CN205420529U - Evaporating plating device - Google Patents
Evaporating plating device Download PDFInfo
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- CN205420529U CN205420529U CN201620208282.9U CN201620208282U CN205420529U CN 205420529 U CN205420529 U CN 205420529U CN 201620208282 U CN201620208282 U CN 201620208282U CN 205420529 U CN205420529 U CN 205420529U
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Abstract
The utility model discloses an evaporating plating device relates to the evaporation coating technique field, for solving because of the base plate problem that the position accuracy that leads to the pattern of coating by vaporization on the base plate reduces that takes place to collapse. Evaporating plating device includes the vacuum deposition room, indoor coating by vaporization source unit, base plate carrier and the cooling plate of being provided with of vacuum deposition, and wherein, the base plate carrier is located the top of coating by vaporization source unit, treats the coating by vaporization base plate and install at the base plate carrier that the cooling plate is located the top of treating the coating by vaporization base plate, it settles the hole to be provided with in the cooling plate to adsorb, adsorb to settle downthehole being provided with and treat the coating by vaporization base plate and carry out absorbent absorptions, adsorb the piece and can treat the coating by vaporization base plate mutually and reciprocate. Evaporating plating device treats the coating by vaporization base plate through adsorbing an absorption, makes to treat coating by vaporization base plate and cooling plate contact to the messenger treats that the coating by vaporization base plate keeps leveling, reduces to treat the degree of collapsing of coating by vaporization base plate, improves the position accuracy of the pattern of coating by vaporization on treating the coating by vaporization base plate.
Description
Technical field
This utility model relates to evaporation coating technique field, particularly relates to a kind of evaporation coating device.
Background technology
Vacuum evaporatation (abbreviation vacuum vapour deposition) is to be heated deposition material by vapor deposition source in vacuum evaporation room, the atom or the molecule that make deposition material form steam stream from the gasification effusion of its surface, incide substrate surface to be deposited, condense the method forming solid film.Vacuum vapour deposition has been widely used for the negative electrode of the manufacturing process of display device, such as OLED display panel, anode and the luminous material layer between negative electrode and anode.
Existing evaporation coating device generally includes vacuum evaporation room, vacuum evaporation indoor are provided with deposition source unit, mask plate carrier, base board carrier and coldplate, substrate to be deposited is arranged on base board carrier, mask plate is arranged on mask plate carrier, and mask plate, substrate to be deposited and coldplate are sequentially laminated on the top of deposition source unit.When substrate to be deposited is deposited with; substrate to be deposited is mounted generally horizontally on base board carrier; owing to the area of substrate to be deposited is relatively big and thinner thickness; substrate to be deposited would generally cave in; thus result in the para-position between substrate to be deposited and mask plate to be forbidden, cause the positional precision of evaporation pattern on substrate to be deposited to reduce.
Utility model content
The purpose of this utility model is to provide a kind of evaporation coating device, for solving the technical problem causing the positional precision of evaporation pattern on substrate to be deposited to reduce because substrate to be deposited caves in.
To achieve these goals, the following technical scheme of this utility model offer:
A kind of evaporation coating device, including vacuum evaporation room, described vacuum evaporation indoor are provided with deposition source unit, base board carrier and coldplate, wherein, described base board carrier is positioned at the top of described deposition source unit, substrate to be deposited is arranged on described base board carrier, and described coldplate is positioned at the top of described substrate to be deposited；Being provided with absorption placement hole in described coldplate, be provided with the adsorption piece adsorbing described substrate to be deposited in described absorption placement hole, described adsorption piece can move up and down by the most described substrate to be deposited.
When substrate to be deposited is deposited with by the evaporation coating device using this utility model to provide, after substrate to be deposited is arranged on base board carrier, adsorption piece is made to move down, i.e. adsorption piece moves towards substrate to be deposited, adsorption piece contacts with substrate to be deposited, and adsorb substrate to be deposited, now make adsorption piece stop moving down；Then adsorption piece is made to move up, i.e. adsorption piece substrate the most to be deposited moves, so that substrate to be deposited contacts with coldplate, and makes substrate to be deposited keep smooth, reduce the degree of caving in of substrate to be deposited, and then improve the positional precision of evaporation pattern on substrate to be deposited.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing being further appreciated by of the present utility model, constitutes a part of the present utility model, and schematic description and description of the present utility model is used for explaining this utility model, is not intended that improper restriction of the present utility model.In the accompanying drawings:
The structural representation of the evaporation coating device that Fig. 1 provides for this utility model embodiment；
Fig. 2 is structural representation during adsorption piece absorption substrate to be deposited in Fig. 1；
Fig. 3 is the structural representation during absorption that in Fig. 1, adsorption piece completes to substrate to be deposited；
Fig. 4 is the structural representation of adsorption piece in Fig. 1；
Structural representation when Fig. 5 is that in Fig. 1, substrate to be deposited separates with adsorption piece.
Reference:
10-deposition source unit, 20-base board carrier,
21-substrate to be deposited, 30-coldplate,
31-adsorbs placement hole, 32-adsorption piece,
32a-adsorbate, 32b-physical absorption face,
32c-support column, 33-range sensor,
34-fore-set placement hole, 35-fore-set,
40-mask plate, 50-is close to unit,
60-vacuum evaporation room.
Detailed description of the invention
In order to further illustrate the evaporation coating device that this utility model embodiment provides, it is described in detail below in conjunction with Figure of description.
Refer to Fig. 1, the evaporation coating device that this utility model embodiment provides includes vacuum evaporation room 60, deposition source unit 10, base board carrier 20 and coldplate 30 it is provided with in vacuum evaporation room 60, wherein, base board carrier 20 is positioned at the top of deposition source unit 10, substrate 21 to be deposited is arranged on base board carrier 20, and coldplate 30 is positioned at the top of substrate 21 to be deposited；Being provided with absorption placement hole 31 in coldplate 30, be provided with, in absorption placement hole 31, the adsorption piece 32 adsorbing substrate 21 to be deposited, adsorption piece 32 can move up and down by substrate 21 the most to be deposited.
For example, refer to Fig. 1, the evaporation coating device that this utility model embodiment provides includes main body and is positioned at the vacuum evaporation room 60 of main body, in Fig. 1, the bottom of vacuum evaporation room 60 is provided with deposition source unit 10, the opening of the nozzle of deposition source unit 10 is upward, deposition source unit 10 be provided above mask plate carrier, base board carrier 20 and coldplate 30, mask plate carrier is used for fixing mask plate 40, base board carrier 20 is used for fixing substrate 21 to be deposited, mask plate 40, substrate 21 to be deposited and coldplate 30 are successively set on the top of deposition source unit 10 from the bottom to top, the lower surface of substrate 21 to be deposited is evaporation face, the lower surface of substrate 21 to be deposited can be close to mask plate 40, the upper surface of substrate 21 to be deposited can contact with coldplate 30；Absorption placement hole 31 it is provided with in coldplate 30, the one end open of absorption placement hole 31 is positioned on coldplate 30 surface towards substrate 21 to be deposited, the i.e. one end open of absorption placement hole 31 is positioned in Fig. 1 on the lower surface of coldplate 30, it is provided with adsorption piece 32 in absorption placement hole 31, adsorption piece 32 can move towards substrate 21 to be deposited and substrate 21 the most to be deposited moves, i.e. adsorption piece 32 can move by above-below direction along Fig. 1, to adsorb substrate 21 to be deposited.
When the evaporation coating device using above-described embodiment to provide, first substrate 21 to be deposited can be arranged on base board carrier 20, refer to Fig. 2, then adsorption piece 32 is made to move down, adsorption piece 32 contacts with substrate 21 to be deposited, and adsorbs substrate 21 to be deposited, now makes adsorption piece 32 stop moving down；Refer to Fig. 3, then make adsorption piece 32 move up, drive the middle part of substrate 21 to be deposited to move up, so that substrate to be deposited 21 contacts with coldplate 30, and make substrate 21 to be deposited keep smooth；Then mask plate 40 is fixed on mask plate carrier, and makes the evaporation face laminating of mask plate 40 and substrate 21 to be deposited；Then containing vacuum deposited chamber 60, to vacuum evaporation room 60 extracting vacuum, keeps vacuum environment in making vacuum evaporation room 60；It is then turned on deposition source unit 10, is deposited with the evaporation face to substrate 21 to be deposited.
From the above, when the evaporation face of substrate 21 to be deposited is deposited with by the evaporation coating device using this utility model embodiment to provide, after substrate 21 to be deposited is arranged on base board carrier 20, adsorption piece 32 is made to move down, adsorption piece 32 is namely made to move towards substrate 21 to be deposited, adsorption piece 32 contacts with substrate 21 to be deposited, and adsorbs substrate 21 to be deposited, now makes adsorption piece 32 stop moving down；Then adsorption piece 32 is made to move up, adsorption piece 32 substrate the most to be deposited 21 is namely made to move, so that substrate 21 to be deposited contacts with coldplate 30, and make substrate 21 to be deposited keep smooth, reduce the degree of caving in of substrate 21 to be deposited, and then improve the positional precision of evaporation pattern on substrate 21 to be deposited.
In the above-described embodiments, when utilizing adsorption piece 32 to adsorb substrate 21 to be deposited, various ways can be used, such as, adsorption piece 32 can be connected with vacuum withdraw device, when utilizing adsorption piece 32 that substrate 21 to be deposited is adsorbed, then open vacuum withdraw device, make to keep between adsorption piece 32 and substrate to be deposited 21 vacuum, it is achieved the adsorption piece 32 absorption to substrate 21 to be deposited.
In this utility model embodiment, the mode of physical absorption is used to make adsorption piece 32 adsorb substrate 21 to be deposited.Referring to Fig. 1 and Fig. 4, adsorption piece 32 includes trapezoidal structure of adsorbate 32a and support column 32c, adsorbate 32a, and the large end face of adsorbate 32a is physical absorption face 32b；Support column 32c is connected with absorption driving means, and absorption driving means drives adsorption piece substrate the most to be deposited 21 to move up and down.When deployed, after substrate 21 to be deposited is arranged on base board carrier 20, start absorption driving means, support column 32c is driven by absorption driving means, to drive adsorbate 32a to move towards substrate 21 to be deposited, after the physical absorption face 32b of adsorption piece 32 contacts with substrate 21 to be deposited, stop making adsorption piece 32 move towards substrate 21 to be deposited, such as close absorption driving means, now, physical absorption face 32b contacts with substrate 21 to be deposited, produces physical absorption, i.e. adsorption piece 32 and adsorb substrate 21 to be deposited between physical absorption face 32b and substrate to be deposited 21；Then make adsorption piece 32 substrate the most to be deposited 21 move by absorption driving means, drive the middle part of substrate 21 to be deposited to move, so that substrate to be deposited 21 contacts with coldplate 30, and make substrate 21 to be deposited keep smooth.
In above-described embodiment, the mode using physical absorption makes adsorption piece 32 adsorb substrate 21 to be deposited, i.e. produce physical absorption between physical absorption face 32b and substrate to be deposited 21, in order to improve the absorption reliability between physical absorption face 32b and substrate to be deposited 21, the surface roughness of physical absorption face 32b is preferably 5 μm～10 μm.It is so designed that, owing to physical absorption face 32b has certain surface roughness, when physical absorption face 32b contacts with substrate 21 to be deposited, the absorption affinity between physical absorption face 32b and substrate to be deposited 21 can be increased, and then improve the absorption reliability between physical absorption face 32b and substrate to be deposited 21, prevent from causing the absorption reliability between physical absorption face 32b and substrate to be deposited 21 to reduce because the surface roughness of physical absorption face 32b is relatively low, it is also prevented from causing physical absorption face 32b to scratch substrate 21 to be deposited because the surface roughness of physical absorption face 32b is higher simultaneously.
In above-described embodiment, the absorption placement hole 31 in coldplate 30 can be one, it is also possible to for multiple, the quantity of adsorption piece 32 can also be set according to actual needs, such as, coldplate 30 arranges an absorption placement hole 31, and an adsorption piece 32 is set in this absorption placement hole 31；Or, coldplate 30 arranges two or more absorption placement hole 31, and an adsorption piece 32 is set in each absorption placement hole 31.
In this utility model embodiment, please continue to refer to Fig. 1, the quantity of absorption placement hole 31 is multiple, and multiple absorption placement holes 31 are evenly distributed in coldplate 30, and are provided with an adsorption piece 32 in each absorption placement hole 31.It is so designed that, when utilizing adsorption piece 32 that substrate 21 to be deposited is adsorbed, the regional of substrate 21 to be deposited all can be by the absorption affinity of corresponding adsorption piece 32, thus the regional stress of substrate 21 to be deposited is more uniform, prevents the regional unbalance stress of substrate 21 to be deposited from causing the deformation of substrate 21 to be deposited.Additionally, when utilizing adsorption piece 32 that substrate 21 to be deposited is adsorbed, owing to the regional of substrate 21 to be deposited all by the absorption affinity of corresponding adsorption piece 32, thus can improve the flatness of substrate 21 to be deposited, reduce the degree of caving in of substrate 21 to be deposited further.
After substrate 21 to be deposited is fixed on base board carrier 20, the middle part of substrate 21 to be deposited is because being caved in by gravity, thus when utilizing adsorption piece 32 that substrate 21 to be deposited is adsorbed, required for the adsorption piece 32 that the regional of substrate 21 to be deposited is corresponding, the distance of movement is different, therefore, in order to regulate the displacement of each adsorption piece 32, to improve the uniform force of the regional of substrate 21 to be deposited, refer to Fig. 4, the range sensor 33 of the initial distance being provided with on each adsorption piece 32 between adsorption piece 32 and the substrate to be deposited 21 that detection is corresponding, range sensor 33 is connected with the controller of evaporation coating device.After substrate 21 to be deposited is arranged on base board carrier 20, initial distance between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 that range sensor 33 then detects correspondence, and send the initial distance between physical absorption face 32b and the substrate to be deposited 21 of corresponding adsorption piece 32 to controller, initial distance between physical absorption face 32b and the substrate 21 to be deposited of the corresponding adsorption piece 32 that controller is then detected according to range sensor 33 obtains the displacement of corresponding adsorption piece 32, and the instruction that the adsorption piece 32 making the driving of absorption driving means corresponding moves is sent to absorption driving means.
nullSuch as，As shown in Figure 1，Range sensor 33 on the adsorption piece 32 in left side detects that the initial distance between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 in left side is 3cm，The middle range sensor 33 on adsorption piece 32 detects that the initial distance between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 of centre is 4cm，Range sensor 33 on the adsorption piece 32 on right side detects that the initial distance between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 on right side is 3cm，I.e. when making adsorption piece 32 move towards substrate 21 to be deposited and making adsorption piece 32 substrate the most to be deposited 21 move，The displacement when adsorption piece 32 in left side moves down is 3cm with displacement when moving up，Displacement when middle adsorption piece 32 moves down is 4cm with displacement when moving up，The displacement when adsorption piece 32 on right side moves down is 3cm with displacement when moving up，Corresponding range information is passed to controller by range sensor 33，Controller then controls to adsorb driving means，Corresponding adsorption piece 32 is driven to move down and move up.
It is so designed that, after substrate 21 to be deposited is arranged on base board carrier 20, initial distance between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 that range sensor 33 detects correspondence, to determine the displacement when adsorption piece 32 of correspondence moves down, after making adsorption piece 32 move down, each adsorption piece 32 all contacts with substrate 21 to be deposited, and substrate 21 to be deposited will not be produced downward pressure, causes substrate 21 to be deposited to deform to prevent substrate 21 stress to be deposited too big.Additionally, after substrate 21 to be deposited is arranged on base board carrier 20, initial distance between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 that range sensor 33 detects correspondence, to determine the displacement when adsorption piece 32 of correspondence moves up, i.e. when adsorption piece 32 substrate the most to be deposited 21 moves, the result detected according to range sensor 33, adjust displacement when corresponding adsorption piece 32 substrate the most to be deposited 21 moves, so that substrate 21 to be deposited keeps smooth, improve the planarization of substrate 21 to be deposited.
In the above-described embodiments, initial distance between the physical absorption face 32b and the substrate to be deposited 21 that regulate the adsorption piece 32 detecting correspondence according to range sensor 33 of the displacement of adsorption piece 32 is carried out, in actual applications, it is also possible to regulated the movement of adsorption piece 32 by the pressure between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 of pressure transducer detection correspondence.When being embodied as, each adsorption piece 32 being provided with the force pressure sensor between adsorption piece 32 and the substrate to be deposited 21 that detection is corresponding, pressure transducer is connected with the controller of evaporation coating device.nullAfter substrate 21 to be deposited is arranged on base board carrier 20，Adsorption piece 32 is made to move towards substrate 21 to be deposited，Pressure between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 that pressure transducer then detects correspondence，And the pressure information between physical absorption face 32b and the substrate to be deposited 21 of corresponding adsorption piece 32 is transferred to controller，When controller confirms that the pressure learning between physical absorption face 32b and the substrate to be deposited 21 of the adsorption piece 32 of correspondence reaches preset pressure，The adsorption piece 32 making correspondence stops moving towards substrate 21 to be deposited，After all of adsorption piece 32 stops moving towards substrate 21 to be deposited，After the most all of adsorption piece 32 contacts with substrate 21 to be deposited and adsorbs substrate 21 to be deposited，Adsorption piece 32 substrate the most to be deposited 21 is made to move，So that substrate 21 to be deposited contacts with coldplate 30，And make substrate 21 to be deposited keep smooth.
In the above-described embodiments, after completing the evaporation to substrate 21 to be deposited, can adopt and manually make substrate 21 to be deposited separate with adsorption piece 32, it would however also be possible to employ mode makes substrate 21 to be deposited separate with adsorption piece 32 automatically.In the present embodiment, referring to Fig. 1 and Fig. 5, be additionally provided with fore-set placement hole 34 in coldplate 30, be provided with fore-set 35 in fore-set placement hole 34, fore-set 35 can move up and down by substrate 21 the most to be deposited.Refer to Fig. 5, after completing the evaporation to substrate 21 to be deposited, base board carrier 20 is made to drive substrate 21 to be deposited to move down, make fore-set 35 move down simultaneously, fore-set 35 contacts with substrate 21 to be deposited, and substrate 21 to be deposited is produced downward thrust, so that substrate to be deposited 21 separates with adsorption piece 32, then substrate 21 to be deposited is taken off from base board carrier 20, and make fore-set 35 keep in the center.
In above-described embodiment, the quantity of fore-set placement hole 34 and fore-set 35 can be set according to demand, for example, it is possible to arrange a fore-set placement hole 34 in coldplate 30, and arranges a fore-set 35 in this fore-set placement hole 34；Or, two or more fore-set placement hole 34 can be set in coldplate 30, and a fore-set 35 is set in each fore-set placement hole 34.
In the present embodiment, please continue to refer to Fig. 1, the quantity of fore-set placement hole 34 is multiple, and multiple fore-set placement holes 34 are evenly distributed in coldplate 30, and is provided with a fore-set 35 in each fore-set placement hole 34.It is so designed that, when utilizing fore-set 35 to make substrate 21 to be deposited separate with adsorption piece 32, the regional uniform force of substrate 21 to be deposited can be made, prevent substrate 21 unbalance stress to be deposited from causing substrate 21 to be deposited to deform.
Please continue to refer to Fig. 1, in the present embodiment, mask plate carrier it is additionally provided with in vacuum evaporation room 60, the mask plate 40 being arranged on mask plate carrier, between substrate 21 to be deposited and deposition source unit 10, is additionally provided with in vacuum evaporation room 60 and makes mask plate 40 be close to unit 50 with substrate 21 to be deposited is close to.When substrate 21 to be deposited is deposited with, mask plate 40 is arranged on the evaporation face of substrate 21 to be deposited, and be close to the evaporation face of substrate 21 to be deposited, vapor deposition source is evaporated on the evaporation face of substrate 21 to be deposited by the nozzle of deposition source unit 10, and forms the pattern matched with mask plate 40 on the evaporation face of evaporation substrate 21.It is close to the setting of unit 50, makes mask plate 40 be close to substrate 21 to be deposited, be possible to prevent between mask plate 40 and substrate to be deposited 21 to have bigger space, thus improve the positional precision of evaporation pattern on substrate 21 to be deposited further.
In the present embodiment, mask plate 40 can use metal mask version, is close to unit 50 and can include Magnet, and Magnet is positioned at the top of coldplate 30.After metal mask version being arranged on mask plate carrier, the Magnet being close in unit 50 produces gravitation to metal mask version, so that metal mask version is close to substrate 21 to be deposited, thus improves the positional precision of evaporation pattern on substrate 21 to be deposited further.
In the description of above-mentioned embodiment, specific features, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
The above; it is only detailed description of the invention of the present utility model; but protection domain of the present utility model is not limited thereto; any those familiar with the art is in the technical scope that this utility model discloses; change can be readily occurred in or replace, all should contain within protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with described scope of the claims.
Claims (10)
1. an evaporation coating device, including vacuum evaporation room, described vacuum evaporation indoor are provided with deposition source unit, base board carrier and coldplate, wherein, described base board carrier is positioned at the top of described deposition source unit, substrate to be deposited is arranged on described base board carrier, and described coldplate is positioned at the top of described substrate to be deposited；It is characterized in that, being provided with absorption placement hole in described coldplate, be provided with the adsorption piece adsorbing described substrate to be deposited in described absorption placement hole, described adsorption piece can move up and down by the most described substrate to be deposited.
Evaporation coating device the most according to claim 1, it is characterised in that described adsorption piece includes adsorbate and support column, trapezoidal structure of described adsorbate, and the large end face of described adsorbate is physical absorption face；Described support column is connected with absorption driving means, and described absorption driving means drives the most described substrate to be deposited of described adsorption piece to move up and down.
Evaporation coating device the most according to claim 2, it is characterised in that the surface roughness in described physical absorption face is 5 μm～10 μm.
Evaporation coating device the most according to claim 1, it is characterised in that the quantity of described absorption placement hole is multiple, multiple described absorption placement holes are evenly distributed in described coldplate, and are provided with a described adsorption piece in each described absorption placement hole.
Evaporation coating device the most according to claim 4, it is characterised in that the range sensor of the initial distance being provided with on each described adsorption piece between described adsorption piece and the described substrate to be deposited that detection is corresponding.
Evaporation coating device the most according to claim 4, it is characterised in that the pressure transducer of the pressure being provided with on each described adsorption piece between described adsorption piece and the described substrate to be deposited that detection is corresponding.
7. according to the arbitrary described evaporation coating device of claim 1-6, it is characterised in that being additionally provided with fore-set placement hole in described coldplate, be provided with fore-set in described fore-set placement hole, described fore-set can move up and down by the most described substrate to be deposited.
Evaporation coating device the most according to claim 7, it is characterised in that the quantity of described fore-set placement hole is multiple, multiple described fore-set placement holes are evenly distributed in described coldplate, and are provided with a described fore-set in each described fore-set placement hole.
Evaporation coating device the most according to claim 1, it is characterized in that, described vacuum evaporation indoor are additionally provided with mask plate carrier, the mask plate being arranged on described mask plate carrier is between described substrate to be deposited and described deposition source unit, and described vacuum evaporation indoor are additionally provided with and make described mask plate be close to unit with described substrate to be deposited is close to.
Evaporation coating device the most according to claim 9, it is characterised in that described mask plate is metal mask version, described in be close to unit and include that Magnet, described Magnet are positioned at the top of described coldplate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620208282.9U CN205420529U (en) | 2016-03-16 | 2016-03-16 | Evaporating plating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620208282.9U CN205420529U (en) | 2016-03-16 | 2016-03-16 | Evaporating plating device |
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| CN205420529U true CN205420529U (en) | 2016-08-03 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106637073A (en) * | 2016-10-14 | 2017-05-10 | 深圳市华星光电技术有限公司 | Vacuum evaporation device |
| CN106756806A (en) * | 2016-12-29 | 2017-05-31 | 长春海谱润斯科技有限公司 | A kind of evaporation coating device and organic EL display panel evaporation coating method |
| CN107043908A (en) * | 2017-04-24 | 2017-08-15 | 昆山国显光电有限公司 | The control method of handling device and handling device |
| CN107365972A (en) * | 2017-09-07 | 2017-11-21 | 京东方科技集团股份有限公司 | Substrate supporting assembly, film-forming apparatus and method |
| CN108950484A (en) * | 2018-07-06 | 2018-12-07 | 武汉华星光电半导体显示技术有限公司 | Evaporation coating device |
| CN109972084A (en) * | 2017-12-27 | 2019-07-05 | 佳能特机株式会社 | The manufacturing method of film formation device, film build method and electronic equipment |
| CN114807842A (en) * | 2022-04-02 | 2022-07-29 | 深圳市华星光电半导体显示技术有限公司 | Vacuum evaporation device and preparation method of display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106637073A (en) * | 2016-10-14 | 2017-05-10 | 深圳市华星光电技术有限公司 | Vacuum evaporation device |
| WO2018068389A1 (en) * | 2016-10-14 | 2018-04-19 | 深圳市华星光电技术有限公司 | Vacuum evaporation apparatus |
| CN106756806A (en) * | 2016-12-29 | 2017-05-31 | 长春海谱润斯科技有限公司 | A kind of evaporation coating device and organic EL display panel evaporation coating method |
| CN107043908A (en) * | 2017-04-24 | 2017-08-15 | 昆山国显光电有限公司 | The control method of handling device and handling device |
| CN107365972A (en) * | 2017-09-07 | 2017-11-21 | 京东方科技集团股份有限公司 | Substrate supporting assembly, film-forming apparatus and method |
| WO2019047856A1 (en) * | 2017-09-07 | 2019-03-14 | 京东方科技集团股份有限公司 | Base support component, film forming device and method |
| CN107365972B (en) * | 2017-09-07 | 2022-06-28 | 京东方科技集团股份有限公司 | Substrate support assembly, film forming apparatus and method |
| CN109972084A (en) * | 2017-12-27 | 2019-07-05 | 佳能特机株式会社 | The manufacturing method of film formation device, film build method and electronic equipment |
| CN108950484A (en) * | 2018-07-06 | 2018-12-07 | 武汉华星光电半导体显示技术有限公司 | Evaporation coating device |
| CN108950484B (en) * | 2018-07-06 | 2020-06-30 | 武汉华星光电半导体显示技术有限公司 | Evaporation plating device |
| CN114807842A (en) * | 2022-04-02 | 2022-07-29 | 深圳市华星光电半导体显示技术有限公司 | Vacuum evaporation device and preparation method of display panel |
| CN114807842B (en) * | 2022-04-02 | 2024-02-27 | 深圳市华星光电半导体显示技术有限公司 | Vacuum evaporation device and preparation method of display panel |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |