CN112813381B - Film forming apparatus - Google Patents

Film forming apparatus Download PDF

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Publication number
CN112813381B
CN112813381B CN202011260259.1A CN202011260259A CN112813381B CN 112813381 B CN112813381 B CN 112813381B CN 202011260259 A CN202011260259 A CN 202011260259A CN 112813381 B CN112813381 B CN 112813381B
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Prior art keywords
substrate
driving mechanism
mask
film forming
container
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CN112813381A (en
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关谷任史
木村龙司
新海达也
冈部俊介
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Canon Tokki Corp
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Canon Tokki Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention provides a film forming apparatus capable of suppressing the reduction of alignment accuracy. The film forming apparatus of the present invention includes: a container; a container support body provided outside the container and supporting at least a part of the container; a substrate holder which is provided in the container and holds a substrate; a mask holder which is provided in the container and supports a mask; a substrate holder driving mechanism that drives the substrate holder; a mask holder driving mechanism that drives the mask holder; and a vibration transmission suppressing member provided at least one of between the container support body and the substrate holder driving mechanism and between the container support body and the mask holder driving mechanism.

Description

Film forming apparatus
Technical Field
The present invention relates to a film deposition apparatus for depositing a predetermined film deposition material on a substrate through a mask.
Background
The application field of organic EL Display devices (organic EL displays) is not only smart phones, televisions, and displays for automobiles, but also is expanding to VR HMDs (visual real Head mounted Display), and in particular, displays used in VR HMDs are required to form pixel patterns with high precision in order to reduce glare to users. That is, further high resolution is required.
In the manufacture of such an organic EL display device, when forming an organic light-emitting element (organic EL element; OLED) constituting the organic EL display device, a film-forming material discharged from a film-forming source of a film-forming device is formed on a substrate through a mask on which a pixel pattern is formed, thereby forming an organic layer and a metal layer.
In such a film deposition apparatus, in order to improve the film deposition accuracy, the relative position between the substrate and the mask is detected before the film deposition process, and when the relative position is shifted, the substrate and/or the mask are moved relative to each other to adjust (align) the position.
Therefore, the conventional film deposition apparatus includes an alignment stage mechanism that is coupled to the substrate support unit and/or the mask stage and drives the substrate support unit and/or the mask stage.
Conventionally, as a film deposition apparatus including an alignment stage mechanism, a film deposition apparatus as disclosed in patent document 1 is known. Patent document 1 discloses a structure in which a support plate on which an alignment stage mechanism is mounted is separated from a top plate of a film forming chamber. Thus, deformation of the film forming chamber and vibration transmitted to the film forming chamber can be reduced, and positional deviation between the substrate and the mask can be suppressed.
Documents of the prior art
Patent document
Patent document 1: japanese unexamined patent publication No. 2012-33468
Disclosure of Invention
Problems to be solved by the invention
However, in the film deposition apparatus disclosed in patent document 1, when the alignment stage mechanism of the substrate or the mask is driven, the vibration during the driving is transmitted to either one of the support bodies, and the alignment accuracy is deteriorated. Further, when performing alignment with high accuracy, it is necessary to increase the controllable frequency band of the alignment stage mechanism, but vibration during driving interferes with the alignment stage mechanism, and the control performance is degraded, resulting in degradation of alignment accuracy.
The present invention has been made in view of the problems of the conventional techniques described above, and an object thereof is to provide a film deposition apparatus capable of suppressing a decrease in alignment accuracy.
Means for solving the problems
A film forming apparatus according to an aspect of the present invention includes: a container; a container support body provided outside the container and supporting at least a part of the container; a substrate holder which is provided in the container and holds a substrate; a mask holder which is provided in the container and supports a mask; a substrate holder driving mechanism that drives the substrate holder; a mask holder driving mechanism that drives the mask holder; and a vibration transmission suppressing member provided at least one of between the container support body and the substrate holder driving mechanism and between the container support body and the mask holder driving mechanism.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a decrease in alignment accuracy can be suppressed.
Drawings
Fig. 1 is a plan view schematically showing a part of the structure of an apparatus for manufacturing an electronic device.
FIG. 2 is a schematic view showing the structure of a film deposition apparatus according to the present invention.
Fig. 3 is a schematic diagram showing a structure of suppressing vibration transmission according to embodiment 1 of the present invention.
Fig. 4 is a schematic diagram showing a configuration of suppressing vibration transmission according to embodiment 2 of the present invention.
Description of the reference numerals
11. 311, 411: film forming apparatus, 21, 321, 421: vacuum vessel, 22, 322, 422: substrate holder drive mechanism, 23, 323: mask holder, 423: mask holder drive mechanism support, 24, 424: substrate holder, 25, 325, 425: film formation source, 26: magnetic force applying member, 27, 327: alignment camera unit, 28, 328, 428: mask holder drive mechanism, 29, 329, 429: vibration transmission suppressing member, 215, 315, 415: substrate holder driving mechanism support, 217, 317, 417: a vacuum container support body.
Detailed Description
The following describes modes for carrying out the present invention based on the drawings. The following embodiments and examples are illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the apparatus, the process flow, the manufacturing conditions, the dimensions, the materials, the shapes, and the like are not intended to limit the scope of the present invention to these embodiments, unless otherwise specified.
The present invention is applicable to an apparatus for depositing various materials on a surface of a substrate to form a film, and is suitably applicable to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition.
As a material of the substrate, any material such as a semiconductor (e.g., silicon), glass, a film of a polymer material, or a metal can be selected. The substrate may be, for example, a silicon wafer or a substrate in which a film of polyimide or the like is laminated on a glass substrate. As the film forming material, any material such as an organic material or a metallic material (metal, metal oxide, or the like) can be selected.
The present invention is applicable to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus, in addition to a vacuum Deposition apparatus using thermal evaporation. Specifically, the technique of the present invention can be applied to manufacturing apparatuses for various electronic devices such as semiconductor devices, magnetic devices, and electronic elements, optical elements, and the like. Specific examples of the electronic device include a light emitting element, a photoelectric conversion element, and a touch panel.
Among these, the present invention can be preferably applied to a manufacturing apparatus for an organic light-emitting element such as an OLED and an organic photoelectric conversion element such as an organic thin-film solar cell. The electronic device of the present invention also includes a display device (for example, an organic EL display device) including a light-emitting element, an illumination device (for example, an organic EL illumination device), and a sensor (for example, an organic CMOS image sensor) including a photoelectric conversion element.
< apparatus for manufacturing electronic device >
Fig. 1 is a plan view schematically showing a part of the structure of an apparatus for manufacturing an electronic device.
The manufacturing apparatus of fig. 1 is used for manufacturing a display panel of an organic EL display device for VR HMD, for example. In the case of a display panel for VR HMD, for example, after a film is formed on a silicon wafer of a predetermined size (e.g., 300 mm) for forming organic EL elements, the silicon wafer is cut along a region between element forming regions (scribe line region) to produce a plurality of small-sized panels.
The manufacturing apparatus of the electronic device of the present embodiment generally includes a plurality of cluster apparatuses (japanese: 1246312521\12473124791.
The cluster apparatus 1 includes a film deposition device 11 that performs a process (e.g., film deposition) on a substrate W, a mask stocker 12 that stores masks before and after use, and a transfer chamber 13 disposed at the center of the mask stocker. As shown in fig. 1, the transfer chamber 13 is connected to the film formation apparatus 11 and the mask stocker 12, respectively.
A transfer robot 14 for transferring the substrate W or the mask is disposed in the transfer chamber 13. The transfer robot 14 is a robot having a structure in which a robot hand holding the substrate W or the mask is attached to an articulated arm, for example.
In the film deposition apparatus 11, a film deposition material discharged from a film deposition source is deposited on a substrate W through a mask. A series of film formation processes, such as transfer of the substrate W/mask to the transfer robot 14, adjustment (alignment) of the relative position of the substrate W and the mask, fixing of the substrate W to the mask, and film formation, are performed by the film formation device 11.
In a manufacturing apparatus for manufacturing an organic EL display device, the film forming apparatus 11 can be classified into an organic film forming apparatus and a metallic film forming apparatus according to the type of material to be formed, and the organic film forming apparatus forms an organic film forming material on a substrate W by vapor deposition or sputtering. The metallic film deposition apparatus deposits a metallic film deposition material on the substrate W by vapor deposition or sputtering.
In a manufacturing apparatus for manufacturing an organic EL display device, which film forming apparatus is disposed at which position differs depending on the stacked structure of the organic EL elements to be manufactured, and a plurality of film forming apparatuses for forming films thereof are disposed depending on the stacked structure of the organic EL elements.
In the case of an organic EL element, generally, the organic EL element has a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are sequentially stacked on a substrate W on which an anode is formed, and an appropriate film forming device is disposed along the flow direction of the substrate so that these layers can be sequentially formed.
For example, in fig. 1, the film formation apparatus 11a forms the hole injection layer HIL and/or the hole transport layer HTL. The film forming devices 11b and 11f form blue light-emitting layers, the film forming device 11c forms red light-emitting layers, and the film forming devices 11d and 11e form green light-emitting layers. The film forming apparatus 11g forms the electron transport layer ETL and/or the electron injection layer EIL. The film forming device 11h is configured to form a cathode metal film. In the example shown in fig. 1, the film formation rates of the blue light-emitting layer and the green light-emitting layer are slower than the film formation rate of the red light-emitting layer in terms of the characteristics of the raw materials, and therefore, in order to balance the process rates, the blue light-emitting layer and the green light-emitting layer are formed by 2 film formation apparatuses, respectively.
In the mask stocker 12, a new mask to be used in a film forming process of the film forming apparatus 11 and an existing mask are separately stored in a plurality of cassettes. The transfer robot 14 transfers a used mask from the film deposition apparatus 11 to the cassette of the mask stocker 12, and transfers a new mask stored in another cassette of the mask stocker 12 to the film deposition apparatus 11.
The relay device for connecting the plurality of cluster devices 1 includes a passage chamber 15 for transferring the substrate W between the cluster devices 1.
The transfer robot 14 of the transfer chamber 13 receives the substrate W from the upstream passage chamber 15 and transfers the substrate W to one of the film deposition apparatuses 11 (e.g., the film deposition apparatus 11 a) in the cluster apparatus 1. The transfer robot 14 receives a substrate W whose film formation process in the cluster apparatus 1 has been completed from one of the plurality of film formation apparatuses 11 (for example, the film formation apparatus 11 e) and transfers the substrate W to the passage chamber 15 connected to the downstream side.
The relay apparatus may include a buffer chamber (not shown) for absorbing a difference in processing speed between the substrates W in the upstream cluster apparatus 1 and the downstream cluster apparatus 1, and a whirling chamber (not shown) for changing the direction of the substrates W, in addition to the passage chamber 15. For example, the buffer chamber includes a substrate loading part that temporarily stores a plurality of substrates W. The spin chamber includes a substrate rotating mechanism (e.g., a turntable or a transfer robot) for rotating the substrate W by 180 degrees. This makes the orientation of the substrate W identical between the upstream cluster device and the downstream cluster device, thereby facilitating substrate processing.
The passage chamber 15 may include a substrate loading unit (not shown) for temporarily storing the plurality of substrates W and a substrate rotating mechanism. That is, the passage chamber 15 may also function as a buffer chamber and a swirl chamber.
The film formation apparatus 11, the mask stocker 12, the transfer chamber 13, and the like constituting the cluster apparatus 1 are maintained in a high vacuum state during the production of the organic light-emitting elements. The passage chamber 15 of the relay device is normally maintained in a low vacuum state, but may be maintained in a high vacuum state if necessary.
The substrate W on which the film formation of the plurality of layers constituting the organic EL element is completed is transported to a sealing device (not shown) for sealing the organic EL element, a cutting device (not shown) for cutting the substrate into a predetermined panel size, and the like.
In this embodiment, the configuration of the apparatus for manufacturing an electronic device is described with reference to fig. 1, but the present invention is not limited to this, and other types of apparatuses and chambers may be provided, and the arrangement between these apparatuses and chambers may be changed.
For example, the electronic device manufacturing apparatus of the present invention may be an in-line type instead of the cluster type shown in fig. 1. That is, the substrate W and the mask may be mounted on a carrier, and the film may be formed while being transported in a plurality of film forming apparatuses arranged in a line. Further, a structure of a type in which a cluster type and a line type are combined may be provided. For example, the organic layer may be formed by a cluster-type manufacturing apparatus, and the electrode layer (cathode layer) may be formed by an inline-type manufacturing apparatus, such as a sealing step and a cutting step.
The following describes a specific configuration of the film formation apparatus 11.
< film Forming apparatus >
Fig. 2 is a schematic diagram showing the structure of the film formation apparatus 11. In the following description, an XYZ rectangular coordinate system is used in which the vertical direction is a Z direction and the horizontal plane is an XY plane. In addition, by θ X The angle of rotation about the X-axis is expressed by θ Y Representing the angle of rotation about the Y axis by theta Z Indicating the angle of rotation about the Z axis.
Fig. 2 is a cross-sectional view showing an example of a film deposition apparatus 11 that heats and evaporates a film deposition material to form a film on a substrate W through a mask M.
The film forming apparatus 11 includes: a vacuum chamber 21 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas; a substrate holder 24 provided in the vacuum chamber 21 and holding the substrate W; a substrate holder driving mechanism 22 provided in the vacuum chamber 21 for driving the substrate holder in at least X-direction, Y-direction and theta Z Directionally driving the substrate support 24; a mask holder 23 provided in the vacuum chamber 21 and supporting the mask M; a mask holder driving mechanism 28 for driving the mask holder in at least X-direction, Y-direction, theta Z The mask holder 23 is driven in the direction; and a film forming source 25 which is provided in the vacuum container 21, stores a film forming material, and discharges the film forming material in a granulated state at the time of film formation.
The film deposition apparatus 11 may further include a magnetic force applying unit 26 for attracting the mask M toward the substrate W by a magnetic force. The magnetic force applying member 26 may also serve as a cooling member (e.g., a cooling plate) for suppressing the temperature rise of the substrate W.
The vacuum chamber 21 of the film deposition apparatus 11 includes: a 1 st vacuum chamber 211 in which the substrate holder drive mechanism 22 is disposed; and a 2 nd vacuum vessel part 212 in which the film formation source 25 is disposed, and the entire internal space of the vacuum vessel 21 is maintained in a high vacuum state by, for example, a vacuum pump P connected to the 2 nd vacuum vessel part 212.
In addition, the extensible member 213 is provided at least between the 1 st vacuum chamber portion 211 and the 2 nd vacuum chamber portion 212. The stretchable member 213 reduces the transmission of vibration from the vacuum pump connected to the 2 nd vacuum chamber portion 212 and vibration from the floor or the floor where the film deposition apparatus 11 is installed (floor vibration) to the 1 st vacuum chamber portion 211 through the 2 nd vacuum chamber portion 212. The stretchable member 213 is, for example, a bellows, but other members may be used as long as the transmission of vibration between the 1 st vacuum container portion 211 and the 2 nd vacuum container portion 212 can be reduced.
The film forming apparatus 11 further includes a vacuum container support 217 for supporting at least a part of the vacuum container 21 (for example, the 1 st vacuum container portion 211 shown in fig. 2).
The substrate holder 24 is a member for holding the substrate W as a film-formed body transferred by the transfer robot 14 of the transfer chamber 13, and is provided on a micro-motion table plate portion 222 of a movable table of a substrate holder drive mechanism 22 described later.
The substrate holder 24 is a substrate clamping member or a substrate suction member. The substrate suction member as the substrate holder 24 is, for example, an electrostatic chuck or a pressure-sensitive adhesive suction member having a structure in which a circuit such as a metal electrode is embedded in a dielectric/insulator (e.g., ceramic material) base body.
The electrostatic chuck serving as the substrate holder 24 may be a coulomb-type electrostatic chuck in which a dielectric having a relatively high resistance is interposed between the electrode and the adsorption surface and is adsorbed by coulomb force between the electrode and the object, a Johnson-Rahbek-type electrostatic chuck in which a dielectric having a relatively low resistance is interposed between the electrode and the adsorption surface and is adsorbed by Johnson-Rahbek force generated between the adsorption surface of the dielectric and the object, or a gradient-type electrostatic chuck in which the object is adsorbed by an uneven electric field.
When the object to be attracted is a conductor or a semiconductor (silicon wafer), it is preferable to use an electrostatic chuck of coulomb type or an electrostatic chuck of johnson-rahbek type, and when the object to be attracted is an insulator such as glass, it is preferable to use an electrostatic chuck of gradient type.
The electrostatic chuck may be formed of one plate or may be formed to have a plurality of sub-plates. In addition, when the electrostatic attraction force is controlled to be different depending on the position in one board, the electrostatic attraction force may be controlled to be different depending on the position in the case where the electrostatic attraction force is controlled to be different.
The substrate holder drive mechanism 22 is an alignment stage mechanism for adjusting the position of the substrate W by driving the substrate holder 24 with a magnetic levitation linear motor, and adjusts at least the X-direction, the Y-direction, and θ Z In the direction, preferably X-direction, Y-direction, Z-direction, θ X Direction, theta Y Direction, theta Z The position of the substrate holder 24 in these 6 directions.
The substrate holder drive mechanism 22 includes a stage reference plate portion 221 that functions as a fixed stage, a fine movement stage plate portion 222 that functions as a movable stage, and a magnetic levitation unit 223 for magnetically levitating and moving the fine movement stage plate portion 222 with respect to the stage reference plate portion 221.
As shown in fig. 2, the substrate holder driving mechanism 22 is provided on a substrate holder driving mechanism support 215 extending from a vacuum container support 217. The extensible member 213 may be provided between the substrate holder driving mechanism support 215 and the 1 st vacuum chamber portion 211. This can further reduce the transmission of external vibration to the substrate holder driving mechanism 22 via the substrate holder driving mechanism support 215.
As described above, by using a magnetic levitation type drive mechanism that does not physically contact the substrate W as the substrate holder drive mechanism 22, it is possible to suppress transmission of ground vibration, vibration from the vacuum pump (P), vibration of the gate valve, and vibration from the transfer robot 14 to the substrate W.
The mask holder 23 is a member for supporting the mask M which is fed into the vacuum chamber by the transfer robot 14. The mask M fed into the vacuum chamber is placed on the mask holder 23 at least at the time of alignment and at the time of film formation. The mask holder 23 is coupled to a mask holder drive mechanism 28 described later.
The mask holder 23 can be provided with a position detection mechanism 231 for detecting the position of the substrate W supported by the substrate holder 24. The type of the position detection mechanism 231 is not particularly limited as long as it can detect the position of the substrate W, the substrate holder 24, or the micropositioner plate portion 222.
For example, the position detection mechanism 231 may be a laser interferometer including a laser interferometer and a reflecting mirror, or may be an electrostatic capacitance sensor, a noncontact displacement meter, or an optical scale.
The mask M has an opening pattern corresponding to a thin film pattern formed on the substrate W. The opening pattern of the mask M is defined by a blocking pattern that does not pass particles of the film-forming material. As a material of the mask, invar alloy material, metal material such as silicon, copper, nickel, stainless steel, or the like is used.
For example, the Mask M used for manufacturing an organic EL display panel for VR-HMD includes a Fine Metal Mask (Fine Metal Mask) which is a Metal Mask formed with a Fine aperture pattern corresponding to an RGB pixel pattern of a light emitting layer of an organic EL element, and an aperture Mask (Open Mask) used for forming a general layer (a hole injection layer, a hole transport layer, an electron injection layer, and the like) of the organic EL element.
The mask holder drive mechanism 28 is a drive mechanism for adjusting the position of the mask holder 23, and includes a mechanism capable of horizontally (XY θ) positioning the mask holder 23 Z Direction) and a coarse movement Z elevating mechanism 28b capable of elevating and lowering the coarse movement stage mechanism 28a in the Z direction, which is the vertical direction. The coarse movement stage mechanism 28a can move alignment marks formed on the substrate W and the mask M into the field of view of an alignment camera, which will be described later, and the coarse movement Z elevating mechanism 28b can easily adjust the vertical distance between the substrate W and the mask M.
The coarse movement stage mechanism 28a and the coarse movement Z-up/down mechanism 28b are mechanically driven by a servo motor, a ball screw (not shown), or the like.
The mask holder drive mechanism 28 is provided on the vacuum container support body 217 via the vibration transmission suppressing member 29.
The vibration transmission suppressing member 29 suppresses transmission of vibration between the mask holder driving mechanism 28 and the vacuum vessel support body 217. More specifically, the vibration transmission suppressing member 29 can suppress transmission of ground vibration, vibration of the vacuum pump (P) transmitted from the vacuum chamber 21, vibration of the gate valve of the vacuum chamber 21, and vibration transmitted from the conveying robot 14 that conveys the substrate and the mask to the mask holder 23 via the mask holder driving mechanism 28.
Further, the reaction force generated when the substrate holder driving mechanism 22 is driven can be prevented from being transmitted to the mask holder 23 and the position detection mechanism 231 provided in the mask holder 23 via the substrate holder driving mechanism support 215 and the vacuum chamber support 217. This can suppress excitation of resonance vibration of the substrate holder driving mechanism support 215 or the like which may interfere with control in frequency characteristics during control of the substrate holder driving mechanism 22, and therefore, can stably control to a higher frequency, and as a result, can improve alignment accuracy.
The vibration transmission suppressing member 29 may be an active vibration damper or a passive vibration damper such as vibration damping rubber. When the vibration transmission suppressing member 29 is an active vibration damper, the transmission of vibration can be effectively suppressed regardless of the type, magnitude, direction, and the like of the vibration.
The film formation source 25 includes a crucible (not shown) for containing a film formation material to be formed on the substrate W, a heater (not shown) for heating the crucible, a shutter (not shown) for preventing the film formation material from scattering toward the substrate until the deposition rate from the film formation source 25 becomes constant, and the like. The film formation source 25 is provided with one or more escape holes through which the granulated film formation material is discharged, and the mask M and the substrate W are disposed in front of the escape holes so that the film formation surfaces thereof face the escape holes.
The film formation source 25 has various structures depending on the application, such as a point (point) film formation source, a line (linear) film formation source, and the like.
The film formation source 25 may include a plurality of crucibles that receive different film formation materials. In such a configuration, a plurality of crucibles for storing different film formation materials may be provided so as to be movable to the film formation position, so that the film formation materials can be changed without opening the vacuum chamber 21 to the atmosphere.
The magnetic force applying member 26 is a member for attracting the mask M toward the substrate W by a magnetic force and bringing the mask M into close contact therewith during the film forming process, and is provided so as to be vertically movable. The magnetic force applying member 26 is constituted by an electromagnet and/or a permanent magnet, for example.
Although not shown in fig. 2, the film forming apparatus 11 may include a film thickness monitor (not shown) for measuring the thickness of a film deposited on a substrate and a film thickness calculating means (not shown).
A magnetic force applying member elevating mechanism 261 for elevating and lowering the magnetic force applying member 26 is provided on the upper outer side (atmosphere side) of the vacuum chamber 21.
The film deposition apparatus 11 further includes an alignment camera unit 27 provided outside the upper portion (on the atmosphere side) of the vacuum chamber 21 and configured to take an image of an alignment mark formed on the substrate W and the mask M.
In the present embodiment, the alignment camera unit 27 may include a coarse alignment camera for roughly adjusting the relative position of the substrate W and the mask M and a fine alignment camera for accurately adjusting the relative position of the substrate W and the mask M. The coarse alignment camera has a relatively wide angle of view and a low resolution, and the fine alignment camera has a relatively narrow angle of view and a high resolution.
The coarse alignment camera and the fine alignment camera are provided at positions corresponding to alignment marks formed on the substrate W and the mask M. For example, the fine alignment camera is provided with 4 cameras to form 4 corners of a rectangle, and the coarse alignment camera is provided at the center of two opposing sides of the rectangle. However, the present invention is not limited to this, and may have other arrangements depending on the positions of the alignment marks of the substrate W and the mask M.
As shown in fig. 2, the alignment camera unit 27 of the film formation apparatus 11 images the alignment mark from the upper atmosphere side of the vacuum chamber 21 through the vacuum corresponding cylinder 214 provided in the vacuum chamber 21. In this way, the alignment camera is disposed so as to enter the inside of the vacuum chamber 21 through the vacuum corresponding cylinder, and thereby, even if the substrate W and the mask M are supported relatively far from the substrate holder driving mechanism support body 215 by the presence of the substrate holder driving mechanism 22, the alignment marks formed on the substrate W and the mask M can be brought into focus. The position of the lower end of the vacuum corresponding cylinder can be appropriately determined depending on the depth of focus of the alignment camera and the distance between the substrate W/mask M and the substrate holder drive mechanism support body 215.
Although not shown in fig. 2, the inside of the vacuum chamber 21 sealed in the film forming step is dark, and therefore, an illumination light source for illuminating the alignment mark from below may be provided in order to image the alignment mark by the alignment camera which has entered the inside of the vacuum chamber 21.
The film deposition apparatus 11 includes a control unit (not shown). The control unit has functions of controlling the transfer and alignment of the substrate W and the mask M, controlling the film formation, and the like. The control unit may have a function of controlling the voltage application to the electrostatic chuck. The control unit performs feedback control based on the position detected by the position detection mechanism 231, in particular, when controlling the alignment.
The control unit may be constituted by a computer having a processor, a memory, a storage, an I/O, and the like, for example. In this case, the function of the control unit is realized by the processor executing a program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (Programmable Logic Controller) may be used. Alternatively, a part or all of the functions of the control unit may be constituted by circuits such as ASICs and FPGAs. Further, the control unit may be provided for each film deposition apparatus, or one control unit may control a plurality of film deposition apparatuses.
< vibration Transmission suppressing mechanism >
Hereinafter, the vibration transmission suppressing mechanism in the film deposition apparatus 11 according to the embodiment of the present invention will be described in detail with reference to fig. 3 and 4.
< embodiment 1 >
Fig. 3 is a schematic view showing a vibration transmission suppressing mechanism of the film formation apparatus 311 according to embodiment 1 of the present invention.
Referring to fig. 3, the film forming apparatus 311 includes a vacuum chamber 321 whose interior is maintained in a vacuum atmosphere, for example. At least a part of the vacuum vessel 321 is supported by a vacuum vessel support 317 provided outside thereof.
A substrate holder (not shown) for holding the substrate W and a mask holder 323 for supporting the mask M are provided in the vacuum chamber 321. The substrate holder is an electrostatic chuck that holds the substrate W by being attracted thereto, but is not limited thereto. The mask holder 323 is supported in the vacuum vessel 321 by a mask holder support 316 extending from a mask holder drive mechanism 328.
The substrate holder driving mechanism 322 is a mechanism for driving the substrate holder, and is supported in the vacuum chamber 321 by the substrate holder driving mechanism support 315 extending from the vacuum chamber support 317. According to the present embodiment, the substrate holder drive mechanism 322 is a magnetic levitation type drive mechanism for moving the substrate holder in a non-contact manner by a magnetic levitation linear motor to adjust the position of the substrate W, and is capable of adjusting at least the X direction, the Y direction, and θ Z Direction, preferably X direction, Y direction, Z direction, θ X Direction, theta Y Direction, theta Z The position of the substrate W in the 6 directions.
Mask supportThe moving mechanism 328 is a mechanical driving mechanism for moving the mask holder 323 to adjust the position of the mask M. The mask holder moving mechanism 328 can adjust at least the X-direction, the Y-direction, the Z-direction, and θ Z Direction, preferably X direction, Y direction, Z direction, θ X Direction, theta Y Direction, theta Z The position of the mask M in the 6 directions. The mask holder driving mechanism 328 is provided outside the vacuum chamber 321, and includes a servomotor, a rolling linear guide, a ball screw, and the like.
The mask holder drive mechanism 328 is provided on the vacuum chamber support body 317 via a vibration transmission suppressing member 329. That is, the vibration transmission suppressing member 329 is provided between the mask holder driving mechanism 328 and the vacuum vessel support body 317. A vibration transmission suppressing member may be provided between the substrate holder driving mechanism support 315 and the vacuum chamber support 317.
The film formation apparatus 311 according to the present embodiment may further include a position detection mechanism 331 provided in the mask holder 323 and configured to detect a position of the substrate W held by the substrate holder. For example, the position detection unit 331 can be selected from a laser interferometer, a capacitance sensor, a non-contact displacement meter, or an optical scale.
The film formation apparatus 311 according to the present embodiment may further include an alignment camera unit 327 provided outside the upper portion of the vacuum chamber 2 via the substrate holder driving mechanism support 315, and configured to capture an image of an alignment mark formed on the substrate W and the mask M.
According to the present embodiment, the substrate holder driving mechanism 322 is constituted by a magnetic levitation type driving mechanism that adjusts the position of the substrate W without contacting the substrate W or the substrate holder. Further, a mask holder driving mechanism 328, which is a mechanical driving mechanism for adjusting the position of the mask M, is provided on the vacuum chamber support body 317 via a vibration transmission suppressing member 329.
With such a configuration, it is possible to suppress transmission of ground vibration, vibration of the vacuum pump P transmitted from the vacuum chamber 321, vibration of the gate valve, and vibration transmitted from the transfer robot 14 that transfers the substrate W and the mask M to the mask holder driving mechanism 328.
Even if a reaction force generated when the substrate holder drive mechanism 322, which is a magnetic levitation type drive mechanism, is driven is transmitted to the vacuum container support body 317 via the substrate holder drive mechanism support body 315, transmission to the mask holder 323 and the position detection mechanism 331 provided in the mask holder 323 can be suppressed by the vibration transmission suppression member 329. This can suppress excitation of resonance vibration of the substrate holder drive mechanism support 315, the mask holder support 316, and the like, which may interfere with control in frequency characteristics during control of the substrate holder drive mechanism 322, and therefore, can be stably controlled to a higher frequency, and as a result, can improve alignment accuracy.
< embodiment 2 >
Fig. 4 is a schematic view showing a vibration transmission suppressing mechanism in a film deposition apparatus 411 according to embodiment 2 of the present invention.
In the film deposition apparatus 411 shown in fig. 4, the substrate holder drive mechanism 422 is a mechanical drive mechanism provided outside the vacuum chamber 421, and the mask holder drive mechanism 428 is a magnetic levitation type drive mechanism provided in the vacuum chamber 421. Further, a vibration transmission suppressing member 429 is provided between the vacuum chamber support 417 and the substrate holder driving mechanism 422. Hereinafter, the vibration transmission suppressing mechanism of the film deposition apparatus according to the present embodiment will be described mainly focusing on differences from the vibration transmission suppressing mechanism of the film deposition apparatus 311 shown in fig. 3.
Referring to fig. 4, the film forming apparatus 411 includes a vacuum chamber 421, for example, the inside of which is maintained in a vacuum atmosphere. At least a part of the vacuum vessel 421 is supported by a vacuum vessel support 417 provided outside the vacuum vessel.
A substrate holder 424 for holding the substrate W and a mask holder (not shown) for holding the mask M are provided in the vacuum chamber 421. The substrate holder 424 is an electrostatic chuck or a chucking mechanism that adsorbs and holds the substrate W. The mask holder is an electrostatic chuck that adsorbs and holds the mask M.
The mask holder driving mechanism 428 is a driving mechanism for moving a mask holder (not shown) to adjust the position of the mask M, and is driven by a mask holder driving machine extending from the vacuum vessel support 417The structure support 423 is supported in the vacuum chamber 421. According to the present embodiment, the mask holder driving mechanism 428 is a magnetic levitation type driving mechanism for moving the mask holder in a non-contact manner by a magnetic levitation linear motor to adjust the position of the mask M, and at least the X direction, the Y direction, and θ can be adjusted Z Direction, preferably X direction, Y direction, Z direction, θ X Direction, theta Y Direction, theta Z The position of the mask M in the 6 directions.
The substrate holder moving mechanism 422 is a mechanical driving mechanism for moving the substrate holder 424 to adjust the position of the substrate W, and is configured to be capable of adjusting at least the X direction, the Y direction, the Z direction, and θ Z Direction, preferably X direction, Y direction, Z direction, θ X Direction, theta Y Direction, theta Z The position of the substrate W in the 6 directions. The substrate holder driving mechanism 422 is provided outside the vacuum chamber 421, and is composed of a servo motor, a rolling linear guide, a ball screw, and the like.
The substrate holder driving mechanism 422 is supported by a substrate holder driving mechanism support 415 extending from the vacuum chamber support 417. In the present embodiment, the substrate holder driving mechanism support 415 includes: a 1 st support member 415a disposed outside an upper portion of the vacuum chamber 421 and provided with a substrate holder driving mechanism 422; and a 2 nd support member 415b extending from the vacuum vessel support 417 and supporting the 1 st support member 415a. In order to suppress the transmission of vibration, the vacuum chamber 421 and the 1 st supporting member 415a may be coupled via an extensible member.
In the film formation apparatus 411 of the present embodiment, a vibration transmission suppressing member 429 for suppressing the transmission of vibration to the substrate holder driving mechanism 422 side is provided between the vacuum chamber support 417 and the substrate holder driving mechanism 422, particularly between the 1 st support member 415a and the 2 nd support member 415 b. The vibration transmission suppressing member 429 is provided between the vacuum chamber support 417 and the substrate holder driving mechanism 422 in the vicinity of the substrate holder driving mechanism 422, and the vibration transmitted to the substrate holder driving mechanism 422 can be more effectively suppressed. However, the present invention is not limited to this, and the vibration transmission suppressing member 429 may be provided at another position. For example, a vibration transmission suppressing member may be provided between the 2 nd support member 415b and the vacuum vessel support 417, or a vibration transmission suppressing member may be provided between the 1 st support member 415a and the 2 nd support member 415b, and between the 2 nd support member 415b and the vacuum vessel support 417.
The film deposition apparatus 411 of the present embodiment may further include a position detection mechanism 431 provided to the substrate holder 424 and configured to detect a position of the mask M held by the mask holder. For example, the position detection mechanism 431 can be selected from a laser interferometer, a capacitance sensor, a non-contact displacement meter, or an optical scale.
Although not shown in fig. 4, in the film deposition apparatus 411 of the present embodiment, an alignment camera unit for imaging an alignment mark formed on the substrate W and the mask M can be provided on the mask holder driving mechanism support 423.
According to the present embodiment, the vibration transmission suppressing member 429 is provided between the vacuum chamber support 417 and the substrate holder driving mechanism 422, which is a mechanical driving mechanism for adjusting the position of the substrate W. The mask holder drive mechanism 428 is a magnetic levitation type drive mechanism for adjusting the position of the mask M without contacting the mask M or the mask holder.
This can suppress transmission of ground vibration, vibration of the vacuum pump transmitted from the vacuum chamber 421, vibration of the gate valve, and vibration transmitted from the transfer robot 14 for transferring the substrate W and the mask M to the substrate holder driving mechanism 422.
Even if a reaction force generated when the mask holder driving mechanism 428 as a magnetic levitation type driving mechanism is driven is transmitted to the vacuum chamber supporting body 417 via the mask holder driving mechanism supporting body 423, the vibration transmission to the substrate holder 424 and the position detecting mechanism 431 provided to the substrate holder 424 can be suppressed by the vibration transmission suppressing member 429. This can suppress excitation of resonance vibration of the substrate holder drive mechanism support 415, the mask holder drive mechanism support 423, and the like, which may interfere with control in the frequency characteristics during control of the mask holder drive mechanism 428, and therefore, can stably control to a higher frequency, and as a result, can improve alignment accuracy.

Claims (12)

1. A film deposition apparatus, comprising:
a container;
a container support body provided outside the container and supporting at least a part of the container;
a substrate holder which is provided in the container and holds a substrate;
a mask holder which is provided in the container and supports a mask;
a substrate holder driving mechanism that drives the substrate holder;
a mask holder driving mechanism that drives the mask holder; and
a vibration transmission suppressing member provided at least one of between the container support body and the substrate holder driving mechanism and between the container support body and the mask holder driving mechanism,
one of the substrate holder drive mechanism and the mask holder drive mechanism is a magnetic levitation type drive mechanism including a stage reference plate portion functioning as a fixed stage, a fine motion stage plate portion functioning as a movable stage, and a magnetic levitation means for magnetically levitating and moving the fine motion stage plate portion with respect to the stage reference plate portion,
the other of the substrate holder driving mechanism and the mask holder driving mechanism is a mechanical driving mechanism, and is provided on the container support body via the vibration transmission suppressing member.
2. The film forming apparatus according to claim 1,
the substrate support driving mechanism is disposed in the container,
the mask holder driving mechanism is a mechanical driving mechanism, is arranged outside the container,
the vibration transmission suppressing member is provided between the container support body and the mask holder driving mechanism.
3. The film forming apparatus according to claim 1,
the film forming apparatus further includes a position detection mechanism provided in the mask holder and configured to detect a position of the substrate held by the substrate holder.
4. The film forming apparatus according to claim 1,
the film forming apparatus further includes a substrate holder driving mechanism support body configured to extend from the container support body and support the substrate holder driving mechanism.
5. The film forming apparatus according to claim 4,
the film forming apparatus further includes an alignment camera unit provided in the substrate holder drive mechanism support body and configured to measure a relative positional displacement amount between the substrate held by the substrate holder and the mask held by the mask holder.
6. The film forming apparatus according to claim 1,
the substrate support driving mechanism is a magnetic suspension type driving mechanism,
the mask holder driving mechanism is a mechanical driving mechanism.
7. The film forming apparatus according to claim 1,
the substrate support driving mechanism is a mechanical driving mechanism and is arranged outside the container,
the reticle holder drive mechanism is disposed inside the container,
the vibration transmission suppressing member is provided between the container support body and the substrate holder driving mechanism.
8. The film forming apparatus according to claim 7,
the film forming apparatus further includes a position detection mechanism provided in the substrate holder and configured to detect a position of the mask held by the mask holder.
9. The film forming apparatus according to claim 7,
the film forming apparatus further includes:
a substrate holder driving mechanism support body configured to extend from the container support body and support the substrate holder driving mechanism; and
and a mask holder driving mechanism support body configured to extend from the container support body and support the mask holder driving mechanism.
10. The film forming apparatus according to claim 9,
the substrate support drive mechanism is a mechanical drive mechanism,
the substrate support driving mechanism support body includes: a 1 st support member provided with the substrate holder drive mechanism; and a 2 nd support member configured to extend from the container support body and support the 1 st support member,
the vibration transmission suppressing member is provided between the 1 st support member and the 2 nd support member.
11. The film forming apparatus according to claim 9,
the film forming apparatus further includes an alignment camera unit provided on the mask holder drive mechanism support body and configured to measure a relative positional displacement amount between the substrate held by the substrate holder and the mask held by the mask holder.
12. The film forming apparatus according to any one of claims 1 to 11,
the vibration transmission suppressing member is an active vibration damping device.
CN202011260259.1A 2019-11-15 2020-11-12 Film forming apparatus Active CN112813381B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005308145A (en) * 2004-04-23 2005-11-04 Nikon Corp Vibration-isolating device and exposure device
CN102312189A (en) * 2010-07-06 2012-01-11 佳能株式会社 Film formation apparatus
CN108701630A (en) * 2017-01-31 2018-10-23 应用材料公司 The method of substrate carrier and processing substrate
JP2019099910A (en) * 2017-11-29 2019-06-24 キヤノントッキ株式会社 Film deposition apparatus, film deposition method, and production method of electronic device
JP2019116679A (en) * 2017-12-27 2019-07-18 キヤノントッキ株式会社 Film deposition apparatus, film deposition method, and method of manufacturing electronic device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102007627B1 (en) * 2013-07-08 2019-08-05 가부시키가이샤 니콘 Substrate processing apparatus, device manufacturing system, device manufacturing method, and pattern formation apparatus
WO2019192679A1 (en) * 2018-04-03 2019-10-10 Applied Materials, Inc. Apparatus and vacuum system for carrier alignment in a vacuum chamber, and method of aligning a carrier

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005308145A (en) * 2004-04-23 2005-11-04 Nikon Corp Vibration-isolating device and exposure device
CN102312189A (en) * 2010-07-06 2012-01-11 佳能株式会社 Film formation apparatus
CN108701630A (en) * 2017-01-31 2018-10-23 应用材料公司 The method of substrate carrier and processing substrate
JP2019099910A (en) * 2017-11-29 2019-06-24 キヤノントッキ株式会社 Film deposition apparatus, film deposition method, and production method of electronic device
JP2019116679A (en) * 2017-12-27 2019-07-18 キヤノントッキ株式会社 Film deposition apparatus, film deposition method, and method of manufacturing electronic device

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