CN100416361C - Apparatus and method for base plate conglutination - Google Patents
Apparatus and method for base plate conglutination Download PDFInfo
- Publication number
- CN100416361C CN100416361C CNB2005100975144A CN200510097514A CN100416361C CN 100416361 C CN100416361 C CN 100416361C CN B2005100975144 A CNB2005100975144 A CN B2005100975144A CN 200510097514 A CN200510097514 A CN 200510097514A CN 100416361 C CN100416361 C CN 100416361C
- Authority
- CN
- China
- Prior art keywords
- sealant
- mentioned
- sucker
- substrate
- exhaust opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 145
- 239000000565 sealant Substances 0.000 claims abstract description 126
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 15
- 238000007599 discharging Methods 0.000 claims description 16
- 238000010030 laminating Methods 0.000 abstract 3
- 239000007789 gas Substances 0.000 description 112
- 230000003321 amplification Effects 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000003199 nucleic acid amplification method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000006837 decompression Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000012467 final product Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000012567 pattern recognition method Methods 0.000 description 2
- 230000003578 releasing effect Effects 0.000 description 2
- 230000003042 antagnostic effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
To provide an apparatus for laminating substrate and a method for sticking substrate for satisfactorily laminating upper and lower substrates across a sealant by reducing intrusion of air bubbles to a liquid crystal display surface. In laminating the upper substrate 1a to lower substrate 1b across the sealant 5, discharge holes 3aa of gas are formed on the upper stage 3a and discharged gas from the discharge holes 3aa is directed to the inner side of a line to which the sealant 5 is applied. In the thin upper and lower substrates 1a, 1b laminated to each other in the vacuum environment, even when connection between the sealant 5 and the upper substrate 1a is not properly performed by the pushing operation 3a of the stage 3a, the sealant 5 is pressurized and is properly crushed by substrate deformation by the discharged gas along the sealant 5. Further, since the discharged gas pushes a substrate surface located on a position more inside than the position of the sealant 5, it is avoided that the discharged gas sneaks in along the substrate edge and flows into a cell and that the air bubble remains on the display surface, and a satisfactory liquid crystal display panel can be manufactured.
Description
Technical field
The suitable base plate bonding device that the present invention relates in the manufacturing of LCD panel, adopt and the improvement of base plate bonding method.
Background technology
Generally the LCD panel that adopts in the display that PC or TV developing device or various monitor are used etc. is the substrate of a pair of thin glass of configuration relatively, by be applied as bonding manufacturing of sealant of frame shape in the mode of surrounding display surface.In addition, in order to make bonding substrate distance (element spacing) constant, a plurality of septs are set on the display surface of substrate in advance.
LCD panel is enclosed liquid crystal and is formed in the display surface of two bonding substrates, the mode of enclosing display surface for liquid crystal has injection mode and the mode of dripping.
Fig. 1 is the portions cut sectional view that is illustrated in the existing base plate bonding device that adopts in the manufacturing that utilizes the LCD panel of mode under the liquid crystal drop, and Fig. 2 is the A-A place sectional view of Fig. 1.
On the display surface of infrabasal plate 1b, set in advance the liquid crystal 6 that drips in the sept 4, have fusible sealant 5 and on infrabasal plate 1b, be coated in the frame shape to surround its display surface.
On the 2a of upper chamber, be provided with motor 9, but the ball screw mechanism that the X-Y-θ travel mechanism 7 that is connected with the driving shaft 9a of motor 9 utilizes motor 9 to drive is assembled into knee-action.
X-Y-θ travel mechanism 7 and motor 9 are subjected to the drive controlling of not shown controller, and the upper substrate 1a that is maintained on the sucker 3a is moved along the X-Y-θ direction and the above-below direction of surface level respectively.
In the time of following sucker 3b placement and maintenance infrabasal plate 1b, video camera 10a, the 10b of upper and lower base plate 1a, 1b location usefulness is housed in the lower chambers 2b of fixing sucker 3b down.
Utilize the substrate 1a that this video camera 10a, 10b obtain, the sign reflection of 1b face location usefulness to supply with not shown controller, by by the drive controlling of controller to X-Y-θ travel mechanism 7 and motor 9, according to so-called pattern recognition method, the relative position between upper and lower base plate 1a, 1b coincide becomes possibility.
Though it is not shown, but the 2a of upper chamber itself is the structure that integral body can be moved up and down, utilize the decline formation of the 2a of upper chamber and being connected of lower chambers 2b, thereby the enclosure space that forms, under this state, utilization is connected to the decompression that exhausts form in the chamber 2 that the not shown off-gas pump (vacuum pump) of chamber 2 carries out, and is used to supply with from the supply container gas of non-active gas and can returns atmospheric pressure.
In order to guarantee impermeability, when forming enclosure spaces, chamber 2 at the 2a of upper chamber that is close to following sucker 2b and the bottom of guiding mechanism 8 sides elastic component 11 is installed respectively respectively.
In addition, as Fig. 1 and shown in Figure 2, on last sucker 3a, be inserted with dipper crowding gear 12, it utilizes board member 12a to be pressed into upper substrate 1a from the outside along the sealant 5 that is coated in the frame shape, in addition, lower chambers 2b constitutes in the mode that moves on carrying track 13, utilizes lower chambers 2b moving on carrying track 13, can will utilize upper and lower base plate 1a, the 1b of lower chambers 2b before bonding to move in the chamber 2 and adhesive base plate can be taken out of (spy opens the 2003-241157 communique) from chamber 2.
In the base plate bonding device of above-mentioned formation, carry out in vacuum, utilizing the bonding of coated sealant 5 after high precision position between upper and lower base plate 1a, 1b coincide.
During the sealant 5 in utilizing vacuum bonding, on two plate 3a, 3b surface up and down, have, therefore exist only to cross over and wholely fully press equal sealant and make its smooth situation because that mobility etc. produce is concavo-convex.Therefore, in said structure, the dipper crowding gear 12 that utilizes board member 12a to be pressed into upper substrate 1a from the outside is inserted upward sucker 3a, by being pressed into along the board member 12a of sealant 5 on the upper substrate 1a, before atmospheric pressure returns, manage to press the sealant 5 between all bonding upper and lower base plate 1a, 1b in the chamber 2.
As mentioned above, in the bonder of Fig. 1 and existing substrate shown in Figure 2, has following structure: make to turn back to atmospheric pressure in the chamber 2 and take out in the chamber before the adhesive base plate, in vacuum, pass through by dipper crowding gear 12 pushing upper substrate 1a, utilize upper substrate 1a to press equal sealant 5, make between upper substrate 1a and the sealant 5 to be contacted.
But because the biasing contact of pushing face of the board member 12a of relative hard is arranged, only push plate member 12a amplifies shown in the pith as Fig. 3 pattern, and upper substrate 1a and sealant 5 produce the place that well contact, expect it is improved.
Summary of the invention
Therefore the purpose of this invention is to provide a kind of base plate bonding device and the base plate bonding method that can utilize better between the sealant adhesive base plate.
The 1st aspect of the present invention is the base plate bonding device, upper substrate is remained on the sucker, make and be placed on down on the sucker relative with it with the bonding infrabasal plate of this maintained upper substrate, at least on either party substrate, sealant is applied as the frame shape, liquid crystal drips in the inboard of the sealant of this frame shape, by the sealant bonding above-mentioned two substrates in vacuum that has applied, it is characterized in that: possess corresponding above-mentioned sealant position and the exhaust opening of opening on either party sucker at least of sucker or above-mentioned sucker down on above-mentioned, the peristome of this exhaust opening forms along sealant, and above-mentioned exhaust opening is made and made from gas supply source gas supplied to discharging than above-mentioned sealant position more in the inner part.
The 2nd aspect of the present invention is the base plate bonding method, makes upper substrate remain on the sucker in chamber, makes infrabasal plate be supported on substrate arrangement step on the following sucker; And, coincide at the laggard line position of this substrate arrangement step, at least on either party real estate, sealant is applied as the frame shape, liquid crystal drips in the inboard of the sealant of this frame shape, bonding process by sealant bonding above-mentioned upper and lower base plate in vacuum of having applied, behind this bonding process, make above-mentioned cavity indoor pressure turn back to atmospheric pressure, take out of the substrate after bonding in the chamber, it is characterized in that: have before in making above-mentioned chamber, turning back to atmospheric pressure from be formed at above-mentioned on either party sucker at least of sucker or above-mentioned sucker down, and along the exhaust opening of above-mentioned sealant opening to the discharge operation of discharging gas than above-mentioned sealant position more in the inner part.
As mentioned above, adopt base plate bonding device of the present invention and base plate bonding method, owing to, discharge gas from its lateral surface along sealant, so substrate is pushed and is out of shape to by sealant bonded two substrates in vacuum.
Thus,, utilize and discharge substrate that gas produces, also can press equal sealant that it is contacted well with upper and lower base plate by compressive strain even can't obtain pushing the flatness of press surface of the sucker up and down of substrate such as one side at the sealant that is coated in the frame shape.
Like this, owing to can suppress the inboard that gas enters the sealant that is coated in the frame shape, so can carry out high-quality bonding.
Description of drawings
Fig. 1 is the portions cut pith front elevation of the existing base plate bonding device of expression.
Fig. 2 is the A-A place sectional view of Fig. 1.
Fig. 3 is for illustrating that base plate bonding device shown in Figure 1 constitutes the pith amplification profile of pattern ground expression.
Fig. 4 is the portions cut pith front elevation of expression according to the 1st embodiment of base plate bonding device of the present invention.
Fig. 5 is for illustrating that base plate bonding device shown in Figure 4 constitutes the pith amplification profile of pattern ground expression.
Fig. 6 is the A-A place sectional view of Fig. 5.
Fig. 7 is the pith amplification profile after gas is discharged in structure shown in Figure 5.
Fig. 8 is illustrated among the 2nd embodiment of base plate bonding device of the present invention, for the pith amplification profile of its formation pattern ground expression is described.
Fig. 9 is the pith amplification profile after gas is discharged in formation shown in Figure 8.
Figure 10 is the pith amplification profile for the formation pattern ground expression of the 3rd embodiment that base plate bonding device of the present invention is described.
Figure 11 is the pith amplification profile after gas is discharged in formation shown in Figure 10.
Embodiment
A following embodiment who describes base plate bonding method of the present invention and base plate bonding device with reference to Fig. 4 to Fig. 9 in detail.Also have, in Fig. 4 to Figure 11, for giving with same-sign detailed to the identical structure of existing structure shown in Figure 3 with Fig. 1.
Fig. 4 is the pie graph of the 1st embodiment of expression base plate bonding device of the present invention.
In Fig. 4, substrate 1a, the 1b of the thin glass of a pair of rectangular shape are in by the chamber 2 that chamber 2a, 2b constitute up and down about constituting, upper substrate 1a utilize absorption to wait to be maintained at sucker 3a below, in addition infrabasal plate 1b placement and be maintained at down sucker 3b above.
The display surface of infrabasal plate 1b is provided with sept 4 in advance, has fusible sealant 5 and is applied as the frame shape to surround its display surface, and liquid crystal 6 drips on its display surface.
For last sucker 3a, form exhaust opening 3aa in last sucker 3a surface upper shed, the following of this exhaust opening 3aa slave plate 3a can be discharged gases such as dry air or nitrogen towards the following sucker 3b relative with it.
Fig. 5 is the pith amplification profile for the formation modal representation that base plate bonding device shown in Figure 4 is described, Fig. 6 is the A-A place sectional view of Fig. 5.
Shown in the sectional view of Fig. 6, the peristome of exhaust opening 3aa forms long slit-shaped along the coating direction of sealant 5.
In addition, exhaust opening 3aa makes it and discharges direction ratio sealant 5 (that is, the display surface side) also partially in the inner part, so that gas can be blowed to than in the inner part upper substrate 1a upper part also, the coating position that is positioned at the sealant 5 between upper and lower base plate 1a, 1b.
As shown in Figure 4, the exhaust opening 3aa that the is formed at sucker 3a gas supply source (air vessel) 14 of depositing gas such as non-active gas by pipe arrangement 3ab with pressurization is connected.
The pipe arrangement 3ab that is positioned at chamber 2 outsides is provided with switch valve 3ac, utilizes the control of 15 couples of switch valve 3ac of controller, the efflux time that can control the gas of discharging from exhaust opening 3aa with and discharge rate.
In addition, near the vibration machine 16 that exhaust opening 3aa opening, possesses the ultrasonic generator that to pay the gas vibration of discharging from peristome etc.Also have, as mentioned above,, can adopt for example special ultrasonic generator that flat 11-319741 communique is put down in writing of opening as the vibration machine 16 of flowing gas being paid vibration.
In addition, X-Y-θ travel mechanism 7 is connected on the driving shaft 9a of motor 9, utilizes the drive controlling of controller to X-Y-θ travel mechanism 7 and motor 9, and X-Y-θ direction and the above-below direction of upper substrate 1a in surface level moved.
Following sucker 3b is same as the prior art, is fixed on the lower chambers 2b of platform-like, is equipped with in the lower chambers 2b to be used for video camera 10a, 10b that each substrate 1a, 1b are up and down positioned.
Utilize video camera 10a, 10b to be fed into controller 15 with sign (location) portrait by the substrate 1a of sucker 3b shooting down, the location of 1b face, according to pattern recognition method and according to the detection of mark position with and detected mark position, by drive controlling, the relative position between upper and lower base plate 1a, 1b is coincide to X-Y-θ travel mechanism 7 and motor 9.
In addition, same as the prior art, comprise motor 9 the interior integral body of the 2a of upper chamber own make can knee-action structure, 2a of decline upper chamber and lower chambers 2b are connected to form enclosure space, under air-tight state, be connected to the decompression in the chamber 2 that the not shown vacuum pump of chamber 2 forms and supply with to make in the chamber 2 by utilization and turn back to atmospheric pressure from the gas of depositing non-active gas supply containers such as nitrogen.Also have, this non-active gas supply container can doublely be done above-mentioned gas supply source 14.
Action to the base plate bonding device of the 1st embodiment of said structure describes below.
At first, upper substrate 1a is moved into chamber 2, upper substrate 1a is adsorbed remain on sucker 3a below.
Secondly, on display surface, be provided with in advance in the sept 4,, on the sucker 3b, moved in the chamber 2 under the infrabasal plate 1b of the liquid crystal 6 that dripped in by sealing agent 5 area surrounded is placed and remains on to surround the mode sealant 5 of this display surface.
Secondly, the 2a of decline upper chamber formation enclosure space then descends and goes up sucker 3a to be deflated in the rear chamber 2, and identical through the position of upper substrate 1a and infrabasal plate 1b, upper and lower base plate 1a, 1b are undertaken bonding by sealant 5 in vacuum.
Upper and lower base plate 1a, 1b location and by sealant 5 carry out bonding after, the absorption of the upper substrate 1a in releasings among sucker 3a maintenance.
The non-active gas of discharging from the peristome of escape hole 3aa shown in Fig. 7 arrow, collide upper substrate 1a above, flow along top (with the direction that wiring intersects that is coated with of sealant 5) to the left and right.
Exhaust opening 3aa is to form along the sealant 5 that is coated in the frame shape and to the mode that its inner side is discharged gas, because the gas and the thin adhesive base plate 1a that discharge from this exhaust opening 3aa collide, therefore upper substrate 1a distortion, upper substrate 1a is pressed into below (infrabasal plate 1b direction).
Its result, even it is gapped between sealant 5 and the upper substrate 1a, there is the pressure of loose contact or sealant 5 all bad between sealant 5 and the upper substrate 1a, as shown in Figure 7, utilize discharge gas also upper substrate 1a can be pressed to sealant 5, therefore, thus upper substrate 1a is pressed against and contacts sealant 5 on the sealant 5 well.
After this, supply gas in the chamber 2, make in the chamber 2 and turn back to atmospheric pressure from the not shown non-active gas supply container that is connected to chamber 2.
If turn back to atmospheric pressure in the chamber 2, sucker 3a and upper chamber 2 are risen, take out of adhesive base plate 1a, 1b (liquid crystal cell).
Like this, be placed on down upper and lower base plate 1a, 1b bonding on the sucker 3b, in chamber 2 relatively, the external and internal pressure that returns generation according to atmospheric in chamber 2 is poor, in the pressurization initial stage, by utilizing the control of opening of 15 couples of switch valve 3ac of controller, discharge gas formation substrate from exhaust opening 3aa is pressed into, and upper substrate 1a is pressed on the sealant 5.Thus, can in region-wide, press bonding two substrates 1a, 1b up and down in the equal sealant 5 well.
Therefore, as shown in Figure 5, even lacking flatness, the inadequate place of contact between upper substrate 1a and sealant 5 between sucker 3a, 3b up and down, blow out being pressed into of upper substrate 1a by being used to gas from exhaust opening 3aa, also can obtain good contact (bonding) as shown in Figure 7.
In addition, adopt this embodiment, discharge gas from exhaust opening 3aa is collided to the position of the sealant 5 of upper substrate 1a, therefore discharge the edge of gas-circulating, can suppress from entering inboard (in sealant 5 area surrounded) between sealant 5 and the upper substrate 1a at upper substrate 1a.
That is, the gaseous diffusion of discharging from exhaust opening is in chamber.At this moment, the gas of diffusion arrives between sealant 5 and the substrate 1a, collides after the upper substrate 1a, arrive the edge of upper substrate 1a by the Clearance Flow of last sucker 3a and upper substrate 1a, and, forward the edge of upper substrate 1a to, arrive the path that is flowing between upper and lower base plate 1a, 1b.Therefore, this path is long more, and it is many more that the gas of discharging from exhaust opening 3aa arrives between sealant 5 and the upper substrate 1a the previously needed time.
As described in embodiment, for the discharge gas collisions from exhaust opening 3aa is configured in exhaust opening 3aa than sealant more in the inner part near the inner side sealant 5 of upper substrate 1a, so that be used to gas from exhaust opening 3aa when making upper substrate 1a indentation sealing agent 5, can prolong the path till arriving between sealant 5 and the upper substrate 1a from the discharge gas of exhaust opening 3aa as far as possible, and then the discharge gas that can prolong as far as possible from exhaust opening 3aa arrives the required time between sealant 5 and the upper substrate 1a.Thus, can be used to make the long-time indentation sealing agent 5 of this part upper substrate 1a from the discharge gas of exhaust opening 3aa.Like this, in during till arriving between sealant 5 and the substrate 1a from the discharge gas of exhaust opening 3aa, contacting of upper substrate 1a and sealant 5 is more reliable, the quality bond that gas enters sealant 5 inboards can be suppressed, thereby the good LCD panel of display quality can be made.
Also have, the gas stream of discharging from exhaust opening 3aa flows owing to utilizing the vibration machine 16 that is installed on the exhaust opening 3aa to become vibration pneumatic, so the impact force that ultrasound wave is produced also acts on upper substrate 1a surface, can carry out upper substrate 1a being pressed into sealant 5 more expeditiously.
In addition, chamber 2 is turned back in the atmospheric process, at first, from exhaust opening 3aa gas is discharged, thereafter, supply gas in the chamber 2 from the not shown non-active gas supply container that is connected to chamber 2, therefore from non-active gas supply container supply gas the time, be used to sealant 5 be contacted well with upper substrate 1a, therefore can prevent from after between upper substrate 1a and the sealant 5, to enter inboard (in sealant 5 area surrounded) from the gas of not shown non-active gas supply container from the discharge gas of exhaust opening 3aa.
In addition, owing to carry out upper substrate 1a being pressed into to upper substrate 1a to sealant 5 by making the discharge gas collisions, therefore only on last sucker 3a exhaust opening 3aa being set gets final product, by on last sucker 3a, inserting mechanism, can prevent the complicated of sucker 3a structure as far as possible with upper substrate 1a indentation sealing agent 5.
In addition, on last sucker 3a, exhaust opening 3aa is set, upper substrate 1a absorption is remained on after sucker 3a goes up, to upper substrate 1a by the sealant 5 that is coated in infrabasal plate 1b bonding upper substrate 1a blow out discharge gas till, can continue on last sucker 3a, to adsorb maintenance upper substrate 1a.Therefore, blow to upper substrate 1a from the gas of exhaust opening 3aa till, therefore the fixing position of upper substrate 1a can prevent to produce position deviation between upper substrate 1a and the infrabasal plate 1b before blowing to discharging gas as far as possible.That is,, the possibility that has the insufficient position of contact is arranged between sealant 5 and upper substrate 1a, can think to compare to obtain good contact condition between this part sealant 5 and the upper substrate 1a and more be easy to generate position deviation to discharging till gas blows to.Therefore, as mentioned above, by discharge gas blow to upper substrate 1a till fixing upper substrate 1a, can prevent this position deviation.
In addition, owing on last sucker 3a, be provided with exhaust opening 3aa, so, can make from the discharge gas of exhaust opening 3aa to blow out from the position near upper substrate 1a as far as possible.Thus, the discharge gas from exhaust opening 3aa can be blown on the upper substrate 1a effectively.Thereby can prevent more reliably that gas from entering sealant 5 inboards.
So, by continuing to make the operation of returning to atmospheric pressure in the chamber 2 by exhaust opening 3aa blow gas, can more accurately carry out base plate bonding, can avoid sneaking into the Presentation Function quality decline that causes by bubble by upper substrate 1a and sealant 5 are adjacent to.
Fig. 8 is the pith amplification profile for the 2nd embodiment modal representation that base plate bonding device of the present invention is described.The 2nd embodiment compares with above-mentioned the 1st embodiment, the structure difference of exhaust opening 3aa peristome only, and other structures are identical with the 1st embodiment, therefore only specify difference.
As shown in Figure 8, the base plate bonding device of the 2nd embodiment, enlarged opening width in the exhaust opening 3aa of last sucker 3a, the peristome of the exhaust opening 3aa of the A/F that this is big is deposited the elastic component 3ad of sponge or rubber etc. and is constituted.
Therefore, when gas was discharged on upper substrate 1a surface, this elastic component 3ad was extruded into upper substrate 1a surface and is pressed into upper substrate 1a, therefore as shown in Figure 9, can obtain excellent contact (bonding) between upper substrate 1a and sealant 5 from exhaust opening 3aa.
Also have, elastic component 3ad turns back to atmospheric pressure in chamber 2 after, utilize the negative pressure that in exhaust opening 3aa, produces to be introduced in the peristome of exhaust opening 3aa.And the elastic component 3ad that is introduced in the peristome utilizes the contact resistance of the side wall surface of elastic component 3ad self side wall surface and exhaust opening 3aa peristome to be maintained in the peristome, removes above-mentioned negative pressure and stays in the peristome afterwards.That is, in the 2nd embodiment, exhaust opening 3aa can connect gas supply source 14 and not shown negative pressure source selectively.
In addition, even in the 2nd embodiment, because the gas of discharging from exhaust opening 3aa more is pressed into inboard upper substrate 1a surface by elastic component 3ad than the wiring that is coated with of sealant 5, therefore identical with the 1st embodiment, edge from the gas-circulating upper substrate 1a that blows out between exhaust opening 3aa and the elastic component 3ad can suppress to enter the inboard from the gap between sealant 5 and the upper substrate 1a.
Also have, be pressed into upper substrate 1a and get final product, for example therefore can utilize with a plurality of airports discharge gases expansions of sponge-like body and be pressed into upper substrate 1a surface because elastic component 3ad so long as utilize discharges gas.
Also have, in the 2nd embodiment, is that example describes to utilize negative pressure with the peristome that elastic component 3ad is incorporated into exhaust opening 3aa, but be not limited thereto, for example utilize spring etc. to elastic component 3ad to the direction reinforcing of introducing peristome, elastic component 3ad is used to supply with the acting force of antagonistic spring etc. and outstanding from peristome from the gas of gas supply source 14, if stop to supply with from the gas of gas supply source, can utilize the acting force of spring etc. to be incorporated in the peristome.
Figure 10 is the pith amplification profile for the 3rd embodiment modal representation that base plate bonding device of the present invention is described.The 3rd embodiment compares with above-mentioned the 1st embodiment, the opening structure difference of exhaust opening 3aa only, and other structures are identical with the 1st embodiment, therefore only specify difference.
The base plate bonding device of the 3rd embodiment is to install to have retractility and have the elastic component 3ae of bubble-tight rubber etc. and constitute on the exhaust opening 3aa of last sucker 3a as shown in figure 10.
Therefore, if supply with exhaust opening 3aa gas then elastic component 3ae utilize its impermeability and retractility to expand, outstanding to upper substrate 1a as shown in Figure 11.So, upper substrate 1a utilizes outstanding elastic component 3ae to press to sealant 5, therefore can obtain excellent contact (bonding) between upper substrate 1a and sealant 5.
Like this, in the 3rd embodiment, utilize elastic component 3ae upper substrate 1a to be pressed to after the sealant 5 never illustrated non-active gas supply container supply gas in chamber 2.Thus, from the non-active gas supply container in chamber 2 during supply gas, owing to utilize elastic component 3ae between upper substrate 1a and sealant 5, can obtain excellent contact, therefore can prevent from after between upper substrate 1a and the sealant 5, to enter inboard (in sealant 5 area surrounded) from the gas of non-active gas supply container.Thus, can access the effect that is equal to the 1st embodiment.
In addition, because be the structure that elastic component 3ae is expanded, the gas of supplying with exhaust opening 3aa is not discarded in the chamber 2, therefore the gaseous tension of supplying with exhaust opening 3aa can act on expeditiously corresponding upper substrate 1a sealant 5 the position (in the present embodiment, the position of sealant 5 inboards) on, upper substrate 1a is pushed more reliably and contact sealant 5.
Also have, in this 3rd embodiment, when bonding upper and lower base plate 1a, 1b etc., in chamber 2, be under the state of decompression, if the pressure in the exhaust opening 3aa is higher than the pressure in the chamber 2, because elastic component 3ae utilizes pressure differential outstanding to upper substrate 1a, therefore when elastic component 3ae give prominence to, pressure and the chamber 2 interior pressure that preestablish in the exhaust opening 3ae equate to get final product.
For example, set in advance the transfer valve that in pipe arrangement 3ab and chamber 2 space is communicated with exhaust opening 3aa selectively, when elastic component 3ae is given prominence to, transfer valve is switched to chamber 2 internal space sides, make in the exhaust opening 3aa and have identical pressure with chamber 2 interior spaces, when elastic component 3ae is given prominence to, transfer valve is switched to pipe arrangement 3ab side, to the gas of exhaust opening 3aa supply from gas supply source 14.
In the various embodiments described above of above explanation, though be to form exhaust opening 3aa in last sucker 3a side, but also can below following sucker 3b side form gas discharge hole, be arranged in addition up and down on sucker 3a, the 3b both sides, gas is discharged to its inboard along sealant 5, pressure according to substrate deformation and sealant 5 is equal, can utilize also that the substrate 1a of sealant 5 and substrate 1b's is bonding.
In addition, in the base plate bonding device of each embodiment of above-mentioned explanation, the structure that sealant 5, liquid crystal 6 and sept 4 is arranged on the infrabasal plate 1b side of below has been described, but these sealants 5, liquid crystal 6 and sept 4 can selectively be arranged on the either or both among upper and lower base plate 1a, the 1b certainly arbitrarily.
In addition, in the various embodiments described above, be that the formation of one side is illustrated to the display surface of upper and lower base plate 1a, 1b, even but the substrate of many chamferings, so long as just can be suitable for along the substrate of substrate edges sealant 5.
In this case, can make consistent setting of coating figure of a plurality of sealants of 1 substrate of exhaust opening and coating.
In addition, can make exhaust opening along the sealant setting in the coating figure of a plurality of sealants of 1 substrate of coating along outer circumferential side (substrate edges side) coating.That is, long more to the distance of sealant from the edge of substrate, gas is difficult more to enter the sealant inboard between bonding agent and the substrate.This is because far away more long more from the gas arrival previously needed time of sealant that escape hole is discharged from the distance of substrate edges arrival sealant.The time of gas arrival sealant is long, and in this state, the time by interior heterodyne generation pushing force that bonding substrate is subjected to is just long, and thus, the gas arrival sealant of discharging from exhaust opening can contact with sealant well with prebasal plate.Therefore, make gas when exhaust opening is discharged, as long as in advance along be positioned at a large amount of gases enter the high outer circumferential side (substrate edges side) of the inboard possibility of sealant sealant part blow gas exhaust opening is set, even do not blow out discharge gas, can suppress gas yet and enter the sealant inboard along compare the sealant that is positioned at the inboard with it.
In addition, be held or be placed on the size of the substrate on plate 3a, the 3b owing to make in batches not simultaneously, on plate 3a, form in advance respectively exhaust opening 3aa that should the size of substrate shape, by according to the size of adhesive base plate 1a, 1b and with the gentle supply source 14 of pipe arrangement 3ab that different separately exhaust opening connects between select to switch, can access same effect.
As above illustrated, adopt the base plate bonding device of the various embodiments described above, before the atmospheric pressure return in chamber 2, by coating position blow gas to the sealant 5 of 2 bonding substrates of correspondence, utilize base plate deformation equal to the pressure of sealant 5, can carry out good bondingly,, also can avoid bubble to sneak in the element even carry out the atmospheric pressure return in chamber 2 continuously.
In addition in the various embodiments described above, utilizing the gas supply source to carry out being illustrated to the example that the gas of exhaust opening is supplied with, never illustrated non-active gas supply container is supplied with gas in the chamber 2, but gas supply source or non-active gas supply container are substitutable for atmosphere opening (with the atmospheric pressure connection).
That is, when the exhaust opening supply gas, or during from non-active gas supply container feeding chamber indoor gas, be in the chamber under the decompression state from the gas supply source, therefore if with exhaust opening or chamber to atmosphere opening, just gas can be supplied with exhaust opening or chamber.
In addition, in the 1st embodiment, be illustrated, be arranged to slit-shaped but also can arrange the replacement of a plurality of holes with the example of the peristome of exhaust opening 3a being arranged to slit-shaped.
In addition, be illustrated with example to the sealant inside part blow gas of substrate, but also can be to the position blow gas on the sealant of substrate.At this moment, make the substrate on the sealant press to sealant, therefore can press equal sealant expeditiously from the discharge gas of exhaust opening.
In addition, even in the 2nd, the 3rd embodiment, also identical with the 1st embodiment, exhaust opening is provided with vibration machine, can pay the gas ultrasonic vibration that is supplied to.
Claims (5)
1. base plate bonding device, upper substrate is remained on the sucker, make and be placed on down on the sucker relative with it with the bonding infrabasal plate of this maintained upper substrate, at least on either party substrate, sealant is applied as the frame shape, liquid crystal drips in the inboard of the sealant of this frame shape, sealant bonding above-mentioned two substrates in vacuum by having applied is characterized in that:
At least possess corresponding above-mentioned sealant position and the exhaust opening of opening on either party sucker of sucker or above-mentioned sucker down on above-mentioned, the peristome of this exhaust opening forms along sealant,
Above-mentioned exhaust opening is so that formed to the mode of discharging than above-mentioned sealant position more in the inner part between the sucker up and down above-mentioned by gas supply source gas supplied.
2. base plate bonding device according to claim 1 is characterized in that:
The peristome of above-mentioned exhaust opening forms long slit-shaped.
3. base plate bonding device according to claim 1 is characterized in that:
The peristome folding and unfolding of above-mentioned exhaust opening is subjected to discharging pressing force that gas produces and the elastic component that can give prominence to from opening surface.
4. base plate bonding device according to claim 1 is characterized in that:
Between the peristome of above-mentioned exhaust opening and above-mentioned gas supply source, possess grant the vibration machine of vibration from above-mentioned gas supply source gas supplied.
5. base plate bonding method comprises: make upper substrate remain on the sucker in chamber, make infrabasal plate be supported on substrate arrangement step on the sucker down; And, coincide at the laggard line position of this substrate arrangement step, at least on either party real estate, sealant is applied as the frame shape, liquid crystal drips in the inboard of the sealant of this frame shape, bonding process by sealant bonding above-mentioned upper and lower base plate in vacuum of having applied after this operation, makes above-mentioned cavity indoor pressure turn back to atmospheric pressure, in chamber, take out of bonding substrate, it is characterized in that:
Have make above-mentioned cavity indoor pressure turn back to atmospheric pressure before from be formed at above-mentioned on either party sucker at least of sucker or above-mentioned down sucker and along the exhaust opening of above-mentioned sealant opening to also in the inner part position discharging the discharge operation of gas than above-mentioned sealant.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004381151 | 2004-12-28 | ||
| JP2004381151A JP4751612B2 (en) | 2004-12-28 | 2004-12-28 | Substrate bonding apparatus and substrate bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1797088A CN1797088A (en) | 2006-07-05 |
| CN100416361C true CN100416361C (en) | 2008-09-03 |
Family
ID=36737941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100975144A Expired - Fee Related CN100416361C (en) | 2004-12-28 | 2005-12-28 | Apparatus and method for base plate conglutination |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4751612B2 (en) |
| KR (1) | KR100764381B1 (en) |
| CN (1) | CN100416361C (en) |
| TW (1) | TW200638140A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4761026B2 (en) * | 2005-06-03 | 2011-08-31 | ソニー株式会社 | Element transfer device, element transfer method, and display device manufacturing method |
| TWI478271B (en) * | 2007-08-10 | 2015-03-21 | 尼康股份有限公司 | Substrate bonding device and substrate bonding method |
| KR101067384B1 (en) * | 2009-06-23 | 2011-09-23 | 동아대학교 산학협력단 | Manufacturing method of EPD device using vacuum bonding |
| JP5323663B2 (en) * | 2009-12-16 | 2013-10-23 | 株式会社ブリヂストン | Tire gas filling method |
| JP5639617B2 (en) * | 2012-05-11 | 2014-12-10 | 東京応化工業株式会社 | Sticking device and sticking method |
| KR102300081B1 (en) * | 2015-04-27 | 2021-09-08 | 삼성디스플레이 주식회사 | Bonding appratus and method of manufacturing curved display device using the same |
| JP6407803B2 (en) * | 2015-06-16 | 2018-10-17 | 東京エレクトロン株式会社 | Joining apparatus, joining system, joining method, program, and computer storage medium |
| CN110197618B (en) * | 2019-06-28 | 2020-08-25 | 云谷（固安）科技有限公司 | Laminating method of curved-surface display panel |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212380A (en) * | 1997-09-19 | 1999-03-31 | 松下电器产业株式会社 | Method and apparatus for manufacturing liquid crystal panel |
| JP2002072225A (en) * | 2000-09-04 | 2002-03-12 | Ran Technical Service Kk | Liquid crystal sealing method and liquid crystal |
| JP2002250927A (en) * | 2001-12-25 | 2002-09-06 | Ran Technical Service Kk | Liquid crystal sealing device |
| KR20030076148A (en) * | 2002-03-22 | 2003-09-26 | 엘지.필립스 엘시디 주식회사 | bonding device for liquid crystal display device |
| CN1447167A (en) * | 2002-03-15 | 2003-10-08 | Lg.菲利浦Lcd株式会社 | Substrate binding appts. for LCD device |
| CN1481003A (en) * | 2002-07-31 | 2004-03-10 | ��һ������ʽ���� | Chip sticking means and chip sticking method |
| JP2004235386A (en) * | 2003-01-30 | 2004-08-19 | Sharp Corp | Positioning table and positioning method |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59144597A (en) * | 1983-02-03 | 1984-08-18 | Canon Inc | Method and device for pressing |
| JP2530853B2 (en) * | 1987-06-12 | 1996-09-04 | 松下電器産業株式会社 | Liquid crystal display element manufacturing method |
| JPH0588188A (en) * | 1991-09-27 | 1993-04-09 | Matsushita Electric Ind Co Ltd | Method for assembling thin plate |
| JPH06208097A (en) * | 1993-01-13 | 1994-07-26 | Ricoh Co Ltd | Production of liquid crystal display device |
| JPH06235896A (en) * | 1993-02-08 | 1994-08-23 | Ropuko:Kk | Contactless pressure sticking method |
| JP3112221B2 (en) * | 1993-07-30 | 2000-11-27 | 新東工業株式会社 | Liquid crystal cell gap setting method |
| JP3545076B2 (en) * | 1995-01-11 | 2004-07-21 | 富士通ディスプレイテクノロジーズ株式会社 | Liquid crystal display device and method of manufacturing the same |
| JPH10123541A (en) * | 1996-10-15 | 1998-05-15 | Optrex Corp | Production for liquid crystal display element |
| JP2001222018A (en) * | 1999-11-29 | 2001-08-17 | Victor Co Of Japan Ltd | Method of manufacturing liquid crystal display element |
| JP2001235759A (en) | 2000-02-24 | 2001-08-31 | Nec Eng Ltd | Device and method for sealing of liquid crystal display cell |
| JP2001312214A (en) * | 2000-04-27 | 2001-11-09 | Seiko Epson Corp | Method for manufacturing optoelectronic device, device for pressing and hardening sealing material, optoelectronic device and electronic appliance |
| JP3742000B2 (en) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | Press machine |
| JP4224959B2 (en) * | 2001-08-21 | 2009-02-18 | 株式会社日立プラントテクノロジー | Liquid crystal substrate assembly equipment |
| US20050022938A1 (en) * | 2002-12-26 | 2005-02-03 | Shibaura Mechatronics Corporation | Apparatus for bonding substrates and method for bonding substrates |
-
2004
- 2004-12-28 JP JP2004381151A patent/JP4751612B2/en not_active Expired - Fee Related
-
2005
- 2005-12-09 TW TW094143620A patent/TW200638140A/en unknown
- 2005-12-28 KR KR1020050132282A patent/KR100764381B1/en not_active IP Right Cessation
- 2005-12-28 CN CNB2005100975144A patent/CN100416361C/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212380A (en) * | 1997-09-19 | 1999-03-31 | 松下电器产业株式会社 | Method and apparatus for manufacturing liquid crystal panel |
| JP2002072225A (en) * | 2000-09-04 | 2002-03-12 | Ran Technical Service Kk | Liquid crystal sealing method and liquid crystal |
| JP2002250927A (en) * | 2001-12-25 | 2002-09-06 | Ran Technical Service Kk | Liquid crystal sealing device |
| CN1447167A (en) * | 2002-03-15 | 2003-10-08 | Lg.菲利浦Lcd株式会社 | Substrate binding appts. for LCD device |
| KR20030076148A (en) * | 2002-03-22 | 2003-09-26 | 엘지.필립스 엘시디 주식회사 | bonding device for liquid crystal display device |
| CN1481003A (en) * | 2002-07-31 | 2004-03-10 | ��һ������ʽ���� | Chip sticking means and chip sticking method |
| JP2004235386A (en) * | 2003-01-30 | 2004-08-19 | Sharp Corp | Positioning table and positioning method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060076754A (en) | 2006-07-04 |
| JP4751612B2 (en) | 2011-08-17 |
| TW200638140A (en) | 2006-11-01 |
| JP2006184807A (en) | 2006-07-13 |
| KR100764381B1 (en) | 2007-10-08 |
| CN1797088A (en) | 2006-07-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100416361C (en) | Apparatus and method for base plate conglutination | |
| JP3707990B2 (en) | Board assembly equipment | |
| US7886793B2 (en) | Substrate bonding machine for liquid crystal display device | |
| CN101216629B (en) | Substrate assembly apparatus and substrate assembly method | |
| TWI438857B (en) | Surfacing type substrate transportation processing apparatus and surfacing type substrate transportation processing method | |
| CN100465716C (en) | Substrate assembling device and method | |
| JP2001005405A (en) | Method for assembling substrate and apparatus therefor | |
| JP2001166272A (en) | Method and device for assembling substrate | |
| JP2001005401A (en) | Method for assembling substrates and device therefor | |
| CN102455540B (en) | Apparatus for fabricating flexible liquid crystal display | |
| KR101179736B1 (en) | An Improved Floating Stage and A Substrate Floating Unit and A Coating Apparatus Having the Same | |
| CN107365972A (en) | Substrate supporting assembly, film-forming apparatus and method | |
| JP2015036739A (en) | Bonding device manufacturing device and bonding device manufacturing method | |
| JP4449923B2 (en) | Substrate assembly method and apparatus | |
| US20050092811A1 (en) | Bonding device for manufacturing liquid crystal display device | |
| JP3819797B2 (en) | Board assembly equipment | |
| KR100938192B1 (en) | Method of superposing and sealing a substrate | |
| JP2002323687A (en) | Method and device for assembling liquid crystal substrate | |
| CN102673939B (en) | Floating transportation device | |
| US7086175B2 (en) | Method of manufacturing liquid crystal panel and gap adjusting apparatus therefor | |
| JP2000104182A (en) | Wet etching method and device, production of vibration diaphragm of ink jet head, ink jet head and ink jet recording device | |
| JP4751659B2 (en) | Substrate bonding device | |
| CN207159344U (en) | Substrate supporting assembly, film-forming apparatus | |
| JP4389474B2 (en) | Board assembly method | |
| WO2019216060A1 (en) | Coating system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080903 Termination date: 20111228 |