

  The FPC 1 is placed on the FPC carrier 10 with the surface 2b on which the surface mount components 3a to 3d are mounted facing down. At this time, the FPC 1 is placed by fitting the positioning holes 4 formed at predetermined positions to the positioning pins 50 formed on the carrier board 42. As a result, the FPC 1 is positioned and placed on the carrier board 42.

  When the FPC 1 is placed on the carrier board 42, the surface mount components 3a to 3d mounted on the lower surface 2b of the FPC 1 are accommodated in the recesses 56a to 56d.

  Here, the recesses 56a to 56d are adjusted by the support portions 54a to 54d formed on the base board 44 so that the depth is the same as the thickness of the surface mount components 3a to 3d. When the surface mount components 3a to 3d are accommodated in .about.56d, the tips (lower portions) of the accommodated surface mount components 3a to 3d are placed on the bottom surfaces of the respective recesses 56a to 56d, that is, the support portions 54a to 54d. Abut.

  As a result, as shown in FIG. 10A, the FPC 1 is horizontally placed on the upper surface of the FPC transport carrier 40 in a state where almost the entire surface is supported. That is, the area other than the installation parts of the surface mount components 3a to 3d is supported by the upper surface of the FPC carrier 40, that is, the upper surface 42a of the carrier board 42, and the installation parts of the surface mount components 3a to 3d are surface mount components. 3a to 3d are supported in contact with the bottom surfaces of the recesses 56a to 56d, that is, the support portions 54a to 54d.

  As a result, when performing solder printing by screen printing, even if the upper surface 2a of the FPC 1 is pressed with a squeegee, the FPC 1 does not bend, so the necessary amount of solder can be ensured. Thereby, stable solder printing can be performed. Similarly, since the FPC 1 does not bend during component mounting, the surface-mounted component can be securely attached, and stable component mounting can be performed.

  In the FPC transport carrier 40 of the present embodiment, since the carrier board 42 is formed so as to be separable from the base board 44, the FPC 1 is supported only by the carrier board 42 as shown in FIG. Can do.

  Thereby, for example, even if the thickness of the FPC transport carrier 40 in which the carrier board 42 and the base board 44 are integrated does not satisfy the board thickness specification in the solder printing apparatus or the component mounting apparatus, the carrier By removing and using only the board 42, it can be set in a solder printing device, a component mounting device, or the like.

  In this case, the function of the base board, that is, the surface mount components 3a to 3d accommodated in the through holes 52a to 52d of the carrier board 42 are provided on the device side where the carrier board 42 such as a solder printing device or a component mounting device is set. By providing a support function from below, stable solder printing and component mounting can be performed.

  For example, in a solder printing device or a surface mounting device, a carrier board is sucked and held on a suction block to perform solder printing and surface mounting. Therefore, as shown in FIG. 12, the suction block 60 has the function of the base board 44. . That is, support portions 64 a to 64 d that support the surface mounted components 3 a to 3 d from the lower side with respect to the set carrier board 42 are formed on the placement surface (upper surface) of the suction block 60. Similar to the base board 44, the support portions 64a to 64d have the thickness (component thickness) of the surface mount components 3a to 3d accommodated in the through holes 52a to 52d and the thickness (plate thickness) of the carrier board 42. Accordingly, a concave portion, a convex portion, or a flat portion is formed at a position where the through hole is arranged on the suction block.

  That is, when the thickness of the surface mount components 3a to 3d accommodated in the through holes 52a to 52d is smaller than the thickness of the carrier board 42, the surface mount components 3a to 3d are formed as convex portions, and when the thickness is thick, they are formed as concave portions. In addition, when the thicknesses of the surface mount components 3a to 3d accommodated in the through holes 52a to 52d are the same as the thickness of the carrier board 42, they are formed as flat portions.

  As described above, by providing the function of the base board 44 to the suction block 60 of the solder printing apparatus or the surface mounting apparatus, the FPC 1 can be mounted on the carrier board 42 in a state where the entire surface is supported as shown in FIG. Placed horizontally. That is, the area other than the installation parts of the surface mount components 3a to 3d is supported by the upper surface 42a of the carrier board 42, and the installation parts of the surface mount components 3a to 3d are attached to the suction block 60 by the surface mount components 3a to 3d. It is abutted and supported by the formed support portions 64a to 64d.

  As a result, when performing solder printing by screen printing, even if the upper surface 2a of the FPC 1 is pressed with a squeegee, it does not bend, so that the necessary amount of solder can be ensured and stable solder printing can be performed. Can do. Similarly, since the FPC 1 does not bend during component mounting, the surface-mounted component can be securely attached, and stable component mounting can be performed.

  In the FPC transport carrier 40 of the present embodiment, the surface mount components 3a to 3d are configured to directly support the support portions 54a to 54d and 64a to 64d, but the FPC transport of the first embodiment is supported. It is good also as a structure which supports surface mount components 3a-3d via a buffer member similarly to a carrier. That is, as shown in FIGS. 13 and 14, buffer members 20a to 20d are arranged on the support portions 54a to 54d and 64a to 64d, and the surface mount components 3a to 3d are supported via the buffer members 20a to 20d. The configuration is as follows. Thereby, an excessive force applied to the surface mount components 3a to 3d can be released, and the surface mount components 3a to 3d can be effectively prevented from being damaged.

  Since the buffer member directly supports the surface mount component, it is preferable to use a buffer member that does not affect the surface mount component to be supported. For example, a rubber-based cushioning material can be used, and natural rubber, urethane rubber, silicon rubber, nitrile rubber, or the like can be used. That is, any material that can reduce the stress applied to the surface-mounted component may be used, and it is preferable to use a material having a hardness lower than that of the squeegee rubber. In addition, a member having elasticity such as a leaf spring or a spring can be used as the buffer member as long as it can reduce the stress applied to the surface-mounted component.

  Moreover, when performing a reflow process, it is preferable to comprise a buffer member using the material which can endure a reflow process.

  Moreover, when performing solder printing by screen printing, it is preferable to use a buffer member having a rubber hardness equal to or less than the rubber hardness of the squeegee used during solder printing. In general, the urethane rubber used in the squeegee has a rubber hardness of 70 to 90 degrees. Therefore, it is preferable to use natural rubber, urethane rubber, silicon rubber, nitrile rubber or the like having a rubber hardness of less than that.

 The buffer member is preferably configured to be in point contact or line contact with the surface-mounted component in order to further reduce the buffer. For example, as shown in FIG. 8 (a), a slit may be formed in the rubber plate so as to be in line contact with the surface mount component, or it is formed in a cylindrical shape as shown in FIG. 8 (b). It is also possible to construct such a rubber rod that is made to stand and make point contact with the surface-mounted component.

  In the above-described series of embodiments, the shape of the FPC transport carrier is formed in a rectangular shape, but the shape of the FPC transport carrier is not limited to this, and a solder printing device or a surface mounting device to be used is used. It shall be set according to.

  In addition, the number of recesses formed in the shape of the FPC transport carrier is also set according to the FPC to be placed.

The top view which shows the structure of the FPC conveyance carrier of 1st Embodiment Side surface sectional drawing which shows the structure of the FPC conveyance carrier of 1st Embodiment Plan view of FPC FPC side view Side surface sectional drawing which shows the structure of the FPC conveyance carrier of 1st Embodiment Side surface sectional view showing a configuration of an FPC carrier in which a buffer member is arranged Side surface sectional view showing a configuration of an FPC carrier in which a buffer member is arranged The perspective view which shows the structure of a buffer member Side surface sectional drawing which shows the structure of the FPC conveyance carrier of 2nd Embodiment Side surface sectional drawing which shows the structure of the FPC conveyance carrier of 2nd Embodiment Side sectional view showing the configuration of the suction block and carrier board Side sectional view showing the configuration of the suction block and carrier board Side surface sectional view showing a configuration of an FPC carrier in which a buffer member is arranged Side cross section showing the configuration of the suction block where the buffer member is placed

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... FPC, 2a ... Upper surface of FPC, 2b ... Lower surface of FPC, 3a-3d ... Surface mount component, 4 ... Positioning hole, 10 ... FPC transport carrier, 12a ... Upper surface of FPC transport carrier, 12b ... Lower surface of FPC transport carrier , 14 ... positioning pins, 16a to 16d ... recesses, 18 ... positioning holes, 20a to 20d ... buffer members, 40 ... FPC transport carrier, 42 ... carrier board, 42a ... upper surface of the carrier board, 42b ... lower surface of the carrier board, 44 ... base board, 44a ... upper surface of base board, 44b ... lower surface of base board, 46 ... positioning hole, 48 ... positioning pin, 50 ... positioning pin, 52a to 52d ... through hole, 54a to 54d ... support part, 56a to 56d ... concave

Claims (15)

In the flexible printed circuit board carrier in which the flexible printed circuit board for double-sided mounting is placed on the upper surface,
A concave portion that accommodates a component mounted on the bottom surface of the flexible printed circuit board is provided on the upper surface, the concave portion has a depth corresponding to the component thickness of the accommodated component, and the component is supported on the bottom surface. Flexible printed circuit board carrier. A carrier board on which the flexible printed circuit board is placed;
A base board on which the carrier board is placed;
A through hole for accommodating a component formed on the carrier board and mounted on the lower surface of the flexible printed circuit board;
A support portion that is formed on the base board and supports the component housed in the through hole from below;
The flexible printed circuit board according to claim 1, wherein when the carrier board is placed on an upper surface of the base board, the through hole and the support portion are integrated to form the concave portion. Career.   The flexible printed circuit board transport carrier according to claim 1, wherein a buffer member is disposed on a bottom surface of the concave portion and the component is supported via the buffer member.   The flexible printed circuit board transport carrier according to claim 3, wherein the buffer member is an elastic body that does not affect a component to be supported.   4. The flexible printed circuit board carrier according to claim 3, wherein the buffer member is a rubber that does not affect a supported component and has a hardness equal to or lower than a hardness of a squeegee used during solder printing.   The flexible printed circuit board transport carrier according to claim 3, wherein the buffer member supports the component by making point contact or line contact with the component. In a solder printing apparatus for placing a flexible printed board for double-sided mounting on a carrier board, setting the carrier board on a suction block, and printing solder on the upper surface of the flexible printed board,
A through hole for accommodating a component formed on the carrier board and mounted on the lower surface of the flexible printed circuit board;
Corresponding to the difference between the component thickness of the component accommodated in the through hole and the plate thickness of the carrier board, it is formed as a concave part, a convex part or a flat part at a position where the through hole is arranged on the suction block. A support part for supporting the component housed in the through hole from below;
A solder printing apparatus comprising:   The solder printing apparatus according to claim 7, wherein a buffer member is disposed on the support portion, and the component is supported from below through the buffer member.   The solder printing apparatus according to claim 8, wherein the buffer member is an elastic body that does not affect components to be supported.   The solder printing apparatus according to claim 8, wherein the buffer member is a rubber that does not affect a supported component and has a hardness equal to or less than a hardness of a squeegee used during solder printing.   11. The solder printing apparatus according to claim 8, wherein the buffer member supports the component by making point contact or line contact with the component. In a component mounting apparatus for mounting a flexible printed circuit board for double-sided mounting on a carrier board, setting the carrier board on a suction block, and mounting a component on the upper surface of the flexible printed circuit board,
A through hole for accommodating a component formed on the carrier board and mounted on the lower surface of the flexible printed circuit board;
Corresponding to the difference between the component thickness of the component accommodated in the through hole and the plate thickness of the carrier board, it is formed as a concave part, a convex part or a flat part at the position where the through hole on the suction block is arranged A support portion for supporting the component housed in the through hole from below;
A component mounting apparatus comprising:   The component mounting apparatus according to claim 12, wherein a buffer member is disposed on the support portion, and the component is supported from below through the buffer member.   The component mounting apparatus according to claim 12, wherein the buffer member is an elastic body that does not affect a component to be supported.   15. The component mounting apparatus according to claim 13, wherein the buffer member supports the component by making point contact or line contact with the component.

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