JP7090686B2 - Manufacturing method for film forming equipment and electronic devices - Google Patents

Description

The present invention relates to a film forming apparatus for forming a film-deposited material on a substrate in a predetermined pattern via a mask, and a method for manufacturing an electronic device using the film forming apparatus.

In the manufacture of an organic EL display device (organic EL display), when forming an organic light emitting element (organic EL element; OLED) constituting the organic EL display device, the vapor deposition material evaporated from the evaporation source of the film forming apparatus is used. An organic layer or a metal layer is formed by depositing a film on a substrate via a mask on which a pixel pattern is formed.

In the film forming apparatus, in order to deposit the pixel pattern on the mask on the substrate with high accuracy, the relative positions of the mask and the substrate are adjusted with high accuracy before the film deposition on the substrate is performed, and the mask is placed on the substrate. Adhere to the film formation surface of. As one method for bringing the mask into close contact with the film-forming surface of the substrate, a method of applying a magnetic force from the upper part of the substrate to the metal mask at the lower part of the substrate by using a magnetic force applying means such as a magnet plate is known. There is.

Patent Document 1 proposes a technique for closely adhering a substrate and a mask in a film forming apparatus having a structure in which the substrate and the mask are brought into close contact with each other by a magnetic force applying means while the substrate is held by using an electrostatic chuck. ing.

Japanese Unexamined Patent Publication No. 2019-116679

In the conventional film forming apparatus, a cooling means is installed between the electrostatic chuck and the magnetic force applying means in order to suppress deterioration and deterioration of the material deposited on the substrate. However, in such a film forming apparatus, since the distance between the magnetic force applying means and the mask becomes long, the attractive force of the mask by the magnetic force applying means is lowered, which may be a factor of lowering the film forming accuracy.

An object of the present invention is to provide a method for manufacturing a film forming apparatus and an electronic device capable of suppressing a decrease in the attractive force of a mask by a magnetic force applying means.

The film forming apparatus according to the present invention has an electrostatic chuck having a substrate holding surface for holding a substrate, a mask support unit installed on the substrate holding surface side for holding a magnet, and the electrostatic chuck. A magnetic force applying means installed on the opposite side of the substrate holding surface to apply a magnetic force to the mask, and a cooling means installed on the opposite side of the substrate holding surface to the electrostatic chuck to cool the substrate. The magnetic force applying means is installed on the first plate member and the surface of the first plate member facing the electrostatic chuck in the film forming apparatus for forming a vapor deposition material on the substrate via a mask. The cooling means faces the second plate member arranged between the first plate member and the electrostatic chuck and the first plate member of the second plate member. It has a cooling tube installed on the surface, and is characterized in that at least a part of the magnet is arranged between two adjacent portions of the cooling tube in a plane parallel to the substrate holding surface. And.

According to the present invention, it is possible to suppress a decrease in the attractive force of the mask by the magnetic force applying means.

FIG. 1 is a schematic diagram of a part of an electronic device manufacturing apparatus. FIG. 2 is a schematic view of a film forming apparatus according to an embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing the configuration and arrangement structure of the cooling means and the magnetic force applying means of the film forming apparatus according to the embodiment of the present invention. FIG. 4 is a plan view schematically showing the configuration and arrangement structure of the cooling means and the magnetic force applying means of the film forming apparatus according to the embodiment of the present invention. FIG. 5 is a schematic diagram showing an electronic device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. Further, in the following description, unless there is a specific description, the hardware configuration and software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the apparatus are limited to those of the present invention. Not a thing.

The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to form a film, and can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition. As the material of the substrate, any material such as glass, a film of a polymer material, metal, silicon and the like can be selected, and the substrate is, for example, a substrate in which a film such as polyimide is laminated on a glass substrate or a silicon wafer. It may be. Further, as the vapor deposition material, any material such as an organic material and a metallic material (metal, metal oxide, etc.) may be selected. In addition to the vacuum deposition apparatus, the present invention can be applied to a film forming apparatus including a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus. Specifically, the technique of the present invention can be applied to manufacturing equipment such as an organic electronic device (for example, an organic EL element, a thin film solar cell), an optical member, and the like. Among them, an apparatus for manufacturing an organic EL element, which forms an organic EL element by evaporating a vapor-deposited material and depositing it on a substrate via a mask, is one of the preferred application examples of the present invention.

<Manufacturing equipment for electronic devices>
FIG. 1 is a plan view schematically showing a configuration of a part of an electronic device manufacturing apparatus.

The manufacturing apparatus of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device. VR
In the case of a display panel for an HMD, a film is formed on a silicon wafer of a predetermined size for forming an organic EL element, and then the silicon wafer is cut out along a region (scribe region) between the element forming regions. , Make multiple small size panels. In the case of a display panel for smartphones, a 4.5th generation substrate (about 700mm x about 900mm), a 6th generation full size (about 1500mm x about 1850mm) or a half cut size (about 1500mm x about 925mm) substrate can be used. After forming a film for forming an organic EL element, the substrate is cut out to produce a plurality of small-sized panels.

The electronic device manufacturing device generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices.

The cluster device 1 includes a plurality of film forming devices 11 for processing (for example, film forming) the substrate W, a plurality of mask stock devices 12 for accommodating masks M before and after use, and a transport chamber 13 arranged in the center thereof. And. As shown in FIG. 1, the transport chamber 13 is connected to each of the plurality of film forming apparatus 11 and the mask stock apparatus 12.

A transfer robot 14 that transfers a substrate or a mask is arranged in the transfer chamber 13. The transfer robot 14 transfers the substrate W from the pass chamber 15 of the relay device arranged on the upstream side to the film forming device 11. Further, the transfer robot 14 transfers the mask M between the film forming apparatus 11 and the mask stock apparatus 12. The transfer robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate W or a mask M is attached to an articulated arm.

In the film forming apparatus 11 (also referred to as a vapor deposition apparatus), the vapor deposition material stored in the evaporation source is heated by a heater and evaporated, and is vapor-deposited on the substrate W via the mask M. A series of film formation processes such as transfer of the substrate W / mask M to and from the transfer robot 14, adjustment (alignment) of the relative position between the substrate W and the mask M, fixing of the substrate W on the mask M, and film formation (deposited film) , Performed by the film forming apparatus 11.

In the mask stock device 12, a new mask used in the film forming process in the film forming apparatus 11 and a used mask are separately stored in two cassettes. The transfer robot 14 transfers the used mask from the film forming apparatus 11 to the cassette of the mask stock device 12, and transfers a new mask from the other cassettes of the mask stock device 12 to the film forming apparatus 11.

The cluster device 1 has a pass chamber 15 for transporting the substrate W transported from the upstream side in the flow direction of the substrate W to the cluster device 1, and a substrate W for which the film formation process has been completed by the cluster device 1 is on the downstream side. A buffer chamber 16 for transporting to the cluster device of the above is connected and provided. The transfer robot 14 in the transfer chamber 13 receives the substrate W from the pass chamber 15 on the upstream side and transfers it to one of the film forming devices 11 (for example, the film forming device 11a) in the cluster device 1. Further, the transfer robot 14 receives the substrate W for which the film forming process has been completed from one of the plurality of film forming devices 11 (for example, the film forming device 11b), and connects the substrate W to the downstream side in a buffer chamber 16. Transport.

A swivel chamber 17 that changes the direction of the substrate may be installed between the buffer chamber 16 and the pass chamber 15 on the downstream side thereof. The swivel chamber 17 is provided with a transfer robot 18 for receiving the substrate W from the buffer chamber 16, rotating the substrate W by 180 °, and transporting the substrate W to the pass chamber 15. As a result, the orientation of the substrate W becomes the same between the cluster device on the upstream side and the cluster device on the downstream side, and the substrate processing becomes easy.

The pass chamber 15, the buffer chamber 16, and the swivel chamber 17 are so-called relay devices that connect the cluster devices, and the relay devices installed on the upstream side and / or the downstream side of the cluster device are the pass room, the buffer room, and the like. Includes at least one of the swivel chambers.

The film forming apparatus 11, the mask stock apparatus 12, the transport chamber 13, the pass chamber 15, the buffer chamber 16, the swirl chamber 17, and the like are maintained in a high vacuum state in the process of manufacturing the organic light emitting element.

In the present embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. 1, but the present invention is not limited to this, and other types of apparatus and chambers may be provided, and these devices may be provided. And the arrangement between the chambers may change. For example, in the present invention, the substrate W and the mask M are coalesced by another device or chamber instead of the film forming apparatus 11, and then the substrate W and the mask M are placed on a carrier and conveyed through a plurality of film forming apparatus arranged in a row. It can also be applied to an in-line type manufacturing apparatus that performs a film forming process while performing the film forming process.

Hereinafter, a specific configuration of the film forming apparatus 11 will be described.

<Film formation device>
FIG. 2 is a schematic view showing the configuration of the film forming apparatus 11. In the following description, the two intersecting directions on the plane (XY plane) parallel to the film forming surface of the substrate W are defined as the X direction (first direction) and the Y direction (second direction), and the film forming surface of the substrate W is defined. An XYZ Cartesian coordinate system is used in which the vertical direction perpendicular to is the Z direction (third direction). Further, the rotation angle (rotation direction) around the Z axis is represented by θ.

The film forming apparatus 11 includes a vacuum vessel 21 maintained in a vacuum atmosphere or an atmosphere of an inert gas such as nitrogen gas, a substrate support unit 22 provided inside the vacuum vessel 21, a mask support unit 23, and an electrostatic chuck. 24 and the evaporation source 25.

The board support unit 22 is a means for receiving and holding the board W transported by the transfer robot 14 provided in the transfer chamber 13, and is also called a substrate holder.

The mask support unit 23 is a means for receiving and holding the mask M conveyed by the transfer robot 14, and is also called a mask holder. The mask support unit 23 is provided on the substrate suction surface (substrate holding surface) side of the electrostatic chuck 24.

The mask M has an opening corresponding to the thin film pattern formed on the substrate W and is supported by the mask support unit 23. In particular, the mask used for manufacturing an organic EL element for smartphones is a metal mask in which a fine opening pattern is formed, and is also called FMM (Fine Metal Mask).

Above the substrate support unit 22, an electrostatic chuck 24 is provided as a substrate adsorption means for adsorbing and fixing the substrate W.

The electrostatic chuck 24 is a Coulomb force type electrostatic chuck in which a dielectric having a relatively high resistance is interposed between an electrode and an adsorption surface, and adsorption is performed by a Coulomb force between the electrode and the object to be adsorbed. However, a dielectric having a relatively low resistance is interposed between the electrode and the adsorption surface, and adsorption is performed by the Johnson-Labeck force generated between the adsorption surface of the dielectric and the object to be adsorbed. It may be a Johnson-Labeck force type electrostatic chuck, or a gradient force type electrostatic chuck that adsorbs an object to be adsorbed by a non-uniform electric field.

When the object to be adsorbed is a conductor or a semiconductor (silicon wafer), it is preferable to use a Coulomb force type electrostatic chuck or a Johnson-Labeck force type electrostatic chuck. When the object to be adsorbed is an insulator such as glass, it is preferable to use a gradient force type electrostatic chuck.

The electrostatic chuck 24 may be formed of one plate or may be formed so as to have a plurality of sub-plates capable of independently controlling the suction force. Further, even when the plate is formed of one plate, a plurality of electrode portions may be provided inside the plate so that the adsorption force can be independently controlled for each electrode portion in one plate.

As the substrate adsorption means, an adhesive chuck by adhesive force may be used in addition to the electrostatic chuck by electrostatic attraction.

The film forming apparatus 11 includes a cooling means 30 and a magnetic force applying means 32 (see FIG. 3) installed on the side opposite to the substrate suction surface of the electrostatic chuck 24. The cooling means 30 has a cooling tube through which the refrigerant flows, suppresses the temperature rise of the substrate W and the electrostatic chuck 24 during the film forming operation, and suppresses deterioration and deterioration of the organic material deposited on the substrate W. Can be done. The magnetic force applying means 32 has a yoke plate (first plate member) and a plurality of magnets provided on the yoke plate, and attracts the mask M by the magnetic force to improve the adhesion between the substrate W and the mask M at the time of film formation. be able to.

In the embodiment of the present invention, the cooling tube of the cooling means 30 and the magnet of the magnetic force applying means 32 are located in substantially the same region in the direction perpendicular to the substrate suction surface of the electrostatic chuck 24. As a result, even when the film forming apparatus 11 is provided with the cooling means 30, the distance between the magnetic force applying means 32 and the mask M is not long, so that the magnetic force acting on the mask M by the magnetic force applying means 32 is reduced. It can be suppressed.

The evaporation source 25 includes a crucible (not shown) in which the vapor-film-deposited material formed on the substrate is stored, a heater for heating the crucible (not shown), and the vapor-filmed material on the substrate until the evaporation rate from the evaporation source becomes constant. Includes shutters (not shown) that prevent scattering. The evaporation source 25 can have various configurations depending on the application, such as a point evaporation source, a linear evaporation source, and a planar evaporation source.

The film forming apparatus 11 includes a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate.

A substrate support unit actuator 26, a mask support unit actuator 27, an electrostatic chuck actuator 28, a position adjusting mechanism 29, and the like are provided on the upper outer side (atmosphere side) of the vacuum vessel 21. The board support unit actuator 26 is a driving means for raising and lowering (moving in the Z direction) the board support unit 22. The mask support unit actuator 27 is a driving means for raising and lowering (moving in the Z direction) the mask support unit 23. The electrostatic chuck actuator 28 is a driving means for raising and lowering (moving in the Z direction) the electrostatic chuck 24.

The position adjusting mechanism 29 is an alignment stage mechanism as a means for adjusting the relative position between the substrate W and the mask M. These actuators and the position adjusting mechanism are composed of, for example, a motor and a ball screw, or a motor and a linear guide. The position adjusting mechanism 29 moves the entire electrostatic chuck 24 or the electrostatic chuck actuator 28 in the XYθ direction (at least one direction of the X direction, the Y direction, and the rotation direction) with respect to the substrate support unit 22 and the mask support unit 23. And / or rotate. In this embodiment, the relative position between the substrate W and the mask M is adjusted by adjusting the position of the electrostatic chuck 24 in the XYθ direction while the substrate W is adsorbed. However, the position adjusting mechanism 29 is not the electrostatic chuck 24 or the electrostatic chuck actuator 28, but the substrate support unit 22 or the substrate support unit actuator 26 and the mask support unit 23 or the mask support unit actuator 27 with respect to the electrostatic chuck 24. It may be configured to move relatively in the XYθ direction.

On the outer upper surface of the vacuum container 21, an alignment camera 31 for photographing the alignment marks formed on the substrate W and the mask M is installed through the transparent window provided on the upper surface of the vacuum container 21. The alignment camera 31 is provided at a position corresponding to the alignment mark formed on the substrate W and the mask M. For example, the alignment camera 31 may be installed at least at least two diagonal corners or all four corners among the four rectangular corners on the circular substrate W.

The film forming apparatus 11 further includes an illumination light source that illuminates the alignment mark when the alignment mark is photographed by the alignment camera 31. Since the inside of the vacuum container 21 is dark, a clearer image can be obtained by illuminating the alignment mark with a light source. For this reason, the light source is preferably, but not limited to, coaxial illumination. The light source may be installed on the outer upper side of the vacuum vessel 21 and illuminate the alignment mark from above, or may be installed inside the vacuum vessel 21 so as to illuminate the alignment mark from below.

The film forming apparatus 11 includes a control unit 33. The control unit 33 has functions such as transfer and alignment of the substrate W / mask M, control of the evaporation source 25, and control of film formation operation.

The control unit 33 can be configured by, for example, a computer having a processor, memory, storage, I / O, and the like. In this case, the function of the control unit 33 is realized by the processor executing the program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logical controller) may be used. Alternatively, a part or all of the functions of the control unit may be configured by a circuit such as an ASIC or FPGA. Further, a control unit may be installed for each film forming apparatus, or one control unit may be configured to control a plurality of film forming apparatus.

<Cooling means and magnetic force applying means>
3 and 4 are cross-sectional views and plan views schematically showing the configuration and arrangement structure of the cooling means 30 and the magnetic force applying means 32 in the film forming measure 11 according to the embodiment of the present invention.

The cooling means 30 has a cooling pipe 30a through which the refrigerant flows, and a cooling plate 30b (second plate member) for increasing the contact area between the electrostatic chuck 24 as the object to be cooled or the substrate W, and the electrostatic chuck 30. It is arranged on the opposite side of the substrate suction surface 24a (substrate holding surface) of the 24.

The refrigerant flows in from the inlet (IN) of the cooling pipe 30a and flows out from the outlet (OUT). In FIG. 4, the positions of the inlet (IN) and the outlet (OUT) of the cooling pipe 30a are exemplary. By flowing the refrigerant through the cooling pipe 30a, the electrostatic chuck 24 below the electrostatic chuck 24 and the substrate W adsorbed on the electrostatic chuck 24 can be cooled.

In the cooling means 30 of the film forming apparatus 11 according to the embodiment of the present invention, the shape of the cooling pipe 30a is linear. Here, the linear shape means that the cooling pipes 30a are connected by one path from the inlet (IN) to the outlet (OUT) without being separated in the middle. Since the cooling pipe 30a is linear, the flow of the refrigerant flowing through the cooling pipe 30a is not stagnant, and effective cooling is possible.

Specifically, the cooling pipe 30a of the cooling means 30 can be provided in various shapes so as to effectively cool the electrostatic chuck 24 and the substrate W. For example, as shown in FIG. 4A, the cooling pipe 30a may be configured in a spiral shape, or may be configured in a zigzag shape as shown in FIG. 4B. According to this configuration, since the flow of the refrigerant exists over the entire plane of the cooling means 30 facing the electrostatic chuck 24, the entire electrostatic chuck 24 and the substrate (W) can be cooled.

As described above, the magnetic force applying means 32 includes a yoke plate (first plate member) 32b and a plurality of magnets 32a provided on the first plate member 32b to generate magnetic force. The magnetic force applying means 32 is also arranged on the opposite side of the substrate suction surface 24a of the electrostatic chuck 24, like the cooling means 30. The magnetic force generated by the magnet 32a can attract the mask M toward the electrostatic chuck 24 and bring it into close contact with the substrate W.

According to one aspect of the present embodiment, the cooling pipe 30a of the cooling means 30 is installed on the surface facing the electrostatic chuck 24 with respect to the first plate member 32b of the magnetic force applying means 32. The cooling tube 30a is located in substantially the same region as the magnet 32a in the direction perpendicular to the substrate suction surface 24a of the electrostatic chuck 24. That is, the magnetic force applying means 32 and the cooling means 30 are arranged so as to overlap each other in the crossing direction intersecting the substrate suction surface 24a. In particular, in one aspect of the present embodiment, the magnet 32a and the cooling pipe 30a are arranged so as to overlap each other in the crossing direction. The magnet 32a has a cooling tube 30a in a direction away from the substrate suction surface 24a.
Since it is provided at the same position as the magnet 32a, the distance of the magnet 32a from the substrate suction surface 24a (or the mask M) is not affected by the presence of the cooling pipe 30a. According to this configuration, the distance between the magnet 32a and the mask M can be shortened, and the magnitude of the magnetic force (attractive force) acting on the mask M by the magnet 32a is not weakened.

As shown in FIG. 4, at least a part of the magnet 32a is arranged in a region between adjacent cooling pipes 30a in a plane parallel to the substrate suction surface 24a. As a result, the cooling tubes 30a and the magnets 32a are alternately arranged in the plane parallel to the substrate suction surface 24a, as shown in FIG.

According to one aspect of the present embodiment, the magnet 32a is installed on the surface of the first plate member 32b facing the electrostatic chuck 24 together with the cooling pipe 30a, but the present invention is not limited thereto. For example, the magnet 32a may be provided on the first plate member 32b, and the cooling pipe 30a may be attached to the surface of the second plate member 30b opposite to the surface facing the electrostatic chuck 32.

In the film forming apparatus of the present invention, since the magnetic force applying means and the cooling means are located in the same region in the direction perpendicular to the substrate suction surface of the electrostatic chuck 24, the magnetic force applying means is used while cooling the substrate by the cooling means. It is possible to suppress a decrease in the magnetic force acting on the mask.

<Manufacturing method of electronic devices>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the electronic device.

First, the organic EL display device to be manufactured will be described. FIG. 5A shows an overall view of the organic EL display device 60, and FIG. 5B shows a cross-sectional structure of one pixel.

As shown in FIG. 5A, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix in the display area 61 of the organic EL display device 60. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The pixel referred to here refers to the smallest unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to this embodiment, the pixel 62 is composed of a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B, which emit light different from each other. The pixel 62 may be composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, or may be composed of a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and may be composed of at least one color. If so, it is not particularly limited.

5 (b) is a schematic partial cross-sectional view taken along the line AB of FIG. 5 (a). The pixel 62 has an organic EL element having an anode 64, a hole transport layer 65, any of the light emitting layers 66R, 66G, 66B, an electron transport layer 67, and a cathode 68 on the substrate 63. There is. Of these, the hole transport layer 65, the light emitting layer 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to a light emitting element (sometimes referred to as an organic EL element) that emits red, green, and blue, respectively. Further, the anode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the anode 64 in order to prevent the anode 64 and the cathode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In FIG. 5B, the hole transport layer 65 and the electron transport layer 67 are shown as one layer, but they are formed of a plurality of layers including the hole block layer and the electron block layer due to the structure of the organic EL display element. May be done. Further, between the anode 64 and the hole transport layer 65, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 into the hole transport layer 65 is provided. It can also be formed. Similarly, an electron injection layer can be formed between the cathode 68 and the electron transport layer 67.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a circuit board (not shown) for driving the organic EL display device and a substrate 63 on which the anode 64 is formed are prepared.

Acrylic resin is formed by spin coating on the substrate 63 on which the anode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the anode 64 is formed to form an insulating layer 69. .. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 in which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, the substrate is held by an electrostatic chuck, and the hole transport layer 65 is a common layer on the anode 64 in the display region. To form a film. The hole transport layer 65 is formed by vacuum deposition. In reality, the hole transport layer 65 is formed in a size larger than that of the display region 61, so that a high-definition mask is unnecessary.

Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second organic material film forming apparatus and held by an electrostatic chuck. After aligning the substrate and the mask and adsorbing the mask on the electrostatic chuck 24 via the substrate, a light emitting layer 66R that emits red color is formed.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G that emits green is formed by the third organic material film forming apparatus, and the light emitting layer 66B that emits blue is further formed by the fourth organic material forming apparatus. .. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the light emitting layers 66R, 66G, and 66B of three colors.

The substrate formed up to the electron transport layer 67 is moved by a metallic vapor deposition material film forming apparatus to form a cathode 68.

From the time when the substrate 63 in which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when the substrate 63 is exposed to an atmosphere containing moisture or oxygen, a light emitting layer made of an organic EL material is formed. It may be deteriorated by moisture and oxygen. Therefore, in this example, the loading and unloading of the substrate between the film forming apparatus is performed in a vacuum atmosphere or an inert gas atmosphere.

The embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment and may be appropriately modified within the scope of the technical idea.

22: Board support unit, 23: Mask support unit, 24: Electrostatic chuck, 29: Position adjustment mechanism, 30: Cooling means, 30a: Cooling tube, 31: Alignment camera, 32: Magnetic force applying means, 32a: Magnet

Claims (6)

An electrostatic chuck with a substrate holding surface that holds the substrate,
A mask support unit installed on the substrate holding surface side for holding the mask, and
A magnetic force applying means for applying a magnetic force to the mask, which is installed on the opposite side of the substrate holding surface with respect to the electrostatic chuck, and
In a film forming apparatus which is installed on the opposite side of the substrate holding surface with respect to the electrostatic chuck, has a cooling means for cooling the substrate, and forms a thin-film deposition material on the substrate via a mask.
The magnetic force applying means has a first plate member and a magnet installed on a surface of the first plate member facing the electrostatic chuck.
The cooling means includes a second plate member arranged between the first plate member and the electrostatic chuck, and a cooling pipe installed on a surface of the second plate member facing the first plate member. And have
A film forming apparatus, characterized in that at least a part of the magnet is arranged between two adjacent portions of the cooling tube in a plane parallel to the substrate holding surface . The film forming apparatus according to claim 1 , wherein the magnet and the cooling tube are alternately arranged in a plane parallel to the substrate holding surface. The film forming apparatus according to claim 1 , wherein the cooling pipe is arranged in a spiral shape. The film forming apparatus according to claim 1 , wherein the cooling pipes are arranged in a zigzag shape. The film forming apparatus according to claim 1 , wherein the cooling tube is linear. A method for manufacturing an electronic device, which comprises manufacturing an electronic device by using the film forming apparatus according to any one of claims 1 to 5 .

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