JP2019116679A - Film deposition apparatus, film deposition method, and method of manufacturing electronic device - Google Patents

Abstract

To let a substrate and a mask adhere together without any gap.SOLUTION: A film deposition apparatus according to the present invention includes: an electrostatic chuck for holding a substrate; a mask table installed on a substrate holding surface side of the electrostatic chuck and holding a mask; magnetic force application means installed on the opposite side from the substrate holding surface of the electrostatic chuck, and applying magnetic force to the mask; and a control part controlling the electrostatic chuck, the mask table, and the magnetic force application means. The control part performs control so that before the magnetic force application means is moved toward the mask table so as to let the substrate and the mask adhere together, the substrate held by the electrostatic chuck and the mask held by the mask table are at a predetermined interval.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a film forming apparatus and a film forming method, and more particularly to a method and apparatus for bringing a mask into close contact with a substrate in a film forming apparatus.

  Recently, an organic EL display device has been in the limelight as a flat panel display device. The organic EL display device is a self-luminous display, and its characteristics such as response speed, viewing angle and thinning are superior to those of liquid crystal panel displays, and existing liquid crystal panel displays such as monitors, televisions and various portable terminals represented by smartphones. Substitute at a high speed. In addition, the field of application is being expanded to displays for automobiles and the like.

  The element of the organic EL display device has a basic structure in which an organic substance layer which emits light is formed between two facing electrodes (a cathode electrode and an anode electrode). The organic layer and the electrode metal layer of the organic EL display device are manufactured by depositing a deposition material on a substrate through a mask on which a pixel pattern is formed in a vacuum chamber.

  In such a deposition process, in order to deposit a pixel pattern on a mask on a substrate with high precision, the relative position between the mask and the substrate is precisely adjusted before deposition on the substrate, and the mask is It must be in close contact with the film formation surface of the substrate.

  In order to bring the mask into close contact with the film formation surface of the substrate, a magnetic plate is used to apply a magnetic force to the metal mask on the lower portion of the substrate from the top of the substrate. That is, with the substrate whose relative position has been adjusted (aligned) placed on the upper surface of the mask, the magnet plate is applied to the metal mask by the magnet of the magnetic plate by bringing it into contact with the upper surface of the substrate. The substrate and the mask are in close contact with each other through a magnetic force.

  For example, in the prior art illustrated in FIG. 7, after the substrate 710 whose peripheral edge is held by the substrate holder 721 is placed on the mask 730 held by the mask table 722, the magnet plate 724 and the cooling plate 723 are provided. Is lowered to attract and bring the mask 730 and the substrate 710 into close contact with each other by the magnetic force applied from the magnet plate 724 to the mask 730.

  However, the mask 730 held on the mask table 722 is held in a bent state by its own weight. Here, when the substrate 710 is placed, the mask 730 receives the weight of the substrate and is further bent. In this state, the magnet plate 724 and the cooling plate 723 are lowered until the lower surface of the cooling plate 723 contacts the upper surface peripheral portion of the substrate, and a magnetic force is applied to the mask to draw the mask and the substrate as a whole. It is attracted and the deflection is reduced. However, if the mask and the substrate are drawn while the peripheral edge of the upper surface of the substrate 710 is in contact with the lower surface of the cooling plate 723, the bending of the central portion of the substrate and the mask can not be completely eliminated. Close contact with wrinkles remaining in the center.

  Furthermore, since the degree of bending of the mask and the substrate is different, even if the magnet plate 724 has a magnetic force, the mask and the substrate can not be completely in close contact with each other, and a gap is generated between the mask and the substrate. With such a gap, a film formation blur can not be formed in which the deposition material can not be formed with high precision on the film formation region of the substrate.

  On the other hand, recently, in order to prevent bending of the substrate due to its own weight, a method of holding the upper surface of the substrate by electrostatic attraction of the electrostatic chuck instead of (or together with) the substrate holder holding the substrate only from below It is done. The electrostatic chuck is placed immediately above the substrate because the upper surface of the substrate is attracted by electrostatic attraction.

  Therefore, in a film forming apparatus having a structure in which the electrostatic chuck is used to hold the substrate and the mask held by the electrostatic chuck is in close contact with the mask, the electrostatic chuck holds the substrate under the magnet plate. You will come to

  For example, as shown in FIG. 8, in order to bring the substrate 810 adsorbed and held by the electrostatic chuck 823 into close contact with the mask 830, until the peripheral edge of the lower surface of the substrate 810 contacts the upper peripheral edge of the mask 830, After the electrostatic chuck 823 is lowered, the magnet plate 824 is lowered and a magnetic force is applied to the mask, whereby the mask is attracted by the magnetic force and the deflection thereof is reduced.

  However, since the mask is drawn in a state where the lower surface peripheral edge of the substrate 810 held by the electrostatic chuck 823 is in contact with the upper surface peripheral edge of the mask 830, deflection of the mask by its own weight can not be completely eliminated. It adheres to the substrate with wrinkles remaining in the center. That is, compared to the prior art shown in FIG. 7, the adoption of the electrostatic chuck 823 reduces the influence of the bending due to the weight of the substrate, but still there is a gap between the substrate 810 and the mask 830. Bokeh occurs.

  The present invention is a film forming apparatus for holding a substrate using an electrostatic chuck and for bringing a substrate and a mask into close contact with each other using magnetic force application means, wherein the film forming apparatus brings the substrate and the mask into close contact with each other. A main object is to provide a film forming method and an electronic device manufacturing method using the same.

  A film forming apparatus according to a first aspect of the present invention includes an electrostatic chuck for holding a substrate, a mask table installed on the substrate holding surface side of the electrostatic chuck for holding a mask, and the electrostatic It is installed on the opposite side of the substrate holding surface of the chuck, and includes magnetic force application means for applying a magnetic force to the mask, and a control unit for controlling the electrostatic chuck, the mask table and the magnetic force application means. The control unit is configured to hold the substrate held by the electrostatic chuck and the mask held by the mask table before moving the magnetic force application unit toward the mask table to bring the substrate and the mask into close contact with each other. The mask is controlled to have a predetermined interval.

  The film forming method according to the second aspect of the present invention comprises the steps of: placing a mask on a mask table; placing the substrate on a substrate support table; and adsorbing and holding the substrate with an electrostatic chuck Moving the electrostatic chuck or the mask table relative to each other such that the distance between the substrate held by the electrostatic chuck and the mask placed on the mask table is a predetermined distance; Moving the magnetic force application unit toward the mask table in a state in which the substrate and the mask are separated by the predetermined distance, and bringing the mask into close contact with the film formation region of the substrate; Depositing a vapor deposition material thereon.

  The method of manufacturing an electronic device according to the third aspect of the present invention manufactures an electronic device using the film forming method according to the second aspect of the present invention.

According to the present invention, when the electrostatic chuck holding the substrate is lowered toward the mask to bring the substrate into close contact with the mask, or the mask table holding the mask is held by the substrate held by the electrostatic chuck At the time of raising, the magnetic force application means is lowered to apply a magnetic force to the mask after lowering or raising it to a position where a predetermined distance is provided between the substrate and the mask. When the mask is attracted and the deflection of the central portion of the mask is reduced by the magnetic force from the magnetic force application means, the peripheral portion of the mask is not in contact with the substrate and is separated by a predetermined distance. Bending can be extended smoothly toward the periphery of the mask. As a result, the deflection of the mask due to its own weight is dispersed at the periphery of the mask, and the wrinkles of the mask come out of the film formation area of the substrate, so that no gap remains between the substrate and the mask. It becomes possible to reduce film formation blur.

FIG. 1 is a schematic view of a part of a manufacturing line of an organic EL display device. FIG. 2 is a schematic view of a film forming apparatus of the present invention. FIG. 3 is a schematic view showing a mask adhesion method by the film forming apparatus of the present invention. FIG. 4 is a schematic view showing a magnetic force application means and a control method thereof according to an embodiment of the film forming apparatus of the present invention. FIG. 5 is a schematic view showing a magnetic force application means and a control method thereof according to another embodiment of the film forming apparatus of the present invention. FIG. 6 is a schematic view showing an example of an electronic device manufactured using the film forming method according to the present invention. FIG. 7 is a schematic view showing a process of adhering the substrate and the mask in the prior art. FIG. 8 is a schematic view showing the step of adhering the substrate to the mask in another prior art.

  Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. In the following description, the hardware configuration and software configuration of the device, the process flow, the manufacturing conditions, the dimensions, the materials, the shape, etc. limit the scope of the present invention to only those unless otherwise specified. It is not for the purpose.

  The present invention can be desirably applied to an apparatus for forming a thin film (material layer) of a desired pattern on a surface of a substrate by vacuum evaporation. As a material of the substrate, any material such as glass, film of polymer material, metal and the like can be selected, and as a vapor deposition material, organic material, metallic material (metal, metal oxide, etc.), etc. Any material can be selected. Specifically, the technology of the present invention is applicable to manufacturing apparatuses such as organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members and the like. Among them, the manufacturing apparatus of the organic EL display device is desired to further improve the alignment accuracy and the adhesion accuracy of the substrate and the mask as the substrate is enlarged or the display panel is made higher in definition. It is one of the application examples.

<Electronic Device Production Line>
FIG. 1 is a top view schematically showing a part of a configuration of a manufacturing line of an electronic device. The manufacturing line of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming a film of an organic EL on a substrate having a size of about 1800 mm × about 1500 mm, the substrate is cut out to produce a plurality of small size panels.

Generally, as shown in FIG. 1, a production line of an electronic device has a plurality of film forming chambers 11 and 12 and a transfer chamber 13. In the transfer chamber 13, a transfer robot 14 for holding and transferring the substrate 10 is provided. The transport robot 14 is, for example, a robot having a structure in which a robot hand holding the substrate 10 is attached to an articulated arm, and carries the substrate 10 into and out of each film forming chamber.
In each of the film forming chambers 11 and 12, a film forming apparatus (also referred to as a vapor deposition apparatus) is provided. A series of film forming processes such as delivery of the substrate 10 with the transport robot 14, adjustment (alignment) of the relative position between the substrate 10 and the mask, fixing of the substrate 10 on the mask, film formation (deposition) It is done automatically.

Hereinafter, the configuration of the film forming apparatus in the film forming chamber will be described.
<Deposition apparatus>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus 2. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. Assuming that the substrate 10 is fixed parallel to the horizontal plane (XY plane) at the time of film formation, the direction parallel to the short side of the substrate 10 is taken as the X direction, and the direction parallel to the long side is taken as the Y direction. Also, the rotation angle around the Z axis is indicated by θ.

  The film forming apparatus 2 includes a vacuum chamber 20 that defines a space in which a film forming process is performed. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

  A substrate support 21 for supporting a substrate 10, a mask 22 for placing a mask, an electrostatic chuck 23 for holding the substrate 10 by electrostatic attraction, and a metal mask A magnetic force application means 24 or the like for applying a magnetic force thereto is provided, and a vapor deposition source 25 or the like in which a vapor deposition material is accommodated is provided at the lower part in the vacuum chamber 20 of the film forming apparatus.

  The substrate 10 carried into the vacuum chamber 20 by the transfer robot 14 of the transfer chamber 13 is placed on the substrate support 21. The substrate support 21 may be provided so as to be fixed to the vacuum chamber 20, or may be provided so as to be vertically movable. The substrate support 21 includes support members 211 and 212 for supporting the periphery of the lower surface of the substrate 10.

  Under the substrate support 21, a frame-shaped mask table 22 is installed. The mask table 22 may be installed so as to be fixed to the vacuum chamber 20, or may be installed so as to be vertically movable. A mask 221 having an opening pattern corresponding to the thin film pattern formed on the substrate 10 is placed on the mask table 22. In particular, a mask used to manufacture an organic EL element for a smartphone is a metal mask on which a minute opening pattern is formed, and is also called FMM (Fine Metal Mask).

  An electrostatic chuck 23 is provided above the support members 211 and 212 of the substrate support 21 to hold and fix the substrate 10 by electrostatic attraction. The electrostatic chuck 23 has, for example, a structure in which an electric circuit such as a metal electrode is embedded in a dielectric (for example, ceramic material) matrix. When positive (+) and negative (-) voltages are applied to the metal electrode, polarization charges of the opposite polarity to the metal electrode are induced in the substrate 10 through the dielectric matrix, and the electrostatic attraction between them causes the substrate 10 to It is held and fixed to the electrostatic chuck 23. The electrostatic chuck 23 may be formed of one plate or may be formed to have a plurality of subplates. Also, even in the case of forming by one plate, electrostatic attraction can be independently controlled depending on the position in one plate, including a plurality of electric circuits inside.

  A magnetic force application means 24 is provided on the upper portion of the electrostatic chuck 23 for applying a magnetic force to the metal mask 221 to prevent bending of the mask 221 and for bringing the mask 221 and the substrate 10 into close contact. The magnetic force application means 24 consists of a permanent magnet or an electromagnet, and can include a plurality of magnet modules. The detailed structure of the magnetic force application means 24 and the method of adhering the substrate 10 and the mask 221 by the magnetic force application means 24 of the present invention will be described later with reference to FIGS. 3 to 5.

  Although not shown in FIG. 2, a cooling plate for cooling the substrate 10 may be provided between the electrostatic chuck 23 and the magnetic force application means 24. The cooling plate may be formed integrally with the electrostatic chuck 23 or the magnetic force applying means 24.

  The deposition source 25 is a crucible (not shown) in which the deposition material to be deposited on the substrate 10 is stored, a heater (not shown) for heating the crucible, the deposition material until the evaporation rate from the deposition source becomes constant. It includes a shutter (not shown) or the like that prevents the substrate from being scattered. The deposition source 25 may have various configurations depending on applications such as a point deposition source and a linear deposition source.

  Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate.

  A driving mechanism for moving the substrate support 21, the mask table 22, the electrostatic chuck 23, the magnetic force application means 24 and the like in the vertical direction (Z direction) on the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2 A drive mechanism or the like for moving the electrostatic chuck 23 or the like in parallel with the horizontal plane (in the X direction, the Y direction, and the θ direction) for alignment of the mask 10 and the mask 221 is provided. In addition, for alignment of the mask 221 and the substrate 10, an alignment camera (not shown) is also provided which captures an alignment mark formed on the substrate 10 and the mask 221 through a window provided on the ceiling of the vacuum chamber 20.

  The film forming apparatus includes a control unit 26. The control unit 26 has functions such as transport and alignment of the substrate 10, control of the vapor deposition source 25, and control of film formation. In particular, when the control unit 26 according to the present invention raises and lowers the electrostatic chuck 23 or the mask table 22 to bring the substrate 10 and the mask 221 into close contact, the electrostatic chuck 23 and the mask table 22 have a predetermined distance. The electrostatic chuck 23 or the mask table 22 is moved up and down to a position where the substrate 10 held by the electrostatic chuck 23 and the mask 221 placed on the mask table 22 have a predetermined interval. The elevation of the drive mechanism of the electric chuck 23 or the drive mechanism of the mask table 22 is controlled. Further, the control unit 26 controls the application of the magnetic force to the mask 221 of the magnetic force application means 24 in the step of lowering the magnetic force application means 24 and bringing the substrate 10 and the mask 221 into close contact. The control unit 26 can be configured by, for example, a computer having a processor, a memory, a storage, an I / O, and the like. In this case, the function of the control unit 26 is realized by the processor executing a program stored in the memory or the storage. As a computer, a general-purpose personal computer may be used, or an embedded computer or programmable logic controller (PLC) may be used. Alternatively, some or all of the functions of the control unit 26 may be configured by a circuit such as an ASIC or an FPGA. Moreover, the control part 26 may be installed for every film-forming apparatus, and one control part 26 is good also as what controls several film-forming apparatuses.

Hereinafter, the film forming process performed by the film forming apparatus of the present invention will be described.
First, a new mask 221 is carried into the vacuum chamber 20 of the film forming apparatus and placed on the mask table 22.

  The substrate 10 is carried into the vacuum chamber 20 by the transfer robot 14 in the transfer chamber 13 and placed on the substrate support 21. Subsequently, the electrostatic chuck 23 is lowered to hold the substrate 10 by electrostatic attraction.

A substrate alignment process is performed to measure and adjust the relative positions of the substrate 10 held by the electrostatic chuck 23 and the mask 221 placed on the mask table in the horizontal (XYθ) direction.

When the substrate alignment process is completed, the electrostatic chuck 23 and / or the substrate support 21 is lowered by the driving mechanism to move the substrate 10 to a position spaced apart from the upper surface of the mask 221 by a predetermined distance, and then a magnetic force is applied. The means 24 is lowered by the drive mechanism to bring the substrate 10 and the mask 221 into close contact. Instead of lowering the electrostatic chuck 23 and / or the substrate support 21, the mask table 22 may be lifted by a drive mechanism to move the mask 221 to a position spaced apart from the substrate 10 by a predetermined distance. A specific method of adhering the substrate 10 and the mask 221 will be described later with reference to FIGS. 3 to 5.

  In this state, the shutter of the deposition source 25 is opened, and the deposition material evaporated from the crucible of the deposition source 25 is deposited on the substrate 10 through the fine pattern opening of the mask.

  When the film thickness of the deposition material deposited on the substrate 10 reaches a predetermined thickness, the shutter of the deposition source 25 is closed, and then the transfer robot 14 unloads the substrate 10 from the vacuum chamber 20 to the transfer chamber 13. After repeating the steps from substrate loading to substrate unloading for a predetermined number of substrates, the deposition material is deposited and the used mask 221 is unloaded from the film forming apparatus, and a new mask 221 is used as a film forming apparatus. Bring in.

<Mask adhesion method>
Hereinafter, a method for adhering or adhering the substrate and the mask according to the present invention will be described with reference to FIG.
In the present embodiment, in order to bring the substrate 10 and the mask 221 into close contact with each other before performing the film forming process, as shown in FIG. 3A, the electrostatic chuck 23 drives the substrate 10 attracted and held by the electrostatic chuck 23. It is lowered by a mechanism (not shown) or the mask table 22 supporting the mask 221 is lifted by a mask table driving mechanism (not shown). At this time, unlike the prior art, the electrostatic chuck 23 or the mask table 22 is not moved relative to the electrostatic chuck 23 or the mask table 22 until the lower surface of the substrate 10 contacts the upper surface peripheral portion of the mask 221. As shown in FIG. 3b, the substrate 10 and the mask 221 are moved by a predetermined distance so as to be separated.

  The distance between the substrate 10 and the mask 221 is determined based on the initial deflection amount of the mask 221. When the mask 221 is carried into the film forming apparatus 2 and placed on the mask table 22, the central portion of the mask 221 is bent downward by the weight of the mask 221. In the present invention, when the electrostatic chuck 23 or the mask base 22 is relatively moved to bring the substrate 10 and the mask 221 into close contact, the distance between the substrate 10 and the mask 221 is the initial deflection of the mask 221 Move until the interval corresponding to.

  When the distance between the substrate 10 and the mask 221 is larger than the initial deflection amount of the mask 221, the magnetic force applied to the mask by the magnetic force application means 24 is not sufficient in the subsequent step of lowering the magnetic force application means 24. The substrate 10 and the mask 221 can not be in close contact with each other. Also, if the distance between the substrate 10 and the mask 221 is too smaller than the initial amount of deflection of the mask 221, the magnetic force of the magnetic force application means 24 causes the mask 221 to be recessed downward (vertically) Since it adheres to the substrate 10 in the process of being inverted in the vertically upward projecting shape, the central portion of the mask 221 can not be attached to the central portion of the substrate 10 first, and finally the formation of the substrate 10 A gap remains between the film area and the mask 221.

In this state (that is, in a state where the substrate 10 held by the electrostatic chuck 23 and the mask 221 held by the mask table 22 are separated at a predetermined distance), as shown in FIG. The application means 24 is lowered toward the mask table 22, and the mask 221 is pulled toward the substrate 10 by the magnetic force of the magnetic force application means 24. At this time, since the substrate 10 and the mask 221 are separated by a predetermined distance, no friction with the substrate 10 occurs in the process of attracting the mask 221 by the magnetic force, and the bending of the central portion of the mask 221 causes both sides of the mask You will be able to move to the department.

  In particular, as shown in FIG. 3 c, when lowering the magnetic force application means 24 toward the mask table 22, the magnetic force application means 24 is applied such that the magnetic force of the magnetic force application means 24 is first applied to the central portion of the mask 221. Let down. For example, as described later with reference to FIG. 4, after the magnet module of the central portion of the plurality of magnet modules of the magnetic force application means 24 is first lowered or the plurality of electromagnet modules are lowered together, Power is supplied to the central electromagnet module first so that the magnetic force from the central electromagnet module attracts the central portion of the mask 221.

  As a result, when the mask 221 is placed on the mask table 22, the mask 221 whose central portion is bent by its own weight is drawn from the central portion toward the substrate 10, and the central portion of the mask 221 is the substrate 10 first. It comes in close contact with the central part of the That is, the central portion of the inverted mask 221 comes first to adhere to the central portion of the substrate 10 while reversing the mask 221 from the vertically downward concave shape to the vertically upward projecting shape.

  Next, as illustrated in FIG. 3D, the magnet modules arranged to correspond to both sides of the mask 221 are lowered toward the mask table 22 so that the mask 221 moves from the central portion toward the peripheral portions on both sides. The substrate 10 is in close contact with the substrate 10. Thereby, the deflection of the mask 221 moves out of the film formation region of the substrate 10, and the mask 221 adheres to the film formation region of the substrate 10 without wrinkles (without a gap).

  In the embodiment illustrated in FIG. 3, after the magnetic force application means 24 starts applying the magnetic force from the central portion of the mask 221, the magnetic force is applied to the peripheral portions on both sides of the mask 221, but the present invention Without being limited thereto, as described with reference to FIG. 5, it is also possible to apply a magnetic force sequentially from one side to the other side of the two opposing sides of the mask.

<Structure of magnetic force application means and magnetic force control>
The structure of the magnetic force application means 24 used in the step of bringing the substrate 10 and the mask 221 into close contact with each other and a specific example of the magnetic force control will be described below with reference to FIGS. 4 and 5. Although the magnetic force control described below is performed by the control unit 26 of the film forming apparatus 2, the present invention is not limited thereto, and may be performed by a separate magnetic force control unit. For this purpose, the film forming apparatus 2 of the present invention can include a separate magnetic force control unit.

  FIG. 4a schematically shows the configuration of the magnetic force application means 24 and the method for applying the magnetic force to the mask 221 by the magnetic force application means 24 according to the first embodiment of the present invention.

  In the first embodiment, the magnetic force application by the magnetic force application unit 24 is advanced from the central portion of the mask 221 in the direction of the two opposing sides of the mask 221.

  That is, in the first embodiment, the magnetic force application means 24 is composed of a plurality of (for example, two) modules, and the hinge portion 241 as a rotation portion is provided at the central portion thereof. The two modules are provided so as to be relatively rotatable by the hinge portion 241.

In the process of applying the magnetic force, as shown in FIG. 4a, with respect to the mask table 22, with the magnetic force applying means 24 having the magnet modules on both sides taking the V shape with the hinge portion 241 as the center, After lowering (or while lowering), control is made to return to the planar shape. As a result, the central portion of the mask 221 receives the magnetic force from the magnetic force application means 24 first and is pulled up toward the substrate 10 (the mask 221 is in the shape of protruding vertically downward from the shape depressed vertically downward), Then, the mask 221 comes in close contact with the substrate 10 from the central portion of the mask 221 toward the opposing sides (for example, two opposing long sides) of the mask 221. By this, the mask comes into close contact with the film formation region of the substrate without any gap (wrinkling).
The magnetic force application means 24 of the first embodiment can be embodied by an electromagnet or a permanent magnet.

As a modification of the first embodiment, as shown in FIG. 4b, the magnetic force application means 24 is constituted by a plurality of (three in the present embodiment) magnet modules, and a plurality of individual magnet modules 242, 243, 2
By appropriately controlling the order of mechanically lowering 44 with respect to the mask 221, the order of applying the magnetic force to the mask 221 can be adjusted.

  For example, as shown in FIG. 4b, from the magnet module 243 disposed at a position corresponding to the central portion of the mask 221 to the magnet modules 242 and 244 disposed correspondingly to both end sides of the mask 221, By controlling the descending order of the magnet modules so that the magnetic force is applied, the application of the magnetic force to the mask 221 proceeds from the central portion of the mask 221 toward the peripheral portions on both sides of the mask 221 as in the first embodiment. Can be controlled as you At this time, the magnet modules 242, 243 and 244 may be embodied as electromagnets or permanent magnets.

As another modification of the first embodiment, as shown in FIG. 4c, the magnetic force application means 24 is constituted by a plurality of (for example, three) electromagnet modules 242, 243, 244, and a plurality of individual electromagnet modules 242, 243. The order of applying the magnetic force to the mask 221 can be controlled by appropriately controlling the order in which the power is applied to the light source 244.

For example, as shown in FIG. 4c, of the three electromagnet modules, the electromagnet module 243 at the center is first powered on so that the central part of the mask 221 is brought into intimate contact with the substrate first, and then both ends Power may be applied to the electromagnet modules 242, 244 of the part so that the mask part at the corresponding position is in close contact with the substrate. In particular, in this modification, the magnetic force can be controlled by turning on / off the power source applied to the electromagnet modules 242, 243, 244. Therefore, as in the first embodiment and the other modifications, By eliminating the need for complicated mechanical control, the structure of the film forming apparatus can be simplified, and control of the mechanism can also be simplified.

  Below, Example 2 of magnetic force control of the present invention is described. The second embodiment differs from the first embodiment in that the magnetic force application unit 24 controls so that the magnetic force is applied from one side (for example, one long side) of both opposing sides of the mask 221.

  Therefore, in the second embodiment, for example, as shown in FIG. 5A, the rotation portion 245 is provided on one side of the magnetic force application means 24, and the magnetic force application means 24 is configured to be rotatable about the side.

In the magnetic force application process according to the present embodiment, as shown in FIG. 5a, after the magnetic force application means 24 is rotated about the rotation portion 245 and inclined, it is lowered relative to the mask table 22. Control this (or lower it) to bring it back to the horizontal position. As a result, the magnetic force application means 24 can apply the magnetic force to the mask in the order of the other opposite side of the mask 221 from the one side of the mask 221 through the central part of the mask 221. This makes it possible to solve the problem that the central portion of the mask 221 receives the magnetic force most lately from the magnetic force application means 24 and the wrinkles remain in the central portion of the mask 221.
In the present embodiment, the magnetic force applying means 24 may be embodied by an electromagnet or a permanent magnet.

In the present embodiment, the configuration using the pivoting portion 245 is described in order to incline the magnetic force application means 24 with respect to the mask surface, but the present invention is not limited to this, and other methods may be used to apply the magnetic force application means 24 You may tilt it to the mask surface.

As a modification of the second embodiment, the magnetic force application means 24 is constituted by a plurality (for example, three) of magnet modules, and one end side of the mask 221 (for example, one long side of two opposing sides) The plurality of magnet modules are lowered so that the magnetic force is applied in order from the center part of the mask 221 to the other end side (the other long side of the two opposite sides) of the mask 221 from the Control the order.

  That is, as shown in FIG. 5 b, from the magnet module 242 disposed to correspond to one end of the mask 221, the magnet module 243 disposed to correspond to the central portion of the mask 221 and the other end to the mask 221. The mechanical module according to the second embodiment can achieve the same effect as that of the second embodiment by mechanically lowering the magnet module vertically from the upper side in the order of the magnet modules 244 arranged correspondingly.

  As another modification of the second embodiment, a mask is provided from one end side (long side) of the mask 221 using the magnetic force application means 24 constituted by a plurality of (for example, three) electromagnet modules 242, 243, 244. The voltage application to the electromagnet module is controlled so that adhesion of the mask 221 to the substrate 10 proceeds to the other end side (opposite long side side) of the mask 221 through the central portion of 221.

  That is, the magnetic force application means 24 is composed of three or more electromagnet modules, and the magnetic force application by this is performed, for example, to the electromagnet module 242 at a position corresponding to one long side of the mask 221 among the three electromagnet modules. The power is applied first so that the corresponding long side of the mask 221 is in close contact with the substrate 10 first. Subsequently, power is applied to the electromagnet module 243 at a position corresponding to the central portion of the mask 221 so that the central portion of the mask 221 is in close contact with the substrate 10, and finally the other long side of the mask 221 is accommodated. The other long side of the mask 221 is brought into close contact with the substrate 10 by applying a power supply to the electromagnet module 244 at the above position. By controlling the magnetic force application means 24 in this manner, the mask 221 comes into close contact with the substrate 10 without wrinkles.

Although the preferred embodiments of the magnetic force control of the present invention have been described above with reference to the drawings, the present invention is not limited to the illustrated embodiments.
For example, instead of the configuration in which the plate-like magnetic force application means 24 is connected by the hinge portion 241 as in the first embodiment, a similar sheet-type magnetic force application means 24 is used to obtain a similar function and effect. Can. In other words, if both long sides of the flexible sheet-type magnetic force application means 24 are supported, the central portion will be bent downward. In this state, the sheet-type magnetic force application means 24 is lowered on the substrate as it is. By doing this, it is possible to obtain the same effects as the configuration of the first embodiment.

<Method of Manufacturing Electronic Device>
Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the electronic device.
First, an organic EL display device to be manufactured will be described. FIG. 6 (a) is a general view of the organic EL display device 60, and FIG. 6 (b) shows a cross-sectional structure of one pixel.

As shown in FIG. 6A, in the display region 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The term “pixel” as used herein refers to the minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present embodiment, the first light emitting element 62R showing light emission different from each other
The pixel 62 is configured by a combination of the second light emitting element 62G and the third light emitting element 62B. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element and a white light emitting element It is not limited.

  FIG. 6 (b) is a schematic partial cross-sectional view taken along line A-B of FIG. 6 (a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. , And an organic EL element comprising Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, 66B are formed in patterns corresponding to light emitting elements (sometimes described as organic EL elements) that emit red, green and blue, respectively. In addition, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrodes 64 and the second electrodes 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

  Although the hole transport layer 65 and the electron transport layer 67 are shown in one layer in FIG. 6B, they are formed of a plurality of layers including the hole block layer and the electron block layer depending on the structure of the organic EL display element. It may be done. In addition, the positive electrode has an energy band structure which can facilitate the injection of holes from the first electrode 64 to the hole transport layer 65 between the first electrode 64 and the hole transport layer 65. A hole injection layer can also be formed. Similarly, an electron injection layer can be formed between the second electrode 68 and the electron transport layer 67 as well.

Next, an example of a method of manufacturing an organic EL display device will be specifically described.
First, a circuit 63 (not shown) for driving the organic EL display device and the substrate 63 on which the first electrode 64 is formed are prepared.

  An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 64 is formed. Form 69 The opening corresponds to a light emitting region in which the light emitting element actually emits light.

  The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, the substrate is held by the substrate support 21 and the electrostatic chuck 23, and the hole transport layer 65 is used as the first display area. A film is formed on the electrode 64 as a common layer. The hole transport layer 65 is deposited by vacuum evaporation. In practice, the hole transport layer 65 is formed to have a size larger than that of the display area 61, so a high definition mask is not necessary.

  Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into the second organic material film forming apparatus and held by the substrate support 21. After the substrate on the substrate support 21 is held by the electrostatic chuck 23, the substrate and the mask are aligned. Subsequently, the substrate is placed on the mask, and the substrate and the mask are brought into close contact by the magnetic force application means 24. In this state, the light emitting layer 66R emitting red is formed on the portion of the substrate 63 where the element emitting red is disposed.

According to the present invention, in the step of bringing the mask 221 into close contact with the substrate 10, the electrostatic chuck 23 or the mask table is separated such that the substrate 10 held by suction by the electrostatic chuck 23 is separated from the mask 221 by a predetermined distance. Move 22 relatively. In this state, the magnetic force application means 24 is lowered toward the mask table 22 so that the mask 221 can be brought into close contact with the film formation region of the substrate 10 without wrinkles.

  Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third organic material film forming apparatus, and the light emitting layer 66B emitting blue is formed by the fourth organic material film forming apparatus. . After film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

  The substrate formed up to the electron transport layer 67 is moved by the metallic deposition material deposition apparatus to deposit the second electrode 68.

  Thereafter, it moves to a plasma CVD apparatus to form a protective layer 70, and the organic EL display device 60 is completed.

  After the substrate 63 on which the insulating layer 69 is patterned is carried into a film forming apparatus and the film is exposed to an atmosphere containing moisture or oxygen until the film formation of the protective layer 70 is completed, the light emitting layer made of the organic EL material It may be degraded by moisture or oxygen. Therefore, in the present embodiment, the loading and unloading of the substrate between the film forming apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

  The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea thereof.

10: Substrate 21: Substrate support 22: Mask base 23: Electrostatic chuck 24: Magnetic force application means 241: Rotating portions 242 to 244: Magnet module

Claims (27)

A film forming apparatus for forming a vapor deposition material on a substrate through a mask, the film forming apparatus comprising:
An electrostatic chuck for holding the substrate,
A mask table installed on the substrate holding surface side of the electrostatic chuck for holding a mask;
Magnetic force application means, disposed on the opposite side of the substrate holding surface of the electrostatic chuck, for applying a magnetic force to the mask;
A control unit that controls the electrostatic chuck, the mask table, and the magnetic force application unit;
The controller holds the substrate held by the electrostatic chuck and the mask table before moving the magnetic force application unit toward the mask table in order to bring the substrate and the mask into close contact with each other. A film forming apparatus in which the mask is controlled to have a predetermined interval.   The control unit controls relative movement of the electrostatic chuck or the mask table such that the substrate held by the electrostatic chuck and the mask held by the mask table have the predetermined interval. The film forming apparatus according to claim 1.   The film forming apparatus according to claim 1, wherein the predetermined interval is determined based on a deflection amount of a central portion of the mask. The apparatus further comprises an electrostatic chuck driving mechanism for moving the electrostatic chuck,
The control unit is configured to move the electrostatic chuck to the mask base to a position where the substrate held by the electrostatic chuck and the mask held by the mask base are separated at a predetermined interval. The film forming apparatus according to any one of claims 1 to 3, wherein the electrostatic chuck drive mechanism is controlled so as to move in a direction. Further including a mask table driving mechanism for moving the mask table;
The control unit directs the mask table to the electrostatic chuck to a position where the substrate held by the electrostatic chuck and the mask held by the mask table are separated at a predetermined interval. The film-forming apparatus of any one of Claims 1-3 which controls the said mask stand drive mechanism so that it may move. The apparatus further includes a magnetic force application means drive mechanism for moving the magnetic force application means,
The control unit is configured to move the magnetic force application unit toward the mask table in a state where the substrate held by the electrostatic chuck and the mask held by the mask table have the predetermined interval. The film-forming apparatus of any one of Claims 1-5 which controls the said magnetic force application means drive mechanism.   The film forming apparatus according to claim 6, wherein the control unit performs control such that a magnetic force of the magnetic force application unit to the mask is applied from a central portion of the mask.   The control unit according to claim 6 or 7, wherein the control unit controls the magnetic force application unit driving mechanism to descend toward the mask table in a state where the magnetic force application unit has a V shape. Film forming apparatus. The magnetic force application means includes a plurality of electromagnet modules,
The control unit is configured to direct the plurality of electromagnet modules from an electromagnet module disposed to correspond to a central portion of the mask to an electromagnet module disposed to correspond to two opposing sides of the mask. The film forming apparatus according to any one of claims 6 to 8, wherein control is performed so as to supply power sequentially. The magnetic force application means includes a plurality of magnet modules movable individually.
The plurality of magnet modules are arranged in the order from the magnet module disposed corresponding to the central part of the mask to the magnet module disposed corresponding to two opposing sides of the mask from the control unit. The film forming apparatus according to any one of claims 6 to 9, wherein the magnetic force application means drive mechanism is controlled such that the magnetic head moves toward the mask table.   The film forming apparatus according to claim 6, wherein the control unit controls the magnetic force of the magnetic force application unit to the mask to be applied from one side of the mask.   The film forming apparatus according to claim 11, wherein the control unit controls the magnetic force application unit driving mechanism so that the magnetic force application unit is moved toward the mask in a state where the magnetic force application unit is inclined. The magnetic force application means includes a plurality of electromagnet modules,
The control unit is configured to control power to be applied to the plurality of electromagnet modules sequentially from an electromagnet module disposed at a position corresponding to one of two opposing sides of the mask table. The film-forming apparatus of Claim 11 or Claim 12. The magnetic force application means includes a plurality of magnet modules movable individually.
The control unit is configured to move the plurality of magnet modules toward the mask base sequentially from a magnet module disposed at a position corresponding to one of two opposing sides of the mask base. The film forming apparatus according to any one of claims 11 to 13, which controls the magnetic force application means driving mechanism. A film forming method for forming a vapor deposition material on a substrate through a mask, comprising:
Placing the mask on the mask table;
Placing the substrate on a substrate support;
Adsorbing and holding the substrate with an electrostatic chuck;
Moving the electrostatic chuck or the mask table relative to each other such that the distance between the substrate held by the electrostatic chuck and the mask placed on the mask table is a predetermined distance;
Moving the magnetic force application unit toward the mask table in a state in which the substrate and the mask are separated by the predetermined distance, and bringing the mask into close contact with the film formation region of the substrate;
And depositing an evaporation material on the substrate through the mask.   The film forming method according to claim 15, wherein the predetermined interval is determined based on a deflection amount of the mask.   In the moving step, the electrostatic chuck holding the substrate is moved toward the mask table on which the mask is placed so that the substrate and the mask are separated at the predetermined interval. The film forming method according to claim 15 or 16, wherein   Moving the mask table on which the mask is mounted toward the electrostatic chuck holding the substrate so that the substrate and the mask are separated at the predetermined distance in the moving step; The film forming method according to claim 15 or 16, wherein   The film forming method according to any one of claims 15 to 18, wherein a magnetic force of the magnetic force application unit to the mask is applied from a central portion of the mask.   The film forming method according to any one of claims 15 to 19, wherein the magnetic force application means descends toward the mask table in a V-shaped state.   The plurality of electromagnet modules of the magnetic force application means including a plurality of electromagnet modules are arranged to correspond to two opposing sides of the mask from the electromagnet modules arranged to correspond to the central portion of the mask The film forming method according to any one of claims 15 to 20, wherein power is sequentially supplied toward the electromagnet module.   The plurality of magnet modules of the magnetic force application means including the plurality of magnet modules that can be moved individually are arranged on the two opposing sides of the mask from the magnet modules arranged to correspond to the central portion of the mask. The film forming method according to any one of claims 15 to 21, wherein the film is moved toward the mask table in the order of the magnet modules arranged in a corresponding manner.   The film forming method according to any one of claims 15 to 22, wherein the magnetic force of the magnetic force application unit with respect to the mask is applied from one side of the mask in the step of bringing into close contact.   24. The film forming method according to claim 23, wherein the magnetic force application means is moved toward the mask table while being inclined.   Power is sequentially applied to the plurality of electromagnet modules of the magnetic force application means including a plurality of electromagnet modules, starting from the electromagnet modules arranged at a position corresponding to one side of two opposing sides of the mask table. The film forming method according to claim 23 or 24.   The plurality of magnet modules of the magnetic force application means including the plurality of magnet modules which can be moved individually are sequentially arranged from the magnet module disposed at a position corresponding to one side of the two opposing sides of the mask table. The film forming method according to any one of claims 23 to 25, wherein the film is moved toward the mask table side. The method of manufacturing an electronic device using the film-forming method of any one of Claims 15-26.