JP4659604B2 - Positioning device for conveying jig for component mounting of flexible printed wiring board - Google Patents

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning device for a printed circuit board for mounting a flexible printed wiring board, and more particularly, to a positioning apparatus for closely attaching and holding a large number of flexible printed wiring boards to a conveying jig.

A film-like thin substrate such as a flexible printed wiring board is flexible and cannot be set directly on a component mounting apparatus to mount a component. For this reason, component mounting is performed by fixing the sheet-like board before punching into individual pieces of products to a dedicated conveyance jig formed of metal plate, synthetic resin plate, etc., but it is incompatible with the same sheet Product may be included, and it is necessary to inspect the nonconforming part.

  Inspection of nonconforming products takes 0.2 to 0.5 seconds per product, and it takes a long time to inspect a large number of products, resulting in a large loss. In addition, since no parts are mounted in the non-conforming part, a conforming product in which the part is mounted on the same sheet and a non-conforming product in which the part is not mounted are mixed, resulting in a decrease in efficiency of the component mounting line.

Fixing multiple flexible printed wiring boards cut into individual pieces to the transfer jig improves component mounting workability, but the position accuracy of individual products is not ensured because the board is flexible and easily deformed. In some cases, the printing of cream solder may be shifted, and in the case of a minute part or a part having a narrow pitch, occurrence of short circuit, insufficient solder, or unconnected solder is likely to occur. As described above, the yield deteriorates when mounting a micro component or a component having a narrow pitch, and a method of mounting components by accurately fixing a plurality of flexible printed wiring boards cut into individual pieces has been desired.

As a method of mounting a plurality of flexible printed wiring boards by holding a plurality of flexible printed wiring boards on a conveying jig, a base plate on which a resin layer is formed in close contact with the lower surfaces of a plurality of substrates having positioning reference holes, and a semiconductor device A carrier (conveying jig ) is constituted by a backup opening through which a bonding portion of the substrate penetrates and a reference pin opening through which a reference pin inserted into the reference hole of the substrate and positions the substrate passes. There is known a method of positioning on the mounting jig , inserting the reference pin through the reference pin opening and inserting it into the reference hole, and keeping the substrate in contact with the resin layer of the carrier with the reference pin positioned on the carrier. (For example, refer to Patent Document 1).

Also, a notch for insertion smaller than the diameter of the conductive pin member of the other end of the connection is formed in the circuit wiring pattern connecting portion (both the flexible base material and the copper foil circuit pattern) in the flexible printed wiring board. There is known a mounting structure in which a through hole larger than the diameter of the pin member is provided in the periphery (surface covering material and reinforcing plate), and the pin member is inserted so as to spread the notch and soldering is performed. (For example, refer to Patent Document 2).
JP 2004-71863 A Japanese Utility Model Publication No. 61-79567

In the invention described in Patent Document 1, the carrier is positioned on the mounting jig by the positioning pin, the substrate is positioned on the carrier by the reference pin, and is closely held on the resin layer. According to this method, the positioning accuracy of the substrate is a numerical value obtained by adding the positioning accuracy of the positioning pins, the positioning accuracy of the reference hole and the circuit pattern opened in the substrate, and the positional deviation when fixing the substrate to the carrier.

  Among these, the most unstable factor is a positional shift caused by deformation of the reference hole when the substrate is fixed to the carrier. This shift is caused by the softness that is a basic characteristic of the flexible printed wiring board, and the substrate is deformed by the positioning pins to cause a position shift, and therefore it is difficult to avoid the shift. In the work described in Patent Document 1, a large variation occurs in the amount of deviation, and when a large number of substrates are set, the positioning accuracy of the substrates is likely to be impaired.

  In the invention described in Patent Document 2, the conductive pin member is inserted so as to expand the notch, and the pin member and the connecting portion are aligned and soldered, but the copper pin is included in the state including the copper foil. Since the notch is expanded, the positioning accuracy cannot be ensured by the compositional deformation of the copper foil. Even if the soldering process is effective, the positioning of a large number of flexible printed wiring boards is likely to cause a shift and a high accuracy cannot be obtained.

Accordingly, an object of the present invention is to provide a method and an apparatus for positioning with high accuracy when a plurality of flexible printed wiring boards cut into individual pieces are fixed to a conveying jig .

The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is a transport jig used when mounting a component on a flexible printed wiring board,
A first positioning means for mounting the conveying jig at a predetermined position on the upper surface of the mounting jig; and a first positioning means for closely holding the flexible printed wiring board at a predetermined position on the upper surface of the conveying jig mounted on the mounting jig. Two positioning means,
In the flexible printed wiring board positioning means for removing the conveyance jig holding the flexible printed wiring board from the mounting jig and releasing the contact with the first and second positioning means,
In a predetermined position on the upper surface of the mounting jig, a positioning pin for a conveying jig that constitutes a part of the first positioning means and a positioning pin for a flexible printed wiring board that constitutes a part of the second positioning means are provided upright. And
The transport jig includes a positioning hole constituting another part of the first positioning means at a position corresponding to the positioning pin for the transport jig, and a second position at a position corresponding to the positioning pin for the flexible printed wiring board. Auxiliary positioning holes constituting the other part of the positioning means are provided,
Furthermore, the flexible printed wiring board is provided with a reference positioning hole constituting another part of the second positioning means at a position corresponding to the positioning pin for the flexible printed wiring board and the auxiliary positioning hole,
The reference positioning hole provided in the flexible printed wiring board is formed such that the hole diameter of the base film of the flexible printed wiring board is smaller than the diameter of the positioning pin for the flexible printed wiring board,
Provided is a positioning device for a printed circuit board mounting jig for a flexible printed wiring board, wherein the hole diameter of the conductor and the cover film is formed larger than the diameter of the positioning pin for flexible printed wiring board .

According to this configuration, the first positioning unit positions and mounts the conveying jig on the upper surface of the mounting jig , and the second positioning unit positions the flexible printed wiring board on the upper surface of the conveying jig. And hold tightly. At this time, when the large-diameter positioning pin provided in the mounting jig is inserted into the reference positioning hole of the flexible printed wiring board, the center of the reference positioning hole approaches the center of the positioning pin due to elastic deformation of the flexible printed wiring board. Thus, the positioning of the second positioning means is performed. In this state, the flexible printed wiring board and the conveying jig are removed from the mounting jig , the contact with the first and second positioning means is released, and the flexible printed wiring board is positioned and held on the conveying jig .

According to this configuration, the conveying jig positioning pin is inserted into the positioning hole of the first positioning means, and the conveying jig is positioned at a predetermined position on the upper surface of the mounting jig . At the same time, the flexible printed wiring board positioning pins are inserted into the auxiliary positioning holes of the second positioning means, and the flexible printed wiring board positioning pins protrude from the upper surface of the conveying jig . Then, a flexible printed wiring board positioning pin protruding from the auxiliary positioning hole is inserted into the reference positioning hole of the second positioning means, and the flexible printed wiring board is held tightly at a predetermined position on the upper surface of the conveying jig . At this time, among the reference positioning holes provided in the flexible printed wiring board, the hole diameter of the base film is formed smaller than the diameter of the positioning pin for flexible printed wiring board. When this is done, the hole in the base film is expanded by the positioning pins for the flexible printed wiring board. Of the reference positioning holes provided in the flexible printed wiring board, the hole diameter of the conductor and the cover film is formed larger than the diameter of the positioning pin for the flexible printed wiring board, so that the deformation of the base film is not hindered. Due to the elastic deformation of the base film, the center of the hole of the base film, that is, the center of the reference positioning hole approaches the center of the flexible printed wiring board positioning pin, and the positioning of the second positioning means is performed.

As described above, the present invention positions and mounts the transport jig on the upper surface of the mounting jig by the first positioning means, and further, the flexible printed wiring on the upper surface of the transport jig by the second positioning means. Position and hold the plate in close contact. The second positioning means is formed by inserting a positioning pin for a flexible printed wiring board having a diameter larger than that of the reference positioning hole provided in the mounting jig into a reference positioning hole provided in the flexible printed wiring board. Since the printed wiring board is positioned on the conveying jig , the center of the reference positioning hole approaches the center of the positioning pin for the flexible printed wiring board due to the elastic deformation of the flexible printed wiring board, and high-precision positioning can be performed.

Therefore, a large number of flexible printed wiring boards cut into individual pieces can be held in close contact with the conveying jig with high positional accuracy, and occurrence of nonconforming products such as misalignment can be eliminated. For this reason, the conveyance jig | tool holding many flexible printed wiring boards correctly positioned can be conveyed to a component mounting process, and component mounting workability | operativity and efficiency improvement can be aimed at.

Hereinafter, a preferred embodiment of a positioning method and a positioning device for a flexible printed wiring board according to the present invention to a component mounting conveying jig will be described. In order to achieve the purpose of positioning with high accuracy when fixing a plurality of flexible printed wiring boards cut into individual pieces to a conveying jig , the present invention is used when mounting components on flexible printed wiring boards. a conveying jig that is, the conveying jig to the upper surface of the mounting jig through a first positioning means mounted, further, the upper surface of the conveying jig mounted on the mounting jig through the second positioning means is held in close contact with the flexible printed circuit board, and thereafter, the remove the transport jig while keeping holding the flexible printed circuit board from the mounting jig, the first and second In the positioning method of the flexible printed wiring board for releasing the contact with the positioning means, the second positioning means is a reference position provided on the flexible printed wiring board. To determine the hole, and inserting the positioning pin having a diameter larger than the reference positioning hole provided in the mounting jig, it was achieved by positioning the flexible printed circuit board in the transport jig.

  FIG. 1 is a conceptual diagram of an individual piece of a flexible printed wiring board (hereinafter referred to as an FPC) 11 having an outer shape punched out. The FPC 11 punched into an individual piece has reference positioning holes 12 provided at two or more locations. Yes. In the illustrated example, a plurality of components such as a semiconductor 13, a connector 14, and a chip component 15 are mounted on a circuit pattern (not shown).

  The reference positioning hole 12 constitutes a part of the second positioning means 26 to be described later. The reference positioning hole 12 is provided through the base film, the conductor, and the cover film constituting the FPC 11, but the hole of the base film The hole diameters of the conductor and the cover film are different.

  FIG. 2 shows an FPC sheet 10 on which a plurality of product FPCs 11 before being punched are arranged. In this state, various holes (not shown) including the reference positioning hole 12 are drilled at predetermined positions of each product FPC. Further, a pattern forming process described later is also performed in the state of the FPC sheet 10. Thus, the position accuracy with respect to the pattern can be accurately maintained by performing the boring process collectively.

  Here, in the present invention, the reference hole is drilled before the pattern is formed, but the method of forming the reference hole is not limited to this, and the reference hole can be drilled by image recognition after the pattern is formed, for example. In this case, it is possible to perforate while ensuring the positional accuracy with the pattern by performing image recognition.

  FIG. 3 shows a procedure for forming a reference positioning hole, a circuit pattern, etc. by applying a photoconductor to the FPC sheet 10 and performing an etching process. For convenience of explanation, only one FPC 11 is displayed to explain the pattern forming process. To do.

  As shown in FIG. 2A, the conductor 17 is formed on the surface of the base film 16 in the FPC 11 in the initial state. Then, the reference positioning holes 12a are drilled at two or more predetermined positions. In the reference positioning hole 12a, the base film 16 and the conductor 17 are penetrated with the same hole diameter. Note that holes other than the reference positioning hole 12a are also drilled at this stage.

  In order to form a circuit pattern, a patterning photoreceptor 18 is applied to the surface of the conductor 17 with a certain thickness, as shown in FIG. Subsequently, as shown in FIG. 2C, an exposure film 19 is attached to the surface of the patterning photoconductor 18. For example, when the negative type exposure film 19 is used, it is covered so that only the portion of the region 20 around the reference positioning hole 12a is not exposed, and the other portions are exposed. Although not shown, an exposure film 19 is formed so as to expose the circuit pattern portion.

  If the exposure film 19 is peeled and developed after being exposed through the exposure film 19, the exposed portion of the patterning photoconductor 18 reacts with light as shown in FIG. Then, the region 20 around the reference positioning hole 12a that has been cured and not exposed is removed, and the conductor 17 is exposed. At the same time, the patterning photoconductor 18 is also removed from the region (not shown) other than the circuit pattern, and the conductor 17 is exposed.

  Thereafter, if the etching process is performed, the conductor 17 is removed by etching in the region 20 around the reference positioning hole 12a where the conductor 17 is exposed, as shown in FIG. The reference positioning hole 12b having a larger diameter than the reference positioning hole 12a is formed. Further, the conductor 17 is also removed from regions other than the circuit pattern (not shown), and a circuit pattern is formed by the remaining conductor 17.

  If the patterning photoconductor 18 is peeled after the etching process is finished, the surface of the conductor 17 is exposed again as shown in FIG. 5F, and the reference positioning hole 12a formed in the base film 16; The reference positioning hole 12b having a larger diameter than that formed in the conductor 17 is exposed. Further, a circuit pattern (not shown) is also exposed.

  And as shown to the same figure (g), the cover film 21 is stuck on the surface of FPC11, and is protected. In the cover film 21, a reference positioning hole 12c having substantially the same hole diameter is formed at the same position as the reference positioning hole 12b formed in the conductor 17. As described above, the reference positioning hole 12 of the FPC 11 includes the small-diameter reference positioning hole 12a provided in the base film, and the conductor 17 and the large-diameter reference positioning holes 12b and 12c provided in the cover film 21.

  FIG. 4 is an enlarged cross-sectional view of the reference positioning hole 12 provided in the FPC 11, and FIG. 5 is an enlarged plan view of the reference positioning hole 12. 4A, a circuit pattern conductor 17 is provided on one side of the base film 16, or a circuit pattern conductor 17 on both sides of the base film 16, as shown in FIG. As described above, the reference positioning holes 12b and 12c provided in the conductor 17 and the cover film 21 are larger than the hole diameter of the reference positioning hole 12a provided in the base film 16, as described above. The hole diameter is larger by 0.1 mm to 2 mm.

  The diameter of the reference positioning hole 12a provided in the base film 16 is formed to be smaller by about 0.01 mm to 0.6 mm than the diameter of a flexible printed wiring board positioning pin (hereinafter referred to as FPC positioning pin) 29 described later. In addition, the diameters of the reference positioning holes 12b and 12c provided in the conductor 17 and the cover film 21 are 0.1 mm to 2 mm larger than the diameter of the FPC positioning pin 29.

FIG. 6 shows a positioning device of the present invention. Reference numeral 22 denotes a conveying jig for mounting components on the FPC 11, and 23 denotes a mounting jig for positioning a plurality of FPCs 11 on the conveying jig 22. The conveying jig 22 is mounted at a predetermined position on the upper surface of the mounting jig 23 via the first positioning means 24. An adhesive layer 25 is provided on the upper surface of the conveying jig 22, and a plurality of FPCs 11 are closely attached to the upper surface of the conveying jig 22 via the adhesive layer 25 via the second positioning means 26. The adhesive layer 25 is formed of an adhesive resin and is provided over the entire upper surface of the transport jig 22. However, the adhesive layer 25 is partially provided on the upper surface of the transport jig 22 in accordance with the mounting position of each FPC 11. An adhesive layer 25 may be provided.

The first positioning means 24, the conveying jig and transporting the jig for the positioning pin 27 protruding from the upper surface of the mounting jig 23, the (including an adhesive layer 25, hereinafter the same) conveying jig 22 in A positioning hole 28 provided at a position corresponding to the positioning pin 27, and the second positioning means 26 is a flexible printed wiring board positioning pin (hereinafter referred to as FPC) protruding from the upper surface of the mounting jig 23. 29), the auxiliary positioning hole 30 provided at a position corresponding to the FPC positioning pin 29 in the conveying jig 22, and the FPC 11 corresponding to the FPC positioning pin 29 and the auxiliary positioning hole 30. The above-described reference positioning hole 12 is provided at the position.

Wherein when mounting the conveying jig 22 on the upper surface of the mounting jig 23, the first of the conveyance jig positioning pin into the positioning hole 28 of the conveying jig 22 which constitutes part of the positioning means 24 27 , And the conveying jig 22 is positioned and mounted at a predetermined position on the upper surface of the mounting jig 23. At this time, the FPC positioning pin 29 is inserted into the auxiliary positioning hole 30 of the conveying jig 22 constituting a part of the second positioning means 26, and the FPC positioning pin 29 is inserted from the upper surface of the conveying jig 22. Protruding.

When mounting the FPC11 the upper surface of the conveying jig 22, to the reference positioning hole 12 of FPC11 constituting a part of the second positioning means 26 protrudes from the upper surface of the conveying jig 22 FPC The positioning pin 29 is inserted, and the FPC 11 is held in close contact with a predetermined position on the upper surface of the conveying jig 22.

Thereafter, while the plurality of FPCs 11 are held in close contact with each other, the conveying jig 22 is raised, the positioning holes 28 are extracted from the conveying jig positioning pins 27, and the reference positioning holes 12 and the auxiliary positioning holes 29 are removed from the FPC positioning pins 29. The positioning hole 30 is extracted, the contact with the first positioning means 24 and the second positioning means 25 is released, the transport jig 22 is removed from the mounting jig 23, and the FPC 11 is kept in close contact with the FPC 11 The conveying jig 22 is conveyed to the component mounting process.

  As described above with reference to FIGS. 4 and 5, the reference positioning hole 12 provided in the FPC 11 constituting a part of the second positioning means 26 is provided in the reference positioning hole 12 a provided in the base film 16 and the conductor 17. The reference positioning hole 12b is provided, and the reference positioning hole 12c is provided in the cover film 21. The hole diameter of the reference positioning hole 12 a provided in the base film 16 is smaller than the diameter of the FPC positioning pin 29 by about 0.01 mm to 0.6 mm, and the conductor 17 and the cover film 21 are formed. The diameters of the provided reference positioning holes 12b and 12c are formed to be 0.1 mm to 2 mm larger than the diameter of the FPC positioning pin 29.

  Therefore, when the FPC positioning pin 29 is inserted into the reference positioning hole 12 provided in the FPC 11 as shown in FIG. 7, the tip of the FPC positioning pin 29 is positioned at the base film 16 as shown in FIG. The reference positioning hole 12a is pressed against the reference positioning hole 12a, and, as shown in FIG.

  Of the reference positioning holes 12 provided in the FPC 11, the diameters of the reference positioning holes 12b provided in the conductor 17 and the reference positioning holes 12c provided in the cover film 21 are formed larger than the diameter of the FPC positioning pin 29. Therefore, the reference positioning hole 12a of the base film 16 is not expanded and the deformation of the base film 16 is not hindered. The elastic deformation of the base film 16 causes the center of the reference positioning hole 12a of the base film 16 to be centered. That is, the center of the reference positioning hole 12 of the FPC 11 approaches the center of the FPC positioning pin 29, and positioning of the second positioning means is performed.

  FIG. 8 shows a structure in which circuit pattern conductors 17 are provided on both surfaces of the base film 16. In this case as well, as in the structure described with reference to FIG. When the pin 29 is inserted, the tip of the FPC positioning pin 29 is pressed against the reference positioning hole 12a provided in the base film 16, and further inserted while expanding the reference positioning hole 12a. Then, due to the elastic deformation of the base film 16, the center of the reference positioning hole 12a of the base film 16, that is, the center of the reference positioning hole 12 of the FPC 11 approaches the center of the FPC positioning pin 29, and the second positioning means. Positioning is performed.

As described above, when the FPC positioning pin 29 is inserted into the reference positioning hole 12 of the FPC 11, the FPC 11 is consciously deformed, whereby the center position of the FPC positioning pin 29 is obtained by the elastic force of the FPC 11. The reference positioning hole 12 can be brought close to the FPC 11, and the FPC 11 can be positioned at a predetermined position. Further, when the plurality of FPCs 11 are fixed to the upper surface of the conveying jig 22, the FPC positioning pins 29 move to the same position by the deformation stress of each FPC 11, so that the positional accuracy can be secured.

Further, since the reference positioning holes 12 are drilled in the FPC 11 before the circuit pattern is formed, the dimensions between the reference positioning holes 12 and the dimensions between the FPC positioning pins 29 can be matched in advance, and highly accurate positioning can be achieved. It becomes possible. The positional accuracy of circuit pattern formation provided on the FPC 11 is about 50 μm. However, in the positioning method of the present invention, the positional accuracy when the individual pieces of the FPC 11 are held in close contact with the conveying jig 22 is the same as the positioning pins 29 for the FPC. On the other hand, since it is 50 μm or less, it does not affect the mounting of components.

  It should be noted that the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

The conceptual diagram of FPC of the individual piece which concerns on this invention. Explanatory drawing of the FPC sheet which concerns on this invention. Explanatory drawing which shows the pattern formation process in the FPC sheet which concerns on this invention. The expanded sectional view of the reference | standard positioning hole provided in FPC which concerns on this invention. The enlarged plan view of the reference | standard positioning hole provided in FPC which concerns on this invention. Explanatory drawing which shows the positioning apparatus of FPC which concerns on this invention. Explanatory drawing which shows a behavior when the positioning pin for FPC is inserted in the reference | standard positioning hole of the single-sided FPC which concerns on this invention. Explanatory drawing which shows a behavior when the positioning pin for FPC is inserted in the reference | standard positioning hole of the double-sided FPC which concerns on this invention.

Explanation of symbols

11 Flexible Printed Circuit Board (FPC)
12 Reference positioning hole 12a Reference positioning hole of base film 12b Reference positioning hole of conductor 12c Reference positioning hole of cover film 16 Base film 17 Conductor 21 Cover film 22 Transport jig 23 Mounting jig 24 First positioning means 25 Adhesive layer 26 Second positioning means 27 Transfer jig positioning pin (first positioning means)
28 Positioning hole (first positioning means)
29 Positioning pins for flexible printed wiring boards (FPC positioning pins)
(Second positioning means)
30 Auxiliary positioning hole (second positioning means)

Claims (1)

It is a transport jig used when mounting parts on flexible printed wiring boards.
A first positioning means for mounting the conveying jig at a predetermined position on the upper surface of the mounting jig; and a first positioning means for closely holding the flexible printed wiring board at a predetermined position on the upper surface of the conveying jig mounted on the mounting jig. Two positioning means,
In the flexible printed wiring board positioning means for removing the conveyance jig holding the flexible printed wiring board from the mounting jig and releasing the contact with the first and second positioning means,
In a predetermined position on the upper surface of the mounting jig, a positioning pin for a conveying jig that constitutes a part of the first positioning means and a positioning pin for a flexible printed wiring board that constitutes a part of the second positioning means are provided upright. And
The transport jig includes a positioning hole constituting another part of the first positioning means at a position corresponding to the positioning pin for the transport jig, and a second position at a position corresponding to the positioning pin for the flexible printed wiring board. Auxiliary positioning holes constituting the other part of the positioning means are provided,
Furthermore, the flexible printed wiring board is provided with a reference positioning hole constituting another part of the second positioning means at a position corresponding to the positioning pin for the flexible printed wiring board and the auxiliary positioning hole,
The reference positioning hole provided in the flexible printed wiring board is formed such that the hole diameter of the base film of the flexible printed wiring board is smaller than the diameter of the positioning pin for the flexible printed wiring board,
An apparatus for positioning a flexible printed wiring board on a component mounting jig, wherein the hole diameter of the conductor and the cover film is larger than the diameter of the positioning pin for flexible printed wiring board.

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