JP7224165B2 - Alignment equipment, vapor deposition equipment, and electronic device manufacturing equipment - Google Patents

Description

The present invention relates to an alignment apparatus, a vapor deposition apparatus, and an electronic device manufacturing apparatus.

BACKGROUND ART Conventionally, a vapor deposition apparatus for forming a film by vapor-depositing a vapor deposition material on a film-forming object such as a glass substrate has been used. For example, an organic layer vapor deposition apparatus for vapor-depositing an organic layer during the manufacture of an organic EL panel is known. . There are so-called cluster type and in-line type vapor deposition apparatuses. In a cluster-type vapor deposition apparatus, vapor deposition chambers in which films are formed on glass substrates are arranged in a plurality of clusters, and the glass substrates are sequentially transported to each vapor deposition chamber and vapor deposited, thereby depositing multiple layers of films. . On the other hand, in an in-line vapor deposition apparatus, a film is formed in a vapor deposition chamber while a glass substrate for film formation is transported in a line. In the in-line system, there may be a plurality of vapor deposition chambers in the line direction.

Patent Literature 1 describes an in-line organic layer vapor deposition apparatus. The apparatus of Patent Literature 1 has a first circulatory section consisting of a loading section into which the glass substrate is loaded, a deposition section that deposits a film on the glass substrate, and an unloading section that unloads the glass substrate in the line direction. there is The apparatus also has a second circulation section for retrieving the transport carrier with the electrostatic chuck for transporting the substrate.

At the time of vapor deposition, first, a glass substrate is loaded from the outside of the apparatus into the first rack of the loading section of the first circulation section. The loaded glass substrate is placed on the upper surface of the transport carrier arranged in the second circulation section by the robot. The transport carrier holds the glass substrate by suction. Subsequently, the substrate is reversed together with the transport carrier by the first reversing robot and transported to the vapor deposition section. This reversal places the glass substrate on the lower surface of the transport carrier. In the vapor deposition section, vapor deposition is performed while the substrate is transported through a mask fixedly arranged in the vapor deposition section by a vapor deposition source arranged below the substrate.

After the vapor deposition is completed, the transport carrier holding the glass substrate transported to the unloading chamber is reversed again by the second reversing robot. After the reversal, the transfer carrier holding the glass substrate is carried out to the second circulation section by the carry-out robot. The transfer carrier that has moved to the second circulation section releases the holding of the glass substrate. Subsequently, only the glass substrate is transported to the discharge chamber by the transport robot and transported out of the apparatus. The transport carrier that has stopped holding the glass substrate is transported through the second circulation section, returns to the position corresponding to the loading section of the first circulation section, and is used to hold a new glass substrate. A lateral magnetic levitation bearing is used for transporting the substrate in the vapor deposition section.

JP 2013-016491 A

However, in Patent Literature 1, a mask used for vapor deposition is fixed to the vapor deposition section. On the other hand, since the position of the glass substrate changes with the progress of transportation, it is difficult to align (position) the glass substrate and the mask with high accuracy. In addition, in Patent Document 1, the alignment of the glass substrate and the mask must be performed after the glass substrate has been transported to the vapor deposition unit, so the alignment takes a long time, especially when there are a plurality of vapor deposition chambers.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object thereof is to provide a technique for accurately aligning a substrate and a mask in an in-line vapor deposition apparatus.

The present invention employs the following configurations. i.e.
a transport mechanism including a transport module forming a transport path along which a transport carrier that holds and transports a substrate moves;
an alignment chamber in which a mask is positioned and fixed to the substrate held by the transport carrier and loaded by the transport mechanism;
By applying a current or a voltage to the plurality of coils arranged on one of the carrier and the carrier module, the coils and the magnets arranged on the other of the carrier and the carrier module are connected. a control means for controlling the magnetic force generated between
An alignment device comprising:
By controlling the magnetic force, the control means adjusts the position of the transport carrier holding the substrate in a floated state, thereby positioning the substrate and the mask. Alignment device.

According to the present invention, it is possible to provide a technique for accurately aligning a substrate and a mask in an in-line vapor deposition apparatus.

Schematic diagram showing the production line for organic EL panels Control block diagram of an organic EL panel manufacturing line It is a schematic diagram showing a transport unit, (a) is an overall view, (b) is an enlarged view of the main part, (c) is a side view of the transport carrier. Disassembled perspective view of transport carrier (A) is a schematic diagram showing a mask chuck, (B) is a schematic diagram of a transport carrier It is a schematic diagram showing an alignment chamber, (A) is a general view, (B) is an enlarged view of the main part, (C) is a plan view. Diagram showing the state of transportation by magnet (A) Perspective view of the transport carrier, (B) is a diagram showing the arrangement of magnets. Flow diagram showing the alignment process Schematic showing each stage of the alignment progression Schematic showing the continuation of each stage of the alignment progression Schematic showing the continuation of each stage of the alignment progression 1A and 1B are explanatory diagrams of alignment, where (a) and (b) are conceptual diagrams of alignment marks on a substrate and a mask, and (b) is a conceptual diagram of an alignment system; Schematic diagram explaining the control box

Preferred embodiments of the present invention will be described below with reference to the drawings. However, the dimensions, materials, shapes and relative arrangement of the component parts described below, the hardware and software configurations of the device, the processing flow, the manufacturing conditions, etc. It should be changed as appropriate according to conditions, and is not intended to limit the scope of the invention to the following description. In principle, the same constituent elements are given the same reference numerals, and the description thereof is omitted.

INDUSTRIAL APPLICABILITY The present invention is suitable for a vapor deposition apparatus that forms a film on a film-forming object by vapor deposition. applicable to equipment. The material of the substrate, which is the film-forming target, may be any material that can be electrostatically chucked, and materials other than glass, such as polymer material films and metals, can be selected. The substrate may be, for example, a substrate in which a film such as polyimide is laminated on a glass substrate. Metallic materials (metals, metal oxides, etc.) and the like may also be selected as vapor deposition materials in addition to organic materials. The present invention can also be regarded as a control method and vapor deposition method for a vapor deposition apparatus, a film formation apparatus for forming a thin film, a control method thereof, and a film formation method. The present invention can also be regarded as an electronic device manufacturing apparatus and an electronic device manufacturing method using an organic EL panel. The present invention can also be regarded as a program that causes a computer to execute the control method, and a storage medium that stores the program. The storage medium may be a non-transitory computer-readable storage medium.

(Overall production line configuration)
FIG. 1 is a conceptual diagram showing the overall configuration of a production line 100 for organic EL panels. Schematically, the manufacturing line 100 constitutes a cyclic transport path including a vapor deposition process transport path 100a, a return transport path 100b, a mask transfer mechanism 100c, a carrier shifter 100d, a mask transfer mechanism 100e, and a carrier shifter 100f. Each component constituting the circulation type transfer path, for example, the substrate loading chamber 101, the reversing chamber 102, the alignment chamber 103, the acceleration chamber 104, the vapor deposition chamber 105, the deceleration chamber 106, the mask separating chamber 107, the reversing chamber 108, and the glass substrate discharge chamber. 109, etc., a transport module 301 for forming a transport path is arranged. Although details will be described later, this figure shows how the glass substrate G, the mask M and the electrostatic chuck 308 (symbol C) are transported on the transport path in each step of the manufacturing process.

In the vapor deposition process transport path 100a, the glass substrate G is roughly carried in from the outside in the transport direction (arrow A), the glass substrate G and the mask M are positioned and held on the transport carrier, and are transported along the transport path along with the transport carrier 302. After being subjected to vapor deposition while moving, the glass substrate G on which a film has been formed is discharged. In the return transport path 100b, the mask M separated after the vapor deposition process is completed and the transport carrier 302 after the glass substrate is discharged are returned to the substrate carrying-in chamber side.

In the mask transfer mechanism 100c, the mask M separated from the transport carrier after completion of the vapor deposition process is moved to the return transport path. The mask M that has moved to the return transport path is again mounted 302 on the transport carrier that has been emptied after the substrate has been discharged. In the carrier shifter 100d, the empty transport carrier 302 that has discharged the glass substrate G to the next process is transferred to the return transport path 100b. In the mask delivery mechanism 100e, the mask M separated from the transport carrier transported along the return transport path 100b is transported to the mask mounting position P2 on the vapor deposition process process transport path 100a. In the carrier shifter 100f, the empty transport carrier after the mask M separation is transported from the return transport path 100b to the glass substrate loading position P1 at the starting point of the deposition process process transport path 100a. Details of the manufacturing process using the manufacturing line 100 will be described later.

FIG. 2 is a conceptual diagram of control blocks of the manufacturing line 100. As shown in FIG. The control block includes an operation management control unit 700 that manages operation information of the entire manufacturing line 100 and an operation controller 20 . Further, each chamber (each device) such as the substrate carrying-in chamber 101, the reversing chamber 102, the alignment chamber 103, the acceleration chamber 104, and the vapor deposition chamber 105 constituting the manufacturing line 100 has a drive control unit for controlling the drive mechanism inside each chamber. department is provided. That is, a substrate loading chamber control unit 701a for the substrate loading chamber 101, a reversing chamber control unit 701b for the reversing chamber 102, an alignment chamber control unit 701c for the alignment chamber 103, an acceleration chamber control unit 701d for the acceleration chamber 104, and a vapor deposition chamber. 105 is provided with a vapor deposition chamber controller 701e. Each device (each room) other than the above is also provided with a control unit 701N. These drive control units and the operation management control unit 700 that manages the whole may be considered to be included in the control means. Also, the operation controller 20 may be considered to be included in the control means.

Further, the transfer module a (301a) in the substrate loading chamber 101, the transfer module b (301b) in the reversing chamber 102, the transfer module c (301c) in the alignment chamber 103, and the transfer module d (301d) in the acceleration chamber 104. , the deposition chamber 105 is provided with a transfer module e (301e). Each chamber other than the above is also provided with a transfer module 301N. Although details will be described later, a plurality of driving coils are arranged in a line along the transport direction of the glass substrate G and the transport carrier 302 in the transport module 301 arranged in each apparatus. By controlling the current or voltage flowing through each drive coil according to the value of the encoder provided in each transfer module 301, the drive of the transfer carrier 302 is controlled. Since the magnets arranged in a line on the transport carrier 302 and the coils arranged in the transport module 301 so as to face the magnets of the transport carrier 302 cooperate to transport the substrate, the transport carrier 302 and the transport module 301 may be collectively considered as a transport unit 300 (transport mechanism).

Each transport module 301 is provided with an encoder for detecting the position of the transport carrier 302 . According to the detected value of the encoder, the operation management control section 700 sends instructions to the drive control section of each room to start or stop control of the drive mechanism of each room, or change the control state. Note that the trigger for control is not limited to the encoder detection value, and any sensor can be used as long as it is used for control.

(Configuration of transfer module)
The transport module 301 includes a main frame having an opening for the transport carrier 302 to pass through. The transport module 301 includes driving coils arranged in a line along the transport direction of the transport carrier 302 and paired left and right with respect to the transport direction. 306 and a coil driver. Each transport path along which the transport carrier 302 moves is configured by arranging a plurality of transport modules 301 in series so that the openings thereof are aligned. The transport module 301 also includes a guide mechanism that guides the transport carrier 302 in the transport direction, and a drive system that drives and controls the attitude of the transport carrier 302 by magnetic force. As a result, the transport carrier 302 can continuously travel on the transport path formed by the plurality of transport modules 301 without deviating from the track. Also, a plurality of transport carriers 302 can be run on the transport path at the same time.

The transport unit 300 performs transport by linear motor control, typically using a moving magnet type linear motor. As shown in FIG. 2, the transport unit 300 includes N transport modules 301a to 301N and an operation controller 20. The transport modules 301a to 301N are continuously arranged side by side to form one transport path. The transport carrier moves on a transport path composed of transport modules 301a to 301N.

The operation controller 20 transmits a drive profile as a drive command indicating correspondence between time and target position to all the transport carriers 302 existing in the linear motor control system. The operation controller 20 transmits a start signal as a group transport command to the transport modules 301a to 301N so that the transport carriers 302 on the manufacturing line are moved all at once. Further, when the transport modules 301a to 301N operate abnormally, the operation controller 20 receives an error signal from the transport modules 301a to 301N and performs control such as stopping all the transport modules 301a to 301N.

(linear motor control)
Here, the propulsion control of the linear motor will be described with reference to FIG. This figure is a schematic configuration diagram showing one of a plurality of transfer modules 301 provided in a production line and a portion related to linear motor control among its control means. This figure is for explaining the principle of the propulsion control of the linear motor of the moving magnet. block configuration) is merely an example. In FIG. 7, the X-axis is defined as the direction in which the transport carrier 302 moves, the Y-axis is defined as the direction intersecting the X-axis in the horizontal plane, and the Z-axis is defined as the vertical direction when viewed from the coil unit 1501 .

The transport module 301 comprises a plurality of coil units 1501-1504. A transport path for the transport carrier 302 is formed by arranging a plurality of coil units 1501 to 1504 in succession. For example, the trajectory of the transport carrier 302 is defined by inserting a roller bearing attached to the transport module 301 into a guide groove of the transport carrier 302 . Each transport carrier 302 has magnets 1514 to 1516 as movers.

Coil units 1501 to 1504 have a plurality of coils so as to enable three-phase drive consisting of a plurality of phases, that is, U-phase, V-phase and W-phase. Each of the coil units 1501 to 1504 in the example of this figure is composed of six coils in which two coils of each of the U-phase, V-phase, and W-phase are connected in series. Coil unit 1501 is configured by combining a plurality of coils and a core formed of an electromagnetic steel sheet, but may be configured without using a core. The length of one coil unit 1501 may be, for example, 100 mm, but is not limited to this. Also, the number of series connections of the coil unit 1501 is not limited, and the coil unit 1501 may be composed of three coils forming three phases of U-phase, V-phase and W-phase.

The current controllers 1521 to 1524 are electrically connected to the corresponding coil units 1501 to 1504 by electric wires such as power wires, and the U-phase coil receives the U-phase current Iu, and the V-phase coil receives the V current. A phase current Iv and a W-phase current Iw are supplied to the W-phase coil, respectively. As a result, each coil is excited by energization, and each of the coil units 1501 to 1504 can control the transport carrier 302 .

The current controllers 1521-1524 are connected to a current information selector 1525, and the current controller selected by the current information selector 1525 supplies drive current to the corresponding coil unit. Current information selector 1525 is connected to motor controllers 1530 , 1540 , 1550 . A current information selector 1525 selects one of the current controllers 1521 to 1524 as an input destination of the current control information output by the motor controllers based on current control information exchange signals transmitted from the motor controllers 1530, 1540, and 1550.
Select one or more to switch. The current control information exchange signal is a signal for the current information selector 1525 to select one or more current controllers that supply current to the coil units for controlling the transport carrier 302 to be controlled. Motor controller 1530 will be described below, but motor controllers 1530, 1540 and 1550 have the same configuration.

The motor controller 1530 includes a position commander 1531 that controls operation of the transport carrier 302 , a control deviation calculator 1532 , and a position controller 1533 . The position commander 1531 outputs to the control deviation calculator 1532 position command information as the target position of the transport carrier 302 to be controlled. The position commander 1531 outputs the position command information of the transport carrier 302 to the control deviation calculator 1532 based on the drive profile transmitted by the operation controller 20 . The control deviation calculator 1532 calculates the difference between the position command information output from the position commander 1531 and the position of the transport carrier 302 output from one of the plurality of optical encoders 1561 to 1564. , the calculated difference is output as control deviation information.

The position controller 1533 performs PID (Proportional Integral Derivative Controller) control based on the control deviation information calculated by the control deviation calculator 1532, and outputs current control information as a current control signal. The current control information exchange signal output by the motor controller 1530 may be generated by the position controller 1533 . Similarly, the motor controller 1540 has a position commander 1541, a control deviation calculator 1542, and a position controller 1543, and the motor controller 1550 has a position commander 1551, a control deviation calculator 1552, and a position controller 1553. , and functions in the same way. In this figure, the number of motor controllers is three, but motor controllers corresponding to the number of transport carriers 302 to be controlled may be provided. Further, the driving profiles transmitted from the operation controller 20 to the motor controllers 1530, 1540, 1550 may be stored in a memory (not shown) accessible by the position commanders 1531, 1541, 1551.

The optical encoders 1561-1564 are arranged to correspond to the control regions of the coil units 1501-1504, respectively. The optical encoders 1561 to 1564 detect the positions of the scales arranged on the transport carrier 302 and identify the positions. It is preferable to determine the positions at which the plurality of optical encoders 1561 to 1564 are arranged and the length of the scale 205 so that the position of the transport carrier 302 can be detected anywhere on the transport path. . Also, the optical encoders 1561 to 1564 preferably have a resolution of several μm per count. Note that the arrangement and number of the optical encoders 1561 to 1564 are not limited to the illustrated example. Also, a magnetic encoder or the like may be used as the position detection mechanism. As the optical encoders 1561 to 1564, either absolute type or incremental type may be used.

The position information selector 1565 is connected to each of the optical encoders 1561-1564. Codes a, b, and c attached to arrows extending from the position information selector 1565 correspond to codes a, b, and c of the motor controllers 1530, 1540, and 1550, respectively. That is, position information selector 1565 is connected to control deviation calculators 1532 , 1542 , 1552 provided in motor controllers 1530 , 1540 , 1550 . The controller controller 1570 is connected to the position information selector 1565 and the motor controllers 1530, 1540, 1550 (not shown). The controller controller 1570 assigns the transport carrier 302 detected by the optical encoders 1561 to 1564 to any one of the motor controllers 1530, 1540, and 1550, and transmits a position information selection signal, which is information about the assignment, to the position information selector 1565. do. Location information selector 1565
A position information selection signal transmitted from the controller controller 1570 communicatively couples any of the motor controllers 1530, 1540, 1550 with any of the optical encoders 1561-1564. The controller controller 1570 receives control state information from each of the motor controllers 1530, 1540, 1550 indicating whether the transport carrier 302 is being controlled or is in a dormant state. The controller controller 1570 stores control state information in a memory (not shown) or the like so that the position of the transport carrier 302 detected by the optical encoder can be transmitted to the motor controller in the idle state.

Such a configuration allows the control system to detect the position of each transport carrier 302 and control the current or voltage applied to the corresponding coil unit to control the transport carrier.

(Configuration of transport carrier)
FIG. 3A is a front view of a transport unit 300 including a transport module 301 as a fixed part and a transport carrier 302 as a movable part, viewed from the transport direction indicated by arrow A in FIG. 3(b) is an enlarged view of the essential part surrounded by the frame S in FIG. 3(a), FIG. 3(c) is a side view of the transport carrier 302, and FIG. 4 is an exploded perspective view of the transport carrier. A plurality of transport modules 301 are arranged over the entire production line 100 to form a transport path. By controlling the current supplied to the drive coil of each transport module 301, the entire transport modules can be controlled as one transport path, and the transport carrier 302 can be moved continuously.

In the figure, a carrier body 302A of the carrier 302 is formed of a rectangular frame, and guide grooves 303a and 303b opening in a U-shaped cross section parallel to the carrying direction A are formed on both left and right sides thereof. On the other hand, roller bearings (guide rollers) 304a and 304b made up of a plurality of roller rows are rotatably attached to the inner surfaces of the side plates 3011a and 3011b on the transfer module 301 side. By inserting roller bearings 304a and 304b into the respective guide grooves 303a and 303b, the transport carrier 302 is movably supported with respect to the transport module 301 in the arrow A direction (transport direction).

Driving magnets 305a and 305b (magnet arrays) in which a plurality of magnets are arranged in a predetermined pattern are arranged on the top surface of the carrier main body 302A of the carrier body 302A at positions where the guide grooves 303a and 303b are formed. It is arranged linearly parallel to (moving direction). Further, drive coils 306a and 306b (coil rows) in which a plurality of coils are arranged in a predetermined pattern are arranged on the transfer module 301 side. The driving magnets 305 a and 305 b and the driving coils 306 a and 306 b are arranged so as to face each other and approach each other when the transport carrier 302 is supported by the transport module 301 . Electromagnetic forces acting between the drive magnets 305a and 305b on the transport carrier 302 side and the drive coils 306a and 306b on the transport module 301 side cause the transport carrier 302 to levitate and move in the direction of arrow A (transport direction). You can run the

The guide grooves 303a and 303b on the transport carrier side are provided with a pair of upper and lower parallel guide surfaces so as to sandwich the rolling surfaces of the roller bearings 304a and 304b. The diameter 304R of each roller bearing 304a, 304b is wider than the diameter 304R by the clearance CL (303W=304R+CL). With this configuration, the roller bearings 304a and 304b can float within the range of the predetermined clearance CL in the guide groove.
With such a configuration, the moving magnet type linear motor control described above can be implemented. That is, by controlling the current supplied to each of the plurality of coils forming the drive coils 306a and 306b forming the drive system, a propulsive force in the traveling direction of the transfer carrier 302 can be generated, or a magnetic levitation force can be generated with respect to the transfer module 301. can generate force. It should be noted that a structure in which a coil is arranged in one of the transfer module and the transfer carrier provided in the transfer mechanism and a magnet is arranged in the other is sufficient, and floating alignment of the transfer carrier can be performed even in a moving coil system.

Furthermore, according to the configuration of the transport module 301 and the transport carrier 302 as shown in FIG. 3, it is possible to transport the transport carrier 302 while supporting it with rollers using roller bearings 304a and 304b. That is, the transport carrier 302 can be moved in a state in which the transport carrier 302 is not magnetically levitated (a state in which the transport carrier 302 sinks under its own weight and the guide grooves 303a and 303b are supported in contact with the roller bearings 304a and 304b). .

(Selection of transport mode)
When moving the transport carrier 302, it is possible to select either the roller transport mode or the magnetic levitation transport mode. In the roller transport mode, the guide grooves 303a and 303b of the transport carrier 302 and the roller bearings 304a and 304b of the transport module 301 are in contact with each other to support the transport carrier 302, and the electromagnetic force generated between the magnet and the coil rotates the transport carrier 302. In this mode, the transport carrier 302 is transported by generating a driving force in the traveling direction. The magnetic levitation transport mode is a mode in which the transport carrier is magnetically levitated, and the transport carrier 302 is transported by generating a driving force in the traveling direction by means of electromagnetic force while the guide grooves 303a, 303b and the roller bearings 304a, 304b are not in contact with each other. is. In the magnetic levitation transport mode, since there are no mechanical contact parts, generation of dust and powder due to friction is suppressed. Therefore, it is particularly suitable for preventing deterioration of deposition quality when vacuum deposition processing is performed. On the other hand, the roller transport mode can be used outside the vapor deposition chamber, where dust and powder due to friction are relatively insignificant.

Note that FIG. 3 employs a support structure in which roller bearings 304a and 304b are inserted into guide grooves 303a and 303b. Therefore, when a power failure or a failure occurs during magnetic levitation transportation, the transportation carrier 302 can be prevented from falling onto the transportation path, damaging the mechanism, or deviating from the transportation path.

Further, by controlling the arrangement pattern of the plurality of magnets forming the drive magnets 305a and 305b, the arrangement pattern of the plurality of coils forming the drive coils 306a and 306b, and the current or voltage supplied to each coil, In the magnetic levitation transport mode, the position and attitude of the transport carrier 302 can be controlled in various ways. The position and orientation are, for example, the position in the traveling direction (X-axis) of the transport carrier 302, the position in the direction (Y-axis) orthogonal to the traveling direction in the same plane (the plane parallel to the plane of the glass substrate G) (that is, the traveling direction). direction), a position in the height direction (Z-axis) with respect to the transfer module 301, a rotational position about the X-axis, a rotational position about the Y-axis, a rotational position about the Z-axis, and the like. The position and attitude of the transport carrier 302 are corrected based on position information detected by a position sensor 310 (linear encoder, distance sensor, scale, etc.) arranged between the transport module and the transport carrier. can be controlled to As an arrangement pattern of the magnets, there is a system as shown in FIG. 8, for example. Although the details will be described later, the position/orientation control using magnets and coils can also be used for the alignment operation of the mask M with respect to the glass substrate G held by the transport carrier 302 .

As shown in FIG. 8B, the transport direction of the transport carrier 302 is the X axis, the direction orthogonal to the X axis in the plane parallel to the plane of the glass substrate G is the Y axis, and the direction orthogonal to the X and Y axes is Assuming the Z axis, the driving magnets 305a and 305b are arranged in two rows on the left and right, and basically the magnetic poles of the S pole and the N pole are arranged alternately along the X axis direction to generate a driving force in the X axis direction. The X-axis magnetic pole arrangement 305x for obtaining In addition, there is provided a Y-axis magnetic pole arrangement 305y for obtaining a driving force in the Y-axis direction in which S and N magnetic poles are arranged in the Y-axis direction. This Y-axis magnetic pole arrangement is provided at two locations in the left and right driving magnets 305a and 305b, respectively, at positions separated from each other in the X-axis direction, for a total of four locations. The Y-axis magnetic pole arrangement 305y is provided in one row of the two left and right rows of magnets.
The position and attitude control using the drive magnets 305a and 305b and the drive coils 306a and 306b can also be used for the alignment operation of the mask M with respect to the glass substrate G held by the transport carrier 302, as will be described later in detail.

(Mechanism for holding glass substrate G and mask M on transport carrier)
Next, a mechanism for holding the glass substrate G on the transport carrier 302 and a mechanism for holding the mask M on the glass substrate will be described. According to the present invention, the glass substrate is held by the electrostatic chuck 308 as the electrostatic chucking means, and the mask is held by the magnetic chuck 307 as the magnetic chucking means.

In FIG. 4, a magnetic adsorption chuck 307 that magnetically adsorbs the mask M and an electrostatic chuck 308 that adsorbs the glass substrate G by an electrostatic force are stacked on the lower surface of the carrier body 302A of the rectangular frame-shaped transport carrier 302 . A chuck frame 309 is attached, and an electrostatic chuck control unit (control box 312) containing a controller for charging the electrostatic chuck 308 is arranged on the top surface of the rectangular frame of the carrier body 302A.
By operating the control box 312 to charge the electrostatic chuck 308 in the chuck frame 309, the glass substrate G can be attracted and held.

As shown in FIG. 3, the magnetic adsorption chuck 307 includes a chuck body 307x and two guide rods 307a extending in the Z-axis direction from the back surface of the chuck body 302x (the side opposite to the glass substrate G) toward the carrier body 302. have. The guide rod 307a is slidably inserted into a tubular guide 307b provided on the frame of the carrier main body 302A, and is vertically movable within the chuck frame 309. As shown in FIG.

The magnetic attraction chuck 307 has a connecting hook 307c which is a connecting portion that can be engaged with and disengaged from a driving side hook 307g provided at the driving side connecting end portion of the driving source side connecting end portion provided outside. By engaging the connecting hook 307c with the driving side hook 307g, the chuck body 307x is driven vertically via the guide rod 302a. The drive-side hook 307g is controlled by an actuator 307h such as a drive device using a fluid pressure cylinder or a ball screw arranged outside the device.

In the illustrated example, a connecting hook 307c is provided on a cap 307i fixed to the tip of the guide rod 307a, and a laterally extending positioning piece 307d is provided on the side surface of the cap 307i. On the other hand, on the carrier body 302A side, the positioning piece 307d can be selectively engaged with an upper end lock piece 307f that abuts at the upper end position of the chuck body 307x and a lower end stopper 307e that locks the lower end position. there is The upper end lock piece 307f is movable in the horizontal direction, and is movable between an engaging position where it engages with the lower surface of the positioning piece 307d at the upper end position and a retracted position away from the positioning piece 307d. At the position, the positioning piece 307d is allowed to move downward and abuts against the lower end stopper 307e to restrict the lowered position. This lower limit is the position where the mask M is magnetically attracted, and a slight gap is provided between the chuck body 307x and the electrostatic chuck 308 . This prevents the weight of the magnetic attraction chuck 307 from acting on the electrostatic chuck 308 .

The drive of the upper end lock piece 307 is also driven by an external driving force. It can be moved horizontally by meshing with the rack.
As shown in FIG. 4, the upper end lock piece 307f is slidably supported on the upper surface of a pedestal 307j provided on the carrier body 302A via a pair of linear guides 307k spaced apart by a predetermined distance. A lower end stopper 307e protrudes from the upper surface of the pedestal 307j between the linear guides 307k. When it moves, it can move downward and abut against the lower end stopper 307e.

Then, while holding the glass substrate G on the electrostatic chuck 308 of the chuck frame 309, the mask M is brought closer to the glass substrate G while being aligned. By moving the adsorption chuck 307 toward the mask M side, the mask M is magnetically adsorbed with the glass substrate G and the electrostatic chuck 308 interposed therebetween. As a result, the glass substrate and the mask are chucked by the chuck frame 309 in a mutually aligned state, and as a result, are held by the transport carrier 302 .

Next, the shapes of the electrostatic chuck 308 and the magnetic chuck 307 will be described with reference to FIG. The chuck frame 309 is a rectangular member slightly smaller than the carrier body 302A, holds the outer peripheral edge of the electrostatic chuck 308, and guides the four sides of the magnetic adsorption chuck 307 and the lattice-like support frame. make up the walls.
The electrostatic chuck 308 is a plate-like member made of ceramic or the like, and when a voltage is applied to an internal electrode, the electrostatic chuck 308 attracts the glass substrate G by an electrostatic force acting between it and the glass substrate G. fixed immovably to the As shown in FIG. 4, the electrostatic chuck 308 is divided into a plurality of chuck plates 308a (six in the figure), and the sides of each chuck plate 308a are fixed by a plurality of ribs 309b. The rib 309b is divided into a plurality of parts so that the support frame of the magnetic adsorption chuck 307 does not interfere with it.

A chuck body 307x of the magnetic chuck 307 includes a lattice-shaped support frame 307x2 having a pattern corresponding to the shielding pattern formed on the mask M on a rectangular frame 307x1, and a chucking magnet (not shown) attached to the support frame 307x2. , has become a configuration. As for the attracting magnets, S-pole and N-pole magnets are alternately arranged in a line along a lattice on the support frame 307x2 via the yoke plate 307x3.

Mask chucks 311 serving as mask holding means for holding the mask M are provided in addition to the magnetic attraction chucks 307 at a plurality of locations (10 locations in the embodiment) around the chuck frame 309 on the lower surface of the transport carrier 302 . . The mask chuck 311 is configured to be driven by an external driving force, and the transport carrier 302 is not equipped with a driving source.

FIG. 5 shows the structure of this mask chuck 311 . As shown, the mask chuck 311 has chuck pieces 311b and 311c that sandwich the mask frame MF around the periphery of the mask M from above and below on a base 311a that is attached to the lower surface of the transport carrier by four posts 311d. The upper chuck piece 311b is arranged at a position abutting on the upper surface of the mask frame MF on the periphery of the mask M, and the lower chuck piece 311c can be rotated in the direction of arrow 311g by a rotating shaft 311f. That is, the lower chuck piece 311c can be moved between a clamping position shown in the drawing where the mask frame MF is clamped together with the upper chuck piece 311b, and a retracted position 311h which is separated from the mask frame MF and does not interfere with the vertical movement of the mask frame. is. These movements rotate the rotating shaft 311f by connecting the connecting portion 311i to the driving-side connecting end portion 311j extending into the chamber from the actuator 311m (see FIG. 3A) arranged outside. It is done by

Further, the rotation shaft 311f is provided with a biasing member 311k that elastically biases the chuck piece 311c toward the transport carrier while sandwiching the mask frame MF together with the chuck piece 311b. The urging force of the urging member 311k can reliably hold the mask M on the transport carrier 302 and prevent misalignment.

The mask chuck 311 is moved to the retracted position before the mask is mounted, and when the mask M is lifted to the lower surface of the transport carrier 302 by an elevating device, which will be described later, and comes into contact with the glass substrate G, the state shown in FIG. is driven through the connecting portion 311i by the actuator shown in , the chuck piece 311c rotates toward the mask and the glass substrate, engages the peripheral portion of the mask, and is elastically chucked to the transport carrier 302. As shown in FIG.

Since the mask chuck 311 holds the glass substrate G by engaging the mask frame MF on the peripheral edge of the mask M, the electrostatic chuck 308 for the glass substrate G and the magnetic adsorption for the mask M are hereinafter described. Even if the chuck 307 is released, the state in which the glass substrate G and the mask M are superimposed and attached and held can be maintained.

FIG. 5(b) is a diagram conceptually showing a simplified transport carrier. The same reference numerals are given to the same functional parts as in FIG. 3(a).
That is, an electrostatic chuck 308 is used to hold the glass substrate G to the transport carrier 302 , and a magnetic adsorption chuck 307 is used to hold the mask M, both of which are incorporated in a chuck frame 309 . The holding of the mask M by the magnetic chuck 307 is operated by the vertical movement of the magnetic chuck 307 within the chuck frame 309 . In addition, in FIG. 3, the upper end lock piece is horizontally moved, but in FIG. 5, it is configured to be rotationally driven. As long as it can be locked and unlocked, horizontal movement or rotational movement may be used. After the magnetic attraction chuck 307 is completed, a mechanical mask chuck 311 holds the mask frame MF on the carrier main body 302A. The mask chuck 311 incorporates an urging member 311k such as a pressurizing spring and is elastically held. These three types of chucks, the electrostatic chuck 308 , the magnetic chuck 307 and the mask chuck 311 are compactly incorporated in the transport carrier 302 .

In addition, a control box 312 for controlling the electrostatic chuck 308 of the glass substrate G is incorporated in the transport carrier 302 together with a rechargeable power source, and is equipped with wireless communication means for communicating commands from the control system. In all steps of the process, it is considered that there is no need to connect power supply cables, communication cables, etc. from the outside.

(control box)
The configuration and function of the electrostatic chuck control box will be described with reference to FIG. In order to use the electrostatic chuck, it is necessary to supply power to the electrostatic chuck and transmit a control signal. However, when a wired cable is used for power supply and communication, there is a risk that the degree of freedom of movement of the transport carrier will be reduced. Therefore, the transport carrier 302 includes a control box for non-contact power supply and control signal transmission to the electrostatic chuck.

FIG. 14 shows an outline of the arrangement and configuration of the control box in the vapor deposition apparatus. The transport carrier 302 is transported by the transport module 301 inside the vacuum chamber 1430 maintained at a predetermined degree of vacuum. Here, vacuum chamber 1430 may be any chamber within manufacturing line 100 . Transport carrier 302 includes an electrostatic chuck 308 held by a glass carrier frame 1420 . As shown in FIG. 14, various structures including a control box 1400 are arranged above the transport carrier when the film-forming surface of the substrate faces downward and the transport carrier is viewed from above. The interior of the control box is maintained at atmospheric pressure and sealed from the vacuum chamber 1430 . The control box 1400 includes a control circuit 1401, a battery 1402, an infrared communication unit 1403, a wireless communication unit 1404, a wireless communication antenna introduction terminal 1405, a view port 1406, a non-contact power receiving coil 1407, a power supply 1408, and the like.

A power source 1431 and a contactless power supply coil 1432 are provided on the vacuum chamber side to supply power to the control box side. For communication, a wireless communication unit 1433, a wireless communication antenna introduction terminal 1434, a viewport 1435, and an infrared communication unit 1436 are provided.

Power is supplied to the control box 1400 from the outside by a contactless power supply method such as an electromagnetic induction method using a coil or a magnetic resonance method. A power supply 1431 (for example, a 24V DC power supply) arranged outside the vacuum chamber causes a current to flow through the non-contact power supply coil 1432, thereby changing the magnetic field, generating a current in the non-contact power receiving coil 1407 inside the control box, and causing the battery to run. 1402 (for example, lithium-ion rechargeable battery). This makes it possible to ensure the power required to operate the electrostatic chuck power source 1408 (for example, a 2 kV high voltage power source). In order to realize contactless power supply, it is necessary to reduce the distance between the coils to a certain extent or less. good.

In the control box 1400, there are a capacitance sensor for detecting a change in capacitance and interlocking in the event of trouble such as a short circuit of the electrostatic chuck circuit, and an interlocking sensor for detecting atmospheric leakage from the control box. It is also preferable to arrange a barometer or the like for The power source 1431 and the non-contact power supply coil 1432 on the vacuum chamber side are preferably arranged at various locations on the manufacturing line, particularly at positions where the transfer carrier stands by.

Communication between the outside and the control box 1400 is also performed by a non-contact method such as infrared or wireless communication. As a configuration for wireless communication, a wireless communication unit 1404 and a wireless communication antenna introduction terminal 1405 are provided on the control box side, and a wireless communication unit 14033 and a wireless communication antenna introduction terminal 1434 are provided on the vacuum chamber side. . As a configuration for infrared communication, an infrared communication unit 1403 and a viewport 1406 are provided on the control box side, and an infrared communication unit 1436 and a viewport 1435 are provided on the vacuum chamber side. Each viewport is an opening for infrared communication and is made of a material that allows infrared transmission. Further, each wireless communication antenna lead-in terminal has a sealing structure to maintain the pressure inside the vacuum chamber or inside the control box. Thereby, the operation of the electrostatic chuck can be controlled by remote communication. By using the control box having such a configuration, it is possible to perform contactless power supply and communication to the electrostatic chuck, thereby avoiding a decrease in the degree of freedom of movement of the transport carrier and troubles in the connecting portion.

(manufacturing process)
Next, a process of actually fixing the mask M to the glass substrate G, vacuum-depositing the organic EL light-emitting material in the vapor deposition chamber, and discharging the material will be described.

As described above, FIG. 1 shows the movement positions of the transport carrier 302 (electrostatic chuck 308) that transports the glass substrate G and the mask M to each manufacturing process step in the manufacturing line 100 of the organic EL panel. In order to facilitate understanding, the transport carriers are drawn at each control movement position in the manufacturing process, but the number of transport carriers shown in the figure is not necessarily introduced onto the transport path. The number of machines introduced at the same time is determined by the manufacturing process design and takt time. Also, in the drawing, the transport carrier and the like move counterclockwise on the paper surface on the production line, but the direction is not limited to this.

In the production line 100, a magnetic drive system (linear motor system) is employed as the driving force in the transport direction of the transport carrier 302. FIG. In addition, for the support in the vertical direction of the transport carrier 302, either magnetic levitation or guide support by rollers is used. As described above, when the transport carrier 302 is magnetically levitated and transported, dust and dust are not generated. effective for

In the figure, the parts where the positional relationship of each component changes are denoted by P1 to P8 as shown below.
P1: Glass substrate loading position for holding the glass substrate G on the transport carrier P2: Mask mounting position for mounting the mask M on the glass substrate G on the transport carrier P3: Mask for separating the mask M from the glass substrate G after evaporation processing Separation position P4: Substrate discharge position where the glass substrate G after vapor deposition processing is separated from the transport carrier 302 and discharged P5: Carrier delivery position where the empty transport carrier 302 from which the glass substrate G has been discharged is delivered to the return transport path P6: Mask delivery position P7 where the mask M separated after vapor deposition is mounted on the carrier 302 on the return carrier path P7: The mask M is separated from the carrier 302 being carried on the return carrier path and the mask is carried to the mask mounting position P2. Return position P8: A carrier return position (return transport path end point) at which the transport carrier 302 from which the mask M is separated is shifted from the return transport path to the glass substrate loading position P1 on the vapor deposition process transport path.

While the transport carrier 302 is moved on the manufacturing line 100 by the transport module 301, the stacking relationship of the glass substrate G, the mask M, the electrostatic chuck 308 provided on the transport carrier, etc. changes at various positions on the manufacturing line. Or, the top and bottom are reversed by 180° by the reversing process. Therefore, in FIG. 1, reference numerals are shown for each major position in order to help understand the vertical relationship of the glass substrate G, mask M, and electrostatic chuck 308 . That is, when the surface of the glass substrate G on which a film is formed (surface to be filmed) is at the top, it is denoted by G1, and when the surface on which no film is formed is at the top, it is denoted by G2. In addition, when the side of the electrostatic chuck 308 that attracts the substrate is at the top, it is denoted by C1, and when the side that does not attract the substrate is at the top, it is denoted by C2. In addition, when the side of the mask M on which the film is formed is at the top, it is denoted by M1, and when the side on which the film is not formed is at the top, it is denoted by M2. The reference numerals indicate the state after reversal in each reversing chamber, and the state after carrying-in and after discharging in the carry-in chamber and the discharge chamber.

<Importing process>
At the glass substrate loading position P1, a glass substrate G is loaded from an external stocker into the substrate loading chamber 101 on the vapor deposition process transport path 100a, and held by an electrostatic chuck at a predetermined holding position on the transport carrier 302. . At the glass substrate loading position P1, the transport carrier 302 and the transport module 301 that supports it are arranged so that the transport module 301 faces downward. At this time, the glass substrate holding surface (chuck surface) of the transport carrier 302 faces upward. The glass substrate G is loaded from above into the glass substrate loading position P1 and placed on the chuck surface.

Subsequently, the transport carrier 302 holding the glass substrate is transported from the glass substrate loading position P1 to the reversing chamber 102 . This transport is performed in roller transport mode. That is, the transport carrier 302 is in contact with the roller bearings 304a and 304b whose guide grooves 303 serve as guides, and is generated between the drive coils 306a and 306b to which current or voltage is applied and the drive magnets 305a and 305b. Moves in the direction of travel due to magnetic force.

<Reversal/mode switching process>
In the reversing chamber 102, the rotation support mechanism rotates the transfer module 301 supporting the transfer carrier 302 holding the glass substrate by 180 degrees with respect to the traveling direction. As a result, the vertical relationship of the transport carrier 302 and the transport module 301 is reversed so that the glass substrate G faces the lower surface. The rotation support mechanism can rotate the transport module 301 together with the transport carrier 302 in 180-degree increments in the direction of travel. It is preferable that the rotary shaft is positioned at the center of gravity so that the transport carrier 302 and the transport module 301 do not shift their positions during the rotating operation. In the drawing, an arrow R indicates the reversal of the transport carrier 302 and the transport module 301 in the advancing direction. It is also preferable to use a locking mechanism that mechanically locks the transfer module 301 and the transfer carrier 302 .

Here, one of the reasons for rotating the transport carrier 302 together with the transport module 301 is that the roller bearings 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304a, 304, 304b is inserted. Another reason is that the magnets on the transport carrier side and the coils on the transport module side face each other. This is due to the complexity of the arrangement and the guide mechanism with the transfer module.

After the reversing process in the reversing chamber, the current or voltage applied to the drive coil is controlled, and the method of supporting the transport carrier 302 is changed from contact between the roller bearings 304a, 304b and the guide grooves 303a, 303b to magnetic levitation. switched. As a result, the control mode is changed from the roller transport mode to the magnetic levitation transport mode. Subsequently, the transport carrier 302 is moved to the alignment chamber 103 (mask mounting position P2) in the magnetic levitation transport mode.

<Alignment process>
FIGS. 6A to 6C are diagrams for explaining the mask lifting device for chucking the mask in the alignment chamber 103 and its operation.

In the alignment chamber 103, the transfer module 301 is fixed to the main frame 200 in the chamber, and the transfer carrier 302 lifts the transfer module 301 by magnetic levitation with the glass substrate G held by the electrostatic chuck facing downward. is maintained in a suspended state.

As shown in the figure, below the transport carrier 302, an elevating device 202 that holds and elevates the mask M is arranged. The lifting device is configured to support the front, rear, left, and right four points by lifting rods 204a, 204b, 204c, and 204d that move up and down by jacks 203a, 203b, 203c, and 203d, respectively, and control the lifting and lowering of the mask tray 205. there is

Further, as shown in FIG. 6(c), the mask tray 205 is configured such that the mask frame MF on the peripheral edge of the mask M is supported by a plurality of mask supporting portions 206. As shown in FIG.

With the above configuration, the mask M placed on the mask tray 205 is lifted by the jacks 203a to 203d, approaches the glass substrate G held by the transport carrier 302 which is magnetically levitated, and reaches a predetermined proximity distance. Then, the glass substrate G and the mask M are aligned.

In the alignment operation, alignment marks formed in advance on the glass substrate and the mask are imaged by an alignment camera to detect the amount and direction of positional deviation between the two. position is finely moved, and in a state in which the positions of the glass substrate and the mask are accurately aligned, the mask M is attracted by the magnetic attraction chuck and held by the transfer carrier.

This holding state is locked by the ten mask chucks 311 as described above, and after that, even if the electrostatic chuck and the magnetic adsorption chuck are released, the glass substrate and the mask are held in alignment with the transport carrier. state is maintained.

Here, during alignment, the position with respect to the transport module 301 is finely adjusted while the transport carrier 302 is magnetically levitated. Therefore, alignment can be performed by the transport carrier drive system without separately providing a fine adjustment mechanism dedicated to alignment, which is effective in simplifying the configuration and reducing the weight of the transport carrier 302 .

(details of alignment)
A detailed description will be given of the above-described method of aligning by imaging the alignment mark. 13(a) is a schematic view of the glass substrate G, and FIG. 13(b) is an enlarged view of the alignment marks provided at the corners of the glass substrate G and the mask M. As shown in FIG. Alignment camera visual field ranges 1301 are set at the four corners of the glass substrate G shown in FIG. 13(a). FIG. 13(b) shows a state in which the glass substrate G and the mask M are superimposed and imaged in one alignment camera visual field range 1301, and the glass substrate side alignment marks 1304 and the mask side alignment marks imaged through the glass are shown. 1305 is displayed.

FIG. 13(c) is a conceptual diagram of the alignment system. An alignment camera 1310 is arranged on the top plate 1311 of the chamber of the alignment chamber. The alignment camera may be any camera capable of optical imaging, and for example, a camera with a sensor size of ⅔ inch can be used. A top plate 1311 of the chamber is provided with a view port 1313 capable of transmitting light used for imaging in the optical axis direction of the alignment camera 1310 . The alignment camera is installed on the stage 1312, and its position can be finely adjusted. For example, a 6-axis adjustment stage can be used as the stage. In addition to the components, the camera may include various members necessary for imaging, such as a lens 1315, a pseudo-coaxial light 1316, a ring illumination 1317, and the like.

As the control means, an alignment chamber control section 701c may be used as shown in the drawing, or another control device may be used. The alignment chamber control unit 701 c performs alignment processing based on image data captured by the alignment camera 1310 . That is, the mask-side alignment mark 1305 and the glass-substrate-side alignment mark 1304 are extracted from the image data by image processing, and the positional deviation amount and the positional deviation direction between them are calculated. If the amount of positional deviation or the direction of positional deviation is not within a predetermined range, the position of the transport carrier 302 is finely adjusted using magnetic force based on the calculated amount of positional deviation, etc., and the glass substrate G and the mask M are aligned. do.

(Magnet configuration)
Here, a configuration for enabling alignment operation by magnetic force will be described. FIG. 8 shows details of the driving magnets 305a and 305b arranged on the upper surface of the transport carrier 302. As shown in FIG. The driving magnets 305a and 305b are arranged so as to form a pair on the left and right with respect to the transport direction. The drive magnets 305a and 305b basically have a configuration in which N-pole magnets and S-pole magnets are alternately arranged in a line to form a magnet row. In the illustrated example, the left and right paired driving magnets 305a and 305b each include two rows of magnets. Basically, in each of the two magnet rows, N poles and S poles are alternately arranged in a line, and are used for control in the X direction (conveyance direction) in the figure. Also, in a part of the magnet row, both the N pole and the S pole are arranged so as to be exposed on the surface facing the transfer module 301, and not only in the X direction but also in the Y direction in the drawing (intersecting the transfer direction). direction).

Rows of a plurality of drive coils 306a and 306b are provided at positions facing the rows of magnets on the carrier 302, and by controlling the current or voltage of each coil, the carrier 302 is moved to X in FIG. It is possible to move in each of the axial (conveying direction), Y-axis (direction intersecting with the conveying direction) and Z-axis (direction in which the conveying carrier and the conveying module face each other) directions, as well as rotational directions about each axis. In particular, it is effective to arrange at least one of the drive magnets 305a and 305b in a plurality of rows in order to control the rotation directions around the Y-axis and the Z-axis.

(processing flow)
Details of the alignment operation in the alignment chamber 103 will be described with reference to the flow chart of FIG. 9 and FIGS. 10(a) to 12(d) correspond to steps S1 to S5 and S7 to S12 in FIG. 9, respectively.

First, in step S1, as shown in FIG. 10A, the mask M is loaded from the prealignment chamber 100g by the mask transfer mechanism 100e. The alignment chamber controller detects the completion of loading by a sensor provided in the alignment chamber 103 .

Next, in step S2, as shown in FIG. 10B, the transfer carrier 302 holding the substrate is transferred from the reversing chamber 102 to the alignment chamber 103 in the magnetic levitation transfer mode. The conveying direction A here is the direction from the back to the front. The alignment chamber controller detects the position from the encoder value of the transfer module 301 and stops the transfer carrier 302 at a predetermined alignment position. The clearance (gap) between the mask M and the glass substrate G at this time is defined as CLS2. For example, CLS2=68 mm.

Next, in step S3, as shown in FIG. 10C, the mask M is lifted by the lifting device 202 (jacks 203a to 203d, lifting rods 204a to 204d) and stopped just before it contacts the glass substrate G. Then, as shown in FIG. The stop position is a position where the alignment camera can simultaneously measure the alignment marks of the glass substrate G and the mask M in the next step S4. Assuming that the clearance between the mask M and the glass substrate G at this time is CLS3, for example, CLS3=3 mm.

Next, in step S4, alignment marks of the glass substrate G and the mask M are simultaneously measured by the alignment camera 1310 as shown in FIG. 10(d). In addition, the transport carrier 302 is provided with a through hole along the optical axis direction of the alignment camera. The alignment camera can measure the alignment marks provided on the glass substrate G and the mask M through this through hole. Also, for example, a notch or the like may be used instead of the through-hole as long as the configuration enables alignment mark measurement.

Next, in step S5, as shown in FIG. 11A, the alignment chamber controller calculates the amount of misalignment between the glass substrate G and the mask M from the measurement result in S4, and the value of the misalignment falls within a predetermined allowable range. The position of the transport carrier 302 holding the glass substrate G is adjusted so that it fits. When adjusting the position, as indicated by reference numeral 331, the current or voltage applied to the drive coils 306a and 306b is controlled to adjust the magnetic force with the drive magnets 305a and 305b. In this manner, the alignment operation in this step is performed while the transport carrier 302 is floated. Next, in step S6, the alignment camera performs measurement again, and the alignment chamber controller determines whether the value of the positional deviation is within a predetermined range. If it is outside the range, the process returns to S5, and alignment is repeated until the positional deviation value falls within the range.

As described above, the alignment operation in this flow is performed by adjusting the position of the transport carrier by magnetic force while the transport carrier and the glass substrate G held thereon are magnetically levitated. In this configuration, since the transport carrier and the transport module are not in contact with each other, influences such as friction are suppressed, and highly accurate positioning becomes possible. Further, since the magnetic force generated by the driving coil and the driving magnet for transporting the transport carrier is used for alignment, there is no need to provide a separate driving means for alignment. As a result, it is possible to simplify the configuration of the device and reduce the cost.

When the alignment operation is completed, the process of magnetically attracting the mask M starts. In this embodiment, the mask frame MF is first chucked by the mask chuck 311 .
That is, in S7, the mask M is raised and brought close to the glass substrate G as shown in FIG. 11(b). When the mask M is lifted, the lifting device 202 lifts the mask tray 205, thereby lifting the mask M supported by the mask support section 206. FIG. The mask M itself is bent as schematically shown, and the mask frame MF supported by the mask supporting portion 206 rises and approaches the glass substrate G to a predetermined gap. Assuming that the clearance between the mask M and the glass substrate G at this time is CLS71, for example, CLS71=0.5 mm. Further, since the transport carrier 302 is magnetically levitated, a clearance CLS72 exists between the lower end of the carrier stand portion 302A1 and the mask tray 205. FIG.

Next, in S8, the magnetic levitation control is turned off, and the transport carrier 302 is seated on the mask tray 205, as shown in FIG. 11(c). When the magnetic levitation control is turned off, the transport carrier 302 that has lost its levitation force drops due to its own weight and is seated on the mask tray 205 . In the illustrated example, the lower end of a carrier stand portion 302A1 provided on the carrier main body 302A abuts. Assuming that the clearance between the mask M and the glass substrate G at this time is CLS8, for example, CLS8=0.3 mm.

Next, in S9, mask chucking is performed as shown in FIG. 11(d).
That is, the rotating shaft 311f is rotationally driven by the drive of the external driving device, and the chuck piece 311c engages and chucks the mask frame MF. In the illustrated example, the upper chuck piece 311b is omitted. At this point the mask frame MF is fixed. This state is maintained even if the electrostatic chuck 308 and the magnetic adsorption chuck 307 are released.

Next, in S10, the transport carrier 302 is raised to the floating start position while the mask M is held by the mask chuck 311, as shown in FIG. 12(a). The transfer carrier 302 is lifted by a mask tray lifting device. The levitation start position is a distance at which the distance between the drive coil 306 of the transport module 301 and the drive magnet 305 of the transport carrier 302 is such that the transport carrier 302 can be levitated. In this step, for example, the transport carrier 302 is raised by about 0.7 mm.

Next, in S11, as shown in FIG. 12B, the magnetic levitation control is turned on, and the transport carrier 302 holding the mask M is floated from the mask tray 205. Then, as shown in FIG. That is, the transport carrier 302 floats above the mask tray 205 by a predetermined amount due to the attractive force between the drive coil 306 of the transport module 301 and the drive magnet 305 of the transport carrier 302 . The amount of rise is, for example, about 0.5 mm. That is, if the clearance between the mask tray 205 and the lower end of the carrier stand portion 302A1 of the transport carrier 302 at this time is CLS11, then CLS11=0.5 mm, for example.

Next, in S12, the magnetic chuck 307 is lowered to magnetically attract the mask M as shown in FIG. 12(c). That is, the lock piece locked at the rising end is rotationally driven by an external actuator, moves to the retracted position, is unlocked in the downward direction, and the magnetic chuck 307 holds the glass substrate G electrostatic chuck 308 . , and the attraction magnet of the magnetic attraction chuck 307 and the mask M are magnetically attracted and held with the electrostatic chuck 308 and the glass substrate G interposed therebetween. As a result, the aligned mask M is held in close contact with the film-forming surface of the glass substrate G over the entire surface. The downward movement of the magnetic adsorption chuck 307 is realized by a driving force from the outside of the transport carrier 302 . The amount of descent of the magnetic adsorption chuck at this time is, for example, 30 mm.

Next, in S13, the transport carrier 302 is transported from the alignment chamber 103 to the acceleration chamber 104 in the transport direction A, as shown in FIG. 12(d).

According to the flow described above, the aligned mask M is held by the magnetic adsorption chuck 307 on the deposition surface of the glass substrate G held by the electrostatic chuck 308, and the mask frame MF is chucked by the mask chuck 311. , the transport carrier 302 is unloaded.

<Vapor deposition process>
Returning to FIG. 1, the description is continued. After completing the alignment operation, the transport carrier discharged from the alignment chamber 103 is accelerated in the acceleration chamber 104 as described above and carried into the vapor deposition chamber 105 . By accelerating the transport carrier before loading it into the vapor deposition chamber 105, it is possible to compensate for the delay in the time required for the high-precision alignment processing in the alignment chamber 103, and to suppress the decrease in tact time.

In the vapor deposition chamber, the organic EL light-emitting material is vacuum-deposited while moving in the direction of arrow B in a magnetically levitated state at a predetermined vapor deposition speed. In this way, by using the magnetic levitation transport mode when carrying the transport carrier from the alignment chamber to the acceleration chamber and deposition chamber, and when moving within the deposition chamber, the generation of dust and powder due to friction is prevented. Therefore, it is possible to form a film with high quality.

<Separation/carrying out process>
The transport carrier discharged from the deposition chamber 105 after the deposition process is decelerated in the deceleration chamber 106, transported to the mask separation chamber 107 located at the mask separation position P3, and stopped at a predetermined position. Here, the locked state of the mask M by the mask chuck 311 is released, and the mask M is separated from the glass substrate.

The separated mask M is lowered by a mechanism similar to the mask lifting device of FIG. The mask delivery mechanism 100c receives and holds the lowered mask M in the holding frame, and transports it to a retracted position between the vapor deposition processing process transport path 100a and the return transport path 100b. Then, when the empty transport carrier 302 after discharging the substrates moves to the mask receiving position P6 on the return transport path, the mask M is moved to the lower position of the transport carrier. Then, the mask M is lifted to the lower surface of the transport carrier by a mechanism similar to the mask lifting device, and held by the magnetic chuck. The transport carrier 302 holding the mask M in this manner is transported back to the supply side.

On the other hand, the transport carrier 302 from which the mask M has been separated in the mask separating chamber 107 moves to the reversing chamber 108 while holding the glass substrate G by the engaging portion of the mask chuck. In the reversing chamber 108, a rotation support mechanism similar to that of the reversing chamber 102 on the supply side rotates the transport carrier 302 together with the transport module 301 by 180 degrees in the advancing direction. Thereby, the glass substrate G becomes the upper surface.

After being reversed in the reversing chamber 108, the transport mode of the transport carrier 302 is switched from the magnetic levitation transport mode to the roller transport mode again. Subsequently, the transport carrier 302 is transported to the glass substrate discharge chamber 109 at the substrate discharge position P4 by roller transport. At the substrate ejection position P4, the mask chuck of the glass substrate G is released, and the glass substrate G is transported to the next process by an ejection mechanism (not shown).

The transport carrier 302 , which has been emptied after discharging the glass substrate G in the glass substrate discharge chamber 109 , is rotated 90 degrees counterclockwise in the drawing together with the transport module 301 . For this purpose, the glass substrate discharge chamber 109 has a direction changing mechanism that rotates the transfer module in the planar direction. Subsequently, the transport carrier 302 is transferred from the transport module 301 to the carrier shifter 100d and transported to the carrier transfer position P5, which is the starting point of the return transport path 100b. On the other hand, after transferring the transport carrier 302 to the carrier shifter 100d, the transport module 301 rotates clockwise by 90 degrees and returns to its original direction. As a result, the transport module 301 returns to a state in which it can receive the next transport carrier carried out from the reversing chamber 108 .

The carrier shifter 100 d has a transport mechanism similar to that of the transport module 301 . The carrier shifter 100d receives the empty transport carrier 302 from the transport module 301 rotated 90 degrees in the glass substrate discharge chamber 109, and arranges it at the starting point (carrier delivery position P5) of the return transport path 100b. 110 to the direction changing mechanism (conveyance module for direction change) 110 . The direction changing mechanism 110 rotates the transport carrier counterclockwise by 90 degrees in a plan view, and transports it to the transport module forming the return transport path 100b. After the transport is completed, the direction changing mechanism 110 rotates clockwise by 90 degrees to return to the original position, and becomes ready to receive the next transport carrier from the carrier shifter 100d.

<Return process>
The transport carrier 302 moves in the roller transport mode on the return transport path. In the reversing chamber 111, the rotation support mechanism rotates the transport carrier 302 together with the transport module by 180 degrees in the traveling direction. As a result, the transport carrier 302 is carried into the mask receiving position P6 with the mask mounting surface of the electrostatic chuck 308 facing downward. Subsequently, the transport carrier 302 receives the mask M from the mask transfer mechanism 100 c , adsorbs it with the magnetic adsorption chuck 307 , and holds it with the mask chuck 311 . Subsequently, the transport carrier 302 continues to move in the direction of the arrow C in the roller transport mode while holding the mask M with the mask chuck 311 .

The transport carrier 302 stops after moving to the mask separation position P7, releases the mask chuck 311, and separates the mask M. As shown in FIG. The separated mask M is delivered to the mask delivery mechanism 100e. The mask transfer mechanism 100e roughly aligns the mask M in the pre-alignment chamber 100g between the vapor deposition processing process transfer path 100a and the return transfer path 100b, and then transfers it to the alignment chamber 103. FIG.

On the other hand, the transport carrier 302 from which the mask M has been separated at the mask separating position P7 is rotated 180 degrees in the direction of travel in the reversing chamber 113 . As a result, the glass substrate holding surface of the electrostatic chuck 308 faces upward. Then, the transport carrier 302 is rotated 90 degrees clockwise by the direction changing mechanism 114 located at the carrier return position P8, which is the end point of the return transport path 100b. Subsequently, it is handed over to the carrier shifter 100f and transported to the substrate loading chamber 101 located at the glass substrate loading position P1, which is the starting point of the vapor deposition process transport path 100a. After delivering the transport carrier 302, the direction changing mechanism 114 rotates counterclockwise 90 degrees and returns to its original state. On the other hand, the transport carrier 302 loaded into the substrate loading chamber 101 is further rotated counterclockwise by 90 degrees and returns to the initial position where it can hold the next glass substrate G loaded from the outside.

By performing the above processes, a series of processes for vapor-depositing the organic EL light-emitting material on the glass substrates which are successively carried in can be executed without delay.

In addition, since the generation of dust and powder due to friction can be suppressed by conveying the carrier 302 by magnetic levitation, it is particularly effective for carrying in and out of the vapor deposition chamber and the vapor deposition chamber. Further, according to the illustrated example, the glass substrate G is only transported in one direction during the process from the glass substrate G being carried into the manufacturing line 100 through alignment and vapor deposition to being discharged, and Although it is necessary to turn upside down in the direction of travel, it is not necessary to turn in the planar direction by a robot or the like. Therefore, it is possible to further reduce the possibility of dust or powder adhering to the substrate.

Furthermore, in the illustrated example, the glass substrate G is carried into the manufacturing line with the film-forming surface facing upward. Therefore, it is effective in protecting the film formation surface when the glass substrate is mounted on the transport carrier 302 .

Here, since the vapor deposition material is vaporized or sublimated by PVD or CVD in a vacuum in the vapor deposition chamber to form a film, the vapor deposition material must be placed downward. Therefore, at the time of vapor deposition, it is necessary to control the position of the glass substrate so that the film-forming surface of the glass substrate faces downward. According to the configuration of the present invention, the mask M is lifted from below toward the film-forming surface of the glass substrate G held by the transport carrier 302 with the film-forming surface facing the lower surface side. It is attached to the glass substrate G through the process. Therefore, when the mask M is attached, it is in a posture in which the vapor deposition material can be vapor-deposited.

An electrostatic chuck is used to hold the glass substrate on the transport carrier 302, and a magnetic adsorption chuck and a mechanical mask chuck are used to hold the mask. The electrostatic chuck and the magnetic chuck are incorporated in the chuck frame, and the magnetic chuck can be switched between chucking and non-chucking states by raising and lowering the magnet within the chuck frame. First, the mask is elastically held on the transfer carrier 302 with the glass substrate interposed therebetween by a mechanical mask chuck. Thereafter, the chucking of the mask is completed by lowering the magnetic chuck. According to the configuration of the present invention, these three types of chucks can be compactly incorporated into the transport carrier 302 .

An electrostatic chuck control unit for controlling the electrostatic chuck of the present invention is housed in a control box together with a rechargeable power supply and wireless communication means for communicating commands from the control system, and is incorporated in the transport carrier. Therefore, in the manufacturing process, it becomes unnecessary to connect a power supply cable, a communication cable, or the like to the transport carrier 302 from the outside.

In the above-described embodiment, the driving magnets 305a, 305b are provided on the upper surface of the transport carrier 302, and the driving magnets 305a, 305b are arranged on the transport module 301 so as to face the driving magnets 305a, 305b. It is configured to be sucked from. However, the arrangement of the magnet unit and the coil unit is not limited to this. It is also possible to hold by magnetic levitation from the side of the .

According to the present invention, while holding the glass substrate G and the mask M by the transport carrier 302, they are magnetically levitated in the alignment chamber and aligned by magnetic force before vapor deposition in the vapor deposition chamber. This enables highly accurate positioning. In addition, since the current or voltage to the coil, which is the conveying means of the conveying carrier, is used for control, there is no need to provide separate means for alignment, and the apparatus can be realized simply and at low cost.

103: alignment chamber, 300: transfer unit, 301: transfer module, 302: transfer carrier, 305: drive magnet, 306: drive coil, 700: operation management control unit

Claims (11)

a transport mechanism including a transport module forming a transport path along which a transport carrier that holds and transports a substrate moves;
an alignment chamber in which a mask is positioned and fixed to the substrate held by the transport carrier and loaded by the transport mechanism;
By applying a current or a voltage to the plurality of coils arranged on one of the carrier and the carrier module, the coils and the magnets arranged on the other of the carrier and the carrier module are connected. a control means for controlling the magnetic force generated between
An alignment device comprising:
By controlling the magnetic force, the control means adjusts the position of the transport carrier holding the substrate in a floated state, thereby positioning the substrate and the mask. Alignment device. 3. The transport carrier has the plurality of magnets arranged in the transport direction of the substrate, and the transport module has the plurality of coils arranged to face the plurality of magnets. 2. The alignment device according to 1. 3. The alignment apparatus according to claim 2, wherein the plurality of magnets are arranged so as to form a plurality of magnet rows paired left and right with respect to the conveying direction of the conveying carrier. 4. The alignment device according to claim 3, wherein at least one of the plurality of magnet rows formed to be paired left and right with respect to the conveying direction further includes a plurality of magnet rows. The control means can move the position of the transport carrier in a transport direction of the substrate, a direction crossing the transport direction, and a direction in which the transport carrier and the transport module face each other. 5. The alignment apparatus according to any one of Items 1 to 4. further comprising an alignment camera capable of simultaneously capturing images of alignment marks respectively arranged on the substrate and the mask, which are arranged on the transport carrier;
The alignment apparatus according to any one of claims 1 to 5, wherein the control means positions the substrate and the mask based on an image of the alignment mark captured by the alignment camera. The alignment apparatus according to any one of claims 1 to 6, wherein the transport carrier has electrostatic attraction means for attracting and holding the substrate. 8. The alignment apparatus according to claim 7, wherein said transport carrier has magnetic attraction means for attracting said mask through said substrate held by said electrostatic attraction means. an alignment apparatus according to any one of claims 1 to 8;
a deposition chamber in which a deposition material is deposited on the substrate transported from the alignment chamber by the transport mechanism;
A vapor deposition apparatus comprising: 10. The vapor deposition apparatus according to claim 9, wherein the controller uses the same transport mechanism to position the transport carrier and the mask in the alignment chamber and to transport the transport carrier. 11. An electronic device manufacturing apparatus for manufacturing an electronic device by forming a film on the substrate using the vapor deposition apparatus according to claim 9 or 10.

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