SG11201606935VA - System and method for bi-facial processing of substrates - Google Patents

System and method for bi-facial processing of substrates

Info

Publication number
SG11201606935VA
SG11201606935VA SG11201606935VA SG11201606935VA SG11201606935VA SG 11201606935V A SG11201606935V A SG 11201606935VA SG 11201606935V A SG11201606935V A SG 11201606935VA SG 11201606935V A SG11201606935V A SG 11201606935VA SG 11201606935V A SG11201606935V A SG 11201606935VA
Authority
SG
Singapore
Prior art keywords
substrates
facial processing
facial
processing
Prior art date
Application number
SG11201606935VA
Inventor
Terry Bluck
Vinay Shah
Ian Latchford
Alexandru Riposan
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of SG11201606935VA publication Critical patent/SG11201606935VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
SG11201606935VA 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates SG11201606935VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461942594P 2014-02-20 2014-02-20
US201461943999P 2014-02-24 2014-02-24
PCT/US2015/016799 WO2015127191A1 (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates

Publications (1)

Publication Number Publication Date
SG11201606935VA true SG11201606935VA (en) 2016-10-28

Family

ID=53879007

Family Applications (3)

Application Number Title Priority Date Filing Date
SG10201807710WA SG10201807710WA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates
SG10201807691XA SG10201807691XA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates
SG11201606935VA SG11201606935VA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates

Family Applications Before (2)

Application Number Title Priority Date Filing Date
SG10201807710WA SG10201807710WA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates
SG10201807691XA SG10201807691XA (en) 2014-02-20 2015-02-20 System and method for bi-facial processing of substrates

Country Status (8)

Country Link
EP (1) EP3108030B1 (en)
JP (1) JP6522667B2 (en)
KR (1) KR102327286B1 (en)
CN (1) CN106460164B (en)
MY (1) MY181905A (en)
SG (3) SG10201807710WA (en)
TW (1) TWI696231B (en)
WO (1) WO2015127191A1 (en)

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US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
PT2852469T (en) 2012-04-26 2019-07-31 Intevac Inc System architecture for vacuum processing
SG11201700675UA (en) 2014-08-05 2017-02-27 Intevac Inc Implant masking and alignment
KR102447219B1 (en) * 2015-10-01 2022-09-23 인테벡, 인코포레이티드 Wafer plate and mask arrangement for substrate fabrication
US10453728B2 (en) 2016-11-18 2019-10-22 Applied Materials, Inc. Exchange and flip chamber design for heterojunction solar cell formation
CN211150516U (en) * 2016-12-19 2020-07-31 P2I有限公司 Device and clamping frame for fastening one or more objects in a surface modification process
DE102017106373A1 (en) * 2017-03-24 2018-09-27 Nexwafe Gmbh Process chamber guide, process chamber and method for guiding a substrate carrier to a process position
CN107245755B (en) * 2017-04-21 2019-05-21 深圳技术大学 Light assisted electrochemical etching device suitable for the synchronous experiment of Multi-example
KR102006435B1 (en) * 2017-09-01 2019-08-01 주식회사 한화 Boat device
TWI679506B (en) * 2018-09-14 2019-12-11 富揚鋼構有限公司 Planning method for turning over steel construction materials
CN108315697B (en) * 2018-01-16 2019-12-10 电子科技大学 Preparation method of double-sided biaxial texture MgO film
KR101962738B1 (en) * 2018-04-23 2019-03-27 (주)에이디엠 Sheet Separating Apparatus and Mask Manufacturing System Having The Same
WO2019205351A1 (en) * 2018-04-24 2019-10-31 君泰创新（北京）科技有限公司 Double-sided coating apparatus and carrier plate processing unit thereof
CN108766916A (en) * 2018-04-28 2018-11-06 东莞帕萨电子装备有限公司 Ion implanting runs sheet devices and ion implanting runs piece method
KR102444830B1 (en) * 2018-05-29 2022-09-16 어플라이드 머티어리얼스, 인코포레이티드 Methods for handling masks in a vacuum system and vacuum system
KR102549429B1 (en) * 2018-05-31 2023-06-28 어플라이드 머티어리얼스, 인코포레이티드 Multi-Substrate Processing on Digital Lithography Systems
CN110600412A (en) * 2018-06-12 2019-12-20 君泰创新（北京）科技有限公司 Positioning transmission mechanism and positioning transmission production system
US11414748B2 (en) * 2019-09-25 2022-08-16 Intevac, Inc. System with dual-motion substrate carriers
TWI693871B (en) * 2019-01-29 2020-05-11 友威科技股份有限公司 Vertical continuous etching machine
KR20210141698A (en) 2019-03-27 2021-11-23 야스카와 유럽 테크놀로지 엘티디. semiconductor flipper
KR20210081794A (en) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 Rotation driving apparatus, film-forming system including the same, manufacturing method of electronic device and carrier for carrying subjectto be carried used in the film-forming apparatus
KR102593602B1 (en) * 2021-01-06 2023-10-23 한화솔루션 주식회사 Wafer boat and plate for wafer boat
CN112631087B (en) * 2021-01-25 2022-04-22 苏州源卓光电科技有限公司 Double-face processing system and processing method
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Also Published As

Publication number Publication date
CN106460164A (en) 2017-02-22
KR102327286B1 (en) 2021-11-16
MY181905A (en) 2021-01-13
JP6522667B2 (en) 2019-05-29
SG10201807691XA (en) 2018-10-30
KR20160137989A (en) 2016-12-02
TW201541546A (en) 2015-11-01
CN106460164B (en) 2019-02-22
TWI696231B (en) 2020-06-11
WO2015127191A1 (en) 2015-08-27
EP3108030A4 (en) 2017-08-23
EP3108030B1 (en) 2018-09-12
JP2017512386A (en) 2017-05-18
EP3108030A1 (en) 2016-12-28
SG10201807710WA (en) 2018-10-30

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