CN104552628A - Expander, breaking apparatus and dividing method - Google Patents
Expander, breaking apparatus and dividing method Download PDFInfo
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- CN104552628A CN104552628A CN201410309070.5A CN201410309070A CN104552628A CN 104552628 A CN104552628 A CN 104552628A CN 201410309070 A CN201410309070 A CN 201410309070A CN 104552628 A CN104552628 A CN 104552628A
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- base plate
- composite base
- expander
- brisement
- line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to an expander, a breaking apparatus and a dividing method. According to the object, a surface is provided with function areas and a substrate is coated by a resin layer so that a composite substrate is formed and each function area is divided. An expander (30) includes a plurality of expanding rods (32a-32n), the plurality of expanding rods (32a-32n) are formed on a flat-plate-shaped substrate (31) with fixed intervals and regards a ridge as the plane in a stripped manner, and the cross section of the expanding rods is arc. When the resin layer (12) of the composite substrate (10) is broken, the expanding rods (32a-32n) press along breaking lines, and cracks develop. In this way, a plurality of chips including the function areas can be divided.
Description
Technical field
The present invention relates to a kind of expander of the composite base plate for disrumpent feelings coating resin layer etc. on the brittle substrate such as semiconductor substrate, ceramic substrate, disrumpent feelings device and method for dividing.
Background technology
Semiconductor chip is by manufacturing forming element area on the semiconductor wafer in the boundary position disjunction of described element area.In the past, when wafer is divided be broken into chip, by cutter sweep, cutting blade is rotated, thus by cut semiconductor wafer is cut off less.
But; when using cutter sweep, water must being had to discharge because cutting the discharge chip produced, in order to not make this water or discharge chip, harmful effect being produced to the performance of semiconductor chip; front and back step must be had to implement protection to semiconductor chip, and wash water or discharge chip.Therefore, become complicated in steps, shortcoming cost cannot cut down or shorten process time.In addition, because using cutting blade to cut, so the problems such as film stripping or defect can be produced.In addition, in MEMS (Micro-Electro-Mechanical Systems, the MEMS) substrate with milli machine structure, structure destruction can be caused because of the surface tension of water, so water can not be used, thus produce the problem cannot being carried out disjunction by cutting.
In addition, in patent document 1,2, propose a kind of substrate brisement device, by the semiconductor wafer forming line, from the back side forming line one side, along ruling its brisement perpendicular to the pressing of this face.Below, the summary of the brisement utilizing this kind of brisement device is shown.The semiconductor wafer becoming brisement object is formed multiple functional area neatly arrangedly.When carrying out disjunction, first, on the semiconductor wafer, longitudinally and laterally line is formed at equal intervals the spaced apart of functional area.Then, brisement device is utilized to carry out disjunction along this line.Fig. 1 (a) is placed in the sectional view of the semiconductor wafer of brisement device before representing disjunction.As shown in this figure, composite base plate 101 forms functional area 101a, 101b, between functional area 101a, 101b, form line S1, S2, S3....When carrying out disjunction, attaching adhesive tape 102 at the back side of composite base plate 101, attaching diaphragm 103 in its front.Then, when brisement, as shown in Fig. 1 (b), configuring the line of answering brisement in the middle of supporting cutter 105,106, is line S2 in this case, makes blade 104 aim at line decline in portion from it, thus pressing composite base plate 101.In this way, the three-point bending of a pair supporting cutter 105,106 and blade 104 is utilized to carry out brisement.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 2004-39931 publication
[patent document 2] Japanese Patent Laid-Open 2010-149495 publication
Summary of the invention
[inventing the problem that will solve]
In the brisement device with this kind of formation, when being pressed toward pressing down by blade 104 when in brisement, composite base plate 101 meeting warpage a little, therefore, stress can concentrate on the part of the edge contact of composite base plate 101 and supporting cutter 105,106.Therefore, if the part of the supporting cutter of brisement device 105,106 touches functional area 101a, 101b as shown in Fig. 1 (a), so power can be applied to functional area when brisement.Therefore, the problem of the functional area that may damage on semiconductor wafer is had.
In addition, as the substrate using brisement device to carry out disjunction, the composite base plate of silicone-coating on ceramic substrate is had.In this kind of composite base plate, after by ceramic substrate brisement, directly utilize brisement rod pressing resin bed, in the case, there is resin bed distortion and be easy to the problem that sustains damage.In addition, if want to use laser to carry out disjunction to solve described problem, so existence can sustain damage because of the heat affecting of laser, or after irradiation laser, splash is attached to the problem of periphery.
The present invention is conceived to this kind of problem and completes, and its object is to can be disrumpent feelings with no damage by the composite base plate of brisement by brittle substrate.
[technological means of dealing with problems]
In order to solve this problem, expander of the present invention uses when disjunction composite base plate, described composite base plate has coating resin on the brittle substrate of longitudinally and transversely multiple functional areas of proper alignment at a mask, and form brisement line with functional area each described in disjunction at described brittle substrate; And this expander comprises: flat substrate; And banded multiple expansion rod, described flat substrate forms; Each crestal line of described each expansion rod forms same plane, and has the interval of the integral multiple of more than 2 of the spacing of the functional area of described composite base plate.
In order to solve this problem, disrumpent feelings device of the present invention is by disrumpent feelings device disrumpent feelings for the resin bed of composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and forms brisement line with functional area described in disjunction at described brittle substrate; Described disrumpent feelings device comprises: workbench; Elastic supporting plate, is configured on described workbench, and the face forming brisement line is kept described composite base plate as upper surface; Expander, the banded multiple expansion rods comprising flat substrate and be integrally formed on the substrate, each crestal line of described each expansion rod forms same plane, and has the interval of the integral multiple of more than 2 of the spacing of the functional area of described composite base plate; Travel mechanism, makes described workbench move along its face; And elevating mechanism, keep described composite base plate and expansion rod abreast, while make described expander be elevated towards the face of the composite base plate on described elastic supporting plate.
In order to solve this problem, method for dividing of the present invention is by the method for dividing of composite base plate disjunction, described composite base plate has coating resin on the brittle substrate of longitudinally and transversely multiple functional areas of proper alignment at a mask, and form brisement line with functional area each described in disjunction; And the mode becoming upper surface with brittle substrate on elastic supporting plate configures described composite base plate, by making the expansion of described expander rod correspond to lower end along the line of brisement toward pressing down described expander, and resin bed is disrumpent feelings.
In order to solve this problem, method for dividing of the present invention is by the method for dividing of composite base plate disjunction, described composite base plate has coating resin on the brittle substrate of longitudinally and transversely multiple functional areas of proper alignment at a mask, and form brisement line with functional area each described in disjunction; And the mode becoming upper surface with brittle substrate on elastic supporting plate configures described composite base plate, by making the described expansion rod of described expander correspond to lower end along the line of brisement toward pressing down described expander, the disrumpent feelings resin bed that proceeds to is made to carry out disrumpent feelings, the amount of the spacing of described functional area is equivalent to by making the position of described composite base plate move, and again toward pressing down described expander, and resin bed is disrumpent feelings.
Herein, the lower end section of the expansion rod of described expander can be formed as arc-shaped.
[effect of invention]
According to the present invention with this kind of feature, be configured at by composite base plate on elastic supporting plate, the mode corresponding to brisement line with the line bottom of banded expansion rod carries out position alignment, thus carries out disrumpent feelings.Therefore, can obtain and can not damage functional area and along brisement line by effect disrumpent feelings for resin bed.
Accompanying drawing explanation
The sectional view of state when Fig. 1 (a), (b) are the semiconductor wafer brisements represented in the past.
Fig. 2 (a), (b) are the front view becoming the substrate of disjunction object and the side view of embodiments of the present invention.
Fig. 3 is the stereogram of an example of the disrumpent feelings device of the resin bed representing present embodiment.
Fig. 4 is the stereogram of an example of the expander representing present embodiment.
Fig. 5 is the stereogram of the elastic supporting plate used when disrumpent feelings representing embodiments of the present invention.
Fig. 6 (a) ~ (d) is the skeleton diagram of the breaking course of the composite base plate representing this embodiment.
Fig. 7 (a) ~ (c) is the skeleton diagram of the breaking course of the resin bed representing this embodiment.
Fig. 8 (a) ~ (c) is the skeleton diagram of the breaking course of the resin bed representing this embodiment.
Detailed description of the invention
Next, embodiments of the present invention are described.Fig. 2 shows OBL front view and the side view forming the composite base plate 10 of semiconductor element of the example as this kind of substrate.In this embodiment, the composite base plate 10 becoming disjunction object is set to the composite base plate 10 of coating resin layer, such as silicones 12 on ceramic substrate 11.Herein, the disjunction of the only ceramic substrate 11 of composite base plate 10 makes delineation vertically extend to substrate and disposable disjunction, therefore this disjunction is expressed as " brisement ", and the disjunction of silicone layer 12 makes the be full of cracks of resin bed expand gradually by applying power and splits, therefore this disjunction is expressed as " disrumpent feelings ".In addition, the disjunction of composite base plate 10 entirety is expressed as " disjunction ".In the manufacturing step of composite base plate 10, along being parallel to x-axis, the line of y-axis is that clathrate forms multiple functional area 13 with uniform distances in length and breadth neatly arrangedly.This functional area 13 is such as set to the MEMS functional area that group has entered LED (Light-Emitting Diode, light emitting diode) or mechanical constituent part, sensor, actuator etc.And, making semiconductor chip to carry out disjunction for each functional area, as shown in some chain lines, longitudinal equally spaced line being set to delineation preset lines S
y1~ S
yn, transversely equally spaced line is set to delineation preset lines S
x1~ S
xm, the part of functional area is positioned at the foursquare central authorities surrounded by these delineation preset lines.In addition, composite base plate 10 can be square and also can be rectangle, is set to rectangle in fig. 2, but cancellate functional area is square, about the quantity of delineation preset lines, makes the delineation preset lines S in y direction
y1~ S
ynthan the delineation preset lines S in x direction
x1~ S
xmmany.
Next, the disrumpent feelings device 20 for disrumpent feelings resin bed of this embodiment is described.As shown in Figure 3, disrumpent feelings device 20 comprises the workbench 21 that can move towards y direction and rotate.In disrumpent feelings device 20, arrange travel mechanism in the below of workbench 21, described travel mechanism makes workbench 21 move in the y-axis direction along its face, and workbench 21 is rotated along its face.And, workbench 21 becomes across following elastic supporting plate 40 mounting the composite base plate 10 of disjunction object.On the top of workbench 21, the horizontal affixation member 22 of U-shaped is set, remains servomotor 23 on the top of horizontal affixation member 22.Directly be connected to ball screw 24 at the rotating shaft of servomotor 23, the lower end of ball screw 24 is supported by another horizontal affixation member 25, and makes ball screw 24 rotatable.Upper mobile member 26 possesses the box thread 27 screwed togather with ball screw 24 at central portion, possess back shaft 28a, 28b downward from the both ends of described upper mobile member 26.A pair through hole of the through horizontal affixation member 25 of back shaft 28a, 28b and be linked to lower mobile member 29.At the lower surface of lower mobile member 29, with the face of workbench 21, following expander 30 is installed abreast.Thus, when making ball screw 24 rotate by servomotor 23, upper mobile member 26 is integrated with lower mobile member 29 one-tenth and moves up and down, and expander 30 also moves up and down simultaneously.Herein, servomotor 23 forms with horizontal affixation member 22,25 and upper and lower mobile member 26,29 elevating mechanism that expander 30 is elevated.
Next, the expander 30 used when disrumpent feelings is described.Such as, shown in the stereogram of Fig. 4, expander 30 forms multiple parallel excellent 32a ~ 32n of banded expansion side by side in plane substrate 31.These all crestal lines that respectively expansion is excellent form a plane.In addition, if the interval of expansion rod be fixing and for the interval of delineating preset lines more than 2 integral multiple, be set to 2 times in the present embodiment.And, as long as the cross section of each expansion rod along the shape of the protuberance of brisement line pressing, then can be not particularly limited for having, but be preferably set to the bending arc-shaped of stock as described below.In addition, few one of the quantity of line more on the number ratio composite base plate that expansion is excellent.In addition, in the diagram, in order to clearly represent the excellent 32a ~ 32n of expansion, make expansion rod 32a ~ 32n become upper surface and represent, but be that the mode making expansion rod 32a ~ 32n become below is installed on lower mobile member 29 in use.
In the present embodiment, elastic supporting plate 40 is used when the resin bed of disrumpent feelings composite base plate 10.As shown in the perspective view of fig. 5, elastic supporting plate 40 is rubber accessories of rectangular flat board, and its size is identical with composite base plate 10, and such as thickness is set to a few millimeter.
Next, the method for disjunction composite base plate 10 is described.Fig. 6 is the part that the figure representing breaking course, Fig. 6 (a) represent composite base plate 10.First, as shown in Fig. 6 (b), using the face of ceramic substrate 11 as upper surface, by not shown chalker, stitch marker 50 is moved, delineate along delineation preset lines.Thus as shown in Fig. 2 (a), form the line S in x direction
x1~ S
xm, y direction line S
y1~ S
yn.
Next, in the brisement step of ceramic substrate 11, as shown in Fig. 6 (c), first make composite base plate 10 overturn.Then, not shown brisement device is used, directly over the line making brisement rod 51 be positioned to have been formed, by brisement rod 51 is only made ceramic substrate 11 brisement toward pressing down.
Thus, become only ceramic substrate 11 along line S
x1~ S
xm, S
y1~ S
ynthe state of brisement.Fig. 6 (d) represents the part along the composite base plate 10 after each line brisement in x direction and y direction.In addition, rule S
x1~ S
xm, S
y1~ S
ynall by brisement, therefore hereinafter referred to brisement line B
x1~ B
xm, B
y1~ B
yn.
Next, as shown in Figure 7, the method terminating the disjunction of composite base plate 10 to making the brisement line being formed at ceramic substrate 11 also extend to silicone layer is described.Fig. 7 is that the figure of the fracture representing resin bed 12, Fig. 7 (a) represent composite base plate 10 and elastic supporting plate 40 and the part expanding rod 30.First, the workbench 21 of described disrumpent feelings device 20 configures elastic supporting plate 40, and then configure composite base plate 10 at the upper surface of elastic supporting plate 40.Now, as shown in Fig. 7 (a), configure silicone layer 12 in the mode being connected to elastic supporting plate 40, make the face of ceramic substrate 11 be upper surface.Then, split disconnection manner with the crestal line aligning of the foot of the expansion of this expander 30 rod such as 32b, 32c, 32d to position.So, other expansion rods also become directly over brisement line every 1.
Next, drive servomotor 23, mobile member 26 and lower mobile member 29 are declined simultaneously, and the expansion of expander 30 rod is declined on one side gradually relative to workbench 21 keeping parallelism.Then, as shown in Fig. 7 (b), excellent 32b, 32c, 32d ... will be expanded from brisement line B
xi+1, B
xi+3, B
xi+5... directly over press ceramic substrate 11.So, as shown in Fig. 7 (c), ceramic substrate 11 is out of shape by the pressing of each expansion rod, and sinks and make elastic supporting plate 40 similarly be deformed into V shape.Now, the left and right of ceramic substrate is out of shape, therefore, it is possible to make be full of cracks extend to below along brisement line equably along with the press-in of each expansion rod.Herein, the cross sectional shape of the below of expansion rod is not particularly limited, but when such as triangle, carries out accurately the necessity of the location of summit alignment brisement line is uprised relatively.Therefore, in order to make ceramic substrate 11, silicones 12 is out of shape in this way evenly, and the cross section of the below of each expansion rod is set to arc-shaped.Thus, the permissible range of the precision of the location of the crestal line of expansion rod alignment brisement line is made relatively to broaden.And, by making expansion rod sufficient decent, the be full of cracks progress in resin and left and right is applied to the power pushed open, thus terminate disrumpent feelings.If disrumpent feelings end, servomotor 23 is so made to reverse and make expander 30 increase.
Now, form multiple expansion rod side by side at expander 30, and it is spaced apart the twice of line, therefore can makes expansion rod every one along multiple brisement line brisement simultaneously silicones 12.
Then, as shown in Figure 8, make workbench 21 in the y-axis direction movement be equivalent to the amount of the spacing of brisement line.Then as shown in Fig. 8 (b), (c), make expander 30 decline, thus also can for other adjacent brisement line B
xi, B
xi+2, B
xi+4... terminate the disrumpent feelings of resin bed.Herein, owing to expanding the twice being spaced apart the spacing of line of rod, therefore undertaken by making workbench 21 offset once disrumpent feelingsly just can terminating the disrumpent feelings of all x-axis directions of composite base plate 10.In addition, when expand rod be spaced apart three times of the spacing of line, undertaken by making workbench 21 move twice disrumpent feelingsly just can terminating the disrumpent feelings of all x-axis directions.
Then, make workbench 21 half-twist, the brisement line for y-axis makes expander 30 decline similarly, thus resin bed is disrumpent feelings.Then, make workbench 21 in the y-axis direction movement be equivalent to the amount of the spacing of brisement line, similarly make expander 30 decline.So, terminate whole disrumpent feelings, tear the functional area of resin and disjunction square shape along each brisement line, thus multiple MEMS chip can be formed.
In addition, in this embodiment, as the substrate becoming substrate, ceramic substrate is illustrated, but the present invention also goes for the various brittle substrate such as semiconductor substrate or glass substrate.
In addition, in this embodiment, as the resin coating ceramic substrate, silicones is illustrated, but also can be other various materials layer, such as to layers such as the Polarizers of glass substrate lamination.
[industrial utilizability]
The present invention delineating the brittle substrate with the region that should protect during disjunction, can not damage the region that should protect and carrying out disrumpent feelings, therefore, effectively can be applicable to the disrumpent feelings device of the substrate forming functional area.
[explanation of symbol]
10 composite base plates
11 ceramic substrates
12 silicones
13 functional areas
20 disrumpent feelings devices
21 workbench
22,25 horizontal affixation member
23 servomotors
24 ball screws
26,29 mobile members
30 expanders
31 substrates
32a ~ 32n expands rod
40 elastic supporting plates
Claims (8)
1. an expander, it uses when disjunction composite base plate, described composite base plate has coating resin on the brittle substrate of longitudinally and transversely multiple functional areas of proper alignment at a mask, and form brisement line with functional area each described in disjunction at described brittle substrate; Described expander comprises:
Flat substrate; And
Banded multiple expansion rod, described flat substrate forms; And
Each crestal line of described each expansion rod forms same plane, and has the interval of the integral multiple of more than 2 of the spacing of the functional area of described composite base plate.
2. expander according to claim 1, the cross section of the lower end of wherein said expansion rod is formed as arc-shaped.
3. a disrumpent feelings device, the resin bed of it is disrumpent feelings composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and forms brisement line with functional area described in disjunction at described brittle substrate; Described disrumpent feelings device comprises:
Workbench;
Elastic supporting plate, is configured on described workbench, and the face forming brisement line is kept described composite base plate as upper surface;
Expander, the banded multiple expansion rods comprising flat substrate and be integrally formed on the substrate, each crestal line of described each expansion rod forms same plane, and has the interval of the integral multiple of more than 2 of the spacing of the functional area of described composite base plate;
Travel mechanism, makes described workbench move along its face; And
Elevating mechanism, keeps described composite base plate and expansion rod, abreast while make described expander be elevated towards the face of the composite base plate on described elastic supporting plate.
4. disrumpent feelings device according to claim 3, the lower end section of the expansion rod of wherein said expander is formed as arc-shaped.
5. a method for dividing, its disjunction composite base plate, described composite base plate has coating resin on the brittle substrate of longitudinally and transversely multiple functional areas of proper alignment at a mask, and form brisement line with functional area each described in disjunction; And
On elastic supporting plate, the mode becoming upper surface with brittle substrate configures described composite base plate,
By making the expansion of expander according to claim 1 rod correspond to lower end along the line of brisement toward pressing down described expander, and resin bed is disrumpent feelings.
6. method for dividing according to claim 5, the lower end section of the expansion rod of wherein said expander is formed as arc-shaped.
7. a method for dividing, its disjunction composite base plate, described composite base plate has coating resin on the brittle substrate of longitudinally and transversely multiple functional areas of proper alignment at a mask, and form brisement line with functional area each described in disjunction; And
On elastic supporting plate, the mode becoming upper surface with brittle substrate configures described composite base plate,
Toward pressing down described expander, the disrumpent feelings resin bed that proceeds to is made to carry out disrumpent feelings by making the expansion of expander according to claim 1 rod correspond to lower end along the line of brisement,
The amount of the spacing of described functional area is equivalent to by making the position of described composite base plate move, and again toward pressing down described expander, and resin bed is disrumpent feelings.
8. method for dividing according to claim 7, the lower end section of the expansion rod of wherein said expander is formed as arc-shaped.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013215395A JP6119550B2 (en) | 2013-10-16 | 2013-10-16 | Expander, breaking device and cutting method |
| JP2013-215395 | 2013-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104552628A true CN104552628A (en) | 2015-04-29 |
| CN104552628B CN104552628B (en) | 2017-11-10 |
Family
ID=53011031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410309070.5A Expired - Fee Related CN104552628B (en) | 2013-10-16 | 2014-07-01 | Expander, disrumpent feelings device and method for dividing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6119550B2 (en) |
| KR (1) | KR20150044368A (en) |
| CN (1) | CN104552628B (en) |
| TW (1) | TWI620634B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552614A (en) * | 2013-10-25 | 2015-04-29 | 三星钻石工业股份有限公司 | Cutting method and device of substrate made of fragile material |
| CN109927185A (en) * | 2017-12-15 | 2019-06-25 | 三星钻石工业股份有限公司 | Substrate breaking apparatus |
| CN111263974A (en) * | 2017-10-27 | 2020-06-09 | 三星钻石工业股份有限公司 | Breaking method of substrate with metal film |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017001180A (en) * | 2016-09-29 | 2017-01-05 | 三星ダイヤモンド工業株式会社 | Surface layer fracturing apparatus of brittle material substrate |
| JP6862045B2 (en) * | 2017-01-13 | 2021-04-21 | 株式会社ディスコ | Processing method |
| JP7157301B2 (en) * | 2017-11-06 | 2022-10-20 | 株式会社東京精密 | Wafer processing method |
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| CN1741879A (en) * | 2002-11-22 | 2006-03-01 | 三星钻石工业股份有限公司 | Method for dividing substrate and method for manufacturing substrate using such method |
| CN101426741A (en) * | 2006-04-28 | 2009-05-06 | 坂东机工株式会社 | Glass sheet cutting method and glass sheet cutting machine |
| CN101596719A (en) * | 2002-11-22 | 2009-12-09 | 三星钻石工业股份有限公司 | Substrate-cutting system |
| JP2011060822A (en) * | 2009-09-07 | 2011-03-24 | Mitsubishi Electric Corp | Method and device for separating semiconductor element |
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- 2013-10-16 JP JP2013215395A patent/JP6119550B2/en active Active
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- 2014-06-17 KR KR20140073641A patent/KR20150044368A/en not_active Application Discontinuation
- 2014-06-23 TW TW103121611A patent/TWI620634B/en not_active IP Right Cessation
- 2014-07-01 CN CN201410309070.5A patent/CN104552628B/en not_active Expired - Fee Related
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| JPH11162887A (en) * | 1997-12-02 | 1999-06-18 | Tokyo Seimitsu Co Ltd | Work cutting method in dicing equipment |
| JP2002151443A (en) * | 2000-11-08 | 2002-05-24 | Victor Co Of Japan Ltd | Device for cleaving semiconductor element |
| JP2004119901A (en) * | 2002-09-27 | 2004-04-15 | Sumitomo Electric Ind Ltd | Cleaving apparatus and method |
| CN1741879A (en) * | 2002-11-22 | 2006-03-01 | 三星钻石工业股份有限公司 | Method for dividing substrate and method for manufacturing substrate using such method |
| CN101596719A (en) * | 2002-11-22 | 2009-12-09 | 三星钻石工业股份有限公司 | Substrate-cutting system |
| CN101426741A (en) * | 2006-04-28 | 2009-05-06 | 坂东机工株式会社 | Glass sheet cutting method and glass sheet cutting machine |
| JP2011060822A (en) * | 2009-09-07 | 2011-03-24 | Mitsubishi Electric Corp | Method and device for separating semiconductor element |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552614A (en) * | 2013-10-25 | 2015-04-29 | 三星钻石工业股份有限公司 | Cutting method and device of substrate made of fragile material |
| CN104552614B (en) * | 2013-10-25 | 2018-02-02 | 三星钻石工业股份有限公司 | The cutting-off method and shearing device of brittle substrate |
| CN111263974A (en) * | 2017-10-27 | 2020-06-09 | 三星钻石工业股份有限公司 | Breaking method of substrate with metal film |
| CN109927185A (en) * | 2017-12-15 | 2019-06-25 | 三星钻石工业股份有限公司 | Substrate breaking apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150044368A (en) | 2015-04-24 |
| JP2015079825A (en) | 2015-04-23 |
| CN104552628B (en) | 2017-11-10 |
| TW201515800A (en) | 2015-05-01 |
| TWI620634B (en) | 2018-04-11 |
| JP6119550B2 (en) | 2017-04-26 |
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