JP4950530B2 - Substrate fixing device - Google Patents

Description

  The present invention relates to an apparatus for fixing a substrate such as a circuit board at the time of work, and particularly to correction of a curved substrate.

A substrate that is relatively thin and flexible, such as a printed circuit board, tends to have a convex warp on the front surface side or a convex warp on the back surface side, which is the surface on which the operation is performed. For this purpose, it is necessary that the substrate is flat with high accuracy. Therefore, in the cream solder printing apparatus described in Patent Document 1 below, a substrate support device for supporting the substrate from the back surface and a substrate pressing device for pressing the substrate from the front surface side are provided to prevent the occurrence of warping of the substrate. Has been. The substrate support device includes a plurality of substrate support pins erected on a pin support table, and is lifted and lowered by a lifting device. The substrate pressing device includes a substrate pressing member and a drive mechanism for moving the substrate pressing member up and down, and is moved in the X-axis and Y-axis directions by a camera moving device that moves an imaging camera for marks provided on the substrate and the screen, respectively. It is done. Then, the substrate is transported by the substrate transport device, and the substrate support device is lifted while being stopped on the substrate support device. The substrate is supported from below by the substrate support pins and is parallel to the substrate transport direction. Each edge is brought into contact with the lower surface of the substrate edge retainer. In this state, the substrate pressing member is moved above the center portion of the substrate by the camera moving device, and is lowered until it comes into contact with the upper surface of the substrate by the drive mechanism. It is applied to both end faces of the substrate and clamps the substrate. Since the substrate is pressed by the substrate pressing member, the substrate does not warp upward and is held flat when clamped by the side clamp member.
JP 2003-62971 A

However, in the cream solder printing apparatus described in Patent Document 1, there is a possibility that the substrate may be damaged when the substrate pressing member presses the substrate. If the substrate has a convex warp upward before being clamped by the side clamp member, when the substrate pressing member is lowered, the substrate will be pressed and the warp will be corrected. If the lowering distance is set to be large in order to securely hold the substrate, the pressing force is further increased after the substrate pressing member presses the substrate in a flat shape, and the substrate may be damaged. In addition, if the substrate pressing member has a high descending speed when the substrate is made of a relatively fragile material such as a ceramic substrate, the impact of contact between the substrate pressing member and the substrate is large, and the substrate is damaged. There is a fear.
The present invention has been made against the background of the above circumstances, and an object of the present invention is to provide a substrate fixing device capable of correcting and fixing a substrate with less fear of breakage.

The above problem is that the substrate fixing device (A) is an upward substrate that supports the substrate from below by contacting at least three locations including at least two peripheral portions and one intermediate portion of the lower surface of the substrate. A substrate support device including one or more substrate support members having a support surface; (B) a substrate lifting device that lifts and lowers the substrate supported by the substrate support member by lifting and lowering the substrate support member; The contact portion is provided above the substrate support member and is brought into contact with the substrate raised by the substrate lifting device from above by the contact portion, and the substrate is not in contact with the substrate support surface. A substrate holding member that presses one or more of the intermediate portions from above and makes the one or more points in close contact with the substrate support surface to straighten the substrate, and (D) the contact portion of the substrate pressing member rises. Giving elastic drag against And a cushioning applying unit to allow an increase in the contact portion, the substrate lifting device, the substrate supported substrate to the support member against the substrate holding member substrate orthodontic lifting device for correcting substrate And a work substrate lifting device that lifts and lowers the substrate supported by the substrate support member to a work position that is a work height at which work is performed on the substrate and a retreat position that is lower than the work position. The ascending speed reducing unit that lowers the ascending speed of the substrate support member when the substrate elevating apparatus operates as the substrate correction elevating apparatus from the ascending speed when operating as the working substrate elevating apparatus. It is solved by including.

  The above-described problem is also directed to the substrate fixing device in which the substrate fixing device is in contact with at least three locations including at least two peripheral portions and one intermediate portion on the lower surface of the substrate to support the substrate from below. A substrate support device including one or more substrate support members having a substrate support surface; and (b) one portion of the intermediate portion of the substrate placed on the substrate support member that is not in contact with the substrate support surface. A substrate pressing member that presses the above from above and causes at least one of the substrates to be in close contact with the substrate supporting surface; and (c) a relative lifting device that relatively lifts and lowers the substrate supporting member and the substrate pressing member in the vertical direction; (d) By controlling the relative lifting device, the substrate pressing member and the substrate supporting member are brought close to each other until the substrate supported by the substrate supporting member and the substrate pressing member are in contact with or close to each other. Control part and (e) before After the substrate pressing member comes into contact with the substrate, the substrate pressing member is moved toward the substrate supporting member at a speed smaller than the approach speed of the substrate pressing member to the substrate controlled by the approach control unit. It is also possible to solve the problem by including a press controller that presses the substrate until it contacts or substantially contacts the substrate support surface of the substrate support member.

  In the substrate fixing device including the substrate supporting device, the substrate lifting device, the substrate pressing member, and the cushioning imparting portion, the substrate is raised by raising the substrate supporting member and is brought into contact with the contact portion of the substrate pressing member. If the substrate has a convex warp upward, the intermediate portion of the substrate does not contact the substrate support surface but contacts the contact portion in a separated state, and when the substrate support member is further raised, the substrate rises. In contrast to being suppressed by the pressing member, the substrate support member rises and pushes up the peripheral edge of the substrate, thereby correcting the warpage of the substrate, and the substrate support surface comes into close contact with the substrate even at the intermediate portion of the substrate. As the substrate warp is corrected, the reaction force applied from the substrate to the substrate pressing member increases, but the initial value of the elastic drag that the cushioning imparting portion imparts to the contact portion (initial value of the cushioning effect) However, when the reaction force is smaller than the reaction force before the lower surface of the substrate contacts the substrate support surface, a cushioning action is applied to the contact portion before the lower surface of the substrate contacts the substrate support surface. It is done gently. In particular, when the initial value of the cushioning action is 0, the contact portion starts to contact the substrate under the cushioning action, and the breakage of the board is best prevented.

On the other hand, if the initial value of the cushioning action is set to a size that does not allow the contact portion to rise until the substrate warps, that is, until the lower surface of the substrate contacts the substrate support surface, The action imparting portion serves to prevent the substrate from being damaged by being sandwiched by an excessive force between the substrate support surface and the substrate pressing member after the lower surface of the substrate contacts the substrate support surface.
However, in any of these cases, the contact portion can be formed of rubber or the like, and the contact portion itself can have a cushion function, thereby reducing the impact at the time of contact between the contact portion and the substrate. Alternatively, the cushion function can be adjusted to a desired one by appropriately selecting the hardness of the contact portion or gradually changing the cross-sectional area of the contact portion.

In any case, in the substrate fixing apparatus according to the present invention, the substrate is corrected to a flat shape by pressing the substrate pressing member. The rising distance of the substrate support member by the substrate lifting device is made slightly larger than the distance between the substrate and the contact portion of the substrate pressing member in a state where the substrate without warping is supported by the substrate support surface. Warpage is reliably corrected. At this time, an excessive rise is allowed by the substrate pressing member rising against the drag applied by the cushioning imparting portion, and the substrate is sandwiched between the substrate pressing member and the substrate supporting member, and an excessive pressing force acts. And avoiding damage.
Thus, according to the board | substrate fixing apparatus which concerns on this invention, it can correct | amend to a planar form, without the possibility of damaging a board | substrate. In addition, since the substrate support member is raised at a low speed when correcting the warp of the substrate, the impact when the substrate contacts the substrate pressing member can be reduced, and the substrate is slowly pressed by the substrate pressing member, and the substrate is damaged. It is corrected to a flat shape with little fear.

  In the substrate fixing device including the substrate support device, the substrate pressing member, the relative lifting device, the approach control unit, and the pressing control unit, the substrate is corrected to a flat shape by pressing the substrate after the substrate pressing member contacts the substrate. Is done. At this time, since the substrate is relatively moved closer to the substrate support surface at a speed smaller than the speed when approaching the substrate, the substrate is slowly pressed by the substrate pressing member and corrected without fear of breakage. This will be described in more detail later.

Aspects of the Invention

The following invention which is considered claimable (hereinafter referred to as "claimable invention". Claimable invention, the lower is the invention der Ru present applied invention claimed Some aspects of the concept invention, the superordinate concept of the invention of the present application, or an invention of another concept) may be exemplified and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

In each of the following items, item ( 2) corresponds to claim 1 , item (4) in claim 2 , item ( 11) in claim 3 , item (18) in claim 4 , Each corresponds.

(1) One or more substrate supports having an upward substrate support surface that contacts at least three locations including at least two peripheral portions and one intermediate portion on the lower surface of the substrate and supports the substrate from below. A substrate support device including a member;
A substrate lifting device that lifts and lowers the substrate supported by the substrate support member by lifting and lowering the substrate support member;
The intermediate portion that is provided above the substrate support member with a contact portion and is brought into contact with the substrate raised by the substrate elevating device from above by the contact portion and is not in contact with the substrate support surface of the substrate. A substrate pressing member that presses one or more portions of the portion from above, closely attaches the one or more portions to the substrate support surface, and corrects the substrate into a flat shape;
A cushion fixing device including a cushion action imparting portion that allows the contact portion to rise while giving an elastic drag force against the rise of the contact portion of the substrate pressing member.
(2) The substrate lifting apparatus presses the substrate supported by the substrate support member against the substrate pressing member to correct the substrate, and the substrate correction lifting apparatus is supported by the substrate supporting member. And a working substrate lifting device that moves up and down to a working position that is a work height at which the work is performed and a retreat position that is lower than the working position. The substrate fixing apparatus according to (1), further including an ascending speed reducing unit that lowers the ascending speed of the substrate support member when operating as an apparatus from the ascending speed when operating as the working substrate lifting apparatus.
When correcting the warp of the substrate, the substrate support member is raised at a low speed, so that the impact when the substrate comes into contact with the substrate pressing member can be reduced, and the substrate is slowly pressed by the substrate pressing member, and the substrate is less likely to be damaged. It is corrected to a flat shape.
Since the substrate elevating device serves as both the substrate correcting elevating device and the working substrate elevating device, for example, substrate correction can be selectively performed. Correction may be performed for all types of substrates fixed by the substrate fixing device. For example, there are substrates that are thick or rigid and have no warpage and do not require correction. Therefore, for example, correction can be performed only for a type of substrate that is estimated to be warped according to the material, thickness, etc. of the substrate, and unnecessary correction operations are not performed, improving work efficiency. be able to. The selection or setting of correction execution may be performed by an operator or may be automatically performed by a control device.
(3) The substrate support device includes one or more suction holes opened in the substrate support surface, and a suction device that is connected to the suction holes and sucks air from the suction holes. The substrate fixing device according to item (1) or (2), wherein the substrate fixing surface is adsorbed and supported by the substrate.
It is not indispensable that the substrate support device is to support the substrate by adsorbing the substrate to the substrate support surface with a negative pressure. However, in the substrate fixing device described in this section, it is possible to reliably prevent the substrate from being warped again by, for example, adsorbing the substrate once corrected into a flat plate shape to the support surface. In addition, the distance between the substrate and the substrate support surface is less than the size that allows the substrate to be adsorbed by the negative pressure without having the substrate pressing member press the substrate until it comes into close contact with the substrate support surface. In some cases, the effect that the substrate is sucked onto the substrate support surface and corrected into a flat plate shape can be used. In this case, it is not indispensable for the substrate pressing member to press the substrate against the substrate supporting surface, and it is ensured that the substrate is sandwiched by an excessive force between the substrate pressing member and the substrate supporting surface and is not damaged. However, the substrate can be adsorbed on the substrate support surface.
(4) The cushion action imparting portion is
A bracket for holding the substrate pressing member so as to be movable up and down;
A lowering limit defining device for defining a lowering limit of the substrate pressing member relative to the bracket;
A cushioning device that is provided between the bracket and the substrate pressing member and allows the substrate pressing member to rise relative to the bracket when an upward force is applied to the substrate pressing member. The substrate fixing device according to any one of items (1) to (3).
Since the lowering limit of the substrate pressing member is defined by the lowering limit defining device, the position of the substrate pressing member before contacting the substrate becomes exactly constant, and the substrate can be corrected stably.
As described above, when the contact part itself has a cushioning function by setting the material and shape of the member constituting the contact part, such as by forming the contact part with rubber or the like, the contact part has its own function. As a result, the ascending of itself is allowed, and the cushioning action imparting unit can be omitted from the cushioning device described in this section.
(5) The substrate fixing device according to any one of (1) to (4), wherein the cushion device includes an air cylinder.
The cushion device can also be configured mainly with an elastic body such as a spring. However, air has compressibility and can easily adjust the elastic drag applied to the contact portion by changing the air pressure, and the air cylinder is particularly suitable as a cushion device. And can be configured at low cost.
(6) The substrate fixing device according to (5), further including an air pressure control device connected to the air cylinder and capable of changing an air pressure in the air cylinder.
By changing the air pressure, for example, the initial value of the elastic drag force applied to the substrate pressing member by the cushion action applying portion can be changed. Thereby, for example, when the substrate is made of a brittle material such as ceramics, the pressing force of the substrate pressing member can be made as small as possible within the range in which the substrate can be corrected, thereby avoiding damage to the substrate. However, it can be corrected to a flat shape. It is also possible to control the air pressure according to the rise of the substrate support member by executing a control program, etc., and appropriately changing the elastic drag of the pressing member as the correction of the warp of the substrate progresses. Accordingly, for example, after the substrate pressing member comes into contact with the substrate, the warpage of the substrate can be corrected while moving backward. A more specific example of this is that when the substrate pressing member starts to contact the substrate, the elastic drag force is made particularly small so that the impact at the time of contact between the substrate pressing member and the substrate is kept small. This is a mode in which the elastic drag force is increased later to reduce the retreat amount of the substrate pressing member.
(7) The substrate fixing device according to any one of (1) to (6), wherein at least a portion of the substrate pressing member that contacts the substrate is made of rubber or the like.
Due to the elastic deformation of the portion of the substrate pressing member that contacts the substrate, the impact when the substrate contacts the substrate pressing member is absorbed, and damage to the substrate is avoided. A desired shock absorbing function can be realized by appropriately selecting the hardness or the cross-sectional area of the rubber or the like, or by gradually increasing the cross-sectional area from the lower end to the upper side.
(8) The substrate fixing device according to any one of (1) to (7), wherein the substrate pressing member presses a plurality of locations on the upper surface of the substrate.
Even if the substrate pressing member is integrally provided with a plurality of contact portions, and the plurality of contact portions are simultaneously in contact with a plurality of locations of the substrate, the substrate pressing member is moved by the substrate pressing member moving device as described in the item (10). Accordingly, the same substrate pressing member may be configured to press a plurality of different portions of the substrate.
When multiple locations on the substrate are simultaneously pressed by the substrate pressing member, the pressing force is dispersed and applied to the substrate as compared with the case where only one location is pressed, and the pressing force at one location is small, which may cause damage to the substrate. Less.
(9) The substrate pressing member includes a plurality of contact portions provided at a plurality of positions in a plane parallel to the substrate support surface, and in all directions of the plane on which the plurality of contact portions are located. The substrate fixing device according to item (8), wherein the substrate holding member is held by the substrate pressing member holding member in a state in which inclination is allowed.
Since the substrate pressing member with multiple contact parts simultaneously contacts multiple locations on the substrate, the plane in which the multiple contact portions are located can be tilted in any direction so that it does not abut against a specific part of the substrate. For example, the substrate pressing member may be held by the substrate pressing member holding member via a ball joint or a bending member. However, it is desirable that the substrate pressing member keep a posture parallel to the substrate supporting surface of the substrate supporting member as much as possible in a state where the substrate pressing member is not in contact with the substrate.
(10) The substrate fixing device according to any one of (1) to (9), further including a substrate pressing member moving device that moves the substrate pressing member in a direction parallel to the substrate support surface.
By moving the substrate pressing member, one location that is necessary to correct the substrate to a flat shape, such as the center of the substrate, the location where warpage occurs, and the like, regardless of the size of the substrate, etc. It can be pressed or multiple locations can be pressed.
(11) By controlling the substrate elevating device, the substrate pressing member that holds one of the intermediate portions is once separated from the substrate, and then moved closer to a different location from the one location. A presser that causes the substrate pressing member moving device to move the substrate pressing member from a position corresponding to one location of the intermediate portion to a position corresponding to the other location, while pressing the location. The substrate fixing apparatus according to item (10), including a part change control unit.
For example, when the substrate has undulations and there are a plurality of convex deflections on the upper surface side, the posture of the entire substrate can be corrected satisfactorily by sequentially pressing each of the flexures.
Further, when the substrate is a component mounting substrate on which electronic circuit components are mounted and a plurality of printed circuit boards are manufactured from a single substrate, so-called multi-chip (multiple) substrate, By causing the substrate pressing member to press the central portion of each of the printed circuit boards, any of the plurality of printed circuit boards can be accurately manufactured in a state of being flattened.
(12) The substrate pressing member is a circular cross-sectional member having a circular cross-sectional shape when cut by a cut surface perpendicular to at least one axis, such as a cylindrical shape, a drum shape, or a spherical shape, and the circular cross-sectional member serves as a retainer. The circular member rolls on the upper surface of the substrate as the retainer is moved by the substrate pressing member moving device and is held rotatably around the at least one axis (10). Item or (11) Substrate fixing device.
For example, the circular cross-section member is pressed by the cushion action imparting portion in a state where the substrate is corrected to a flat shape in a state where the substrate is pressed into a flat shape in the same manner as the non-rotating substrate pressing member at a portion that contacts the substrate as the substrate rises It is possible to move up and hold the upper surface of the substrate by being moved by the substrate pressing member moving device after the substrate supporting device is lifted. Thereby, the substrate is pressed in the band-like region, and even if the substrate is wavy, it is corrected to a flat shape. According to the rolling of the circular member in cross section, it is possible to change the holding position of the substrate by the substrate pressing member without having to raise and lower the substrate supporting device one by one, and to quickly correct the posture of the substrate.
In addition, the circular cross-sectional member can be configured not to strongly sandwich the substrate with the substrate support surface even at the position closest to the substrate support surface. As described above, when the substrate support surface has suction holes and the substrate is adsorbed by negative pressure, the substrate is adsorbed to the substrate support surface if the gap between the lower surface of the substrate and the substrate support surface becomes a certain value or less. Therefore, if the cross-sectional circular member is brought close to the substrate support surface to a position where the gap is equal to or smaller than the predetermined value and greater than 0, and the cross-sectional circular member is moved by the pressing member moving device in this state, the lower surface of the substrate The gap between the whole and the substrate support surface can be removed.
(13) The substrate fixing device according to any one of (1) to (12), wherein the substrate pressing member is configured by a bag body containing fluid.
If the bag body is made of an elastic rubber bag body, and the inside of the bag body is filled with gas, the bag and the compressibility of the gas can be used to perform the function of pressing the substrate against the substrate support surface. In addition, if the bag is made of a flexible material sheet and the liquid is contained in a part of the inner volume of the bag, the substrate is pressed against the substrate support surface by the weight of the liquid. be able to.
It is easy to apply a pressing force by dispersing the bag containing the fluid in a relatively wide area of the substrate, and there is little risk of damaging the substrate.
When the substrate is pressed against the substrate support surface against the bag body by utilizing the compressibility of the bag body and the gas, the bag body can be made to function as a cushion action imparting portion by the compression of the gas, and the substrate fixing device is simply configured. be able to.
(14) The substrate fixing device according to (13), including a fluid amount control device that increases or decreases the amount of fluid in the bag.
By increasing / decreasing the amount of fluid in the bag, the force for pressing the substrate can be increased / decreased, or the contact / non-contact of the bag with the substrate can be controlled.
(15) The substrate fixing device according to any one of (1) to (14), further including a retracted position detecting device that detects a retracted position of the substrate pressing member due to a reaction force from the substrate.
Even if the position of the substrate pressing member itself is detected, the position of the substrate pressing member may be detected indirectly by detecting the position of the member that moves up and down together with the substrate pressing member.
If the relationship between the position of the substrate pressing member and the pressing force is determined in advance, the pressing force applied to the substrate by the substrate pressing member can be estimated based on the position of the substrate pressing member, thus preventing damage to the substrate. can do. Further, if the backward position detection device detects a position before a set distance from the backward limit position of the substrate pressing member, and the substrate lifting device is stopped according to the detection, any of the substrate fixing devices It is possible to prevent the pressing force of the substrate pressing member from becoming excessive due to the failure or malfunction of this part.
(16) a reference mark camera for imaging a reference mark provided on a substrate fixed to the substrate fixing device;
A camera holding member for holding the reference mark camera;
A camera moving device that moves the reference mark camera held by the camera holding member to an arbitrary position in a plane parallel to the substrate support surface by moving the camera holding member. The substrate fixing device according to any one of (10) to (15), wherein the substrate pressing member is held and the camera moving device also serves as the substrate pressing member moving device.
The configuration of the substrate fixing device can be simplified.
(17) An approach control unit that causes the substrate supporting member to approach until the substrate supported by the substrate supporting member contacts or approaches the substrate pressing member; and after the substrate pressing member contacts the substrate, the substrate The substrate is brought into contact with the substrate support surface of the substrate support member at a speed smaller than the approach speed of the substrate press member to the substrate by the control of the access control unit toward the substrate support member. The substrate fixing device according to any one of items (1) to (16), including a pressing control unit that presses until substantially contacting.
In the aspect in which this term is dependent on the term (2), the approaching speed of the substrate pressing member to the substrate can be made smaller than the ascending speed during the work.
As described above, when the initial value of the elastic drag force applied to the contact portion by the cushion action applying portion (the initial value of the cushion action) is smaller than the reaction force of the substrate before the lower surface of the substrate contacts the substrate support surface The speed of approach of the substrate pressing member to the substrate by the control of the approach control unit is as much as the cushion action imparting portion allows the contact portion to retreat as the substrate support member rises after the contact between the substrate and the contact portion. Thus, the approach speed of the substrate to the substrate support surface is reduced. This aspect is an example of the pressing control unit in this section.
Further, as described in the above item (12), the substrate pressing member is a circular member having a rotatable cross section, and the circular member in cross section is parallel to the substrate support surface by the substrate pressing member moving device described in the above item (10). Even when the portion of the intermediate portion of the substrate that does not contact the substrate support surface is gradually brought into contact with the substrate support surface as the substrate is moved in a certain direction, the substrate pressing member approaches the substrate by the control of the access control unit. The approach speed of the substrate to the substrate support surface is smaller than the speed. Therefore, this aspect is also an example of the pressing control unit in this section.
In any case, the contact speed of the lower surface of the substrate to the substrate support surface can be reduced, and the substrate can be satisfactorily prevented from being damaged by an impact.
(18) One or more substrate supports having an upward substrate support surface that contacts at least three locations including at least two peripheral portions and one intermediate portion of the lower surface of the substrate to support the substrate from the lower side. A substrate support device including a member;
A substrate pressing member that presses one or more portions of the intermediate portion of the substrate placed on the substrate supporting member that are not in contact with the substrate supporting surface from above and closely contacts at least one portion with the substrate supporting surface. When,
A relative lifting device that lifts and lowers the substrate support member and the substrate pressing member in the vertical direction;
An approach control unit for controlling the relative lifting device to bring the substrate pressing member and the substrate supporting member closer until the substrate supported by the substrate supporting member and the substrate pressing member come in contact with or close to each other; ,
After the substrate pressing member comes into contact with the substrate, the substrate pressing member is moved toward the substrate supporting member at a speed smaller than the approaching speed of the substrate pressing member to the substrate under the control of the approach control unit. And a holding controller that holds the substrate until the substrate contacts or substantially contacts the substrate support surface of the substrate support member.
The description of the above item (17) applies to the presser control unit.
When the substrate support surface has a suction hole and the substrate is not strongly sandwiched between the substrate pressing member and the substrate supporting surface, the substrate pressing member (including a rotatable circular member in cross section) is used as the substrate. It is not indispensable to bring the substrate support surface and the substrate pressing member close to each other until it is pressed against the substrate support surface, and the cushion action providing portion can be omitted. However, even in this case, it is not excluded that the cushion action imparting portion is provided as a safety device in preparation for malfunction.
(19) The substrate pressing member is provided above the substrate supporting member with a contact portion, and the substrate supporting member and the substrate pressing member are moved closer to each other by the relative lifting device when the substrate supporting member and the substrate pressing member are brought closer to each other. The substrate is contacted from above by the contact portion to correct the substrate into a flat shape, and allows the contact portion to rise while giving an elastic drag against the rise of the contact portion of the substrate pressing member. The board fixing device according to (18), wherein the board pressing member and the cushioning function giving part together with the relative lifting device constitute the approach control part and the pressing control part. .
Regarding the substrate fixing apparatus of this section, the description of the substrate fixing apparatus described in the section (17) is applicable.
(20) In the above (19), the cushion action imparting portion allows the contact portion to rise after the contact portion contacts the substrate and before the substrate contacts the substrate support surface. Board fixing device.
(21) A substrate pressing member moving device that moves the substrate pressing member in a direction parallel to the substrate supporting surface, wherein the substrate pressing member is a cut surface perpendicular to at least one axis, such as a cylindrical shape, a drum shape, or a spherical shape. A cross-sectional circular member having a circular cross-sectional shape when cut at a section, the circular cross-sectional member is held by a retainer so as to be rotatable around at least one axis, and (a) the relative lifting device is (B) The cross-sectional circular member as the retainer is moved by the substrate pressing member moving device in a state where the circular member is in contact with or close to one place of the substrate supported by the substrate supporting member. Rolling on the upper surface of the substrate to hold the one or more portions that are not in contact with the substrate support surface of the intermediate portion of the substrate. The part realizing (a) constitutes the approach control unit, and the part realizing (b) of the substrate pressing member moving device constitutes the pressing control unit in the paragraph (18) or (19) The board | substrate fixing apparatus of description.
In a mode in which this item is subordinate to item (18), the cross-sectional circular member is brought into contact with or brought close to one place on the substrate in the state where the substrate supporting member and the circular cross-sectional member are closest to each other by the relative lifting device. The substrate is pressed by moving the substrate pressing member to extend in a planar shape. The speed at which the substrate pressing member presses the substrate at the time of pressing is determined by the state of warping of the substrate and the moving speed of the substrate pressing member by the substrate pressing member moving device, but in most cases, the speed at which the substrate pressing member approaches the substrate Small and can correct the substrate with little risk of breakage.
In the case where the cushion action imparting portion is provided, when the circular cross-sectional member is brought close to the substrate support member by the approach control unit, the circular cross-sectional member is the substrate support member until the lower surface of the substrate comes into close contact with the substrate support surface. Even if it is made to approach, it can avoid that a board | substrate is damaged by the excessive pinching force. On the other hand, when the cushioning action providing portion is not provided, the substrate support surface is provided with a suction hole, the circular cross-section member is the substrate, and the lower surface thereof is the substrate support surface. The substrate pressing member and the substrate supporting member are moved closer to each other by a relative lifting device so as to hold down (a gap in which the lower surface of the substrate can be adsorbed to the substrate supporting surface by suction of air from the suction hole) remains. Is desirable. Even when the cushioning action imparting portion is not provided, by forming at least the outer peripheral portion of the circular cross-sectional member with rubber or the like to give a cushion function, the circular cross-sectional member avoids damaging the substrate. It is possible to press against the substrate support surface.
(22) The substrate fixing device according to any one of (1) to (21),
And a printing device that prints a high-viscosity material on a substrate fixed by the substrate fixing device through a screen.
The screen is flat, and the substrate is corrected to be flat, so that the printing surface of the substrate and the screen are parallel to each other, and screen printing of a highly viscous material can be performed with high accuracy.
The substrate fixing device according to any one of the items (1) to (21) is used for fixing a substrate in a circuit board working machine other than a screen printing machine, such as a circuit component mounting machine, as well as a screen printing machine. be able to.
(23) One or more substrate supports having an upward substrate support surface that contacts at least three locations including at least two peripheral portions and one intermediate portion on the lower surface of the substrate and supports the substrate from below. A substrate support device including a member;
A screen provided in parallel to the substrate support surface and having a plurality of through holes;
A squeegee device that pushes a highly viscous fluid into the through-hole while moving on the screen;
A relative lifting device for approaching and separating the substrate support device and the screen from each other;
A pair of clamp members that respectively abut against the two parallel side end surfaces of the substrate placed on the substrate support member and clamp the substrate from the side;
A clamp member driving device that moves at least one of the clamp members to a clamp position and an unclamp position retracted from the clamp position;
A positioning control unit that causes the clamp member driving device to position the pair of clamp members at the clamp position and to position the substrate with respect to the substrate support member;
After positioning by the positioning control unit, the clamp by the pair of clamp members is released, and in the released state, the substrate support member and the screen are brought close to the relative lifting device and supported by the substrate support member. A screen use pressing unit that presses a substrate on the screen and presses a portion of the lower surface of the substrate that is lifted from the substrate support surface of the substrate support surface by the screen.
By using the screen, it is possible to easily and inexpensively configure a substrate fixing device having a substrate correction function.

  Hereinafter, embodiments of the claimable invention will be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  FIG. 1 shows a screen printing machine including a substrate fixing device as one embodiment of the claimable invention. The screen printing machine includes a frame 10 as a printing machine body, a substrate transport device 12 (see FIG. 2), a substrate fixing device 14, a substrate position adjusting device 16, a screen support device 18, a squeegee device 20, an imaging device 22, and an imaging device. The moving device 24 and the control device 26 (see FIG. 9) are included.

  In this embodiment, the substrate transfer device 12 is constituted by a belt conveyor, and includes a carry-in conveyor 30, a main conveyor 32, and a carry-out conveyor 34 as shown in FIG. Each of the conveyors 30, 32, and 34 includes a pair of endless conveyor belts 36 (see FIGS. 2 and 3), which are arranged in a line, and each pair of conveyor belts 36 is respectively provided by a belt circulating device. By being rotated, the circuit board 40 (hereinafter abbreviated as the board 40) is conveyed in a horizontal direction in a direction parallel to the solder printing surface in a posture in which the solder printing surface as a plate surface thereof is horizontal. . In FIG. 3, the conveyor belt 36 is shown only in a portion where the substrate 40 is placed. The belt circulating device uses a belt circulating motor 42 (see FIG. 9) as a drive source, and the substrate transport device 12 can transport the substrate 40 to an arbitrary position in the substrate transport direction. A direction parallel to the substrate transport direction is defined as an X-axis direction, and a direction parallel to the solder printing surface of the substrate 40 fixed by the substrate fixing device 14 and perpendicular to the substrate transport direction is defined as a Y-axis direction.

  The substrate fixing device 14 includes a substrate holding device 48, a substrate holding device lifting / lowering device 50, and a substrate pressing device 52. The substrate holding device 48 and the substrate holding device lifting / lowering device 50 are provided at a portion corresponding to the circuit board transfer area of the main conveyor 32 of the frame 10 and between the carry-in conveyor 30 and the carry-out conveyor 34. As shown in FIG. 3, the substrate holding device lifting device 50 includes a lifting platform 60 as a lifting member and a lifting platform lifting drive 62. The lifting platform lifting / lowering drive device 62 includes a lifting platform lifting / lowering motor 64 as a drive source, a ball screw 66 and a nut 68 as a kind of feed screw, and guides the lifting platform 60 to a guide rail 70 as a guide. Move to any position in the vertical direction. The ball screw 66 and the nut 68 constitute a feed screw mechanism that is a motion conversion mechanism.

  The substrate holding device 48 is provided on the lifting platform 60 via the substrate position adjusting device 16, and the substrate holding device lifting device 50 makes a direction perpendicular to the solder printing surface of the substrate 40 held by the substrate holding device lifting device 50 (Z-axis direction and And is raised and lowered in the vertical direction. The substrate holding device 48 is also moved in the X-axis direction and the Y-axis direction by the substrate position adjusting device 16 and is rotated about a vertical axis that is parallel to the Z-axis and is held by the substrate holding device 48. The positions of the substrate 40 and the screen supported by the screen support device 18 are adjusted. Although not shown in the drawings, the substrate position adjusting device 16 is a movable table 76 which is a movable member mounted on the lifting platform 60 so as to be movable in the X-axis direction and the Y-axis direction and to be rotatable about the Z-axis, The substrate holding device 48 is provided on the moving table 76. Although the substrate position adjusting device 16 has not been disclosed yet, it is configured in the same manner as the substrate position adjusting device described in the specification of Japanese Patent Application No. 2005-223144 related to the present applicant, and detailed illustration and description thereof are omitted. To do.

  In the present screen printing machine, the substrate holding device 48 includes a substrate supporting device 80 and a substrate clamping device 82 as shown in FIG. As shown in FIGS. 4 and 5, the substrate support device 80, as shown in FIG. 4 and FIG. 5, has a plurality of substrate support pins 84 and a substrate support pin 84 as a substrate support member. The substrate 40 is adsorbed and supported by a negative pressure. Each of the plurality of substrate support pins 84 includes a support portion 88 made of a non-magnetic material and a pedestal 90 made of a permanent magnet as an attachment portion, and is fixed to the pin support surface 92 of the pin support stand 86 made of a magnetic material by a magnetic force. Is done.

  The support portion 88 of the substrate support pin 84 has a flat upper end surface or tip end surface as an upward substrate support surface 96 that supports the substrate 40, and a rubber suction cup 98 is attached to the support portion 88. The tip surface of the suction cup 98 is slightly protruded from the substrate support surface 96. In the support portion 88, a suction hole 102 that opens to the substrate support surface 96 and the negative pressure chamber 100 provided in the pedestal 90 and extends in the axial direction is formed, and the substrate support pins 84 are formed in the pedestal 90. When the suction hole 102 is attached to the pin support base 86 so as to cover the negative pressure supply port 104 opened on the pin support surface 92, the suction hole 102 is in the negative pressure chamber 100, the negative pressure supply port 104, and the pin support base 86. Is connected to a negative pressure source 108 through a passage 106 and the like, and air is sucked from the suction hole 102 to supply a negative pressure to the substrate support surface 96. The negative pressure source 108 is constituted by a vacuum pump, for example, and constitutes a suction device. A plurality of negative pressure supply ports 104 are provided in the pin support base 86, and the substrate support pins 84 are flat where there are no projections due to mounting of the electronic circuit components or the like, which are supported by the substrate support pins 84 of the substrate 40. The negative pressure suction port 104 is in contact with three or more locations including at least two peripheral portions and one intermediate portion on the lower surface of the substrate 40 so as to support the substrate 40 from below. Is selected and attached to the pin support 86. The negative pressure supply port 82 to which the substrate support pins 84 are not attached is covered with a cap 110 to prevent negative pressure leakage.

  The substrate 40 is supported by a set of substrate support surfaces 92 of a plurality of substrate support pins 84. Hereinafter, a virtual substrate support surface that is a flat surface including the plurality of substrate support surfaces 92 unless otherwise required. Suppose that it is supported by 120 (refer FIG. 12).

The substrate clamping device 82 is not disclosed yet, but is configured in the same manner as the substrate clamping device described in the specification of Japanese Patent Application No. 2005-108074 by the applicant of the present invention, and will be briefly described.
The substrate clamping device 82 includes a side clamping device 130 and a matching device 132. As shown in FIG. 3, the aligning device 132 includes a pair of aligning members 140 provided on the moving table 76 of the substrate position adjusting device 16 so as to be movable in the Y-axis direction, and substrate aligning that moves the aligning members 140 respectively. Member moving device 142. The board alignment member moving device 142 uses, for example, an air cylinder as a drive source. Each of the pair of alignment members 140 has a plate-like substrate edge pressing portion or alignment portion 144 that protrudes toward the main conveyor 32 and is long in a direction parallel to the substrate conveyance direction.

  The side clamp device 130 includes a pair of clamp members 150 and is lifted and lowered by a side clamp device lifting device 152. The side clamp device lifting device 152 includes a lifting platform 154 and a lifting platform lifting drive device 156 as lifting members. The lifting platform lifting / lowering driving device 156 includes a lifting platform lifting / lowering motor 158 as a driving source, a ball screw 160, a nut 162, and a pair of cam members 164, while the pair of cam members 164 are guided by the guide rails 166. By being moved in the axial direction, the lifting table 154 is guided by the guide rod 172 as a guide by the action of the inclined surface of the cam surface 168 and the rolling element 170 as a cam follower provided on the lower surface of the lifting table 154. The substrate position adjusting device 16 and the aligning device 132 are moved up and down.

  Each of the pair of clamp members 150 has a clamp surface 180 that extends parallel to the board conveyance direction and is perpendicular to the solder printing surface of the board 40 and perpendicular to the solder print surface. One of the pair of clamp members 150 is a fixed clamp member 150 fixed to the lifting platform 154, and the other is a movable clamp member 150, which is moved in the Y-axis direction by the clamp member driving device 182. It is done. The clamp member drive device 182 includes a clamp member drive motor 188 as a drive source, a ball screw 190, a nut 192, and a damper 194, and clamps the substrate 40 by moving the movable clamp member 150 closer to and away from the fixed clamp member 150. The position is moved to the unclamping position where the substrate 40 is released.

  The pair of clamp members 150 are provided with the clamp surfaces 180 on the surfaces facing each other, and are provided with a pair of conveyor belts 36 of the main conveyor 32 below the clamp surfaces 180, respectively. The main conveyor 32 is moved up and down by the substrate holding device lifting device 50 together with the substrate holding device 48. Accordingly, the substrate 40 or the substrate holding device 48 is a contact position or a working position where the screen is brought into contact with the substrate 40 to print the cream solder, and a position lower than the printing position. Are moved up and down to a transport position or a retracted position where the transport is performed, a position between the printing position and the retracted position, and a substrate holding position where the substrate 40 is retained.

  The substrate support device 80 and the substrate support device lifting device 200 are provided on the lifting platform 154, and are lifted and lowered with respect to the substrate position adjusting device 16 and the aligning device 132 by the side clamp lifting device 152 together with the side clamp device 130. The substrate support device 80 is moved up and down together with the substrate clamp device 82 by the substrate holding device lifting device 50 and the substrate support pins 84 are lifted and lowered. In this screen printing machine, the substrate support device 80 is lifted and lowered to support the substrate. The pins 84 are moved up and down, and the substrate supporting device 80 is further moved up and down with respect to the substrate position adjusting device 16 and the like in the substrate holding device 48. The substrate supporting apparatus lifting device 200 includes a lifting platform 202 and a lifting platform lifting drive device 204 as lifting members. The lifting platform lifting / lowering drive device 204 includes a lifting platform lifting / lowering motor 206, a ball screw 208 and a nut 210 held by the lifting platform 154, and lifts the lifting platform 202 to an arbitrary position in the vertical direction with respect to the lifting platform 154. The substrate support device 80 is moved up and down with respect to the side clamp device 130.

  As shown in FIG. 1, the screen holding device 18 is provided above the substrate holding device 48. In this screen printing machine, the screen 220 is parallel to the substrate 40 held by the substrate holding device 48. It is supposed to be held horizontally. The screen 220 has a through-hole (not shown) formed in a portion corresponding to the solder printing portion of the substrate 40, is stretched on the screen frame 222 (see FIG. 1), and is held by the screen holding device 18 in the screen frame 222. Has been.

  In the screen printing machine, the squeegee device 20 is a release type. As shown in FIG. 1, a pair of squeegee heads 232 (only one is shown in FIG. 1), the squeegee heads 232. And a squeegee head moving device 236 for moving the pair of squeegee heads 232 in a direction parallel to the screen 220. The squeegee head moving device 236 includes a moving member 242 and a moving member driving device 244. The moving member driving device 244 includes a squeegee head moving motor 246 that is a driving source and a feed screw mechanism 248 including a ball screw and a nut (see FIG. 9), and moves the moving member 242 while guiding it to the guide rail 250. The pair of squeegee heads 232 mounted on the moving member 242 is moved in the Y-axis direction. Each of the pair of squeegee head elevating devices 234 uses, for example, an air cylinder as a drive source, elevates the pair of squeegee heads 232, and contacts and separates the squeegee 252 included in each squeegee head 232 from the screen 220.

  The imaging device 22 includes a reference mark camera 260 (see FIG. 9), and images the reference marks (not shown) provided on the substrate 40 and the screen 204, respectively. Although this imaging device 22 has not been disclosed yet, it is configured in the same manner as the imaging device described in the specification of Japanese Patent Application No. 2005-223144 related to the present applicant, and detailed illustration and description thereof will be omitted.

  As shown in FIG. 6, the imaging device moving device 24 includes an X-axis direction moving device 270 and a Y-axis direction moving device 272, and the imaging device 22 is in a plane parallel to the substrate 40 and the screen 220. Move to any position in the horizontal plane. The X-axis direction moving device 270 includes an X-axis moving member 276 and an X-axis moving member moving device 278 as movable members. The X-axis moving member moving device 278 includes an X-axis moving motor 280 as a drive source, a feed screw mechanism 286 including a ball screw 282 and a nut 284, and guides the X-axis moving member 276 to a pair of guide rails 288. Move to any position in the X-axis direction. The Y-axis direction moving device 272 is provided on the X-axis moving member 276, and includes a Y-axis moving member 290 and a Y-axis moving member moving device 292 as movable members. The Y-axis moving member moving device 292 includes a Y-axis moving motor 294 as a drive source, a feed screw mechanism 300 including a ball screw 296 and a nut 298, and guides the Y-axis moving member 290 to the guide rail 302, while Move to any position in the direction. The imaging device 22 is provided on the Y-axis moving member 290. By moving the Y-axis moving member 290, the imaging device 22 has the virtual substrate support surface 120 (actually, the substrate support surface 96 of the substrate support pins 84), the substrate It is moved to an arbitrary position within a horizontal plane in a plane parallel to the substrate 40 held by the holding device 48 and the screen 220 supported by the screen support device 18.

  As shown in FIGS. 2 and 6, the Y-axis moving member 290 also holds a stop position defining device 320 that is moved by the imaging device moving device 24 to an arbitrary position in the horizontal plane. The imaging device moving device 24 is also a stop position defining device moving device, and the X-axis direction moving device 270 moves the stop position defining device 320 to an arbitrary position in the X-axis direction and parallel to the substrate transport direction. It is moved and the stop position of the substrate 40 is defined.

  As shown in FIG. 7, the stop position defining device 320 includes a stop position defining member 322, an elevating drive device 324, and a guide device 326. The stop position defining member 322 has a longitudinal shape, and is held by a holding portion 328 provided on the Y-axis moving member 290 so as to be movable up and down in a vertical direction perpendicular to the substrate 40. The elevating drive device 324 is composed of, for example, an air cylinder, and while the guide device 326 guides the stop position defining member 322, the movement restricting portion 330 is positioned in the substrate transport plane, and the substrate 40 is moved in the substrate transport direction. The substrate 40 is moved up and down to a lowered position where it contacts the downstream end and prevents the substrate 40 from being transported, and to a raised position where the substrate 40 is retracted and allowed to transport the substrate 40. The stop position defining member 322 is a position suitable for defining the stop position according to the width of the substrate 40 by the movement of the Y axis moving member 290, for example, the center in the width direction of the substrate 40 (direction parallel to the Y axis direction). It is located in the position which contacts a part.

  The Y-axis moving member 290 further holds the substrate pressing device 52 as shown in FIG. 7, and the imaging device moving device 24 causes the virtual substrate support surface 120 (actually on the pin support 86 to be It is moved in a direction parallel to the substrate support surface 96) of the attached substrate support pin 84, and is moved to an arbitrary position in a horizontal plane within a plane parallel to the virtual substrate support surface 120. The imaging device moving device 24 also serves as a substrate pressing member moving device.

  As shown in FIG. 7, the substrate pressing device 52 includes a substrate pressing member 350 and a cushion action imparting portion 352. As shown in FIGS. 7 and 8, the substrate pressing member 350 includes at least one, for example, six contact members 354. Each of these six contact members 354 has a circular cross-sectional shape, a rubber block having a constant diameter and a constant cross-sectional area, and a plate-like attachment member 356 around the axis of the attachment member 356. They are provided at equiangular intervals and with the axis line parallel to the axis line of the mounting member 356 and mounted so as to be detachable by an appropriate mounting device 358 such as a bolt in the state of being close to each other. As the rubber, for example, antistatic urethane rubber is used. The protruding end portions or tip portions protruding from the attachment members 356 of the six contact members 354 constitute the contact portions 355, and the contact surface which is the tip surface is located within a plane perpendicular to the axis of the attachment member 356. To do. In FIG. 7, three adjacent contact members 354 are shown in a straight line for easy understanding.

  As shown in FIG. 7, the cushion action imparting portion 352 includes a bracket 364 and an air cylinder 366. The bracket 364 is provided in the holding portion 328 of the Y-axis moving member 290, and holds the air cylinder 366 in the vertical direction. An attachment member 356 is attached to the front end or lower end of the piston rod 374 projecting downward from the cylinder housing 372 of the air cylinder 366 at its center, and is detachably attached, and a substrate pressing member 350 is attached. The air cylinder 366 is provided between the bracket 364 and the substrate pressing member 352.

  The air cylinder 366 is a double-acting air cylinder, and air chambers provided on both upper and lower sides of a piston (not shown) are switched by electromagnetic direction switching valves 382 and 384, which are electromagnetic control valves, as shown in FIG. Thus, a state communicating with the positive pressure source 386, a state opened to the atmosphere, and a state where neither communicates with the positive pressure source 386 is obtained, and the substrate holding member 350 is moved to the rising end position indicated by a solid line in FIG. It is raised and lowered to the descending end position indicated by a two-dot chain line. The lower end position of the substrate pressing member 350 is defined by, for example, the stroke end of the piston. The stroke end of this piston is adjustable. In the substrate pressing device 52, the portion that defines the stroke end of the piston of the air cylinder 370 constitutes a lowering limit defining device that defines the lowering limit of the substrate pressing member 350 relative to the bracket 352. An air pressure control device 388 is provided between the upper air chamber and the positive pressure source 386 so that the air pressure in the upper air chamber is changed. The air pressure in the upper air chamber is detected by the pressure sensor 390, and the air pressure control device 388 controls the air pressure in the upper air chamber based on the air pressure detected by the pressure sensor 390.

  Further, as shown in FIG. 7, the substrate pressing device 52 includes a retracted position detecting device 394 that detects the retracted position of the substrate pressing member 350. The backward position detection device 394 detects a position before (down) a set distance from the backward limit position of the substrate pressing member 350. The retreat limit position of the substrate pressing member 350 is defined by, for example, the stroke end of the air cylinder 366 above the piston. The retracted position detection device 394 is provided on the upper surface of the mounting member 356 and has a longitudinal dog 396 as a detected member that extends upward in parallel with the axis of the air cylinder 366 and a detection provided on the bracket 364. And a photoelectric sensor 398 as a switch. The photoelectric sensor 398 is, for example, a transmission type photoelectric sensor including a light projecting unit and a light receiving unit, and detects the dog 396 when the substrate pressing member 350 is located a set distance before the retreat limit position. In a state where the ON signal is output and the substrate pressing member 350 is positioned in front (lower side) of the retreat limit position, the dog 396 is detached from the photoelectric sensor 398 and outputs an OFF signal.

  As shown in FIG. 9, the control device 26 includes a control unit including a computer 450 and an input / output unit 452, and a plurality of drive circuits 454. The computer 450 includes a CPU 456, a ROM 458, a RAM 460, and a bus for connecting them, and a photoelectric sensor 398, an image processing computer 462, and an input device 464 are connected to the input side of the input / output unit 452, and the belt circling motor 42 and the like. Are connected to the output side of the input / output unit 452 via a drive circuit 454. The input device 464 includes, for example, a keyboard, a mouse, a touch panel, and the like. A motor as a drive source of various devices constituting the screen printing machine is configured by a lift motor for raising and lowering the lift 64 and a servo motor having an encoder, and is servo-controlled. The servo motor is an electric rotary motor capable of accurately controlling the rotation angle, and can control the position and operating speed of an operating member driven using the servo motor as a drive source. A step motor may be used instead of the servo motor. The ROM 458 stores various programs and data, such as a main routine (not shown), a substrate holding routine shown in the flowchart of FIG. 10, and a cream solder printing routine.

Next, the operation will be described.
In the present screen printing machine, the substrate holding device 48 is lowered to the retracted position when the substrate is carried in and out, and the substrate 40 is carried under the screen 220. The conveyors 40, 42, and 44 are simultaneously operated in synchronism, and simultaneously with the loading and unloading of the substrate 40, the stop position defining device 320 is moved in the same direction as the substrate conveyance direction. The stop position defining member 322 is lowered to the lowered position, and is positioned between the substrate 40 carried in by the carry-in conveyor 30 and the substrate 40 carried out by the main conveyor 32, and defines the stop position of the substrate 40. . The X-axis moving member 276 is stopped at a preset position, and the stop position defining device 320 is stopped at the stop position defining position. The stop position defining position is a position where the substrate 40 is located above the substrate support device 80 and below the screen 220.

  The substrate 40 contacts the stop position defining member 322, is stopped at a preset stop position, and is held by the substrate holding device 48 after the stop. The holding of the substrate 40 is performed according to the substrate holding routine shown in FIG. 10. If the correction of the substrate 40 is set, the substrate 40 is held after being corrected to a flat shape, and if not set, it is held immediately. Is done. In this screen printing machine, whether or not the substrate 40 is corrected is set in advance according to the type of the substrate 40. For example, execution of correction is set when it is estimated that there is a warp according to the thickness, material, and the like of the substrate 40, and when correction is not necessary, that is set.

  Further, when the substrate 40 is corrected, whether the substrate pressing member 350 presses only one place of the substrate 40 or the substrate pressing member 350 presses a plurality of different positions of the substrate 40 is set according to the type of the substrate 40. The The substrate pressing member 350 includes six contact members 354, and the contact member 354 simultaneously presses six locations of the substrate 40. The substrate pressing member 350 as a whole has one substrate pressing position. 40, if the substrate pressing member 350 is pressed only at one position of the substrate 40 at one substrate pressing position, or the substrate pressing member 350 is moved by the imaging device moving device 24, the substrate pressing position. It is set whether or not multiple locations on the substrate 40 are pressed. When the substrate pressing position is changed to a plurality, the substrate pressing member 350 is configured to press a plurality of locations on the substrate 40 when the contact portions 355 of the six contact members 354 contact the substrate 40 at the same time. By changing the pressing position, a plurality of locations on the substrate 40 are also pressed.

  If the entire substrate 40 is convexly warped upward, only one intermediate portion of the substrate 40 needs to be pressed. However, depending on the thickness, material, etc. of the substrate 40, the substrate 40 undulates and a plurality of locations are convex on the upper surface side. There is a case where there is a bend, and in such a case, the posture of the entire substrate 40 can be corrected satisfactorily by pressing the convex portions on the plurality of upper surfaces. Substrate correction presence / absence data for setting the presence / absence of correction and substrate pressing location data for setting the pressing location are preset and stored in the RAM 460 in association with the type of the substrate 40. The substrate pressing location data is set with reference to a reference position set for the substrate 40, for example, one corner on the downstream side in the substrate transport direction. Location data is set.

  The correction of the substrate 40 will be described. After carrying the substrate 40 into the substrate holding device 48, a substrate holding routine is executed, and whether or not the correction of the substrate 40 is instructed in step 1 (hereinafter abbreviated as S1. The same applies to other steps). Determined. This determination is performed based on the substrate correction presence / absence data stored in the RAM 460. If the correction of the substrate 40 is not instructed, the determination result of S1 is NO and S2 is executed, and the substrate 40 is corrected. Without being held by the substrate holding device 48. Since the holding of the substrate 40 by the substrate holding device 48 is performed in the same manner as the holding of the substrate described in the specification of the Japanese Patent Application No. 2005-108074, the description thereof is omitted.

  If the correction of the substrate 40 is instructed, the determination result of S1 is YES, S3 is executed, and it is determined whether or not the pressing position of the substrate 40 is one. This determination is performed based on the substrate pressing portion data stored in the RAM 460. If there is one pressing portion, the determination result in S3 is YES, S4 is executed, and the substrate 40 is an intermediate portion thereof. One place is pushed, and it is corrected and held flat.

  The substrate 40 is carried into the substrate holding device 48 as shown in FIG. 11A, and the alignment member 140 is advanced onto the clamp member 150 as shown in FIG. As shown in FIG. 11D, the movable clamp member 150 is moved toward the fixed clamp member 150 to press the substrate 40 against the fixed clamp member 150, and once clamped, the substrate is separated. The clamp member 150 temporarily clamps the substrate 40 and determines the position in the width direction (Y-axis direction). In this state, the side clamp device 130 is raised by the side clamp device lifting device 152, and the clamp member 150 is aligned. 11 (e) and 11 (f), the substrate support device 80 is raised by the substrate support device lifting device 200, and the substrate support pins 84 move the substrate 40 from below. Support and lift from conveyor belt 36 to contact mating section 144. Thereby, the upper surface of the substrate 40 and the upper surface of the clamp member 150 are positioned in the same plane, and both edge portions of the substrate 40 parallel to the substrate transport direction are pressed by the mating portion 144. When the substrate support device 80 is raised and the substrate 40 is brought into contact with the mating portion 144, the air in the suction hole 102 of the substrate support pin 84 is sucked, and negative pressure is applied to the opening of the suction hole 102 on the substrate support surface 96 side. Then, the substrate 40 is adsorbed by a negative pressure and held in close contact with the substrate support surface 96. The substrate 40 may have a convex warp on the side opposite to the solder printing surface and on the lower surface side. This warp is removed by the substrate 40 being attracted and pushed up by the substrate support pins 84. Is done.

  In parallel with the temporary clamping of the substrate 40, the stop position defining member 322 of the stop position defining device 320 is raised to the raised position. The substrate pressing member 350 is positioned at the raised end position except when the substrate is pressed, and is lowered to the lowered end position by the air cylinder 366 prior to the start of movement to the substrate pressing position by the imaging device moving device 24. . The lower end position is defined by the stroke end of the piston of the air cylinder 366 as described above, but is supported from below by the substrate support device 80 of the substrate holding device 48 positioned at the retracted position in the vertical direction. Is a position where the contact member 354 is positioned a set distance above the upper surface of the substrate 40 in a state where the contact member 140 is in contact with the alignment member 140. Note that when the substrate 40 is raised by the substrate support device 80 and brought into contact with the alignment member 140, the entire substrate holding device 48 is lowered from the retracted position by a set distance and lowered to the lowered end position. Interference between the contact member 354 and the substrate 40 is reliably avoided.

  After the substrate pressing member 350 is lowered to the lower end position, the substrate pressing device 52 is moved in the X-axis and Y-axis directions by the imaging device moving device 24 in parallel with the substrate 40 being supported by the substrate support device 80. And moved to the substrate pressing position. The substrate pressing position is a position corresponding to the central portion of the substrate 40 when there is one substrate pressing position. If the vicinity of the center of the substrate 40 is adsorbed from below by the substrate support pins 84, the supported portion may be pressed. The substrate pressing member 350 may be lowered to the lower end position during the movement to the substrate pressing position.

  If the substrate pressing member 350 is moved to the substrate pressing position, the substrate holding device 48 is raised by a set distance by the substrate holding device lifting / lowering device 50 and raised to the substrate correction position. In the substrate holding device 48 that is lowered by a set distance from the retracted position, the ascent distance is increased by the virtual substrate support surface 120 of the substrate support device 80 that is raised to a position that supports the substrate 40 and the substrate that is located at the lowered end position. The distance is set to be slightly larger than the distance obtained by subtracting the thickness of the substrate 40 from the distance between the pressing member 350 and the contact member 354. This distance is sufficient to correct the substrate 40, is short, and the substrate correction position is lower than the printing position. Further, the lifting / lowering motor 64 of the substrate holding device lifting / lowering device 50 is controlled by the control device 26, and the substrate holding device 48 raises the substrate supporting device 80 during the printing of the cream solder on the substrate 40, The speed is increased at a speed smaller than the speed at which the screen 220 is brought into contact with the screen 220. As described above, the supply of negative pressure to the substrate support pins 84 when the substrate 40 is supported and brought into contact with the mating portion 144 of the mating member 140 is started. Until the support by the apparatus 80 is released, the negative pressure continues to be supplied and is also supplied during substrate correction.

  When the substrate holding device 48 is raised and the substrate 40 supported by the virtual substrate support surface 120 (actually, the substrate support pins 84) is raised, if the substrate 40 has a convex warp upward, 12, the peripheral portion of the substrate 40 is supported by the virtual substrate support surface 120, but the intermediate portion is separated from the virtual substrate support surface 120, and the contact of the contact member 354 is in that state. Contact the part 355. Since the contact member 354 is made of rubber, the elastic deformation of the contact portion 355 absorbs an impact when the substrate 40 contacts. The elastic deformation of the contact portion 355 is due to shock absorption, and the amount thereof is negligibly small. Even when the rising speed of the substrate holding device 48 is controlled to be small, the impact at the time of contact can be small. In FIG. 12, six contact members 354 are collectively shown as one contact member 354. In FIG. 12, the warpage of the substrate 40 is exaggerated for easy understanding.

  When the substrate supporting device 80 is further raised from this state, the central portion of the substrate 40 is pressed by the substrate pressing member 350 and does not rise, while the peripheral portion is pushed up by the virtual substrate supporting surface 120. FIG. As indicated by the dashed line, the substrate 40 is gradually extended and corrected into a flat shape. At this time, the substrate 40 is not clamped by the clamp member 150, and both edge portions parallel to the substrate transport direction are pressed by the mating portion 144. Therefore, the substrate 40 is extended without coming off the conveyor belt 36, and the warpage is corrected. . The alignment member 140 is also a substrate edge pressing member and a substrate lifting prevention member. Then, the central portion of the substrate 40 is also sucked by the substrate support pins 84, is attracted to the substrate support surface 96, and is brought into close contact with and supported.

  As the warpage of the substrate 40 is corrected in this way, the reaction force applied from the substrate 40 to the substrate pressing member 350 increases, and the force by which the substrate pressing member 350 presses the substrate 40 increases as shown in FIG. However, the air cylinder 366 of the substrate pressing device 52 is such that the lower air chamber is open to the atmosphere and is the upper air chamber, and the initial value of the air pressure in the air chamber on the substrate pressing side is the warpage of the substrate 40. The air cylinder 366 is set to a size that the air cylinder 366 applies to the substrate pressing member 350 until the lower surface of the substrate 40 comes into contact with the substrate supporting surface 96 until the air cylinder 366 is lifted. The substrate 40 is pressed in a state where the substrate pressing member 350 is located at the lower end position, and the warpage of the substrate 40 is corrected. The air pressure is set according to, for example, the type of the substrate 40. For example, when the substrate 40 is made of a brittle material such as ceramics, the pressing force of the substrate pressing member 350 can be set within a range in which the substrate 40 can be corrected. The size is set as small as possible, and is corrected to a flat shape while avoiding damage to the substrate 40.

  The ascending distance of the substrate support pins 84 during substrate correction is slightly larger than the distance obtained by subtracting the thickness of the substrate 40 from the distance between the virtual substrate support surface 120 and the contact member 354. Therefore, the substrate support pins 84 are further raised after the warp of the substrate 40 is corrected and the lower surface of the substrate 40 contacts the substrate support surface 96. At this time, as shown in FIG. 13, the force with which the substrate pressing member 350 presses the substrate 40 increases at a stroke. Until the lower surface of the substrate 40 comes into contact with the substrate support surface 96, the force with which the substrate pressing member 350 presses the substrate 40 increases with a gradient determined by the elastic force of the substrate 40. Since the substrate pressing member 350 is pushed through the substrate 40, the pressing force rises at once to a magnitude determined by the initial value of the air pressure. When the pressing force exceeds the magnitude determined by the air pressure in the air chamber, the substrate pressing member 350 or the contact portion 355 rises while receiving elastic drag from the air cylinder 366, and the substrate support pin 84 and the substrate 40 rise. Is acceptable. At this time, the air pressure is detected by the pressure sensor 390 and the air pressure is controlled by the air pressure control device 388 regardless of the volume of the air chamber due to the rise of the piston due to the rise of the substrate pressing member 350. The force that acts on the substrate pressing member 350 is controlled to be constant, and the force by which the substrate pressing member 350 presses the substrate 40 is constant. Therefore, the warpage of the substrate 40 is reliably corrected by increasing the distance of the substrate support pins 84 that is greater than the distance between the substrate 40 and the contact member 354, and the substrate pressing member 350 is removed from the air cylinder 366 after correction. Ascending while receiving a certain drag force, the substrate 40 is not sandwiched between the substrate support surface 96 and the substrate pressing member 350 by an excessive force, and is prevented from being damaged.

  The rising distance of the substrate support pins 84 for correcting the warp of the substrate 40 is a distance that ensures that the warp of the substrate 40 is corrected, but the substrate pressing member 350 does not rise to the retreat limit position. However, for example, the substrate support pin 84 may rise beyond the set distance due to a failure or malfunction of the substrate holding device elevating device 50, but the substrate pressing member 350 rises to a short distance before the retreat limit position, and retreats. Then, the dog 396 is detected by the photoelectric sensor 398, and the substrate holding device lifting device 50 is stopped. Therefore, the piston reaches the ascending end position, the substrate pressing member 350 rises to the retreat limit position, and the substrate support pin 84 is further raised from this state, so that the substrate 40 becomes the substrate pressing member 350 and the substrate support pin 84. It is prevented from being pinched and damaged by excessive force.

  As described above, the support pins 84 are raised by a set distance by raising the substrate holding device 48, and after the warp of the substrate 40 is corrected, the movable clamp member 150 of the side clamp device 130 is moved to the clamping position, and FIG. As shown in g), the pair of clamp members 150 abut against the two side end faces parallel to the transport direction of the substrate 40 to clamp the substrate 40 from the side. Thereafter, the substrate holding device 48 is lowered to the retracted position, and at the same time, the substrate pressing member 350 is raised to the raised end position.

  After the substrate support device 80 is lowered, the image pickup device 22 is moved by the image pickup device moving device 24 to pick up images of the reference marks respectively provided on the substrate 40 and the screen 220, and their positional deviation is acquired. Further, as shown in FIGS. 11 (h) to 11 (j), the alignment member 140 is retracted from the clamp member 150 and the substrate 40, and the side clamp device 150 is raised, so that the alignment member 140, the substrate 40, the clamp Each upper surface of the member 150 is positioned in the same plane. Then, after the imaging device 22 and the like are retracted from between the substrate holding device 48 and the screen support device 18, the substrate holding device 48 is raised at a speed higher than that during substrate correction, as shown in FIG. 11 (k). Next, the substrate 40 is brought into contact with the screen 220. Then, as shown in FIG. 11 (l), the squeegee 252 is moved and cream-like solder is printed. However, the warpage is corrected and the substrate 40 is made flat with high accuracy, and printing is performed with high accuracy. Is called.

  If the substrate pressing member 350 is set to hold a plurality of different locations on the substrate 40, the determination result of S3 in the substrate holding routine is NO and S5 is executed. Several different locations can be pressed. When pressing a plurality of locations on the substrate 40, the plurality of substrate pressing locations are sequentially read out from the substrate pressing location data stored in the RAM 460, and the substrate pressing member 350 is moved to the substrate pressing location by the imaging device moving device 24. Then, the substrate 40 is pressed.

  Of the plurality of pressing points of the substrate 40 by the substrate pressing member 350, the pressing of the first substrate 40 is performed in the same manner as when pressing only one of the substrates 40. 48 is lowered, the substrate support device 80 is lowered by the same distance as the rising distance during substrate correction, and is lowered to the correction start position. The air pressure in the upper air chamber of the air cylinder 366 is controlled to the initial value, and the substrate supporting member 80 is lowered and the substrate pressing member 350 is lowered to the lowered end position as the substrate 40 is lowered. . After the substrate support device 80 is lowered, the substrate pressing member 350 is moved to the next substrate pressing position by the imaging device moving device 24. After the movement, the substrate support device 80 is raised by a set distance, and another portion of the substrate 40 is pressed by the substrate pressing member 350 and corrected into a flat shape. After all the set substrate pressing points are pressed, the substrate 40 is clamped by the side clamp device 130.

  As is apparent from the above description, in the present screen printing machine, there is a portion that controls the lifting / lowering motor 64 of the control device 26 and controls the rising speed of the substrate holding device 48 during substrate correction to be smaller than that during solder printing. A rising speed reduction unit is configured, and the substrate lifting apparatus 50 is configured together with the substrate holding apparatus lifting apparatus 50. In addition, the portion of the control device 26 that executes S1 constitutes a substrate correction execution selection unit, and the portion that executes S5 constitutes a pressing portion change control unit. A clamp member driving device 182 of the control device 26 has a movable clamp. A portion that moves the member 150 toward the fixed clamp member 150 and positions the substrate 40 in the width direction with respect to the substrate support pins 84 constitutes a positioning control unit. Further, the piston rod 374 constitutes a substrate pressing member holding member. The substrate holding device lifting / lowering device 50 is an aspect of a relative lifting / lowering device that causes the substrate support device 80, the substrate pressing member 350, and the screen 220 to approach and separate from each other.

  The cross-sectional area of the contact portion of the substrate pressing member may be gradually changed. For example, the substrate pressing member 480 shown in FIG. 14 includes a plurality of rubber contact members 482, and each of the contact members 482 has a columnar shape with a circular cross section at the base end portion 486 attached to the attachment member 484. However, the contact portion at the distal end is a transverse area gradually increasing portion 488 formed by an annular protrusion whose transverse area gradually increases from the distal end toward the proximal end side.

  The cross-sectional area gradually increasing portion 488 has a greater elastic deformation capability as it goes downward, and when the substrate 40 is brought into contact with the substrate support device 80 ascending, it is easily elastically deformed, and the impact when the substrate 40 comes into contact with the contact member 482 is sufficiently increased. Absorb. Therefore, as shown in FIG. 15, the force with which the substrate pressing member 480 holds the substrate 40 is when the cross-sectional area of the contact portion is constant at the beginning of contact with the substrate 40 (indicated by a two-dot chain line in FIG. 15). The amount of elastic deformation of the cross-sectional area gradually increasing portion 488 with respect to the unit rising amount decreases as the substrate 40 rises thereafter, and eventually the elastic deformation does not occur and the cross-sectional area of the contact portion is constant. Similarly increases.

  The substrate pressing member having a plurality of contact portions may be held in a state where inclination in any direction of a plane on which the plurality of contact portions are located is allowed. For example, as shown in FIG. 16, the substrate pressing member 500 is held via the ball joint 504 at the tip or lower end of the piston rod 502 of the air cylinder. The substrate pressing member 500 is configured in the same manner as the substrate pressing member 350, and a plurality of rubber contact members 506 are provided at equiangular intervals around the axis of the plate-like mounting member 508. A spherical portion or ball 510 provided at the tip of the piston rod 502 and a housing 512 provided at the center of the mounting member 508 are included. The housing 512 has a fitting hole 514 having a spherical inner peripheral surface. The piston rod 502 passes through the through hole 516 provided in the center of the mounting member 508, and the ball 510 passes through the fitting hole 514 in all directions. It is fitted so that it can rotate but cannot be pulled out. In FIG. 16, reference numeral 507 denotes a contact portion.

  Therefore, the substrate pressing member 500 is allowed to be inclined in any direction with respect to the piston rod 502 in the plane where the tip surfaces of the six contact members 506 are located. The contact portions 507 of the six contact members 506 are in contact with and pressed against the substrate 40 in the same manner. The inclination of the substrate pressing member 500 is regulated by the opening periphery of the through hole 516 being engaged with the piston rod 502, and the front end surfaces of the six contact portions 507 in a state where the substrate pressing member 500 is not in contact with the substrate 40. The one plane on which the is located is maintained in a posture parallel to the virtual substrate support surface 120 as much as possible. The opening peripheral edge portion of the through hole 516 constitutes an inclination restricting portion.

  The substrate pressing member may be a roller 550 as shown in FIG. The roller is a cylindrical member having a circular cross section when the roller is cut along a cutting plane perpendicular to one axis. The roller 550 is held at the tip end portion of the piston rod 374 of the air cylinder 366 in the same manner as the substrate pressing member 350. A yoke-shaped retainer 552 is provided at the tip of the piston rod 374, and a roller 550 is parallel to the virtual substrate support surface 120 by a shaft 554 and in a direction perpendicular to the substrate transport direction and in the Y-axis direction. It is held rotatably around a parallel axis. The outer peripheral portion of the roller 550 constitutes a contact portion 556, and the contact portion is made of rubber. Although the retracted position detecting device is not shown, the retracted position detecting device is configured similarly to the retracted position detecting device 394 and includes a dog and a photoelectric sensor. The dog is provided in the retainer 552 and the photoelectric sensor is provided in the bracket 364. .

  When the substrate 40 is pressed, the roller 550 is positioned at the lowered end position in the same manner as the substrate pressing member 350. Further, the width direction (Y-axis direction) of the substrate 40 corresponds to the center portion, and the direction parallel to the substrate transport direction (X-axis direction) corresponds to a portion slightly off from one end or the center portion of the substrate 40. It is located at the position to do. Then, the substrate support device 80 is raised, and the substrate 40 is brought into contact with the substrate 40, and the substrate 40 is pressed in the same manner as the substrate pressing member 350, and the substrate 40 is corrected to a flat shape. In this state, the air cylinder 366 rises while receiving a certain drag force. After the set distance of the substrate support device 80 is increased, the roller 550 is moved in the direction parallel to the substrate transport direction by the imaging device moving device 24 to the center side of the substrate 40 and rolls on the upper surface of the substrate 40. Hold it down. As a result, the substrate 40 is pressed in the band-shaped region, and even if the substrate 40 is wavy, it is corrected to a flat surface. As the roller 550 is moved in the direction parallel to the virtual substrate support surface 120 by the imaging device moving device 24, the portion of the intermediate portion of the substrate 40 that is not in contact with the virtual substrate support surface 120 gradually becomes virtual substrate support surface 120. The approach speed of the substrate 40 to the virtual substrate support surface 12 is smaller than the approach speed when the substrate support device 80 is brought close to the roller 550. This aspect is an example of a pressing control unit.

The roller may be provided so as to be rotatable around an axis parallel to the substrate transport direction. A plurality of rollers may be provided. For example, a plurality of rollers are provided at the tip of the piston rod so as to be rotatable around the same axis, or are provided so as to be rotatable around a plurality of axes parallel to each other, and the substrates are simultaneously pressed by the plurality of rollers. In this case, a plurality of rollers constitute a substrate pressing member, and each of the plurality of rollers constitutes a contact portion.
Furthermore, the circular cross-section member may be a sphere. If the cross-sectional circular member is a sphere, it can be rotated in any direction, and when the substrate is pressed while being moved and moved by the moving device, the pressing path can be arbitrarily set, and the substrate support pin of the substrate The part supported by can be pressed.

  As shown in FIGS. 18 to 20, the substrate pressing member may be configured by an elastic rubber bag 600 (hereinafter abbreviated as bag 600). The substrate holding device 602 has a plurality of, for example, three bags 600, and is moved in one direction parallel to the virtual substrate support surface, here parallel to the substrate transport direction, by the imaging device moving device 606 that moves the imaging device 604. Is moved in the X-axis direction, which is a simple direction. The imaging device moving device 606 is configured in the same manner as the imaging device moving device 24, and includes an X-axis direction moving device 608 and a Y-axis direction moving device 610. Three rubbers are provided on the X-axis moving member 612 of the X-axis direction moving device 610. Bag-making bodies 600 are provided in a row at intervals in the X-axis direction.

The three rubber bag bodies 600 are configured in the same manner, and one will be representatively described.
The rubber bag 600 is held at the opening by a bag holding member 618 and is provided on the X-axis moving member 612 via a bag lifting / lowering device 620. The bag lifting / lowering device 620 transmits the rotation of the bag lifting / lowering motor 624 including a lifting / lowering member 622, a servo motor, a bag lifting / lowering motor 624, a ball screw and a nut to the ball screw. When the elevating member 622 is moved up and down, the bag body 600 mounted on the elevating member 622 is moved to an arbitrary position in the vertical direction.

  As shown in FIG. 19, the bag body holding member 618 is connected to a positive pressure source 634 so that air is supplied to the bag body 600. An electromagnetic direction switching valve 636 serving as an electromagnetic control valve is provided between the bag body holding member 618 and the positive pressure source 634, and the bag body 600 is in communication with the positive pressure source 634, and is opened to the atmosphere. , A state in which neither of them can be communicated is obtained. In addition, a pressure sensor 638 is provided between the electromagnetic direction switching valve 636 and the bag body holding member 618 so that the pressure in the bag body 600 is detected.

  On the substrate carry-in side of the main conveyor 644 of the substrate carrying apparatus, there are 3 mounted on the X-axis direction moving member 612 in the Y-axis direction (the left-right direction in FIGS. 18 and 19) below the substrate carrying path. Load detecting devices 646 are provided at positions corresponding to the respective centers of the two bag bodies 600. The load detection device 646 is configured, for example, in the same manner as the load detection device described in the specification of Japanese Patent Application No. 2003-318237, and as shown in FIG. 20, as a strain gauge type load cell 648 as a detection unit and a transmission body The transmission plate 650 is included. The input element 652 constituting the input part of the load cell 648 has an outer peripheral surface of a tip part of which forms a partial spherical shape, and is provided integrally with a sensing part column as a sensing member housed in the casing 654. Yes. The sensing part column is made of an elastic body, and a plurality of strain gauges are attached. When a load is applied to the input element 652, the sensing part column is compressed, and the strain of the strain gauge is converted into an electrical signal by the bridge circuit. It is converted and output. The transmission plate 650 has a disc shape, and a projection 656 whose outer peripheral surface forms a partial spherical shape is provided at the center thereof, and an input 651 is provided in an opening 658 provided in the projection 656. It is fitted so that it can swing. The detection value of the pressure sensor 638 and the detection signal of the load detection device 646 are supplied to a control device 664 mainly composed of a computer, and the electromagnetic direction switching valve 636 and the like are controlled.

  When the bag body 600 is not used for correcting the substrate 40, air is allowed to flow out, and the bag body 600 is in a non-use state in which the bag body 600 is deflated like the bag bodies 600 on both sides of the three bag bodies 600 of FIGS. 18 and 19. . When used for straightening the substrate 40, the bag body 600 is communicated with the positive pressure source 634 and supplied with air by the switching of the electromagnetic direction switching valve 636 so as to be inflated. At this time, prior to the supply of air, the bag body 600 is moved above the load detection device 646 and lowered to the load detection position or the air filling position in the vertical direction. As shown by a two-dot chain line in FIG. 19, the load detection position is not in contact with the transmission plate 650 of the load detection device 646, but the bag 600 in the deflated state is in contact with the bag 600 when inflated by the supply of air. This is the detected position. Then, if air is supplied to the bag body 600, the load detected by the load detection device 646 becomes a predetermined value, and the pressing force that the bag body 600 presses the substrate 40 is obtained, the supply of air is stopped, and the bag body 600 is maintained in a state in which air is enclosed, and is raised to a retracted position as indicated by a one-dot chain line in FIG. The retracted position is a position where the bag body 600 which is inflated and in use is separated upward from the substrate 40 and is not in contact, and is a position above the substrate pressing position. As shown by a solid line in FIG. 19, the substrate pressing position is a position where the contact portion, which is the lower portion of the bag body 600, contacts the substrate 40 from above and presses it. When the bag body 600 is in a deflated state, the bag body 600 is not in contact with the substrate 40 and is positioned at the substrate pressing position. The substrate pressing position is also a standby position. Further, the three bags 600 are selectively inflated by the width of the substrate 40 (here, the dimension in a direction perpendicular to the substrate transport direction and parallel to the Y-axis direction) and used for holding. The As shown in FIGS. 18 and 19, when the width of the substrate 40 is small, only one central bag body 600 is sufficient for pressing, and only one is inflated. On the other hand, when the width of the substrate 40 is large, all three bags 600 are inflated.

  After the substrate 40 is loaded and stopped, the bag body 600 is moved above the central portion of the substrate 40 by the movement of the X-axis direction moving member 612. After the movement, the bag body 600 is lowered from the retracted position to the substrate pressing position. . Thereafter, the substrate 40 is raised and pressed by the bag body 600 to correct the warp. The bag body 600 containing air has compressibility, and absorbs an impact when contacting the substrate 40 by its elastic deformation. In addition, the load in the bag body 600 is set to be slightly larger than the size capable of pressing the substrate 40 until the warp is corrected, that is, until the lower surface of the substrate 40 contacts the virtual substrate support surface, for example, If the reaction force from the substrate 40 exceeds the load of the bag body 600, the bag body 600 is compressed to allow the substrate support device 80 and the substrate 40 to rise, and damage to the substrate 40 is avoided.

  After the correction of the substrate 40, the substrate 40 is clamped and lowered, and the bag body 600 is raised to the retracted position, and is kept waiting for the next pressing of the substrate 40 while being inflated. The type of the substrate 40 on which the cream solder is printed changes, and the width becomes smaller and is no longer used for pressing, or the substrate 40 is a substrate that does not require correction, printing by the screen printing machine is terminated, etc. When the pressing by the bag body 600 becomes unnecessary, the bag body 600 is opened to the atmosphere and squeezed. At this time, the pressure in the bag body 600 is detected by the pressure sensor 638, and the pressure in the bag body 600 is lowered to the atmospheric pressure and is surely deflated.

  The bag body constituting the substrate pressing member is not limited to rubber, and for example, the whole may be made of a cloth sheet, or may be one in which a cloth is applied to one opening in the axial direction of the cylindrical support portion. . The shape is determined when the substrate is expanded by pushing a gas such as air. In this case, since the pressure in a state where the bag body is inflated is determined in advance, when air is supplied to the bag body, the pressure of the bag body may be detected and air may be supplied until a predetermined pressure is obtained. The load does not have to be detected as in the case of a rubber bag body. Therefore, the bag body has only to be moved to the substrate pressing position and the retracted position, and the bag body elevating device is installed with a fluid pressure cylinder such as an air cylinder. It can be a drive source. In addition, since the bag body can be squeezed and folded away from the substrate when the air is extracted, the bag body is brought into contact with and separated from the substrate by supplying and discharging air to the bag body for each substrate. The lifting device can be omitted.

  The screen may be used for substrate correction. One embodiment will be described with reference to FIG. This screen printing machine is configured similarly to the screen printing machine of the embodiment shown in FIGS. 1 to 13 except for the substrate pressing device 52. Then, the substrate 40 is carried into the substrate holding device 48, and as shown in FIGS. 21A to 21F, the substrate 40 is temporarily clamped, and the clamp member 150 and the substrate 40 are brought into contact with the mating portion 144. 21 (g) to (j), the substrate 40 is finally clamped, and after the upper surfaces of the mating portion 144, the clamp member 150, and the substrate 40 are positioned in one plane, FIG. As shown in (k), the clamp is released. Thereby, although it is smaller than the case where it is not pinched | interposed by a pair of matching part 144 between the board | substrate 40 and the clamp surface 180, a clearance gap arises and correction | amendment of the curvature of the board | substrate 40 is accept | permitted. Then, the substrate holding device 48 is raised, and the substrate 40 is brought into contact with the screen 220 as shown in FIG. The screen 220 is elastic and absorbs an impact when contacting the substrate 40. As the substrate holding device 48 is raised, the screen 220 is caused to press the portion of the lower surface of the substrate 40 that is lifted from the virtual substrate support surface 120, and the warp is corrected. When the substrate 40 comes into contact with the virtual substrate support surface 120 and is further raised from the state in which the warpage is corrected, the rise is allowed by elastic deformation of the screen 220, and an excessive force is prevented from acting on the substrate 40. The After the substrate correction, as shown in FIG. 21 (m), the substrate 40 is clamped by the clamp member 150 and is lowered as shown in FIG. 21 (n) to be separated from the screen 220. Imaging is performed. In this screen printing machine, a portion that controls the clamp member driving device 182 and the substrate holding device lifting device 50 of the control device 26 and presses the substrate 40 onto the screen 220 constitutes a screen use pressing portion.

  When pressing the substrate 40 on the screen 220, the squeegee 252 is brought into contact with the center portion of the screen 220 and pressed to prevent the center portion of the screen 220 from being lifted and insufficiently pressing the substrate 40. Good. The squeegee 252 can also be elastically deformed to prevent the substrate 40 from being pressed by an excessive force.

  When correcting the warp by pressing the substrate with the substrate pressing member, the substrate pressing member can also be lifted after the contact portion of the substrate pressing member contacts the substrate and before the substrate contacts the substrate support surface. Can be corrected into a flat shape. For example, the air pressure in the upper air chamber of the air cylinder 366 of the substrate pressing device 52 of the embodiment shown in FIGS. 1 to 13 is raised until the lower surface of the substrate 40 contacts the virtual substrate support surface 120. Is made smaller than an unacceptable size. The initial value of the elastic drag force applied to the substrate pressing member 350 by the air cylinder 366 is made smaller than the reaction force of the substrate 40 before the lower surface of the substrate 40 contacts the virtual substrate support surface 120. The air chamber above the air cylinder 366 is cut off from the positive pressure source 386 and the atmosphere after the air pressure is controlled to the set pressure by the air control device 388. Therefore, when the substrate pressing member 350 is raised, the air pressure increases as the volume of the air chamber decreases, and the substrate 40 is pressed.

After the contact portion 355 comes into contact with the substrate 40, if the reaction force of the substrate 40 exceeds the initial value of the drag that the air cylinder 366 applies to the substrate pressing member 350, the substrate pressing member 350 starts to retract. Then, the substrate pressing force increases as the substrate 40 rises, but as shown by the solid line in FIG. 22, the increasing gradient of the substrate pressing force with respect to the rising amount of the substrate 40 (substrate support device 80) causes warping of the substrate 40. This is smaller than when the substrate pressing member 350 is not allowed to rise until it is corrected (indicated by a two-dot chain line in FIG. 22). As the substrate support device 80 rises after the substrate 40 and the contact portion 355 are brought into contact with each other, the air cylinder 366 allows the substrate pressing member 350 to be retracted. The approach speed of the substrate 40 to the virtual substrate support surface 120 becomes smaller than the approach speed, and the warpage is corrected slowly. Therefore, after the lower surface of the substrate 40 comes into contact with the virtual substrate support surface 120, the substrate pressing force increases with a larger gradient than that during substrate correction. As described above, in the aspect in which the holding speed of the substrate 40 by the substrate pressing member 350 is controlled to be small by setting the air pressure, the substrate holding member 350 and the air cylinder 366 that constitutes the cushion action imparting unit are combined with the substrate holding device lifting device 50. Thus, an approach control unit and a press control unit are configured.
6. The apparatus for fixing a substrate according to claim 5, wherein the air pressure of the air cylinder is set so that the substrate pressing member is raised before the substrate is brought into contact with the substrate support surface, and the substrate is corrected in this mode. This is an example.

The air pressure of the air chamber on the holding side of the air cylinder is controlled, and after the contact portion 355 contacts the substrate 40, the elastic drag that the air cylinder applies to the substrate pressing member is increased, and the retraction amount of the substrate pressing member 350 is increased. You may make it restrain small.
The air pressure in the air chamber below the air cylinder is also detected by a pressure sensor and controlled by an air pressure control device so that upward pressure is applied to the piston during substrate correction, and the piston, piston rod, and substrate holding member Weight may not be added to the substrate.
Even when the substrate pressing member is a rubber bag, it is possible to allow the substrate to rise before the substrate support surface comes into contact with the substrate by the air pressure setting, and to correct while raising the substrate. It is.

  The cushion action imparting portion is not limited to the air cylinder, and may be configured by a contact portion made of, for example, rubber or the like. By selecting the length (vertical dimension) of the cross-sectional area change portion of the contact portion and the hardness of the contact portion, a cushioning action is provided even when the lower surface of the substrate is further raised from the state in contact with the substrate support surface. Can be.

  When the substrate pressing member is a circular member in cross section, the air cylinder may be omitted.

  Whether or not the substrate 40 is corrected may be set by an operator. Also, the number of substrate pressing points may be set by the operator. In this case, the operator may set the substrate pressing location and the pressing location is set in advance, but the operator may select whether to press one location or multiple locations on the substrate 40. .

  Further, the correction of the substrate may be performed in a state where the substrate is clamped from both sides by a pair of clamp members.

Furthermore, the substrate support member is not limited to a pin, and may be a plate shape. For example, as described in Japanese Examined Patent Publication No. 2-13474, a plurality of suction holes are provided in the substrate support table, and a plurality of suction holes are formed in the substrate support table. The negative pressure chamber connected to the suction hole is connected to a suction device, and air is sucked from the suction hole. The substrate support surface is brought into contact with the substrate from below, and is adsorbed and held by a negative pressure. For example, if the substrate has no irregularities on the back surface and is flat and flat, it can be supported by a plate-like substrate support member.
The substrate support member may be a member that does not adsorb the substrate by the negative pressure and only supports it from below by the substrate support surface.

  The aligning device for pressing the edge of the substrate during substrate correction may be a substrate edge pressing device or a substrate lifting prevention device, and may be a device for pressing the edge of the substrate even during operations such as screen printing.

It is a front view which shows roughly the screen printing machine provided with the board | substrate fixing device which is one Example of claimable invention, Comprising: It is a figure which shows the part provided with the imaging device. It is a front view of the screen printing machine, and is a plan view showing a portion provided with a stop position defining device and a substrate transport device. It is a side view which shows the board | substrate holding | maintenance apparatus of the said screen printer, a board | substrate position adjustment apparatus, and a board | substrate holding | maintenance apparatus raising / lowering apparatus. It is front sectional drawing which shows a part of substrate support apparatus of the said board | substrate holding apparatus. It is a top view which shows the said board | substrate support apparatus. It is a top view which shows the imaging device moving apparatus of the said screen printer. It is a side view which shows the board | substrate holding | suppressing apparatus of the said board | substrate fixing apparatus. It is a bottom view which shows the board | substrate holding member of the said board | substrate holding | maintenance apparatus. It is a block diagram which shows notionally the control apparatus which controls the said screen printer. It is a flowchart which shows the board | substrate holding routine memorize | stored in ROM of the computer which comprises the main body of the said control apparatus. It is a figure explaining holding of a substrate with the above-mentioned substrate holding device. It is a figure explaining correction | amendment of the curvature of the said board | substrate. It is a graph which shows the relationship between the raise amount of a board | substrate at the time of the correction | amendment of the said board | substrate curvature, and the pressing force of the board | substrate by a board | substrate pressing member. It is a side view which shows the board | substrate holding | suppressing apparatus of the board | substrate fixing apparatus which is another Example. It is a graph which shows the relationship between the raise amount of a board | substrate at the time of correction | amendment of the curvature of a board | substrate by the holding | suppressing of the board | substrate pressing apparatus shown in FIG. It is side surface sectional drawing which shows the board | substrate holding member of the board | substrate fixing device which is another Example. It is a side view which shows the board | substrate holding | suppressing apparatus of the board | substrate fixing apparatus which is another Example. It is a top view which shows roughly the screen printer provided with the board | substrate fixing device which is another Example. It is a side view which shows the board | substrate holding | suppressing apparatus of the board | substrate fixing apparatus shown in FIG. It is a side view (partial cross section) which shows a load detection apparatus which detects a load when inflating the bag body of the board | substrate holding | suppressing apparatus shown in FIG. It is a figure explaining correction | amendment of the curvature of the board | substrate by the screen printer provided with the board | substrate fixing apparatus which is another Example. It is a graph which shows the relationship between the raise amount of a board | substrate at the time of the board | substrate correction by the holding | suppressing of the board | substrate pressing member of the board | substrate fixing apparatus which is another Example, and a board | substrate pressing force.

Explanation of symbols

  14: Substrate fixing device 24: Imaging device moving device 26: Control device 40: Circuit board 48: Substrate holding device 50: Substrate holding device lifting device 52: Substrate holding device 80: Substrate support device 84: Substrate support pin 96: Substrate support Surface 130: Side clamp device 350: Substrate pressing member 352: Cushion action imparting portion 354: Contact portion 366: Air cylinder 480: Substrate pressing member 482: Contact portion 500: Substrate pressing member 504: Ball joint 550: Roller 600: Made of rubber Bag body 602: Substrate pressing device

Claims (4)

One or more substrate support members having an upward substrate support surface that contacts at least three locations including at least two peripheral portions and one intermediate portion of the lower surface of the substrate and supports the substrate from the lower side. A substrate support device;
A substrate lifting device that lifts and lowers the substrate supported by the substrate support member by lifting and lowering the substrate support member;
The intermediate portion that is provided above the substrate support member with a contact portion and is brought into contact with the substrate raised by the substrate elevating device from above by the contact portion and is not in contact with the substrate support surface of the substrate. A substrate pressing member that presses one or more portions of the portion from above, closely attaches the one or more portions to the substrate support surface, and corrects the substrate into a flat shape;
A cushioning imparting portion that allows the contact portion to rise while giving an elastic drag against the rise of the contact portion of the substrate pressing member;
And the substrate lifting device presses the substrate supported by the substrate support member against the substrate pressing member to correct the substrate, and the substrate supported by the substrate support member, It also serves as a work substrate lifting device that moves up and down to a work position that is a work height at which work is performed on the substrate and a retreat position that is lower than the work position. An apparatus for fixing a substrate, comprising: an ascending speed reducing unit for lowering an ascending speed of the substrate support member when operating as a working lifting / lowering apparatus to be lower than a rising speed when operating as the working substrate lifting / lowering apparatus. The cushion action imparting portion is
A bracket for holding the substrate pressing member so as to be movable up and down;
A lowering limit defining device for defining a lowering limit of the substrate pressing member relative to the bracket;
A cushioning device that is provided between the bracket and the substrate pressing member and allows the substrate pressing member to rise relative to the bracket when an upward force is applied to the substrate pressing member. substrate fixing apparatus according to claim 1, characterized in that. further,
A substrate pressing member moving device for moving the substrate pressing member in a direction parallel to the substrate support surface;
By controlling the substrate lifting device, the substrate pressing member that holds one place of the intermediate portion is once separated from the substrate, and then brought closer to a place different from the one place to hold the other place. And holding part changing control for moving the board pressing member from a position corresponding to one position of the intermediate portion to a position corresponding to the other position between the separation and approach. The board | substrate fixing apparatus of Claim 1 or 2 characterized by the above-mentioned. One or more substrate support members having an upward substrate support surface that contacts at least three locations including at least two peripheral portions and one intermediate portion of the lower surface of the substrate and supports the substrate from the lower side. A substrate support device;
A substrate pressing member that presses one or more portions of the intermediate portion of the substrate placed on the substrate supporting member that are not in contact with the substrate supporting surface from above and closely contacts at least one portion with the substrate supporting surface. When,
A relative lifting device that lifts and lowers the substrate support member and the substrate pressing member in the vertical direction;
An approach control unit for controlling the relative lifting device to bring the substrate pressing member and the substrate supporting member closer until the substrate supported by the substrate supporting member and the substrate pressing member come in contact with or close to each other; ,
After the substrate pressing member comes into contact with the substrate, the substrate pressing member is moved toward the substrate supporting member at a speed smaller than the approaching speed of the substrate pressing member to the substrate under the control of the approach control unit. And a pressing control unit that presses the substrate until it contacts or substantially contacts the substrate supporting surface of the substrate supporting member.

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