CN112631087B - Double-face processing system and processing method - Google Patents
Double-face processing system and processing method Download PDFInfo
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- CN112631087B CN112631087B CN202110097621.6A CN202110097621A CN112631087B CN 112631087 B CN112631087 B CN 112631087B CN 202110097621 A CN202110097621 A CN 202110097621A CN 112631087 B CN112631087 B CN 112631087B
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- workbench
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
Abstract
The invention relates to a double-face processing system and a processing method, wherein the processing system comprises a workbench system, an optical system and an alignment system, the workbench system comprises a first workbench and a second workbench, the alignment system comprises a first alignment system and a second alignment system, the first alignment system and the second alignment system are positioned on two sides of the optical system, a feeding and discharging station is arranged on the side of the first alignment system, a turning station is arranged on the side of the second alignment system, and at least one workbench of the first workbench and the second workbench is provided with a vertical slide rail to drive the table top of the first workbench or the second workbench to be lifted or lowered. The double-side processing of the workpiece is finished through the same workbench through the reciprocating operation of the first workbench and the second workbench, and the first workbench and the second workbench are tightly matched, so that the production efficiency can be improved.
Description
Technical Field
The invention relates to a system for optically processing a workpiece, in particular to a system for optically processing two sides of a workpiece and a processing method.
Background
Optical processing is widely used in the field of semiconductor and PCB production, is an important processing method for manufacturing products such as semiconductor devices, chips, PCB boards and the like, and is used for processing photoetching characteristic patterns on the surface of a workpiece, solder resist ink of a printed circuit board, punching processing of electrical interconnection between multilayer circuit boards and the like.
For a printed circuit board, circuit patterns and solder mask ink are usually processed on two corresponding surfaces of the printed circuit board, the traditional lithography technology needs to make a master mask or a film negative film of a mask for exposure operation, the manufacturing period is long, and each plate corresponds to a single pattern and cannot be widely applied. In order to solve the problems of the traditional photoetching technology, a direct-write photoetching mechanism comes along, the digital light processing technology is utilized, different required graph structures are edited through a programmable digital reflector device, graphs can be switched rapidly, the cost can be reduced, the time of a manufacturing process can be shortened, and the direct-write photoetching mechanism is widely applied to the technical field of photoetching. The existing direct-writing photoetching mechanism adopts double workbenches to process double surfaces, one workbench is usually adopted to process the front surface of the printed circuit board, the other workbench is utilized to process the back surface of the printed circuit board, and double-surface processing is completed through the two workbenches.
Disclosure of Invention
The invention aims to provide a system and a method for finishing double-sided machining by using the same workbench.
In order to solve the above problems, the present invention provides a double-side processing system, which includes a workbench system, an optical system, and an alignment system, wherein the workbench system includes a first workbench and a second workbench, the alignment system includes a first alignment system and a second alignment system, the first alignment system and the second alignment system are located on two sides of the optical system, a loading and unloading station is arranged on the first alignment system side, an overturning station is arranged on the second alignment system side, and at least one of the first workbench and the second workbench has a vertical slide rail to drive a table top of the first workbench or the second workbench to be raised or lowered.
Further, first workstation and second workstation all include vertical slide rail.
Furthermore, the first workbench and the second workbench complete optical machining of a first surface of a workpiece placed on the first workbench or the second workbench sequentially through the feeding and discharging station, the first aligning system and the optical system, move to the overturning station for overturning operation, complete optical machining of a second surface of the workpiece through the second aligning system and the optical system, and move to the feeding and discharging station for feeding and discharging operation.
Further, after the first workbench and/or the second workbench finish the optical processing of the optical system, the height of the table top is reduced, and the table top is moved to a loading and unloading station or a turning station.
Further, the optical system includes a plurality of optical lenses.
Furthermore, the optical lenses are arranged in a row and column mode, and are arranged in a staggered mode between different rows or different columns.
Further, the optical lens includes a beam splitting system.
Furthermore, the light splitting system comprises at least two groups of optical components, each optical component corresponds to one light path, and an imaging area is formed on the workpiece.
In the processing method of the double-sided processing system, the first workbench finishes the optical processing of the first side of the workpiece placed on the first workbench sequentially through the feeding and discharging station, the first aligning system and the optical system, moves to the overturning station for overturning operation, finishes the optical processing of the second side of the workpiece through the second aligning system and the optical system, and moves to the feeding and discharging station for feeding and discharging operation; the second workbench follows the first workbench, and enters a corresponding position to complete the operation after the first workbench finishes the corresponding operation and leaves the corresponding position, so that the double-sided exposure of the workpiece is finished; when the first workbench and the second workbench meet, the heights of the first table top and the second table top are different.
Further, when the first workbench and the second workbench meet, the height of the second workbench is lower than that of the first table top.
Compared with the prior art, the double-side processing of the workpiece is completed through the same workbench by the reciprocating operation of the first workbench and the second workbench, and the first workbench and the second workbench are tightly matched, so that the production efficiency can be improved.
Drawings
FIG. 1 is a schematic diagram of a double-sided processing system.
FIG. 2 is a schematic of a station of a double-sided processing system.
Fig. 3 is a schematic view of an embodiment of an optical system of the double-side processing system.
Fig. 4 is a schematic view of an embodiment of an exposure optical system of the double-sided processing system.
Detailed Description
In order that the objects, aspects and advantages of the invention will become more apparent, the invention will be described by way of example only, and in connection with the accompanying drawings.
As shown in fig. 1-4, a double-sided processing system includes a workbench system 1, an optical system 2, and an alignment system 3, where the workbench system 1 bears a workpiece and drives the workpiece to move among a feeding and discharging station 5, alignment stations 6 and 7, an optical processing station 8, and a turning station 9, the alignment station is divided into a first alignment station 6 and a second alignment station 7, which are respectively located at two sides of the optical processing station 8, the feeding and discharging station 5 is disposed at a side of the first alignment station 6, and the turning station 9 is disposed at a side of the second alignment station 7.
The workbench system 1 comprises a first workbench 11 and a second workbench 12, the first workbench 11 and the second workbench 12 independently move along respective rails, and the first workbench 11 and the second workbench 12 both comprise vertical sliding rails 100 for raising or lowering the table height of the workbench.
The optical system 2 is located in the middle of the laser processing system and is an optical processing station. The optical system includes a plurality of optical lenses 20. The optical lens can be arranged in a single row or in a multi-row staggered manner, and optical processing of the workpiece is completed through one strip. The optical system 2 may be an exposure optical system, a solder resist ink etching optical system, or the like. The exposure optical system adjusts the position of light emitted by the light source projected to the workpiece through the spatial light modulation element, and the welding ink etching prevention optical system adjusts the position of light emitted by the light source projected to the workpiece through the vibrating mirror.
For the exposure optical system, the optical lens 20 may further include a light splitting system 21, the light splitting system 21 includes at least two sets of optical components 22 and 23, each optical component 22 and 23 corresponds to a light path, and light emitted from the light source 24 passes through the spatial light modulation element 25 and the optical components 22 and 23 to form an imaging region 15 on the workpiece, so that the imaging region 15 of the optical system 2 covers all the processing regions of the workpiece, that is, the optical processing can be completed by the optical system 2 through one-way movement of the worktable.
The alignment system 3 includes a first alignment system 30 and a second alignment system 31, where the first alignment system 30 and the second alignment system 31 are respectively located at two sides of the optical system 2, and respectively perform alignment operation on the workpieces on the first workbench 11 and the second workbench 12. The first alignment system 30 and the second alignment system 31 each include at least one alignment camera 32 and a slide 33, and the alignment camera 32 slides along the slide 33 and moves to a corresponding position to capture an alignment point. The first aligning system 30 is arranged corresponding to the first aligning station, and the second aligning system 31 is arranged corresponding to the second aligning station.
The loading and unloading station 5 and the turning station 9 can be manually operated or automatically operated by a mechanical device, for example, the turning operation of a workpiece is completed by a mechanical arm or the workpiece which is completed by one-side processing operation is turned by a panel turnover machine, so that the one side which is not optically processed faces upwards, and the workpiece is moved to a workbench system by the mechanical arm, and one side which is not optically processed is operated.
During working, the first workbench 11 finishes optical machining of a first surface of a workpiece placed on the first workbench 11 sequentially through the feeding and discharging station 5, the first aligning system 30 and the optical system 2, moves to the overturning station 9 for overturning operation, finishes optical machining of a second surface of the workpiece through the second aligning system 31 and the optical system 2, and moves to the feeding and discharging station 5 for feeding and discharging operation; the second workbench 12 follows the first workbench 11, and enters a corresponding position to complete the operation after the first workbench 11 finishes the corresponding operation and leaves the corresponding position, so that the double-sided exposure of the workpiece is finished; when the first table 11 and the second table 12 meet, the heights of the first table 11 and the second table 12 are different. Preferably, the second table 12 is lower in height than the first table. Preferably, the worktable for optical processing is ensured to pass preferentially, and the height of the worktable is kept higher.
The following describes the above-described processing method in detail with reference to an example.
At a first time S1, the first stage 11 is loaded with unprocessed workpieces and moved to the first alignment system 30 for alignment.
At a second timing S2, the first stage 11 moves to the optical system 2 and performs optical processing; the second table is raised to load the unprocessed workpiece and moved to the first alignment system 30 for alignment.
At a third time S3, the first workbench 11 moves to the flipping station, and the workpiece on the table top, which has finished the first-side optical processing, is flipped to the second unprocessed side and placed on the first workbench 11; the second stage 12 is moved to the optical system 2 for optical processing.
At a fourth time S4, the first worktable 11 moves to the second alignment system 31 for alignment operation; the second table 12 lowers the table top height, moves to the flipping station, and raises the table top.
At a fifth timing S5, the first stage 11 moves to the optical system 2 and performs optical processing; and the workpiece on the optical processing finished surface on the second workbench is turned over, so that the unprocessed surface of the workpiece is upwards placed on the second workbench 12 and moved to the second alignment system 31 for alignment.
At a sixth time S6, the first workbench 11 moves to the loading and unloading station to complete the unloading and loading of the workpiece; the second stage 12 is moved to the optical system 2 for optical processing.
At a seventh time S7, the first worktable 11 moves to the first aligning system 30 for aligning; the second table 12 is lowered to a height and returned to the loading and unloading station.
The first table 11 and the second table 12 continuously repeat the operations from the second timing S2 to the seventh timing S7, thereby completing the double-sided optical processing of the workpiece.
In addition to the above processing methods, the loading and unloading operation and the lifting operation of the second worktable 12 can be performed at the loading and unloading station and the overturning station first, and then the table top is lifted. After the optical processing is completed by the first workbench 11, the table top can be lowered to move to the loading and unloading station and the overturning station, and the risk of collision between the first workbench 11 and the second workbench 12 is lowered.
The first workbench 11 and the second workbench 12 are operated to and fro to complete double-sided processing of the workpiece by the same workbench, and errors caused by different workbenches during double-sided exposure by different workbenches are avoided. And first workstation and second workstation closely cooperate, more can improve production efficiency.
Claims (8)
1. A processing method of a double-sided processing system is characterized in that: the double-side processing system comprises a workbench system, an optical system and an alignment system, the workbench system comprises a first workbench and a second workbench, the alignment system comprises a first alignment system and a second alignment system, the first alignment system and the second alignment system are located on two sides of the optical system, a feeding and discharging station is arranged on the side of the first alignment system, an overturning station is arranged on the side of the second alignment system, at least one workbench of the first workbench and the second workbench is provided with a vertical sliding rail, the table top of the first workbench or the second workbench is driven to rise or fall, the first workbench completes first-side optical processing of a workpiece placed on the first workbench through the feeding and discharging station, the first alignment system and the optical system in sequence, moves to the overturning station to perform overturning operation, and then turns over through the second alignment system, The optical system finishes the optical processing of the second surface of the workpiece and moves to a feeding and discharging station to perform feeding and discharging operations; the second workbench follows the first workbench, and enters a corresponding position to complete the operation after the first workbench finishes the corresponding operation and leaves the corresponding position, so that the double-sided exposure of the workpiece is finished; when the first workbench and the second workbench meet, the heights of the table tops of the first workbench and the second workbench are different.
2. The processing method of a double-sided processing system according to claim 1, characterized in that: when the first workbench and the second workbench meet, the height of the table top of the second workbench is lower than that of the first workbench.
3. The processing method of a double-sided processing system according to claim 1, characterized in that: first workstation and second workstation all include vertical slide rail.
4. The processing method of a double-sided processing system according to claim 1, characterized in that: and after the first workbench and/or the second workbench finish the optical processing of the optical system, the height of the table top is reduced, and the table top is moved to a loading and unloading station or a turning station.
5. The processing method of a double-sided processing system according to claim 1, characterized in that: the optical system includes a plurality of optical lenses.
6. The processing method of a double-sided processing system according to claim 5, characterized in that: the optical lenses are arranged in a row and column mode, and are arranged in a staggered mode in different rows or different columns.
7. The processing method of a double-sided processing system according to claim 5, characterized in that: the optical lens includes a beam splitting system.
8. The processing method of a double-sided processing system according to claim 7, characterized in that: the light splitting system comprises at least two groups of optical components, each optical component corresponds to one light path, and an imaging area is formed on the workpiece.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110097621.6A CN112631087B (en) | 2021-01-25 | 2021-01-25 | Double-face processing system and processing method |
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| CN202110097621.6A CN112631087B (en) | 2021-01-25 | 2021-01-25 | Double-face processing system and processing method |
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| CN112631087A CN112631087A (en) | 2021-04-09 |
| CN112631087B true CN112631087B (en) | 2022-04-22 |
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| CN108873622A (en) * | 2018-07-26 | 2018-11-23 | 中山新诺科技股份有限公司 | Sided exposure machine and double-faced exposure method |
| CN208752392U (en) * | 2018-09-29 | 2019-04-16 | 苏州源卓光电科技有限公司 | A kind of double-sided exposure digital laser direct write equipment |
| CN208969427U (en) * | 2018-09-03 | 2019-06-11 | 东莞市友辉光电科技有限公司 | Flexible base board sided exposure machine |
| CN110187608A (en) * | 2019-05-21 | 2019-08-30 | 苏州源卓光电科技有限公司 | A kind of exposure method of write-through exposure machine |
| CN211149182U (en) * | 2019-10-04 | 2020-07-31 | 苏州源卓光电科技有限公司 | Double-station exposure machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007055237A1 (en) * | 2005-11-09 | 2007-05-18 | Nikon Corporation | Exposure apparatus, exposure method and device manufacturing method |
| SG11201606935VA (en) * | 2014-02-20 | 2016-10-28 | Intevac Inc | System and method for bi-facial processing of substrates |
| TWI676227B (en) * | 2015-01-23 | 2019-11-01 | 美商應用材料股份有限公司 | Semiconductor process equipment |
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- 2021-01-25 CN CN202110097621.6A patent/CN112631087B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108873622A (en) * | 2018-07-26 | 2018-11-23 | 中山新诺科技股份有限公司 | Sided exposure machine and double-faced exposure method |
| CN208969427U (en) * | 2018-09-03 | 2019-06-11 | 东莞市友辉光电科技有限公司 | Flexible base board sided exposure machine |
| CN208752392U (en) * | 2018-09-29 | 2019-04-16 | 苏州源卓光电科技有限公司 | A kind of double-sided exposure digital laser direct write equipment |
| CN110187608A (en) * | 2019-05-21 | 2019-08-30 | 苏州源卓光电科技有限公司 | A kind of exposure method of write-through exposure machine |
| CN211149182U (en) * | 2019-10-04 | 2020-07-31 | 苏州源卓光电科技有限公司 | Double-station exposure machine |
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| CN112631087A (en) | 2021-04-09 |
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Address after: 215026 Room 102, building C5, No. 192, Tinglan lane, Suzhou Industrial Park, Jiangsu Province Patentee after: Yuanzhuo Micro Nano Technology (Suzhou) Co.,Ltd. Address before: 215026 Room 102, building C5, No. 192, Tinglan lane, Suzhou Industrial Park, Jiangsu Province Patentee before: ADVANCED MICRO OPTICS.INC |