CN110187608A - A kind of exposure method of write-through exposure machine - Google Patents
A kind of exposure method of write-through exposure machine Download PDFInfo
- Publication number
- CN110187608A CN110187608A CN201910422841.4A CN201910422841A CN110187608A CN 110187608 A CN110187608 A CN 110187608A CN 201910422841 A CN201910422841 A CN 201910422841A CN 110187608 A CN110187608 A CN 110187608A
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- China
- Prior art keywords
- exposure
- substrate
- table top
- base plate
- carrying table
- Prior art date
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- Pending
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The present invention provides a kind of exposure method of write-through exposure machine, the exposure method includes the following steps: that (1) upper plate operates: transplanter transports on substrate to the base plate carrying table top from a upper process；(2) alignment operation: the base plate carrying table top, which is moved to below alignment system, carries out alignment operation；(3) exposing operation: the base plate carrying table top is moved to the initial position of exposure mechanism, and exposure mechanism is exposed the substrate；(4) lower plate operates: after the completion of exposure, substrate is transported to subsequent processing by transplanter；(5) return operates: the stepping axis moving parts drive the base plate carrying table top to return to initial position.The exposure method is more conducive to applied to full-automatic mode.
Description
Technical field
The present invention relates to laser direct-writing formula exposure machine technical fields, the in particular to exposure method of write-through exposure machine.
Background technique
The exposure of laser direct-writing formula is for printing the composition with feature on the surface of a substrate, compared to traditional mask plate
With the direct transfer techniques of image of the exposures such as film egative film, write-through exposure technique production capacity is high, and aligning accuracy is high.In semiconductor and
PCB production field has very important effect.
Write-through exposure machine includes single table surface direct-write type lithography machine and dual stage face write-through exposure machine, the exposure of single table surface direct write
In one period of machine, the exposure of single substrate is needed by upper and lower plates, contraposition, exposing operation, and exposure needs to pass through multiple
Exposure is completed in step-scan.In order to improve the production capacity of write-through exposure machine, the dual stage that has been born face direct write exposure machine.Dual stage face direct write
Exposure machine includes two base plate carrying table tops, when one of base plate carrying table top carries out upper and lower plates positioning operation, another base
Plate loading floor is exposed operation, and described two substrate table tops can be arranged in parallel, can also be setting up and down, can save in this way
The waiting time of write-through exposure machine is saved, the production capacity of write-through exposure machine is improved.But either single table surface direct-write type lithography machine
Or the position of dual stage face write-through exposure machine upper plate is the position of lower plate, needs manually to stack material and place, it is artificial or
Person's mechanical arm carries out upper plate operation, and the substrate also will do it stacking placement after lower plate, then manually be pushed into subsequent processing,
Connectivity between upper and lower process is poor, can not be applied to full-automatic operation.Also, the substrate table top needs both direction
On repeatedly with for complete exposure, reduce the efficiency of write-through exposure machine.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of direct-write type lithography machines that can adapt in automatic operation
Exposure method.
To solve the above-mentioned problems, the present invention provides a kind of exposure method of write-through exposure machine,
The exposure method includes the following steps:
(1) upper plate operates: transplanter transports on substrate to the base plate carrying table top from a upper process；
(2) alignment operation: the base plate carrying table top, which is moved to below alignment system, carries out alignment operation；
(3) exposing operation: the base plate carrying table top is moved to the initial position of exposure mechanism, exposure mechanism to the substrate into
Row exposure；
(4) lower plate operates: after the completion of exposure, substrate is transported to subsequent processing by transplanter；
(5) return operates: the stepping axis moving parts drive the base plate carrying table top to return to initial position.
Further, in the exposing operation, the exposure mechanism completes exposure behaviour to the substrate by single exposure
Make.
Further, the lower plate operation, exposing operation are not necessarily to move the base plate carrying table top progress lower plate after the completion
Operation.
Further, the lower plate operation, exposing operation need to move the base plate carrying table top to lower plate area pair after the completion
The substrate carries out lower plate operation.
A kind of exposure method of dual stage face write-through exposure machine, it is characterised in that:
The exposure method includes the following steps:
First substrate loading floor:
(1) upper plate operates: the substrate for completing a upper process is transported on the base plate carrying table top by transplanter, the Z axis fortune
Dynamic component drives the base plate carrying table top to be increased to a high position；
(2) alignment operation: the base plate carrying table top, which is moved to below alignment system, carries out alignment operation；
(3) exposing operation: the base plate carrying table top is moved to the initial position of the exposure mechanism, and the exposure mechanism is to institute
Substrate is stated to be exposed；
(4) lower plate operates: after the completion of exposure, substrate is transported to subsequent processing by transplanter；
(5) return operates: the stepping axis moving parts drive the base plate carrying table top to return to initial position.
The second substrate loading floor, second loading floor identical as the first substrate loading floor operating procedure
At least start corresponding operation after the first substrate loading floor leaves.
Further, in the exposing operation, the exposure mechanism completes exposure behaviour to the substrate by single exposure
Make.
Further, the lower plate operation, exposing operation are not necessarily to move the base plate carrying table top progress lower plate after the completion
Operation.
Further, the lower plate operation, exposing operation need to move the base plate carrying table top to lower plate area pair after the completion
The substrate carries out lower plate operation.
Further, the time of the exposing operation is not more than the temporal summation of remaining four step.
Further, control device controls the positioning mechanism, the exposure mechanism, the stepping axis moving parts and institute
Substrate stage component is stated, each operating procedure is controlled according to different exposure informations, and according to the time of each operating procedure
Control the speed of the stepping axis moving parts.
Further, the second substrate loading floor completes upper plate before the first substrate table top completes exposing operation
Operation and alignment operation.
By using the exposure method, the substrate carries out upper plate operation from the side of write-through exposure machine, from direct write
The other side of formula exposure machine carries out lower plate operation, is more conducive to applied to full-automatic mode, and the exposing operation
Described in exposure system the substrate is disposably exposed, avoid the base plate carrying table top repeatedly movement be exposed,
It more can be improved efficiency, more can be applied to the direct-write type lithography machine in dual stage face, guarantee the efficiency of dual stage face direct-write type lithography machine.
Detailed description of the invention
The top view of the position Fig. 1 write-through exposure machine of the invention.
Fig. 2 is the structural schematic diagram of dual stage face write-through exposure machine of the invention.
Fig. 3 is the side view of dual stage face write-through exposure machine of the invention.
Fig. 4 is the structural schematic diagram of the dual stage face write-through exposure machine of double-sided exposure of the invention.
Fig. 5 is the side view of the dual stage face write-through exposure machine of double-sided exposure of the invention.
Specific embodiment
In order to make the objectives, technical solutions and advantages of the present invention clearer, below by shown in the accompanying drawings specific
Embodiment describes the present invention.
As shown in Figure 1, a kind of write-through exposure machine of the invention, including pedestal 1, be placed in it is arranged in parallel on the pedestal
First gantry mechanism 2, the second gantry mechanism 3, stepping axis moving parts 4, the substrate being placed on the stepping axis moving parts 4 are put down
Platform component 5 and control device (not shown) are placed in the positioning mechanism 6 of the first gantry mechanism 2, are placed in the exposure of the second gantry mechanism 3
Mechanism 7.In the present embodiment, pedestal 1 uses marble pedestal, and first gantry mechanism 2 and the second gantry mechanism 3 will be described
Pedestal 1, which divides, is located at first gantry plane for upper plate area 10, contraposition area 11, exposure region 12 and lower plate area 13, the upper plate area 10
Before structure 2, the contraposition area 11 is located at 2 lower section of the first gantry mechanism, and the exposure region 12 is located at second gantry mechanism 3
Lower section, the lower plate area 13 is located at 3 rear of the second gantry mechanism, or is overlapped or partially overlaps with the exposure region 12.
The stepping axis moving parts 4 pass through the upper plate area 10, contraposition area 11, exposure region 12 and lower plate area 13, the stepping axis fortune
Dynamic component 4 can drive the substrate stage component 5 to sequentially pass through the upper plate area 10, contraposition area 11, exposure region 12 and lower plate
Area 13.
The write-through exposure machine can use the form of single table surface, can also use the mode in dual stage face, preferably, its
Using the mode in dual stage face.
As Figure 2-3, by taking the direct-write type lithography machine in dual stage face as an example, the quantity into axis moving parts 4 is two,
It includes the guide rail 40 arranged in parallel in pedestal 1, the stepping axis movement mould group 41 moved on the guide rail 40.Stepping axis
Installation base plate platform assembly 5, the substrate stage component 5 are transported including Z axis respectively in the stepping axis movement mould group 41 of moving parts 4
Dynamic component 50 and base plate carrying table top 51, the Z axis moving parts 50 are placed on the stepping axis moving parts 4, stepping axis fortune
Dynamic component 4 is able to drive Z axis moving parts 50 and is moved forward and backward across upper plate area 10, contraposition area 11, exposure region 12 and lower plate area 13.
Base plate carrying table top 51 is fixedly connected on Z axis moving parts 50, and base plate carrying table top 51 is arranged to two layers one on the other, Huo Zhesuo
Stating base plate carrying table top 51 highly can also unanimously be arranged side by side, preferably, the base plate carrying table top 51 is arranged one on the other
At two layers.Z axis moving parts 50 are able to drive 51 small range of base plate carrying table top and move up and down alignment exposure focal plane or big model
It encloses and moves up and down, two base plate carrying table tops 51 is avoided to bump against.In the present embodiment, base plate carrying table top 51 is fixed by screw
On the Z axis cantilever of Z axis moving parts 50, it is ensured that the levelness and flatness of base plate carrying table top 51 are good, and base
Plate loading floor 51 is equipped with hollow sucker structure, and substrate can firmly be sucked, and guarantees exposure quality.The control device controls institute
Positioning mechanism 6, the exposure mechanism 7, the stepping axis moving parts 4 and the substrate stage component 5 are stated, according to different
Exposure information controls each operating procedure, and the speed of the stepping axis moving parts 4 is controlled according to the time of each operating procedure
Degree.
Specifically, in the present embodiment, positioning mechanism 6 includes the contraposition axis exercise group being mounted on the first gantry mechanism 2
Part, contraposition axis moving parts include linear guide 60 and alignment system 61, alignment system 61 include CCD camera, alignment camera lens and
Lighting source.
Specifically, in the present embodiment, exposure mechanism 7 includes multiple exposure cameras 70, the exposure cameras 70 exposes model
Enclose the substrate covered on the base plate carrying table top 51.For the substrate by the exposure mechanism 7, each exposure cameras is logical
Exposure of the band completion to the substrate is crossed, therefore the substrate once can complete exposure by the exposure mechanism,
The base plate carrying table top 51 does not have to mobile progress multiple exposure in two directions.
In use process, the step of exposure of each substrate is as follows:
(1) upper plate operates: the substrate for completing a upper process is placed on the base plate carrying table top 51 by transplanter 400, the Z
Axis moving parts 50 drive the base plate carrying table top 51 to be increased to a high position；
(2) alignment operation: the base plate carrying table top 51, which is moved to below alignment system 61, carries out alignment operation, is believed according to contraposition
Breath, the Z axis moving parts 50 drive the base plate carrying table top 51 to move along Z axis up or down, complete alignment operation；
(3) exposing operation: the stepping axis moving parts 4 drive the base plate carrying table top 51 to be moved to the exposure mechanism 7
Initial position, the exposure mechanism 7 according to contraposition information, adjust digital figure information, the substrate is disposably exposed
Light；
(4) lower plate operates: after the completion of exposure, the base plate carrying table top 51 is moved to lower plate area 13, the Z axis moving parts 50
The base plate carrying table top 51 is driven to be down to low level, the transplanter 400 send the substrate into subsequent processing；
(5) return operates: the stepping axis moving parts 4 drive the base plate carrying table top 51 to return to initial position.
Preferably, determining the how opposite movement in the dual stage face, and maximum according to the time of each operating procedure
The exposure of the completing substrate of efficiency.
In above-mentioned five steps, the time for exposure is relatively long, and is not easy to adjust relatively, and the time of other steps relatively can
Control determines described two base plate carrying table tops such as according to the time relationship of other relatively described four steps of the time for exposure
What relative motion.
Several situations are divided to be illustrated below
(1) time for exposure is identical as the time of other four steps in this case, can set the first substrate and hold
When the microscope carrier face time for exposure carries out to half, the second substrate loading floor starts to carry out upper plate operation.As shown in the table
Table 1
(2) time for exposure is the half of other four Step Time summations, the time and lower plate of upper plate and contraposition and
The time of return is identical
In this case, when can set the first substrate loading floor and starting to be exposed, the second substrate plummer
Face starts to carry out upper plate operation.As shown in the table
Table 2
(3) time for exposure is 3/4ths of other four Step Time summations
In this case, when can set the first substrate loading floor end exposure, in the second substrate table top completion
Plate and positioning operation.As shown in the table
Table 3
(4) time for exposure is greater than the time of other four steps
In this case, certainly exist waiting period collides to avoid two base plate carrying table tops.As shown in the table, in table
One base plate carrying table top is since the T3 moment
Table 4
Therefore, for dual stage face direct write exposure machine, preferably, total the time required to the time for exposure is less than remaining four step
With can be improved the utilization rate of the dual stage face direct write exposure machine in this way.And the dual stage face direct write exposure machine in the present invention uses
Single exposure operation, substantially reduces the time for exposure, when the time for exposure is less than needed for remaining four step
Between, improve the efficiency of the dual stage face direct write exposure machine.
For the substrate of double-sided exposure, the direct write exposure machine of full-automatic operation, lower mask body introduction are more needed
It can carry out the dual stage face direct write exposure machine of double-sided exposure.
As illustrated in figures 4-5, the dual stage face direct write exposure machine of double-sided exposure includes the first direct write exposure machine 100 and the second direct write
Panel turnover machine, the turnover panel are provided among exposure machine 200, the first write-through exposure machine and the second write-through exposure machine
The substrate that first write-through exposure machine exposure is completed is carried out turnover panel operation by machine, and the substrate is by transplanter 400 from the
Write-through exposure machine is to the panel turnover machine, and by the transplanter 400 from panel turnover machine to the second write-through exposure machine.
In use, the substrate carries out single side exposure in the first direct write exposure machine 100, and after completing exposing operation, institute
It states transplanter 400 and grabs the substrate placement panel turnover machine 300, panel turnover machine 300 is by overturning the substrate, so that it is not exposed
Upward, the transplanter 400 grabs the substrate and places the second write-through exposure machine 200, second direct write light one side
Formula exposure machine 200 is unexposed to substrate to be exposed on one side, after the completion of exposure, is moved to down one of work by transplanter 400
Sequence.The transplanter can be mechanical arm either transmission wheel.
By using the exposure method, the substrate carries out upper plate operation from the side of the write-through exposure machine, from
The other side of the write-through exposure machine carries out lower plate operation, is more conducive to the write-through exposure machine and is applied to full-automation
Mode, and the exposure system of the write-through exposure machine disposably exposes the substrate, and the substrate is avoided to hold
Repeatedly movement is exposed in microscope carrier face, more be can be improved efficiency, more be can be applied to the direct-write type lithography machine in dual stage face, is guaranteed double
The efficiency of table top direct-write type lithography machine.
Claims (11)
1. a kind of exposure method of write-through exposure machine, it is characterised in that:
The exposure method includes the following steps:
Upper plate operation: transplanter transports on substrate to the base plate carrying table top from a upper process；
Alignment operation: the base plate carrying table top, which is moved to below alignment system, carries out alignment operation；
Exposing operation: the base plate carrying table top is moved to the initial position of exposure mechanism, and exposure mechanism carries out the substrate
Exposure；
Lower plate operation: after the completion of exposure, substrate is transported to subsequent processing by transplanter；
Return operation: the stepping axis moving parts drive the base plate carrying table top to return to initial position.
2. exposure method according to claim 1, it is characterised in that: in the exposing operation, the exposure mechanism passes through
Single exposure completes exposing operation to the substrate.
3. exposure method according to claim 1, it is characterised in that: the lower plate operation, exposing operation are not necessarily to after the completion
The mobile base plate carrying table top carries out lower plate operation.
4. exposure method according to claim 1, it is characterised in that: the lower plate operation, exposing operation need to move after the completion
It moves the base plate carrying table top and lower plate operation is carried out to the substrate to lower plate area.
5. a kind of exposure method of dual stage face write-through exposure machine, it is characterised in that:
The exposure method includes the following steps:
First substrate loading floor:
Upper plate operation: the substrate for completing a upper process is transported on the base plate carrying table top by transplanter, the Z axis exercise group
Part drives the base plate carrying table top to be increased to a high position；
Alignment operation: the base plate carrying table top, which is moved to below alignment system, carries out alignment operation；
Exposing operation: the base plate carrying table top is moved to the initial position of the exposure mechanism, and the exposure mechanism is to described
Substrate is exposed；
Lower plate operation: after the completion of exposure, substrate is transported to subsequent processing by transplanter；
Return operation: the stepping axis moving parts drive the base plate carrying table top to return to initial position；
The second substrate loading floor, identical as the first substrate loading floor operating procedure, second loading floor is at least
Start corresponding operation after the first substrate loading floor leaves.
6. exposure method according to claim 5, it is characterised in that: in the exposing operation, the exposure mechanism passes through
Single exposure completes exposing operation to the substrate.
7. exposure method according to claim 5, it is characterised in that: the lower plate operation, exposing operation are not necessarily to after the completion
The mobile base plate carrying table top carries out lower plate operation.
8. exposure method according to claim 5, it is characterised in that: the lower plate operation, exposing operation need to move after the completion
It moves the base plate carrying table top and lower plate operation is carried out to the substrate to lower plate area.
9. exposure method according to claim 5, it is characterised in that: the time of the exposing operation is not more than remaining four
The temporal summation of step.
10. exposure method according to claim 5, it is characterised in that: control device controls the positioning mechanism, the exposure
Ray machine structure, the stepping axis moving parts and the substrate stage component control each operation according to different exposure informations
Step, and control according to the time of each operating procedure the speed of the stepping axis moving parts.
11. exposure method according to claim 5, it is characterised in that: the second substrate loading floor is described first
Substrate table top completes upper plate operation and alignment operation before completing exposing operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910422841.4A CN110187608A (en) | 2019-05-21 | 2019-05-21 | A kind of exposure method of write-through exposure machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910422841.4A CN110187608A (en) | 2019-05-21 | 2019-05-21 | A kind of exposure method of write-through exposure machine |
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Family
ID=67717155
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| CN201910422841.4A Pending CN110187608A (en) | 2019-05-21 | 2019-05-21 | A kind of exposure method of write-through exposure machine |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111025853A (en) * | 2019-10-23 | 2020-04-17 | 苏州源卓光电科技有限公司 | Alignment method and direct-writing photoetching equipment applying same |
| CN111965944A (en) * | 2019-05-20 | 2020-11-20 | 中山新诺科技股份有限公司 | Novel double-sided double-carrier-plate mechanism digital direct-writing exposure machine and exposure method |
| CN112631087A (en) * | 2021-01-25 | 2021-04-09 | 苏州源卓光电科技有限公司 | Double-face processing system and processing method |
| CN112698549A (en) * | 2019-10-22 | 2021-04-23 | 苏州源卓光电科技有限公司 | Double-table-board direct-writing type exposure machine and exposure method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170090294A1 (en) * | 2015-09-29 | 2017-03-30 | Apple Inc. | High-volume replication of diffractive optical elements |
| CN206920817U (en) * | 2017-03-31 | 2018-01-23 | 苏州微影激光技术有限公司 | It is a kind of to have dual stage face direct write exposure machine that is independent and merging both of which concurrently |
| CN109143797A (en) * | 2018-11-06 | 2019-01-04 | 苏州源卓光电科技有限公司 | A kind of dual stage face write-through exposure machine and its exposure method |
| CN109240048A (en) * | 2018-11-06 | 2019-01-18 | 无锡影速半导体科技有限公司 | A kind of multistation work stage single exposure molding direct-write photoetching system |
-
2019
- 2019-05-21 CN CN201910422841.4A patent/CN110187608A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170090294A1 (en) * | 2015-09-29 | 2017-03-30 | Apple Inc. | High-volume replication of diffractive optical elements |
| CN206920817U (en) * | 2017-03-31 | 2018-01-23 | 苏州微影激光技术有限公司 | It is a kind of to have dual stage face direct write exposure machine that is independent and merging both of which concurrently |
| CN109143797A (en) * | 2018-11-06 | 2019-01-04 | 苏州源卓光电科技有限公司 | A kind of dual stage face write-through exposure machine and its exposure method |
| CN109240048A (en) * | 2018-11-06 | 2019-01-18 | 无锡影速半导体科技有限公司 | A kind of multistation work stage single exposure molding direct-write photoetching system |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111965944A (en) * | 2019-05-20 | 2020-11-20 | 中山新诺科技股份有限公司 | Novel double-sided double-carrier-plate mechanism digital direct-writing exposure machine and exposure method |
| CN112698549A (en) * | 2019-10-22 | 2021-04-23 | 苏州源卓光电科技有限公司 | Double-table-board direct-writing type exposure machine and exposure method thereof |
| CN111025853A (en) * | 2019-10-23 | 2020-04-17 | 苏州源卓光电科技有限公司 | Alignment method and direct-writing photoetching equipment applying same |
| CN112631087A (en) * | 2021-01-25 | 2021-04-09 | 苏州源卓光电科技有限公司 | Double-face processing system and processing method |
| CN112631087B (en) * | 2021-01-25 | 2022-04-22 | 苏州源卓光电科技有限公司 | Double-face processing system and processing method |
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Application publication date: 20190830 |