KR20210081794A - Rotation driving apparatus, film-forming system including the same, manufacturing method of electronic device and carrier for carrying subjectto be carried used in the film-forming apparatus - Google Patents

Abstract

The present invention relates to a rotation driving device for rotating a carrier for a subject to be transported. According to the present invention, the rotation driving device comprises: a carrier mounting unit on which a carrier for a subject to be transported is placed; a rotating mechanism for rotating the carrier mounting unit; and an alignment mechanism for adjusting a relative position between the carrier for a subject to be transported and the subject to be transported mounted on the carrier. The alignment mechanism includes a stage part movable in a direction parallel to a substrate holding surface of the carrier for a subject to be transported, and the stage part is installed in the carrier mounting unit.

Description

Rotary drive device, film forming system including same, electronic device manufacturing method, and carrier used in film forming system TECHNICAL FIELD USED IN THE FILM-FORMING APPARATUS}

BACKGROUND OF THE INVENTION Field of the Invention [0001] The present invention relates to a rotation drive device and a carrier to be transported used for rotating a substrate in a film forming system for forming a film on a substrate.

In the manufacture of an organic EL display device (organic EL display), when forming an organic light emitting element (organic EL element; OLED) constituting an organic EL display device, the deposition material evaporated from the evaporation source of the film forming apparatus is used for forming a pixel pattern By forming a film on the substrate through a mask, an organic material layer or a metal layer is formed.

Such a film forming apparatus or a film forming system including the same includes a so-called cluster type and an inline type.

In a cluster type film forming system, a plurality of film forming chambers in which a film is formed on a substrate are arranged in a cluster shape around a transfer chamber in which a transfer robot is installed, and the substrate is sequentially transferred to each film forming chamber by the transfer robot to form a film. A plurality of layers constituting the light emitting element is formed.

On the other hand, in an in-line type film forming system, a carrier carrier on which a substrate for film forming is mounted is formed while being conveyed by a roller type or magnetic levitation type conveying mechanism to a plurality of film forming chambers arranged in a line shape.

The inline type film forming system has a first conveyance path including a loading unit into which a substrate is loaded, a film forming unit in which a film is formed on a substrate mounted on a conveyance carrier, and an unloading unit for unloading the substrate. The in-line type film forming system also has a second conveying path for collecting empty conveying carriers.

In the in-line type film-forming system, a substrate is carried in from the outside of the film-forming system into the loading part of a 1st conveyance path. The carried-in board|substrate is mounted by a robot in the state which the film-forming surface turned upward on the upper surface of the empty conveyance carrier from a 2nd conveyance path. The transport carrier adsorbs and holds the substrate. The substrate held by the carrier carrier is turned upside down while the carrier carrier is there, and the substrate is transferred to the film forming unit with the film forming surface facing downward. In the film forming unit, film formation is performed while the substrate is conveyed through a mask fixedly arranged in the film forming unit by a film forming source disposed below the substrate.

After completion of film formation, the conveyance carrier conveyed to the unloading chamber is inverted again, and conveyed to the 2nd conveyance path with the film-forming surface of a board|substrate facing upward. The conveyance carrier moved to the 2nd conveyance path eliminates holding|maintenance of a board|substrate. Then, only the board|substrate is conveyed to the discharge chamber by the conveyance robot, and it is conveyed out of the film-forming system. The empty conveyance carrier in which the holding|maintenance of the board|substrate is eliminated is conveyed along the 2nd conveyance path, and it returns to the position corresponding to the loading part of the 1st conveyance path, and is used for holding|maintenance of a new board|substrate.

Patent Document 1 (Public Utility Model Publication No. 20-2019-0000162) discloses a configuration in which the carrier carrier is inverted after the substrate is held by the carrier carrier in the inversion chamber of the in-line type film forming system.

Public Utility Model No. 20-2019-0000162

In a configuration in which a substrate is placed and sucked on a transfer carrier in the inversion chamber, the substrate may be placed at a position deviated from the reference position on the transfer carrier due to a transfer error of a transfer robot that transfers the substrate to the substrate mounting surface of the transfer carrier.

However, Patent Document 1 does not disclose an alignment mechanism for adjusting the position of the substrate when the substrate is placed in an incorrect position on the carrier carrier due to such a transfer error of the substrate.

In addition, when an alignment mechanism for adjusting the placement position of the substrate is provided in the inversion chamber, the alignment mechanism needs to be configured to be compatible with the inversion of the carrier, so that the configuration of the inversion chamber including the alignment mechanism becomes complicated. can

An object of the present invention is to provide a rotational drive device that enables position adjustment (alignment) of a substrate in an inversion chamber, a film forming system including the same, an electronic device manufacturing method, and a carrier to be used in the film forming system. do.

A rotation drive device according to a first aspect of the present invention is a rotation drive device for rotating a carrier, comprising: a carrier mounting unit on which a carrier carrier is mounted; a rotation mechanism for rotating the carrier mounting unit; and an alignment mechanism for adjusting a relative position between a carrier carrier and an object mounted on the carrier, wherein the alignment mechanism moves in a direction parallel to the substrate holding surface of the carrier. It includes a possible stage part, wherein the stage part is characterized in that it is installed in the carrier mounting part.

A film forming system according to a second aspect of the present invention is characterized by including a film forming apparatus for forming a film on a substrate, and a rotational driving device according to the first aspect of the present invention.

An electronic device manufacturing method according to a third aspect of the present invention is characterized in that the electronic device is manufactured using the film forming system according to the second aspect of the present invention.

A transport target carrier according to a fourth aspect of the present invention is a transport target carrier used in a film forming system including the rotation drive device according to the first aspect of the invention, and corresponds to a substrate receiving portion of the rotation drive device. It is characterized in that a through hole through which the substrate receiving part is inserted into the position is installed.

According to the present invention, it is possible to mount the alignment mechanism in the inversion chamber.

1 is a conceptual diagram showing a film forming system of an organic EL display device.
Fig. 2A is a schematic cross-sectional view of a rotation drive device according to an embodiment of the present invention, and Fig. 2B is a schematic top view of the rotation drive device.
3 : is a figure which shows the carrying-in of the board|substrate and alignment operation|movement by the rotation drive apparatus which concerns on one Embodiment of this invention.
4 is a view showing an operation of inverting the substrate by the rotation driving device according to the embodiment of the present invention.
5 : is a figure which shows the additional carrying-in operation|movement of the board|substrate by the rotation drive apparatus which concerns on one Embodiment of this invention.
6 : is a schematic diagram which shows an electronic device.

EMBODIMENT OF THE INVENTION Preferred embodiment of this invention is described below, referring drawings. However, the dimensions, materials, shapes and their relative arrangement of the components described below, or the hardware configuration and software configuration of the device, processing flow, manufacturing conditions, etc. may be appropriately determined depending on the configuration and various conditions of the device to which the invention is applied. It is subject to change and is not intended to limit the scope of the present invention to the embodiments described below. In addition, in principle, the same reference numerals are assigned to the same components, and descriptions thereof are omitted.

INDUSTRIAL APPLICABILITY The present invention is suitable for a film forming system that forms a film on a film forming target by evaporation, and typically forms a film by depositing an organic material and/or a metallic material on a substrate to form an organic EL panel. can be applied to the system. The material of the substrate as the film forming object may be a material that can be chucked, and materials other than glass, such as a polymer film, metal, silicon, and the like can be selected. The board|substrate may be the board|substrate or silicon wafer by which films, such as polyimide, were laminated|stacked on the glass substrate, for example. As a film-forming material, you may select a metallic material (metal, a metal oxide, etc.) other than an organic material.

<The overall configuration of the film forming system>

1 : is a conceptual diagram which shows the whole structure of the film-forming system 100 of an organic electroluminescent display. Schematically, the film-forming system 100 includes a film-forming process conveyance path 100a and a return conveyance path 100b, and the mask M between the film-forming process conveyance path 100a and the return conveyance path 100b. and a mask recovery transport path 100c, a carrier recovery transport path 100d, a mask supply transport path 100e, and a carrier supply transport path 100f for recovering and supplying the transport carrier C, thereby circulating Construct a mold return path.

The film formation system 100 includes each component constituting the circulation type transport path, for example, a substrate loading/reversing chamber 101 , an alignment chamber 103 , a film formation chamber 105 , a mask separation chamber 107 , and a substrate inversion chamber. /Contains the discharge chamber (109).

In the film-forming system 100 which concerns on this embodiment, the board|substrate G is carried in from the outside in the conveyance direction (arrow A), and the board|substrate G and the mask M are positioned and held on the conveyance carrier C. After being supported and film-forming process is performed with respect to the board|substrate G while the conveyance carrier C moves on the film-forming process process conveyance path 100a, the film-forming board|substrate G is discharged|emitted. In the return conveyance path 100b, the mask M separated from the conveyance carrier C after film-forming process completion, and the empty conveyance carrier C after discharge|emission of the film-forming board|substrate G return to the board|substrate carrying-in position side.

Hereinafter, with reference to FIG. 1 , operations and processing in the components included in the film forming system 100 will be described in more detail.

In the film-forming processing process conveyance path 100a of the film-forming system 100, first, the board|substrate G is carried in from the outside into the board|substrate carrying-in/inversion chamber 101, and is held on the conveyance carrier C, and the conveyance carrier ( C) is inverted (flipped) up and down together with

That is, from an external substrate stocker (not shown), the substrate G is loaded into the substrate loading/reversing chamber 101 on the film-forming process transport path 100a, and on the empty transport carrier C that was loaded earlier. At a predetermined holding position, it is chucked by a substrate chucking means (eg, an electrostatic chuck or an adhesive chuck). At this time, the conveyance carrier C is in the attitude|position with the board|substrate holding surface or the board|substrate chucking surface facing upward. The board|substrate G is carried in above the board|substrate chucking surface by a transfer robot (not shown), and is mounted on the board|substrate chucking surface.

Next, the transfer carrier C holding the substrate G is vertically inverted (flipped) by the rotation drive device 200 (refer to FIG. 2 ) of the substrate carrying-in/inversion chamber 101 . For example, the rotation drive device 200 rotates the conveyance carrier C holding the board|substrate G 180 degrees with respect to the advancing direction A. As shown in FIG. Thereby, the vertical relationship between the transport carrier C and the substrate G is reversed, the substrate G becomes the lower side of the chucking surface of the transport carrier C, and the film formation surface of the substrate G faces downward. do.

In the rotation driving apparatus 200 according to the embodiment of the present invention, before the substrate G carried into the substrate carrying-in/inversion chamber 101 is inverted, as will be described later, the substrate G is transferred to the transfer carrier C. ) includes an alignment mechanism for adjusting the position to be placed on.

The inverted conveyance carrier C is conveyed to the alignment chamber 103 by a roller conveyance or a magnetic levitation conveyance method, and the relative position with the mask M is adjusted.

In the alignment chamber 103 , the transfer carrier 302 is held in a state in which the substrate G held by the substrate chucking means faces downward.

The mask M carried into the alignment chamber 103 by a route different from the conveyance carrier C (mask supply conveyance path 100e) is mounted on the mask tray (not shown) provided below the conveyance carrier C. . The mask M approaches the board|substrate G hold|maintained by the conveyance carrier C by raising of a mask tray, and when it becomes a predetermined approach distance (measuring position), it is attached to the board|substrate G and the mask M. An alignment operation is performed with respect to each other.

In alignment operation|movement, the alignment mark previously formed in the board|substrate G and the mask M is imaged with an alignment camera, and both position shift amount and direction are measured.

Based on the measured position shift amount and direction, position adjustment (alignment) is performed by moving the position of the conveyance carrier C finely with the conveyance drive system (for example, a magnetic levitation conveyance system) of the conveyance carrier C. When the amount of relative positional shift between the substrate G and the mask M falls within a predetermined threshold, the mask M is pulled by the magnetic force applying means (not shown) provided on the transport carrier C, and the transport carrier C is held on

Alignment is completed, and the conveyance carrier C discharged|emitted from the alignment chamber 103 is carried in into the film-forming chamber 105. As shown in FIG.

In the film formation chamber 105 , the organic EL light emitting material is evaporated from an evaporation source disposed below the film formation chamber 105 while moving the carrier C holding the substrate G and the mask M at a predetermined speed. and vacuum film formation on the upper substrate G. In this embodiment, although the structure in which the film-forming process is performed while the mask M is conveyed with the board|substrate G held by the conveyance carrier C is demonstrated, this invention is not limited to this, The mask ( M) may be provided in each deposition chamber.

The conveyance carrier C discharged|emitted from the film-forming chamber 105 after completing a film-forming process is conveyed to the mask separation chamber 107, and the mask M is isolate|separated downward from the conveyance carrier C. As shown in FIG. The mask M separated from the conveyance carrier C and descended is conveyed from the mask separation chamber 107 to the return conveyance path 100b along the mask recovery conveyance path 100c.

Then, when the empty transport carrier C after discharging the substrate, which will be described later, moves to the mask receiving position on the return transport path 100b, the mask M is again held by the magnetic force applying means of the transport carrier C. Thus, the conveyance carrier C holding only the mask M is conveyed along the return conveyance path 100b to the mask supply conveyance path 100e side.

On the other hand, the transport carrier C, which has been separated from the mask M in the mask separation chamber 107, moves to the substrate inversion/discharge chamber 109 while holding only the substrate G. In the substrate reversing/discharging chamber 109, a rotation driving device (not shown) rotates the conveying carrier C 180 degrees in the traveling direction. Thereby, the film-forming surface of the board|substrate G turns upward. In the present embodiment, the rotation driving device in the substrate inversion/discharging chamber 109 does not include an alignment mechanism, unlike the rotation driving device 200 in the substrate loading/inversion chamber 101 .

Next, the substrate G is unchucked from the transport carrier C, and the substrate G is transported to the next step by a discharging mechanism (not shown).

The conveyance carrier C which became empty by discharging the board|substrate G from the board|substrate inversion/discharge chamber 109 is conveyed along the carrier recovery conveyance path 100d to the starting position of the return conveyance path 100b.

The empty conveyance carrier C returns to the board|substrate carrying-in/inversion chamber 101 side along the return conveyance path 100b. At this time, the empty conveyance carrier C receives the mask M conveyed from the mask collection|recovery conveyance path 100c to the return conveyance path 100b as mentioned above.

The conveyance carrier C conveyed along the return conveyance path 100b is separated again from the mask M in the mask supply conveyance path 100e, and the separated mask M is a film-forming process conveyance path 100a. It is transported to the mask mounting position on the top.

The empty conveyance carrier C after the mask M is removed in the carrier supply conveyance path 100f is conveyed from the return conveyance path 100b to the board|substrate carrying-in and inversion position which is the starting position of the film-forming process conveyance path 100a. do.

Thereby, the film-forming system 100 which concerns on one Embodiment of this invention forms a circulation type conveyance path.

<Rotational drive device in the board loading/reversing room>

FIG. 2A is a schematic cross-sectional view of the rotation driving device 200 installed in the substrate carrying-in/inversion chamber 101 according to an embodiment of the present invention, and FIG. 2B is a schematic top view of the rotation driving device 200 .

The rotation drive apparatus 200 which concerns on one Embodiment of this invention rotates the carrier mounting table 201 (carrier mounting part) on which the conveyance carrier C is mounted, and the carrier mounting table 201, rotation for inverting up and down The mechanism 203 and the alignment mechanism 205 for adjusting the relative position of the carrier mounting table 201 and the board|substrate G are included.

The carrier mounting table 201 is a member on which the empty conveyance carrier C carried in to the board|substrate carrying-in/inversion chamber 101 along the carrier supply conveyance path 100f is mounted. The carrier mounting table 201 which concerns on this embodiment has a structure which can mount the conveyance carrier C on the two main surfaces which oppose the carrier mounting table 201, as shown to FIG. 2A. That is, the carrier mounting table 201 has the 1st carrier mounting surface 201a and the 2nd carrier mounting surface 201b.

The carrier mounting table 201 has carrier fixing means (not shown) for fixing the conveyance carrier C to the 1st carrier mounting surface 201a and the 2nd carrier mounting surface 201b, respectively. The carrier fixing means (the first carrier fixing means and the second carrier fixing means) respectively installed on both mounting surfaces of the carrier mounting table 201 may include, for example, clamping means.

Through this configuration, after inverting the transport carrier C mounted and fixed on the first carrier mounting surface 201a of the carrier mounting table 201 (the first carrier mounting surface 201a is directed downward, Even if the 2nd carrier mounting surface 201b does not return to an original position again, the 2nd carrier mounting surface 201b will face upward), the new conveyance carrier C can be mounted on the 2nd carrier mounting surface 201b. . Through this, it is possible to shorten the process time (Tact Time).

The rotation mechanism 203 is a mechanism for rotating the carrier mounting table 201 by 180 degrees to invert up and down. The rotation mechanism 203 of the rotation drive device 200 according to the present embodiment includes a support portion 213 for supporting the central portions of two opposing sides of the carrier mounting table 201 and a rotation drive portion for applying a rotation driving force (not shown). city) is included.

The alignment mechanism 205 is a mechanism for adjusting the mounting position of the board|substrate G chucked by the board|substrate chucking means on the conveyance carrier C before the carrier mounting table 201 is vertically inverted.

As described above, in the substrate loading/reversing chamber 101 , the substrate G as a transport target is loaded from an external substrate stocker by a transport robot, loaded in advance, and the first carrier material of the carrier mounting table 201 . It is mounted on the chucking surface of the conveying carrier C mounted on the tooth surface 201a or the second carrier mounting surface 201b, but due to the conveying error of the conveying robot, the substrate G is placed on the chucking surface of the conveying carrier C. It may not be placed at the reference position, but may be placed at a position deviated therefrom.

According to one embodiment of the present invention, an alignment mechanism 205 capable of adjusting the placement position of the substrate G relative to the reference position on the chucking surface of the transfer carrier C is provided in the substrate loading/reversing chamber 101 . By providing, it is possible to reduce the position of the substrate G shifted due to the conveyance error, thereby improving the precision of the subsequent film forming process.

For this purpose, the alignment mechanism 205 includes a substrate receiving unit 221 for temporarily receiving the substrate G, and a direction parallel to the chucking surface (substrate holding surface) (eg, chucking the substrate receiving unit 221 ). Stage part for moving in at least one of a first direction parallel to the king surface, a second direction parallel to the chucking surface and intersecting the first direction, and a rotation direction about a third direction perpendicular to the chucking surface) 223 and the camera part 225 for imaging the alignment mark formed in the board|substrate G and the conveyance carrier C are included.

The substrate receiving unit 221 is a pin-shaped member for temporarily receiving the substrate G loaded into the substrate loading/reversing chamber 101 from the hand of the transport robot, and includes a first carrier mounting surface 201a or a second 2 Installed so as to be movable in the direction (third direction) perpendicular to the carrier mounting surface 201b or the chucking surface (substrate holding surface) of the conveying carrier C (eg, to be able to move up and down in the Z direction in FIG. 2A ) do. As will be described later, the receiving unit driving unit for elevating the substrate receiving unit 221 is mounted on the stage 223 and includes a servo motor and a ball screw or a linear guide.

The board|substrate receiving part 221, when receiving the board|substrate G to be hold|maintained by the conveyance carrier C mounted on the 1st carrier mounting surface 201a, the through-hole 250 provided in the conveyance carrier C, It rises in the +Z direction, protrudes from the chucking surface of the conveyance carrier C, and receives the board|substrate G from the conveyance robot. Next, as will be described later, in the direction parallel to the chucking surface (substrate holding surface) of the transport carrier C, the relative position of the substrate G and the transport carrier C placed on the substrate receiving unit 221 . Adjustment is made. Upon completion of the position adjustment, the substrate receiving unit 221 descends in the -Z direction to place the substrate G on the chucking surface of the transport carrier C. As shown in FIG.

Similarly, when the conveyance carrier C is mounted on the 2nd carrier mounting surface 201b (that is, when the carrier mounting table 201 is inverted), the board|substrate receiving part 221 is a 2nd carrier mounting surface. It moves to the (201b) side, it protrudes on the chucking surface of the conveyance carrier C mounted on the 2nd carrier mounting surface 201b, and receives the board|substrate G.

Thus, the board|substrate receiving part 221 of this embodiment protrudes from the chucking surface of the conveyance carrier C mounted on each mounting surface in the direction perpendicular|vertical to the 1st carrier mounting surface 201a and the 2nd carrier mounting surface 201b. By making it possible, the structure of the board|substrate receiving part 221 can be simplified.

The board|substrate receiving part 221 is provided so that it can support multiple places of the board|substrate G. As shown in FIG. For example, as shown in FIG. 2B, the board|substrate receiving part 221 is the periphery of the 1st carrier mounting surface 201a or the 2nd carrier mounting surface 201b (Therefore, the periphery of the chucking surface of the conveyance carrier C) Alternatively, a plurality of pieces may be installed along the periphery of the substrate (G).

Through this, the enlarged substrate G can be supported more stably. In addition, when the peripheral portion of the substrate G is supported by the plurality of substrate receiving portions 221 , the central portion of the substrate G is sagged downward by its own weight, and the transport carrier according to the descent of the substrate receiving portion 221 . Since the chucking surface of (C) is sequentially contacted from the central portion to the peripheral portion of the substrate G, it is possible to suppress the remaining wrinkles on the substrate G at the time of chucking by the substrate chucking means.

However, the present invention is not limited thereto, and the substrate receiving unit 221 may be installed at a position capable of supporting the central portion of the substrate G in order to reduce sagging of the substrate G. This is because the substrate G placed on the transfer carrier C in the substrate loading/reversing chamber 101 has the film-forming surface facing upward, and the substrate receiving part 221 is opposite to the film-forming surface of the substrate G. because it supports the sides.

In addition, the board|substrate receiving part 221 may be comprised so that it can descend|fall sequentially from one long side side of the board|substrate G toward the other long side side opposite to it. That is, the plurality of substrate receiving units 221 may be configured to be able to move up and down independently of each other.

As shown in FIG. 2B , the transport carrier C as a transport target carrier used in the film forming system 100 according to the embodiment of the present invention allows the substrate receiving part 221 to be inserted and penetrated, It has a plurality of through-holes 250 provided at the periphery of the chucking surface. The through hole 250 is formed so as to allow movement of the substrate receiving unit 221 when the position of the substrate G placed on the substrate receiving unit 221 with respect to the conveying carrier C is adjusted. It is formed to have a diameter larger than the cross-sectional diameter of the substrate receiving portion 221 in a direction parallel to the chucking surface (substrate holding surface) of (C) or in a radial direction of the through hole 250 .

The stage 223 of the alignment mechanism 205 moves the substrate G supported by the substrate receiving unit 221 in a direction parallel to the chucking surface of the carrier C with respect to the carrier C (X direction, A member for moving in at least one of the Y-direction and the rotational direction about the Z-axis (also referred to as the XYθ direction). To this end, the stage unit 223 includes, for example, two servo motors (not shown) and a ball screw (not shown) for respectively moving the stage plate (not shown) and the stage plate in the +X direction and the -X direction; , including two servo motors (not shown) and a ball screw (not shown) for moving in the +Y direction and the -Y direction, respectively. A substrate receiving unit 221 and a receiving unit driving unit (not shown) for driving the substrate receiving unit 221 in the Z direction are mounted on the stage plate of the stage unit 223 .

By moving the stage plate in the XYθ direction by the servo motor and the ball screw, the substrate receiving unit 221 mounted on the stage plate and the substrate G supported thereon are moved relative to the carrier carrier C in the XYθ direction. It is possible to adjust the relative position of the substrate (G) and the carrier carrier (C).

In particular, according to the present embodiment, the stage portion 223 of the alignment mechanism 205 is provided in the carrier mounting table 201 . Thereby, it can suppress that the alignment mechanism which adjusts the relative position between the board|substrate G and the conveyance carrier C in the rotation drive apparatus 200 which performs the up-down inversion process of the conveyance carrier C becomes complicated. .

Conventional alignment mechanisms generally have a structure in which a stage portion is provided outside a chamber, and a substrate holder holding a substrate is connected to the stage portion by a shaft to transmit the driving force of the stage portion to the substrate holder. However, when the alignment mechanism of the conventional structure is applied to the board|substrate carrying-in/inversion chamber 101 in which the conveyance carrier C is inverted, the alignment mechanism becomes very complicated.

In this embodiment, the configuration in which the carrier mounting table 201 is inverted by providing the stage portion 223 of the alignment mechanism 205 in the carrier mounting table 201 rather than outside the substrate loading/reversing chamber 101 Also in this, the alignment mechanism can be implemented as a simple structure.

The camera part 225 is an optical means for imaging the alignment mark of the board|substrate G and the conveyance carrier C. As shown in FIG. The camera unit 225 images the alignment mark of the substrate G supported by the substrate receiving unit 221 and the alignment mark of the transport carrier C, and based on this image (eg, by image processing), the substrate ( The degree and the direction in which G) deviates from the reference position on the chucking surface of the conveyance carrier C are measured.

When the substrate G is deviated from the reference position of the carrier carrier C by more than a predetermined threshold, based on the shift amount, the stage 223 on which the substrate receiving unit 221 is mounted is driven in the XYθ direction. , adjust the relative position of the substrate G and the carrier carrier C.

The camera unit 225 is provided outside the upper surface of the housing 280 of the substrate carrying-in/inversion chamber 101 as shown in FIG. 2A . A transparent window is provided in a portion of the housing 280 corresponding to the position of the camera unit 225 , and the alignment mark of the substrate G and the carrier carrier C in the housing 280 is imaged by the camera unit 225 . can However, the present invention is not limited thereto, and the camera unit 225 may be installed outside the bottom surface of the housing 280 .

<Substrate loading/reversing process>

3 shows the loading and alignment of the substrate by the rotation driving device 200 according to the embodiment of the present invention.

As shown in Fig. 3(a), an empty conveyance carrier C is carried into the substrate loading/reversing chamber 101, and on the carrier mounting table 201, for example, on the first carrier mounting surface 201a. it is witty

When the conveyance carrier C is mounted on the 1st carrier mounting surface 201a, as shown in FIG.3(b), the board|substrate receiving part 221 is the 1st carrier mounting surface 201a by a receiving part driving part. It moves to the side (eg, rises), and protrudes from the chucking surface of the conveyance carrier C through the through hole 250 of the conveyance carrier C. At this time, the height at which the substrate receiving part 221 protrudes is such that the hand of the transport robot does not interfere with the chucking surface of the transport carrier C when the substrate G is placed on the substrate receiving part 221 . It is preferable to be

A substrate G as a transport target is loaded into the substrate loading/reversing chamber 101 by a transport robot from an external stocker, and placed on the substrate receiving unit 221 . At this time, the board|substrate G is mounted on the board|substrate receiving part 221 so that the film-forming surface may face upward.

Next, as shown in FIG. 3C , the substrate receiving unit 221 descends, and the distance between the substrate G supported by the substrate receiving unit 221 and the chucking surface of the carrier C is set to a predetermined value. When the measurement distance of , the alignment mark of the substrate G and the carrier C is imaged by the camera unit 225, and the relative positional shift amount and shift direction in the XYθ direction are measured based on this image. do. However, the present invention is not limited thereto, and the displacement of the relative position may be measured at the height at which the substrate G is received without lowering the substrate receiving unit 221 . That is, the height at which the substrate receiving unit 221 receives the substrate G may be the measured height.

When the relative positional displacement amount is larger than a predetermined threshold, the stage portion 223 of the alignment mechanism 205 is moved based on the measured relative positional displacement amount and the displacement direction, and the substrate mounted on the stage plate of the stage portion 223 . By moving the receiving part 221, the position of the board|substrate G with respect to the conveyance carrier C is adjusted. This process is repeated until the amount of relative positional shift between the substrate G and the carrier carrier C falls within a predetermined threshold.

When the amount of relative positional shift between the substrate G and the transfer carrier C falls within a predetermined threshold, the substrate receiving unit 221 is lowered to transport the substrate G as shown in Fig. 3(d). It mounts on the chucking surface of the carrier C, and chucks by the board|substrate chucking means of the conveyance carrier C. In order to more reliably prevent the substrate G from being separated from the carrier carrier C in the inversion processing operation to be described later, the substrate G is held onto the carrier carrier C by another clamping means in addition to the substrate chucking means. It can be additionally fixed.

4 is a diagram illustrating an operation of inversion processing of a substrate by the rotation driving device 200 according to an embodiment of the present invention.

When the substrate G is chucked and fixed to the chucking surface of the conveyance carrier C, the rotation mechanism 203 in a state in which the conveyance carrier C is fixed to the carrier mounting table 201 by a carrier fixing means (not shown). ), the carrier mounting table 201 rotates 180 degrees to invert up and down.

Thereby, the vertical relationship of the conveyance carrier C and the board|substrate G is inverted, and the film-forming surface of the board|substrate G turns downward.

Thus, according to this embodiment, since the stage part 223 of the alignment mechanism 205 of the board|substrate carrying-in/inversion chamber 101 is provided in the carrier mounting table 201, the board|substrate on which inversion of the board|substrate G is performed. The alignment mechanism in the carry-in/reverse chamber 101 becomes feasible. Furthermore, the alignment mechanism can be implemented with a much simpler structure compared to the case where the stage part of the alignment mechanism is installed outside the substrate carrying-in/inversion chamber 101 .

Fig. 5 shows an additional loading operation of the substrate by the rotation drive device 200 according to the embodiment of the present invention.

When the inversion process of the substrate G is completed, the fixing is released by the carrier fixing means, and the transfer carrier C is carried out from the substrate loading/reversing chamber 101 with the substrate G facing downward, and is an alignment chamber. It is returned to (103).

Next, another empty conveyance carrier C' is carried in into the board|substrate carrying-in/inversion chamber 101, and it is mounted on the 2nd carrier mounting surface 201b of the carrier mounting table 201 facing upward. In the rotary drive device 200 according to an embodiment of the present invention, since the carrier mounting table 201 has two mounting surfaces opposite to each other, in order to place a new empty conveyance carrier C', the carrier mounting table ( Without having to rotate 201 again by 180 degrees to return to the original position, a new empty conveyance carrier C' can be received immediately in the state in which the previously reversed conveyance carrier C has been unloaded. Thereby, the tact time of the whole process can be reduced.

When the conveyance carrier C' is mounted on the 2nd carrier mounting surface 201b of the carrier mounting table 201, through the operation|movement similar to the operation|movement shown to FIG.3(b)-(d), the conveyance carrier C A new substrate G' positioned on the chucking surface of ') is chucked and held, and inversion processing is performed similarly to that shown in FIG.

<Method for manufacturing electronic device>

Next, an example of the manufacturing method of the electronic device using the film-forming system of this embodiment is demonstrated. Hereinafter, the structure and manufacturing method of an organic electroluminescent display are illustrated as an example of an electronic device.

First, an organic EL display device to be manufactured will be described. Fig. 6(a) is an overall view of the organic EL display device 60, and Fig. 6(b) is a cross-sectional structure of one pixel.

As shown in FIG. 6A , in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix form. Although details will be described later, each of the light emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel here refers to the minimum unit which enables the display of a desired color in the display area 61. As shown in FIG. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit light different from each other. has been The pixel 62 is often composed of a combination of a red light emitting device, a green light emitting device, and a blue light emitting device, but may be a combination of a yellow light emitting device, a cyan light emitting device, and a white light emitting device. no.

Fig. 6(b) is a schematic partial cross-sectional view taken along line A-B of Fig. 6(a). The pixel 62 has an organic EL device having an anode 64 , a hole transport layer 65 , light emitting layers 66R, 66G, and 66B, an electron transport layer 67 , and a cathode 68 on a substrate 63 . . Among them, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In this embodiment, the light emitting layer 66R is an organic EL layer emitting red light, the light emitting layer 66G is an organic EL layer emitting green color, and the light emitting layer 66B is an organic EL layer emitting blue color. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue, respectively. In addition, the anode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. In addition, in order to prevent the anode 64 and the cathode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the anodes 64 . In addition, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

Although the hole transport layer 65 and the electron transport layer 67 are shown as one layer in FIG. 6B , it is formed as a plurality of layers including the hole blocking layer or the electron blocking layer depending on the structure of the organic EL display device. could be Also, between the anode 64 and the hole transport layer 65, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 to the hole transport layer 65 may be formed. . Similarly, an electron injection layer may be formed between the cathode 68 and the electron transport layer 67 .

Next, an example of a manufacturing method of the organic EL display device will be specifically described.

First, a substrate 63 on which a circuit (not shown) for driving an organic EL display device and an anode 64 are formed is prepared.

An acrylic resin is formed by spin coating on the substrate 63 on which the anode 64 is formed, and the acrylic resin is patterned to form an opening in the portion where the anode 64 is formed by lithography to form the insulating layer 69 . This opening corresponds to the light emitting region in which the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 has been patterned is loaded into the first organic material film forming apparatus, and a hole transport layer 65 is formed as a common layer over the anode 64 of the display area. The hole transport layer 65 is formed by vacuum deposition. In reality, since the hole transport layer 65 is formed in a size larger than that of the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transport layer 65 is loaded into the second organic material film forming apparatus, and a red light emitting layer 66R is formed on a portion of the substrate 63 where a red light emitting element is placed.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green light is formed by the third organic material film forming apparatus, and further, the light emitting layer 66B which emits blue light is formed by the fourth organic material film forming apparatus. After the formation of the light emitting layers 66R, 66G, and 66B is completed, an electron transporting layer 67 is formed over the entire display area 61 by the fifth organic material film forming apparatus. The electron transport layer 67 is formed as a layer common to the light emitting layers 66R, 66G, and 66B of the three colors.

A cathode 68 is formed by moving the substrate formed up to the electron transport layer 67 to a metallic deposition material film forming apparatus.

ADVANTAGE OF THE INVENTION According to this invention, the relative position of a board|substrate and a conveyance carrier can be adjusted in a board|substrate carrying-in/inversion chamber.

After that, it is transferred to a plasma CVD apparatus to form a protective layer 70 , thereby completing the organic EL display apparatus 60 .

From the time the substrate 63 on which the insulating layer 69 is patterned is brought into the film formation system until the film formation of the protective layer 70 is completed, when exposed to an atmosphere containing moisture or oxygen, a light emitting layer made of an organic EL material is It may be deteriorated by moisture or oxygen. Therefore, in this example, carrying in and carrying out of the board|substrate between film-forming apparatuses are performed in a vacuum atmosphere or inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea.

100: film forming system
101: board loading/reversing room
103: alignment room
105: tabernacle room
200: rotary drive device
201: carrier mount
201a: first carrier mounting surface
201b: second carrier mounting surface
203: rotating mechanism
205: alignment mechanism
221: board receiving unit
223: stage part
225: camera unit
250: through hole

Claims (14)

A rotation driving device for rotating a carrier to be transported, comprising:
a carrier mounting unit on which the carrier to be transported is placed;
a rotating mechanism for rotating the carrier mounting unit;
an alignment mechanism for adjusting a relative position between the carrier and the subject mounted on the carrier;
The alignment mechanism includes a stage movable in a direction parallel to the substrate holding surface of the carrier to be transported;
The stage unit is a rotation driving device, characterized in that provided in the carrier mounting unit. According to claim 1,
The alignment mechanism includes a transport target receiving unit for receiving the transport target,
The rotational drive device, characterized in that the transfer target receiving portion is mounted on the stage portion. 3. The method of claim 2,
The carrier mounting unit has a first carrier mounting surface and a second carrier mounting surface facing the first carrier mounting surface,
The transfer target receiving part is a rotation driving device, characterized in that it is installed to be movable in a direction perpendicular to the first carrier mounting surface or the second carrier mounting surface. 4. The method of claim 3,
The alignment mechanism includes a receiving unit driving unit for moving the transport target receiving unit in the vertical direction,
The receiving unit driving unit is a rotation driving device, characterized in that mounted on the stage unit. 4. The method of claim 3,
A plurality of the transfer target receiving units are provided along at least a periphery of the first carrier mounting surface or the second carrier mounting surface. 6. The method of claim 5,
The plurality of transfer target receiving units are each independently movable in the vertical direction. 4. The method of claim 3,
The transfer target receiving part is configured to be protrudable from the first carrier mounting surface or the second carrier mounting surface in the vertical direction. In claim 3,
Said rotation mechanism is comprised so that the said carrier mounting part can be reversed back and forth in order to place the to-be-carried object carrier on either of the said 1st carrier mounting surface or the said 2nd carrier mounting surface . 9. The method of claim 8,
and first carrier fixing means and second carrier fixing means respectively fixing the carrier to the first carrier loading surface and the second carrier loading surface respectively. 3. The method of claim 2,
The alignment mechanism further includes a camera unit capable of photographing an alignment mark formed on the target object and the target object carrier,
A rotational drive device characterized in that, based on an image captured by the camera, the stage unit is driven to position the conveyed object supported by the conveyed object receiving unit with respect to the conveyed object carrier. a film forming apparatus for forming a film on a substrate;
A film forming system comprising the rotational drive device according to any one of claims 1 to 10. An electronic device manufacturing method, characterized in that the electronic device is manufactured using the film forming system of claim 11 . 11. An object carrier used in a film forming system comprising the rotational drive device according to any one of claims 2 to 10, comprising:
and a through hole through which the substrate receiving unit can be inserted is provided at a position corresponding to the substrate receiving unit of the rotational driving device. 14. The method of claim 13,
and the through hole of the carrier has a diameter larger than a cross-sectional diameter of the substrate receiving portion so as to allow movement of the substrate receiving portion in the radial direction of the through hole.

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