SG10201906641WA - Wafer plate and mask arrangement for substrate fabrication - Google Patents
Wafer plate and mask arrangement for substrate fabricationInfo
- Publication number
- SG10201906641WA SG10201906641WA SG10201906641WA SG10201906641WA SG10201906641WA SG 10201906641W A SG10201906641W A SG 10201906641WA SG 10201906641W A SG10201906641W A SG 10201906641WA SG 10201906641W A SG10201906641W A SG 10201906641WA SG 10201906641W A SG10201906641W A SG 10201906641WA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- carrier
- opening
- mask
- carriers
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
WAFER PLATE AND MASK ARRANGEMENT FOR SUBSTRATE FABRICATION A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer. Figure 1.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562235898P | 2015-10-01 | 2015-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201906641WA true SG10201906641WA (en) | 2019-09-27 |
Family
ID=58427960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201906641WA SG10201906641WA (en) | 2015-10-01 | 2016-09-30 | Wafer plate and mask arrangement for substrate fabrication |
Country Status (8)
Country | Link |
---|---|
JP (1) | JP6816132B2 (en) |
KR (1) | KR102447219B1 (en) |
CN (1) | CN108290694B (en) |
MY (1) | MY190638A (en) |
PH (1) | PH12018500685A1 (en) |
SG (1) | SG10201906641WA (en) |
TW (1) | TWI611998B (en) |
WO (1) | WO2017059373A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6914600B2 (en) * | 2017-10-24 | 2021-08-04 | 住重アテックス株式会社 | Fixing device and ion irradiation method |
WO2019225838A1 (en) | 2018-05-25 | 2019-11-28 | 주식회사 엘지화학 | Battery housing and battery module comprising same |
US11137675B2 (en) | 2018-08-14 | 2021-10-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mask and method for forming the same |
US11756816B2 (en) | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
US11196360B2 (en) | 2019-07-26 | 2021-12-07 | Applied Materials, Inc. | System and method for electrostatically chucking a substrate to a carrier |
US10916464B1 (en) | 2019-07-26 | 2021-02-09 | Applied Materials, Inc. | Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency |
KR20210081794A (en) * | 2019-12-24 | 2021-07-02 | 캐논 톡키 가부시키가이샤 | Rotation driving apparatus, film-forming system including the same, manufacturing method of electronic device and carrier for carrying subjectto be carried used in the film-forming apparatus |
WO2022002385A1 (en) * | 2020-07-01 | 2022-01-06 | Applied Materials, Inc. | Apparatus for moving a substrate, deposition apparatus, and processing system |
TWI730862B (en) * | 2020-08-03 | 2021-06-11 | 國立陽明交通大學 | Method of fabricating a thin film with a varying thickness |
CN111933557B (en) * | 2020-10-19 | 2021-02-09 | 晶芯成(北京)科技有限公司 | Method and system for correcting center of wafer |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3498711A (en) * | 1967-10-18 | 1970-03-03 | Texas Instruments Inc | Step and repeat camera |
US7191512B2 (en) * | 1998-09-29 | 2007-03-20 | Applied Kinetics, Inc. | Tray system for holding and positioning components |
US6716656B2 (en) * | 2001-09-04 | 2004-04-06 | The Trustees Of Princeton University | Self-aligned hybrid deposition |
JP2004012598A (en) * | 2002-06-04 | 2004-01-15 | Adtec Engineeng Co Ltd | Projection aligner |
US7234584B2 (en) * | 2002-08-31 | 2007-06-26 | Applied Materials, Inc. | System for transporting substrate carriers |
WO2006025386A1 (en) * | 2004-08-31 | 2006-03-09 | Nikon Corporation | Aligning method, processing system, substrate loading repeatability measuring method, position measuring method, exposure method, substrate processing apparatus, measuring method and measuring apparatus |
WO2009155119A2 (en) * | 2008-05-30 | 2009-12-23 | Alta Devices, Inc. | Methods and apparatus for a chemical vapor deposition reactor |
US20130082727A1 (en) | 2010-08-31 | 2013-04-04 | Advantest Corporation | Wafer tray, semiconductor wafer test apparatus, and test method of semiconductor wafer |
JP6158091B2 (en) * | 2010-12-14 | 2017-07-05 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | Lithographic system and method for processing a substrate in such a lithographic system |
JP5704402B2 (en) * | 2011-08-30 | 2015-04-22 | 日新イオン機器株式会社 | Substrate holding member and method for adjusting position of semiconductor substrate attached to semiconductor holding member |
TWI506719B (en) | 2011-11-08 | 2015-11-01 | Intevac Inc | Substrate processing system and method |
KR102104688B1 (en) * | 2012-04-19 | 2020-05-29 | 인테벡, 인코포레이티드 | Dual-mask arrangement for solar cell fabrication |
US10062600B2 (en) * | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
PT2852469T (en) * | 2012-04-26 | 2019-07-31 | Intevac Inc | System architecture for vacuum processing |
CN203185174U (en) * | 2013-03-30 | 2013-09-11 | 歌尔声学股份有限公司 | Vacuum absorption fixing platform |
JP6133128B2 (en) * | 2013-05-23 | 2017-05-24 | 株式会社アルバック | Vacuum processing equipment, vibration control equipment |
JP6522667B2 (en) * | 2014-02-20 | 2019-05-29 | インテヴァック インコーポレイテッド | Substrate double sided processing system and method |
-
2016
- 2016-09-30 KR KR1020187009169A patent/KR102447219B1/en active IP Right Grant
- 2016-09-30 MY MYPI2018701283A patent/MY190638A/en unknown
- 2016-09-30 CN CN201680070352.1A patent/CN108290694B/en active Active
- 2016-09-30 JP JP2018517129A patent/JP6816132B2/en active Active
- 2016-09-30 WO PCT/US2016/055021 patent/WO2017059373A1/en active Application Filing
- 2016-09-30 SG SG10201906641WA patent/SG10201906641WA/en unknown
- 2016-10-03 TW TW105131864A patent/TWI611998B/en not_active IP Right Cessation
-
2018
- 2018-03-27 PH PH12018500685A patent/PH12018500685A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN108290694B (en) | 2021-05-04 |
WO2017059373A1 (en) | 2017-04-06 |
MY190638A (en) | 2022-04-29 |
JP6816132B2 (en) | 2021-01-20 |
TWI611998B (en) | 2018-01-21 |
KR102447219B1 (en) | 2022-09-23 |
KR20180059804A (en) | 2018-06-05 |
PH12018500685A1 (en) | 2018-10-15 |
TW201722822A (en) | 2017-07-01 |
CN108290694A (en) | 2018-07-17 |
JP2018531510A (en) | 2018-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PH12018500685A1 (en) | Wafer plate and mask arrangement for substrate fabrication | |
US9525099B2 (en) | Dual-mask arrangement for solar cell fabrication | |
US20170062258A1 (en) | Wafer plate and mask arrangement for substrate fabrication | |
MY159775A (en) | Wafer handler comprising a vision system | |
MY170824A (en) | System architecture for vacuum processing | |
SG10201807710WA (en) | System and method for bi-facial processing of substrates | |
JP2012129566A5 (en) | Exposure apparatus and device manufacturing method | |
MY175007A (en) | Substrate processing system and method | |
UA107071C2 (en) | Silk screen printing and magnetic orientation | |
EP3176824A3 (en) | Image pickup device | |
RU2013132215A (en) | LITHOGRAPHIC SYSTEM AND METHOD FOR PROCESSING SUBSTRATES IN SUCH A LITHOGRAPHIC SYSTEM | |
MY183097A (en) | Implant masking and alignment system with rollers | |
JP2018531510A6 (en) | Wafer plate and mask apparatus for substrate manufacture | |
TWI371078B (en) | Substrate support, substrate processing device and method of placing a substrate | |
TW200705597A (en) | Holder for fabricating organic light emitting display | |
US20160200091A1 (en) | Screen printing method and screen printing device | |
JP2014203860A5 (en) | Holder, stage apparatus, lithography apparatus and article manufacturing method | |
SG10201808377WA (en) | Wafer Support System, Wafer Support Device, System Comprising A Wafer And A Wafer Support Device As Well As Mask Aligner | |
US10323316B2 (en) | Multi-mask alignment system and method | |
JP6310705B2 (en) | Substrate holding apparatus and film forming apparatus | |
WO2019054718A3 (en) | Method for manufacturing frame-integrated mask | |
MX2018006602A (en) | Carrier for honeycomb body and method. | |
SG10201701124TA (en) | Substrate treating apparatus and substrate treating method | |
WO2015075817A9 (en) | Substrate processing system | |
KR101464706B1 (en) | Scan and step exposure system |