SG10201906641WA - Wafer plate and mask arrangement for substrate fabrication - Google Patents

Wafer plate and mask arrangement for substrate fabrication

Info

Publication number
SG10201906641WA
SG10201906641WA SG10201906641WA SG10201906641WA SG10201906641WA SG 10201906641W A SG10201906641W A SG 10201906641WA SG 10201906641W A SG10201906641W A SG 10201906641WA SG 10201906641W A SG10201906641W A SG 10201906641WA SG 10201906641W A SG10201906641W A SG 10201906641WA
Authority
SG
Singapore
Prior art keywords
wafer
carrier
opening
mask
carriers
Prior art date
Application number
SG10201906641WA
Inventor
Terry Bluck
Aaron Zanetto
Terry Pederson
Runstadler, Jr
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of SG10201906641WA publication Critical patent/SG10201906641WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

WAFER PLATE AND MASK ARRANGEMENT FOR SUBSTRATE FABRICATION A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer. Figure 1.
SG10201906641WA 2015-10-01 2016-09-30 Wafer plate and mask arrangement for substrate fabrication SG10201906641WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562235898P 2015-10-01 2015-10-01

Publications (1)

Publication Number Publication Date
SG10201906641WA true SG10201906641WA (en) 2019-09-27

Family

ID=58427960

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201906641WA SG10201906641WA (en) 2015-10-01 2016-09-30 Wafer plate and mask arrangement for substrate fabrication

Country Status (8)

Country Link
JP (1) JP6816132B2 (en)
KR (1) KR102447219B1 (en)
CN (1) CN108290694B (en)
MY (1) MY190638A (en)
PH (1) PH12018500685A1 (en)
SG (1) SG10201906641WA (en)
TW (1) TWI611998B (en)
WO (1) WO2017059373A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10328549B2 (en) 2013-12-11 2019-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Polishing head, chemical-mechanical polishing system and method for polishing substrate
JP6914600B2 (en) * 2017-10-24 2021-08-04 住重アテックス株式会社 Fixing device and ion irradiation method
WO2019225838A1 (en) 2018-05-25 2019-11-28 주식회사 엘지화학 Battery housing and battery module comprising same
DE102018006259A1 (en) * 2018-06-14 2019-12-19 Robert Bosch Gmbh Conveyor device for conveying at least one wafer
US11137675B2 (en) * 2018-08-14 2021-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Mask and method for forming the same
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
KR20210081794A (en) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 Rotation driving apparatus, film-forming system including the same, manufacturing method of electronic device and carrier for carrying subjectto be carried used in the film-forming apparatus
WO2022002385A1 (en) * 2020-07-01 2022-01-06 Applied Materials, Inc. Apparatus for moving a substrate, deposition apparatus, and processing system
TWI730862B (en) * 2020-08-03 2021-06-11 國立陽明交通大學 Method of fabricating a thin film with a varying thickness
CN111933557B (en) * 2020-10-19 2021-02-09 晶芯成(北京)科技有限公司 Method and system for correcting center of wafer
CN117976510B (en) * 2024-04-02 2024-06-25 浙江求是创芯半导体设备有限公司 Wafer driving structure and workpiece taking and adjusting method

Family Cites Families (17)

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US3498711A (en) * 1967-10-18 1970-03-03 Texas Instruments Inc Step and repeat camera
US7191512B2 (en) 1998-09-29 2007-03-20 Applied Kinetics, Inc. Tray system for holding and positioning components
US6716656B2 (en) * 2001-09-04 2004-04-06 The Trustees Of Princeton University Self-aligned hybrid deposition
JP2004012598A (en) * 2002-06-04 2004-01-15 Adtec Engineeng Co Ltd Projection aligner
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
WO2006025386A1 (en) 2004-08-31 2006-03-09 Nikon Corporation Aligning method, processing system, substrate loading repeatability measuring method, position measuring method, exposure method, substrate processing apparatus, measuring method and measuring apparatus
WO2009155119A2 (en) * 2008-05-30 2009-12-23 Alta Devices, Inc. Methods and apparatus for a chemical vapor deposition reactor
JP5405575B2 (en) * 2010-08-31 2014-02-05 株式会社アドバンテスト Semiconductor wafer test apparatus and semiconductor wafer test method
CN103370655B (en) * 2010-12-14 2016-03-16 迈普尔平版印刷Ip有限公司 Etching system and in this etching system the method for the treatment of substrate
JP5704402B2 (en) * 2011-08-30 2015-04-22 日新イオン機器株式会社 Substrate holding member and method for adjusting position of semiconductor substrate attached to semiconductor holding member
SG11201402177XA (en) * 2011-11-08 2014-06-27 Intevac Inc Substrate processing system and method
MY167662A (en) * 2012-04-19 2018-09-21 Intevac Inc Dual-mask arrangement for solar cell fabrication
MY170824A (en) * 2012-04-26 2019-09-04 Intevac Inc System architecture for vacuum processing
US10062600B2 (en) * 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
CN203185174U (en) * 2013-03-30 2013-09-11 歌尔声学股份有限公司 Vacuum absorption fixing platform
JP6133128B2 (en) * 2013-05-23 2017-05-24 株式会社アルバック Vacuum processing equipment, vibration control equipment
WO2015127191A1 (en) * 2014-02-20 2015-08-27 Intevac, Inc. System and method for bi-facial processing of substrates

Also Published As

Publication number Publication date
MY190638A (en) 2022-04-29
JP6816132B2 (en) 2021-01-20
TW201722822A (en) 2017-07-01
KR102447219B1 (en) 2022-09-23
PH12018500685A1 (en) 2018-10-15
TWI611998B (en) 2018-01-21
KR20180059804A (en) 2018-06-05
CN108290694B (en) 2021-05-04
CN108290694A (en) 2018-07-17
JP2018531510A (en) 2018-10-25
WO2017059373A1 (en) 2017-04-06

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