CN114803445A - Digital photoetching method of circuit board and digital photoetching system of circuit board using same - Google Patents
Digital photoetching method of circuit board and digital photoetching system of circuit board using same Download PDFInfo
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- CN114803445A CN114803445A CN202210285376.6A CN202210285376A CN114803445A CN 114803445 A CN114803445 A CN 114803445A CN 202210285376 A CN202210285376 A CN 202210285376A CN 114803445 A CN114803445 A CN 114803445A
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- 238000001259 photo etching Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000007599 discharging Methods 0.000 claims abstract description 66
- 230000005540 biological transmission Effects 0.000 claims abstract description 43
- 238000012546 transfer Methods 0.000 claims description 45
- 238000001459 lithography Methods 0.000 claims description 36
- 238000010009 beating Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000001816 cooling Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
- B65G47/68—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices adapted to receive articles arriving in one layer from one conveyor lane and to transfer them in individual layers to more than one conveyor lane or to one broader conveyor lane, or vice versa, e.g. combining the flows of articles conveyed by more than one conveyor
- B65G47/681—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices adapted to receive articles arriving in one layer from one conveyor lane and to transfer them in individual layers to more than one conveyor lane or to one broader conveyor lane, or vice versa, e.g. combining the flows of articles conveyed by more than one conveyor from distinct, separate conveyor lanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
- B65G47/68—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices adapted to receive articles arriving in one layer from one conveyor lane and to transfer them in individual layers to more than one conveyor lane or to one broader conveyor lane, or vice versa, e.g. combining the flows of articles conveyed by more than one conveyor
- B65G47/71—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices adapted to receive articles arriving in one layer from one conveyor lane and to transfer them in individual layers to more than one conveyor lane or to one broader conveyor lane, or vice versa, e.g. combining the flows of articles conveyed by more than one conveyor the articles being discharged or distributed to several distinct separate conveyors or to a broader conveyor lane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a digital photoetching method of a circuit board, wherein a digital photoetching system of the circuit board comprises a photoetching main body, a first transmission line and a second transmission line, the first transmission line comprises a first positioning station, a first platform and a first discharging station, the second transmission line comprises a second positioning station, a second platform and a second discharging station, and the digital photoetching method of the circuit board comprises the following steps: feeding a plurality of circuit boards, and alternately supplying the circuit boards A and the circuit boards B; secondly, the circuit board A enters a first transmission line; and step three, the circuit board B enters a second transmission line, and the second step and the third step are simultaneously carried out. According to the invention, the circuit board is shunted to the two transmission lines, and the photoetching main body alternately carries out digital photoetching treatment on the circuit boards on the two platforms, so that the photoetching efficiency is greatly improved, the time is saved, and the cost is saved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of photoetching of circuit boards, in particular to a digital photoetching method of a circuit board and a digital photoetching system of the circuit board using the same.
[ background of the invention ]
Photolithography refers to a technique of transferring a pattern on a reticle onto a substrate by means of a photoresist (also called a photoresist) under the influence of light. The main process is generally as follows: firstly, ultraviolet light irradiates the surface of a substrate attached with a layer of photoresist film through a mask plate to cause the photoresist in an exposure area to generate chemical reaction, then the photoresist in the exposure area or an unexposed area (the former is called positive photoresist and the latter is called negative photoresist) is dissolved and removed through a developing technology, so that a pattern on the mask plate is copied to the photoresist film, and finally the pattern is transferred to the substrate by utilizing an etching technology. In integrated circuit fabrication, photolithographic techniques are used to transfer circuit patterns onto a monocrystalline surface or dielectric layer to form an active pattern window or a functional pattern on a PCB wiring board.
When the photoetching device performs photoetching on a PCB (printed circuit board), feeding is generally performed on one side of the photoetching device, and after the photoetching of the previous PCB is completed, the next PCB needs to be waited for feeding so as to perform photoetching on the next PCB. The existing photoetching device has a single structure, the time for feeding and photoetching the PCB circuit board and the time for blanking the PCB circuit board cannot be utilized in an overlapping way, and the photoetching efficiency is low.
Therefore, there is a need to provide a new digital lithography method for circuit board and a digital lithography system for circuit board using the same to solve the above technical problems.
[ summary of the invention ]
The invention aims to provide a digital photoetching method of a circuit board with high photoetching efficiency and a digital photoetching system of the circuit board using the same, so as to solve the problems in the related art.
In order to achieve the above object, the present invention provides a digital lithography method for a circuit board, which is applied to a digital lithography system for a circuit board, the digital lithography system for a circuit board includes a lithography main body, a first transmission line and a second transmission line, the first transmission line includes a first positioning station, a first platform and a first discharging station, the second transmission line includes a second positioning station, a second platform and a second discharging station, the digital lithography method for a circuit board includes the following steps: feeding a plurality of circuit boards, and alternately supplying the circuit boards A and the circuit boards B; secondly, the circuit board A enters the first transmission line, and the method comprises the step of S1, wherein the circuit board A is moved to the first positioning station; s2, the first positioning station carries out clapper positioning on the circuit board A; s3, moving the circuit board A to the first platform; s4, the photoetching main body carries out digital photoetching processing on the circuit board A; s5, moving the circuit board A to the first discharging station; a third step, in which the board B enters the second transport line, which includes a step, T1, in which the board B moves to the second positioning station; t2, the second positioning station carries out clapper positioning on the circuit board B; t3, the circuit board B is moved to the second platform; t4, the photoetching body carries out photoetching treatment on the circuit board B; t5, moving the circuit board B to the first discharging station; the second step is performed partially simultaneously with the third step.
Preferably, in the first step, the circuit boards are fed through a first feeding line arranged adjacent to the first positioning station and a second feeding line arranged adjacent to the second positioning station, the circuit board a is supplied by the first feeding line, and the circuit board B is supplied by the second feeding line.
Preferably, the blanking device further comprises a fourth step, wherein the circuit board A and the circuit board B are blanked, in the fourth step, the circuit board A is blanked through a first blanking assembly line which is adjacent to the first discharging station, and the circuit board B is blanked through a second blanking assembly line which is adjacent to the second discharging station.
Preferably, the method further comprises a fourth step, and the circuit board A and the circuit board B respectively enter the next working procedure.
Preferably, the digital lithography system of the circuit board further comprises a shunting station, the shunting station is located between the first positioning station and the second positioning station, in the first step, the circuit boards are fed through a feeding assembly line which is adjacent to the shunting station, and the circuit boards A and the circuit boards B are alternately supplied by the shunting station.
Preferably, the digital lithography system of the circuit board further comprises a confluence station, the confluence station is located between the first discharging station and the second discharging station, and after the second step and the third step, the circuit boards A and B alternately enter the confluence station and then are discharged through a discharging production line arranged adjacent to the confluence station.
Preferably, the method further comprises a fourth step, and the circuit board A and the circuit board B respectively enter the next working procedure.
The invention also provides a digital photoetching system of the circuit board, which comprises a frame, a photoetching main body, a first platform, a second platform, a plate separating mechanism, a plate beating mechanism, a discharging mechanism and a converging mechanism, wherein the photoetching main body, the first platform, the second platform, the plate separating mechanism, the plate beating mechanism, the discharging mechanism and the converging mechanism are assembled on the frame, the plate separating mechanism is positioned at the shunting station, the plate beating mechanism comprises a first plate beating mechanism positioned at the first positioning station and a second plate beating mechanism positioned at the second positioning station, the discharging mechanism comprises a first discharging mechanism positioned at the first discharging station and a second discharging mechanism positioned at the second discharging station, and the converging mechanism is positioned at the converging station.
Preferably, the transfer mechanism further comprises a first transfer mechanism, a second transfer mechanism, a third transfer mechanism and a fourth transfer mechanism, the first transfer mechanism comprises a first slide rail assembly, a second slide rail assembly and a first manipulator, the first manipulator comprises a plurality of suckers, the first transfer mechanism is located above the first clapper mechanism and the first platform, the second transfer mechanism is located above the first platform and the first discharging mechanism, the third transfer mechanism is located above the second clapper mechanism and the second platform, and the fourth transfer mechanism is located above the second platform and the second discharging mechanism.
Preferably, the device further comprises a transmission assembly in transmission connection with the first platform and the second platform, and the transmission assembly comprises a sliding rail extending along the longitudinal direction.
The invention has the technical effects that: according to the invention, the circuit board is shunted to the first transmission line and the second transmission line, and the photoetching main body alternately carries out digital photoetching treatment on the circuit boards on the two platforms, so that the photoetching efficiency is greatly improved, the time is saved, and the cost is saved.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic structural diagram of a digital photolithography method for a circuit board according to the present invention;
FIG. 2 is a schematic diagram of the steps of a digital photolithography method for a circuit board according to the present invention;
FIG. 3 is a schematic structural view of embodiment 1 of a digital lithography method for a wiring board according to the present invention;
FIG. 4 is a schematic structural diagram of embodiment 2 of a digital lithography method for a wiring board according to the present invention;
FIG. 5 is a schematic structural view of embodiment 3 of a digital lithography method for a wiring board according to the present invention;
FIG. 6 is a schematic structural view of embodiment 4 of a digital lithography method for a wiring board according to the present invention;
FIG. 7 is a perspective assembly view of a digital lithography system for a circuit board of the present invention;
FIG. 8 is a top view of FIG. 7;
FIG. 9 is a front view of FIG. 7;
FIG. 10 is a perspective assembly view of the racking mechanism;
fig. 11 is a perspective assembly view of the first clapper mechanism;
FIG. 12 is a perspective view of the base plate of the first clapper mechanism shown in FIG. 11;
fig. 13 is a perspective assembly view of the first transfer mechanism of the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and fig. 2, the present invention provides a digital lithography method for a circuit board, which is applied to a digital lithography system for a circuit board, the digital lithography system for a circuit board includes a lithography main body, a first transmission line and a second transmission line, the first transmission line includes a first positioning station, a first platform and a first discharging station, the second transmission line includes a second positioning station, a second platform and a second discharging station, the digital lithography method for a circuit board includes the following steps:
feeding a plurality of circuit boards, and alternately supplying the circuit boards A and the circuit boards B;
secondly, the circuit board A enters the first transmission line and comprises the steps of,
s1, moving the circuit board A to a first positioning station;
s2, the first positioning station carries out clapper positioning on the circuit board A;
s3, moving the circuit board A to the first platform;
s4, carrying out digital photoetching treatment on the circuit board A by the photoetching main body;
s5, moving the circuit board A to a first discharging station;
in a third step, the wiring board B enters a second transmission line, which includes the steps of,
t1, moving the circuit board B to a second positioning station;
t2, a second positioning station carries out clapper positioning on the circuit board B;
t3, moving the circuit board B to the second platform;
t4, carrying out photoetching treatment on the circuit board B by a photoetching main body;
t5, moving the circuit board B to a first discharging station;
the second step and the third step are carried out simultaneously;
fourthly, blanking the circuit board A and the circuit board B or respectively entering the next procedure;
in the present embodiment, step S2 is performed simultaneously with step T1, step S3 is performed simultaneously with step T2, step S4 is performed simultaneously with step T3, and step S5 is performed simultaneously with step T4, but the present invention is not limited thereto.
Specifically, the first platform and the second platform are respectively located on two longitudinal sides of the photoetching main body, the first positioning station and the first discharging station are respectively located on two transverse sides of the first platform, and the second positioning station and the second discharging station are respectively located on two transverse sides of the second platform.
Obviously, the circuit board is divided into the first transmission line and the second transmission line, so that the time of positioning, photoetching and discharging of the two circuit boards is overlapped and utilized, and the photoetching efficiency of the photoetching main body is effectively improved.
As shown in fig. 3, in example 1, in the first step, a plurality of circuit boards are fed through a first feeding line disposed adjacent to a first positioning station and a second feeding line disposed adjacent to a second positioning station, wherein the circuit board a is supplied from the first feeding line and the circuit board B is supplied from the second feeding line. And in the fourth step, the circuit board A is blanked through a first blanking assembly line arranged adjacent to the first discharging station, and the circuit board B is blanked through a second blanking assembly line arranged adjacent to the second discharging station.
As shown in fig. 4, in example 2, in the first step, the board a is supplied from the first feeding line, the board B is supplied from the second feeding line, and in the fourth step, the board a and the board B are respectively subjected to the next process.
As shown in fig. 5, in embodiment 3, the digital lithography system of the circuit board further includes a shunting station and a converging station, the shunting station is located between the first positioning station and the second positioning station, and the converging station is located between the first discharging station and the second discharging station. In the first step, a plurality of circuit boards are fed through a feeding assembly line arranged adjacent to the shunting station, and the circuit boards A and the circuit boards B are alternately supplied by the shunting station. And in the fourth step, the circuit boards A and the circuit boards B alternately enter the confluence station and then are discharged through a discharging production line which is adjacent to the confluence station.
As shown in fig. 6, in embodiment 4, the digital lithography system for a circuit board further includes a shunting station, and the shunting station is located between the first positioning station and the second positioning station. In the first step, a plurality of circuit boards are fed through a feeding assembly line arranged adjacent to the shunting station, and the circuit boards A and the circuit boards B are alternately supplied by the shunting station. And in the fourth step, the circuit board A and the circuit board B respectively enter the next procedure.
As shown in fig. 7 to 9, a digital lithography system 100 for a circuit board, to which a digital lithography method for a circuit board according to the present invention is applied, includes a frame 1, and a lithography body 2, a first platform 31, a second platform 32, a transmission assembly 4, a feeding mechanism 200, a plate separating mechanism 5, a plate beating mechanism 6, a transferring mechanism 7, a discharging mechanism 8, a converging mechanism 9, and a receiving mechanism 300, which are assembled to the frame 1.
The frame 1 includes a plurality of suspension beams 11 extending in the X-axis, Y-axis, and Z-axis directions. The X-axis direction corresponds to the transverse direction, and the Y-axis direction corresponds to the longitudinal direction. The frame 1 further comprises a support table 12, and the support table 12 is used for bearing the photoetching main body 2, the first platform 31, the second platform 32, the transmission assembly 4, the plate separating mechanism 5, the plate beating mechanism 6, the transferring mechanism 7, the discharging mechanism 8 and the converging mechanism 9. The support base 12 may be a marble platform to ensure structural stability of the device, but the material is not limited thereto.
The lithography body 2 includes an exposure barrel 21, an exposure light source 22 connected to the exposure barrel 21, an exposure head control unit 23, and a liquid cooling pipe assembly 24. The exposure light source 22 is used for providing exposure light for digital photoetching processing, and after the light of the exposure light source 22 passes through the exposure lens barrel 21, the exposure processing of the circuit board can be realized. The exposure head control unit 23 is used for controlling the exposure light source 22 to perform exposure, and the exposure light source 22 may be an LED light source or a laser light source. The liquid cooling pipeline assembly 34 comprises a plurality of liquid cooling pipes which are distributed side by side, cooling liquid is filled in the liquid cooling pipes, and the cooling liquid flows in the liquid cooling pipes, so that heat generated by the work of the exposure light source 22 and the exposure head control unit 23 can be taken away, and the temperature is prevented from being too high.
The first platform 31 and the second platform 32 are respectively located on two sides of the lithography main body 2 along the Y-axis direction, and the first platform 31 and the second platform 32 are used for bearing circuit boards. In the present embodiment, the first platform 31 and the second platform 32 can simultaneously support one or two circuit boards, but are not limited thereto.
The transmission assembly 4 is assembled below the first platform 31 and the second platform 32 along the Z-axis direction, and includes a slide rail 41 extending along the Y-axis direction, and the transmission assembly 4 can drive the first platform 31 and the second platform 32 to move along the Y-axis direction. In other embodiments, the drive assembly 4 may be a conveyor belt.
The plate separating mechanism 5 and the converging mechanism 9 are respectively positioned on two sides of the photoetching main body 2 along the X-axis direction. The plate separating mechanism 5 is positioned at a flow separating station, and the converging mechanism 9 is positioned at a converging station. The board separating mechanism 5 is connected to the feeding mechanism 200, in this embodiment, the feeding mechanism 200 is a feeding automatic line, the circuit board enters the board separating mechanism 5 from the feeding mechanism 200, and the board separating mechanism 5 can separate the circuit board. The feeding mechanism 200 is located at the feeding.
Referring to fig. 10, the plate separating mechanism 5 includes a first driving module 51, a plurality of push rods 52 spaced apart from each other and arranged in a row along the X-axis direction, a second driving module 53, and a plurality of stop rods 54 spaced apart from each other and arranged in a row along the Y-axis direction. The first driving module 51 is in transmission connection with the push rods 52 and can drive the push rods 52 to reciprocate along the Z-axis direction and the Y-axis direction, and the second driving module 53 is in transmission connection with the stop rods 54 and can drive the stop rods 54 to reciprocate along the Z-axis direction.
In this embodiment, when the first driving module 51 drives the plurality of push rods 52 to reciprocate along the Y-axis direction, the circuit board carried by the board separation mechanism 5 can move along the Y-axis, so as to separate the circuit board along two opposite directions of the Y-axis. When the second driving module 53 drives the stop rods 54 to move along the Z-axis direction, the circuit board can be stopped.
In this embodiment, the first driving module 51 and the second driving module 53 may employ a power source such as a motor or a cylinder, including but not limited to this.
The clapper mechanism 6 comprises a first clapper mechanism 61 and a second clapper mechanism 62 which are respectively positioned at two sides of the clapper mechanism 5 along the Y-axis direction. The first clapper mechanism 61 and the second clapper mechanism 62 have the same structure. The first clapper mechanism 61 is located at the first positioning station, and the second clapper mechanism 62 is located at the second positioning station.
After the circuit boards are divided by the board dividing mechanism 5, the circuit board a enters the first clapper mechanism 61, and the circuit board B enters the second clapper mechanism 62. The first clapper mechanism 61 carries out clapper positioning on the circuit board A, and the second clapper mechanism 62 carries out clapper positioning on the circuit board B.
As shown in fig. 11 and 12, the first flap mechanism 61 includes a bottom plate 610, and a first positioning component 611, a second positioning component 612, and a third positioning component 613 located on the bottom plate 610. The first positioning component 611 and the second positioning component 612 are oppositely arranged along the X-axis direction.
The first positioning assembly 611 includes a third driving module 6111 extending along the X-axis direction, a first positioning portion 6112 driven by the third driving module 6111 to reciprocate along the X-axis direction, and a first positioning column 6113 extending from the first positioning portion 6112 along the Z-axis direction.
The second positioning assembly 612 includes a fourth driving module 6121 extending along the X-axis direction, a second positioning portion 6122 driven by the fourth driving module 6121 to reciprocate along the X-axis direction, and a second positioning column 6123 extending from the second positioning portion 6122 along the Z-axis direction.
The third positioning assembly 613 includes a fifth driving module 6131 extending along the Y-axis direction, a third positioning portion 6132 driven by the fifth driving module 6131 to reciprocate along the Y-axis direction, and a third positioning post 6133 extending from the third positioning portion 6132 along the Z-axis direction.
When the circuit board a enters the first clapper mechanism 61, the first positioning component 611 and the second positioning component 612 approach the circuit board a along the X-axis direction, and the third positioning component 613 approaches the circuit board a along the Y-axis direction, so as to clamp the circuit board a. Through such a design, the first positioning assembly 611, the second positioning assembly 612 and the third positioning assembly 613 can position the circuit board a in two directions of the X axis and the Y axis, thereby improving the positioning accuracy.
The discharging mechanism 8 includes a first discharging mechanism 81 and a second discharging mechanism 82 respectively located on both sides of the confluence mechanism 9 along the Y-axis direction. The circuit boards a and B carried by the first discharging mechanism 81 and the second discharging mechanism 82 enter the confluence mechanism 9 in turn. The first discharging mechanism 81 is located at the first discharging station, and the second discharging mechanism 82 is located at the second discharging station.
The confluence mechanism 9 has the same structure as the plate separating mechanism 5. The collecting mechanism 9 is connected with the receiving mechanism 300, and the receiving mechanism 300 is used for discharging. The circuit boards a and B after the photolithography can enter the receiving mechanism 300 from the converging mechanism 9. In the present embodiment, the receiving mechanism 300 is a receiving automation line, but is not limited thereto.
The transfer mechanism 7 includes a first transfer mechanism 71, a second transfer mechanism 72, a third transfer mechanism 73, and a fourth transfer mechanism 74.
As shown in fig. 8 and 13, the first transfer mechanism 71 is located above the first shooting plate mechanism 61 and the first platform 31 in the Z-axis direction, the first transfer mechanism 71 includes a first rail assembly 711 extending in the X-axis direction, a second rail assembly 712 extending in the Z-axis direction, and a first robot 713, the first robot 713 includes a plurality of suction pads 7131, and the suction pads 7131 can suck the circuit board. The first robot 713 is movable in the X-axis and Z-axis directions. The first transfer mechanism 71 can transfer the wiring board a positioned on the first board-shooting mechanism 61 to the first stage 31.
The second transfer mechanism 72, the third transfer mechanism 73, and the fourth transfer mechanism 74 have the same configuration as the first transfer mechanism 71, and will not be described in detail here.
The second transfer mechanism 72 is located above the first platform 31 and the first discharging mechanism 81 along the Z-axis direction, and the second transfer mechanism 72 can transfer the circuit board a located on the first platform 31 to the first discharging mechanism 81.
The third transfer mechanism 73 is positioned above the second tapping mechanism 62 and the second stage 32 in the Z-axis direction, and the third transfer mechanism 73 can transfer the circuit board B positioned on the second tapping mechanism 62 to the second stage 32.
The fourth transfer mechanism 74 is located above the second stage 32 and the second discharging mechanism 82 in the Z-axis direction, and the fourth transfer mechanism 74 can transfer the circuit board B located on the second stage 32 to the second discharging mechanism 82.
The first clapper mechanism 61, the first platform 31 and the first discharging mechanism 81 form a first transmission line together, and the second clapper mechanism 62, the second platform 32 and the second discharging mechanism 82 form a second transmission line together.
In summary, in the digital lithography system 100 for circuit boards, the circuit board is divided into the circuit board a and the circuit board B by the board dividing mechanism 5, the circuit board a enters the first transmission line, the circuit board B enters the second transmission line, and the first transmission line and the second transmission line are performed simultaneously, so that the lithography main body 2 performs digital lithography processing on the circuit boards on the two platforms alternatively, the lithography efficiency is greatly improved, the time is saved, and the cost is saved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not necessarily depart from the spirit and scope of the corresponding technical solutions.
Claims (10)
1. A digital photoetching method of a circuit board is applied to a digital photoetching system of the circuit board, and is characterized in that the digital photoetching system of the circuit board comprises a photoetching main body, a first transmission line and a second transmission line, wherein the first transmission line comprises a first positioning station, a first platform and a first discharging station, the second transmission line comprises a second positioning station, a second platform and a second discharging station, and the digital photoetching method of the circuit board comprises the following steps:
feeding a plurality of circuit boards, and alternately supplying the circuit boards A and the circuit boards B;
in a second step, the circuit board A enters the first transmission line, which comprises the steps of,
s1, moving the circuit board A to the first positioning station;
s2, the first positioning station carries out clapper positioning on the circuit board A;
s3, moving the circuit board A to the first platform;
s4, the photoetching main body carries out digital photoetching processing on the circuit board A;
s5, moving the circuit board A to the first discharging station;
in a third step, said wiring board B enters said second transmission line, comprising the steps of,
t1, moving the circuit board B to the second positioning station;
t2, the second positioning station carries out clapper positioning on the circuit board B;
t3, the circuit board B is moved to the second platform;
t4, the photoetching body carries out photoetching treatment on the circuit board B;
t5, moving the circuit board B to the first discharging station;
the second step is performed partially simultaneously with the third step.
2. The method of claim 1, wherein in the first step, the plurality of circuit boards are fed through a first feeding line disposed adjacent to the first positioning station and a second feeding line disposed adjacent to the second positioning station, the circuit board a being supplied from the first feeding line, and the circuit board B being supplied from the second feeding line.
3. The method according to claim 2, further comprising a fourth step of blanking the circuit board a and the circuit board B, wherein in the fourth step, the circuit board a is blanked through a first blanking line disposed adjacent to the first discharging station, and the circuit board B is blanked through a second blanking line disposed adjacent to the second discharging station.
4. The method according to claim 2, further comprising a fourth step of performing a next process on the circuit board a and the circuit board B.
5. The method of claim 1, wherein the digital lithography system further comprises a shunting station located between the first positioning station and the second positioning station, and in the first step, the plurality of circuit boards are fed through a feeding line disposed adjacent to the shunting station, and the circuit boards a and the circuit boards B are alternately supplied from the shunting station.
6. The method according to claim 5, wherein the digital lithography system further comprises a confluence station, the confluence station is located between the first discharging station and the second discharging station, and after the second step and the third step, the circuit boards A and B alternately enter the confluence station and are blanked through a blanking line arranged adjacent to the confluence station.
7. The method according to claim 5, further comprising a fourth step of performing a next process on the circuit board A and the circuit board B.
8. A circuit board digital lithography system applying the circuit board digital lithography method as claimed in claims 5-6, characterized in that it comprises a frame, and a lithography main body, a first platform, a second platform, a plate separating mechanism, a plate beating mechanism, a discharging mechanism and a converging mechanism assembled on the frame, wherein the plate separating mechanism is located at the diverging station, the plate beating mechanism comprises a first plate beating mechanism located at the first positioning station and a second plate beating mechanism located at the second positioning station, the discharging mechanism comprises a first discharging mechanism located at the first discharging station and a second discharging mechanism located at the second discharging station, and the converging mechanism is located at the converging station.
9. The system according to claim 8, further comprising a transfer mechanism, wherein the transfer mechanism comprises a first transfer mechanism, a second transfer mechanism, a third transfer mechanism, and a fourth transfer mechanism, the first transfer mechanism comprises a first slide rail assembly, a second slide rail assembly, and a first robot, the first robot comprises a plurality of suction cups, the first transfer mechanism is located above the first patting mechanism and the first stage, the second transfer mechanism is located above the first stage and the first discharging mechanism, the third transfer mechanism is located above the second patting mechanism and the second stage, and the fourth transfer mechanism is located above the second stage and the second discharging mechanism.
10. The digital lithography system for circuit boards of claim 8 further comprising a drive assembly drivingly connected to said first stage and said second stage, said drive assembly comprising a longitudinally extending slide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210285376.6A CN114803445A (en) | 2022-03-23 | 2022-03-23 | Digital photoetching method of circuit board and digital photoetching system of circuit board using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210285376.6A CN114803445A (en) | 2022-03-23 | 2022-03-23 | Digital photoetching method of circuit board and digital photoetching system of circuit board using same |
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| CN114803445A true CN114803445A (en) | 2022-07-29 |
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| CN202210285376.6A Pending CN114803445A (en) | 2022-03-23 | 2022-03-23 | Digital photoetching method of circuit board and digital photoetching system of circuit board using same |
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