CN218273081U

CN218273081U - Single-side digital photoetching machine

Info

Publication number: CN218273081U
Application number: CN202220249920.7U
Authority: CN
Inventors: 陈志特; 王�华; 甘泉; 龚海峰
Original assignee: Guangdong Keshi Optical Technology Co ltd
Current assignee: Guangdong Keshi Optical Technology Co ltd
Priority date: 2022-02-07
Filing date: 2022-02-07
Publication date: 2023-01-10
Anticipated expiration: 2032-02-07

Abstract

The utility model provides a single-side digital photoetching machine, which comprises a first platform, a second platform, a photoetching main body and a transmission component; the photoetching main body is positioned between the first platform and the second platform, and the transmission assembly bears the first platform and the second platform; the first platform and the second platform are used for bearing a circuit board to be photoetched, the circuit board to be photoetched comprises a surface to be photoetched, and the transmission assembly is used for driving the first platform or the second platform to move towards the direction close to the photoetching main body so as to realize that the photoetching main body alternately carries out digital photoetching treatment on the surface to be photoetched of the circuit board to be photoetched on the first platform and the second platform. The utility model provides a single face digital photoetching machine, the photoetching main part can be to treating on two platforms the photoetching circuit board and carry out digital photoetching in turn and handle, has improved photoetching efficiency.

Description

Single-side digital photoetching machine

[ technical field ] A method for producing a semiconductor device

The utility model relates to a digital photoetching technical field especially relates to a single face digital photoetching machine of PCB board.

[ background of the invention ]

Photolithography refers to a technique of transferring a pattern on a reticle onto a substrate by means of a photoresist (also called a photoresist) under the influence of light. The main process is generally as follows: firstly, ultraviolet light irradiates the surface of a substrate attached with a layer of photoresist film through a mask plate to cause the photoresist in an exposure area to generate chemical reaction, then the photoresist in the exposure area or an unexposed area (the former is called positive photoresist and the latter is called negative photoresist) is dissolved and removed through a developing technology, so that a pattern on the mask plate is copied to the photoresist film, and finally the pattern is transferred to the substrate by utilizing an etching technology. In integrated circuit fabrication, photolithographic techniques are used to transfer circuit patterns onto a monocrystalline surface or dielectric layer to form a wiring board with active pattern windows or functional patterns.

When a photoetching device performs photoetching on a circuit board, generally, feeding is performed on one side of the photoetching device, and after the photoetching of the previous circuit board is completed, feeding of the next circuit board is required to be waited for so as to perform photoetching on the next circuit board. The existing photoetching device has a single structure, the time for carrying out circuit board feeding, photoetching and circuit board blanking cannot be used in an overlapping way, and the photoetching efficiency is low.

In view of the above, it is desirable to provide a novel single-sided digital lithography machine to overcome the above-mentioned drawbacks.

[ Utility model ] A method for manufacturing a semiconductor device

The utility model aims at providing a single face digital photoetching machine, the photoetching main part can be to treating on two platforms the photoetching circuit board and carry out digital photoetching in turn and handle, has improved photoetching efficiency.

In order to achieve the above object, the present invention provides a single-sided digital lithography machine, which comprises a first platform, a second platform, a lithography main body and a transmission assembly; the photoetching main body is positioned between the first platform and the second platform, and the transmission assembly bears the first platform and the second platform; the first platform and the second platform are used for bearing a circuit board to be subjected to photoetching, the circuit board to be subjected to photoetching comprises a surface to be subjected to photoetching, the transmission assembly is used for driving the first platform or the second platform to move towards the direction close to the photoetching main body, and therefore the photoetching main body can alternately perform digital photoetching on the surfaces to be subjected to photoetching of the circuit board to be subjected to photoetching on the first platform and the second platform.

In a preferred embodiment, the first platform and the second platform are provided with an adsorbing member on their surfaces, and the adsorbing member is used for adsorbing the surface of the circuit board to be subjected to lithography, which is opposite to the surface to be subjected to lithography.

In a preferred embodiment, the first platform and the second platform are provided with a pressure plate assembly, and the pressure plate assembly is used for flattening the edge of the circuit board to be photoetched.

In a preferred embodiment, the platen assembly includes an edge platen member disposed at an edge location of the first and second platforms.

In a preferred embodiment, the platen assembly further comprises an intermediate platen member disposed at a central location of the first and second platforms.

In a preferred embodiment, the lithography main body includes an exposure lens barrel and an exposure light source, the exposure lens barrel is connected to the exposure light source, and the exposure light source is used for providing exposure light for digital lithography processing.

In a preferred embodiment, a liquid cooling duct assembly is connected to the exposure light source.

In a preferred embodiment, the lithographic apparatus further comprises a support table for carrying the first stage, the second stage, the lithographic body and the drive assembly.

Compared with the prior art, the utility model provides a single face digital lithography machine, first platform reaches the second platform is located the both sides of photoetching main part respectively, first platform reaches the second platform all is used for bearing the weight of waiting to photoetch the circuit board, drive assembly can drive first platform or the second platform is to being close to the direction of photoetching main part removes, in order to realize the photoetching main part is right first platform reaches the photoetching surface of waiting to photoetch the circuit board on the second platform carries out digital photoetching in turn and handles, has realized carrying out the in-term that digital photoetching was handled at one of them platform, and another platform carries out the material loading simultaneously, has saved the time on the whole, and the photoetching main part is to waiting to photoetch the circuit board on two platforms and is carried out digital photoetching in turn and handle, has improved photoetching efficiency.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a three-dimensional structure diagram of a single-sided digital lithography machine according to the present invention.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, the present invention provides a single-side digital lithography machine 100, which includes a first stage 10, a second stage 20, a lithography body 30 and a transmission assembly 40.

The lithography body 30 is located between the first stage 10 and the second stage 20, and the driving assembly 40 carries the first stage 10 and the second stage 20. Specifically, the first platform 10 and the second platform 20 are both used for bearing a circuit board to be subjected to photolithography (not shown), the circuit board to be subjected to photolithography includes a surface to be subjected to photolithography, the transmission assembly 40 is used for driving the first platform 10 or the second platform 20 to move in a direction close to the photolithography main body 30, and specifically, the surface to be subjected to photolithography of the circuit board to be subjected to photolithography faces the exposure lens barrel 31 in the photolithography main body 30, so that the photolithography main body 30 alternately performs digital photolithography on the surfaces to be subjected to photolithography of the circuit boards to be subjected to photolithography on the first platform 10 and the second platform 20.

It can be understood that the first platform 10 and the second platform 20 are respectively located at two sides of the lithography main body 30, and the first platform 10 and the second platform 20 are both used for bearing a circuit board to be lithographed, when in actual application, the transmission assembly 40 can drive the first platform 10 and the circuit board to be lithographed thereon to move towards the direction close to the lithography main body 30, so that the lithography main body 30 can perform digital lithography processing on the surface to be lithographed of the circuit board to be lithographed on the first platform 10, and in the process of performing digital lithography on the circuit board to be lithographed on the first platform 10, the transmission assembly 40 can drive the second platform 20 and the circuit board to be lithographed thereon to move towards the direction close to the lithography main body 30, after the digital lithography of the circuit board to be lithographically processed on the first platform 10 is completed, the lithography circuit board subjected to the digital lithography processing on the first platform 10 is discharged, and the second platform 20 and the circuit board to be lithographically processed on the second platform 20 are moved to the lower part of the lithography main body 30, so that the lithography main body 30 performs the digital lithography processing on the surface to be lithographically processed of the circuit board to be lithographically processed on the second platform 20, and thus, the digital lithography processing is alternately performed on the surfaces to be lithographically processed of the circuit boards to be lithographically processed on the first platform 10 and the second platform 20, and the single-side lithography of the circuit boards to be lithographically processed on the two platforms is completed. That is, when the circuit board to be photoetched on the first platform 10 is subjected to digital photoetching, the circuit board to be photoetched on the second platform 20 is loaded, and when the circuit board to be photoetched on the second platform 20 is subjected to digital photoetching, the circuit board to be photoetched on the first platform 10 is loaded, so that the circuit board to be photoetched on one platform is simultaneously loaded during the digital photoetching on the other platform, the time is saved on the whole, the photoetching main body 30 alternately performs digital photoetching on the circuit boards to be photoetched on the two platforms, and the photoetching efficiency is improved.

Therefore, the utility model provides a single face digital lithography machine 100, first platform 10 reaches second platform 20 is located the both sides of photoetching main part 30 respectively, first platform 10 reaches second platform 20 all is used for bearing the circuit board of waiting to be photoetched, drive assembly 40 can drive first platform 10 or second platform 20 is to being close to the direction removal of photoetching main part 30, in order to realize photoetching main part 30 is to the surface of waiting to be photoetched of the circuit board of waiting to be photoetched on first platform 10 and the second platform 20 carries out digital photoetching in turn and handles, has realized that in the period that one of them platform carries out digital photoetching and handles, and another platform carries out the material loading simultaneously, has saved the time on the whole, and photoetching main part 30 carries out digital photoetching to wait to be photoetched the circuit board on two platforms in turn and handles, has improved photoetching efficiency.

It is understood that the driving assembly 40 can also drive the first stage 10 or the second stage 20 to move away from the lithography body 30, so as to discharge the circuit board after performing the digital lithography process. Specifically, the driving assembly 40 may be, for example, a conveyor belt, and can drive the first platform 10 and the second platform 20 to move. It can be understood that, after the photolithography main body 30 performs digital photolithography processing on the circuit board to be subjected to photolithography on the first platform 10 or the second platform 20, the transmission assembly 40 drives the first platform 10 or the second platform 20 to move in a direction away from the photolithography main body 30, so as to discharge the circuit board to be subjected to digital photolithography processing, for example, the circuit board to be subjected to digital photolithography processing on the first platform 10 moves onto a first bus station, the circuit board to be subjected to digital photolithography processing on the second platform 10 moves onto a second bus station, and the circuit board to be subjected to photolithography processing on the first bus station and the second bus station can be conveyed and discharged through a conveying member.

In this embodiment, the first platform 10 and the second platform 20 have a surface provided with an adsorbing member 120, and the adsorbing member 120 is used for adsorbing a surface of the circuit board to be subjected to photolithography, which is opposite to the surface to be subjected to photolithography. It can be understood that, when the circuit board to be subjected to lithography is conveyed onto the first platform 10 or the second platform 20, the surface of the circuit board to be subjected to lithography opposite to the surface to be subjected to lithography (i.e. the surface not subjected to lithography at this time) is fixed onto the first platform 10 or the second platform 20 through the adsorption member 120, and the adsorption member 120 can stably fix the circuit board to be subjected to lithography onto the first platform 10 or the second platform 20, so as to prevent the circuit board to be subjected to lithography from deviating in position on the first platform 10 or the second platform 20 and avoid affecting the lithography precision.

Further, the first platform 10 and the second platform 20 are provided with a pressing plate assembly 50, the pressing plate assembly 50 is used for pressing the edge of the circuit board to be photoetched, and the pressing plate assembly 50 can prevent the edge of the circuit board to be photoetched from tilting, improve the position accuracy of the circuit board to be photoetched, and further improve the photoetching accuracy.

In this embodiment, first platform 10 reaches second platform 20 homoenergetic simultaneously bears two circuit boards, then corresponds, clamp plate assembly 50 includes marginal clamp plate spare 51 and middle clamp plate spare 52, marginal clamp plate spare 51 set up in first platform 10 reaches the border position of second platform 20, marginal clamp plate spare 51 can flatten the position relative with the platform edge of two circuit boards, middle clamp plate spare 52 set up in first platform 10 reaches the middle part position of second platform 20, middle clamp plate spare 52 can flatten the position relative with the platform middle part of two circuit board concatenation departments.

The main body 30 includes an exposure lens barrel 31, the exposure lens barrel 31 is connected with an exposure light source 32, and the exposure light source 32 is used for providing exposure light for digital lithography processing. It can be understood that, after the light of the exposure light source 32 passes through the exposure lens barrel 31, the exposure processing of the circuit board to be photoetched can be realized. Specifically, the lithography main body 30 further includes an exposure head control unit 33, the exposure head control unit 33 is configured to control the exposure light source 32 to perform exposure, and the exposure light source 32 may be an LED light source or a laser light source.

Further, exposure light source 32 is connected with liquid cooling pipeline assembly 34, and liquid cooling pipeline assembly can include a plurality of liquid cooling pipes that distribute side by side, and the intussuseption of liquid cooling pipe has the coolant liquid, and the coolant liquid flows in the liquid cooling pipe, can take away exposure light source 32 the heat that exposure head the control unit 33 work produced prevents the high temperature.

In this embodiment, the target cameras 60 are further disposed on two sides of the lithography main body 30, the target cameras 60 are located above the first platform 10 and the second platform 20, and the target cameras 60 can photograph the circuit boards to be lithographed on the first platform 10 and the second platform 20 to obtain image information of the circuit boards to be lithographed, so that the lithography main body 30 can perform digital lithography processing on the circuit boards according to the image information. Specifically, the number of the target point cameras 60 is multiple, camera translation assemblies 61 are arranged on two sides of the lithography main body 30, the target point cameras 60 are fixed on the camera translation assemblies 61, and the camera translation assemblies 61 are used for driving the target point cameras 60 to translate so as to acquire image information of different positions of the circuit board to be lithographed. By arranging the target camera 60, the circuit board to be photoetched can be photographed before the circuit board to be photoetched is subjected to digital photoetching processing, so that the image information of the circuit board to be photoetched is obtained, the target positioning of the circuit board to be photoetched is realized, and the photoetching precision is improved.

The utility model provides a single face digital lithography machine 100 still includes a supporting bench 70, a supporting bench 70 is used for bearing first platform 10, second platform 20, photoetching main part 30 and drive assembly 40. The support table 70 may be a marble table to ensure structural stability of the device.

To sum up, the utility model provides a single face digital lithography machine 100, first platform 10 reaches second platform 20 is located the both sides of photoetching main part 30 respectively, first platform 10 reaches second platform 20 all is used for bearing the pending photoetching circuit board, drive assembly 40 can drive first platform 10 or second platform 20 is to being close to photoetching main part 30's direction removes, in order to realize photoetching main part 30 is right first platform 10 reaches the pending photoetching surface of pending photoetching circuit board on the second platform 20 carries out digital photoetching in turn and handles, has realized that in the period that one of them platform carries out digital photoetching and handles, another platform carries out the material loading simultaneously, has saved the time on the whole, and photoetching main part 30 carries out digital photoetching in turn to the pending photoetching circuit board on two platforms and handles, has improved photoetching efficiency.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A single-side digital photoetching machine is characterized by comprising a first platform, a second platform, a photoetching main body and a transmission assembly; the photoetching main body is positioned between the first platform and the second platform, and the transmission assembly bears the first platform and the second platform; the first platform and the second platform are used for bearing a circuit board to be subjected to photoetching, the circuit board to be subjected to photoetching comprises a surface to be subjected to photoetching, the transmission assembly is used for driving the first platform or the second platform to move towards the direction close to the photoetching main body, and therefore the photoetching main body can alternately perform digital photoetching on the surfaces to be subjected to photoetching of the circuit board to be subjected to photoetching on the first platform and the second platform.

2. The single-sided digital lithography machine according to claim 1, wherein the first stage and the second stage have surfaces provided with an adsorption member for adsorbing a surface of the circuit board to be lithographed opposite to the surface to be lithographed.

3. The single-sided digital lithography machine according to claim 1, wherein said first stage and said second stage are provided with a platen assembly for flattening an edge of said circuit board to be lithographed.

4. The single-sided digital lithography machine as recited in claim 3 wherein said platen assembly includes an edge platen member disposed at an edge location of said first stage and said second stage.

5. The single-sided digital lithography machine according to claim 4, wherein said platen assembly further comprises an intermediate platen member disposed intermediate said first stage and said second stage.

6. The single-sided digital lithography machine according to claim 1, wherein said lithography body includes an exposure barrel and an exposure light source, said exposure barrel being connected to said exposure light source, said exposure light source being adapted to provide exposure light for digital lithography processing.

7. The single-sided digital lithography machine as recited in claim 6 wherein said exposure light source is connected to a liquid cooled plumbing assembly.

8. The single-sided digital lithography machine as recited in claim 1, further comprising a support table for carrying said first stage, second stage, lithography body and drive assembly.