KR20060076754A - Substrate assembling apparatus and assembling method - Google Patents

Abstract

In the present invention, at the time of bonding the upper and lower substrates 1a and 1b through the sealing agent 5, a gas discharge hole 3aa is formed in the upper stage 3a, and the discharge gas from the discharge hole 3aa is formed. It is comprised so that it may face inward of the line to which the sealing compound 5 was apply | coated. In the thin upper and lower substrates 1a and 1b bonded in a vacuum atmosphere, even when the connection between the sealing agent 5 and the upper substrate 1a is not performed properly in the press-in operation of the stage 3a, the sealing agent 5 By the deformation | transformation of the board | substrate by discharge gas according to), the sealing compound 5 is pressurized and pressed appropriately and it crushes. In addition, since the discharge gas press-fits the substrate surface inside the position of the sealant 5, the discharge gas enters the cell by turning around the substrate edge and avoids bubbles remaining on the display surface. Can be prepared.

Description

Substrate bonding apparatus and substrate bonding method {SUBSTRATE ASSEMBLING APPARATUS AND ASSEMBLING METHOD}

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view of a part of a cut away portion showing a conventional substrate bonding apparatus.

FIG. 2 is a cross-sectional view taken along the line A-A in FIG. 1. FIG.

FIG. 3 is an enlarged cross-sectional view of a main part schematically illustrated in order to explain the configuration of the substrate bonding apparatus shown in FIG. 1.

4 is a front view of a part of the cutout main part showing the first embodiment of the substrate bonding apparatus according to the present invention.

FIG. 5 is an enlarged cross-sectional view of an essential part schematically illustrated to explain the configuration of the substrate bonding apparatus shown in FIG. 4.

FIG. 6 is a cross-sectional view taken along the line A-A in FIG. 5. FIG.

FIG. 7 is an enlarged cross-sectional view of the main part after gas discharge in the configuration shown in FIG. 5. FIG.

FIG. 8 is an enlarged sectional view of principal parts schematically shown in order to explain the configuration of the second embodiment of the substrate bonding apparatus according to the present invention.

FIG. 9 is an enlarged cross-sectional view of a main part after gas discharge in the configuration shown in FIG. 8. FIG.

FIG. 10 is an enlarged cross-sectional view of a main part schematically showing the structure of the third embodiment of the substrate bonding apparatus according to the present invention. FIG.

FIG. 11 is an enlarged cross-sectional view of an essential part after gas discharge in the configuration shown in FIG. 10. FIG.

This invention relates to the improvement of the board | substrate bonding apparatus and board | substrate bonding method suitable for employ | adopting manufacture of a liquid crystal display panel.

Generally, the liquid crystal display panel employ | adopted for a display, such as a personal computer, a TV receiver, or various monitors, is bonded through the sealing agent apply | coated in frame shape so that a pair of thin glass substrates which oppose may surround a display surface. To be manufactured. Moreover, many spacers are provided in advance in the display surface of a board | substrate so that the space | interval (cell gap) between the joined board | substrates becomes constant.

Although a liquid crystal is enclosed and formed in the display surface between the board | substrates bonded together, a liquid crystal display panel has an injection system and a dropping system in sealing a liquid crystal to a display surface.

1 is a partial cutaway sectional view showing a conventional substrate bonding apparatus employed in the manufacture of a liquid crystal display panel by a liquid crystal dropping method, and FIG. 2 is an A-A perspective sectional view of FIG. 1.

Although the thin glass substrates 1a and 1b which form a pair of upper and lower rectangles are carried in the chamber 2 which consists of the upper and lower chambers 2a and 2b, as shown in FIG. The upper substrate 1a is adsorbed and held on the lower surface of the upper stage 3a, and the lower substrate 1b is configured to be placed on the upper surface of the lower stage 3b.

The spacer 4 is previously provided on the display surface of the lower substrate 1b, and the liquid crystal 6 is dropped, and the sealing compound 5 having bonding property is framed on the lower substrate 1b so as to surround the display surface. Is applied.

The upper stage 3a is connected to and held by the support shaft 7a of the XY-θ moving mechanism 7 at the center position, and the XY-θ moving mechanism 7 is mounted inside the upper chamber 2a. While being guided by the guide mechanism 8, it is comprised so that a movement to an up-down (arrow Z) direction is possible.

The motor 9 is provided on the upper chamber 2a, and the XY-θ moving mechanism 7 connected to the drive shaft 9a of the motor 9 is movable up and down by a ball screw mechanism of driving the motor 9. Is mounted.

The XY-θ moving mechanism 7 and the motor 9 are subjected to drive control by a controller (not shown), and the upper substrate 1a held in the upper stage 3a is XY-θ direction and up and down in the horizontal plane, respectively. Can be moved in a direction.

The lower stage 3b mounts and holds the lower substrate 1b, and the imaging camera for positioning the upper and lower substrates 1a and 1b in the lower chamber 2b in which the lower stage 3b is fixed. 10a and 10b are built in.

The image of the mark (alignment mark) for positioning of the board | substrate 1a, 1b surface by these imaging cameras 10a, 10b is supplied to the controller not shown, and the XY- (theta) movement mechanism 7 by a controller is provided. And by the drive control for the motor 9, relative positioning between the upper and lower substrates 1a and 1b based on a so-called pattern recognition method is possible.

Although not shown, the whole upper chamber 2a itself is comprised so that it can move up and down, and the chamber 2 was formed in the state which formed the closed space by connection with the lower chamber 2b by the fall of the upper chamber 2a. It is possible to return to atmospheric pressure by the pressure reduction by the exhaust in the chamber 2 by the exhaust pump (vacuum pump) not shown connected to the gas supply, and the gas supply from the inert gas supply tank.

When the chamber 2 forms a closed space, in order to ensure airtightness, the elastic member 11 is attached to the lower side of the upper chamber 2a and the guide mechanism 8 in close contact with the lower chamber 2b, respectively. .

1 and 2, the upper substrate 3a is press-fitted into the upper stage 3a from the outside by the plate member 12a along the sealing agent 5 coated in a frame shape. The pressurization mechanism 12 is mounted, and the lower chamber 2b is comprised so that it may move on the conveyance rail 13, and the lower chamber 2b is moved by the movement of the lower chamber 2b on the conveyance rail 13. It is possible to carry in the upper and lower board | substrates 1a and 1b before joining into the chamber 2, and to carry out the bonded board | substrate from the chamber 2 (JP-A-2003-241157).

In the board | substrate bonding apparatus of the said structure, after the high precision positioning between the upper and lower board | substrates 1a and 1b is performed, the bonding through the apply | coated sealing compound 5 is performed in a vacuum atmosphere.

In the case of joining through the sealing agent 5 in a vacuum atmosphere, when the upper and lower stages 3a and 3b face irregularities due to wrinkles or the like, the flatness can not be obtained by pressing the sealing agent sufficiently over the whole. There is. Therefore, in the said structure, the press mechanism 12 which press-fits the upper board | substrate 1a from the outer side by the plate member 12a is attached to the upper stage 3a, and the plate member 12a is carried out along the sealing agent 5 Is pressed to crush the sealing agent 5 between the bonded upper and lower substrates 1a and 1b prior to returning the inside of the chamber 2 to atmospheric pressure by pressing the upper substrate 1a.

As described above, in the conventional apparatus for bonding substrates shown in FIGS. 1 and 2, the pressing mechanism is applied in a vacuum atmosphere prior to returning the interior of the chamber 2 to atmospheric pressure and taking the bonded substrate out of the chamber 2. By pressurizing the upper substrate 1a by (12), the sealing agent 5 is pressed and crushed through the upper substrate 1a to obtain contact between the upper substrate 1a and the sealing agent 5.

However, there is also deflection with respect to the pressing surface of the rigid plate member 12a, and only by pressing the plate member 12a, the main substrate 1a is schematically enlarged as shown in FIG. 3. ) And the sealing compound 5 may generate | occur | produce, and the improvement may be desired.

Then, an object of this invention is to provide the board | substrate bonding apparatus and board | substrate bonding method which can perform the bonding between board | substrates by a sealing agent more favorably.

According to a first aspect of the present invention, a seal is applied to the at least one substrate in a frame shape by holding the upper substrate on the upper stage, placing the lower substrate bonded to the held upper substrate on the lower stage, and opposing the lower substrate. In the substrate bonding apparatus configured to bond the both substrates in a vacuum atmosphere, the at least one of the upper stage and the lower stage has a discharge hole that opens in response to the position of the sealing agent. The discharge hole is characterized in that the gas supplied from the gas supply source is discharged toward the position of the sealing agent.

According to a second aspect of the present invention, in a chamber, a substrate arranging step of holding an upper substrate on an upper stage and supporting a lower substrate on a lower stage, and performing alignment after at least one of the substrate surfaces In the joining step of joining the upper and lower substrates in a vacuum atmosphere through a sealant applied in a frame shape, and in the substrate joining method of returning the pressure in the chamber to atmospheric pressure after this step, and transporting the bonded substrates out of the chamber. Prior to returning the internal pressure to atmospheric pressure, a discharge is formed in at least one of the upper stage and the lower stage, and discharges gas toward the position of the sealing agent from a discharge hole opened along the sealing agent. It is characterized by having a process.

As mentioned above, according to the board | substrate bonding apparatus and the board | substrate bonding method of this invention, since gas is discharged along the sealing agent from the outer side surface with respect to two board | substrates joined together in the vacuum atmosphere through the sealing agent, a board | substrate is pressurized. Take it and transform it.

Therefore, even if the flatness of the pressing surface in the upper and lower stages pressurizing the substrate is not obtained on one side of the sealing agent applied in the form of a frame, the sealing agent is pressed and crushed due to the pressure deformation of the substrate by the discharge gas. Good contact with the substrate.

Thereby, since gas can enter the inside of the sealing compound apply | coated in frame shape, high quality joining is possible.

Hereinafter, an embodiment of a substrate bonding method and a substrate bonding apparatus according to the present invention will be described in detail with reference to FIGS. 4 to 9. 4-11, the same code | symbol is attached | subjected to the structure same as the conventional structure shown in FIGS. 1-3, and detailed description is abbreviate | omitted.

4 is a configuration diagram showing a first embodiment of a substrate bonding apparatus according to the present invention.

In FIG. 4, the thin glass substrates 1a and 1b which form a pair of upper and lower rectangles are in the chamber 2 which consists of upper and lower chambers 2a and 2b, and the upper substrate 1a is the upper stage 3a. The lower substrate 1b is placed on the upper surface of the lower stage 3b and held on the lower surface of the lower stage 3b.

A spacer 4 is provided in advance on the display surface of the lower substrate 1b, and an adhesive sealant 5 having adhesiveness is applied in a frame shape so as to surround the display surface, and the liquid crystal 6 is dropped on the display surface. do.

The upper stage 3a is connected to and held by the support shaft 7a of the XY-θ moving mechanism 7 at the center, and the XY-θ moving mechanism 7 is a guide mechanism (mounted in the upper chamber 2a). While being guided by 8), it can move to the up-down (arrow Z) direction which is a vertical direction.

In the upper stage 3a, discharge holes 3aa capable of discharging gas such as dry air or nitrogen gas are formed in the upper stage 3a surface from the lower surface of the stage 3a toward the lower stage 3b. .

FIG. 5 is an enlarged cross-sectional view of an essential part schematically illustrated in order to explain the configuration of the substrate bonding apparatus shown in FIG. 4, and FIG. 6 is an A-A perspective cross-sectional view of FIG. 5.

As shown in the sectional view of FIG. 6, the opening of the discharge hole 3aa is formed in a long slit shape in the application direction of the sealing agent 5.

Moreover, the discharge hole 3aa discharges so that a gas may be blown toward the site | part on the upper board | substrate 1a which becomes slightly inward of the application | coating position of the sealing compound 5 located between the upper and lower board | substrates 1a and 1b. The direction is formed by shifting the position inward of the sealing agent 5 (that is, toward the display surface side).

As shown in FIG. 4, the discharge hole 3aa formed in the upper stage 3a is connected to the gas supply source (air tank) 14 in which gas, such as an inert gas, was pressurized and stored through the piping 3ab.

The opening and closing valve 3ac is provided in the piping 3ab located outside the chamber 2, and the control of the opening / closing valve 3ac by the controller 15 controls the opening and closing of the gas discharged from the discharge hole 3aa. It is comprised so that discharge timing and its discharge amount can be controlled.

In addition, near the opening of the discharge hole 3aa, a vibration generator 16 such as an ultrasonic generator capable of imparting vibration to the gas discharged from the opening is provided. As described above, as the vibration generator 16 that imparts vibration to the flowing gas, for example, an ultrasonic generator described in JP-A-11-319741 can be adopted.

In addition, the XY-θ moving mechanism 7 is connected to the drive shaft 9a of the motor 9 and is driven by drive control of the XY-θ moving mechanism 7 and the motor 9 by the controller 15. The upper substrate 1a can be moved in the XY-θ direction and the vertical direction in the horizontal plane.

The lower stage 3b is fixed on the lower chamber 2b of a plate shape like the conventional one, and the imaging camera for positioning the upper and lower substrates 1a and 1b in the lower chamber 2b. 10a and 10b are built in.

The image of the mark (alignment mark) for positioning of the surface of the board | substrate 1a, 1b image | photographed through the lower stage 3b by the imaging cameras 10a and 10b is supplied to the controller 15, and the pattern recognition method is carried out. The relative positioning between the upper and lower substrates 1a and 1b is possible by the detection of the mark position based on and the drive control of the XY-θ moving mechanism 7 and the motor 9 based on the detected mark position. Do.

In addition, as in the prior art, the upper chamber 2a itself including the motor 9 is configured to be movable up and down entirely, and the upper chamber 2a is lowered and connected to the lower chamber 2b to form a closed space. In the closed state, the inside of the chamber 2 is opened by a reduced pressure in the chamber 2 by a vacuum pump (not shown) connected to the chamber 2, and a gas supply from an inert gas supply tank in which nitrogen gas or the like is stored. Can be returned to atmospheric pressure. Moreover, this inert gas supply tank can also serve as the gas supply source 14 mentioned above.

The operation of the substrate bonding apparatus according to the first embodiment of the above configuration will be described.

First, the upper substrate 1a is loaded into the chamber 2, and the upper substrate 1a is held by the lower surface of the upper stage 3a by suction.

Next, the lower substrate in which the spacer 4 is provided on the display surface in advance and the sealing agent 5 is applied so as to surround the display surface, and the liquid crystal 6 is dripped in the area surrounded by the sealing agent 5 ( 1b) is placed on the lower stage 3b and carried in the chamber 2.

Next, after the upper chamber 2a descends to form a closed space, the inside of the chamber 2 is exhausted, and then the upper stage 3a descends, and the upper substrate 1a and the lower substrate 1b are lowered. The upper and lower substrates 1a and 1b are bonded through the sealing agent 5 in a vacuum atmosphere through the alignment of the.

After the upper and lower substrates 1a and 1b are positioned and the bonding through the sealing agent 5 is performed, the suction holding of the upper substrate 1a in the upper stage 3a is released.

Simultaneously with the release of the suction holding of the upper substrate 1a, the controller 15 opens and closes the valve 3ac, so that gases such as inert gas from the gas supply source 14 pass through the pipe 3ab, and the upper stage 3a. Is supplied to the discharge hole 3aa formed in FIG. Gas, such as an inert gas discharged from the opening part of the discharge hole 3aa, has the inside of the position where the sealing compound 5 of the upper board | substrate 1a of the bonding board | substrate 1a, 1b was apply | coated, as shown in FIG. Is discharged toward.

The inert gas discharged from the opening of the discharge hole 3aa collides with the upper surface of the upper substrate 1a as shown by the arrow in FIG. 7, and crosses the application line of the sealing agent 5 along the upper surface. Direction).

The discharge hole 3aa is formed so as to discharge gas along the sealing agent 5 coated in a frame shape and toward the inner position thereof, and the gas discharged from the discharge hole 3aa is thin and bonded substrate 1a. ), The upper substrate 1a is deformed, and the upper substrate 1a is pushed downward (in the direction of the lower substrate 1b).

As a result, there is a gap between the sealing agent 5 and the upper substrate 1a, or there is a poor contact between the sealing agent 5 and the upper substrate 1a or a failure to press the sealing agent 5 to crush it. Although there existed, as shown in FIG. 7, since the upper board | substrate 1a is press-fitted toward the sealing compound 5 by discharge gas, the upper board | substrate 1a is crimped | bonded by the sealing agent 5, and the sealing agent ( Good contact with 5).

Thereafter, gas is supplied into the chamber 2 from an inert gas supply tank (not shown) connected to the chamber 2 to return the inside of the chamber 2 to atmospheric pressure.

When the inside of the chamber 2 returns to atmospheric pressure, the upper stage 3a and the upper chamber 2a are raised, and the bonded substrates 1a and 1b (liquid crystal cell) are carried out.

Thus, with respect to the upper and lower substrates 1a and 1b mounted on the lower stage 3b and bonded in the chamber 2, the pressure is based on the internal and external pressure difference by returning the inside of the chamber 2 to atmospheric pressure. In the initial stage, the upper substrate 1a is pressed onto the sealant 5 by substrate press-fitting by the gas discharged from the discharge hole 3aa by opening control of the opening / closing valve 3ac by the controller 15. do. Thereby, the sealing compound 5 can join the upper and lower board | substrates 1a and 1b, pressing well in all the areas and being crushed.

Therefore, as shown in FIG. 5, even when the contact between the upper substrate 1a and the sealing agent 5 is insufficient due to the lack of flatness between the upper and lower stages 3a and 3b, the upper substrate 1a By blowing out the gas from the discharge hole 3aa and pressurizing it with respect to), as shown in Fig. 7, good contact (bonding) is obtained.

Further, according to this embodiment, the ejection gas collides from the ejection hole 3aa toward the inner position where the sealant 5 is applied on the upper substrate 1a, so that the ejection gas is at the edge of the upper substrate 1a. It is suppressed to enter into the inside (in the area | region enclosed by the sealing compound 5) from between the sealing compound 5 and the upper board | substrate 1a.

That is, the gas discharged from the discharge hole diffuses into the chamber. At this time, in order for the diffused gas to reach between the sealing agent 5 and the substrate 1a, the upper substrate 1a is hit by the upper substrate 3a and the upper substrate 1a through the gap between the upper stage 3a and the upper substrate 1a. It flows to the edge of 1a, and passes through the same path | route which flows between the upper and lower board | substrates 1a and 1b by turning the edge of the upper board | substrate 1a. Therefore, the longer the path length, the more time is required until the gas discharged from the discharge hole 3aa reaches between the sealing agent 5 and the substrate 1a.

As in the embodiment, by disposing the discharge hole 3aa inside the sealing agent so that the gas discharged from the discharge hole 3aa collides with the inner side position of the sealing agent 5 in the upper substrate 1a, the discharge hole is discharged. The gas discharged from the discharge hole 3aa until the gas discharged from the discharge hole 3aa reaches between the sealing agent 5 and the substrate 1a while press-fitting the upper substrate 1a into the sealing agent 5 by the gas discharged from 3aa. The path length can be made as long as possible, and the time required for the gas discharged from the discharge hole 3aa to reach between the sealing agent 5 and the substrate 1a can be made as long as possible. Therefore, it becomes possible to press-fit the upper board | substrate 1a to the sealing compound 5 by the gas discharged from the discharge hole 3aa for such a long time. Thereby, while the gas discharged from the discharge hole 3aa reaches | attains between the sealing agent 5 and the board | substrate 1a, the contact of the upper board | substrate 1a and the sealing agent 5 becomes more reliable. It is possible to perform high quality bonding in which gas is prevented from entering the sealing agent 5 inside, and it is possible to manufacture a liquid crystal display panel having good display quality.

In addition, since the gas flow discharged from the discharge hole 3aa becomes a vibration gas flow by the vibration generator 16 attached to the discharge hole 3aa, the collision force by the ultrasonic vibration also falls on the upper substrate 1a surface. By acting, the press-fitting into the sealing agent 5 of the upper substrate 1a can be performed efficiently and effectively.

In addition, when returning the inside of the chamber 2 to atmospheric pressure, first, gas is discharged from the discharge hole 3aa, and thereafter, gas is injected into the chamber 2 from an inert gas supply tank (not shown) connected to the chamber 2. When supplying gas from an inert gas supply tank (not shown), the sealing agent 5 is in good contact with the upper substrate 1a in the entire area by the gas discharged from the discharge hole 3aa. The gas can be prevented from entering the inner side (in the region surrounded by the sealant 5) past the upper substrate 1a and the sealant from the inert gas supply tank.

In addition, since press-fitting of the upper board | substrate 1a with respect to the sealing compound 5 is made to collide with discharge gas to the upper board | substrate 1a, you may only form the discharge hole 3aa in the upper stage 3a, By attaching the means for press-fitting the substrate 1a to the sealant 5 to the upper stage 3a, the structure of the upper stage 3a can be prevented from becoming complicated.

Moreover, after forming the discharge hole 3aa in the upper stage 3a, and holding the upper substrate 1a by the upper stage 3a, the sealing agent apply | coated the upper substrate 1a to the lower substrate 1b. The upper substrate 1a was continuously adsorbed and held in the upper stage 3a until it was bonded through (5) and ejected the discharge gas toward the upper substrate 1a. Therefore, since the position of the upper substrate 1a can be fixed until the gas discharged from the discharge hole 3aa is blown onto the upper substrate 1a, the upper substrate 1a and the lower substrate until the discharge gas is ejected. The position shift between (1b) can be prevented as much as possible. That is, until the discharge gas is blown out, there is a possibility that a portion with insufficient contact may exist between the sealing agent 5 and the upper substrate 1a, and thus the gap between the sealing agent 5 and the upper substrate 1a. It is thought that position shift | offset | difference tends to generate | occur | produce rather than the state with which favorable contact was obtained. Therefore, as described above, by fixing the position of the upper substrate 1a until the ejection gas is ejected to the upper substrate 1a, such position shift can be prevented.

In addition, since the discharge hole 3aa is formed in the upper stage 3a, the gas discharged from the discharge hole 3aa can be ejected from the position as close as possible to the upper substrate 1a. Therefore, the gas discharged from the discharge hole 3aa can be ejected effectively to the upper substrate 1a. Therefore, it is possible to more reliably prevent the gas from entering the inside of the sealing agent 5.

From this, the substrate bonding is performed more accurately by the operation of returning the inside of the chamber 2 to the atmospheric pressure following the ejection of the gas by the discharge hole 3aa, so that the upper substrate 1a and the sealing agent 5 adhere closely. The deterioration of the display function due to the mixing of bubbles can be avoided.

8 is an enlarged sectional view of principal parts schematically illustrated for explaining a second embodiment of the substrate bonding apparatus according to the present invention. This second embodiment is different in structure from the opening of the discharge hole 3aa as compared with the first embodiment, and the other configuration is the same as that of the first embodiment.

In the board | substrate bonding apparatus which concerns on 2nd Example, the opening width is enlarged in the discharge hole 3aa of the upper stage 3a, and the opening part of the discharge hole 3aa of the large opening width is shown in FIG. It is comprised by accommodating elastic members 3ad, such as a sponge or rubber, in the inside.

Therefore, when gas is discharged from the discharge hole 3aa toward the upper substrate 1a surface, the elastic member 3ad is extruded to the upper substrate 1a surface and press-fits the upper substrate 1a. As shown in the figure, good contact (adhesion) is obtained between the upper substrate 1a and the sealing agent 5.

In addition, after the inside of the chamber 2 returns to atmospheric pressure, the elastic member 3ad is led into the opening part of the discharge hole 3aa by generating underpressure in the discharge hole 3aa. The elastic member 3ad drawn into the opening is held in the opening by the contact resistance between the side wall surface of the elastic member 3ad itself and the side wall surface of the opening of the discharge hole 3aa, and even after the negative pressure is released. Stay in the opening. That is, in the second embodiment, the discharge hole 3aa can be selectively connected to the gas supply source 14 and a negative pressure source (not shown).

Moreover, also in this 2nd Example, since the gas discharged | emitted from the discharge hole 3aa press-fits the upper substrate 1a surface inside inner side of the application | coating line of the sealing compound 5 via the elastic member 3ad, As in the first embodiment, the gas ejected from between the discharge hole 3aa and the elastic member 3ad enters the edge of the upper substrate 1a to enter the gap between the sealing agent 5 and the upper substrate 1a. Entry from the inside to the inside (display surface) is suppressed.

Moreover, since the elastic member 3ad needs to be able to press-fit the upper substrate 1a surface by the discharge gas, for example, there are many air holes in the shape of a sponge, and the upper substrate is expanded by the discharge gas. The surface (1a) may be press-fitted.

In addition, in the second embodiment, the elastic member 3ad has been described as an example in which the elastic member 3ad is drawn into the opening of the discharge hole 3aa by the negative pressure, but the present invention is not limited thereto. By biasing in the direction of drawing into the opening, and supplying gas from the gas supply source 14, the elastic member 3ad protrudes from an opening part against resistive forces, such as a spring, and the gas from the gas supply source 14 When the supply of water is stopped, it may be made to be introduced into the opening by a bias force such as a spring.

FIG. 10 is an enlarged sectional view of principal parts schematically illustrated for explaining the third embodiment of the substrate bonding apparatus according to the present invention. FIG. This third embodiment is different in structure from the opening of the discharge hole 3aa in comparison with the first embodiment, and the other configuration is the same as that of the first embodiment, and therefore only the difference will be described.

As shown in FIG. 10, the board | substrate bonding apparatus which concerns on 3rd Example is comprised by mounting elastic member 3ae, such as rubber | gum which has elasticity and airtightness, in the discharge hole 3aa of the upper stage 3a. do.

Therefore, when gas is supplied to the discharge hole 3aa, the elastic member 3ae swells due to its airtightness and elasticity, and projects toward the upper substrate 1a as shown in FIG. As a result, since the upper substrate 1a is press-fitted toward the sealing agent 5 by the protruding elastic member 3ae, good contact (adhesion) is obtained between the upper substrate 1a and the sealing agent 5. .

Thus, in this 3rd Example, after press-fitting the upper board | substrate 1a toward the sealing compound 5 by the elastic member 3ae, gas is supplied into the chamber 2 from the inert gas supply tank which is not shown in figure. do. For this reason, when supplying gas into the chamber 2 from an inert gas supply tank, since the favorable contact is obtained between the upper board | substrate 1a and the sealing compound 5 by the elastic member 3ae, from an inert gas supply tank, The gas which has emerged can be prevented from entering the inner side (in the region surrounded by the sealant 5) past between the upper substrate 1a and the sealant 5. Therefore, the same effect as in the first embodiment can be obtained.

In addition, since the gas supplied to the discharge hole 3aa is not discharged into the chamber 2 because of the structure of inflating the elastic member 3ae, the pressure of the gas supplied to the discharge hole 3aa is changed to the upper substrate 1a. ) Can be efficiently operated at the position corresponding to the sealing agent 5 (in this embodiment, the position inside the sealing agent 5), so that the upper substrate 1a is more reliably attached to the sealing agent 5 Press contact can be made.

In addition, in this third embodiment, when the pressure in the discharge hole 3aa is higher than the pressure in the chamber 2 in a state in which the chamber 2 is depressurized, such as when the upper and lower substrates 1a and 1b are bonded together, Since the elastic member 3ae protrudes toward the upper substrate 1a due to the pressure difference, when it is not necessary to protrude the elastic member 3ae, the pressure in the discharge hole 3aa is equal to the pressure in the chamber 2. The same pressure can be set.

For example, when the switching valve which selectively connects the discharge hole 3aa to the piping 3ab and the space in the chamber 2 is provided, and when it is not necessary to protrude the elastic member 3ae, the switching valve is provided with a chamber. (2) Switch to the inner space side to make the discharge hole 3aa the same pressure as the space in the chamber 2, and when switching the elastic member 3ae, the switching valve is switched to the pipe 3ab side to discharge the discharge hole 3aa. What is necessary is just to supply gas to the gas from the gas supply source 14.

In each of the above-described embodiments, the discharge holes 3aa are formed on the upper stage 3a side, but the gas discharge holes may be formed on the lower stage 3b side below, and the upper and lower stages 3a and 3b are provided. It is provided in both sides, and a gas is discharged toward the inside along the sealing agent 5, and deformation | transformation of a board | substrate and crushing of the sealing agent 5 generate | occur | produce the board | substrate 1a and the board | substrate (through the sealing agent 5). The bonding of 1b) may be performed.

In addition, in the board | substrate bonding apparatus in each Example of the said description, although the sealing agent 5, the liquid crystal 6, and the spacer 4 were demonstrated to be provided in the lower board | substrate 1b side, these sealing agents It goes without saying that the liquid crystal 6 and the spacer 4 can be arbitrarily and selectively provided on any one or both of the upper and lower substrates 1a and 1b, and the like.

In each of the above embodiments, the upper and lower substrates 1a and 1b have been described as having one display surface. However, even if it is a so-called multi-sided substrate, the substrate on which the sealing agent 5 is applied along the edge of the substrate is applied. If you can apply.

In this case, the discharge holes may be formed in accordance with the coating patterns of the plurality of sealing agents applied to one substrate.

Further, the discharge hole may be formed along the sealing agent applied to the outer circumferential side (edge side of the substrate) of the coating patterns of the plurality of sealing agents applied to one substrate. That is, the gas tends to be harder to enter into the sealing agent from between the sealing agent and the substrate as the distance from the edge of the substrate to the sealing agent becomes longer. This is because the longer the distance from the edge of the substrate to the sealing agent is, the longer the time required until the gas discharged from the discharge hole reaches the sealing agent. The longer the time until the gas reaches the sealing agent means that the bonded substrate receives a longer pressing force due to the pressure difference between the inside and the outside, whereby the substrate until the gas discharged from the discharge hole reaches the sealing compound. It is because and a sealing agent contact favorably. Therefore, when discharging the gas from the discharge hole, if the discharge hole is formed so as to eject the gas along the portion of the sealing agent located on the outer circumferential side (edge side of the substrate) which is most likely to enter the inside of the sealing agent, Even if the ejection gas is not ejected along the sealing agent located on the inner side, the gas can be prevented from entering the inside of the sealing agent.

Moreover, when the size of the board | substrate hold | maintained or mounted in the stage 3a, 3b differs according to manufacture lot etc., the discharge hole 3aa of the shape corresponding to the size of the board | substrate is formed previously in the stage 3a, etc. The same effect can be obtained by selectively switching between the piping 3ab and the gas supply source 14 which permeate each different discharge hole according to the magnitude | size of the bonding substrate 1a, 1b.

As explained above, according to the board | substrate bonding apparatus of each said Example, before the operation | movement which returns the inside of the chamber 2 to air | atmosphere, to the outer surface corresponding to the application | coating position of the sealing agent 5 of the two board | substrates joined together. When the sealing agent 5 is pressed and crushed by the substrate deformation by gas blowing, favorable bonding is performed, and even if an operation etc. which return the inside of the chamber to atmospheric pressure are performed subsequently, mixing of bubbles into the cell can be avoided. have.

In each of the above embodiments, the gas is supplied to the discharge hole as a gas supply source, and the gas is supplied from the inert gas supply tank (not shown) into the chamber 2, but the gas supply source and the inert gas supply tank are in the atmosphere. It is possible to switch to open (communication with atmospheric pressure).

That is, when gas is supplied from the gas supply source to the discharge hole, or when gas is supplied from the inert gas supply tank into the chamber, the chamber is under a reduced pressure atmosphere. Because it can supply.

Incidentally, in the first embodiment, an example in which the opening of the discharge hole 3a is formed in the slit shape is described, but instead of the slit shape, the plurality of holes may be arranged.

In addition, although it demonstrated as an example which blows gas toward the inner part of the sealing compound in a board | substrate, you may make it blow out a gas toward the position on the sealing compound in a board | substrate. In this case, since the gas discharged from the discharge hole press-fits the board | substrate on a sealing compound toward a sealing compound, a sealing agent can be pressed effectively and it can be crushed.

In addition, in the second and third embodiments, as in the first embodiment, a vibration generator may be formed in the discharge hole to provide ultrasonic vibration to the gas to be supplied.

Such a configuration provides a substrate bonding apparatus and a substrate bonding method capable of better bonding between substrates with a sealing agent.

Claims (5)

The upper substrate is held on the upper stage, the lower substrate bonded to the retained upper substrate is placed on the lower stage to face each other, and both substrates are connected to each other by a sealing agent applied in at least one substrate in a frame shape. In the substrate bonding apparatus configured to bond in a vacuum atmosphere, At least one of the upper stage and the lower stage includes a discharge hole that opens in correspondence with the position of the sealing agent, And the discharge hole is formed so as to discharge the gas supplied from the gas supply source toward the position of the sealing agent between the upper and lower stages. The board | substrate bonding apparatus of Claim 1 in which the opening part of the said discharge hole was formed in the elongate slit shape along the said sealing compound. The board | substrate bonding apparatus of Claim 1 or 2 in which the opening part of the said discharge hole accommodated the elastic member which can protrude from an opening surface in response to the pressing force by discharge gas. The substrate bonding apparatus of Claim 1 provided with the vibration generator which gives a vibration to the gas supplied from the said gas supply source between the opening part of the said discharge hole and the said gas supply source. In the chamber, a substrate arranging step of holding the upper substrate on the upper stage and supporting the lower substrate on the lower stage, and positioning after the step, and a sealing compound applied in a frame shape to at least one substrate surface In the joining process of joining the said up-and-down board | substrate in a vacuum atmosphere via this, and the board | substrate joining method of returning the pressure in the said chamber to atmospheric pressure after this process, and carrying out the joined board | substrate from inside a chamber, Prior to returning the pressure in the chamber to atmospheric pressure, gas is discharged toward a position of the sealing agent from a discharge hole formed in at least one of the upper stage and the lower stage and opened along the sealing agent. It has a discharge process, The board | substrate bonding method characterized by the above-mentioned.

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