JP2021102810A - Rotation drive device, film deposition device comprising the same, and method for producing electronic device - Google Patents

Abstract

To enable the positional adjustment (alignment) of a substrate in a reverse chamber.SOLUTION: A rotation drive device in the present invention has a carrier mounting part for mounting thereon a carried body carrier having a holding face for holding a carried body, a rotation mechanism that rotates the carrier mounting part, and an alignment mechanism for adjusting a relative positional relation between the carried body carrier and the carried body mounted on the carried body carrier in a direction parallel to the holding face. The alignment mechanism has a stage part that is provided in the carrier mounting part and is movable in the direction parallel to the holding face.SELECTED DRAWING: Figure 2

Description

The present invention relates to a rotation driving device used to rotate a substrate in a film forming apparatus for forming a film on the substrate.

In the manufacture of an organic EL display device (organic EL display), when the organic light emitting element (organic EL element; OLED) constituting the organic EL display device is formed, the vapor deposition material evaporated from the evaporation source of the film forming apparatus is used. An organic layer or a metal layer is formed by forming a film on a substrate through a mask on which a pixel pattern is formed.

Such a film forming apparatus or a film forming system including the film forming apparatus includes a so-called cluster type and an in-line type.

In the cluster-type film formation system, a plurality of film forming chambers for forming a film on a substrate are arranged in a cluster around a transport chamber in which a transfer robot is provided, and the substrate is sequentially conveyed to each film formation chamber by the transfer robot. By forming a film, a plurality of layers of films constituting the organic light emitting element are formed.

On the other hand, in an in-line type film forming system, a transfer carrier on which a film forming substrate is mounted is conveyed to a plurality of film forming chambers arranged in a line by a roller type or a magnetic levitation type transfer mechanism to form a film. To.

The in-line type film forming system has a first transport path including a loading section in which the substrate is carried in, a film forming section in which the film is formed on the substrate mounted on the transport carrier, and an unloading section in which the substrate is carried out. doing. The in-line film forming system has a second transport path for collecting empty transport carriers.

In the in-line film forming system, the substrate is carried into the loading portion of the first transport path from the outside of the film forming system. The carried-in substrate is placed by a robot on the upper surface of an empty transport carrier from the second transport path with the film-forming surface facing upward. The transport carrier attracts and holds the substrate. The substrate held by the transport carrier is turned upside down together with the transport carrier, and is transported to the film-forming portion with the film-forming surface facing downward. In the film forming section, the film forming source is arranged at the lower part of the substrate, and the film is formed while the substrate is conveyed through the mask fixedly arranged on the film forming section.

After the film formation is completed, the transport carrier transported to the unloading chamber is inverted again and transported to the second transport path with the film formation surface of the substrate facing upward. The transport carrier that has moved to the second transport path releases the holding of the substrate. Subsequently, only the substrate is conveyed to the discharge chamber by the carry-out robot, and is carried out to the outside of the film forming system. The empty transport carrier that has released the holding of the substrate is transported along the second transport path, returns to the position corresponding to the loading portion of the first transport path, and is used for holding a new substrate.

Patent Document 1 (Korea Public Utility Model No. 20-2019-000162) discloses a configuration in which a substrate is held by a transfer carrier and then the transfer carrier is inverted in an inversion chamber of an in-line film formation system. ..

Korea Public Utility Model No. 20-2019-000162

In the configuration in which the substrate is placed on the transfer carrier and sucked in the reversing chamber, the position where the substrate deviates from the reference position on the transfer carrier due to the transfer error of the transfer robot that transfers the substrate to the substrate mounting surface of the transfer carrier. May be placed in.

However, Patent Document 1 does not disclose an alignment mechanism for adjusting the position of the substrate when the substrate is placed at a position where the transfer carrier is displaced due to such a transfer error of the substrate.

Further, when an alignment mechanism for adjusting the mounting position of the substrate is installed in the reversing chamber, the alignment mechanism must be configured to be capable of reversing the transport carrier, whereby the reversing chamber including the alignment mechanism is provided. The configuration of can be complicated.

An object of the present invention is to provide a rotary drive device capable of adjusting the position (alignment) of a substrate in a reversing chamber, a film forming apparatus including the rotary drive device, and a method for manufacturing an electronic device.

The rotation drive device according to the first aspect of the present invention includes a carrier mounting portion on which a carrier to be transported having a holding surface for holding the transported body is mounted, a rotation mechanism for rotating the carrier mounting portion, and the above. The carrier is provided with an alignment mechanism for adjusting the relative position of the carrier to be transported and the body to be transported mounted on the carrier to be transported in a direction parallel to the holding surface, and the alignment mechanism is mounted on the carrier. It is characterized by having a stage portion provided in the placement portion and movable in a direction parallel to the holding surface.

According to the present invention, it is possible to adjust the position (alignment) of the substrate in the reversing chamber.

FIG. 1 is a conceptual diagram showing a film forming apparatus of an organic EL display apparatus. FIG. 2A is a schematic cross-sectional view of a rotary drive device according to an embodiment of the present invention, and FIG. 2B is a schematic top view of the rotary drive device. FIG. 3 is a drawing showing a substrate alignment operation by the rotary drive device according to the embodiment of the present invention. FIG. 4 is a drawing showing a substrate reversal processing operation by the rotary drive device according to the embodiment of the present invention. FIG. 5 is a drawing showing an additional loading operation of the substrate by the rotary drive device according to the embodiment of the present invention. FIG. 6 is a schematic view showing an electronic device.

A preferred embodiment of the present invention will be described below with reference to the drawings. However, the dimensions, materials, shapes and their relative arrangements of the components described below, or the hardware configuration and software configuration of the device, the processing flow, the manufacturing conditions, etc., are the configurations of the device to which the invention is applied and various types. It can be changed as appropriate depending on the conditions, and it is not intended to limit the scope of the present invention to the embodiments described below. In principle, the same components are given the same reference numbers, and the description thereof will be omitted.

The present invention is suitable for a film forming apparatus that deposits a film on a film forming object by evaporation, and typically deposits an organic material and / or a metallic material or the like on a substrate in order to manufacture an organic EL panel. It can be applied to a film forming apparatus for manufacturing an electronic device for forming a film. The material of the substrate to be the film-forming object may be any material that can be chucked, and in addition to glass, a polymer material such as a film, metal, or silicon can be selected. The substrate may be, for example, a substrate or a silicon wafer in which a film such as polyimide is laminated on a glass substrate. As the film-forming material, a metallic material (metal, metal oxide, etc.) or the like may be selected in addition to the organic material.
<Overall configuration of film forming equipment>
FIG. 1 is a conceptual diagram showing the overall configuration of the film forming apparatus 100 of the organic EL display apparatus. Generally, the film forming apparatus 100 includes a film forming process transport path 100a and a return transport path 100b, and collects the mask M and the transport carrier C between the film forming process transport path 100a and the return transport path 100b. A circulation type transport path is configured by including the mask recovery transport path 100c, the carrier recovery transport path 100d, the mask supply transport path 100e, and the carrier supply transport path 100f for supplying.

The film forming apparatus 100 includes each component constituting the circulation type transport path, for example, a substrate carry-in / reversing chamber 101, an alignment chamber 103, a film forming chamber 105, a mask separation chamber 107, and a substrate discharging / reversing chamber 109.

In the film forming apparatus 100 according to the present embodiment, the substrate G is carried in the transport direction (arrow A) from the outside of the film forming apparatus, the substrate G and the mask M are positioned and held on the transport carrier C, and the transport carrier C is Film-forming process After the film-forming process is performed on the substrate G while moving 100a on the transport path, the film-forming substrate G is discharged. In the return transport path 100b, the mask M separated from the transport carrier C after the film formation process is completed and the empty transport carrier C after the film-forming substrate G is discharged are transported to the substrate carry-in position.

Hereinafter, the operation and processing of the components included in the film forming apparatus 100 will be described in more detail with reference to FIG.

In the film forming process transfer path 100a of the film forming apparatus 100, the substrate G is carried into the substrate loading / inverting chamber 101 from the outside of the film forming apparatus, held on the transport carrier C, and turned upside down (front and back inversion) together with the transport carrier C. ).

That is, the substrate G is carried into the substrate carry-in / reversing chamber 101 on the film forming process transport path 100a from the external substrate stocker (not shown), and the predetermined substrate G is carried on the empty transport carrier C which has been carried in earlier. At the holding position, the board is chucked by a substrate chucking means (for example, an electrostatic chuck or an adhesive chuck). At this time, the transport carrier C is in a posture in which the substrate holding surface or the substrate chucking surface is upward. The substrate G is carried into the upper side of the substrate chucking surface by a transfer robot (not shown) and placed on the substrate chucking surface.

The transport carrier C holding the substrate G is upside down (upside down) by the rotation drive device 200 (see FIG. 2) of the substrate carry-in / reversing chamber 101. For example, the rotation drive device 200 rotates the transport carrier C holding the substrate G by 180 degrees about the traveling direction (A). As a result, the transfer carrier C and the substrate G are turned upside down, the substrate G is on the lower side of the chucking surface of the transfer carrier C, and the film-forming surface of the substrate G faces downward.

The rotation drive device 200 according to an embodiment of the present invention is an alignment mechanism for adjusting the position where the substrate G is placed on the transport carrier C before the substrate G carried into the substrate carry-in / reversing chamber 101 is inverted. including.

The inverted transfer carrier C is conveyed to the alignment chamber 103 by roller transfer or magnetic levitation transfer method, and its relative position with respect to the mask M is adjusted.

In the alignment chamber 103, the transport carrier 302 is maintained with the substrate G held by the substrate chucking means downward.

The mask M carried into the alignment chamber 103 by a route different from the transport carrier C (mask supply transport path 100e) is placed on a mask tray (not shown) installed below the transport carrier C. The mask M approaches the substrate G held by the transport carrier C by raising the mask tray, and when a predetermined proximity distance (measurement position) is reached, an alignment operation is performed on the substrate G and the mask M.

In the alignment operation, the alignment camera images the alignment marks formed in advance on the substrate G and the mask M, and measures the amount and direction of the misalignment between the two.

Based on the measured displacement amount and direction, the position adjustment (alignment) is performed by moving the position of the transfer carrier C by the transfer drive system (for example, magnetic levitation transfer system) of the transfer carrier C. When the relative positional deviation between the substrate G and the mask M falls within a predetermined threshold value, the mask M is attracted by the magnetic force applying means (not shown) installed in the transport carrier C and held by the transport carrier C.

The transport carrier C, which has been aligned and discharged from the alignment chamber 103, is carried into the film forming chamber 105.

In the film forming chamber 105, the organic EL light emitting material is evaporated from the evaporation source arranged in the lower part of the film forming chamber 105 while moving the transport carrier C holding the substrate G and the mask M at a predetermined speed to evaporate the organic EL light emitting material to the upper substrate G. Vacuum film is formed. In the present embodiment, the configuration in which the mask M is transported while being held together with the substrate G by the transport carrier C to perform the film forming process will be described, but the present invention is not limited to this, and the mask M is placed in each film forming chamber. It may be installed.

The transport carrier C discharged from the film forming chamber 105 after the film forming process is transported to the mask separation chamber 107, and the mask M is separated downward from the transport carrier C. The mask M separated from the transport carrier C is transported from the mask separation chamber 107 to the return transport path 100b along the mask recovery transport path 100c.

Then, when the empty transport carrier C after discharging the substrate, which will be described later, moves to the mask receiving position on the return transport path 100b, the mask M is held again by the magnetic force applying means of the transport carrier C. The transport carrier C holding only the mask M in this way is transported to the mask supply transport path 100e along the return transport path 100b.

On the other hand, the transport carrier C from which the mask M is separated in the mask separation chamber 107 moves to the substrate reversal / discharge chamber 109 while holding only the substrate G. In the substrate reversal / discharge chamber 109, a rotation drive device (not shown) rotates the transport carrier C by 180 degrees about the traveling direction. As a result, the film-forming surface of the substrate G faces upward. In the present embodiment, the rotation drive device in the substrate reversing / discharging chamber 109 does not include an alignment mechanism unlike the rotation driving device 200 in the substrate loading / reversing chamber 101.

Subsequently, the substrate G is unchucked from the transport carrier C, and the substrate G is transported to the next step by a discharge mechanism (not shown).

The transport carrier C, which has been emptied by discharging the substrate G in the substrate reversal / discharge chamber 109, is transported along the carrier recovery transport path 100d to the start point position of the return transport path 100b.

The empty transport carrier C is transported to the substrate carry-in / reversing chamber 101 along the return transport path 100b. At this time, the empty transport carrier C receives the mask M transported from the mask recovery transport path 100c to the return transport path 100b as described above.

The transport carrier C transported along the return transport path 100b is separated from the mask M again by the mask supply transport path 100e, and the separated mask M is transported to the mask mounting position on the film forming process transport path 100a. To.

The empty transport carrier C after the mask M is separated in the carrier supply transport path 100f is transported from the return transport path 100b to the substrate carry-in and reversal positions at the start point position of the film forming process transport path 100a.

As a result, the film forming apparatus 100 according to the embodiment of the present invention forms a circulation type transport path.

<Rotating drive device for board loading / reversing chamber>
FIG. 2A is a schematic cross-sectional view of the rotary drive device 200 installed in the substrate loading / reversing chamber 101 according to the embodiment of the present invention, and FIG. 2B is a schematic view of the upper surface of the rotary drive device 200. is there.

The rotation drive device 200 according to an embodiment of the present invention includes a carrier mounting base (carrier mounting portion) 201 on which the transport carrier C is mounted, and a rotation mechanism 203 for rotating the carrier mounting base 201 and turning it upside down. Includes an alignment mechanism 205 for adjusting the relative positions of the carrier mounting table 201 and the substrate G.

On the carrier mounting table 201, an empty transport carrier C carried into the substrate carry-in / reversing chamber 101 along the carrier supply transport path 100f is placed. As shown in FIG. 2A, the carrier mounting table 201 according to the present embodiment can mount the transport carrier C on two opposing main surfaces of the carrier mounting table 201. That is, the carrier mounting table 201 has a first carrier mounting surface 201a and a second carrier mounting surface 201b.

The carrier mounting table 201 has carrier fixing means (not shown) for fixing the transport carrier C to the first carrier mounting surface 201a and the second carrier mounting surface 201b, respectively. Carrier fixing means (first carrier fixing means and second carrier fixing means) installed on both mounting surfaces of the carrier mounting table 201 can include, for example, clamping means.

With such a configuration, after the transport carrier C mounted and fixed on the first carrier mounting surface 201a of the carrier mounting table 201 is inverted (the first carrier mounting surface 201a faces downward). Therefore, the second carrier mounting surface 201b faces upward), and a new transport carrier C is mounted on the second carrier mounting surface 201b without returning the carrier mounting table 201 to its original position again. Can be placed. Thereby, the process time (Takt time) can be shortened.

The rotation mechanism 203 is a mechanism that rotates the carrier mounting table 201 by 180 degrees and turns it upside down. The rotation mechanism 203 of the rotation drive device 200 according to the present embodiment includes a support portion 213 that supports the central portions of two opposite side surfaces of the carrier mounting table 201 and a rotation drive portion (not shown) that applies a rotation drive force.

The alignment mechanism 205 is a mechanism for adjusting the mounting position of the substrate G chucked by the substrate chucking means on the transport carrier C before the carrier mounting table 201 is turned upside down.

The substrate G as the object to be transported is carried into the substrate loading / reversing chamber 101 from an external substrate stocker by a transport robot, and is brought onto the first carrier mounting surface 201a or the second carrier mounting surface 201b of the carrier mounting table 201. It is mounted on the chucking surface of the mounted transport carrier C. However, due to the transfer error of the transfer robot, the substrate G cannot be placed at the reference position on the chucking surface of the transfer carrier C, and may be placed at a position deviated from the reference position.

According to one embodiment of the present invention, the substrate carry-in / reversing chamber 101 is provided with an alignment mechanism 205 capable of adjusting the mounting position of the substrate G relative to the reference position on the chucking surface of the transport carrier C. Therefore, the position of the substrate G displaced due to the transport error can be adjusted, and the accuracy of the film forming process can be improved.

Therefore, the alignment mechanism 205 has a substrate receiving portion 221 that temporarily receives the substrate G and a substrate receiving portion 221 in a direction parallel to the chucking surface (board holding surface) (for example, a first direction parallel to the chucking surface). , A stage for moving in at least one of the second direction parallel to the chucking surface and intersecting the first direction and the rotation direction centered on the third direction perpendicular to the chucking surface). A unit 223 and a camera unit 225 for imaging an alignment mark formed on the substrate G and the transport carrier C are included.

The board receiving unit 221 is a pin-shaped member for temporarily receiving the board G carried into the board carrying / reversing chamber 101 from the hand of the transfer robot, and is mounted on the first carrier mounting surface 201a or the second carrier. It is installed so as to be movable in the direction (third direction) perpendicular to the surface 201b or the chucking surface (board holding surface) of the transport carrier C (for example, in FIG. 2A, it can be raised and lowered in the Z direction). To. The receiving unit driving unit for raising and lowering the substrate receiving unit 221 is mounted on the stage unit 223 and includes a servomotor and a ball screw, or a linear guide, as described later.

When receiving the substrate G, the substrate receiving unit 221 rises in the + Z direction through the through hole 250 installed in the transport carrier C, protrudes from the chucking surface of the transport carrier C, and receives the substrate G from the transport robot. Subsequently, the relative positions of the substrate G mounted on the substrate receiving unit 221 and the transport carrier C are adjusted in a direction parallel to the chucking surface (board holding surface) of the transport carrier C. When the position adjustment is completed, the substrate receiving unit 221 descends in the −Z direction to lower the substrate G onto the chucking surface of the transport carrier C.

Similarly, when the transport carrier C is mounted on the second carrier mounting surface 201b (that is, when the carrier mounting table 201 is inverted), the substrate receiving unit 221 also uses the second carrier mounting surface 201b. It moves to the side, projects onto the chucking surface of the transport carrier C mounted on the second carrier mounting surface 201b, and receives the substrate G.

As described above, the substrate receiving unit 221 of the present embodiment has a chuck of the transport carrier C mounted on each mounting surface in the direction perpendicular to the first carrier mounting surface 201a and the second carrier mounting surface 201b. By making it possible to project from the king surface, the configuration of the substrate receiving unit 221 can be simplified.

The substrate receiving unit 221 is installed so as to support a plurality of locations on the substrate G. For example, as shown in FIG. 2B, the substrate receiving portion 221 is a peripheral portion of the first carrier mounting surface 201a or the second carrier mounting surface 201b (thus, the peripheral edge of the chucking surface of the transport carrier C). A plurality of portions or a peripheral portion of the substrate G) are provided.

As a result, the enlarged substrate G can be supported more stably. Further, if the peripheral edge portion of the substrate G is supported by a plurality of substrate receiving portions 221s, the central portion of the substrate G bends downward due to its own weight, and as the substrate receiving portion 221 descends, it becomes a chucking surface of the transport carrier C. Since the central portion to the peripheral portion of the substrate G are sequentially touched, it is possible to suppress the occurrence of wrinkles on the substrate G during chucking by the substrate chucking means.

However, the present invention is not limited to this, and the substrate receiving portion 221 may be provided at a position where the central portion of the substrate G can be supported in order to reduce the deflection of the substrate G. This is because the substrate G placed on the transport carrier C in the substrate carry-in / reversing chamber 101 has a film-forming surface facing upward, and the substrate receiving portion 221 supports the opposite side surface of the substrate G that is not the film-forming surface. Because.

Further, the substrate receiving unit 221 may be configured so as to be able to sequentially descend from one long side side of the substrate G toward the other long side side facing the substrate G. That is, the plurality of substrate receiving units 221 may be configured to be able to move up and down independently.

As shown in FIG. 2B, the transport carrier C as the carrier to be transported used in the film forming apparatus 100 according to the embodiment of the present invention has a peripheral portion of a chucking surface so that the substrate receiving portion 221 can be inserted therethrough. It has a plurality of through holes 250 installed in. The through hole 250 has a chucking surface (board holding surface) of the transport carrier C so that the substrate receiving portion 221 can be moved when the position of the substrate G mounted on the substrate receiving portion 221 is adjusted with respect to the transport carrier C. ) Or in the radial direction of the through hole 250 so as to have a diameter larger than the cross-sectional diameter of the substrate receiving portion 221.

The stage portion 223 of the alignment mechanism 205 centers the substrate G supported by the substrate receiving portion 221 in directions parallel to the chucking surface of the transport carrier C with respect to the transport carrier C (X direction, Y direction, and Z axis). It is a member for moving in at least one direction (also referred to as XYθ direction) in the direction of rotation. Therefore, the stage unit 223 includes, for example, a stage plate (not shown), two servomotors (not shown) and a ball screw (not shown) for moving the stage plate in the + X direction and the −X direction, respectively, and + Y. Includes two servomotors (not shown) and a ball screw (not shown) for movement in the directional and -Y directions, respectively. On the stage plate of the stage unit 223, a substrate receiving unit 221 and a receiving unit driving unit (not shown) for driving the substrate receiving unit 221 in the Z direction are mounted.

By moving the stage plate in the XYθ direction by the servomotor and the ball screw, the substrate receiving portion 221 mounted on the stage plate and the substrate G supported by the substrate receiving portion 221 are moved in the XYθ direction relative to the transport carrier C. The relative positions of the substrate G and the transport carrier C can be adjusted.

In particular, according to the present embodiment, the stage portion 223 of the alignment mechanism 205 is installed in the carrier mounting table 201. As a result, in the rotary drive device 200 that performs the upside-down processing of the transport carrier C, the alignment mechanism that adjusts the relative position between the substrate G and the transport carrier C is not complicated.

The conventional alignment mechanism usually has a structure in which a stage portion is provided on the outside of the chamber, the substrate holder for holding the substrate and the stage portion are connected by a shaft, and the driving force of the stage portion is transmitted to the substrate holder. However, when the alignment mechanism of the conventional configuration is applied to the substrate carry-in / reversing chamber 101 in which the transport carrier C is inverted, the alignment mechanism becomes very complicated.

In the present embodiment, the stage portion 223 of the alignment mechanism 205 is installed in the carrier mounting table 201 instead of outside the substrate loading / reversing chamber 101, so that the carrier mounting table 201 can be inverted even in a simple configuration. An alignment mechanism can be realized.

The camera unit 225 is an optical means for capturing an alignment mark between the substrate G and the transport carrier C. The camera unit 225 takes an image of the alignment mark of the substrate G supported by the substrate receiving unit 221 and the alignment mark of the transport carrier C, and based on this (for example, by image processing or the like), the substrate G is the transport carrier C. Measure the amount and direction of deviation from the reference position on the chucking surface.

When the substrate G deviates from the reference position of the transport carrier C by a predetermined threshold value or more, the stage portion 223 on which the substrate receiving unit 221 is mounted is driven in the XYθ direction based on the deviation amount, thereby causing the substrate G to deviate from the reference position. The relative position of the transport carrier C is adjusted.

As shown in FIG. 2A, the camera unit 225 is installed on the outside of the upper surface of the housing 280 of the substrate carry-in / reversing chamber 101. A transparent window is provided in the portion of the housing 280 corresponding to the position of the camera unit 225, and the camera unit 225 can image the alignment mark between the substrate G and the transport carrier C in the housing 280. However, the present invention is not limited to this, and the camera unit 225 may be installed on the outside of the bottom surface of the housing 280.

<Board loading / reversing process>
FIG. 3 shows a substrate loading and alignment operation by the rotary drive device 200 according to the embodiment of the present invention.

As shown in FIG. 3A, the empty transport carrier C is carried into the substrate loading / reversing chamber 101 and mounted on the carrier mounting table 201, for example, the first carrier mounting surface 201a.

When the transport carrier C is mounted on the first carrier mounting surface 201a, the substrate receiving unit 221 moves to the first carrier mounting surface 201a side by the receiving unit driving unit as shown in FIG. 3B. (For example, ascending), it protrudes from the chucking surface of the transport carrier C through the through hole 250 of the transport carrier C. At this time, the height at which the substrate receiving portion 221 protrudes is such that the hand of the conveying robot does not interfere with the chucking surface of the conveying carrier C when the substrate G is placed on the substrate receiving portion 221. preferable.

The substrate G as the object to be transported is carried into the substrate carry-in / reversing chamber 101 by a transfer robot from an external stocker and placed on the board receiving unit 221. At this time, the substrate G is placed on the substrate receiving unit 221 so that the film-forming surface faces upward.

Subsequently, as shown in FIG. 3C, the substrate receiving portion 221 is lowered, and the distance between the substrate G supported by the substrate receiving portion 221 and the chucking surface of the transport carrier C becomes a predetermined measurement distance. Then, the camera unit 225 takes an image of the alignment mark between the substrate G and the transport carrier C, and based on this, measures the relative positional deviation amount and the deviation direction in the XYθ direction. However, the present invention is not limited to this, and the deviation of the relative position may be measured at the height at which the substrate G is received without lowering the substrate receiving portion 221. That is, the height at which the substrate receiving unit 221 receives the substrate G may be the measured height.

When the relative misalignment amount is larger than a predetermined threshold value, the stage portion 223 of the alignment mechanism 205 is moved based on the measured relative misalignment and the displacement direction, and the substrate receiving portion 221 mounted on the stage plate of the stage portion 223 is moved. Adjusts the position of the substrate G with respect to the transport carrier C by moving the substrate G. This process is repeated until the relative positional deviation between the substrate G and the transport carrier C falls within a predetermined threshold value.

When the relative positional deviation between the substrate G and the transport carrier C falls within a predetermined threshold value, the substrate receiving portion 221 is lowered as shown in FIG. 3D, and the substrate G is brought onto the chucking surface of the transport carrier C. It is placed and chucked by the substrate chucking means of the transport carrier C. In order to more reliably prevent the substrate G and the transport carrier C from being separated in the reversing processing operation described later, the substrate G may be additionally fixed to the transport carrier C by a separate clamping means other than the substrate chucking means. A good FIG. 4 is a drawing showing an anti-pretreatment operation of the substrate by the rotation driving device 200 according to the embodiment of the present invention.

When the substrate G is chucked and fixed to the chucking surface of the transport carrier C, the carrier mount 201 is moved by the rotation mechanism 203 while the transport carrier C is fixed to the carrier mount 201 by the carrier fixing means (not shown). Rotate 180 degrees and turn it upside down.

As a result, the vertical relationship between the transport carrier C and the substrate G is reversed, and the film-forming surface of the substrate G faces downward.

As described above, according to the present embodiment, since the stage portion 223 of the alignment mechanism 205 of the substrate loading / reversing chamber 101 is installed in the carrier mounting table 201, the substrate loading / reversing chamber 101 in which the substrate G is inverted is performed. An in-house alignment mechanism can be realized. Further, the alignment mechanism can be realized with a simple structure as compared with the case where the stage portion of the alignment mechanism is installed outside the substrate loading / inverting chamber 101.

FIG. 5 shows an additional loading operation of the substrate by the rotation driving device 200 according to the embodiment of the present invention.

When the reversing process of the substrate G is completed, the fixing is released by the carrier fixing means, and the transport carrier C is carried out from the substrate loading / inverting chamber 101 and transported to the alignment chamber 103 with the substrate G facing downward.

Subsequently, another empty transport carrier C'is carried in the substrate loading / reversing chamber 101 and mounted on the second carrier mounting surface 201b of the carrier mounting table 201 facing upward. In the rotary drive device 200 according to the embodiment of the present invention, since the carrier mounting base 201 has two mounting surfaces facing each other, the carrier mounting base 201 is mounted in order to mount a new empty transport carrier C'. It is not necessary to rotate 180 degrees again and return to the original position, and a new empty transport carrier C'can be immediately accepted in the state where the previously inverted transport carrier C has been carried out. As a result, the takt time of the entire process can be reduced.

If the transport carrier C'is mounted on the second carrier mounting surface 201b of the carrier mounting table 201, the transport carrier C'is chucked by the same operations as those shown in FIGS. 3 (b) to 3 (d). The new substrate G'position adjusted to the surface is chucked and held, and the inversion process is performed in the same manner as that shown in FIG.

<Manufacturing method of electronic devices>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the electronic device.

FIG. 6A shows an overall view of the organic EL display device 60, and FIG. 6B shows a cross-sectional structure of one pixel.

As shown in FIG. 6A, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix in the display area 61 of the organic EL display device 60. Each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The pixel referred to here refers to the smallest unit that enables the display of a desired color in the display area 61. In the case of the organic EL display device according to this embodiment, the pixel 62 is composed of a combination of a first light emitting element 62R, a second light emitting element 62G, and a third light emitting element 62B that emit light differently from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and is particularly limited to at least one color. There are no restrictions.

FIG. 6B is a schematic partial cross-sectional view taken along the line AB of FIG. 6A. The pixel 62 has an organic EL element having an anode 64, a hole transport layer 65, any of the light emitting layers 66R, 66G, 66B, an electron transport layer 67, and a cathode 68 on the substrate 63. There is. Of these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to a light emitting element (sometimes referred to as an organic EL element) that emits red, green, and blue, respectively. Further, the anode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the anode 64 in order to prevent the anode 64 and the cathode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In FIG. 6B, the hole transport layer 65 and the electron transport layer 67 are shown as one layer, but they are formed of a plurality of layers including the hole block layer and the electron block layer due to the structure of the organic EL display element. May be done. Further, between the anode 64 and the hole transport layer 65, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 into the hole transport layer 65 is provided. It can also be formed. Similarly, an electron injection layer can be formed between the cathode 68 and the electron transport layer 67.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a circuit board (not shown) for driving the organic EL display device and a substrate 63 on which the anode 64 is formed are prepared.

An acrylic resin is formed by spin coating on the substrate 63 on which the anode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the anode 64 is formed to form an insulating layer 69. .. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 in which the insulating layer 69 is patterned is carried into the first organic material film forming apparatus, and the hole transport layer 65 is formed as a common layer on the anode 64 in the display region. The hole transport layer 65 is formed by vacuum deposition. In reality, the hole transport layer 65 is formed to have a size larger than that of the display region 61, so that a high-definition mask is unnecessary.

Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second organic material film forming apparatus, and the light emitting layer 66R that emits red is formed on the portion of the substrate 63 on which the element that emits red is arranged. To do.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G that emits green is formed by the third organic material film forming apparatus, and the light emitting layer 66B that emits blue is further formed by the fourth organic material film forming apparatus. .. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transport layer 67 is moved by a metallic thin-film deposition material film forming apparatus to form a cathode 68 film.

According to the present invention, the relative positions of the substrate and the transport carrier can be adjusted in the substrate loading / inverting chamber.

After that, the organic EL display device 60 is completed by moving to a plasma CVD device and forming a protective layer 70.

From the time when the substrate 63 in which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when the substrate 63 is exposed to an atmosphere containing moisture or oxygen, a light emitting layer made of an organic EL material is formed. It may be deteriorated by moisture and oxygen. Therefore, in this example, the loading and unloading of the substrate between the film forming apparatus is performed in a vacuum atmosphere or an inert gas atmosphere.

Since the above-described embodiment shows an example of the present invention, the present invention is not limited to the configuration of the above-mentioned embodiment, and may be appropriately modified within the scope of the technical idea.

100: film forming apparatus, 101: substrate loading / reversing chamber, 103: alignment chamber, 105: film forming chamber, 200: rotary drive device, 201: carrier mounting table, 201a: first carrier mounting surface, 201b: second Carrier mounting surface, 203: Rotation mechanism, 205: Alignment mechanism, 221: Substrate receiving part, 223: Stage part, 225: Camera part, 250: Through hole

Claims (12)

A carrier mounting portion on which the carrier of the transported body having a holding surface for holding the transported body is mounted, and a carrier mounting portion.
A rotation mechanism for rotating the carrier mounting portion and
An alignment mechanism for adjusting the relative position of the carrier to be transported and the body to be transported mounted on the carrier to be transported in a direction parallel to the holding surface is provided.
The alignment mechanism is a rotary drive device provided in the carrier mounting portion and having a stage portion that can move in a direction parallel to the holding surface. The rotation driving device according to claim 1, wherein the alignment mechanism is mounted on the stage portion and has a transported body receiving portion for receiving the transported body. The carrier mounting portion has a first carrier mounting surface and a second carrier mounting surface facing the first carrier mounting surface.
The rotary drive device according to claim 2, wherein the transported body receiving unit is provided so as to be movable in a direction perpendicular to the first carrier mounting surface or the second carrier mounting surface. The alignment mechanism includes a receiving unit driving unit for moving the transported body receiving unit in the vertical direction.
The rotary drive device according to claim 3, wherein the receiving unit drive unit is mounted on the stage unit. The rotary drive device according to claim 3, wherein a plurality of the transported body receiving portions are provided along at least a plurality of the first carrier mounting surface or the peripheral edge portion of the second carrier mounting surface. The rotary drive device according to claim 5, wherein each of the plurality of recipients of the transported object can independently move in the vertical direction. The rotary drive device according to claim 3, wherein the transported body receiving unit is configured to be able to project from the first carrier mounting surface or the second carrier mounting surface in the vertical direction. The rotation mechanism is characterized in that the carrier mounting portion can be turned upside down in order to mount the carrier to be transported on either the first carrier mounting surface or the second carrier mounting surface. The rotary drive device according to claim 3. 8. The eighth aspect of the present invention, further comprising a first carrier fixing means and a second carrier fixing means for fixing the carrier to be transported to the first carrier mounting surface and the second carrier mounting surface, respectively. Rotation drive device. The alignment mechanism further includes a camera unit capable of photographing an alignment mark provided on the transported body and the carrier of the transported body.
Based on the image captured by the camera unit, the stage unit is driven to adjust the position of the transported body supported by the transported body receiving unit with respect to the transported body carrier. The rotary drive device according to claim 2. The rotary drive device according to any one of claims 1 to 10.
A film forming apparatus including a film forming means for performing a film forming operation on a substrate rotated by the rotation driving device. A method for manufacturing an electronic device, which comprises manufacturing an electronic device using the film forming apparatus according to claim 11.

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