CN116600481B - Method for manufacturing fine circuit of printed circuit board - Google Patents
Method for manufacturing fine circuit of printed circuit board Download PDFInfo
- Publication number
- CN116600481B CN116600481B CN202310885074.7A CN202310885074A CN116600481B CN 116600481 B CN116600481 B CN 116600481B CN 202310885074 A CN202310885074 A CN 202310885074A CN 116600481 B CN116600481 B CN 116600481B
- Authority
- CN
- China
- Prior art keywords
- substrate
- rotating
- groove
- laser
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000007246 mechanism Effects 0.000 claims abstract description 71
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 238000005530 etching Methods 0.000 claims abstract description 14
- 230000009471 action Effects 0.000 claims abstract description 10
- 238000009713 electroplating Methods 0.000 claims abstract description 7
- 238000007731 hot pressing Methods 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 230000008021 deposition Effects 0.000 claims abstract description 4
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 230000008719 thickening Effects 0.000 claims abstract description 3
- 230000008569 process Effects 0.000 claims description 16
- 230000001105 regulatory effect Effects 0.000 claims description 9
- 230000007306 turnover Effects 0.000 claims description 7
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 238000012545 processing Methods 0.000 abstract description 13
- 238000010586 diagram Methods 0.000 description 4
- 238000000608 laser ablation Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a method for manufacturing a fine circuit of a printed circuit board, which relates to the technical field of printed circuit board processing and comprises the following steps: s1, performing pretreatment: cutting, drilling and copper deposition are carried out on the substrate; s2, whole plate electroplating: thickening a copper layer; s3, sticking a dry film: sticking a dry film on the copper layer in a hot pressing mode; s4, laser removal: placing a substrate in a placing groove of a bearing mechanism, and removing a part of dry film area of the substrate by using laser equipment and exposing a copper layer of the area; after one laser removal, the two clamping mechanisms clamp the substrate; the bearing mechanism is separated from the substrate, and the two clamping mechanisms and the substrate rotate 180 degrees under the action of the rotating mechanism; the bearing mechanism holds the substrate again, and after the clamping mechanism loosens the substrate, the laser equipment is used for carrying out secondary laser removal on the substrate; s5, etching: etching the exposed copper layer to obtain the circuit. The scheme utilizes laser to remove unnecessary dry films, and effectively improves the processing precision of the circuit.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a method for manufacturing fine circuits of a printed circuit board.
Background
In the process of manufacturing a printed circuit board, the manufacture of a circuit is a very core process. The main processing procedure of the current circuit is as follows: and (3) sticking a dry film on the surface of the copper-clad plate on which the circuit is required to be manufactured, exposing the dry film by using an exposure machine to enable a part of the dry film area to be cured by using visible light, removing the uncured dry film area by using a developing solution to expose the copper surface of the area, and finally etching the exposed copper surface by using an etching solution to form the circuit on the residual copper surface. In the processing process, the developing solution uses weak alkaline sodium carbonate or potassium carbonate solution to remove the uncured dry film, and the developing solution can corrode the dry film in the vertical direction and simultaneously has a corrosion effect on the side surface of the dry film, so that the side surface corrosion can degrade the bonding force between the dry film and the copper surface to influence the subsequent etching process, and on the other hand, the width and the design value of the developed dry film have great errors; in addition, the alkalinity of the developing solution is reduced after the dry film is corroded, the reaction rate is reduced, the developing solution is required to be continuously updated to maintain constant developing speed, and the developing solution exchange rates are different in the areas with dense lines and sparse lines, so that the developing rates are different, and the processing precision control of the whole circuit is further affected.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides the method for manufacturing the fine circuit of the printed circuit board, which eliminates the dry film corrosion of the developing solution, removes the unnecessary dry film by utilizing laser, and effectively improves the circuit processing precision.
In order to achieve the object of the invention, the following scheme is adopted:
a method for manufacturing fine circuit of a printed circuit board comprises the following steps:
s1, performing pretreatment: sequentially carrying out the processes of cutting, drilling and copper deposition on the substrate to obtain a copper-clad substrate;
s2, whole plate electroplating: thickening the copper layer to a required thickness by electroplating;
s3, sticking a dry film: a dry film is stuck on the copper layer in a hot pressing mode;
s4, laser removal: placing the substrate on the top of a turnover device, and removing part of the dry film region and exposing the copper layer of the region by using laser equipment; wherein turning device includes U type box, bears mechanism, two fixture, slewing mechanism, bears the mechanism and locates U type box top, bears the mechanism top and is equipped with the standing groove for place the base plate, two fixture symmetry are located U type box both sides wall for the base plate in the centre gripping standing groove, and slewing mechanism connects fixture for make fixture rotate 180, laser equipment locates turning device top, and laser removes concrete method includes:
placing a substrate in a placing groove of a bearing mechanism, and removing a part of dry film area of the substrate by using laser equipment and exposing a copper layer of the area; after one laser removal is completed, the two clamping mechanisms clamp the two sides of the substrate respectively; the bearing mechanism is separated from the substrate, and the two clamping mechanisms and the substrate simultaneously rotate 180 degrees towards one direction under the action of the rotating mechanism; the bearing mechanism holds the substrate again, and the clamping mechanism releases the substrate; performing secondary laser removal on the substrate by using laser equipment;
s5, etching: and etching the exposed copper layer by using etching liquid to obtain the circuit.
Further, be equipped with two backup pads between the U type box both sides wall, one side that two backup pads are relative is equipped with dodges the groove, bearing mechanism includes four trays and four first flexible subassemblies, four first flexible subassemblies symmetric distribution is around the U type box, a tray is connected to every first flexible subassembly expansion end, the backup pad is hugged closely to the tray bottom surface, the tray is equipped with the recess towards one corner of U type box central direction, the region that four recesses enclose forms the standing groove, the method of placing the base plate in the standing groove in step S4 is:
the first telescopic component stretches to enable the tray to move into the area of the avoidance groove, and the size of the placement groove is guaranteed to be matched with the substrate; then the substrate is placed in the placing groove, and the downward projection of the substrate is positioned in the area surrounded by the two avoidance grooves.
Further, the fixture is located between two backup pads, and every fixture includes regulation and control pole and two splint, and regulation and control pole one end is connected in U type box lateral wall through the bearing, and two splint are connected to the other end for two regulation and control splint open and shut from top to bottom, and when two splint are in open condition, splint are located two and dodge outside the region that the groove encloses, and the method of clamping the base plate of fixture in step S4 is:
after one laser removal is completed, the two clamping plates are closed by the adjusting and controlling rod, and the clamping plates clamp the substrate.
Further, the rotating mechanism comprises a driving component, a rotating rod, two first rotating wheels, two second rotating wheels and two belts, the outer end of the clamping mechanism is connected with the corresponding first rotating wheels, the two ends of the rotating rod penetrate through the side wall of the U-shaped box body and then are connected with the corresponding second rotating wheels, the first rotating wheels and the second rotating wheels on the same side are connected through the belts, the driving component is used for driving the rotating rod, and the method for rotating the clamping mechanism by 180 degrees in the step S4 is as follows:
the driving assembly drives the rotating rod to enable the second rotating wheel to rotate 180 degrees, and the first rotating wheel and the clamping mechanism rotate along with the second rotating wheel under the action of the belt.
Further, the rotating mechanism further comprises two tightness adjusting parts which are symmetrical to two side walls of the U-shaped box body, the tightness adjusting parts comprise a third rotating wheel, a screw rod and a knob, the side walls of the U-shaped box body are provided with a through groove and a T-shaped groove, the T-shaped groove is horizontally arranged, the screw rod is rotationally arranged in the T-shaped groove, one end of the screw rod penetrates through the end part of the T-shaped groove and then is connected with the knob, the knob is located in the through groove, the screw rod is in threaded connection with a T-shaped block, the third rotating wheel is rotationally connected to the T-shaped block, and the third rotating wheel is used for adjusting tightness of a belt, and the method is as follows: the turning knob drives the T-shaped block and the third turning wheel to move towards the direction of the belt.
Further, be equipped with the base in the U type box, drive assembly includes rack, gear, the flexible subassembly of second, and the rack slides and locates the base top, and gear fixed cover is located on the dwang, and rack, gear engagement, the flexible subassembly of second are located base one side, and rack one side is connected to the flexible subassembly expansion end of second, and the method of drive assembly drive dwang in step S4 is:
the second telescopic component stretches or contracts to enable the rack to slide along the base; under the meshing action of the racks and the gears, the gears and the rotating rods rotate 180 degrees.
The invention has the beneficial effects that:
1. the whole circuit processing process does not need developing solution, so that development waste liquid is avoided, and the processing process is more environment-friendly; the dry film laser ablation process time is short, the side attack of the laser to the dry film is small, the circuit processing precision can be effectively improved, and the circuit tolerance is better controlled.
2. The double-sided laser removal of the substrate is realized through the cooperation of the laser equipment and the turnover device, the turnover device is simple and convenient to use, and the process is as follows: placing a substrate in a placing groove of a bearing mechanism, and removing a part of dry film area of the substrate by using laser equipment and exposing a copper layer of the area; after one laser removal is completed, the two clamping mechanisms clamp the two sides of the substrate respectively; the bearing mechanism is separated from the substrate, and the two clamping mechanisms and the substrate simultaneously rotate 180 degrees towards one direction under the action of the rotating mechanism; the bearing mechanism holds the substrate again, and the clamping mechanism releases the substrate; and performing secondary laser removal on the substrate by using a laser device.
3. Because the belt can be loosened after long-time use, the belt tension adjusting device is provided with the tension adjusting piece for adjusting the tension of the belt, and the third rotating wheel can be driven to move towards the direction of the belt by rotating the knob, so that the third rotating wheel plays a role in tensioning the belt.
Drawings
FIG. 1 is a flow chart of a fine line manufacturing method according to an embodiment;
FIG. 2 is a schematic diagram of a substrate according to an embodiment;
FIG. 3 is a schematic view of a electroplated substrate according to an embodiment;
FIG. 4 is a schematic diagram of a substrate after dry film lamination according to an embodiment;
FIG. 5 is a schematic view of a substrate after laser ablation according to an embodiment;
FIG. 6 is a schematic diagram of an etched substrate according to an embodiment;
FIG. 7 is a block diagram of a flipping device according to an embodiment;
FIG. 8 is an enlarged view of a portion of FIG. 7 at A;
FIG. 9 is an enlarged view of a portion of FIG. 7 at B;
FIG. 10 is a top view of an embodiment of a flipping unit;
reference numerals: the novel multifunctional automatic lifting device comprises a U-shaped box body-4, a supporting plate-41, an avoidance groove-411, a through groove-42, a T-shaped groove-43, a base-44, a tray-11, a placing groove-111, a first telescopic component-12, a regulating rod-21, a clamping plate-22, a rack-311, a gear-312, a second telescopic component-313, a rotating rod-32, a first rotating wheel-331, a second rotating wheel-332, a belt-34, a third rotating wheel-35, a screw-36 and a knob-37.
Detailed Description
Example 1
As shown in fig. 7, the present embodiment provides a turnover device for turning a substrate 180 °, where the turnover device includes a U-shaped box 4, a carrying mechanism, two clamping mechanisms, and a rotating mechanism.
The bearing mechanism is arranged at the top of the U-shaped box body 4, as shown in fig. 10, and the top of the bearing mechanism is provided with a placing groove 111 for placing a substrate, and the specific implementation manner is as follows: two support plates 41 are arranged between two side walls of the U-shaped box body 4, a space is reserved between the two support plates 41, an avoidance slot 411 is arranged on one side of the two support plates 41 opposite to each other, and the area of an area surrounded by the two avoidance slots 411 is larger than the horizontal section of the base plate; the bearing mechanism comprises four trays 11 and four first telescopic components 12, the first telescopic components 12 can be cylinders, oil cylinders or hydraulically driven telescopic rods, the four first telescopic components 12 are symmetrically distributed around the U-shaped box body 4, the movable end of each first telescopic component 12 is connected with one tray 11, the bottom surface of each tray 11 is tightly attached to the supporting plate 41, the supporting plate 41 plays a role in supporting the tray 11, a groove is formed in one corner of each tray 11 facing the central direction of the U-shaped box body 4, and a placing groove 111 is formed in an area surrounded by the four grooves.
In use, the first telescopic assembly 12 is extended to move the tray 11 into the area of the avoidance slot 411, more specifically, to move the groove of the tray 11 into the area of the avoidance slot 411, and the position of the tray 11 after moving needs to ensure that the size of the placement slot 111 matches with the substrate; then, the substrate is placed in the placement groove 111 by using a manual or automatic transfer mechanism, and the downward projection of the substrate is located in an area surrounded by the two avoidance grooves 411, so that the substrate can be turned over in the later stage. In the above process, the automatic transfer mechanism is a conventional mechanism, for example, the automatic transfer mechanism comprises a sucker, a hydraulic lifting rod and a sliding rail, the bottom of the hydraulic lifting rod is connected with the sucker, the top of the hydraulic lifting rod is connected with the sliding rail, the sucker is used for adsorbing the substrate on the conveying table, and the sliding rail is used for transferring the substrate into the placing groove 111.
The two clamping mechanisms are symmetrically arranged on two side walls of the U-shaped box body 4 and used for clamping the substrate in the placing groove 111, and the specific implementation mode is as follows: the clamping mechanisms are located between the two supporting plates 41, each clamping mechanism comprises a regulating rod 21 and two clamping plates 22, one end of the regulating rod 21 is connected to the side wall of the U-shaped box body 4 through a bearing, the other end of the regulating rod 21 is connected with the two clamping plates 22, the regulating rod 21 is used for regulating the two clamping plates 22 to open and close up and down, note that in the embodiment, the two clamping plates 22 are hinged open and close clamps and are not split type clamps, when the two clamping plates 22 are in an open state, the clamping plates 22 are located outside an area surrounded by the two avoiding grooves 411 so as to prevent the substrate from being placed, turned or taken out; when the two clamping plates 22 are in the closed state, the substrate in the placing groove 111 can be clamped.
The rotating mechanism is connected with the clamping mechanism and used for enabling the clamping mechanism to rotate 180 degrees, and the specific implementation mode is as follows: the rotating mechanism comprises a driving component, a rotating rod 32, two first rotating wheels 331, two second rotating wheels 332 and two belts 34, the outer end of the regulating rod 21 is connected with the corresponding first rotating wheels 331, the two ends of the rotating rod 32 penetrate through the side wall of the U-shaped box body 4 and then are connected with the corresponding second rotating wheels 332, the second rotating wheels 332 on the same side are located below the first rotating wheels 331, the first rotating wheels 331 and the second rotating wheels 332 on the same side are located on the same vertical line, the first rotating wheels 331 and the second rotating wheels 332 on the same side are connected through the belts 34, as shown in fig. 9, the driving component comprises a rack 311, a gear 312 and a second telescopic component 313, a base 44 is arranged in the U-shaped box body 4 in a sliding mode, the rack 311 is arranged at the top of the base 44 in a sliding mode, the gear 312 is fixedly sleeved on the rotating rod 32, the rack 311 and the gear 312 are meshed, the second telescopic component 313 can be a telescopic rod driven by an air cylinder or hydraulic pressure, the second telescopic component 313 is arranged on one side of the base 44, and the second telescopic component 313 is connected with one side of the rack 311.
In use, the second retraction assembly 313 is extended or retracted to slide the rack 311 along the base 44; under the meshing action of the rack 311 and the gear 312, the gear 312 and the rotating rod 32 rotate 180 degrees, so that the second rotating wheel 332 and the first rotating wheel 331 synchronously rotate 180 degrees, and the clamping mechanism and the substrate thereon can be turned 180 degrees.
Because the belt 34 will loose after long-time use, preferably, the rotating mechanism of this embodiment further includes two elastic adjusting members symmetrical to two side walls of the U-shaped box 4, as shown in fig. 8, the elastic adjusting members include a third rotating wheel 35, a screw rod 36, and a knob 37, the side wall of the U-shaped box 4 is provided with a through groove 42 and a T-shaped groove 43, the T-shaped groove 43 is horizontally arranged, the screw rod 36 is rotationally arranged in the T-shaped groove 43, one end of the screw rod 36 penetrates through the end of the T-shaped groove 43 and then is connected with the knob 37, the knob 37 is located in the through groove 42, the through groove 42 is convenient for a worker to operate the knob 37 by hand, the screw rod 36 is in threaded connection with a T-shaped block, the T-shaped block is slidably matched with the T-shaped groove, the third rotating wheel 35 is rotationally connected with the T-shaped block, and the third rotating wheel 35 is used for adjusting the tightness of the belt 34, and the method is as follows: because the T-block is threadedly engaged with the screw 36 and the T-block is slidably engaged with the T-slot, turning the knob 37 causes the T-block and the third turning wheel 35 to move in the direction of the belt 34, the third turning wheel 35 acting to compress and tension the belt 34.
Example 2
As shown in fig. 1, the present embodiment provides a method for manufacturing fine circuit of a printed circuit board, which includes the following steps:
s1, performing pretreatment: sequentially carrying out the processes of cutting, drilling and copper deposition on the substrate of FIG. 2 to obtain a copper-clad substrate;
s2, whole plate electroplating: as shown in fig. 3, the copper layer is thickened to a desired thickness by electroplating, wherein the copper on the inner wall of the through hole is also thickened;
s3, sticking a dry film: as shown in fig. 4, the dry film is stuck on the copper layer by adopting a hot pressing mode, wherein the hot pressing temperature is between 100 and 120 ℃;
s4, laser removal: the laser device is arranged above the turnover device in embodiment 1, and is used for removing the unnecessary dry film on the substrate, and the laser energy can be adjusted in the laser ablation process to ensure that the unnecessary dry film is completely removed, and the specific method is as follows:
the first telescopic assembly 12 is extended to enable the tray 11 to move into the area of the avoidance slot 411; then the substrate is placed in the placement groove 111 by using a manual or automatic transfer mechanism; removing a part of the dry film region of the substrate by using laser equipment and exposing the copper layer of the region; after one laser removal is completed, the clamping plates 22 are closed by the regulating rods 21, and two groups of clamping plates 22 clamp two sides of the substrate respectively; the first telescopic component 12 shortens to reset the tray 11, so that the tray 11 is ensured to be completely separated from the substrate; the second telescopic assembly 313 is extended to enable the rack 311 to slide along the base 44, under the meshing action of the rack 311 and the gear 312, the gear 312 and the rotating rod 32 rotate 180 degrees, and then the second rotating wheel 332 and the first rotating wheel 331 synchronously rotate 180 degrees, so that the substrate is turned 180 degrees; the first telescopic component 12 stretches to enable the tray 11 to hold the substrate again, after the clamping plate 22 releases the substrate, the laser equipment is used for carrying out secondary laser removal on the newly turned surface of the substrate, and the obtained substrate is shown in fig. 5;
s5, etching: the exposed copper layer is etched away by an alkaline etching solution, and the circuit shown in fig. 6 is obtained, wherein the alkaline etching solution mainly comprises ammonium chloride, copper chloride, ammonia water and an oxidant.
In conclusion, developing solution is not needed in the whole circuit processing process, developing waste liquid is avoided, and the processing process is more environment-friendly; the dry film laser ablation process time is short, the side attack of the laser to the dry film is small, the circuit processing precision can be effectively improved, and the circuit tolerance is better controlled.
The above embodiments are merely for illustrating the technical ideas and features of the present invention, and are not meant to be exclusive or limiting. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention.
Claims (1)
1. The method for manufacturing the fine circuit of the printed circuit board is characterized by comprising the following steps of:
s1, performing pretreatment: sequentially carrying out the processes of cutting, drilling and copper deposition on the substrate to obtain a copper-clad substrate;
s2, whole plate electroplating: thickening the copper layer to a required thickness by electroplating;
s3, sticking a dry film: a dry film is stuck on the copper layer in a hot pressing mode;
s4, laser removal: placing the substrate on the top of a turnover device, and removing part of the dry film region and exposing the copper layer of the region by using laser equipment; wherein turning device includes U type box (4), bear mechanism, two fixture, slewing mechanism, bear the mechanism and locate U type box (4) top, bear the mechanism top and be equipped with standing groove (111) for place the base plate, U type box (4) both sides wall is located to two fixture symmetries, be used for the base plate in centre gripping standing groove (111), slewing mechanism connects fixture, be used for making fixture rotate 180, laser equipment locates turning device top, laser removal concrete method includes:
placing the substrate in a placing groove (111) of a bearing mechanism, and removing part of the dry film region of the substrate by using laser equipment and exposing a copper layer of the region; after one laser removal is completed, the two clamping mechanisms clamp the two sides of the substrate respectively; the bearing mechanism is separated from the substrate, and the two clamping mechanisms and the substrate simultaneously rotate 180 degrees towards one direction under the action of the rotating mechanism; the bearing mechanism holds the substrate again, and the clamping mechanism releases the substrate; performing secondary laser removal on the substrate by using laser equipment;
s5, etching: etching the exposed copper layer by using etching solution to obtain a circuit;
two supporting plates (41) are arranged between two side walls of the U-shaped box body (4), avoidance grooves (411) are formed in one side, opposite to the two supporting plates (41), of the bearing mechanism, the bearing mechanism comprises four trays (11) and four first telescopic assemblies (12), the four first telescopic assemblies (12) are symmetrically distributed around the U-shaped box body (4), the movable end of each telescopic assembly (12) is connected with one tray (11), the bottom surface of each tray (11) is tightly attached to the supporting plate (41), grooves are formed in one corner, facing the central direction of the U-shaped box body (4), of each tray (11), a placing groove (111) is formed in the area surrounded by the four grooves, and the method for placing the substrate in the placing groove (111) in the step S4 is as follows:
the telescopic component (12) stretches to enable the tray (11) to move into the area of the avoidance groove (411), and the size of the placement groove (111) is guaranteed to be matched with the base plate; then placing the substrate in the placing groove (111), wherein the downward projection of the substrate is positioned in the area surrounded by the two avoidance grooves (411);
the fixture is located between two backup pads (41), and every fixture includes regulation and control pole (21) and two splint (22), and regulation and control pole (21) one end is connected in U type box (4) lateral wall through the bearing, and two splint (22) are connected to the other end for regulate and control two splint (22) open and shut from top to bottom, when two splint (22) are in open condition, splint (22) are located two and dodge outside the region that slot (411) encloses, and the method of clamping the base plate of fixture in step S4 is:
after one laser removal is completed, two clamping plates (22) are closed by using a regulating rod (21), and the clamping plates (22) clamp the substrate;
the rotating mechanism comprises a driving component, a rotating rod (32), two first rotating wheels (331), two second rotating wheels (332) and two belts (34), the outer ends of the clamping mechanism are connected with the corresponding first rotating wheels (331), the two ends of the rotating rod (32) penetrate through the side wall of the U-shaped box body (4) and then are connected with the corresponding second rotating wheels (332), the first rotating wheels (331) and the second rotating wheels (332) on the same side are connected through the belts (34), the driving component is used for driving the rotating rod (32), and the clamping mechanism in the step S4 rotates 180 degrees:
the driving component drives the rotating rod (32) to enable the second rotating wheel (332) to rotate 180 degrees, and the first rotating wheel (331) and the clamping mechanism rotate along with the second rotating wheel (332) under the action of the belt (34);
the rotating mechanism further comprises two tightness adjusting parts which are symmetrical to two side walls of the U-shaped box body (4), the tightness adjusting parts comprise a third rotating wheel (35), a screw rod (36) and a knob (37), the side walls of the U-shaped box body (4) are provided with a through groove (42) and a T-shaped groove (43), the T-shaped groove (43) is horizontally arranged, the screw rod (36) is rotationally arranged in the T-shaped groove (43), one end of the screw rod (36) penetrates through the end part of the T-shaped groove (43) and then is connected with the knob (37), the knob (37) is located in the through groove (42), the screw rod (36) is in threaded connection with a T-shaped block, the third rotating wheel (35) is rotationally connected with the T-shaped block, and the third rotating wheel (35) is used for adjusting tightness of the belt (34), and the method is as follows: the turning knob (37) drives the T-shaped block and the third turning wheel (35) to move towards the belt (34);
the U-shaped box body (4) is internally provided with a base (44), the driving assembly comprises a rack (311), a gear (312) and a second telescopic assembly (313), the rack (311) is slidably arranged at the top of the base (44), the gear (312) is fixedly sleeved on the rotating rod (32), the rack (311) is meshed with the gear (312), the second telescopic assembly (313) is arranged at one side of the base (44), the movable end of the second telescopic assembly (313) is connected with one side of the rack (311), and the method for driving the rotating rod (32) by the driving assembly in the step S4 is as follows:
the second telescopic assembly (313) stretches or contracts to enable the rack (311) to slide along the base (44); under the meshing action of the rack (311) and the gear (312), the gear (312) and the rotating rod (32) rotate 180 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310885074.7A CN116600481B (en) | 2023-07-19 | 2023-07-19 | Method for manufacturing fine circuit of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310885074.7A CN116600481B (en) | 2023-07-19 | 2023-07-19 | Method for manufacturing fine circuit of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116600481A CN116600481A (en) | 2023-08-15 |
| CN116600481B true CN116600481B (en) | 2023-09-19 |
Family
ID=87606698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310885074.7A Active CN116600481B (en) | 2023-07-19 | 2023-07-19 | Method for manufacturing fine circuit of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116600481B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117082746B (en) * | 2023-10-12 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Processing method of half-etched copper characters |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004224208A (en) * | 2003-01-23 | 2004-08-12 | Nsk Ltd | Steering column device |
| JP2007245593A (en) * | 2006-03-16 | 2007-09-27 | Fuji Mach Mfg Co Ltd | Board fixing device |
| KR20120027674A (en) * | 2010-09-13 | 2012-03-22 | 삼성전기주식회사 | Method for forming via hole in printed circuit board |
| GB201522012D0 (en) * | 2015-12-02 | 2016-01-27 | Trw Steering Systems Poland Sp Z O O | Clamp mechanism for a rake adjustable steering column assembly |
| CN108697002A (en) * | 2018-04-24 | 2018-10-23 | 深圳市斯普莱特激光科技有限公司 | A kind of laser processing formula high-precision circuit board manufacture craft |
| WO2019105025A1 (en) * | 2017-11-30 | 2019-06-06 | 江苏华源节水股份有限公司 | Telescopic jacking stepping reel-back-type reel sprinkler |
| CN110280092A (en) * | 2019-06-28 | 2019-09-27 | 深圳市永盛旺机械设备有限公司 | A kind of exhaust gas automatic processing equipment suitable for spray booth |
| CN210328161U (en) * | 2019-06-01 | 2020-04-14 | 广州京写电路板有限公司 | Automatic double-sided printing machine for PCB (printed circuit board) substrate |
| CN111717675A (en) * | 2020-06-22 | 2020-09-29 | 阳程（佛山）科技有限公司 | Receive material range upon range of device and flexible circuit board towards type equipment |
| CN212860458U (en) * | 2020-07-20 | 2021-04-02 | 昆山长益模型科技有限公司 | 3D prints and uses balance adjustment device |
| CN112788857A (en) * | 2021-02-02 | 2021-05-11 | 深圳明阳电路科技股份有限公司 | Circuit board fine circuit processing method |
| CN214800077U (en) * | 2021-03-17 | 2021-11-19 | 深圳市银海电子有限公司 | Step block keeps away piece smt laser template |
| CN113715467A (en) * | 2021-09-10 | 2021-11-30 | 杭州威雷登科技有限公司 | Batch pressing device for circuit boards |
| CN215529444U (en) * | 2021-08-18 | 2022-01-14 | 江苏兴之盛电路科技有限公司 | Circuit board silk screen printing device |
| WO2022088642A1 (en) * | 2020-10-30 | 2022-05-05 | 广东邦普循环科技有限公司 | Automatic production line for power battery echelon utilization |
| CN115739549A (en) * | 2022-12-09 | 2023-03-07 | 新沂市宏展电子科技有限公司 | Overturning machine with mobile phone data line interface double-sided dispensing structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11383862B2 (en) * | 2019-11-01 | 2022-07-12 | Binzhou University | Automatic packing machine for express delivery and automatic packing method for express delivery |
| US20230096301A1 (en) * | 2021-09-29 | 2023-03-30 | Catlam, Llc. | Circuit Board Traces in Channels using Electroless and Electroplated Depositions |
-
2023
- 2023-07-19 CN CN202310885074.7A patent/CN116600481B/en active Active
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004224208A (en) * | 2003-01-23 | 2004-08-12 | Nsk Ltd | Steering column device |
| JP2007245593A (en) * | 2006-03-16 | 2007-09-27 | Fuji Mach Mfg Co Ltd | Board fixing device |
| KR20120027674A (en) * | 2010-09-13 | 2012-03-22 | 삼성전기주식회사 | Method for forming via hole in printed circuit board |
| GB201522012D0 (en) * | 2015-12-02 | 2016-01-27 | Trw Steering Systems Poland Sp Z O O | Clamp mechanism for a rake adjustable steering column assembly |
| WO2019105025A1 (en) * | 2017-11-30 | 2019-06-06 | 江苏华源节水股份有限公司 | Telescopic jacking stepping reel-back-type reel sprinkler |
| CN108697002A (en) * | 2018-04-24 | 2018-10-23 | 深圳市斯普莱特激光科技有限公司 | A kind of laser processing formula high-precision circuit board manufacture craft |
| CN210328161U (en) * | 2019-06-01 | 2020-04-14 | 广州京写电路板有限公司 | Automatic double-sided printing machine for PCB (printed circuit board) substrate |
| CN110280092A (en) * | 2019-06-28 | 2019-09-27 | 深圳市永盛旺机械设备有限公司 | A kind of exhaust gas automatic processing equipment suitable for spray booth |
| CN111717675A (en) * | 2020-06-22 | 2020-09-29 | 阳程（佛山）科技有限公司 | Receive material range upon range of device and flexible circuit board towards type equipment |
| CN212860458U (en) * | 2020-07-20 | 2021-04-02 | 昆山长益模型科技有限公司 | 3D prints and uses balance adjustment device |
| WO2022088642A1 (en) * | 2020-10-30 | 2022-05-05 | 广东邦普循环科技有限公司 | Automatic production line for power battery echelon utilization |
| CN112788857A (en) * | 2021-02-02 | 2021-05-11 | 深圳明阳电路科技股份有限公司 | Circuit board fine circuit processing method |
| CN214800077U (en) * | 2021-03-17 | 2021-11-19 | 深圳市银海电子有限公司 | Step block keeps away piece smt laser template |
| CN215529444U (en) * | 2021-08-18 | 2022-01-14 | 江苏兴之盛电路科技有限公司 | Circuit board silk screen printing device |
| CN113715467A (en) * | 2021-09-10 | 2021-11-30 | 杭州威雷登科技有限公司 | Batch pressing device for circuit boards |
| CN115739549A (en) * | 2022-12-09 | 2023-03-07 | 新沂市宏展电子科技有限公司 | Overturning machine with mobile phone data line interface double-sided dispensing structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116600481A (en) | 2023-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN116600481B (en) | Method for manufacturing fine circuit of printed circuit board | |
| CN101594743B (en) | Method for manufacturing outer graphics of electronic circuit board by encapsulation method | |
| EP1612850A4 (en) | Exposure apparatus and method for manufacturing device | |
| HK1152391A1 (en) | Exposure apparatus and device manufacturing method | |
| JPS63296388A (en) | Apparatus and method for temporarily sealing hole in printed circuit board | |
| CN103796437A (en) | Method for manufacturing negative and positive copper foil circuit board | |
| CN111200912B (en) | Precision-improved fine line manufacturing method | |
| TW200641556A (en) | A new immersion lithography apparatus and method | |
| CN104080275A (en) | Method for manufacturing stepped circuit board | |
| CN116944709B (en) | Base material laser drilling device and method | |
| CN114980566B (en) | Manufacturing method of ladder circuit | |
| CN212392257U (en) | Etching clamp for solar cell | |
| CN113267965A (en) | Exposure platform | |
| CN210759735U (en) | A border formula intaglio bat printing device for glass apron printing | |
| CN104023480A (en) | Processing method for shortening PCB plating process | |
| CN103207515A (en) | A three-dimensional mask plate and a production process thereof | |
| CN114063396A (en) | High-efficiency laser direct-writing line exposure method | |
| CN117082746B (en) | Processing method of half-etched copper characters | |
| CN218273081U (en) | Single-side digital photoetching machine | |
| SE459708B (en) | PROCEDURE FOR MANUFACTURING PRINTED CIRCUITS AND APPLIANCES | |
| CN206805038U (en) | Device for forming photoresist film of liquid crystal display | |
| CN218477121U (en) | A manual tool for pad pasting board | |
| CN220743471U (en) | Film pasting equipment | |
| CN212083891U (en) | Improved weighing sensor photoetching equipment | |
| KR101889967B1 (en) | Carrier flip device and mask manufacturing system having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |