CN111434797B

CN111434797B - Film forming apparatus and electronic device manufacturing apparatus

Info

Publication number: CN111434797B
Application number: CN201911161941.2A
Authority: CN
Inventors: 铃木健太郎
Original assignee: Canon Tokki Corp
Current assignee: Canon Tokki Corp
Priority date: 2019-01-11
Filing date: 2019-11-25
Publication date: 2023-10-31
Anticipated expiration: 2039-11-25
Also published as: KR20200087593A; CN116770224A; CN111434797A; KR102182471B1

Abstract

The invention provides a film forming apparatus capable of improving film forming accuracy and a manufacturing apparatus of electronic devices. The film forming apparatus is a film forming apparatus (11) having a vacuum vessel (21), wherein the vacuum vessel (21) comprises: a plurality of vacuum container parts (1 st vacuum container part (211) and 2 nd vacuum container part (212)); and a stretchable member (213) provided between the plurality of vacuum container parts (between the 1 st vacuum container part (211) and the 2 nd vacuum container part (212)).

Description

Film forming apparatus and electronic device manufacturing apparatus

Technical Field

The present invention relates to a film forming apparatus for forming a film of a film forming material on a substrate through a mask, and a manufacturing apparatus for an electronic device including the film forming apparatus.

Background

The application field of the organic EL display device (organic EL display) relates not only to a smart phone, a television, an automobile display, but also to VR-HMD (Virtual Reality Head Mount Display: virtual reality head mounted display) and the like. In these devices, it is desirable to form a pixel pattern with high accuracy. Particularly, a display used in a VR HMD is required to form a pixel pattern with higher accuracy in order to prevent dizziness of a user.

In the production of an organic EL display device (organic EL display), when an organic light emitting element (organic EL element; OLED) constituting the organic EL display device is formed, a film-forming material discharged from a film-forming source of the film-forming device is formed on a substrate through a mask having a pixel pattern formed thereon, whereby an organic layer and a metal layer are formed.

In such a film forming apparatus, the film forming step is performed in a vacuum chamber in which a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas is maintained. For example, in a film forming apparatus of an upper film forming method (Depo-up), a film forming source is provided at a lower portion of a vacuum chamber, and a substrate and a mask positioned with respect to the substrate are disposed at an upper portion of the vacuum chamber. Then, a film-forming material discharged from a film-forming source is deposited on the lower surface of the substrate through an opening formed in the mask, thereby forming a film.

In a film forming apparatus having such a scattering path of a film forming material, one of the main factors affecting film forming accuracy is the angle at which the scattered film forming material enters the substrate through the opening of the mask. For example, if the angle at which the film forming material is incident on the substrate from the film forming source through the opening of the mask, that is, if the film forming material is incident approximately perpendicularly to the film forming surface of the substrate, the film forming accuracy can be improved. On the other hand, if the incident angle of the film forming material to the substrate is small, the film forming accuracy is lowered accordingly.

As one method of increasing the angle at which the film-forming material is incident on the film-forming surface of the substrate, it is considered to lengthen the distance between the film-forming source and the substrate.

However, if the distance between the film forming source and the substrate is increased, the height of the vacuum chamber of the film forming apparatus increases correspondingly in the case of the apparatus of the upper film forming method. When the height of the vacuum vessel is increased, the substrate, the mask, and various members supporting them, which are provided on the upper side of the vacuum vessel, are susceptible to vibrations from the vacuum pump and the ground. This may cause a decrease in alignment accuracy of the substrate with respect to the mask, and the positional relationship between the substrate and the mask may become unstable during the film formation process, which may cause a decrease in film formation accuracy.

Patent document 1: japanese patent application laid-open No. 2012-033468

Disclosure of Invention

Problems to be solved by the invention

The invention aims to provide a film forming device capable of improving film forming precision and a manufacturing device of an electronic device comprising the film forming device.

Means for solving the problems

In order to solve the above problems, the present invention adopts the following means.

That is, the film forming apparatus of the present invention is a film forming apparatus having a vacuum vessel, characterized in that,

The vacuum container includes a plurality of vacuum container portions and a stretchable member provided between the plurality of vacuum container portions.

The apparatus for manufacturing an electronic device according to the present invention is characterized in that,

the manufacturing device of the electronic device comprises:

the film forming apparatus;

mask storage means for storing a mask; and

and a transfer device for transferring the substrate or the mask.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, film formation accuracy can be improved.

Drawings

Fig. 1 is a schematic configuration diagram showing a part of an apparatus for manufacturing an electronic device according to an embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view of a film forming apparatus according to an embodiment of the present invention.

Fig. 3 is a schematic configuration diagram of a magnetic levitation carriage mechanism according to an embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view of a magnetic levitation carriage mechanism according to an embodiment of the present invention.

Fig. 5 is a schematic configuration diagram of a magnetic levitation linear motor according to an embodiment of the present invention.

Fig. 6 is a schematic configuration diagram of a magnetic levitation linear motor according to an embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view of the dead weight cancellation mechanism of the embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view showing a vacuum vessel according to modification 1 of the present invention.

Fig. 9 is a schematic cross-sectional view showing a vacuum vessel according to modification 2 of the present invention.

Fig. 10 is a schematic cross-sectional view showing a vacuum vessel according to modification 3 of the present invention.

Description of the reference numerals

11. A film forming device; 21. a vacuum container; 22. a magnetic levitation loading table mechanism; 23. a mask supporting unit; 24. a substrate adsorption member; 211. a 1 st vacuum container part; 212. a 2 nd vacuum container part; 213. a telescoping member.

Detailed Description

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the accompanying drawings. However, the following embodiments and examples are illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the apparatus, the processing flow, the manufacturing conditions, the dimensions, the materials, the shapes, and the like are not intended to limit the scope of the present invention unless particularly limited.

The present invention can be applied to a device for depositing various materials on a surface of a substrate to form a film, and can be preferably applied to a device for forming a thin film (material layer) having a desired pattern by vacuum vapor deposition.

As a material of the substrate, any material such as a semiconductor (e.g., silicon), glass, a film of a polymer material, and a metal can be selected. As the substrate, for example, a substrate formed by laminating a film such as polyimide on a silicon wafer or a glass substrate can be used. As the film-forming material, any material such as an organic material and a metallic material (metal, metal oxide, or the like) can be selected.

The present invention is not limited to a vacuum deposition apparatus using heating evaporation, and can be applied to various film forming apparatuses such as a sputtering apparatus and a CVD (Chemical Vapor Deposition: chemical vapor deposition) apparatus. Specifically, the technique of the present invention can be applied to a manufacturing apparatus for various electronic devices such as semiconductor devices, magnetic devices, and electronic components, optical components, and the like. Specific examples of the electronic device include a light emitting element, a photoelectric conversion element, and a touch panel. The present invention is particularly suitable for a device for manufacturing an organic light emitting device such as an OLED, an organic photoelectric conversion device such as an organic thin film solar cell, and the like. The electronic device according to the present invention further includes a display device (for example, an organic EL display device) including a light emitting element, an illumination device (for example, an organic EL illumination device), and a sensor (for example, an organic CMOS image sensor) including a photoelectric conversion element.

[ apparatus for manufacturing electronic device ]

The overall configuration and the like of the apparatus for manufacturing an electronic device according to the present embodiment will be described with reference to fig. 1. Fig. 1 is a schematic configuration diagram showing a part of an apparatus for manufacturing an electronic device according to an embodiment of the present invention, and shows a schematic configuration of a part of the apparatus for manufacturing an electronic device in a plan view.

The manufacturing apparatus is used for manufacturing a display panel in an organic EL display apparatus for VR HMDs, for example. In the case of a display panel for a VR HMD, for example, after film formation for forming an organic EL element on a silicon wafer of a predetermined size is performed, the silicon wafer is cut out along the region (scribe line region) between the element formation regions, and a plurality of small-sized panels are produced.

The electronic device manufacturing apparatus of the present embodiment generally includes a plurality of cluster apparatuses 1 and a relay apparatus that connects the cluster apparatuses 1 to each other. The cluster apparatus 1 includes a film forming apparatus 11 that performs processing (for example, film formation) on the substrates W, a mask storage apparatus 12 that stores the masks M before and after use, and a conveyance chamber 13 (conveyance apparatus) disposed in the center of the cluster apparatus 1. As shown in fig. 1, the transfer chamber 13 is connected to the film forming apparatus 11 and the mask storage apparatus 12, respectively.

A transfer robot 14 that transfers the substrate W and the mask M is disposed in the transfer chamber 13. The transfer robot 14 is, for example, a robot having a structure in which a robot hand for holding the substrate W or the mask M is attached to a multi-joint arm.

In the film forming apparatus 11, a film forming material discharged from a film forming source forms a film on the substrate W through the mask M. A series of film forming processes such as a transfer operation of the substrate W and the mask M by the transfer robot 14, an adjustment (alignment) operation of the relative positions of the substrate W and the mask M, a fixing of the substrate W to the mask, and a film forming are performed by the film forming apparatus 11.

In the manufacturing apparatus of the organic EL display device, the film forming apparatus 11 can be classified into a film forming apparatus for an organic film and a film forming apparatus for a metal film according to the kind of the material to be formed. The film forming apparatus for forming an organic film forms a film forming material of an organic substance on the substrate W by vapor deposition or sputtering, and the film forming apparatus for forming a metallic film forming material on the substrate W by vapor deposition or sputtering.

In the manufacturing apparatus of the organic EL display device, which film forming apparatus is disposed at which position is different depending on the laminated structure of the manufactured organic EL element, and a plurality of film forming apparatuses for forming films are disposed depending on the laminated structure of the organic EL element.

In the case of an organic EL element, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are laminated in this order on a substrate W on which an anode is formed, and a film forming device is arranged appropriately along the flow direction of the substrate so that these layers can be formed in this order.

For example, in fig. 1, the film forming device 11a is configured to form the hole injection layer HIL and/or the hole transport layer HTL, the film forming devices 11b and 11f form the blue light emitting layer, the film forming device 11c forms the red light emitting layer, the film forming devices 11d and 11e form the green light emitting layer, the film forming device 11g forms the electron transport layer ETL and/or the electron injection layer EIL, and the film forming device 11h forms the cathode metal film. Since the film formation rate of the blue light-emitting layer and the green light-emitting layer is slower than that of the red light-emitting layer in terms of the characteristics of the raw materials, the blue light-emitting layer and the green light-emitting layer are formed by 2 film formation devices, respectively, in order to balance the processing speed. However, the present invention is not limited to this, and other arrangement structures can be adopted.

In the mask storage device 12, a new mask used in the film forming process by the film forming device 11 and a used mask are stored separately in two cassettes. The transfer robot 14 transfers the used mask from the film forming apparatus 11 to the cassette of the mask storage apparatus 12, and transfers a new mask stored in the other cassette of the mask storage apparatus 12 to the film forming apparatus 11.

The relay device connecting the plurality of cluster devices 1 further includes a path room 15 for transferring the substrate W from one cluster device 1 to another cluster device 1.

The transfer robot 14 disposed in the transfer chamber 13 receives the substrate W from the upstream path chamber 15 and transfers the substrate W to one of the film forming apparatuses 11 (e.g., the film forming apparatus 11 a) in the cluster apparatus 1. The transfer robot 14 receives the substrates W, which have been subjected to the film formation process in the cluster apparatus 1, from one of the plurality of film forming apparatuses 11 (for example, the film forming apparatus 11 e), and transfers the substrates W to the path chamber 15 connected to the downstream side.

In addition to the path chamber 15, the relay apparatus may further include a buffer chamber (not shown) for absorbing a difference in processing speed between the upstream cluster apparatus 1 and the downstream cluster apparatus 1, and a swirl chamber (not shown) for changing the direction of the substrate W. For example, the buffer chamber includes a substrate loading portion for temporarily storing a plurality of substrates W. The spin chamber is provided with a substrate spin mechanism (e.g., a spin table or a transfer robot) for rotating the substrate W180 degrees. This makes it possible to make the cluster device facing the upstream side and the cluster device facing the downstream side of the substrate W identical, and to facilitate substrate processing.

The path chamber 15 may be provided with a substrate loading unit (not shown) for temporarily storing a plurality of substrates W and a substrate turning mechanism. That is, the path chamber 15 can also function as both a buffer chamber and a swirl chamber.

The film forming apparatus 11, the mask storage apparatus 12, the transfer chamber 13, and the like constituting the cluster apparatus 1 are maintained in a high vacuum state during the manufacturing process of the organic light emitting element. The path chamber 15 of the relay device is usually maintained in a low vacuum state, but may be maintained in a high vacuum state as needed.

The substrate W on which the film formation of the plurality of layers constituting the organic EL element is completed is carried to a sealing device (not shown) for sealing the organic EL element, a cutting device (not shown) for cutting the substrate into a predetermined panel size, and the like.

In the present embodiment, the manufacturing apparatus of the electronic device shown in fig. 1 is described, but the present invention is not limited to this, and other kinds of apparatuses and chambers may be provided, and a configuration in which the arrangement between these apparatuses and chambers is different may be adopted.

For example, the electronic device manufacturing apparatus of the present invention can be applied not only to the cluster type shown in fig. 1 but also to the series type. In the case of a tandem type electronic device manufacturing apparatus, a substrate W and a mask M are mounted on a carrier, and film formation is performed while passing through a plurality of film forming apparatuses arranged in a row together with the carrier. The manufacturing apparatus of the electronic device of the present invention may have a structure in which a cluster type and a serial type are combined. For example, the process may be performed by a cluster-type manufacturing apparatus before the formation of the organic layer, and the sealing process, the cutting process, and the like may be performed by a tandem-type manufacturing apparatus from the step of forming the electrode layer (cathode layer).

[ film Forming apparatus ]

The film forming apparatus 11 according to the present embodiment will be described in more detail with reference to fig. 2. Fig. 2 is a schematic cross-sectional view of a film forming apparatus according to an embodiment of the present invention. In the following description, an XYZ rectangular coordinate system having a vertical direction as a Z direction and a horizontal plane (substrate surface at the time of film formation) as an XY plane is used. In addition, use θ _X Representing the rotation angle about the X-axis, denoted by θ _Y Representing the rotation angle about the Y-axis, denoted by θ _Z Representing the rotation angle about the Z-axis.

Fig. 2 shows an example of a film forming apparatus 11 that evaporates or sublimates a film forming material by heating and forms a film on a substrate W through a mask M. The film forming apparatus 11 includes a vacuum chamber 21 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen, and is provided in the vacuum chamber 21 for at least X-direction, Y-direction, and θ _Z The substrate processing apparatus includes a magnetic levitation stage mechanism 22 for adjusting the position of a substrate W in a direction, a mask support unit 23 provided in a vacuum chamber 21 for supporting a mask M, a substrate adsorbing member 24 provided in the vacuum chamber 21 for adsorbing and holding the substrate W, and a film forming source 25 for storing a film forming material and granulating and discharging the film forming material during film forming. The film forming apparatus 11 preferably further includes a magnetic force applying member 26 for adhering the mask M to the substrate W by a magnetic force.

The vacuum chamber 21 in the film forming apparatus 11 of the present embodiment includes a plurality of vacuum chamber sections 211, 212 (hereinafter, also referred to as a 1 st vacuum chamber section 211 and a 2 nd vacuum chamber section 212, respectively, as needed for convenience), and a stretchable member 213 provided between these 1 st vacuum chamber section 211 and 2 nd vacuum chamber section 212. In the example shown in fig. 2, the vacuum vessel 21 has a structure including two vacuum vessel portions 211 and 212, but the present invention is not limited to such a structure. The vacuum vessel of the present invention may have a structure including 3 or more vacuum vessel portions. Various modifications of the vacuum vessel 21 including a plurality of vacuum vessel sections will be described below.

The vacuum chamber 21 shown in fig. 2 includes a 1 st vacuum chamber portion 211 forming a 1 st internal space in which the magnetic levitation stage mechanism 22 is disposed, and a 2 nd vacuum chamber portion 212 forming a 2 nd internal space in which the film forming source 25 is disposed. In the 1 st vacuum container 211, a mask support unit 23 and a substrate adsorbing member 24 can be disposed in addition to the magnetic levitation stage mechanism 22. The 1 st internal space formed by the 1 st vacuum container portion 211 communicates with the 2 nd internal space formed by the 2 nd vacuum container portion 212, and the entire internal space of the vacuum container 21 is maintained in a high vacuum state by, for example, a vacuum pump (not shown) connected to the 2 nd vacuum container portion 212.

Further, a stretchable member 213 is provided at least between the 1 st vacuum container portion 211 and the 2 nd vacuum container portion 212. The extensible member 213 functions to reduce vibrations from a vacuum pump connected to the 2 nd vacuum chamber 212 and vibrations from the floor or floor on which the film forming apparatus 11 is installed from being transmitted to the 1 st vacuum chamber 211 through the 2 nd vacuum chamber 212. As the stretchable member 213, for example, a bellows can be used. However, the present invention is not limited to this, and other members may be used as long as the transmission of vibration between the 1 st vacuum container 211 and the 2 nd vacuum container 212 can be reduced.

The vacuum vessel 21 further includes a reference plate portion to which the magnetic levitation stage mechanism 22 is coupled. As shown in fig. 2, the reference plate portion includes, for example, a reference plate 214 to which the magnetic levitation stage mechanism 22 is coupled in a fixed state, and a reference plate support portion 215 for supporting the reference plate 214 to a predetermined height.

As shown in fig. 2, a retractable member 213 is preferably further provided between the reference plate 214 and the 1 st vacuum container portion 211. This can further reduce the transmission of external vibrations to the magnetic levitation table mechanism 22 via the reference plate 214.

Further, it is preferable to provide a damper unit 216 between the reference plate support 215 of the reference plate portion and the mounting table 217 of the film forming apparatus 11. The vibration damping unit 216 serves to interrupt or reduce transmission of vibration from the floor or the like on which the film forming apparatus 11 is installed to the reference plate support portion 215 via the installation stand 217 of the film forming apparatus 11.

The structure of the damper unit 216 of the present embodiment is not particularly limited. For example, the vibration absorbing means 216 may be a mechanism that absorbs vibration from the outside by air pressure or hydraulic pressure, or a mechanism that absorbs vibration by an elastic member such as a spring.

The magnetic levitation stage mechanism 22 is an example of an alignment stage mechanism for adjusting the position of the substrate W or the substrate adsorbing member 24. The magnetic levitation stage mechanism 22 according to the present embodiment is a stage mechanism for adjusting the position of the substrate W or the substrate adsorbing member 24 by a magnetic levitation linear motor, and is provided with at least an X direction, a Y direction, and a θ direction adjustment _Z Direction, preferably X-direction, Y-direction, Z-direction, θ _X Direction, theta _Y Direction, theta _Z The positions of the substrate W or the substrate adsorbing member 24 in these 6 directions are directed.

The magnetic levitation stage mechanism 22 includes a stage reference plate portion 221 functioning as a fixed stage, a micro-motion stage plate portion 222 functioning as a movable stage, and a magnetic levitation means 223 for moving the micro-motion stage plate portion 222 relative to the stage reference plate portion 221 while being magnetically levitated.

In the embodiment shown in fig. 2, the magnetic levitation stage mechanism 22 is fixedly connected to the reference plate 214 that is a part of the vacuum vessel 21, but the present invention is not limited to this, and the magnetic levitation stage mechanism 22 may be provided to be fixed to a structure different from the vacuum vessel 21. For example, the reference plate portion to which the magnetic levitation stage mechanism 22 is fixedly connected is a structure different from the top of the vacuum container 21, and can be provided inside or outside the vacuum container 21 separately from the vacuum container 21.

The mask support unit 23 has a function of receiving the mask M carried by the carrying robot 14 provided in the carrying chamber 13 and holding the mask, and is also called a mask holder.

The mask support unit 23 is provided so as to be vertically movable at least. This makes it possible to easily adjust the vertical interval between the substrate W and the mask M. As in the present embodiment, when the position of the substrate W is adjusted by the magnetic levitation table mechanism 22, the mask support unit 23 for supporting the mask M is preferably configured to be mechanically movable up and down by a motor (not shown) and a ball screw or a guide (not shown).

In addition, as for the mask supporting unit 23, a mask that can be horizontally (i.e., xyθ _Z Direction) of the structure. In this case, even when the mask M is out of the field of view of the alignment camera, the mask M can be quickly moved into the field of view.

The mask supporting unit 23 further includes a mask pickup 231, and the mask pickup 231 is configured to temporarily receive the mask M carried into the vacuum container 21 by the carrying robot 14. The mask pickup 231 is configured to be relatively liftable and lowerable with respect to a mask support surface of the mask support unit 23. For example, as shown in fig. 2, the mask pickup 231 can be relatively lifted and lowered with respect to the mask support surface of the mask support unit 23 by the mask pickup lifting mechanism 232. However, the present invention is not limited to this, and other structures may be used as long as the mask pickup 231 and the mask support surface of the mask support unit 23 can be lifted and lowered relatively. For example, the mask pickup 231 may be fixed to the reference plate 214 or the stage reference plate portion 221 of the magnetic levitation stage mechanism 22, and instead, the mask support unit 23 may be movable up and down. Alternatively, both the mask pickup 231 and the mask support unit 23 may be configured to be movable up and down.

The mask pickup 231, which receives the mask M from the hand of the transfer robot 14, is relatively lowered with respect to the mask support surface of the mask support unit 23, and lowers the mask M to the mask support surface of the mask support unit 23. In contrast, when the used mask M is carried out, the mask M is lifted from the mask support surface of the mask support unit 23, and the hand of the carrying robot 14 receives the mask M.

The mask M has an opening pattern corresponding to a thin film pattern formed on the substrate W, and is supported by the mask support unit 23. For example, as the Mask M for manufacturing an organic EL display panel for VR-HMD, a fine metal Mask (fine Mask) which is a metal Mask having a fine opening pattern corresponding to the RGB pixel pattern of the light-emitting layer of the organic EL element formed therein, and an open Mask (open Mask) for forming a general layer (hole injection layer, hole transport layer, electron injection layer, etc.) of the organic EL element are used. The opening pattern of the mask M is defined by a blocking pattern that does not pass particles of the film forming material.

The substrate adsorbing member 24 is an example of a substrate holding member for holding the substrate W, and has a function of adsorbing and holding the substrate W as a film formation object and an adsorbate. The substrate adsorbing member 24 is fixed to a micro-movement mounting platen portion 222 as a movable stage in the magnetic levitation mounting stage mechanism 22.

As the substrate adsorbing member 24, for example, an electrostatic chuck having a structure in which a circuit such as a metal electrode is embedded in a matrix of a dielectric or an insulator (for example, a ceramic material) can be used.

As the electrostatic chuck of the substrate suction member 24, a coulomb force type electrostatic chuck in which a dielectric having a relatively high resistance is interposed between an electrode and a suction surface, and the suction is performed by using coulomb force between the electrode and a suction target can be used. Further, as the electrostatic chuck, a johnson/ravigneaux type electrostatic chuck in which a dielectric having a relatively low resistance is interposed between an electrode and a suction surface and johnson/ravigneaux force generated between the suction surface of the dielectric and a body to be sucked is used. Further, as the electrostatic chuck, a gradient force type electrostatic chuck that adsorbs the adsorbate by an uneven electric field can also be used.

In the case where the adsorbate is a conductor or a semiconductor (silicon wafer), a coulomb force type electrostatic chuck or a johnson-larceny type electrostatic chuck is preferably used, and in the case where the adsorbate is an insulator such as glass, a gradient force type electrostatic chuck is preferably used.

The electrostatic chuck may be formed of one plate or may be formed with a plurality of auxiliary plates. In the case of forming the circuit by one board, it is preferable that a plurality of circuits be included in the circuit, and that the electrostatic attraction be controlled so as to be different depending on the position in one board.

Although not shown in fig. 2, the film forming apparatus 11 may further include a substrate supporting unit that temporarily holds the substrate W before the substrate W carried into the vacuum chamber 21 by the carrying robot 14 is adsorbed and held by the substrate adsorbing member 24. For example, the substrate supporting unit can be provided integrally with the mask supporting unit 23. That is, the mask support unit 23 is provided with a substrate support surface for supporting the substrate W at a position different from the mask support surface for supporting the mask M, thereby forming a substrate support unit.

Although not shown in fig. 2, a cooling member (e.g., a cooling plate) that suppresses the temperature rise of the substrate W may be provided on the opposite side of the suction surface of the substrate suction member 24. This can suppress deterioration or degradation of the organic material deposited on the substrate W.

The film forming source 25 includes a crucible (not shown) for storing a film forming material to be formed on the substrate W, a heater (not shown) for heating the crucible, a shutter (not shown) for preventing the film forming material from scattering toward the substrate until the evaporation rate from the film forming source 25 becomes constant, and the like. The film forming source 25 may have various structures such as a point (point) film forming source and a linear (linear) film forming source, depending on the application. The film forming source 25 may have a structure including a plurality of crucibles for storing different film forming materials. In such a configuration, in order to change the film forming material without opening the vacuum chamber 21 to the atmosphere, it is preferable to provide a plurality of crucibles accommodating different film forming materials so as to be movable to the film forming position.

The magnetic force applying member 26 has a function of attracting the mask M to the substrate W side by a magnetic force and bringing the mask into close contact with the substrate W during the film forming process, and is configured to be vertically movable. For example, the magnetic force applying part 26 is constituted by an electromagnet and/or a permanent magnet.

Although not shown in fig. 2, the film forming apparatus 11 preferably includes a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the thickness of the film deposited on the substrate.

A mask pickup lifting mechanism 232 for lifting the mask pickup 231, a magnetic force applying member lifting mechanism 261 for lifting the magnetic force applying member 26, and the like are provided on the upper outer side (the atmosphere side) of the vacuum container 21, that is, on the reference plate 214. A mask support unit lifting mechanism (not shown) for lifting and lowering the mask support unit 23 may be provided on the reference plate 214, but the present invention is not limited to this, and for example, the mask support unit lifting mechanism (not shown) may be provided on the atmosphere side of the lower portion of the 1 st vacuum container portion 211.

The film forming apparatus 11 of the present embodiment further includes an alignment camera unit 27, and the alignment camera unit 27 is provided on the upper outer side (atmosphere side) of the vacuum chamber 21 to capture an alignment mark formed on the substrate W and the mask M.

The alignment camera unit 27 preferably includes a rough alignment camera for roughly adjusting the relative position of the substrate W and the mask M, and a fine alignment camera for precisely adjusting the relative position of the substrate W and the mask M. The angle of view of the coarse alignment camera is relatively wide, the resolution is low, and the fine alignment camera is a camera having a relatively narrow angle of view but a high resolution.

The coarse alignment camera and the fine alignment camera are provided at positions corresponding to alignment marks formed on the substrate W and the mask M. For example, in the fine alignment camera, 4 cameras are provided at the 4 corners of the rectangle, respectively, and in the coarse alignment camera, 2 cameras are provided at the centers of the two sides of the rectangle that face each other. However, the present invention is not limited thereto, and the number and arrangement positions of the cameras may be appropriately set according to the positions of the alignment marks of the substrate W and the mask M.

As shown in fig. 2, the alignment camera unit 27 of the film forming apparatus 11 according to the present embodiment is provided so as to penetrate the reference plate 214 from the upper atmosphere side of the vacuum chamber 21 and enter the inside of the vacuum chamber 21. Therefore, the alignment camera unit 27 includes a vacuum corresponding tube (not shown) that is sealed so as to surround the alignment camera disposed on the atmosphere side.

As described above, in the present embodiment, the calibration camera is provided so as to enter the vacuum container 21 through the vacuum corresponding tube. Thus, even if the substrate W and the mask M are disposed at positions away from the reference plate 214 by providing the magnetic levitation stage mechanism 22, the focus can be aligned with the alignment marks formed on the substrate W and the mask M. Further, the position of the lower end of the vacuum corresponding cylinder is determined based on the depth of focus of the alignment camera and the distance between the substrate W and the mask M and the reference plate 214.

Although not shown in fig. 2, since the inside of the vacuum container 21 sealed in the film forming step is dark, an illumination light source for irradiating the alignment mark from below may be provided in order to take an image of the alignment mark with the alignment camera that enters the inside of the vacuum container 21.

The film forming apparatus 11 includes a control unit (not shown). The control unit has functions and actions such as conveyance control of the substrate W and the mask M, alignment control of the substrate W and the mask M, control of the film forming source 25, and film forming control. The control unit may also have a function of controlling the voltage application to the electrostatic chuck.

The control unit may be constituted by a computer having a processor, a memory, a storage device, I/O, and the like, for example. In this case, the function of the control section is realized by the processor executing a program stored in the memory or the storage device. As the computer, a general-purpose personal computer or an embedded computer or PLC (programmable logic controller: programmable logic controller) may be used. Alternatively, part or all of the functions of the control unit may be constituted by a circuit such as an ASIC or FPGA. The control unit may be provided for each film forming apparatus, or one control unit may control a plurality of film forming apparatuses.

[ magnetic suspension mounting table mechanism ]

In particular, the magnetic levitation mounting table mechanism 22 will be described in more detail with reference to fig. 3 to 7. As described above, the magnetic levitation stage mechanism 22 includes the stage reference plate portion 221, the jog stage plate portion 222, and the magnetic levitation unit 223.

The stage reference plate 221 is a member that serves as a reference for movement of the jog stage plate 222, and is provided so that its position is fixed. For example, as shown in fig. 2, the stage reference plate 221 is provided so as to be fixed to the reference plate 214 of the vacuum chamber 21 in parallel to the XY plane. However, the present invention is not limited to this, and the stage reference plate 221 may be fixed to other members (for example, other reference frames) instead of being directly fixed to the reference plate 214, as long as the position of the stage reference plate 221 can be fixed.

The table reference plate 221 is a member that serves as a reference for movement of the jog table 222, and is preferably provided so as to be free from external disturbances such as vibrations from the vacuum pump or the floor by the telescopic member 213, the vibration damping unit 216, and the like.

The micro-motion mounting platen portion 222 is provided so as to be movable with respect to the mounting table reference plate portion 221, and a substrate adsorbing member 24 such as an electrostatic chuck is provided on a main surface (for example, a lower surface) of the micro-motion mounting platen portion 222. Therefore, by moving the platen portion 222, the positions of the substrate adsorbing member 24 and the substrate W adsorbed to the substrate adsorbing member 24 can be adjusted.

The magnetic levitation unit 223 includes: a magnetic levitation linear motor 31 for generating a driving force for moving the micro-motion mounting platen portion 222 as a movable stage with respect to the mounting stage reference plate portion 221 as a fixed stage; a position measuring means for measuring the position of the jog mount platen 222; a dead weight canceling member 33 for canceling (canceling) the gravity applied to the fine movement mounting platen 222 by imparting a levitation force for levitating the fine movement mounting platen 222; and an origin positioning member 34 for determining the origin position of the jog mount platen 222.

The magnetic levitation linear motor 31 is a driving source that generates a driving force for moving the micro-motion mounting platen 222. In the present embodiment, the following three magnetic levitation linear motors are provided. The 1 st is the two X-direction magnetic levitation linear motors 311 that generate driving forces for moving the micro-motion mounting platen portion 222 in the X-direction. The 2 nd is two Y-direction magnetic levitation linear motors 312 that generate driving forces for moving the micro-motion mounting platen portion 222 in the Y-direction. The 3 rd is three Z-direction magnetic levitation linear motors 313 that generate driving forces for moving the micro-motion mounting platen portion 222 in the Z-direction.

The use of these magnetic levitation linear motors 31 can allow the micro-motion mounting platen portion 222 to move in six directions (X direction, Y direction, Z direction, θ _X Direction, theta _Y Direction, theta _Z Direction) is moved.

For example, the translational movement in the X direction, the Y direction, and the Z direction may be performed by driving the X-direction magnetic levitation linear motor 311, the Y-direction magnetic levitation linear motor 312, and the Z-direction magnetic levitation linear motor 313 in the same direction.

With respect to the direction theta _Z The rotational movement in the direction is only required to adjust the driving directions of the two X-direction magnetic levitation linear motors 311 and the two Y-direction magnetic levitation linear motors 312. For example, when the X-direction magnetic levitation linear motor 311a is driven in the +x direction, the X-direction magnetic levitation linear motor 311b is driven in the-X direction, the Y-direction magnetic levitation linear motor 312a is driven in the +y direction, and the Y-direction magnetic levitation linear motor 312b is driven in the-Y direction, the jog mount platen 222 can be rotated counterclockwise about the Z axis. With respect to the direction theta _X Direction and θ _Y The rotational movement in the direction may be similarly performed by adjusting the driving directions of the three Z-direction magnetic levitation linear motors 313.

The number and arrangement of the magnetic levitation linear motors 31 shown in fig. 3 are illustrative, and the present invention is not limited thereto, and other structures may be adopted as long as the micro-motion mounting platen portion 222 can be moved in a desired direction.

Further, by using the magnetic levitation stage mechanism 22 instead of the alignment stage using a mechanical motor and a ball screw or a linear guide, the accuracy of the position adjustment of the substrate W can be further improved.

Unlike mechanical stage mechanisms, the magnetic levitation stage mechanism 22 can reduce the possibility of contamination due to particles and contamination due to evaporation of lubricant, and the magnetic levitation stage mechanism 22 can be installed in the vacuum container 21. Thus, the distance between the holding member (substrate adsorbing member 24) of the substrate W and the stage mechanism is reduced, and therefore, the influence of the swing and external disturbance on the substrate adsorbing member 24 during driving of the stage mechanism can be reduced.

Fig. 5 is a schematic cross-sectional view showing the structure of the Z-direction magnetic levitation linear motor 313, and fig. 6 is a schematic cross-sectional view showing the structure of the X-direction magnetic levitation linear motor 311 or the Y-direction magnetic levitation linear motor 312.

The magnetic levitation linear motor 31 includes a fixed member 314 provided on the stage reference plate portion 221 and a movable member 315 provided on the micro-movement stage plate portion 222. The mount reference plate 221 and the fine-movement mount platen 222 may be provided with the fixing member 314 on one side and the movable member 315 on the other side. Therefore, a configuration may be adopted in which the movable member 315 is provided in the stage reference plate portion 221, and the fixed member 314 is provided in the fine movement stage plate portion 222.

As shown in the figure, the stator 314 of the magnetic levitation linear motor 31 includes a magnetic field generating member, for example, a coil 3141 through which power flows, and the movable member 315 includes a magnetic body, for example, a permanent magnet 3151.

The magnetic levitation linear motor 31 applies a driving force to the permanent magnet 3151 of the movable member 315 by using a magnetic field generated by flowing a current through the coil 3141 of the fixed member 314. The magnetic levitation linear motor 31 can adjust the direction of the force applied to the permanent magnet 3151 as the movable member 315 by adjusting the direction of the current flowing through the fixed member 314.

For example, as shown in fig. 5 (b), when the direction of the current flowing through the coil 3141 of the holder 314 is rotated counterclockwise on the paper surface, the N pole is guided to the left (-X side) of the coil 3141 and the S pole is guided to the right (+x side) in fig. 5 (a). Thus, the movable element 315 is forced in the downward (-Z) direction and moves downward. Conversely, when the direction of the current flowing through the coil 3141 is rotated clockwise, the movable element 315 moves in the upward (+z) direction.

Similarly, the X-direction magnetic levitation linear motor 311 or the Y-direction magnetic levitation linear motor 312 shown in fig. 6 can also move the movable member 315 in the X-direction and the Y-direction by controlling the direction of the current flowing through the coil 3141 of the fixed member 314.

The position measuring means of the magnetic levitation unit 223 of the present embodiment is a means for measuring the position of the micro-motion mounting platen 222, and includes the laser interferometer 32 and the reflecting portion 324 provided to face the micro-motion mounting platen 222. As the reflecting portion 324, for example, a plane mirror can be used.

The laser interferometer 32 irradiates the measurement beam onto the reflection section 324 provided in the micro-motion mounting platen section 222, and detects the reflected beam to measure the position of the reflection section 324 (the position of the micro-motion mounting platen section 222). More specifically, the laser interferometer 32 can measure the position of the micro-motion mounting platen 222 based on interference light between the reflected light of the measurement beam and the reflected light of the reference beam.

The position measuring means of the magnetic levitation unit 223 of the present embodiment includes an X-direction position measuring section for measuring the position in the X-direction of the jog mount platen section 222, a Y-direction position measuring section for measuring the position in the Y-direction, and a Z-direction position measuring section for measuring the position in the Z-direction.

As shown in fig. 3, the laser interferometer 32 as the position measuring means of the present embodiment uses two X-direction laser interferometers 321 for detecting the position of the micro-motion mounting platen portion 222 in the X-axis direction, one Y-direction laser interferometer 322 for detecting the position of the micro-motion mounting platen portion 222 in the Y-axis direction, and three Z-direction laser interferometers 323 for detecting the position of the micro-motion mounting platen portion 222 in the Z-axis direction.

The fine movement mounting platen 222 is provided with a reflecting portion 324 for reflecting the measurement beam from the laser interferometer 32 so as to face the laser interferometer 32. For example, the reflection unit 324 includes an X-direction reflection unit 3241 provided so as to face the X-direction laser interferometer 321, a Y-direction reflection unit 3242 provided so as to face the Y-direction laser interferometer 322, and a Z-direction reflection unit 3243 provided so as to face the Z-direction laser interferometer 323.

The X-direction position measuring unit includes an X-direction laser interferometer 321 and an X-direction reflecting unit 3241, the Y-direction position measuring unit includes a Y-direction laser interferometer 322 and a Y-direction reflecting unit 3242, and the Z-direction position measuring unit includes a Z-direction laser interferometer 323 and a Z-direction reflecting unit 3243.

According to the structure of the position measuring member, the position of the jog mount platen 222 can be precisely measured with 6 degrees of freedom (degree of freedom). That is, the X-direction laser interferometer 321, the Y-direction laser interferometer 322, and the Z-direction laser interferometer 323 can measure the X-direction position, the Y-direction position, and the Z-direction position of the micro-motion mounting platen 222. Further, by providing a plurality of X-direction laser interferometers 321, rotation (θ) about the Z-axis can also be measured _Z ) The position of the direction. Further, by providing a plurality of Z-direction laser interferometers 323, the rotation direction (θ) about the X-axis and/or the Y-axis can be measured as well _X Or theta _Y ) I.e., the tilt angle of the jog mount platen 222).

The control unit of the film forming apparatus 11 according to the present embodiment controls the magnetic levitation linear motor 31 based on the positional information of the micro-motion mounting platen 222 (or the substrate adsorbing member 24 provided thereto) measured by the laser interferometer 32. For example, the control unit of the film forming apparatus 11 moves the micro-placement platen 222 or the substrate adsorbing member 24 to a positioning target position determined by the relative positional displacement between the substrate W and the mask M measured by the alignment camera unit 27 and the position of the micro-placement platen 222 or the substrate adsorbing member 24 measured by the laser interferometer 32. This enables the position of the micro-movement mounting platen 222 or the substrate adsorbing member 24 to be controlled with high accuracy in nanometer units.

The weight canceling member 33 is a member for canceling (canceling) the weight of the jog mount platen 222. For example, as shown in fig. 4 (c) and 7, the weight canceling member 33 generates a levitation force having a magnitude corresponding to the gravity applied to the fine movement mounting platen 222 in a direction opposite to the gravity by using a repulsive force or an attractive force between the 1 st magnet portion 331 provided on the mounting table reference plate portion 221 side and the 2 nd magnet portion 332 provided on the fine movement mounting platen portion 222 side.

The 1 st magnet portion 331 and the 2 nd magnet portion 332 can be constituted by electromagnets or permanent magnets. In the 1 st and 2 nd magnet portions 331 and 332 shown in fig. 4 (c) and 7, a portion hatched with a lower right oblique line and a portion hatched with an upper right oblique line each represent a different magnetic pole (S pole or N pole).

For example, as shown in fig. 4 (c), by disposing the 1 st magnet portion 331 provided on the stage reference plate portion 221 side and the 2 nd magnet portion 332 provided on the jog mount platen portion 222 side so that the magnetic poles of opposite polarities face each other, the 1 st magnet portion 331 provided on the stage reference plate portion 221 side attracts the 2 nd magnet portion 332 provided on the jog mount platen portion 222 side upward, and the gravity applied to the jog mount platen portion 222 can be offset.

Alternatively, the weight force of the micro-motion mounting platen 222 may be offset by a repulsive force between the 1 st magnet 331 provided on the mounting table reference plate 221 side and the 2 nd magnet 332 provided on the micro-motion mounting platen 222 side.

For example, as shown in fig. 7, the 1 st magnet portion 331 and the 2 nd magnet portion 332 may be arranged so that the magnetic poles of the same polarity face each other, and the spacer 333 extending in the Z direction may be interposed between the jog mount plate portion 222 and the 2 nd magnet portion 332 so that the lower end (end portion) of the 2 nd magnet portion 332 is higher than the lower end (end portion) of the 1 st magnet portion 331. That is, the length of the spacer 333 in the Z direction is formed such that the lower end of the 2 nd magnet portion 332 provided on the side of the jog mount platen portion 222 is higher than the lower end of the 1 st magnet portion 331 provided on the side of the mount table base plate portion 221 (i.e., further away from the jog mount platen portion 222).

With the configuration shown in fig. 7, the 2 nd magnet portion 332 provided on the side of the fine movement mounting platen portion 222 receives a repulsive force upward by the 1 st magnet portion 331 provided on the side of the mounting table reference plate portion 221, and can cancel the gravity applied to the fine movement mounting platen portion 222.

In order to more stably support the jog mount platen 222, the weight canceling member 33 is preferably provided at least three positions in the XY plane as shown in fig. 3. For example, it is preferable that the mounting plate portion 222 be provided symmetrically around the center of gravity.

By adopting the dead weight canceling member 33 in this way, the load of the magnetic levitation linear motor 31 can be reduced, and the heat generation amount of the magnetic levitation linear motor 31 can be suppressed. This can suppress thermal denaturation of the organic material deposited on the substrate W.

The origin positioning member 34 of the magnetic levitation unit 223 of the present embodiment is a member that determines the origin position of the jog mount platen 222, and may be configured by a motion coupler (kinematic coupling) including a triangular-cone-shaped concave portion 341 and a hemispherical convex portion 342.

For example, as shown in fig. 4 (b), a triangular pyramid-shaped concave portion 341 is provided on the stage reference plate portion 221 side, and a hemispherical convex portion 342 is provided on the jog stage plate portion 222 side. When the hemispherical convex portion 342 is inserted into the triangular-cone-shaped concave portion 341, the convex portion 342 contacts the inner surface of the concave portion 341 at 3 points, and the position of the fine movement mounting platen portion 222 is determined.

As shown in fig. 3, by providing three such origin positioning members 34 of the kinematic coupler type at equal intervals (for example, 120 ° intervals) around the center of the jog mount platen 222 on a plane including the X direction and the Y direction, the center position of the jog mount platen 222 can be determined. That is, the position of the jog mount platen 222 when the jog mount platen 222 is brought close to the mount table reference plate 221 and the convex portions 342 of the three origin positioning members are seated in the concave portions 341 is measured by the laser interferometer 32, and is taken as the origin position.

As described above, according to the film forming apparatus 11 of the present embodiment, the mounting table and its driving mechanism can be disposed in the vacuum chamber 21 of the film forming apparatus 11 by using the magnetic levitation driving mechanism (magnetic levitation linear motor) instead of using the mechanical driving mechanism. Thus, the influence of vibration caused by external disturbance can be effectively reduced. In addition, vibration caused by mechanical driving can be reduced, and as a result, accuracy of positional adjustment of the substrate can be improved. Further, by using the position measuring section including the laser interferometer 32, the dead weight canceling section 33, and the origin positioning section 34 constituted by a motion coupler, the accuracy of the position adjustment of the substrate can be further improved.

However, in the present invention, the mechanism for adjusting the positions of the substrate W and the substrate adsorbing member 24 is not limited to the magnetic levitation stage mechanism 22, and various known techniques can be adopted.

[ Structure of vacuum vessel ]

A specific example of a vacuum vessel having a different structure from the vacuum vessel 21 shown in fig. 2 will be described with reference to fig. 8 to 10. In order to form a fine pattern on a substrate W such as a silicon wafer with high accuracy, it is preferable to increase the incidence angle of the film forming material when it is incident on the substrate W from the film forming source 25 through the mask M (i.e., incidence on the film forming surface of the substrate W approximately perpendicularly). Therefore, it is preferable to extend the distance from the film formation source 25 to the substrate W. In the case of extending the distance, the alignment stage mechanism for adjusting the position of the substrate W is provided at a relatively high position, and is therefore susceptible to external disturbances such as vibrations from the vacuum pump or the floor. As a result, the accuracy of the alignment stage mechanism in adjusting the position of the substrate W is lowered, and the accuracy of the alignment of the substrate W with respect to the mask M is also lowered, and as a result, the accuracy of film formation may be lowered.

Therefore, the film forming apparatus 11 of the present embodiment adopts the following structure as the structure of the vacuum chamber 21. That is, in the film forming apparatus 11 of the present embodiment, the vacuum chamber 21 is divided into a plurality of chamber parts (for example, the 1 st vacuum chamber part 211 and the 2 nd vacuum chamber part 212), and the retractable member 213 is provided between the plurality of chamber parts. This reduces transmission of external vibration to the 1 st vacuum container 211 provided with the magnetic levitation stage mechanism 22. Although fig. 8 to 10 show a modification in which the vacuum vessel 21 is composed of two vacuum vessel portions 211 and 212, the present invention is not limited to this, and a configuration in which the vacuum vessel 21 includes three or more vacuum vessel portions may be adopted.

In the film forming apparatus 11, as described above, it is preferable that the vibration damping means 216 be provided between the reference plate portion and the mounting table 217 of the film forming apparatus 11 in order to interrupt or reduce transmission of vibration from the outside to the reference plate portion. The reference plate portion may constitute a part of a chamber wall constituting the vacuum chamber 21, or may be a structure different from the chamber wall.

Fig. 8 is a schematic cross-sectional view of a vacuum vessel according to modification 1 of the present invention, fig. 9 is a schematic cross-sectional view of a vacuum vessel according to modification 2 of the present invention, and fig. 10 is a schematic cross-sectional view of a vacuum vessel according to modification 3 of the present invention.

In fig. 8 to 10, various structures provided in the vacuum vessel are omitted to clarify the structure of the vacuum vessel 21. Various structures provided in the vacuum vessel 21 have been described with reference to fig. 2 and the like.

Modification 1

The vacuum vessel 21a of modification 1 shown in fig. 8 is different from the vacuum vessel 21 shown in fig. 2 in that the reference plate 214 is directly connected to the 1 st vacuum vessel portion 211, and a stretchable member is not provided between the reference plate 214 and the 1 st vacuum vessel portion 211. When such a vacuum chamber 21a is used, the vibration transmitted through the mounting table 217 of the film forming apparatus 11 is reduced by the vibration reducing means 216, the vibration transmitted to the 1 st vacuum chamber 211 through the 2 nd vacuum chamber 212 is reduced by the stretchable member 213, and the structure of the vacuum chamber 21a can be further simplified.

Modification 2

In the vacuum chamber 21b of modification 2 shown in fig. 9, a different reference plate portion different from the chamber wall is not provided, and the vibration damping means 216 is provided between the lower chamber wall of the 1 st vacuum chamber portion 211 and the mounting table 217 of the film forming apparatus. In the case of such a configuration, the vibration transmitted from the outside of the film forming apparatus 11 to the chamber wall of the 1 st vacuum chamber 211 through the setting table 217 is reduced by the vibration reducing unit 216, and the vibration transmitted to the 1 st vacuum chamber 211 through the 2 nd vacuum chamber 212 is reduced by the telescopic member 213. In the case of the vacuum container 21b according to modification 2, the upper chamber wall of the 1 st vacuum container 211 functions as a reference plate 214 fixedly connected to the magnetic levitation table mechanism 22. In this modification, the structure of the vacuum vessel 21b can be further simplified because there is no different reference plate portion.

Modification 3

The vacuum vessel 21c of modification 3 shown in fig. 10 is similar to the vacuum vessel 21b of modification 2 in that the upper chamber wall of the 1 st vacuum vessel portion 211 functions as a reference plate 214. However, in the case of the vacuum vessel 21c of modification 3, the configuration is different from that of the vacuum vessel 21b of modification 2 in that the vibration damping means 216 is provided between a different structure (for example, the reference plate supporting portion 215) protruding from the side chamber wall of the 1 st vacuum vessel portion 211 and the installation table 217.

In the vacuum chamber 21c of modification 3, the damper unit 216 is disposed at a position where the support point of the damper unit 216 is at least higher than the bottom surface of the chamber wall of the 1 st vacuum chamber portion 211.

The vibration damping unit 216 is preferably provided to support the structural portion of the film forming apparatus 11 at a position having the same height (substantially the same height) as the center of gravity of the structural portion supported by the vibration damping unit 216. For example, the vibration damping means 216 is preferably provided to support the 1 st vacuum container 211 at a position having the same height (substantially the same height) as the center of gravity of the 1 st vacuum container 211 in which the magnetic levitation stage mechanism 22 is disposed, among the plurality of vacuum container 211, 212.

According to such a configuration, the 1 st vacuum vessel 211 provided with the magnetic levitation stage mechanism 22 can effectively suppress vibration (oscillation) of the 1 st vacuum vessel 211 by a moment force caused by external vibration or the like. Therefore, the influence of external disturbance between the upper chamber wall of the 1 st vacuum chamber 212 and the magnetic levitation stage mechanism 22 fixed to the upper chamber wall can be reduced.

Although not particularly shown, the vibration damping means 216 is preferably provided to support the vacuum vessel 21 at a position at the same height as the height of the center of gravity of the vacuum vessel 21. By adopting such a configuration, the vibration of the vacuum vessel 21 can be effectively suppressed, and the influence of external disturbance of the magnetic levitation stage mechanism 22 can be reduced.

Claims

1. A film forming apparatus, characterized in that,

the film forming apparatus includes:

a 1 st vacuum vessel;

a substrate holding member provided in the 1 st vacuum chamber and holding a substrate;

a 2 nd vacuum vessel;

a film forming source provided in the 2 nd vacuum chamber and configured to discharge a film forming material formed on a substrate held by the substrate holding member;

a stretchable member provided between the 1 st vacuum vessel and the 2 nd vacuum vessel;

an alignment stage mechanism provided in the 1 st vacuum chamber for adjusting a position of the substrate holding member;

a reference plate portion connecting the alignment stage mechanism; and

and a 2 nd telescopic member provided between the reference plate portion and the 1 st vacuum vessel.

2. The film forming apparatus according to claim 1, wherein,

the telescoping member is a bellows.

3. The film forming apparatus according to claim 1, wherein,

the film forming apparatus further includes a vibration reduction unit for preventing vibration from being transmitted to the alignment stage mechanism.

4. The film forming apparatus according to claim 3, wherein,

the vibration damping unit is provided between the reference plate portion and a mounting table of the film forming apparatus.

5. The film forming apparatus according to claim 4, wherein,

the vibration damping unit supports the 1 st vacuum vessel at a position higher than a bottom surface of the 1 st vacuum vessel.

6. The film forming apparatus according to claim 5, wherein,

the vibration damping unit supports the 1 st vacuum vessel at a height of a center of gravity of the 1 st vacuum vessel.

7. An apparatus for manufacturing an electronic device, characterized in that,

the manufacturing apparatus of the electronic device includes:

the film forming apparatus according to any one of claims 1 to 6;

mask storage means for storing a mask; and

and a transfer device for transferring the substrate or the mask.