CN114019768A - Double-gantry photoetching machine and processing method thereof - Google Patents
Double-gantry photoetching machine and processing method thereof Download PDFInfo
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- CN114019768A CN114019768A CN202111503155.3A CN202111503155A CN114019768A CN 114019768 A CN114019768 A CN 114019768A CN 202111503155 A CN202111503155 A CN 202111503155A CN 114019768 A CN114019768 A CN 114019768A
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- photoetching
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a double-gantry photoetching machine and a processing method thereof, relating to the technical field of optical processing, and comprising a base, double gantries, an optical mechanism, an alignment mechanism and a worktable mechanism, wherein the optical mechanism and the alignment mechanism are connected to the double gantries; the optical mechanism comprises a photoetching lens, a photoetching lens and a lens moving plate; the alignment mechanism comprises an alignment camera; the worktable mechanism comprises an upper worktable and a lower worktable, a screw rod lifting mechanism is arranged on the upper worktable, and the upper worktable vertically lifts the table top through the screw rod lifting mechanism; the lower workbench is provided with an inclined block lifting mechanism, and the lower workbench vertically lifts the table top through the inclined block lifting mechanism; the upper workbench vertically lifts the table top through the lead screw lifting mechanism, the lower workbench vertically lifts the table top through the inclined block lifting mechanism, and the lead screw lifting mechanism is simple in structure, low in weight and small in occupied space; the invention improves the working efficiency through the close fit of the upper working table and the lower working table, and is not easy to generate errors.
Description
Technical Field
The invention relates to the technical field of optical processing, in particular to a double-gantry photoetching machine and a processing method thereof.
Background
Optical processing is widely used in the field of semiconductor and PCB production, is an important processing method for manufacturing products such as semiconductor devices, chips, PCB boards and the like, and is used for processing photoetching characteristic patterns on the surface of a workpiece, solder resist ink of a printed circuit board, punching processing of electrical interconnection between multilayer circuit boards and the like.
For a printed circuit board, circuit patterns and solder mask ink are usually processed on two corresponding surfaces of the printed circuit board, the traditional lithography technology needs to make a master mask or a film negative film of a mask for exposure operation, the manufacturing period is long, and each plate corresponds to a single pattern and cannot be widely applied. The existing direct-writing photoetching mechanism adopts two working tables to process double faces, usually one working table is adopted to process the front face of a printed circuit board, the other working table is utilized to process the back face of the printed circuit board, and double-face processing is completed through the two working tables. The inclined block lifting mechanism of the existing photoetching machine has the disadvantages of complex structure, high weight, large occupied space and high cost.
Disclosure of Invention
The invention aims to provide a double-gantry photoetching machine and a processing method thereof, which have the advantages of difficult error generation, more stable working operation and improved production efficiency and solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a double-gantry photoetching machine comprises a base, double gantries, an optical mechanism, an alignment mechanism and a worktable mechanism, wherein the double gantries are connected to the top side of the base;
the optical mechanism comprises a photoetching lens, the photoetching lens and a lens moving plate, the photoetching lens is connected to the lens moving plate, and the lens moving plate is connected to the double gantries;
the alignment mechanism comprises an alignment camera, and the alignment camera is arranged above the worktable mechanism and connected with the double gantry;
the worktable mechanism comprises an upper worktable and a lower worktable, both the upper worktable and the lower worktable can move on the base, the upper worktable is provided with a lead screw lifting mechanism, and the lower worktable is provided with an inclined block lifting mechanism;
as a still further scheme of the invention: the base is provided with a movable module, and the upper workbench and the lower workbench can move on the movable module.
As a still further scheme of the invention: the number of the photoetching lenses is 1, 4, 5, 6, 7, 8 or 12, the double gantries are connected with slide rails, the lens moving plate is connected on the slide rails in a sliding way, and the photoetching lenses are connected on the lens moving plate; each photoetching lens corresponds to one light path, and an imaging area is formed on the workpiece.
As a still further scheme of the invention: the two alignment cameras are arranged, a camera moving plate is connected to the side face of each alignment camera, a guide rail is connected to the side face of each camera moving plate, the camera moving plates are connected to the guide rails in a sliding mode, and the guide rails are fixed to the double gantries.
As a still further scheme of the invention: the alignment mechanism further comprises a workbench correction camera and a gantry correction camera, and the two workbench correction cameras are connected to the side face of the workbench mechanism; the two gantry correction cameras are arranged, one is connected to one end of the lens moving plate, and the other is connected to the other end of the lens moving plate.
As a still further scheme of the invention: after the upper workbench finishes photoetching, the upper workbench moves to a starting point position; after the lower workbench finishes photoetching processing, the table top is vertically lowered through the inclined block lifting mechanism and is moved to the starting point position; when the upper workbench meets the lower workbench, the height of the table top of the upper workbench is higher than that of the table top of the lower workbench.
As a still further scheme of the invention: the lifting amplitude of the inclined block lifting mechanism is larger than that of the lead screw lifting mechanism.
The processing method of the three-station double-gantry inclined block lifting type photoetching machine comprises the following steps: placing a PCB on an upper workbench, moving the upper workbench to a position below alignment cameras, performing alignment processing on the PCB, calibrating a PCB grabbing target by the two alignment cameras, moving the PCB to a position below a photoetching lens after the alignment processing, performing photoetching processing on the PCB by reciprocating, forming an imaging area on the PCB by the photoetching lens, and moving the upper workbench to a starting point position after the photoetching processing; when the upper workbench moves to the position below the alignment camera, the other PCB is placed on the lower workbench, the lower workbench moves to the position below the alignment camera, the table top is vertically lifted through the inclined block lifting mechanism, at the moment, the upper workbench moves to the position of the starting point without interference, the alignment camera performs alignment processing on the PCB, the two alignment cameras capture a target of the PCB for calibration, the PCB is moved to the position below the photoetching lens after alignment processing, the PCB is subjected to photoetching processing through reciprocating movement, the photoetching lens forms an imaging area on the PCB, and after photoetching processing, the lower workbench vertically lowers the table top through the inclined block lifting mechanism and moves to the position of the starting point.
Compared with the prior art, the invention has the beneficial effects that:
the upper workbench vertically lifts the table top through the lead screw lifting mechanism, the lower workbench vertically lifts the table top through the inclined block lifting mechanism, and the lead screw lifting mechanism is simple in structure, low in weight and small in occupied space; the invention improves the working efficiency through the close fit of the upper working table and the lower working table, and is not easy to generate errors.
Drawings
FIG. 1 is a schematic structural diagram of a lithography machine according to the present invention.
FIG. 2 is a perspective view of a lithography machine according to the present invention.
FIG. 3 is a perspective view of another embodiment of the lithography machine of the present invention.
FIG. 4 is a schematic structural diagram of a lithography machine according to the present invention, in which the number of lithography lenses is 12.
FIG. 5 is a schematic view of a lithography lens of the lithography machine according to the present invention.
The labels in the figure are:
1. a base; 2. double gantries; 3. an optical mechanism; 4. an alignment mechanism; 5. a table mechanism;
11. a moving module;
22. a slide rail;
31. a lens moving plate; 32. photoetching a lens;
41. a camera moving plate; 42. aligning a camera; 43. a guide rail; 44. a workbench calibrating camera; 45. gantry calibrating cameras;
51. an upper working table; 52. a lower working table; 53. a lead screw lifting mechanism; 54. sloping block elevating system.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, in an embodiment of the present invention, a double gantry lithography machine and a processing method thereof, referring to fig. 1-3, include a base 1, a double gantry 2, an optical mechanism 3, an alignment mechanism 4 and a worktable mechanism 5, the double gantry 2 is fixedly connected to a top side of the base 1, the optical mechanism 3 is disposed at one side of the alignment mechanism 4, the optical mechanism 3 and the alignment mechanism 4 are both connected to the double gantry 2, the worktable mechanism 5 is connected to the base 1 and disposed below the alignment mechanism 4;
the optical mechanism 3 comprises a photoetching lens 32, a photoetching lens 32 and a lens moving plate 31, wherein the photoetching lens 32 is connected to the lens moving plate 31, and the lens moving plate 31 is connected to the double gantry 2;
the alignment mechanism 4 comprises an alignment camera 42, and the alignment camera 42 is arranged above the worktable mechanism 5 and connected with the double gantries 2;
the worktable mechanism 5 comprises an upper worktable 51 and a lower worktable 52, the upper worktable 51 and the lower worktable 52 are both connected on the base 1 and can move on the base 1, a screw rod lifting mechanism 53 is arranged on the upper worktable 51, and the upper worktable 51 vertically lifts the table top through the screw rod lifting mechanism 53; the lower working table 52 is provided with an inclined block lifting mechanism 54, and the lower working table 52 vertically lifts the table top through the inclined block lifting mechanism 54;
the upper table 51 moves to the position below the alignment mechanism 4 for alignment processing, moves to the position below the optical mechanism 3 after alignment processing, moves to and fro for photoetching processing, and moves to the starting point position after photoetching processing; the lower table 52 is moved to a position below the aligning mechanism 4, and the table top is vertically raised by the lifter 54 to perform alignment processing, and after the alignment processing, the lower table 52 is moved to a position below the optical mechanism 3 to perform photolithography processing by reciprocating movement, and after the photolithography processing, the lower table 52 is vertically lowered by the lifter 54 to move to a starting position. The upper workbench 51 vertically lifts the table top through the lead screw lifting mechanism 53, the lower workbench 52 vertically lifts the table top through the inclined block lifting mechanism 54, and the lead screw lifting mechanism 53 has simple structure, low weight and small occupied space; the invention improves the working efficiency through the close fit work of the upper working table 51 and the lower working table 52, and is not easy to generate errors.
As a still further scheme of the invention: the base 1 is provided with a moving module 11, and an upper table 51 and a lower table 52 are movable on the moving module 11.
As a still further scheme of the invention: the number of the photoetching lenses 32 is 1, 4, 5, 6, 7, 8 or 12, the double gantry 2 is connected with a slide rail 22, the lens moving plate 31 is slidably connected on the slide rail 22, and the photoetching lenses 32 are connected on the lens moving plate 31; referring to fig. 5, each lithography lens 32 corresponds to one optical path to form an imaging area on the workpiece; referring to fig. 4, the number of the lithography lenses 32 of the present invention is 12.
As a still further scheme of the invention: two alignment cameras 42 are arranged, the side surface of each alignment camera 42 is connected with a camera moving plate 41, the side surface of each camera moving plate 41 is connected with a guide rail 43, each camera moving plate 41 is connected to the guide rail 43 in a sliding manner, and the guide rails 43 are fixed on the double gantries 2; the position of the alignment camera 42 can be adjusted according to the PCB size.
In a preferred embodiment of the present invention, the alignment mechanism 4 further comprises a worktable calibration camera 44 and a gantry calibration camera 45, two worktable calibration cameras 44 are provided and are connected to the side surface of the worktable mechanism 5; two gantry correction cameras 45 are arranged, one is connected to one end of the lens moving plate 31, and the other is connected to the other end of the lens moving plate 31; the table calibration camera 44 and the gantry calibration camera 45 can be used to detect whether the table mechanism 5 is tilted, and if the table mechanism 5 is tilted, the position of the alignment mechanism 4 can be adjusted, so that the alignment mechanism 4 and the table mechanism 5 are always parallel.
In a preferred embodiment of the present invention, the upper table 51 is moved to the starting position after the photolithography process is completed; after the lower working table 52 completes the photoetching process, the table top is vertically lowered through the inclined block lifting mechanism 54 and is moved to the starting point position; when the upper table 51 meets the lower table 52, the table height of the upper table 51 is higher than the table height of the lower table 52.
In a preferred embodiment of the present invention, the raising and lowering range of the slant block raising and lowering mechanism 54 is larger than that of the lead screw raising and lowering mechanism 53.
The processing method of the three-station double-gantry inclined block lifting type photoetching machine comprises the following steps: placing the PCB on an upper workbench 51, moving the upper workbench 51 to the position below the alignment cameras 42, performing alignment processing on the PCB, calibrating a PCB grabbing target by the two alignment cameras 42, namely positioning the PCB, moving the upper workbench 51 to the position below the photoetching lens 32 after the alignment processing, performing photoetching processing on the PCB by reciprocating, forming an imaging area on the PCB by the photoetching lens 32, and moving the upper workbench 51 to a starting position after the photoetching processing; when the upper workbench 51 moves to the position below the alignment camera 42, manually placing another PCB on the lower workbench 52, moving the lower workbench 52 to the position below the alignment camera 42, vertically lifting the table top through the inclined block lifting mechanism 54, moving the upper workbench 51 to the starting position without interference, aligning the PCB by the alignment camera 42, calibrating a PCB grabbing target by the two alignment cameras 42, namely positioning the PCB, after aligning, moving the lower workbench 52 to the position below the photoetching lens 32, and moving the lower workbench to and fro to perform photoetching processing on the PCB, forming an imaging area on the PCB by the photoetching lens 32, and after photoetching processing, vertically lowering the table top through the inclined block lifting mechanism 54 by the lower workbench 52 and moving the lower workbench to the starting position; after the first PCB is processed, the photoetching machine can continuously perform photoetching processing on the PCB.
The upper workbench 51 vertically lifts the table top through the lead screw lifting mechanism 53, the lower workbench 52 vertically lifts the table top through the inclined block lifting mechanism 54, and the lead screw lifting mechanism 53 has simple structure, low weight and small occupied space; the invention improves the working efficiency through the close fit work of the upper working table 51 and the lower working table 52, and is not easy to generate errors.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the invention can be made, and equivalents and modifications of some features of the invention can be made without departing from the spirit and scope of the invention.
Claims (8)
1. A double-gantry photoetching machine is characterized by comprising a base, double gantries, an optical mechanism, an alignment mechanism and a worktable mechanism, wherein the double gantries are connected to the top side of the base;
the optical mechanism comprises a photoetching lens, the photoetching lens and a lens moving plate, the photoetching lens is connected to the lens moving plate, and the lens moving plate is connected to the double gantries;
the alignment mechanism comprises an alignment camera, and the alignment camera is arranged above the worktable mechanism and connected with the double gantry;
the workbench mechanism comprises an upper workbench and a lower workbench, the upper workbench and the lower workbench can move on the base, a lead screw lifting mechanism is arranged on the upper workbench, and an inclined block lifting mechanism is arranged on the lower workbench.
2. A dual gantry lithography machine according to claim 1, wherein said base is provided with a moving module, and said upper table and said lower table are movable on said moving module.
3. The double gantry lithography machine according to claim 1, wherein the number of lithography lenses is 1, 4, 5, 6, 7, 8 or 12, the double gantry is connected with a slide rail, the lens moving plate is slidably connected to the slide rail, and the lithography lenses are connected to the lens moving plate; each photoetching lens corresponds to one light path, and an imaging area is formed on the workpiece.
4. The double gantry lithography machine according to claim 1, wherein there are two alignment cameras, a camera moving plate is connected to a side of the alignment cameras, a guide rail is connected to a side of the camera moving plate, the camera moving plate is slidably connected to the guide rail, and the guide rail is fixed to the double gantry.
5. A double gantry lithography machine according to claim 1, wherein said alignment mechanism further comprises a stage calibration camera and a gantry calibration camera, said stage calibration camera having two, both connected to the side of the stage mechanism; the two gantry correction cameras are arranged, one is connected to one end of the lens moving plate, and the other is connected to the other end of the lens moving plate.
6. The double gantry lithography machine according to claim 1, wherein said upper stage is moved to a starting position after the completion of the lithography process; after the lower workbench finishes photoetching processing, the table top is vertically lowered through the inclined block lifting mechanism and is moved to the starting point position; when the upper workbench meets the lower workbench, the height of the table top of the upper workbench is higher than that of the table top of the lower workbench.
7. A double gantry lithography machine according to claim 1, wherein said swash block elevating mechanism has an elevating range larger than said screw elevating mechanism.
8. The processing method of the three-station double-gantry-inclined-block lifting type photoetching machine according to any one of claims 1 to 7, characterized in that a PCB is placed on an upper workbench, the upper workbench moves to a position below alignment cameras and performs alignment processing on the PCB, the two alignment cameras calibrate a PCB grabbing target, after the alignment processing, the upper workbench moves to a position below a photoetching lens and performs photoetching processing on the PCB by reciprocating, the photoetching lens forms an imaging area on the PCB, and after the photoetching processing, the upper workbench moves to a starting point; when the upper workbench moves to the position below the alignment camera, the other PCB is placed on the lower workbench, the lower workbench moves to the position below the alignment camera, the table top is vertically lifted through the inclined block lifting mechanism, at the moment, the upper workbench moves to the position of the starting point without interference, the alignment camera performs alignment processing on the PCB, the two alignment cameras capture a target of the PCB for calibration, the PCB is moved to the position below the photoetching lens after alignment processing, the PCB is subjected to photoetching processing through reciprocating movement, the photoetching lens forms an imaging area on the PCB, and after photoetching processing, the lower workbench vertically lowers the table top through the inclined block lifting mechanism and moves to the position of the starting point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111503155.3A CN114019768A (en) | 2021-12-10 | 2021-12-10 | Double-gantry photoetching machine and processing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111503155.3A CN114019768A (en) | 2021-12-10 | 2021-12-10 | Double-gantry photoetching machine and processing method thereof |
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| CN114019768A true CN114019768A (en) | 2022-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111503155.3A Pending CN114019768A (en) | 2021-12-10 | 2021-12-10 | Double-gantry photoetching machine and processing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115373231A (en) * | 2022-09-30 | 2022-11-22 | 广东科视光学技术股份有限公司 | Gantry double-sided photoetching system |
-
2021
- 2021-12-10 CN CN202111503155.3A patent/CN114019768A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115373231A (en) * | 2022-09-30 | 2022-11-22 | 广东科视光学技术股份有限公司 | Gantry double-sided photoetching system |
| CN115373231B (en) * | 2022-09-30 | 2023-03-14 | 广东科视光学技术股份有限公司 | Gantry double-sided photoetching system |
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