CN107365972A - Substrate supporting assembly, film-forming apparatus and method - Google Patents
Substrate supporting assembly, film-forming apparatus and method Download PDFInfo
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- CN107365972A CN107365972A CN201710800465.9A CN201710800465A CN107365972A CN 107365972 A CN107365972 A CN 107365972A CN 201710800465 A CN201710800465 A CN 201710800465A CN 107365972 A CN107365972 A CN 107365972A
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- substrate
- movable block
- working face
- supporting assembly
- film
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of substrate supporting assembly, film-forming apparatus and method, belong to film technique field, its can at least partly solve existing coldplate be sticked the copper tape technology tangent line time it is long, it is dangerous it is big, easily cause bonding die or fragment, thickness to adjust inflexible problem.The substrate supporting assembly of the present invention includes being used for the support plate that substrate is supported in film-forming process, support plate, which has, to be used for towards based working face, and, there are multiple spaced openings on the working face of the support plate, movable block and driver are provided with each opening, the driver is used to drive movable block to lift relative to working face, so that the top surface of the movable block can move between flushing and protruding from the position of working face with working face.
Description
Technical field
The invention belongs to film technique field, and in particular to a kind of substrate supporting assembly, film-forming apparatus and method.
Background technology
As shown in figure 1, in evaporated device, substrate 5 to be filmed can be located at outside the working face of coldplate 9 (because gravity is made
Under, actually there is gap between substrate 5 and working face).And the opposite side of substrate 5 and the mask plate for having pierced pattern (not shown)
6 (Mask) are contacted, and evaporation gas corresponds to the film layer of figure by being formed on substrate 5 after pierced pattern caused by evaporation source.By
There is wavy fold in itself in mask plate 6, therefore its portion is bonded bad (gap being present) with substrate 5, from these positions
It can be spread to make into figure inaccuracy by the evaporation gas of pierced pattern, cause strip colour mixture, edge colour mixture etc..Therefore,
Existing way is the copper adhesive tape 99 that is sticked on coldplate 9, so as to adjust the flatness of coldplate 9, by the relevant position of substrate 5
" jack-up ", it is set to be in close contact with mask plate 6.But at least there is problems with this mode：
First, the fold situation of different mask plates 6 is different, and corresponding copper adhesive tape 99 is not sticked mode (position, the number of plies) also not
Together, therefore when changing mask plate 6 every time vacuum breaker and evaporated device will be beaten, be sticked copper adhesive tape 99 again, causes the tangent line time big
It is big to extend.
Second, be sticked need to be in equipment narrow and small hemi-closure space in manually carry out, and will use acetone, isopropanol
(IPA) medicament such as, causes working environment severe, dangerous big；Precision, the efficiency of manual work are also all difficult to ensure that simultaneously.
3rd, it need to firmly be extruded to ensure copper adhesive tape 99 to be sticked closely, this easily causes cull, cull toughness,
Can be because causing bonding die even fragment.
4th, the copper adhesive tape 99 of individual layer has certain thickness H, therefore the gross thickness for the copper adhesive tape 99 being sticked is only H integer
Times (multilayer can be pasted) and can not arbitrarily adjust, may be unsatisfactory for demand in many positions.
The content of the invention
At least part of the invention solves existing coldplate and is sticked copper tape technology tangent line time length, danger greatly, easily
Bonding die or fragment, thickness is caused to adjust inflexible problem, there is provided a kind of substrate supporting assembly for avoiding disadvantage mentioned above, film forming
Apparatus and method.
Technical scheme is a kind of substrate supporting assembly used by solving present invention problem, and it includes being used in film forming
The support plate of substrate is supported in technique, support plate, which has, to be used for towards based working face, and
There are multiple spaced openings on the working face of the support plate, movable block and drive are provided with each opening
Dynamic device, the driver are used to drive movable block to lift relative to working face so that the top surface of the movable block at least can with
Working face moves between flushing and protruding from the position of working face.
Preferably, in the face parallel to the working face, the section of the opening and the cross-sections match of movable block.
Preferably, on the direction arbitrarily parallel to the working face, the size of the top surface of the movable block is work
Face in direction size 1/10th to ten/20th.
Preferably, each opening lines up array；
On the direction arbitrarily parallel to the working face, the spacing distance between the adjacent movable block is the top of movable block
Face in direction size 2/1sts to three/3rd.
Preferably, the substrate supporting assembly also includes：
The coolant pipeline of astomous position in support plate.
Preferably, the top surface of the movable block is cambered surface.
Preferably, the top surface of the movable block is made up of elastomeric material.
Preferably, the support plate and movable block are constructed from a material that be electrically conducting.
Preferably, the substrate supporting assembly also includes：
Memory cell, for storing one or more presupposed solutions, include each movable block in each presupposed solution
Predeterminated position；
Control unit, for controlling each driver according to the presupposed solution, so that each movable block reaches corresponding
Predeterminated position.
Preferably, the substrate supporting assembly also includes：
Geometrical clamp, for the edge of the substrate to be clamped into support plate.
Technical scheme is a kind of film-forming apparatus used by solving present invention problem, and it includes：
Above-mentioned substrate supporting assembly；
Mask plate supporting assembly, for mask plate to be supported in the position with a side contacts of the substrate away from working face；
Into membrane module, for the film forming in substrate.
Preferably, the film-forming apparatus is evaporated device.
Technical scheme is a kind of film build method used by solving present invention problem, and it uses above-mentioned film-forming apparatus
Carry out, the film build method includes：
The substrate is supported in outside the working face of the support plate of substrate supporting assembly, by the mask plate with pierced pattern
On mask plate supporting assembly, make itself and a side contacts of the substrate away from working face；
According to the fluctuating of the mask plate, the position of each movable block is adjusted, substrate each position is connect with mask plate
Touch；
With the position film forming for corresponding to pierced pattern in substrate into membrane module.
Preferably, it is described with into membrane module after substrate corresponds to the position film forming of pierced pattern, in addition to：
Make at least partly described movable block protrude relative to working face to move, the substrate and working face are separated.
In the supporting assembly of the present invention, the working face of support plate has opening, is provided with liftable movable block in opening, passes through
Each movable block is moved into diverse location, then changes its flatness equivalent to making face surface have specific rise and fall, so as to
Substrate each position can be made to be in close contact with mask plate, good fit in required position " jack-up " substrate, and then make institute into figure
It is accurate.Wherein, each movable block under driver driving can autonomous travel, need not without manual operation, therefore when changing mask plate
Vacuum breaker etc., as long as adjusting each movable block position by driver, so as to which tangential velocity is greatly speeded up, working environment is good,
Without danger, and in the absence of bonding die, fragment the problems such as；In addition, as long as driver precision is enough, then the change of mutual motion block position is to appoint
Meaning, it is unrestricted equivalent to flatness adjustment amount, therefore various demands can be met.
Brief description of the drawings
Fig. 1 is that existing coldplate is sticked the cross-sectional view after copper adhesive tape；
Fig. 2 is schematic diagram for the structure of support plate in a kind of substrate supporting assembly of embodiments of the invention；
Fig. 3 be embodiments of the invention a kind of substrate supporting assembly in support plate cross-sectional view；
Fig. 4 be embodiments of the invention a kind of film-forming apparatus cross-sectional view (be not shown coolant pipeline and
Movable block is in uniform location)；
Wherein, reference is：1st, support plate；11st, it is open；12nd, coolant pipeline；2nd, movable block；3rd, driver；5th, base
Bottom；59th, geometrical clamp；6th, mask plate；69th, mask plate supporting assembly；7th, into membrane module；9th, coldplate；99th, copper adhesive tape.
Embodiment
To make those skilled in the art more fully understand technical scheme, below in conjunction with the accompanying drawings and specific embodiment party
Formula is described in further detail to the present invention.
Embodiment 1：
As shown in Figures 2 to 4, the present embodiment provides a kind of substrate supporting assembly, and it includes being used to prop up in film-forming process
The support plate 1 of substrate 5 is held, support plate 1 has the working face being used for towards substrate 5, wherein,
There are multiple spaced openings 11 on the working face of support plate 1, movable block 2 and driving are provided with each opening 11
Device 3, driver 3 be used for drive movable block 2 to be lifted relative to working face so that the top surface of movable block 2 at least can with working face
Flush and protrude between the position of working face and move.
The substrate supporting assembly has support plate 1, and it is used to support substrate 5 in the film-forming process such as evaporation；And mask plate 6
For the mask plate 6 with the pierced pattern (not shown) for passing through for film forming gas, for example, fine metal mask version 6
(FFM), the fine metal mask version 6 can be combined into by multiple bonding jumpers.
As shown in Figure 2 and Figure 3, above support plate 1 has the working face (lower surface in Fig. 3) being used for towards substrate 5, should
Working face is not a complete plane, and is provided with multiple openings 11, is provided with movable block 2 in opening 11, movable block 2 can drive
Moved under the driving of dynamic device 3, so that each movable block 2 can protrude from working face when moving to extreme higher position, and move to lowest order
It can at least be flushed when putting with working face (certainly also recessed under working face).
Certainly, because substrate supporting assembly is integrally provided in film-forming apparatus, therefore above support plate 1, opening 11, activity
Block 2, driver 3 etc. also should be all in film-forming apparatus, without being impacted to the vacuum environment of film-forming apparatus.
In the supporting assembly of the present embodiment, the working face of support plate 1 has opening 11, and liftable activity is provided with opening 11
Block 2, by the way that each movable block 2 is moved into diverse location, then change it equivalent to making face surface have specific rise and fall and put down
Smooth degree, so as in required position " jack-up " substrate 5, make each position of substrate 5 be in close contact with mask plate 6, good fit, enter
And make into the accurate of figure.Wherein, each movable block 2 driver 3 driving under can autonomous travel, without manual operation, therefore more
When changing mask plate 6 need not vacuum breaker etc., as long as adjusting each position of movable block 2 by driver 3, so as to tangential velocity significantly
Accelerate, working environment is good, no danger, and in the absence of bonding die, fragment the problems such as；In addition, as long as the precision of driver 3 is enough, then mutually
The change of motion block position be it is arbitrary, it is unrestricted equivalent to flatness adjustment amount, therefore various demands can be met.
Preferably, driver 3 is high-precision motor.
Obviously, the kinematic accuracy of driver 3 is higher, then corresponding adjustment is more accurate, therefore it is preferred that available high-precision motor enters
Row adjustment, its kinematic accuracy can be at 10 μm or so.
Preferably, in the face parallel to working face, be open 11 section and the cross-sections match of movable block 2.
That is, as shown in Figure 2 and Figure 3, above movable block 2 preferably answers " filling up " opening 11, i.e. its edge and opening 11
There should not be gap between side wall, to improve support effect.
Preferably, on the direction arbitrarily parallel to working face, the size of the top surface of movable block 2 is working face in the direction
/ 10th to ten/20th of size.
Wherein, to guarantee all to be adjusted each refined area, therefore the size of the top surface of movable block 2 should be with mask plate
The size of 6 mesorelief is related (the such as less than half of fluctuating size), or (each substrate 5 can at least below substrate to be formed
Cut out multiple substrates)；But angularly consider from cost, movable block 2 is also impossible to too small too many, therefore the it is preferred that top surface of movable block 2
Size is the 1/20~1/10 of working face size.
Preferably, each opening 11 lines up array, on the direction arbitrarily parallel to working face, between adjacent activities block 11 between
Gauge is from the top surface for movable block 11 2nd/1st to three/3rd of direction size.
Clearly as only just having adjustment function at opening 11, therefore it should be tried one's best with upper shed 11 (movable block 2) and uniformly divided
Cloth, and interval can not be too big, and due to there is provision of cooling line etc. between opening 11, therefore their interval also should not be too small；
Therefore, opening 11 preferably lines up array, and spacing is the 1/3~2/3 of top surface size, more preferably the 1/2 of top surface size.
Preferably, substrate supporting assembly also includes：The coolant pipeline 12 of the position of imperforation 11 in support plate 1.
Substrate 5 can heat up in many film-forming process (as being deposited), it is therefore desirable to it be cooled down, i.e., support plate 1 can
For the coldplate with refrigerating function.In the present embodiment, due to many openings 11 of support plate 1, therefore coolant (such as cooling water)
Pipeline 12 can only be along the gap distribution of each opening 11.
Preferably, the top surface of movable block 2 is cambered surface.
Preferably, the top surface of movable block 2 is made up of elastomeric material.
Because movable block 2 may contact with substrate 5, therefore it is preferably cambered surface (be, for example, arc surface, sphere etc.) to increase
Its big contact area between substrate 5, while it is preferably the deformable material (such as rubber) with certain elasticity, with as far as possible
Realize that face contacts, avoid breaking up substrate 5 because the sharp corners of hard movable block contact with the generation point of substrate 5.
Preferably, support plate 1 and movable block 2 are constructed from a material that be electrically conducting.
A large amount of electrostatic can be produced in film-forming process, and its environment is mostly vacuum, therefore these electrostatic can not discharge and easily exist
Accumulated in substrate 5, influence the progress of film forming.Therefore, movable block 2 and support plate 1 are preferably conductive materials, so as to by substrate 5
In electrostatic export release (support plate 1 can be grounded).Moreover, substrate 5 is typically to be located at below seating surface in film-forming process, therefore
It can actually be deformed under gravity, and most of position does not contact with working face, thus depend merely on the electrostatic of support plate 1 be difficult to it is suitable
Profit export；And in the present embodiment, multiple positions of substrate 5 may all contact with the movable block 2 of protrusion, so as to the export of its electrostatic more
Add easily.
Specifically, above movable block 2 can be conductive rubber material, so as to which it is not only conductive but also is elasticity；And support plate 1 still may be used
For the metal material of routine, to reduce cost, intensity is improved.
Preferably, substrate supporting assembly also includes：
Geometrical clamp 59, for the edge of substrate 5 to be clamped into support plate 1.
That is, multiple geometrical clamps 59 can be set, the edge of substrate 5 is folded on support plate 1, so as to not to substrate
The purpose for supporting substrate 5 is realized in the case of being fixed in 5 middle parts.
Preferably, above substrate supporting assembly also includes：
Memory cell, for storing one or more presupposed solutions, include the pre- of each movable block 2 in each presupposed solution
If position；
Control unit, for controlling each driver 3 according to presupposed solution, so that each movable block 2 reaches default position accordingly
Put.
That is, each driver 3 can be controlled to drive movable block 2 to work by control unit, and will corresponding different masks
The position of movable block 2 of version stores as different presupposed solutions (recipe), so that when using certain mask plate 6, as long as
Call corresponding presupposed solution, you can making whole show block 2 all move to required position and completing to adjust quickly, enter one
Step shortens the tangent line time.
The present embodiment also provides a kind of film-forming apparatus, and it includes：
Above-mentioned substrate supporting assembly；
Mask plate supporting assembly 69, for mask plate 6 to be supported in the position with a side contacts of the substrate 5 away from working face
Put；
Into membrane module 7, for film forming on substrate 5.
Above substrate supporting assembly can be used in film-forming apparatus, have mask plate supporting assembly 69 in the film-forming apparatus, with
The mask plate 6 with pierced pattern is supported, and makes mask plate 6 and a side contacts of the substrate 5 away from working face, so as to ensure substrate
The position of the pierced pattern of only corresponding mask plate 6 could film forming on 5.
Preferably, film-forming apparatus is evaporated device.
Above substrate supporting assembly can be used in evaporated device, wherein being accordingly that gas is deposited for producing into membrane module 7
The evaporation source of body, evaporation gas correspond to the film layer of figure by being formed on substrate 5 after pierced pattern.
Embodiment 2：
As shown in Figures 2 to 4, the present embodiment provides a kind of film build method, and it uses above-mentioned film-forming apparatus to carry out, this into
Film method includes：
Substrate 5 is supported in outside the working face of support plate 1 of substrate supporting assembly, there will be pierced pattern (not show in figure
Go out) mask plate 6 (such as fine metal mask version) on the mask plate supporting assembly 69, make it with substrate 5 away from working face
A side contacts；
According to the fluctuating of mask plate 6, the position of each movable block 2 is adjusted, each position of substrate 5 is contacted with mask plate 6；
With the position film forming for corresponding to pierced pattern in substrate 5 into membrane module 7.
In use above film-forming apparatus film forming, each position of substrate 5 can be made with covering by adjusting the position of each movable block 2
Film version 6 is in close contact, so as to ensure into the accuracy of figure.
Preferably, also include after the position film forming of the corresponding pierced pattern of substrate 5 with into membrane module 7：
Make at least part movable block 2 protrude relative to working face to move, substrate 5 and working face are separated.
Due to easily accumulating electrostatic in substrate 5 in film forming procedure, therefore it may be adsorbed because of electrostatic in support plate 1
On working face, substrate 5 is caused not to be removed；And in the present embodiment, due to provided with movable block 2, therefore when substrate 5 and working face are sent out
During raw absorption, available active block 2 " opens on top substrate 5 " from working face, smoothly to remove substrate 5.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, but the invention is not limited in this.For those skilled in the art, the essence of the present invention is not being departed from
In the case of refreshing and essence, various changes and modifications can be made therein, and these variations and modifications are also considered as protection scope of the present invention.
Claims (14)
1. a kind of substrate supporting assembly, it includes being used for the support plate that substrate is supported in film-forming process, and support plate, which has, to be used for
Towards based working face, it is characterised in that
There are multiple spaced openings on the working face of the support plate, movable block and driving are provided with each opening
Device, the driver be used for drive movable block to be lifted relative to working face so that the top surface of the movable block at least can with work
Flush and protrude between the position of working face and move as face.
2. substrate supporting assembly according to claim 1, it is characterised in that
In the face parallel to the working face, the section of the opening and the cross-sections match of movable block.
3. substrate supporting assembly according to claim 1, it is characterised in that
On the direction arbitrarily parallel to the working face, the size of the top surface of the movable block is working face in direction size
1/10th to ten/20th.
4. substrate supporting assembly according to claim 1, it is characterised in that
Each opening lines up array；
On the direction arbitrarily parallel to the working face, the spacing distance between the adjacent movable block exists for the top surface of movable block
2nd/to three/3rd of direction size.
5. substrate supporting assembly according to claim 1, it is characterised in that also include：
The coolant pipeline of astomous position in support plate.
6. substrate supporting assembly according to claim 1, it is characterised in that
The top surface of the movable block is cambered surface.
7. substrate supporting assembly according to claim 1, it is characterised in that
The top surface of the movable block is made up of elastomeric material.
8. substrate supporting assembly according to claim 1, it is characterised in that
The support plate and movable block are constructed from a material that be electrically conducting.
9. substrate supporting assembly according to claim 1, it is characterised in that also include：
Memory cell, it is pre- including each movable block in each presupposed solution for storing one or more presupposed solutions
If position；
Control unit, for controlling each driver according to the presupposed solution, so that each movable block reaches corresponding default
Position.
10. substrate supporting assembly according to claim 1, it is characterised in that also include：
Geometrical clamp, for the edge of the substrate to be clamped into support plate.
A kind of 11. film-forming apparatus, it is characterised in that including：
Substrate supporting assembly in claim 1 to 10 described in any one；
Mask plate supporting assembly, for mask plate to be supported in the position with a side contacts of the substrate away from working face；
Into membrane module, for the film forming in substrate.
12. film-forming apparatus according to claim 11, it is characterised in that
The film-forming apparatus is evaporated device.
13. a kind of film build method, it is characterised in that carried out using the film-forming apparatus described in claim 11 or 12, the film forming
Method includes：
The substrate is supported in outside the working face of the support plate of substrate supporting assembly, the mask plate with pierced pattern is located at
On mask plate supporting assembly, make itself and a side contacts of the substrate away from working face；
According to the fluctuating of the mask plate, the position of each movable block is adjusted, substrate each position is contacted with mask plate；
With the position film forming for corresponding to pierced pattern in substrate into membrane module.
14. film build method according to claim 13, it is characterised in that correspond to hollow out in substrate with into membrane module described
After the position film forming of pattern, in addition to：
Make at least partly described movable block protrude relative to working face to move, the substrate and working face are separated.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710800465.9A CN107365972B (en) | 2017-09-07 | 2017-09-07 | Substrate support assembly, film forming apparatus and method |
| PCT/CN2018/104196 WO2019047856A1 (en) | 2017-09-07 | 2018-09-05 | Base support component, film forming device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710800465.9A CN107365972B (en) | 2017-09-07 | 2017-09-07 | Substrate support assembly, film forming apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107365972A true CN107365972A (en) | 2017-11-21 |
| CN107365972B CN107365972B (en) | 2022-06-28 |
Family
ID=60311744
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710800465.9A Active CN107365972B (en) | 2017-09-07 | 2017-09-07 | Substrate support assembly, film forming apparatus and method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107365972B (en) |
| WO (1) | WO2019047856A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108220904A (en) * | 2018-01-03 | 2018-06-29 | 京东方科技集团股份有限公司 | Contact plate and evaporated device |
| WO2018214515A1 (en) * | 2017-05-23 | 2018-11-29 | 京东方科技集团股份有限公司 | Support plate for vapor deposition device and vapor deposition device thereof |
| WO2019047856A1 (en) * | 2017-09-07 | 2019-03-14 | 京东方科技集团股份有限公司 | Base support component, film forming device and method |
| CN113463021A (en) * | 2021-06-30 | 2021-10-01 | 武汉华星光电半导体显示技术有限公司 | Cooling device and cooling method thereof |
| CN114807868A (en) * | 2022-06-24 | 2022-07-29 | 度亘激光技术（苏州）有限公司 | Coating method and fixture for bars with different cavity lengths |
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| CN112198755B (en) * | 2020-10-20 | 2024-05-24 | 江苏高光半导体材料有限公司 | Integrated loading box for storing and using mask |
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- 2017-09-07 CN CN201710800465.9A patent/CN107365972B/en active Active
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2018
- 2018-09-05 WO PCT/CN2018/104196 patent/WO2019047856A1/en active Application Filing
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| CN1721933A (en) * | 2004-07-09 | 2006-01-18 | 应用材料股份有限公司 | Independently moving substrate supports |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018214515A1 (en) * | 2017-05-23 | 2018-11-29 | 京东方科技集团股份有限公司 | Support plate for vapor deposition device and vapor deposition device thereof |
| WO2019047856A1 (en) * | 2017-09-07 | 2019-03-14 | 京东方科技集团股份有限公司 | Base support component, film forming device and method |
| CN108220904A (en) * | 2018-01-03 | 2018-06-29 | 京东方科技集团股份有限公司 | Contact plate and evaporated device |
| CN113463021A (en) * | 2021-06-30 | 2021-10-01 | 武汉华星光电半导体显示技术有限公司 | Cooling device and cooling method thereof |
| CN114807868A (en) * | 2022-06-24 | 2022-07-29 | 度亘激光技术（苏州）有限公司 | Coating method and fixture for bars with different cavity lengths |
| CN114807868B (en) * | 2022-06-24 | 2022-09-23 | 度亘激光技术（苏州）有限公司 | Coating method and fixture for bars with different cavity lengths |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019047856A1 (en) | 2019-03-14 |
| CN107365972B (en) | 2022-06-28 |
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