TWI611998B - Wafer plate and mask arrangement for substrate fabrication - Google Patents

Wafer plate and mask arrangement for substrate fabrication Download PDF

Info

Publication number
TWI611998B
TWI611998B TW105131864A TW105131864A TWI611998B TW I611998 B TWI611998 B TW I611998B TW 105131864 A TW105131864 A TW 105131864A TW 105131864 A TW105131864 A TW 105131864A TW I611998 B TWI611998 B TW I611998B
Authority
TW
Taiwan
Prior art keywords
wafer
carrier
photomask
wafer carrier
alignment
Prior art date
Application number
TW105131864A
Other languages
Chinese (zh)
Other versions
TW201722822A (en
Inventor
泰瑞 布拉克
亞倫 札内妥
泰瑞 彼得森
威廉尤金 倫史塔德勒二世
Original Assignee
因特瓦克公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 因特瓦克公司 filed Critical 因特瓦克公司
Publication of TW201722822A publication Critical patent/TW201722822A/en
Application granted granted Critical
Publication of TWI611998B publication Critical patent/TWI611998B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682Mask-wafer alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

一種用於在真空加工腔室中加工晶圓的系統。載具包括具有多個開口的框架,每個開口配置成可容納一個晶圓。傳送機構配置為可在整個系統中傳送多個載具。多個晶圓承載板配置用於支撐晶圓。附接機構用於將多個晶圓承載板附接到每個載具,其中每個晶圓承載板附接到相應載具的底面的相應位置,使得位於晶圓載具上的晶圓定位於載具內的多個開口中的一個之內。光罩附接在載具中的多個開口其中之一的前側。對準台從在載具的開口下方支撐晶圓承載板。相機定位成同時對光罩和晶圓進行成像。A system for processing wafers in a vacuum processing chamber. The carrier includes a frame having a plurality of openings, each opening being configured to accommodate a wafer. The transfer mechanism is configured to transfer multiple vehicles throughout the system. A plurality of wafer carrier plates are configured to support the wafer. The attachment mechanism is used to attach a plurality of wafer carrier plates to each carrier, wherein each wafer carrier plate is attached to a corresponding position on the bottom surface of the corresponding carrier, so that the wafer located on the wafer carrier is positioned at Within one of the multiple openings in the vehicle. A photomask is attached to the front side of one of the plurality of openings in the vehicle. The alignment stage supports the wafer carrier plate from below the opening of the carrier. The camera is positioned to image both the reticle and the wafer.

Description

製造基板所用的晶圓承載板與光罩配置Wafer Carrier and Mask Configuration for Substrate Manufacturing

本發明是關於真空加工所用的系統,例如用於製造太陽能電池,平板顯示器,觸控螢幕等的系統。The present invention relates to a system for vacuum processing, such as a system for manufacturing a solar cell, a flat panel display, a touch screen, and the like.

在本領域中已知有各種製造半導體IC,太陽能電池,觸控螢幕等所用的系統。這些系統的加工是在真空中進行,並包括例如物理氣相沉積(PVD),化學氣相沉積(CVD),離子植入,蝕刻等加工。這類系統的加工方法大致上可分成兩種:單一基板加工或批次加工。在單一晶圓的加工過程中,腔室內僅存在單一基板。在批次加工的過程中,腔室內存在數個基板。單一基板加工能夠對腔室內部的加工,以及在基板上製造的薄膜或結構進行高水平的控制,但會導致相對較低的生產量。相反的,批次加工會導致對加工條件和形成的薄膜或結構較差的控制,但提供高出很多的生產量。Various systems are known in the art for manufacturing semiconductor ICs, solar cells, touch screens, and the like. The processing of these systems is performed in a vacuum, and includes processes such as physical vapor deposition (PVD), chemical vapor deposition (CVD), ion implantation, and etching. The processing methods of such systems can be roughly divided into two types: single substrate processing or batch processing. During the processing of a single wafer, there is only a single substrate in the chamber. During the batch process, there are several substrates in the chamber. Single substrate processing enables high-level control of the processing inside the chamber, as well as films or structures manufactured on the substrate, but results in relatively low throughput. In contrast, batch processing results in poor control over processing conditions and the film or structure formed, but provides much higher throughput.

批次加工,例如製造太陽能電池,觸控面板等的系統中所採用的批次加工,通常是使基板排成nXm的二維陣列,以傳送和加工基板。例如,由Roth & Rau公司在2005年所開發,用於太陽能電池製造的電漿輔助化學氣相沉積(PECVD)系統,就是利用5×5晶圓的承載盤達到每小時1,200晶圓的生產量。然而,其他系統則使用具有6×6,7×7,8×8等二維陣列,甚至更高晶圓數的承載盤。雖然使用二維晶圓陣列的承載盤可以提高生產量,但是這種大承載盤的移送,裝載和卸載的操作都會變得複雜。Batch processing, such as batch processing used in systems for manufacturing solar cells, touch panels, etc., usually arranges the substrates into a two-dimensional array of nXm to transfer and process the substrates. For example, the plasma-assisted chemical vapor deposition (PECVD) system developed by Roth & Rau in 2005 for solar cell manufacturing uses a 5 × 5 wafer carrier tray to achieve 1,200 wafers per hour. . However, other systems use carrier disks with two-dimensional arrays of 6 × 6, 7 × 7, 8 × 8, and even higher wafer counts. Although the use of a two-dimensional wafer array carrier tray can increase throughput, the transfer, loading and unloading operations of such a large carrier tray can become complicated.

在一些基板加工過程中,需要向正在加工的基板施加偏壓,例如高頻(RF)或直流(DC)電位。然而,由於批次系統使用與基板一起移動的承載盤,因此難以對基板施加偏壓。In some substrate processing processes, a bias voltage needs to be applied to the substrate being processed, such as high frequency (RF) or direct current (DC) potential. However, since the batch system uses a carrier tray that moves with the substrate, it is difficult to bias the substrate.

此外,雖然基板在保持水平的情況下可以執行某些加工步驟,但在將基板保持在垂直的情況下執行某些加工步驟,卻有更多的優點。然而,與以水平朝向裝載和卸載基板相比,以垂直朝向裝載和卸載基板顯得較為複雜。In addition, although the substrate can perform certain processing steps while being held horizontally, there are more advantages to performing certain processing steps while the substrate is held vertically. However, loading and unloading a substrate in a vertical orientation appears more complicated than loading and unloading a substrate in a horizontal orientation.

一些基板加工過程可能需要使用光罩以在特定製造過程中,遮擋基板的部分。例如,光罩可用於形成接點或用於作邊緣隔離,以防止電池的分流。亦即,對於需要在正面和背面形成接點的電池,用於製造接點的材料可能會沉積在晶圓的邊緣上,並使正面和背面的接點分流。因此,至少在正面或背面形成接點的製造過程中,必須使用光罩來隔離電池的邊緣。Some substrate processing processes may require the use of a photomask to shield portions of the substrate during a particular manufacturing process. For example, photomasks can be used to form contacts or to provide edge isolation to prevent battery shunting. That is, for a battery that needs to form contacts on the front and back, the materials used to make the contacts may be deposited on the edge of the wafer and the contacts on the front and back may be shunted. Therefore, at least during the manufacturing process of forming contacts on the front or back, a photomask must be used to isolate the edges of the battery.

作為另一個例子,在矽基太陽能電池的製造中,最好能在基板背部表面上沉積覆蓋金屬層,以作為光反射層和電導體。所使用的金屬通常是鋁,但是覆蓋金屬可依不同原因,例如成本,導電性,可焊性等考量,而使用任何其他金屬。沉積膜的厚度可以非常薄,例如約10nm至非常厚,例如2-3um。然而無論如何都必須防止覆蓋金屬沈積在矽晶圓的邊緣上。這是因為沈積在矽晶圓邊緣上的金屬會在太陽能電池的正面表面和背面表面之間形成歐姆接觸,亦即形成分流。為了防止產生這種電性連接,可以在晶圓的背側邊緣上建立隔離區域。隔離區域的典型尺寸小於2mm寬,但較好使該隔離區域的寬度盡可能的小。As another example, in the manufacture of silicon-based solar cells, it is desirable to be able to deposit a cover metal layer on the back surface of the substrate as a light reflecting layer and an electrical conductor. The metal used is usually aluminum, but the cover metal can be used for any other reason, such as cost, conductivity, solderability, etc. The thickness of the deposited film can be very thin, such as about 10 nm to very thick, such as 2-3 um. In any case, it is necessary to prevent the covering metal from being deposited on the edge of the silicon wafer. This is because the metal deposited on the edge of the silicon wafer will form an ohmic contact between the front surface and the back surface of the solar cell, that is, a shunt. To prevent such an electrical connection, an isolation region can be established on the backside edge of the wafer. The typical size of the isolation area is less than 2 mm wide, but it is preferred to make the width of the isolation area as small as possible.

建立隔離區域的一種方式是使用光罩;然而,使用光罩會面臨許多挑戰。由於太陽能工業的高度競爭性,光罩的製造成本必須非常低廉。此外,由於太陽能電池製造設備的高產量(通常為每小時產製1500-2500個電池)需求,光罩必須快速且容易地使用於大量製造的過程。同時,由於光罩被用於防止薄膜在晶圓某些部分上的沉積,它必須能夠吸收和容納沉積物的積累。再者,由於薄膜沉積是在升高的溫度下完成,光罩必須能夠在升高的溫度,例如高達350℃下正常工作,同時仍然能夠精確地保持隔離區域的寬度,並且容許由熱應力引起的基板翹曲。One way to create an isolated area is to use a mask; however, using a mask can face many challenges. Due to the highly competitive nature of the solar industry, the manufacturing cost of photomasks must be very low. In addition, due to the high output of solar cell manufacturing equipment (typically 1500-2500 cells per hour), photomasks must be quickly and easily used in mass manufacturing processes. At the same time, since the photomask is used to prevent the deposition of thin films on certain parts of the wafer, it must be able to absorb and contain the accumulation of deposits. Furthermore, since the film deposition is completed at an elevated temperature, the photomask must be able to work normally at an elevated temperature, such as up to 350 ° C, while still accurately maintaining the width of the isolation area, and tolerating thermal stress The substrate is warped.

以下對本發明的簡述,目的在於對本發明之數種面向和技術特徵作一基本說明。發明簡述並非對本發明的詳細表述,因此其目的不在特別列舉本發明的關鍵性或重要元件,也不是用來界定本發明的範圍。其唯一目的是以簡明的方式呈現本發明的數種概念,作為以下詳細說明的前言。The following brief description of the present invention aims to provide a basic description of several aspects and technical features of the present invention. The summary of the invention is not a detailed description of the present invention, and therefore its purpose is not to specifically list the key or important elements of the present invention, nor to define the scope of the present invention. Its sole purpose is to present some concepts of the invention in a concise manner as a prelude to the more detailed description that follows.

本發明的實施例提供了模組化的系統架構,可以使用在不同的製程和加工步驟中。本發明的架構也具有通用性,可以適用於製造不同的裝置,包括例如太陽能電池,平板顯示器,觸控螢幕等。此外,該系統也可以用來輸送不同類型和尺寸的基板,不需變更配置,而是只須改變所使用的承載盤即可。The embodiments of the present invention provide a modular system architecture that can be used in different processes and processing steps. The architecture of the present invention is also universal and can be applied to manufacture different devices, including, for example, solar cells, flat panel displays, touch screens, and the like. In addition, the system can also be used to transport substrates of different types and sizes, without changing the configuration, but only by changing the carrier disk used.

本發明系統的結構使基板在大氣環境中的載送,例如裝載和卸載,可以與在真空中進行的加工分離。此外,本發明數種實施例的架構使得在自動操作閒置時,或不存在的情況下,仍可以手動進行裝載和卸載。換言之,本發明的系統可以在沒有自動化裝載/卸載裝置的情況下運作。在真空環境內,該系統能夠對基板進行靜止型或通過型的加工。在本發明某些實施例中,是透過致動閥的使用在每兩個加工腔室之間形成真空隔離。本發明的數種實施例並提供對基板的靜電夾持,以實現有效率的冷卻,並防止基板的意外移動。在其他實施例中,使用例如具有釋放機構的彈簧負載夾具,來實現機械夾持方式的基板裝載/卸載。本發明的數種實施例還可使用例如RF或DC偏壓功率來對基板提供偏壓,或者浮置基板。The structure of the system of the present invention enables the substrate to be carried in the atmospheric environment, such as loading and unloading, and can be separated from processing performed in a vacuum. In addition, the architecture of several embodiments of the present invention allows manual loading and unloading when the automatic operation is idle, or when it does not exist. In other words, the system of the present invention can operate without an automated loading / unloading device. In a vacuum environment, the system can process substrates in a stationary or pass-through mode. In some embodiments of the invention, vacuum isolation is formed between every two processing chambers through the use of an actuated valve. Several embodiments of the present invention also provide electrostatic clamping of the substrate to achieve efficient cooling and prevent accidental movement of the substrate. In other embodiments, for example, a spring-loaded jig having a release mechanism is used to realize substrate loading / unloading by a mechanical clamping method. Several embodiments of the present invention may also use, for example, RF or DC bias power to bias the substrate, or float the substrate.

本發明的數種實施例是利用排成線形陣列的載具上載送,以簡化基板的載送,但對基板的加工則是對排成二維陣列的nXm個基板,進行加工,同時加工多數線形矩陣上的基板。本發明的其他實施例則提供輸送機制,其中的基板是以垂直朝向接受加工,但裝載和卸載則在基板朝向水平的狀態下執行。Several embodiments of the present invention use carriers arranged in a linear array to simplify the loading of the substrate, but the processing of the substrate is to process n × m substrates arranged in a two-dimensional array. Substrate on a linear matrix. Other embodiments of the present invention provide a transport mechanism in which the substrate is processed in a vertical orientation, but loading and unloading are performed with the substrate facing horizontally.

本發明的實施例亦使基板可利用光罩進行加工,且可以使用雙光罩配置執行加工。本發明的二件式光罩系統是配置成用於光罩基板,並包括一個由扁平的金屬板構成的內光罩,該金屬板上具有孔洞,用以暴露出晶圓的待加工區域;另包括一外光罩,配置成可放置在該內光罩的上方並遮蔽該內光罩。該外光罩具有一個開放切口,其尺寸和形狀類似於該基板的尺寸和形狀,且該外光罩的厚度大於該內光罩的厚度。光罩框架是配置成可以支撐內光罩和外光罩,以將該外光罩夾置在該光罩框架和該內光罩之間。在本發明一個實例中,是以該雙光罩形成邊緣隔離。在這種實例中,該內光罩上的開放切口尺寸略小於太陽能電池晶圓,使該內光罩放置在晶圓上方時,能覆蓋晶圓的外圍邊緣,而在該外光罩內的開放切口尺寸則略大於該內光罩上的開放切口。一個頂部框架載具可用於保持該內光罩和該外光罩,並將內光罩和外光罩固定到晶圓承載盤上。Embodiments of the present invention also allow the substrate to be processed using a photomask, and processing can be performed using a dual photomask configuration. The two-piece photomask system of the present invention is configured for a photomask substrate and includes an inner photomask composed of a flat metal plate having holes for exposing a region to be processed of a wafer; An external photomask is further configured to be placed above the internal photomask and shield the internal photomask. The outer photomask has an open cutout, and its size and shape are similar to the size and shape of the substrate, and the thickness of the outer photomask is greater than the thickness of the inner photomask. The photomask frame is configured to support the inner photomask and the outer photomask to sandwich the outer photomask between the photomask frame and the inner photomask. In one example of the present invention, edge separation is formed by the double photomask. In this example, the size of the open cutout on the inner photomask is slightly smaller than the solar cell wafer, so that when the inner photomask is placed over the wafer, it can cover the peripheral edge of the wafer, while the The size of the open cut is slightly larger than the open cut on the inner reticle. A top frame carrier can be used to hold the inner mask and the outer mask, and fix the inner mask and the outer mask to the wafer carrier tray.

本發明的實施例也提供一個裝載及卸載機構,可同時載送四列的基板。該裝載/卸載機構是配置成可用於垂直移動,具有一個降低位置和一個升高位置。在該降低位置時,該機構是配置成可在同一時間:將一排加工過的基板從一個載具上移除,將一排新的基板放置在一個清空的載具上,將一排經加工的基板放置在基板移除機構上,以及從基板傳送機構上收集一排新的基板。該基板移除機構和該基板傳送機構個別可為輸送帶,並沿著相同或相反的方向運行。在該升高位置時,該機構是配置為可旋轉180度。An embodiment of the present invention also provides a loading and unloading mechanism, which can simultaneously carry four rows of substrates. The loading / unloading mechanism is configured for vertical movement and has a lowered position and a raised position. In this lowered position, the mechanism is configured to be at the same time: a row of processed substrates is removed from a carrier, a new row of substrates is placed on an empty carrier, and a row of warps The processed substrate is placed on a substrate removal mechanism, and a new row of substrates is collected from the substrate transfer mechanism. The substrate removal mechanism and the substrate transfer mechanism may each be a conveyor belt and run in the same or opposite directions. In this raised position, the mechanism is configured to be rotatable 180 degrees.

在本發明某些實施例中使用一種配置,其中的晶圓承載板是附接到載具的底面,而光罩配置則由附接到載具的上方。該晶圓承載板與該光罩配置中有一者是以固定的朝向附接到載具上,而另一者則可在每次裝載到新晶圓時,重新對準。在本發明的說明性實施例中,該光罩配置是以固定的朝向放置在載具上。一旦有新的晶圓裝載到晶圓承載板上時,該晶圓承載板就會被帶到其位於載具下方的位置。接者以一具相機來驗證晶圓是否對準於該光罩配置。如果沒有對準,則以平移和/或旋轉的方式將該晶圓承載板適當對準於該光罩配置。當達到適當的朝向後,將該晶圓承載板以例如一系列的磁體抬起,以附接到載具上。在本發明一個實施例中,該晶圓承載板並包括吸附孔,以在上述對準過程中,施加真空到該吸附孔,以便保持晶圓,並將晶圓壓向晶圓承載板。In some embodiments of the present invention, a configuration is used in which the wafer carrier is attached to the bottom surface of the carrier, and the photomask configuration is attached above the carrier. One of the wafer carrier plate and the mask configuration is attached to the carrier in a fixed orientation, and the other can be realigned each time a new wafer is loaded. In an illustrative embodiment of the invention, the photomask configuration is placed on the carrier in a fixed orientation. Once a new wafer is loaded onto the wafer carrier, the wafer carrier is brought to its position below the carrier. A camera is then used to verify that the wafer is aligned with the mask configuration. If not aligned, the wafer carrier plate is properly aligned with the reticle configuration by translation and / or rotation. When the proper orientation is reached, the wafer carrier plate is lifted with, for example, a series of magnets to attach to the carrier. In one embodiment of the present invention, the wafer carrier plate further includes a suction hole, so that a vacuum is applied to the suction hole during the above-mentioned alignment process to hold the wafer and press the wafer against the wafer carrier plate.

以下的詳細說明提供數種實例,用以說明本發明所請求保護的創新加工系統的數種技術特徵和面向。所揭示的數種實施例均提供一種系統,在該系統的真空加工腔,例如電漿加工腔中,可以同時加工多數個基板,例如半導體或玻璃基板。雖然玻璃基板,例如用於製作觸控螢幕的基板,通常不會分類成晶圓,但應當理解,在本發明的說明書中以晶圓為加工對象的實例,完全是為方便和容易理解,但在所有的說明中,晶圓都可以玻璃基板取代。The following detailed description provides several examples to illustrate several technical features and aspects of the innovative processing system claimed by the present invention. Several of the disclosed embodiments provide a system in which a plurality of substrates, such as semiconductor or glass substrates, can be processed simultaneously in a vacuum processing chamber, such as a plasma processing chamber. Although glass substrates, such as those used to make touch screens, are generally not classified into wafers, it should be understood that the use of wafers as examples of processing objects in the description of the present invention is entirely convenient and easy to understand, but In all descriptions, the wafer can be replaced by a glass substrate.

圖1是本發明多基板加工系統一種實施例的頂視圖,其中所使用的傳送載具是用來支持以線形排列的基板,但加工過程是對排列成二維陣列的基板進行。在圖1所示的系統100中,基板是在裝載/卸載站105進行裝載和卸載,即從系統的同一側進行裝載和卸載。然而,應當理解的是,該系統也可以設計成將裝載站設置在系統的一側,而卸載站設置在系統的相對側。在本發明一些實施例中,更可以手動將基板裝載到載具上及/或從載具上卸載,但在其他實施例中,則提供自動化的方式執行裝載與卸載,或執行其一。FIG. 1 is a top view of an embodiment of a multi-substrate processing system according to the present invention, in which a transfer carrier is used to support substrates arranged in a linear shape, but the processing process is performed on substrates arranged in a two-dimensional array. In the system 100 shown in FIG. 1, substrates are loaded and unloaded at a loading / unloading station 105, that is, loading and unloading are performed from the same side of the system. It should be understood, however, that the system can also be designed with the loading station on one side of the system and the unloading station on the opposite side of the system. In some embodiments of the present invention, the substrate may be manually loaded on and / or unloaded from the carrier, but in other embodiments, an automated way is provided to perform loading and unloading, or perform one of them.

該基板在裝載/卸載站105內裝載到載具上,而載具則是從載具返回站110輸送到裝載/卸載站105。每一個載具支持一線形陣列的基板,亦即,兩個或以上的基板排列成一單排,沿垂直於該系統行進方向的方向排列。該載具從裝載/卸載站105經由該載具返回站110移動至緩衝站115。該載具在緩衝站115停留直到低真空裝載腔(LVLL) 120完成準備。如以下將會說明,在本發明一些實施例中,該緩衝站也可作為翻轉站。在該翻轉站朝向水平方向的載具會翻轉90度,達成朝向一垂直方向。在這些實施例中,是使用夾具以將基板保持固定,並保持朝向垂直方向。The substrate is loaded onto a carrier in a loading / unloading station 105, and the carrier is transferred from the carrier returning station 110 to the loading / unloading station 105. Each carrier supports a linear array of substrates, that is, two or more substrates are arranged in a single row, arranged in a direction perpendicular to the direction of travel of the system. The vehicle is moved from the loading / unloading station 105 via the vehicle return station 110 to a buffer station 115. The vehicle stays at the buffer station 115 until the low vacuum loading chamber (LVLL) 120 is ready. As will be explained below, in some embodiments of the present invention, the buffer station can also be used as a flip station. The carrier facing the horizontal direction at the turning station will be turned 90 degrees to achieve a vertical direction. In these embodiments, a fixture is used to keep the substrate fixed and to keep it facing the vertical direction.

在適當時點,閥門112會開啟,而位於緩衝站115的該載具會輸送至低真空裝載腔120。然後閥門112會關閉且該低真空裝載腔120會抽真空至低真空水平。此後,閥門113會開啟且該載具會從低真空裝載腔120輸送至高真空裝載腔(HVLL) 125。一旦高真空裝載腔達到其真空水平時,閥門114會開啟且該載具會從高真空裝載腔125輸送至加工腔130。該系統可以有任何數量、以線性排列的加工腔130,使該載具可從一腔室經由任何位於兩個加工腔之間的閥門,輸送到下一腔室。在最後一個加工腔的末端,設置有一閥門,該閥門開啟後可以進入一組與系統順序相反的裝載配置的入口,亦即,先是一高真空裝載腔。然後是一低真空裝載腔。之後,該載具經由閥門116送出到該載具返回模組135。將該載具從載具返回模組135送回至載具返回站100的方式,可以使用例如:位於該加工腔130的上方或下方的輸送帶(未圖示)。At the appropriate time, the valve 112 will open and the carrier at the buffer station 115 will be delivered to the low vacuum loading chamber 120. The valve 112 is then closed and the low vacuum loading chamber 120 is evacuated to a low vacuum level. Thereafter, the valve 113 is opened and the carrier is transferred from the low-vacuum loading chamber 120 to the high-vacuum loading chamber (HVLL) 125. Once the high vacuum loading chamber reaches its vacuum level, the valve 114 is opened and the carrier is transferred from the high vacuum loading chamber 125 to the processing chamber 130. The system can have any number of processing chambers 130 in a linear arrangement, so that the carrier can be transferred from one chamber to the next chamber via any valve located between the two processing chambers. At the end of the last processing chamber, a valve is provided. When the valve is opened, it can enter a set of inlets in a loading configuration opposite to the system sequence, that is, a high vacuum loading chamber first. Then there is a low vacuum loading chamber. After that, the vehicle is sent out to the vehicle return module 135 via the valve 116. The method for returning the vehicle from the vehicle return module 135 to the vehicle return station 100 may be, for example, a conveyor belt (not shown) located above or below the processing chamber 130.

如上所述,每一個載具支持一線形陣列的基板,以使得裝載/卸載基板更為簡單,且使該載具更容易製造、加工以及輸送。然而,為使系統達成高產量,每一個加工腔130都配置成能夠容納和同時加工一組排成二維陣列的多數基板,該基板位在多數,亦即兩個或更多個載具上,且載具配置成兩兩相連。為了提高效率,在圖1顯示的特定實施例中,緩衝站115、低真空裝載腔120和高真空裝載腔125都是配置成能夠同時容納相同數目的載具,該數量與在加工腔130中所能同時容納的載具數量相同。例如,每一個載具可支持一排3個的玻璃基板,但每一個加工腔配置為能同時加工2個載具,則可同時加工排列成一二維陣列的3 x 2個基板。As described above, each carrier supports a linear array of substrates to make loading / unloading substrates simpler and to make the carriers easier to manufacture, process, and transport. However, in order for the system to achieve high throughput, each processing chamber 130 is configured to accommodate and simultaneously process a plurality of substrates arranged in a two-dimensional array, which substrates are located on the majority, that is, two or more carriers. , And the vehicles are configured to be connected in pairs. In order to improve efficiency, in the specific embodiment shown in FIG. 1, the buffer station 115, the low-vacuum loading chamber 120, and the high-vacuum loading chamber 125 are all configured to simultaneously accommodate the same number of carriers, which is the same as that in the processing chamber 130 The same number of vehicles can be accommodated at the same time. For example, each carrier can support a row of 3 glass substrates, but each processing chamber is configured to process 2 carriers simultaneously, and 3 x 2 substrates arranged in a two-dimensional array can be processed simultaneously.

根據本發明其他實施例,該裝載腔和緩衝腔的尺寸設置成可同時加工多個載具,例如,兩個載具,以配合延長的抽氣/排氣以及壓力穩定化時間。同時,也可以使用一緩衝腔,以提供載具移動模式轉換的過渡空間,使載具由一個站到站的移動,轉換成在一個加工腔內的持續移動。例如:如果在一加工腔的載具是在靜止模式加工,而另一個腔室則是在通過模式中加工,這兩個腔室之間即應該設置一緩衝腔。系統內的多數載具在該加工腔或模組中形成一連續的載具流,而每一加工腔/模組可以使5至10個載具持續以頭尾相銜的方式移入,魚貫通過加工源,例如熱源、物理氣相沉積、蝕刻等。According to other embodiments of the present invention, the loading cavity and the buffer cavity are sized to process multiple carriers, for example, two carriers at the same time, so as to cooperate with the extended suction / exhaust and pressure stabilization time. At the same time, a buffer cavity can also be used to provide a transition space for the change of the vehicle movement mode, so that the movement of the vehicle from one station to another station is converted into continuous movement in a processing chamber. For example, if the carrier of one processing chamber is processed in the stationary mode and the other chamber is processed in the pass mode, a buffer chamber should be set between the two chambers. Most carriers in the system form a continuous carrier flow in the processing cavity or module, and each processing cavity / module can make 5 to 10 vehicles move in in a continuous manner, and the fish passes through Processing source, such as heat source, physical vapor deposition, etching, etc.

如圖1所示,該系統中供用於輸送、裝載和卸載基板的部分,是設置在大氣環境中。反之,所有加工製程則是在真空環境中進行。在大氣環境中輸送、裝載和卸載比在真空中容易執行。As shown in Figure 1, the part of the system for transporting, loading, and unloading substrates is set in the atmospheric environment. In contrast, all processing processes are performed in a vacuum environment. Transporting, loading and unloading in the atmospheric environment is easier than performing in a vacuum.

圖1A顯示本發明系統的一種實施例,即如圖1所示的實施例,其中該載具200在輸送和加工期間維持朝向水平方向。該載具經由配置在加工腔上方的直線型輸送帶140,返回到起始點。直線型輸送帶140可以是一條輸送帶或多數的動力滾輪。如圖1A所示,每一個載具200支持4個呈線形陣列的一排基板220。此外,為了說明起見,腔室120的上方部分被移除,以顯示其中同時存在的6個載具的排列方式。因此,根據本實施例,由於每一個載具承載4個基板,每一個加工腔可以同時加工24個基板。FIG. 1A shows an embodiment of the system of the present invention, that is, the embodiment shown in FIG. 1, wherein the carrier 200 is maintained in a horizontal direction during transportation and processing. The carrier returns to the starting point via a linear conveyor belt 140 disposed above the processing chamber. The linear conveyor belt 140 may be a conveyor belt or a plurality of power rollers. As shown in FIG. 1A, each carrier 200 supports four rows of substrates 220 in a linear array. In addition, for the sake of explanation, the upper part of the chamber 120 has been removed to show the arrangement of the six vehicles that are simultaneously present therein. Therefore, according to this embodiment, since each carrier carries 4 substrates, each processing chamber can simultaneously process 24 substrates.

圖1B顯示本發明一實施例,其中該載具在輸送和裝載/卸載期間朝向水平方向,但在加工期間則朝向垂直方向。圖1B的配置與圖1A中非常相似,但該裝載腔和加工腔翻轉成垂直方向,以便加工朝向垂直方向的基板。在圖1A和圖1B所顯示之實施例,兩者的裝載腔和加工腔的建置可以為相同,不同的是圖1A的腔室是以水平方向安裝,而圖1B中的腔室則是以垂直方向安裝在其中一側。因此,該緩衝站115和在該系統的另一端的緩衝站145經過修改,以包括一可將載具的朝向轉動90度的升降裝置,如緩衝站145中所示。FIG. 1B shows an embodiment of the present invention, in which the carrier is oriented horizontally during transportation and loading / unloading, but is oriented vertically during processing. The configuration of FIG. 1B is very similar to that of FIG. 1A, but the loading cavity and the processing cavity are turned to a vertical direction in order to process the substrate facing the vertical direction. In the embodiment shown in FIG. 1A and FIG. 1B, the construction of the loading chamber and the processing chamber of the two can be the same, the difference is that the chamber of FIG. 1A is installed horizontally, and the chamber of FIG. 1B is Mount vertically on one of them. Therefore, the buffer station 115 and the buffer station 145 at the other end of the system are modified to include a lifting device capable of rotating the orientation of the vehicle by 90 degrees, as shown in the buffer station 145.

圖2顯示根據本發明的線形陣列載具的一種實施例,該載具可建置成用於加工矽晶圓、玻璃基板等的製程。如圖2所示,根據本實施例的線形陣列載具的建置相當簡單且成本低廉。應當理解的是,只要通過安裝不同吸盤在該載具的上方,該載具就可以配置成用來載送不同數量和尺寸的基板。同時,應當理解的是,每一個加工腔配置為可同時容納多個載具,因此,可同時加工在多個載具上的多個晶圓。FIG. 2 shows an embodiment of a linear array carrier according to the present invention, and the carrier can be built into a process for processing silicon wafers, glass substrates, and the like. As shown in FIG. 2, the construction of the linear array carrier according to this embodiment is relatively simple and low cost. It should be understood that as long as different suction cups are installed above the carrier, the carrier can be configured to carry substrates of different numbers and sizes. At the same time, it should be understood that each processing chamber is configured to accommodate multiple carriers simultaneously, and therefore, multiple wafers on multiple carriers can be processed simultaneously.

在圖2中的載具200建置在一簡單的框架205上,框架205是由兩條輸送軌道225及兩支陶瓷桿210構成。該陶瓷桿210提高貼附其上的承載盤(未圖示),與該腔室的其餘部分的隔熱效果。每一支陶瓷桿210至少有一側與輸送軌道225形成一叉形配置235,如圖中放大圖所示。在叉形配置235中形成一凹槽245,使得該陶瓷桿210受熱膨脹時可自由移動(如雙箭頭所示),且不將壓力施加在該輸送軌道225上。The carrier 200 in FIG. 2 is built on a simple frame 205. The frame 205 is composed of two conveying rails 225 and two ceramic rods 210. The ceramic rod 210 enhances the thermal insulation effect of the carrier plate (not shown) attached to the ceramic rod 210 and the rest of the chamber. At least one side of each ceramic rod 210 forms a fork-shaped configuration 235 with the conveying rail 225, as shown in the enlarged view in the figure. A groove 245 is formed in the fork-shaped configuration 235, so that the ceramic rod 210 can move freely (as shown by double arrows) when thermally expanded, and no pressure is applied to the conveying rail 225.

一磁性傳動桿240提供在每一條輸送軌道225上,以將該載具在整個系統中傳送。該磁性傳動桿可在磁化滾輪上行進,以輸送載具。為提高該系統的清潔度,該傳動桿240可以鍍鎳加工。這種磁性裝置可使輸送達到準確,而不會因高加速度導致該載具滑動。此外,此磁性裝置使滾輪能有較大的間隔,使得該載具由於磁力而附著在滾輪上,且可形成較長的懸臂,故可通過較寬的間隙。此外,該磁性裝置使該載具在輸送時可以朝向垂直方向,也可朝向水平方向,因為該載具是以磁力附著在滾輪上。A magnetic transmission rod 240 is provided on each conveying track 225 to transfer the carrier throughout the system. The magnetic transmission rod can travel on a magnetized roller to transport the carrier. To improve the cleanliness of the system, the transmission rod 240 may be nickel-plated. This magnetic device enables accurate delivery without the carrier sliding due to high acceleration. In addition, the magnetic device enables the rollers to have a larger interval, so that the carrier is attached to the rollers due to magnetic force, and can form a longer cantilever, so it can pass through a wider gap. In addition, the magnetic device enables the carrier to be oriented in a vertical direction or a horizontal direction during transportation, because the carrier is magnetically attached to the roller.

載具接觸組件250是附著在該輸送軌道225上,且其形狀配合一附著在該腔室上的腔室接觸組件252(見放大圖)。該腔室接觸組件具有一絕緣桿260,該絕緣桿260內建一接觸刷262。該載具接觸組件250具有一導電延伸251(圖2A),插入到一絕緣彈簧264和該絕緣桿260之間,因此被壓靠在該接觸刷262上,以從該配合的接觸點接收偏壓電位。該偏壓可用以作為,例如:基板偏壓、基板吸附(供靜電吸盤用)等。該偏壓可以是高頻或直流 (連續型或脈衝型)。該載具接觸組件250位於該載具的單側或兩側。The carrier contact assembly 250 is attached to the conveying rail 225, and its shape is matched with a chamber contact assembly 252 attached to the chamber (see an enlarged view). The chamber contact assembly has an insulating rod 260, and a contact brush 262 is built in the insulating rod 260. The vehicle contact assembly 250 has a conductive extension 251 (FIG. 2A), which is inserted between an insulating spring 264 and the insulating rod 260, and is therefore pressed against the contact brush 262 to receive bias from the mating contact point. Piezoelectric position. The bias can be used as, for example, substrate bias, substrate adsorption (for electrostatic chucks), and the like. The bias can be high frequency or DC (continuous or pulsed). The vehicle contact assembly 250 is located on one or both sides of the vehicle.

圖2A為一部分截面圖,顯示該載具如何輸送及如何接收偏壓功率。圖2A特別顯示該傳動桿240跨置在三個磁化滾輪267上,磁化滾輪267均附著於轉軸268。轉軸268延伸出該腔室壁269之外,使其可從該腔室內部真空環境以外的部分轉動驅動。該轉軸268經由一彈性帶,例如一無端帶,耦接至一馬達,以配合不同的軸徑。FIG. 2A is a partial cross-sectional view showing how the vehicle transmits and receives bias power. FIG. 2A particularly shows that the transmission rod 240 is straddled on three magnetized rollers 267, and the magnetized rollers 267 are all attached to the rotating shaft 268. The rotating shaft 268 extends beyond the chamber wall 269 so that it can be driven and rotated from a part outside the vacuum environment inside the chamber. The rotating shaft 268 is coupled to a motor via an elastic belt, such as an endless belt, to fit different shaft diameters.

圖2B顯示本發明中用以加工矽晶圓,例如應用在製造太陽能電池的晶圓的載具一種實施例。在圖2B中可使用承載盤223以例如吸附電位吸附晶圓220。一升降裝置215可用以升高和降低晶圓的位置,以裝載和卸載該晶圓。圖2C顯示本發明一實施例,其中該載具可用以載送玻璃基板,例如觸控螢幕。在本實施例中,該基板可利用機械式的彈簧裝載夾鉗或夾具227固定其位置。該承載盤224可以是一簡單的托盤,但具有配合該彈簧裝載夾具的裝置。FIG. 2B shows an embodiment of a carrier for processing a silicon wafer, such as a wafer used in manufacturing a solar cell, according to the present invention. The carrier tray 223 may be used in FIG. 2B to, for example, suck the wafer 220 with a suction potential. A lifting device 215 can be used to raise and lower the position of the wafer to load and unload the wafer. FIG. 2C shows an embodiment of the present invention, wherein the carrier can be used to carry a glass substrate, such as a touch screen. In this embodiment, the substrate can be fixed in position using a mechanical spring-loaded clamp or clamp 227. The carrier tray 224 may be a simple tray, but has a device for cooperating with the spring loading jig.

圖3A和3B顯示本發明一實施例的基板裝載和卸載機構,該機構與該載具返回站結合。圖3A是該裝載和卸載機構的頂視圖,而圖3B則為其側視圖。如圖1A所示,一輸送帶在加工完成後將該載具送回。然後該載具由升降裝置107下降,並且朝向水平方向輸送到裝載/卸載站105。如圖3A和3B所示,一雙向輸送帶,亦即,輸送帶301和303,用以傳送未加工的基板接受加工,並移除已加工的晶圓。輸送帶301和303中何者輸送未加工的晶圓,何者移除已加工晶圓,並不重要,因為該系統無論如何都會進行完全一致的操作。此外,在本實施例中顯示該輸送帶301和303以相反的方向輸送基板,但即使兩個輸送帶運行的方向相同,仍會導致一樣的結果。3A and 3B show a substrate loading and unloading mechanism according to an embodiment of the present invention, which is combined with the carrier return station. FIG. 3A is a top view of the loading and unloading mechanism, and FIG. 3B is a side view thereof. As shown in FIG. 1A, a carrier returns the carrier after processing is completed. The carrier is then lowered by the lifting device 107 and conveyed to the loading / unloading station 105 in a horizontal direction. As shown in FIGS. 3A and 3B, a two-way conveyor belt, that is, conveyor belts 301 and 303, is used to transport unprocessed substrates for processing, and remove processed wafers. It does not matter which of the conveyor belts 301 and 303 conveys the unprocessed wafers, and which of the processed wafers is removed, because the system performs completely the same operation anyway. In addition, in this embodiment, it is shown that the conveyor belts 301 and 303 transport substrates in opposite directions, but even if the two conveyor belts run in the same direction, the same results will still be caused.

圖3A和圖3B的裝置可支援同時移送兩個載具。準確的說,在本實施例中,將已加工基板從一載具卸載,並將未加工的基板裝載在另一個載具,是同時進行。另外,在同一時間中,將已加工的基板放置在該已加工基板的輸送帶上,而將未加工的基板從該未加工的基板的輸送帶上取出,放到下一輪的載具上。這些操作的執行如下所述。The device of FIGS. 3A and 3B can support the simultaneous transfer of two carriers. To be precise, in this embodiment, unloading the processed substrate from one carrier and loading the unprocessed substrate on another carrier are performed simultaneously. In addition, at the same time, the processed substrate is placed on the conveyor of the processed substrate, and the unprocessed substrate is taken out of the conveyor of the unprocessed substrate and placed on the next round of carriers. These operations are performed as described below.

該基板拾取機構配置成可進行兩種運動:旋轉運動和垂直移動。4排吸盤307附在該基板拾取機構305上。該吸盤307可以為例如:真空吸盤、靜電吸盤等。在本特定實施例中,使用4排白努利(Bernoulli)吸盤。亦即,吸盤可使用白努利吸力支持基板。該4排吸盤配置成2排,分別位於兩側,使得當兩排吸盤對準該載具時,另外2排吸盤會對準該輸送帶。因此,當該拾取機構305位在下降位置時,一排吸盤從一載具拾取已加工基板,且另一排吸盤則將未加工的基板放置在另一載具上。此時在另一側則有一排吸盤將已加工的基板放置到一輸送帶上,而另一排吸盤則從另一輸送帶拾取未加工的基板。其後該拾取機構305達到其上升位置並旋轉180度,其中同一時間,該載具移動一個節距,亦即,該載有未加工基板的載具移動一步,而該已經移除已加工基板的載具則移動到未加工基板的裝載位置,且另一個載有已加工基板的載具移動到該卸載位置。然後該拾取機構305達到其下降位置,並且重複上述過程。The substrate pickup mechanism is configured to perform two kinds of movements: a rotary movement and a vertical movement. Four rows of suction cups 307 are attached to the substrate pickup mechanism 305. The chuck 307 may be, for example, a vacuum chuck, an electrostatic chuck, or the like. In this particular embodiment, four rows of Bernoulli suction cups are used. That is, the suction cup can support the substrate using a Bainuoli suction. The four rows of suction cups are arranged in two rows, one on each side, so that when the two rows of suction cups are aligned with the carrier, the other two rows of suction cups will be aligned with the conveyor belt. Therefore, when the picking mechanism 305 is in the lowered position, one row of suckers picks up processed substrates from one carrier, and the other row of suckers places unprocessed substrates on another carrier. At this time, there is a row of suction cups on the other side to place the processed substrates on a conveyor belt, and another row of suction cups to pick up the unprocessed substrates from the other conveyor belt. Thereafter, the picking mechanism 305 reaches its raised position and rotates 180 degrees, at the same time, the carrier moves by a pitch, that is, the carrier carrying the unprocessed substrate moves one step, and the processed substrate has been removed The carrier moves to the loading position of the unprocessed substrate, and the other carrier carrying the processed substrate moves to the unloading position. The pickup mechanism 305 then reaches its lowered position and repeats the above process.

為提供一具體實例,在圖3A所示的時間點,載具311上有已經加工的基板,該基板正由在拾取機構305上的一排吸盤拾取中。載具313正在裝載從拾取機構305上另一排吸盤送來的未加工的基板。在該拾取機構305的另一側,一排吸盤正在放置已加工基板到輸送帶303上,而另一排吸盤正從輸送帶301上拾取未加工的基板。當這些動作完成時,拾取機構305升起,到達其上升位置並旋轉180度,如曲線箭頭所示。同時,全部載具移動一步,亦即,載具316移動到原先由載具317所佔據的位置,載具313現正裝載未加工的基板,則移動到先前由載具316所佔據的位置,載具311現在未裝載,則移動到先前由載具313所佔據的位置,且載具318已裝載已加工基板,則移動到先前由載具311所佔據的位置。之後該拾取裝置下降,使該載具311裝載未加工的基板,已加工基板則從載具318移除,從載具311移除的基板則放置到輸送帶303上,而未加工的基板則從輸送帶301取出。然後該拾取機構305上升,並且重複上述步驟。To provide a specific example, at the time point shown in FIG. 3A, the carrier 311 has a processed substrate, and the substrate is being picked up by a row of suction cups on the pickup mechanism 305. The carrier 313 is loading an unprocessed substrate sent from another row of suction cups on the pickup mechanism 305. On the other side of the pickup mechanism 305, one row of suction cups is placing processed substrates on the conveyor belt 303, and the other row of suction cups is picking up unprocessed substrates from the conveyor belt 301. When these actions are completed, the pickup mechanism 305 rises, reaches its raised position, and rotates 180 degrees, as shown by the curved arrows. At the same time, all the carriers move one step, that is, the carrier 316 moves to the position previously occupied by the carrier 317, and the carrier 313 is now loading the unprocessed substrate, then moves to the position previously occupied by the carrier 316. If the carrier 311 is not currently loaded, it moves to the position previously occupied by the carrier 313, and if the processed substrate is loaded on the carrier 318, it moves to the position previously occupied by the carrier 311. After that, the pick-up device is lowered, so that the carrier 311 is loaded with an unprocessed substrate, the processed substrate is removed from the carrier 318, the substrate removed from the carrier 311 is placed on the conveyor 303, and the unprocessed substrate is Take out from the conveyor 301. The pickup mechanism 305 is then raised, and the above steps are repeated.

圖3A和圖3B的實施例也採用一選用的光罩升降裝置321。在本實施例中,光罩是用以在該基板表面產生一所需的圖案,亦即,暴露出該基板的一定區域,以進行加工,同時防止加工到其覆蓋的區域。該載具以及放置於基板上的光罩移動穿過該系統,直到到達該光罩升降裝置321為止。當一具有已加工基板的載具(在圖3A和圖3B中的載具318)到達該光罩升降裝置321時,該光罩升降裝置321上升到其上升位置,並從載具抬起該光罩。然後該載具可前往該卸載站,以卸載已加工基板。在同一時間,一承載未加工基板的載具(在圖3B中的載具319)移動到該光罩升降裝置處,且光罩升降裝置321下降,達到其下降位置,以將該光罩置放到該未加工基板上,供進行加工。The embodiment of FIGS. 3A and 3B also uses an optional photomask lifting device 321. In this embodiment, the photomask is used to generate a desired pattern on the surface of the substrate, that is, a certain area of the substrate is exposed for processing, and at the same time, the area covered by the substrate is prevented from being processed. The carrier and the photomask placed on the substrate move through the system until it reaches the photomask lifting device 321. When a carrier with a processed substrate (carrier 318 in FIGS. 3A and 3B) reaches the mask lifting device 321, the mask lifting device 321 rises to its raised position, and lifts the Photomask. The carrier can then go to the unloading station to unload the processed substrate. At the same time, a carrier (carrier 319 in FIG. 3B) carrying an unprocessed substrate is moved to the photomask lifting device, and the photomask lifting device 321 is lowered to reach its lowered position to place the photomask It is put on this raw substrate for processing.

可理解的是,在圖3A和圖3B的實施例中,該光罩升降裝置是從一載具移除光罩,並將光罩放置於一不同載具上。亦即,該光罩不會送回到之前移除該光罩的載具上,而是放置到另一不同載具上。根據該系統的設計及載具的數量而定,在經過幾輪的加工之後,光罩可能會回到相同的載具上,但只會是在該光罩由其他載具上拿起後。反之也是如此。亦即,根據設計的不同以及使用中的載具數量和光罩數目的不同,每一個光罩可能使用於該系統的所有載具。也就是說,該系統中的每一個載具可使用於該系統的每一個光罩,其中在整個系統的每一個製程循環中,載具所使用的光罩都不同。It can be understood that, in the embodiment of FIGS. 3A and 3B, the mask lifting device removes the mask from a carrier and places the mask on a different carrier. That is, the reticle will not be returned to the carrier from which the reticle was removed before, but will be placed on a different carrier. Depending on the design of the system and the number of carriers, after several rounds of processing, the mask may return to the same carrier, but only after the mask is picked up by other carriers. The opposite is also true. That is, depending on the design and the number of vehicles and masks in use, each mask may be used on all the vehicles in the system. That is, each carrier in the system can be used in each mask of the system, wherein the mask used by the carrier is different in each process cycle of the entire system.

如圖中的放大圖所示,載具升降裝置可配置有兩條垂直輸送帶裝置,分別設置在載具的兩側。每一個輸送帶裝置是由一條或更多條輸送帶333組成,其中輸送帶333由滾輪336驅動。升降銷331附於該輸送帶333,使得當該輸送帶333移動時,該銷331可接合該載具,並且向垂直方向移動該載具(亦即,向上或向下移動,取決於該升降裝置位於該系統哪一側,以及該載具回送輸送帶的位置是在該加工腔的上方和下方而定)。As shown in the enlarged view in the figure, the carrier lifting device can be configured with two vertical conveyor belt devices, which are respectively disposed on both sides of the carrier. Each conveyor belt device is composed of one or more conveyor belts 333, wherein the conveyor belts 333 are driven by rollers 336. A lifting pin 331 is attached to the conveyor belt 333 so that when the conveyor belt 333 moves, the pin 331 can engage the carrier and move the carrier in a vertical direction (that is, move up or down depending on the lift (The device is located on which side of the system, and the position of the carrier return conveyor is above and below the processing chamber).

圖3C顯示本發明中基板對準機構的一實施例。根據本實施例,吸盤345的一側具有彈簧裝載的對準銷329,且另一側則設有一凹口312。一旋轉推入銷341配置為可進入該凹口312,並將基板320推壓向該對準銷329,之後縮回,如圖中虛線和旋轉箭頭所示。應當注意的是,該旋轉推入銷341並非該吸盤345和該載具的一部份,且不在該系統內移動而是固定在該位置。此外,該彈簧裝載的對準銷在有光罩使用中時,是被下壓到一個較低的位置。因此,本發明提供一基板對準機構,包括一吸盤,該吸盤具有:一第一側,配置一對準銷,一第二側,垂直於該第一側並配置兩個對準銷,一第三側,位在該第一側的相反側並配置一第一凹口,及一第四側,位於該第二側之相反側並配置一第二凹口;該對準機構尚包括一第一推入銷,用於進入該第一凹口以將該基板推壓向該第一對準銷,以及一第二推入銷,配置為可進入該第二凹口並且將該基板推壓向該第二對準銷。FIG. 3C shows an embodiment of a substrate alignment mechanism in the present invention. According to this embodiment, one side of the suction cup 345 has a spring-loaded alignment pin 329, and the other side is provided with a notch 312. A rotary push-in pin 341 is configured to enter the notch 312, and pushes the substrate 320 toward the alignment pin 329, and then retracts, as shown by the dotted line and the rotation arrow in the figure. It should be noted that the rotary push-in pin 341 is not part of the suction cup 345 and the carrier, and does not move within the system but is fixed in this position. In addition, the spring-loaded alignment pin is depressed to a lower position when in use with a mask. Therefore, the present invention provides a substrate alignment mechanism including a suction cup having a first side configured with an alignment pin, a second side perpendicular to the first side and configured with two alignment pins, a A third side is located on the opposite side of the first side and is provided with a first notch, and a fourth side is located on the opposite side of the second side and is provided with a second notch; the alignment mechanism further includes a A first push-in pin for entering the first recess to push the substrate toward the first alignment pin, and a second push-in pin configured to enter the second recess and push the substrate Press against the second alignment pin.

圖4顯示本發明真空加工腔400的一實施例,該腔室可用於本案所公開的系統。在圖4中所示的狀態,是將該腔室的蓋子移除,以顯示其內部構造。該腔室400可以水平或垂直方向設置,而對其組成和構造不需作任何修改。該腔室是由簡單箱型框架所建構,但具有開口422以便抽真空。腔室的一側壁切出一進入口412,而在相對的側壁則切出一離開口413,以使載具424能夠進入腔室,穿過整個腔室且從另一側退出該腔室。閘閥設置在每一個開口412和413,雖然為了圖式簡潔起見,圖4只顯示閘閥414。FIG. 4 shows an embodiment of the vacuum processing chamber 400 of the present invention, which can be used in the system disclosed in the present case. In the state shown in Fig. 4, the lid of the chamber is removed to show its internal structure. The chamber 400 can be disposed horizontally or vertically without any modification to its composition and structure. The chamber is constructed of a simple box-type frame, but has an opening 422 for evacuation. An entrance opening 412 is cut out on one side wall of the chamber, and an exit opening 413 is cut out on the opposite side wall, so that the carrier 424 can enter the chamber, pass through the entire chamber, and exit the chamber from the other side. A gate valve is provided at each of the openings 412 and 413, although for the sake of brevity of the drawings, only the gate valve 414 is shown in FIG.

為能有效率且精確的使該載具424在水平和垂直方向輸送,將磁化滾輪402設置在該腔室的相對兩側壁上。該載具具有磁性桿,可在磁化滾輪402上行進。該滾輪402所安裝的轉軸延伸到腔室外部,進入大氣環境中。該滾輪是由馬達401在大氣環境中驅動。準確地說,即是設置多個馬達401,每一個馬達使用傳動帶,例如無端帶,以驅動數個轉軸。此外,也提供惰輪404,以從橫向規制該載具。In order to efficiently and accurately transport the carrier 424 in the horizontal and vertical directions, a magnetizing roller 402 is disposed on two opposite sidewalls of the chamber. The carrier has a magnetic rod and can travel on a magnetizing roller 402. The rotating shaft mounted on the roller 402 extends to the outside of the chamber and enters the atmospheric environment. This roller is driven by a motor 401 in an atmospheric environment. To be precise, a plurality of motors 401 are provided, and each motor uses a transmission belt, such as an endless belt, to drive several rotating shafts. In addition, an idler 404 is also provided to regulate the vehicle laterally.

圖4顯示本發明實施例的一種特徵,即該磁化滾輪的直徑小於該腔室側壁的厚度。這種設計使得磁化滾輪可放置於該進入口412和離開口413內,如滾輪406和407所示。由於滾輪406和407可以配置在進入口412和離開口413內,故使該載具能夠平滑的進出腔室,這是因為這種設計大幅度的縮小該載具沒有滾輪支持的間距長度。FIG. 4 shows a feature of the embodiment of the present invention, that is, the diameter of the magnetizing roller is smaller than the thickness of the side wall of the chamber. This design allows magnetized rollers to be placed inside the entry port 412 and exit port 413, as shown by the rollers 406 and 407. Because the rollers 406 and 407 can be arranged in the entrance 412 and the exit 413, the vehicle can smoothly enter and exit the chamber, because this design greatly reduces the distance of the vehicle without the support of the roller.

圖5顯示本發明中一光罩與載具組件的一種實施例。由左邊沿著彎曲箭頭前進到右邊,一負載單一基板的光罩組件501先裝載到一光罩載具503上,該光罩載具503支持多個光罩組件。之後將該光罩載具503裝載到一基板載具505上。在本發明一種實施例中,位在該浮動的光罩組件501之間的彈簧使得光罩組件501能夠與設置在該基板載具505上的導引銷507嵌合,以使每個光罩都能夠對準其相應的基板。每一個負載單一基板的光罩組件是由一內部箔片光罩構成,以達成成本低廉且可多次重複使用的效果。該箔片光罩是由一薄片的磁性材料製成,並根據所需的設計形成開口。一外部光罩覆蓋該內部光罩,並可移除熱負荷,以保護該內部光罩,避免該箔片光罩變形。在該外部光罩設一開口,以露出該內部光罩具有開口的區域。一框架將該內部光罩和外部光罩支持在該光罩載具503上。磁體內建在該基板載具505上,用以拉動該內箔片光罩,使其接觸該基板。FIG. 5 shows an embodiment of a photomask and a carrier assembly according to the present invention. From the left along the curved arrow to the right, a photomask assembly 501 carrying a single substrate is first loaded onto a photomask carrier 503, which supports multiple photomask assemblies. The photomask carrier 503 is then loaded on a substrate carrier 505. In an embodiment of the present invention, the spring located between the floating photomask assemblies 501 enables the photomask assembly 501 to be fitted with the guide pin 507 provided on the substrate carrier 505 so that each photomask Are able to align their respective substrates. Each photomask assembly carrying a single substrate is composed of an internal foil photomask, so as to achieve the effect of low cost and repeated use. The foil reticle is made of a thin sheet of magnetic material and is formed with an opening according to a desired design. An external photomask covers the internal photomask, and a thermal load can be removed to protect the internal photomask and prevent the foil photomask from deforming. An opening is provided in the external photomask to expose a region of the internal photomask having an opening. A frame supports the inner mask and the outer mask on the mask carrier 503. A magnet is built in the substrate carrier 505 to pull the inner foil mask to contact the substrate.

每一個基板承載盤517,例如機械吸盤或靜電吸盤支持一個基板。個別吸盤517可加以改變,以支持不同形狀及/或尺寸的基板,使得相同的系統可用來加工不同尺寸和形狀的基板。在本實施例中,該吸盤517具有可伸縮的基板對準銷519,以及用以將該基板對準在該吸盤上面的裝置。在本實施例中,該用以對準的裝置包括一切口512,用來容納一可伸縮的推壓銷,該推壓銷用來將該基板推向該對準銷519,之後回縮,離開該切口512。這種設計可使該基板和該光罩對準該基板載具,使得該光罩對準到該基板上。Each substrate carrier 517, such as a mechanical chuck or an electrostatic chuck, supports one substrate. Individual chucks 517 can be modified to support substrates of different shapes and / or sizes, so that the same system can be used to process substrates of different sizes and shapes. In this embodiment, the suction cup 517 has a retractable substrate alignment pin 519 and a device for aligning the substrate on the suction cup. In this embodiment, the device for alignment includes a slot 512 for receiving a retractable push pin for pushing the substrate toward the alignment pin 519 and then retracting, Leave the cut 512. This design allows the substrate and the photomask to be aligned with the substrate carrier, so that the photomask is aligned on the substrate.

應當理解的是,迄今所描述的系統可以降低製造成本並可用來高效率的真空加工多種基板,例如:太陽能電池、觸控螢幕等。該系統可以配置成從兩端或一端裝載和卸載,亦即,基板可從一側裝載和卸載,或是從一側裝載並從相對的一側卸載。基板的載送都不是在真空中進行。該系統為模組化系統,可根據需要在入口的裝載腔和出口的卸載腔之間安裝所需數量的真空加工腔。該真空加工腔的設計簡單,且僅有少數元件位在真空環境中。該真空腔安裝方向可以朝向水平方向或垂直方向。例如:在太陽能電池的製程中,該系統可以加工朝向水平方向的基板,而對觸控螢幕的基板則可以加工朝向垂直方向的基板。但無論採用何種朝向加工,在大氣環境下裝載、卸載和輸送基板,都是使基板朝向在水平方向進行。而該加工源,例如:濺鍍源,可安裝在基板的上方及/或下方。該系統可以用來進行通過型或靜止型的加工,亦即,該基板在真空加工過程中可以是靜止不動或保持移動。該腔室可容納濺鍍源、熱源、植入離子束源、離子蝕刻源等。It should be understood that the systems described so far can reduce manufacturing costs and can be used to efficiently vacuum process a variety of substrates, such as solar cells, touch screens, and the like. The system can be configured to be loaded and unloaded from both ends or from one end, that is, the substrate can be loaded and unloaded from one side, or from one side and unloaded from the opposite side. None of the substrates are carried in a vacuum. This system is a modular system, and the required number of vacuum processing chambers can be installed between the loading chamber at the inlet and the unloading chamber at the outlet as required. The design of the vacuum processing cavity is simple, and only a few components are located in a vacuum environment. The installation direction of the vacuum chamber can be horizontal or vertical. For example: in the manufacturing process of solar cells, the system can process substrates facing the horizontal direction, while the substrates for touch screens can process substrates facing the vertical direction. However, no matter what orientation processing is used, loading, unloading, and transporting substrates in the atmospheric environment always have the substrates oriented horizontally. The processing source, such as a sputtering source, can be mounted above and / or below the substrate. The system can be used for either pass-through or stationary processing, that is, the substrate can be stationary or kept moving during vacuum processing. The chamber can contain a sputtering source, a heat source, an implanted ion beam source, an ion etching source, and the like.

該真空腔如果用來製造太陽能電池,則可以包括一低能量(例如,低於15千伏特)植入機。對於特定的太陽能電池設計,例如:鈍化射極及背面太陽能電池(PERC)、交指背接觸電極太陽能電池(IBC)或選擇性射極太陽能電池(SE),該光罩裝置可用於執行遮蔽植入材料。此外,紋理蝕刻(texture etch)可以在有光罩或沒有光罩之下進行,並使用一離子蝕刻源或雷射輔助蝕刻機。對於點接觸的太陽能電池而言,可以使用有多數孔洞對準到該接點的光罩。同時,厚金屬層的形成則可使用串聯數個物理氣相沉積腔,並依序形成層層堆疊的薄膜而達成。The vacuum cavity, if used to make solar cells, may include a low-energy (eg, less than 15 kV) implanter. For specific solar cell designs, such as: passivated emitter and backside solar cells (PERC), interdigital back contact electrode solar cells (IBC) or selective emitter solar cells (SE), the mask device can be used to perform shaded implants Into the material. In addition, texture etch can be performed with or without a mask, and an ion etching source or laser assisted etching machine is used. For point-contact solar cells, a photomask with a large number of holes aligned to the contact can be used. At the same time, the formation of a thick metal layer can be achieved by using several physical vapor deposition chambers in series and sequentially forming a layer-by-layer thin film.

如果用來製造觸控面板,該腔室可以用來使用物理氣相沉積源堆疊冷及/或熱透明導電薄膜。製程中可以將數片,例如3片觸控面板以寬度方向排列在每個載具上,並使數個,例如兩個載具同時位在一個腔室內部,進行加工,以簡化裝卸載及輸送,但獲得較高的載量。與此相同的系統可用來移送如平板電腦或手機的觸控螢幕大小的玻璃,而不需要在內部進行任何重新配置。簡單的說,只要對該載具作適當的修改,但整個系統仍維持不變。同樣的,基板的裝卸載及移送都不在真空中進行。If used to make a touch panel, the chamber can be used to stack cold and / or hot transparent conductive films using a physical vapor deposition source. In the manufacturing process, several pieces, for example, three touch panels can be arranged on each carrier in the width direction, and several, such as two carriers, can be located inside a chamber at the same time for processing to simplify loading and unloading Conveying, but getting a higher load. The same system can be used to move touchscreen-sized glass, such as a tablet or mobile phone, without requiring any internal reconfiguration. Simply put, as long as the vehicle is appropriately modified, the entire system remains unchanged. Similarly, loading, unloading, and transfer of substrates are not performed in a vacuum.

上述的載送和加工操作方法可以使用於所有形態和尺寸的基板。一未裝載的載具從載具返回升降裝置移動到裝載站。如果有使用光罩,則將該光罩移除並停留在該升降裝置上。將基板在大氣環境下裝載到載具上。該載具回到該升降裝置,將該光罩放置到該基板上方。然後將該載具移動到該裝載腔。在真空中該載具的輸送是經由簡單的磁化滾輪完成。該磁化滾輪配置在腔室壁上,並從腔室外部的大氣環境或真空環境提供動力。該腔室可具有隔離閥門,且可具有加工源,位在一抽屜上方或抽屜內,以從下方加工該基板。該基板可在該系統的卸載端移除,或留在載具上以返回該裝載端,亦即,基板進入該系統的一側。載具利用簡單的輸送帶,從該系統的加工端返回至該系統的裝載端。簡單的插銷輸送裝置在裝載站或卸載站升起或降低該載具。The aforementioned carrying and processing operation methods can be used for substrates of all shapes and sizes. An unloaded vehicle is moved from the vehicle return lift to the loading station. If a photomask is used, remove the photomask and stay on the lifting device. The substrate is mounted on a carrier in an atmospheric environment. The carrier returns to the lifting device and places the photomask over the substrate. The carrier is then moved to the loading cavity. The transport of the vehicle in a vacuum is done via a simple magnetized roller. The magnetized roller is arranged on the wall of the chamber and is powered from the atmospheric environment or the vacuum environment outside the chamber. The chamber may have an isolation valve and may have a processing source positioned above or in a drawer to process the substrate from below. The substrate can be removed at the unloading end of the system, or left on the carrier to return to the loading end, that is, the side where the substrate enters the system. The carrier uses a simple conveyor belt to return from the processing end of the system to the loading end of the system. A simple latch conveyor raises or lowers the vehicle at the loading or unloading station.

圖6A至圖6C顯示本發明三種實施例,以展示該真空腔可以配合具有不同尺寸和不同構造的不同加工源。在圖6A至圖6C的實施例中,呈現該基板在寬度方向排列成三單位,但當然可以在一載具上使更多或更少單位的基板在寬度方向排列。此外,在圖6A至圖6C中,是假設該加工腔可容納多個載具,亦即,兩個或三個同時進行加工。在圖6A至圖6C中所顯示的加工源可是任何加工源,例如:PVD、蝕刻、植入材料等。6A to 6C show three embodiments of the present invention to show that the vacuum chamber can cooperate with different processing sources having different sizes and different configurations. In the embodiments of FIGS. 6A to 6C, it is shown that the substrate is arranged in three units in the width direction, but of course, more or fewer units of the substrate can be arranged in the width direction on a carrier. In addition, in FIGS. 6A to 6C, it is assumed that the processing chamber can accommodate a plurality of carriers, that is, two or three are processed at the same time. The processing source shown in FIGS. 6A to 6C may be any processing source, such as: PVD, etching, implant materials, and the like.

圖6A顯示本發明一種實施例,其中在腔室600內使用單一加工源601。此單一加工源用以加工所有位在該腔室600內的基板。該加工源601具有的長度及/或寬度能同時覆蓋所有的基板。對於一些加工源,製造一大尺寸的單一加工源可能太複雜或太昂貴。例如,如果加工源601是一濺鍍源,該靶材就必須非常龐大並且昂貴、複雜,同時也會導致利用率不足。因此,根據圖6B和圖6C的實施例,乃是使用多個尺寸較小的加工源。在圖6B的實施例中,每一個加工源603A至603C的寬度僅足夠覆蓋單一基板,但在長度方向,亦即,在基板行進的方向則足以覆蓋多於一個基板。通過交錯排列該加工源,使得雖然每一個加工源僅可以覆蓋在每一個載具上的單一基板,但仍可加工所有基板。這種設置特別適合用於通過型的加工。相反的,在圖6C的實施例中,每一個加工源603A至603C的寬度足以覆蓋一載具上的所有基板,亦即,在垂直於基板行進的方向上排列的所有基板,但長度則不足以覆蓋所有位在該腔室內的基板。事實上,在一些實施例中,每一個加工源606A-606C的長度甚至是小於一個基板的長度。這種設置同樣適合於通過型以及靜止型的加工。FIG. 6A shows an embodiment of the present invention in which a single processing source 601 is used within the chamber 600. The single processing source is used to process all substrates located in the chamber 600. The processing source 601 has a length and / or a width capable of covering all substrates at the same time. For some processing sources, making a single processing source of a large size may be too complicated or too expensive. For example, if the processing source 601 is a sputtering source, the target must be very large, expensive, and complicated, and it may also cause insufficient utilization. Therefore, according to the embodiment of FIGS. 6B and 6C, a plurality of smaller-sized processing sources are used. In the embodiment of FIG. 6B, the width of each processing source 603A to 603C is sufficient to cover only a single substrate, but in the length direction, that is, in the direction in which the substrate travels, it is sufficient to cover more than one substrate. By staggering the processing sources, although each processing source can only cover a single substrate on each carrier, all substrates can still be processed. This arrangement is particularly suitable for pass-through processing. In contrast, in the embodiment of FIG. 6C, the width of each processing source 603A to 603C is sufficient to cover all substrates on a carrier, that is, all substrates arranged in a direction perpendicular to the substrate traveling direction, but the length is insufficient To cover all the substrates located in the chamber. In fact, in some embodiments, the length of each processing source 606A-606C is even less than the length of a substrate. This setting is also suitable for through and stationary machining.

如上所述的實施例提供一真空加工腔,並具有一真空殼體,其尺寸足以同時容納及加工多個基板載具。該殼體也配置為可同時支持多個加工源。該加工源可以為,例如:濺鍍源。該加工源可為窄型的加工源,具有足夠長度以涵蓋由一基板載具所支持的基板,但其寬度則可短於放置在該載具上的基板的寬度。可將數個此種加工源一個接著一個,以該載具的輸送方向排列在腔室的長度上的全部或一部份。該腔室具有多個轉軸,配置在該腔室上的相反兩側,以在腔室內輸送該載具。每一個轉軸是以馬達所驅動的一彈性皮帶帶動旋轉。每一個轉軸上以交替磁極的順序配置多個磁化滾輪,亦即,當一滾輪的外圈為磁南極且內圈為磁北極時,其鄰近的滾輪則是外圈為磁北極且內圈為磁南極。該腔室也具有一入口側壁,該入口側壁具有一進入開口,以及一出口側壁。該出口側壁位於該入口側壁的相對側,並具有一離開開口;其中有一磁化滾輪配置是位在該入口側壁內,並穿越該進入開口內部,另有一磁化滾輪配置,是位在該出口側壁內,並穿越該離開開口內部,用以驅動該基板載具通過該進入開口和離開開口。The embodiment described above provides a vacuum processing chamber and has a vacuum housing, which is large enough to accommodate and process multiple substrate carriers at the same time. The housing is also configured to support multiple processing sources simultaneously. The processing source may be, for example, a sputtering source. The processing source may be a narrow processing source having a sufficient length to cover a substrate supported by a substrate carrier, but its width may be shorter than the width of a substrate placed on the carrier. Several such processing sources can be arranged one after the other, all or part of the length of the chamber in the direction of the carrier's conveyance. The chamber has a plurality of rotating shafts, which are arranged on opposite sides of the chamber to convey the carrier in the chamber. Each rotating shaft is driven by an elastic belt driven by a motor. A plurality of magnetized rollers are arranged on each rotating shaft in the order of alternating magnetic poles, that is, when the outer ring of a roller is a magnetic south pole and the inner ring is a magnetic north pole, its adjacent rollers are an outer ring with a magnetic north pole and an inner ring Magnetic South Pole. The chamber also has an inlet side wall, the inlet side wall has an inlet opening, and an outlet side wall. The exit side wall is located on the opposite side of the entrance side wall and has an exit opening; one of the magnetizing rollers is located in the entrance side wall and passes through the entrance opening; another magnetizing roller is located in the exit side wall. And pass through the inside of the exit opening to drive the substrate carrier through the entrance opening and the exit opening.

本發明所揭示的系統是一種線性系統,該系統的多數腔室為線性配置 ,一腔室耦接在另一腔室之後,使基板載具可從系統的一側進入該系統,以線性方式移動穿過所有腔室,並從系統上的相反側退出該系統。該載具從一腔室經由分隔兩腔室的閘閥直接移動到下一個腔室。一旦一載具離開該系統的真空環境,即會進入一升降裝置,而垂直移動到一回送裝置,該回送裝置水平輸送該載具返回該系統的入口側,並在該入口側進入另一升降裝置,而垂直移動,以供裝載未加工的基板,並再次進入該系統的真空環境中。雖然該載具在大氣環境中輸送時是保持朝向水平方向,然而,在一種實施例中,當該載具進入該真空環境時會旋轉而朝向一垂直方向,使該基板保持朝向一垂直方向而進行加工。The system disclosed by the present invention is a linear system. Most of the chambers of the system are configured linearly. One chamber is coupled to another chamber, so that the substrate carrier can enter the system from one side of the system in a linear manner. Move through all the chambers and exit the system from the opposite side on the system. The carrier moves directly from one chamber to the next via a gate valve that separates the two chambers. Once a vehicle leaves the vacuum environment of the system, it enters a lifting device and moves vertically to a loopback device that transports the vehicle horizontally back to the entrance side of the system and enters another lift at the entrance side The device is moved vertically for loading unprocessed substrates and re-enters the vacuum environment of the system. Although the carrier is maintained in a horizontal direction during transportation in the atmospheric environment, in one embodiment, when the carrier enters the vacuum environment, the carrier is rotated to face a vertical direction, so that the substrate is kept in a vertical direction. For processing.

本發明的系統具有一裝載及卸載站,配置在該系統的入口側。該裝載及卸載系統具有一旋轉結構,其上配置四排吸盤,在旋轉軸的兩側各配置兩排。在該旋轉軸的兩側中,每一側所配置的吸盤有一排建置為用以卸載已加工的基板,而且一排吸盤則建置為用以裝載未加工的基板。該旋轉結構建置為用以垂直移動,其中,當其位在其較低位置時該結構可拾取基板,且當其位在上升位置時,該結構會轉動180度。此外,當該結構位在其較低位置時,在其旋轉軸的兩側都會有一排吸盤拾取基板,而另一排的吸盤則放置基板,亦即,釋出其基板。在本發明一種實施例中,則提供兩輸送裝置,穿越該系統的入口,其中一輸送裝置用以輸送未加工的基板,而另一輸送裝置則用以移除已加工的基板。該旋轉結構是建置成使得當其位在較低位置時,有一排吸盤會對準該正輸送未加工的基板的輸送裝置,而另一排的吸盤則對準該正移除已加工的基板的輸送裝置。同時,在該旋轉軸的另一側,有一排吸盤對準一空的載具,而另一排吸盤則對準一承載已加工基板的載具。The system of the present invention has a loading and unloading station arranged on the entrance side of the system. The loading and unloading system has a rotating structure, on which four rows of suction cups are arranged, and two rows are arranged on both sides of the rotating shaft. On both sides of the rotation shaft, a row of suction cups arranged on each side is built to unload processed substrates, and a row of suction cups is built to load unprocessed substrates. The rotating structure is built for vertical movement, where the structure can pick up a substrate when it is in its lower position, and it rotates 180 degrees when it is in the raised position. In addition, when the structure is in its lower position, there will be a row of suction cups picking up the substrate on both sides of its rotation axis, and another row of suction cups will place the substrate, that is, release its substrate. In one embodiment of the present invention, two conveying devices are provided to pass through the entrance of the system. One of the conveying devices is used to convey the unprocessed substrate, and the other is used to remove the processed substrate. The rotating structure is built so that when it is in a lower position, one row of suction cups is aligned with the conveying device that is transporting the unprocessed substrate, and the other row of suction cups is aligned with the process that is removing the processed substrate. Substrate conveying device. At the same time, on the other side of the rotating shaft, a row of suction cups is aligned with an empty carrier, and another row of suction cups is aligned with a carrier carrying a processed substrate.

在本發明一些實施例中提供一種裝置,用以施加電位到該基板。準確地說,每一個載具包括一支導電條。當該載具進入一加工腔時,該導電條即插入一滑動接點中,該滑動接點包括一長形的接觸刷,及一共形的絕緣彈簧,該彈簧配置成可將該導電條壓向並抵靠該長形的接觸刷。一絕緣條,例如一卡普頓膠帶(Kapton strip),可用以將該導電條附著到該載具上。In some embodiments of the present invention, a device is provided for applying a potential to the substrate. To be precise, each carrier includes a conductive strip. When the carrier enters a processing chamber, the conductive strip is inserted into a sliding contact. The sliding contact includes an elongated contact brush and a conformal insulating spring. The spring is configured to press the conductive strip. Toward and abut the elongated contact brush. An insulating strip, such as a Kapton strip, can be used to attach the conductive strip to the carrier.

當該基板的加工需要使用光罩時,該光罩可逐一放置在每個基板上方,或可形成一光罩以同時覆蓋一載具上的所有基板。該光罩可以使用例如:磁體固定其位置。然而,為能精確加工,該光罩應當製作成非常的薄,且可能因加工過程的熱應力而變形。此外,薄形的光罩可能會迅速累積沉積物,且該沉積物可能干擾該光罩精確的定位和掩蔽的區域。因此,根據以下所公開的實施例,使用雙光罩裝置將可改善這個問題。When a photomask is required for the processing of the substrate, the photomask can be placed over each substrate one by one, or a photomask can be formed to cover all substrates on a carrier at the same time. The mask can be fixed in position using, for example, a magnet. However, for accurate processing, the photomask should be made very thin and may be deformed by thermal stress during processing. In addition, thin photomasks can quickly accumulate deposits, and the deposits can interfere with the precise positioning and masking areas of the photomask. Therefore, according to the embodiments disclosed below, the use of a dual mask device will improve this problem.

圖7A至圖7E顯示根據本發明不同實施例中,一多晶圓載具(在本實施例中是以直線排列)具有雙光罩設置。圖7A顯示一具有雙光罩配置的多晶圓載具,其中該光罩配置位在較低位置,在該位置上使內部光罩與晶圓作物理性的緊密接觸;圖7B顯示一具有雙光罩配置的多晶圓載具,其中該光罩配置位在上升位置,從而可更換該晶圓;圖7C顯示一具有雙光罩配置的多晶圓載具,其中包括晶圓抬升器,用以裝載/卸載晶圓(晶圓在該圖示中省略);圖7D顯示一具有雙光罩配置的多晶圓載具的部份橫截面,其中該光罩配置和該晶圓抬升器都位於上升位置;而圖7E則顯示具有雙光罩配置的多晶圓載具的部份橫截面,其中該光罩配置及該晶圓抬升器都位在該較低位置。FIG. 7A to FIG. 7E show a multi-wafer carrier (arranged in a straight line in this embodiment) with a double mask arrangement according to different embodiments of the present invention. FIG. 7A shows a multi-wafer carrier with a dual-mask configuration, wherein the mask configuration is located at a lower position, in which the internal mask is reasonably in close contact with the wafer crop; FIG. 7B shows a dual-light configuration A multi-wafer carrier with a mask configuration, in which the mask configuration is in a raised position, so that the wafer can be replaced; FIG. 7C shows a multi-wafer carrier with a dual-mask configuration, which includes a wafer lifter for loading / Unload the wafer (wafer is omitted in this illustration); Figure 7D shows a partial cross-section of a multi-wafer carrier with a dual photomask configuration, where the photomask configuration and the wafer lifter are both in a raised position 7E shows a partial cross-section of a multi-wafer carrier with a dual-mask configuration, where the mask configuration and the wafer lifter are both in the lower position.

請先參考圖7A,圖中該多晶圓載具也稱作載具支撐700,具有三個分離的單晶圓載具或承載盤705,該承載盤705由一例如以陶瓷製作的承載盤框架或支桿710所支持。每一個單晶圓載具705配置為保持一單晶圓,連同一雙光罩配置。在圖7A中的該雙光罩配置是位於一較低位置,但在任何載具上都沒有顯示晶圓,以顯示該載具之結構。在圖7B中該雙光罩配置顯示位在上升位置,但同樣的,在任何該載具上都沒有顯示晶圓。在圖7A至圖7E所示的實施例中,一抬升器715用以升起和降低該雙光罩配置;然而,為降低成本及複雜性,抬升器715可予省略且該雙光罩配置可以手動方式抬升。輸送軌道725提供在框架710的每一個側邊,用以輸送該載具700運行穿越整個系統。Please refer to FIG. 7A first. The multi-wafer carrier is also referred to as a carrier support 700, and has three separate single-wafer carriers or carrier trays 705. The carrier tray 705 is formed by a carrier plate frame or Supported by pole 710. Each single wafer carrier 705 is configured to hold a single wafer, and is connected to the same double photomask configuration. The dual mask configuration in FIG. 7A is located in a lower position, but no wafer is shown on any carrier to show the structure of the carrier. The dual photomask configuration is shown in the raised position in FIG. 7B, but again, no wafers are shown on any of the carriers. In the embodiment shown in FIG. 7A to FIG. 7E, a lifter 715 is used to raise and lower the dual photomask configuration; however, to reduce cost and complexity, the lifter 715 may be omitted and the dual photomask configuration Can be lifted manually. Conveyor rails 725 are provided on each side of the frame 710 for conveying the carrier 700 through the entire system.

每一個單晶圓載具705具有一基座730(顯示在圖7B中)。基座730具有一高起的框架732,框架732具有一凹槽735,利用框架732的外圍支持懸吊一晶圓。該基座730和該框架732形成一袋740,位在該懸吊的晶圓下方,以有利於收集破碎的晶圓破片。在本發明一些實施例中,該框架732是與該基座730分離。外部光罩745配置成安裝在框架732上,以覆蓋該框架732,並覆蓋該內部光罩的外圍,但暴露出該內部光罩的中央部分;該中央部分即對應於該晶圓的範圍。這種配置顯示於圖8實施例的橫截面圖。Each single wafer carrier 705 has a pedestal 730 (shown in FIG. 7B). The base 730 has a raised frame 732, and the frame 732 has a groove 735. A periphery of the frame 732 is used to suspend a wafer. The base 730 and the frame 732 form a bag 740 located under the suspended wafer to facilitate the collection of broken wafer fragments. In some embodiments of the present invention, the frame 732 is separated from the base 730. The external photomask 745 is configured to be mounted on the frame 732 to cover the frame 732 and cover the periphery of the internal photomask, but the central portion of the internal photomask is exposed; the central portion corresponds to the range of the wafer. This configuration is shown in a cross-sectional view of the embodiment of FIG.

在圖8中,基座或承載盤805已經升起框架830,框架830有凹槽832,用以支持晶圓820的外周。該基座825及框架830形成袋840,且該晶圓820懸吊於該袋之上方。一系列磁體834配置在該升起的框架830內部,並圍繞該晶圓820的外周。在本發明一些實施例中,尤其是適用於高溫操作的實施例中,該磁體834可由釤鈷(SmCo)合金製成。內部光罩850配置在該升起的框架830及該晶圓820的上方,且由磁體834保持定位,以與該晶圓形成物理接觸。外部光罩845放置在內部光罩850上方,並與該內部光罩850形成物理接觸,使該外部光罩845覆蓋該內部光罩的外圍,但露出內部光罩850設計用以加工晶圓的區域。圖9顯示該外部光罩945的一種實例,該外部光罩在本實例以摺疊(例如以沖壓形成摺疊)的鋁片製成。在此實施例中該內部光罩由外部光罩覆蓋,但暴露出外部邊緣952的小區域,這是因為本實例係供邊緣分流隔離加工之用。該內部光罩750的一種實例,即作為邊緣分流隔離加工之用的實施例則顯示於圖10。該內部光罩750基本上為一金屬平板,具有一同於晶圓尺寸形狀的開口,但不同之處在於其尺寸略小,例如:比晶圓尺寸小1-2mm。在圖8的實施例中提供光罩框架836,用來支持並抬升該內部光罩和外部光罩,以從載具卸除。在上述的配置之下,該外部光罩845夾設在該光罩框架836和該內部光罩850之間。In FIG. 8, the base or carrier tray 805 has raised the frame 830, and the frame 830 has a groove 832 to support the outer periphery of the wafer 820. The base 825 and the frame 830 form a pocket 840, and the wafer 820 is suspended above the pocket. A series of magnets 834 are disposed inside the raised frame 830 and surround the outer periphery of the wafer 820. In some embodiments of the present invention, particularly in embodiments suitable for high temperature operation, the magnet 834 may be made of SmCo alloy. The internal photomask 850 is disposed above the raised frame 830 and the wafer 820, and is held in place by a magnet 834 to form physical contact with the wafer. The external photomask 845 is placed above the internal photomask 850 and makes physical contact with the internal photomask 850 so that the external photomask 845 covers the periphery of the internal photomask, but exposes the internal photomask 850 designed to process wafers. region. FIG. 9 shows an example of the external photomask 945, which in this example is made of a folded aluminum sheet (eg, formed by pressing to form a fold). In this embodiment, the inner reticle is covered by the outer reticle, but a small area of the outer edge 952 is exposed, because this example is used for edge shunt isolation processing. An example of the internal reticle 750, that is, an embodiment used for edge shunt isolation processing is shown in FIG. The internal photomask 750 is basically a metal flat plate with an opening that is the same as the shape of the wafer, but the difference is that its size is slightly smaller, for example: 1-2 mm smaller than the wafer size. A photomask frame 836 is provided in the embodiment of FIG. 8 to support and lift the internal photomask and the external photomask for removal from the carrier. Under the above configuration, the outer mask 845 is sandwiched between the mask frame 836 and the inner mask 850.

圖8A展示了另一個實施例,其可用於例如在晶圓的背面上形成接點圖案。在該實施例中,基座形成一頂部平台以支撐在其整個表面上的晶圓。磁體834嵌入在承載盤的整個區域上,位於承載盤的頂部表面的下方。內光罩850覆蓋晶圓820的整個表面,並根據接點設計具有數個孔洞。FIG. 8A illustrates another embodiment, which can be used, for example, to form a contact pattern on the backside of a wafer. In this embodiment, the pedestal forms a top platform to support the wafer on its entire surface. The magnet 834 is embedded over the entire area of the carrier disc, below the top surface of the carrier disc. The inner photomask 850 covers the entire surface of the wafer 820 and has several holes according to the contact design.

現回到圖7A至圖7E。抬升器715可用以將該外部光罩連同該內部光罩升起。此外,晶圓抬升器752可用以從該框架730抬升,卸除該晶圓,故可使用一機械手臂以一未加工的晶圓替換,以進行加工。然而,也可省略抬升器715和752,而將該光罩的升降操作改以手動替代完成,或者通過其他方法作為代替。Now return to FIGS. 7A to 7E. A lifter 715 may be used to raise the external photomask along with the internal photomask. In addition, the wafer lifter 752 can be used to lift from the frame 730 and remove the wafer, so a robotic arm can be used to replace an unprocessed wafer for processing. However, the lifters 715 and 752 can also be omitted, and the lifting operation of the photomask can be replaced by manual replacement, or replaced by other methods.

參考上述圖8的實施例。在此實施例中,該載具在晶圓外周邊緣支持該晶圓,使該晶圓形成懸吊狀態。晶圓下方所形成的袋是用以盛裝破碎的晶圓破片,並避免沉積材料堆積。另一方面,在圖8A的實施例中,該晶圓是以其整個表面被支持。將該光罩組件下降到可以進行濺鍍或其他形式的加工的位置,之後以手動或機械方式升起,以裝載和卸載晶圓。一系列設在該載具上的磁體幫助保持內部光罩於定位,並與該晶圓形成緊密接觸。經過反覆使用後,可將該外部和內部光罩替換,而該載具組件的其餘部分則可重複使用。該框架710也可稱為光罩組件側桿,可由低熱膨脹係數材料,例如氧化鋁或鈦製成。Reference is made to the embodiment of FIG. 8 described above. In this embodiment, the carrier supports the wafer at the periphery of the wafer, so that the wafer is suspended. The bag formed under the wafer is used to contain broken wafer fragments and to avoid accumulation of deposited material. On the other hand, in the embodiment of FIG. 8A, the wafer is supported by its entire surface. The mask assembly is lowered to a position where sputtering or other forms of processing can be performed, and then raised manually or mechanically to load and unload wafers. A series of magnets on the carrier help keep the internal reticle in place and make close contact with the wafer. After repeated use, the external and internal masks can be replaced, and the rest of the vehicle assembly can be reused. The frame 710 may also be referred to as a mask assembly side bar, and may be made of a material with a low thermal expansion coefficient, such as alumina or titanium.

根據上述實施例,該內部光罩與基板建立一緊密,無間距的接觸。該外部光罩則保護該內部光罩、該載具以及該載具框架,以避免受材料沉積。在該實施例中顯示,該外部和內部光罩的開口均為一偽正方形,適合應用在單晶體太陽能電池製程中,進行邊緣分流隔離加工。在其他種類的加工製程中,該內部光罩具有一定的開口配置,而該外部光罩也是具有該偽正方形的開口。所稱之偽正方形是指一方形,其各角切出切口,且開切口形狀相同於一用以切割出晶圓的圓形鑄錠的形狀。當然,如果使用多晶體正方形晶圓進行加工,則該外部和內部光罩的開口形狀應以正方形較佳。According to the above-mentioned embodiment, the internal photomask establishes a tight, non-pitch contact with the substrate. The external photomask protects the internal photomask, the carrier, and the carrier frame from material deposition. It is shown in this embodiment that the openings of the external and internal photomasks are both pseudo-squares, and are suitable for being applied to a single crystal solar cell process for edge shunt isolation processing. In other types of processing processes, the inner mask has a certain opening configuration, and the outer mask also has the pseudo-square opening. The so-called pseudo-square refers to a square whose cutouts are cut at each corner, and the shape of the cutout is the same as the shape of a circular ingot used to cut out a wafer. Of course, if a polycrystalline square wafer is used for processing, the opening shapes of the external and internal photomasks should be square.

圖11顯示該單晶圓承載盤1105的一種實施例。該晶圓以其外周置放在凹槽1132內。磁體1134 (以虛線顯示)設置在載具內,排列在該晶圓周圍全部。對準銷1160用以使該外部光罩對準到該承載盤1105。該外部光罩的一實施例如圖12所示,圖中顯示由下往上觀察的狀態。該外部光罩1245是由沖壓金屬片製成。該外部光罩具有對準孔或凹槽1262,分別對應到該載具1205的對準銷1260。FIG. 11 shows an embodiment of the single wafer carrier tray 1105. The wafer is placed in the groove 1132 with its periphery. Magnets 1134 (shown in dotted lines) are placed inside the carrier, all arranged around the wafer. The alignment pins 1160 are used to align the external photomask to the carrier tray 1105. An example of the external photomask is shown in FIG. 12, and the figure shows a state viewed from the bottom to the top. The external photomask 1245 is made of a stamped metal sheet. The external photomask has alignment holes or grooves 1262 corresponding to the alignment pins 1260 of the carrier 1205, respectively.

圖13顯示本發明中一種頂部框架1336的實施例,該框架1336用以支持該外部和內部光罩,並固定兩光罩到該承載盤。該頂部框架1336可以由例如:兩條縱向桿1362製成,並以兩條橫向桿1364結合在一起。該外部光罩保持在該袋1366內。對準孔1368用以將該頂部框架對準到該承載盤。FIG. 13 shows an embodiment of a top frame 1336 according to the present invention. The frame 1336 is used to support the external and internal photomasks and fix two photomasks to the carrier tray. The top frame 1336 may be made of, for example, two longitudinal bars 1362 and joined together with two transverse bars 1364. The external reticle is held within the bag 1366. The alignment hole 1368 is used to align the top frame to the carrier tray.

圖14顯示本發明中一種具有孔洞圖案設計的內部光罩的實施例。該內部光罩用於例如在該晶圓上製作複數個接點。這種內部光罩可與如圖15所示的承載盤一起使用,其中的磁體1534是分布在該晶圓表面之下的整個區域。該磁體配置為磁極交替排列。FIG. 14 shows an embodiment of an internal mask with a hole pattern design in the present invention. The internal photomask is used to make a plurality of contacts on the wafer, for example. This internal reticle can be used with a carrier plate as shown in FIG. 15, where the magnets 1534 are distributed over the entire area below the surface of the wafer. The magnet is configured so that the magnetic poles are alternately arranged.

一上部或外部光罩可由薄板,例如厚度約0.03英吋(76.2mm)的鋁、鋼或其他類似材料製成,且配置成可與一基板載具相配適。一內部光罩則由非常薄的,例如:約0.001至0.003英吋(2.54-7.62mm)的平坦鋼片或其他磁性材料製成,且配置成可嵌入至該外部光罩中。An upper or outer reticle may be made of a thin plate, such as aluminum, steel, or other similar material having a thickness of about 0.03 inches (76.2 mm), and is configured to fit a substrate carrier. An inner reticle is made of a very thin, for example, about 0.001 to 0.003 inch (2.54-7.62mm) flat steel sheet or other magnetic material, and is configured to be embedded in the outer reticle.

根據進一步的實施例,本發明提供在加工過程中用以支持晶圓的配置,包括:一晶圓載具或承載盤,具有一升起的框架,該升起框架具有一凹槽,用以支持一晶圓,並圍繞該晶圓的外周,且將該晶圓規制於預定位置;一內部光罩,配置為設置於該升起框架的上方,該內部光罩具有一開口裝置,配置成可遮蔽該晶圓的部分,並暴露該晶圓的其餘部分;及一外部光罩,配置為設置於該升起框架上方,並位於該內部光罩上方,該外部光罩具有一單一開口,配置成可部分覆蓋該內部光罩。可使用一頂部框架載具以支持該內部及外部光罩,並將該內部光罩和外部光罩固定到該晶圓承載盤。According to a further embodiment, the present invention provides a configuration for supporting a wafer during processing, including: a wafer carrier or a tray having a raised frame, the raised frame having a groove for supporting A wafer surrounds the periphery of the wafer, and the wafer is regulated at a predetermined position; an internal photomask is configured to be disposed above the lifting frame, and the internal photomask has an opening device configured to be Shielding a portion of the wafer and exposing the remaining portion of the wafer; and an external photomask configured to be disposed above the lifting frame and positioned above the internal photomask, the external photomask having a single opening configured It is possible to partially cover the internal photomask. A top frame carrier may be used to support the internal and external photomasks and secure the internal and external photomasks to the wafer carrier tray.

磁體位於該承載盤內,且以交替的N-S-N-S-N磁極排列,圍繞該框架的全部周邊,或配置在該承載盤表面下方的整個區域,並且位在晶圓的正下方。該外部和內部光罩設計成只藉由磁力貼住該框架,使裝載和卸載基板得以簡單且快速的方式進行。The magnets are located in the carrier disk, and are arranged in alternating N-S-N-S-N magnetic poles, surrounding the entire periphery of the frame, or disposed in the entire area below the surface of the carrier disk, and located directly below the wafer. The external and internal photomasks are designed to be attached to the frame by magnetic force only, making loading and unloading of substrates easy and fast.

該光罩組件可從該晶圓載具及光罩框架上移除,以便將基板裝載到載具內。該外部光罩和內部光罩兩者作為該光罩組件的一部份,而會同時抬升。一旦該晶圓已經放置到載具的該晶圓袋內,即將該光罩組件下降,回到該載具上。此時該內部光罩會覆蓋在該晶圓的表面上方。在該載具框架內的磁體會向下拉動該內部光罩,以使其與該基板緊密接觸。以此在該晶圓邊緣形成一緊密搭配的密封。該外部光罩設計成可防止沉積物沉積在該薄的,搭配的內部光罩上。如上所述,該沉積製程可能造成內部光罩升溫,從而導致該光罩翹曲,而無法與晶圓良好接觸。如果該光罩與該晶圓接觸不良,則所形成的金屬薄膜會沉積在該基板晶圓表面上的排除區域。但由於有該口袋,以及由該磁體產生的摩擦力,可使該基板和光罩在輸送和沉積的過程中不會發生相對位移。另該外部光罩則可防止薄膜沉積在該內部光罩上,並且防止該內部光罩翹曲。The photomask assembly can be removed from the wafer carrier and the photomask frame to load the substrate into the carrier. Both the external photomask and the internal photomask are part of the photomask assembly and are lifted simultaneously. Once the wafer has been placed in the wafer bag of the carrier, the photomask assembly is lowered and returned to the carrier. At this time, the internal mask will cover the surface of the wafer. The magnet inside the carrier frame pulls down the internal photomask to make it in close contact with the substrate. This forms a tightly matched seal at the edge of the wafer. The external reticle is designed to prevent deposits from depositing on the thin, matching internal reticle. As described above, the deposition process may cause the internal photomask to heat up, thereby causing the photomask to warp and fail to make good contact with the wafer. If the photomask is not in good contact with the wafer, the formed metal film is deposited on a excluded area on the substrate wafer surface. However, due to the pocket and the friction generated by the magnet, the substrate and the photomask can be prevented from undergoing relative displacement during transportation and deposition. In addition, the external photomask can prevent a thin film from being deposited on the internal photomask, and prevent the internal photomask from warping.

該光罩組件可與載具一起,使用一真空載具替換裝置,定期從該系統移除。該載具替換裝置為一可攜式真空包裝,具有載具輸送裝置。該可攜式真空包裝可於加工過程中進行載具的替換,而不須將系統在連續操作中停機。The photomask assembly can be removed from the system with the carrier periodically using a vacuum carrier replacement device. The carrier replacement device is a portable vacuum package with a carrier conveying device. The portable vacuum packaging can replace the carrier during the process without having to stop the system in continuous operation.

圖16A-16D顯示本發明一種實施例,該實施例可以在一個裝載站,例如裝載站105內部實施。在該實施例中,晶圓承載板用於支撐晶圓,其中晶圓承載板是以可拆卸的方式附接到載具的底面,而雙光罩配置則附接到載具的頂面。圖16A-16D僅展示系統的相關部分,以便簡化說明。此外,也有一些元件被移除,使該實施例的特徵更容易看到。16A-16D show an embodiment of the present invention, which can be implemented inside a loading station, such as the loading station 105. In this embodiment, the wafer carrier plate is used to support the wafer, wherein the wafer carrier plate is detachably attached to the bottom surface of the carrier, and the dual photomask configuration is attached to the top surface of the carrier. Figures 16A-16D show only relevant parts of the system to simplify the description. In addition, some elements have been removed to make the features of this embodiment easier to see.

在圖16A-16D中,該載具1600包括一簡單框架1605,框架1605具有數個開口1602,都形成與待加工的基板,例如半導體晶圓相同的形狀,但可略大於基板,以使基板能夠從開口通過。多個晶圓承載板1610附接到每個載具1600的底部。晶圓承載板1610通常是形式簡單的鋁板,並可包括附接機構,以將晶圓承載板附接到載具1600的底面。當晶圓承載板1610附接到載具1600後,位於晶圓承載板1610前方表面上的基板1620即會與開口1602對準,並從開口1602中暴露。該附接機構可包括機械夾具,彈簧,磁體等。在本實施例中顯示有數個磁體1612(圖16C)用作附接機構。In FIGS. 16A-16D, the carrier 1600 includes a simple frame 1605. The frame 1605 has several openings 1602, all forming the same shape as a substrate to be processed, such as a semiconductor wafer, but may be slightly larger than the substrate so that the substrate Can pass through the opening. A plurality of wafer carrier plates 1610 are attached to the bottom of each carrier 1600. The wafer carrier plate 1610 is generally an aluminum plate in a simple form, and may include an attachment mechanism to attach the wafer carrier plate to the bottom surface of the carrier 1600. After the wafer carrier plate 1610 is attached to the carrier 1600, the substrate 1620 on the front surface of the wafer carrier plate 1610 is aligned with the opening 1602 and exposed from the opening 1602. The attachment mechanism may include a mechanical clamp, a spring, a magnet, and the like. Several magnets 1612 (FIG. 16C) are shown as attachment mechanisms in this embodiment.

光罩配置1649位於每個載具1600的頂面上,使得每個光罩配置1649可以覆蓋一個從該開口1602中暴露的基板。光罩配置1645可以是類似於圖9和圖10所示的雙光罩配置,但根據要執行的加工過程而定,亦可使用其他配置。例如,圖16E即顯示出一種雙光罩配置,其中的內光罩1650是簡單的以沖壓壓平的金屬片,在該實例中是以順磁性材料製成。至於外光罩1645則是簡單的鋁板,具有與內光罩開口類似形狀的開口,但略大於該內光罩開口。須注意的是,在該雙光罩配置中,關鍵僅在於內光罩的開口的內部尺寸,其他所有的尺寸則不需符合高裝配公差,因此可降低製造光罩的複雜性和成本。此外,在該配置中,光罩是以固定朝向附接到載具1600,使內光罩1650的開口與載具中的開口1602對準。The photomask configuration 1649 is located on the top surface of each carrier 1600, so that each photomask configuration 1649 can cover a substrate exposed through the opening 1602. The photomask configuration 1645 may be similar to the dual photomask configuration shown in FIG. 9 and FIG. 10, but other configurations may be used depending on the processing process to be performed. For example, FIG. 16E shows a dual photomask configuration, in which the inner photomask 1650 is a simple sheet metal that is stamped and flattened, and in this example is made of paramagnetic material. The outer reticle 1645 is a simple aluminum plate with an opening similar to the inner reticle opening, but slightly larger than the inner reticle opening. It should be noted that in this dual-mask configuration, the key is only the internal dimensions of the openings of the inner mask, and all other dimensions do not need to meet high assembly tolerances, so the complexity and cost of manufacturing the mask can be reduced. Further, in this configuration, the photomask is attached to the carrier 1600 in a fixed orientation, aligning the opening of the inner photomask 1650 with the opening 1602 in the carrier.

為了清楚起見,在一些圖式中載具1600是以懸置方式呈現,但該載具1600當然是受到支撐,並由例如圖1A所示的傳送機構載送。另一方面,晶圓承載板是在專用的輸送帶1632上獨立行進,直到傳送到台架1664時為止,然後附接到載具1600上。該機構的操作如下。升降機構1662用於將晶圓承載板1610裝載到晶圓承載板線性傳送器1663上,例如輸送帶上。提供一個台架機構1664用於對準每個晶圓承載板1610,使放置在其上的晶圓與內光罩1650的開口對準(使用相機1670),然後將晶圓承載板抬升,使其附接到載具1600。在該實施例中,當晶圓承載板位於台架1662上時,通過晶圓承載板1610中的孔洞1614施加真空,以保持晶圓並防止晶圓在對準過程中移動。一旦晶圓承載板已經附接到載具1600,就可以終止抽真空,因為如果將晶圓承載板夾持到載具,將會阻止晶圓移動。For clarity, the carrier 1600 is presented in a suspended manner in some drawings, but the carrier 1600 is of course supported and carried by a transfer mechanism such as shown in FIG. 1A. On the other hand, the wafer carrier plate travels independently on a dedicated conveyor belt 1632 until it is transferred to the stage 1664, and then attached to the carrier 1600. The operation of the mechanism is as follows. The lifting mechanism 1662 is used to load the wafer carrier plate 1610 on the wafer carrier plate linear conveyor 1663, such as a conveyor belt. A gantry mechanism 1664 is provided for aligning each wafer carrier plate 1610 so that the wafer placed thereon is aligned with the opening of the inner photomask 1650 (using the camera 1670), and then the wafer carrier plate is lifted so that It is attached to a vehicle 1600. In this embodiment, when the wafer carrying plate is located on the stage 1662, a vacuum is applied through the hole 1614 in the wafer carrying plate 1610 to maintain the wafer and prevent the wafer from moving during the alignment process. Once the wafer carrier board has been attached to the carrier 1600, the evacuation can be terminated because if the wafer carrier board is clamped to the carrier, the wafer will be prevented from moving.

此外,可以採用一個裝載機構1605(圖16D)將基板裝載到晶圓承載板1610上。值得注意的是,在將晶圓承載板1610裝載到載具之前,可先將基板裝載到晶圓承載板1610上。例如,在圖16A所示的時間點下,其中兩個晶圓承載板(標識為A和B)上並沒有晶圓,一個晶圓承載板(標識為C)上則放置有晶圓,但尚未附接到載具1600,而另一個晶圓承載板(標識為D)上也放置有晶圓,但已經被抬升而附接到載具1600。In addition, a loading mechanism 1605 (FIG. 16D) may be used to load the substrate onto the wafer carrier plate 1610. It is worth noting that the substrate can be loaded onto the wafer carrier plate 1610 before the wafer carrier plate 1610 is loaded onto the carrier. For example, at the time shown in FIG. 16A, there are no wafers on two wafer carrier boards (identified as A and B), and wafers are placed on one wafer carrier board (identified as C), but Not yet attached to the carrier 1600, and another wafer carrier plate (labeled D) has wafers placed on it, but has been lifted up and attached to the carrier 1600.

圖16A-D所示的實施例的優點在於,用於裝載和卸載晶圓的晶圓承載板的傳送,與載具和光罩的傳送分別進行。透過這種方式,晶圓承載板可以從用於清潔的系統中移除。此外,因為晶圓承載板由相當便宜的鋁板製成,故而可以容易以新的鋁板替換,而不影響系統的操作。An advantage of the embodiment shown in FIGS. 16A-D is that the transfer of the wafer carrier plate for loading and unloading the wafer is performed separately from the transfer of the carrier and the photomask. In this way, the wafer carrier board can be removed from the system for cleaning. In addition, because the wafer carrier plate is made of a relatively inexpensive aluminum plate, it can be easily replaced with a new aluminum plate without affecting the operation of the system.

如在圖16B和16D中更清楚顯示,空的載具1600是以升降器1635傳送到工作站,然後定位到傳送裝置,例如輸送帶1633上。在該實例中,每個載具都配置為可容納兩個用於同時加工兩個晶圓的晶圓承載板,但是該載具也可設置為可容納其他數量的晶圓承載板。另一個傳送裝置,例如輸送帶1632,是在傳送裝置1633的下方傳送晶圓承載板1610。一個晶圓裝載機構,例如機械手臂1605將晶圓放置在晶圓承載板1610上。當一片晶圓已經放置到晶圓承載板1610上時,傳送裝置1632即移動晶圓承載板1610至對準站,該對準站位於對準台1664的上方。接著使用真空幫浦1647向晶圓承載板傳送吸力,以便將晶圓保持在晶圓承載板上,並將晶圓承載板保持在對準台上。具體來說,晶圓承載板具有吸引孔1614,位於晶圓下方。當通過這些吸引孔1614施加吸力時,晶圓將會保持在晶圓承載板上,並密封這些孔。因此,這種被晶圓所阻擋吸力,將使晶圓承載板通因為真空而保持在抵靠對準台的狀態。同一時間中,傳送裝置1633將空的載具1600傳送到位於台架1664正上方的對準站。對準站中的載具具有光罩配置1649,附接至開口1602上。為了執行對準,致動器1667將載具1600從傳送裝置上抬升,使其機械地保持在一個靜止位置。台架1664接著抬升晶圓承載板,該控制器1671並根據需要使用以相機1670拍攝的影像,決定旋轉或平移晶圓,以使晶圓對準光罩1645的開口。一旦實現了適當的對準,下一步就是將晶圓承載板抬升,直到晶圓承載板接觸到載具的底面為止。此時真空終止,使晶圓承載板通過機械或磁性方式附接到載具。台架1664接著下降,以接受另一個晶圓承載板,同時傳送裝置1633則將已裝載的載具移出對準站,並將未裝載的載具帶入對準站。重複上述過程。As shown more clearly in FIGS. 16B and 16D, the empty carrier 1600 is transferred to the workstation by a lifter 1635, and then positioned on a transfer device, such as a conveyor belt 1633. In this example, each carrier is configured to accommodate two wafer carrier boards for processing two wafers at the same time, but the carrier may be configured to accommodate other number of wafer carrier boards. Another transfer device, such as a conveyor belt 1632, transfers the wafer carrier plate 1610 under the transfer device 1633. A wafer loading mechanism, such as a robot arm 1605, places a wafer on a wafer carrier plate 1610. When a wafer has been placed on the wafer carrier plate 1610, the transfer device 1632 moves the wafer carrier plate 1610 to an alignment station, which is located above the alignment table 1664. Vacuum pump 1647 is then used to transfer suction to the wafer carrier plate to hold the wafer on the wafer carrier plate and to hold the wafer carrier plate on the alignment table. Specifically, the wafer carrier board has a suction hole 1614 located under the wafer. When suction is applied through these suction holes 1614, the wafer will remain on the wafer carrier plate and seal the holes. Therefore, the suction force blocked by the wafer will keep the wafer carrier plate against the alignment table due to the vacuum. At the same time, the transfer device 1633 transfers the empty carrier 1600 to the alignment station located directly above the stand 1664. The carrier in the alignment station has a mask configuration 1649 attached to the opening 1602. To perform the alignment, the actuator 1667 lifts the carrier 1600 from the transfer device, holding it mechanically in a rest position. The stage 1664 then raises the wafer carrier board. The controller 1671 uses the image captured by the camera 1670 to rotate or translate the wafer as needed to align the wafer with the opening of the mask 1645. Once proper alignment is achieved, the next step is to lift the wafer carrier plate until the wafer carrier plate contacts the bottom surface of the carrier. The vacuum is terminated at this time, causing the wafer carrier plate to be mechanically or magnetically attached to the carrier. The gantry 1664 then descends to accept another wafer carrier, while the transfer device 1633 removes the loaded carrier from the alignment station and brings the unloaded carrier into the alignment station. Repeat the process.

在本發明用於裝載和加工基板的方法一種實施例中,是以如下的步驟進行:未載晶圓的載具從卸載站返回。在一些實施例,晶圓承載板是附接在載具上傳送。在這種實施例中,在此步驟是將晶圓承載板從載具上移除,並藉由例如升降機構1662降低到傳送裝置。另一種作法則是將晶圓承載板1610獨立於載具被送。一個裝載機構將數個晶圓放置到相應的晶圓承載板上,每個晶圓承載板上放置一個晶圓。然後使晶圓承載板和載具獨立地移動到一個對準站,其中有相機1670對晶圓和光罩進行成像。所得到的影像提供給控制器1671,以檢查光罩開口是否對準於晶圓。也就是說,在該特定實例中,光罩1645是以固定的朝向附接到載具。晶圓載具是定位在位於相機下方的x-y-z-θ四軸台架1664上。晶圓相對於光罩開口的位置/朝向,是由控制器根據相機1670所提供的影像來計算,控制器1671並向台架1664發送信號,以在必要時通過平移或旋轉x-y-z-θ四軸台架來修正光罩的朝向。晶圓承載板接著被抬升而附接到載具,使得晶圓移動至與內光罩接觸。在達到該位置後,以磁力將晶圓承載板保持在載具中,使得晶圓不能移動,然後可以釋放真空。此外,相同的磁力也用來將雙光罩配置保持在壓靠晶圓的狀態。藉此防止晶圓從其對準位置移動。也就是說,在本發明的一種實施例中,當晶圓承載板是位在對準站中,並且晶圓已經定位在對準位置時,即經由晶圓承載板施加真空於晶圓,進而防止晶圓移動。然而,一旦晶圓承載板已經附接到載具,且光罩也已經接觸到晶圓,則可終止真空幫補的運作。接著,將載具移動通過整個系統,以進行加工步驟,並在加工完成後,重複上述步驟。In one embodiment of the method for loading and processing a substrate according to the present invention, the method is performed as follows: a carrier that does not carry a wafer is returned from an unloading station. In some embodiments, the wafer carrier board is attached to a carrier for transfer. In this embodiment, in this step, the wafer carrier plate is removed from the carrier and lowered to the transfer device by, for example, a lifting mechanism 1662. Another method is to send the wafer carrier plate 1610 independently of the carrier. A loading mechanism places several wafers on a corresponding wafer carrier plate, and one wafer is placed on each wafer carrier plate. The wafer carrier plate and carrier are then independently moved to an alignment station, with a camera 1670 imaging the wafer and reticle. The obtained image is provided to the controller 1671 to check whether the mask opening is aligned with the wafer. That is, in this particular example, the photomask 1645 is attached to the vehicle in a fixed orientation. The wafer carrier is positioned on an x-y-z-θ four-axis stage 1664 located below the camera. The position / orientation of the wafer relative to the mask opening is calculated by the controller based on the image provided by the camera 1670. The controller 1671 sends a signal to the stage 1664 to translate or rotate the xyz-θ four-axis if necessary A stand to correct the orientation of the mask. The wafer carrier plate is then lifted up and attached to the carrier so that the wafer is moved into contact with the inner reticle. After reaching this position, the wafer carrier plate is held in the carrier by magnetic force so that the wafer cannot be moved, and then the vacuum can be released. In addition, the same magnetic force is also used to maintain the dual photomask configuration against the wafer. This prevents the wafer from moving from its alignment position. That is, in one embodiment of the present invention, when the wafer carrier board is located in the alignment station and the wafer is already positioned in the alignment position, a vacuum is applied to the wafer via the wafer carrier board, and further, Prevent wafer movement. However, once the wafer carrier board has been attached to the carrier and the photomask has contacted the wafer, the operation of the vacuum repair can be terminated. Next, the carrier is moved through the entire system to perform the processing steps, and after the processing is completed, the above steps are repeated.

在本發明一種實施例中,在加工完成後,晶圓承載板是在卸載站移除晶圓,然後將晶圓承載板傾斜成垂直朝向。這種做法可以確保任何在加工期間損壞的晶圓,所有的破片都可以在回送晶圓承載板以供進行進一步加工之前,就被傾倒出來。In one embodiment of the present invention, after the processing is completed, the wafer carrier board is removed from the unloading station, and then the wafer carrier board is tilted into a vertical orientation. This practice ensures that any wafers that are damaged during processing can be dumped before any wafers are returned to the wafer carrier for further processing.

圖16F顯示該系統一部分的橫截面,在放大圖中顯示出放大部分。由圖式可知,在該實施例中是使用雙光罩配置,其中的內光罩1650被外光罩1645覆蓋。磁體1612圍繞於晶圓承載板1610的周邊設置,以將晶圓承載板1610保持在載具1605的底面。Fig. 16F shows a cross section of a part of the system, showing an enlarged part in an enlarged view. As can be seen from the figure, in this embodiment, a dual-mask configuration is used, in which the inner mask 1650 is covered by the outer mask 1645. The magnet 1612 is disposed around the periphery of the wafer carrier plate 1610 to hold the wafer carrier plate 1610 on the bottom surface of the carrier 1605.

在本發明一種具體實施例中,執行了以下步驟,其中每個載具都可以支撐5個晶圓承載板:將5個晶圓裝載到5個個別的晶圓承載板上,接著將5個載有晶圓的晶圓承載板移動到對準站。在該具體實施例中,每個晶圓承載板都具有一個墊片,其邊緣周圍具有磁體。墊片可以由分類為ASTM D1418和ISO 1629編號FKM的含氟彈性體製成。在對準站中,對準台(在本例是使用5個分別的對準台,以便同時對準5個晶圓承載板)將5個晶圓承載板抬升離開傳送裝置。當晶圓承載板被抬離傳送裝置時,以真空將晶圓承載板牢固地保持在升降器上,並將晶圓牢固地保持在晶圓承載板上。在此,以5台相機分別對5個晶圓成像。輸送裝置接著將載具移動到對準站,使其位在晶圓承載板的正上方,使得載具中的各個開口都在一個晶圓承載板的上方。接著將載具抬離輸送帶,以便將載具移動而定位到一個靜止位置,並以機械方式固定。啟動相機對載具上的5個開口成像。系統接著計算每個光罩開口的x軸和y軸,以及5個晶圓中每一個晶圓的x軸和y軸。5個X/Y/θ三軸台架將每個晶圓移動,以將每個晶圓的x軸和y軸對準,而與每個相應光罩的x軸和y軸重合。接著將5個晶圓承載板抬升,直到與晶圓承載板接觸並附接到載具為止。這時每個晶圓承載板上的晶圓正位於載具中的相應開口內,與相應的內光罩接觸。接著釋放真空,使晶圓承載板以機械或磁性方式附接到載具。然後降低載具和台架,並為第二列晶圓重複上述步驟。In a specific embodiment of the present invention, the following steps are performed, where each carrier can support 5 wafer carrier boards: 5 wafers are loaded onto 5 individual wafer carrier boards, and then 5 The wafer carrying plate carrying the wafer is moved to the alignment station. In this specific embodiment, each wafer carrier board has a spacer with magnets around its edges. Gaskets can be made of fluoroelastomers classified as ASTM D1418 and ISO 1629 number FKM. In the alignment station, the alignment table (in this example, 5 separate alignment tables are used to align the 5 wafer carrier plates at the same time) lifts the 5 wafer carrier plates away from the transfer device. When the wafer carrier plate is lifted from the conveying device, the wafer carrier plate is firmly held on the lifter by vacuum, and the wafer is firmly held on the wafer carrier plate. Here, five wafers are imaged with five cameras. The transport device then moves the carrier to the alignment station so that it is positioned directly above the wafer carrier plate so that each opening in the carrier is above a wafer carrier plate. The carrier is then lifted off the conveyor belt to move the carrier to a rest position and mechanically secure it. Activate the camera to image the 5 openings in the vehicle. The system then calculates the x-axis and y-axis of each mask opening, and the x-axis and y-axis of each of the five wafers. Five X / Y / θ three-axis stages move each wafer to align the x-axis and y-axis of each wafer and coincide with the x-axis and y-axis of each corresponding mask. The 5 wafer carrier plates are then raised until they are in contact with the wafer carrier plate and attached to the carrier. At this time, the wafer on each wafer carrier is located in the corresponding opening in the carrier, and is in contact with the corresponding inner photomask. The vacuum is then released, causing the wafer carrier to be mechanically or magnetically attached to the carrier. Then lower the carrier and stage, and repeat the above steps for the second row of wafers.

圖16G顯示該晶圓承載板1610的一種替代實施例。在該實施例中,晶圓承載板1610仍然是由鋁板製成。在晶圓承載板1610的前方表面上有3個真空台座1613,每個台座都設有吸引孔1614。在本發明的一種實施例中,台座是由軟質材料製成,每個台座都包括圍繞各吸引孔1614的密封件1611。因此,當晶圓被放置在晶圓承載板1610的頂部並施加真空到台座後,晶圓將因真空吸引而保持在3個台座的頂部,並使晶圓不會接觸晶圓承載板1610的表面。由於只有3個台座,故也不會對晶圓施力以致造成彎曲或斷裂。此外,圍繞晶圓承載板1610的周邊設置有緩衝環1618。磁體1612嵌入在緩衝環1618中。在該實施例中,緩衝環不向晶圓提供密封,以避免將晶圓吸向晶圓承載板1610的表面。實施方式是例如以多孔材料製成該緩衝環1618,或在緩衝環1618中提供空氣通道1619,以在外部環境與晶圓和晶圓承載板1610的頂表面之間的空間,提供流體連通。FIG. 16G shows an alternative embodiment of the wafer carrier plate 1610. In this embodiment, the wafer carrier plate 1610 is still made of an aluminum plate. There are three vacuum pedestals 1613 on the front surface of the wafer carrier plate 1610, and each pedestal is provided with a suction hole 1614. In one embodiment of the present invention, the pedestals are made of a soft material, and each pedestal includes a seal 1611 surrounding each suction hole 1614. Therefore, when the wafer is placed on top of the wafer carrier plate 1610 and a vacuum is applied to the pedestal, the wafer will be held on top of the three pedestals due to vacuum suction, and the wafer will not contact the wafer carrier plate 1610. surface. Since there are only three pedestals, no force is applied to the wafer to cause bending or breaking. In addition, a buffer ring 1618 is provided around the periphery of the wafer carrier plate 1610. The magnet 1612 is embedded in the buffer ring 1618. In this embodiment, the buffer ring does not provide a seal to the wafer to avoid sucking the wafer toward the surface of the wafer carrier plate 1610. An embodiment is, for example, to make the buffer ring 1618 from a porous material, or to provide an air channel 1619 in the buffer ring 1618 to provide fluid communication between the external environment and the space between the wafer and the top surface of the wafer carrier plate 1610.

圖16H顯示根據本發明一種實施例的座板1672的頂表面,該座板1672可以裝配到裝載台1669或對準台1664,或裝配到兩者上。座板1672是用來固定到裝載台1669和對準台1664的頂部,且將晶圓承載板1610安置到在座板1672上方。如圖16H所示,兩組吸引孔設置成穿過座板1672的頂表面。其中,第一組吸引孔1668的孔洞與對應的晶圓承載板1610的吸引孔1614對準,並將真空通道連通到對應的晶圓承載板1610的吸引孔1614,以便將吸力傳送到晶圓,藉以將晶圓保持在晶圓承載板1610上。第二組吸引孔1667則是提供吸力以將晶圓承載板1610保持在對準台1664的底座上。因此,在一個實施例中,當載具被傳送到裝載站時,裝載台抬升,啟動吸引力到至少第二組吸引孔1667,使得每個裝載台因為真空吸力的作用,附接到相應的晶圓承載板上。當裝載台降低時,通過將晶圓承載板保持在座板1672的真空吸力,將晶圓承載板1610與載具分離。由於在一個實施例中,載具是在沒有載送晶圓的情況下返回(晶圓已在卸載台完成卸載),因此在該步驟中,並不需將真空吸力傳送至孔1668。實際上,可以將這些孔堵塞,或在設置座板1672的裝載台上僅配備吸引孔1667。FIG. 16H shows a top surface of a seat plate 1672 according to an embodiment of the present invention, and the seat plate 1672 may be mounted on the loading table 1669 or the alignment table 1664, or both. The seat plate 1672 is used to be fixed to the top of the loading table 1669 and the alignment table 1664, and the wafer carrier plate 1610 is placed above the seat plate 1672. As shown in FIG. 16H, two sets of suction holes are provided through the top surface of the seat plate 1672. Among them, the holes of the first set of suction holes 1668 are aligned with the suction holes 1614 of the corresponding wafer carrier plate 1610, and the vacuum channel is communicated to the suction holes 1614 of the corresponding wafer carrier plate 1610, so as to transfer the suction force to the wafer Thus, the wafer is held on the wafer carrier plate 1610. The second set of suction holes 1667 provides suction to hold the wafer carrier plate 1610 on the base of the alignment table 1664. Therefore, in one embodiment, when the carrier is transferred to the loading station, the loading platform is lifted, and the attraction force is activated to at least the second set of suction holes 1667, so that each loading platform is attached to the corresponding Wafer carrier board. When the loading stage is lowered, the wafer carrier plate 1610 is separated from the carrier by the vacuum suction force that holds the wafer carrier plate on the seat plate 1672. Since the carrier is returned without carrying the wafer in one embodiment (the wafer has been unloaded at the unloading station), it is not necessary to transfer the vacuum suction to the hole 1668 in this step. Actually, these holes can be blocked or only the suction holes 1667 can be provided on the loading table on which the seat plate 1672 is provided.

圖16I顯示該座板1674的頂表面,該頂表面是用來安裝到卸載台,例如在圖1,1A和1B所示的載具返回腔室135內時。將座板1674固定到卸載台的頂部,並將晶圓承載板1610放置到座板1674上。如圖16I所示,該第一組吸引孔1668的孔洞全部封閉或根本不設置,因此沒有真空通道可以通到相應的晶圓承載板1610的吸引孔1614。也就是說,在卸載階段,不會施加吸力到晶圓以將晶圓保持在晶圓承載板1610上。第二組吸引孔1667的孔洞則提供吸力以將晶圓承載板1610保持在對準台1664的底座。因此,在本發明的一種實施例中,當載具被傳送到卸載站時,即啟動吸力到吸引孔1667,以通過真空吸力保持相應的晶圓承載板。其後卸載台使座板1674傾斜,如彎曲箭頭所示。如果在晶圓承載板1610上有任何晶圓破碎,其破片將從晶圓承載板1610滑落而進入到收集槽1682中。FIG. 16I shows the top surface of the seat plate 1674, which is used to mount to the unloading table, for example, when the carrier shown in FIGS. 1, 1A, and 1B is returned into the chamber 135. The seat plate 1674 is fixed to the top of the unloading table, and the wafer carrier plate 1610 is placed on the seat plate 1674. As shown in FIG. 16I, the holes of the first group of suction holes 1668 are all closed or not provided at all, so there is no vacuum channel that can pass to the suction holes 1614 of the corresponding wafer carrier plate 1610. That is, during the unloading phase, no suction force is applied to the wafer to hold the wafer on the wafer carrier plate 1610. The second set of suction holes 1667 provides suction to hold the wafer carrier plate 1610 on the base of the alignment table 1664. Therefore, in one embodiment of the present invention, when the carrier is transferred to the unloading station, the suction force is activated to the suction hole 1667 to hold the corresponding wafer carrier plate by the vacuum suction force. The unloading table then tilts the seat plate 1674 as shown by the curved arrow. If any wafer is broken on the wafer carrier plate 1610, its fragments will slide off the wafer carrier plate 1610 and enter the collection tank 1682.

從以上的揭示內容可以理解,本發明提供了一種用於加工晶圓的系統,該系統包括:一裝載站,具有可在垂直方向上移動的裝載台,並具有裝載座板,該裝載座板具有第一組吸引孔;一對準站,具有可沿著x-y-z和旋轉方向移動的對準台,並具有對準座板,該對準座板具有第二組吸引孔和第三組吸引孔;一卸載站,具有可在垂直和傾斜方向上移動的卸載台,並具有卸載座板,該卸載座板具有第四組吸引孔,當該卸載台沿傾斜方向移動時,該卸載座板呈現垂直的朝向;至少一個真空加工腔室,位於該對準站和該卸載站之間;數個晶圓承載板,每個晶圓承載板配置為用於支撐一個晶圓且具有第五組吸引孔,該第五組吸引孔配置為可向位於該晶圓承載板上的晶圓施加真空;一傳送機構,配置為連續將該數個晶圓承載板從該裝載站傳送到該對準站,到該真空加工腔室,到該卸載站,及返回到該裝載站;其中該第一組吸引孔,第二組吸引孔和第四組吸引孔均配置為向晶圓承載板施加真空,而該第三組吸引孔對準該第五組吸引孔並對該第五組吸引孔提供流體連通。該系統還可包括數個載具,每個載具均配置為從載具的底面支撐數個晶圓承載板,並可包括數個光罩,各個光罩附接在該載具中的一個的頂表面上。As can be understood from the above disclosure, the present invention provides a system for processing a wafer. The system includes: a loading station having a loading table movable in a vertical direction, and a loading base plate. A first set of suction holes; an alignment station having an alignment table movable along xyz and rotation directions, and an alignment seat plate having a second group of suction holes and a third group of suction holes ; An unloading station having a unloading table that can be moved in vertical and tilt directions, and having a unloading seat plate, the unloading seat plate having a fourth group of suction holes, when the unloading table moves in the tilt direction, the unloading seat plate appears Vertical orientation; at least one vacuum processing chamber located between the alignment station and the unloading station; several wafer carrier plates, each wafer carrier plate is configured to support a wafer and has a fifth set of suction Holes, the fifth set of suction holes is configured to apply a vacuum to the wafer on the wafer carrier plate; a transfer mechanism is configured to continuously transfer the plurality of wafer carrier plates from the loading station to the alignment station To the vacuum The working chamber, to the unloading station, and back to the loading station; wherein the first set of suction holes, the second set of suction holes and the fourth set of suction holes are all configured to apply a vacuum to the wafer carrier plate, and the third The set of suction holes is aligned with the fifth set of suction holes and provides fluid communication to the fifth set of suction holes. The system may further include a plurality of carriers, each of which is configured to support a plurality of wafer carrier plates from a bottom surface of the carrier, and may include a plurality of photomasks, each of which is attached to one of the carriers On the top surface.

每個晶圓承載板可以包括三個台座,每個台座容納一個吸引孔。每個台座還可包括一個圍繞於該吸引孔的密封件。每個晶圓承載板還可包括一緩衝環和附接到緩衝環的多個磁體。該系統可包括一個容器,配置成可在該卸載台沿傾斜方向移動時,從晶圓承載板接收晶圓的破片。該對準站還可包括一台相機,朝向放置在該對準台上的晶圓承載板內的晶圓進行成像,及對附接到載具的光罩進行成像。此外,一控制器從相機接收影像並將對準控制信號發送到對準台,以便使晶圓對準光罩。該傳送機構可以包括一第一輸送帶,設置成用來傳送載具,以及一第二輸送帶,設置成用來傳送晶圓承載板。Each wafer carrier plate may include three pedestals, each pedestal receiving a suction hole. Each pedestal may further include a seal surrounding the suction hole. Each wafer carrier plate may further include a buffer ring and a plurality of magnets attached to the buffer ring. The system may include a container configured to receive a fragment of a wafer from a wafer carrier plate as the unloading table moves in an oblique direction. The alignment station may further include a camera for imaging a wafer in a wafer carrier plate placed on the alignment station, and imaging a photomask attached to a carrier. In addition, a controller receives an image from the camera and sends an alignment control signal to the alignment table to align the wafer with the photomask. The transfer mechanism may include a first transfer belt configured to transfer a carrier, and a second transfer belt configured to transfer a wafer carrier plate.

以上是對本發明例示性實施例之說明,其中顯示特定之材料與步驟。但須了解,對習於斯藝之人士而言,由上述特定實例可產生或使用不同變化,而此種結構及方法均可在理解本說明書所描述及說明之操作後,以及對操作之討論後,產生修改,但仍不會脫離本發明申請專利範圍所界定之範圍。The above is an explanation of an exemplary embodiment of the present invention, in which specific materials and steps are shown. However, it must be understood that for those who are used to Siyi, different changes can be made or used from the above specific examples, and this structure and method can be understood after the operation described and explained in this manual, and the discussion of the operation After that, there will be modifications, but it will still not depart from the scope defined by the scope of patent application of the present invention.

100‧‧‧系統
105‧‧‧裝載/卸載站
107‧‧‧升降裝置
110‧‧‧載具返回站
112‧‧‧閥門
113‧‧‧閥門
114‧‧‧閥門
115‧‧‧緩衝站(翻轉站)
116‧‧‧閥門
120‧‧‧低真空裝載腔
125‧‧‧高真空裝載腔
130‧‧‧加工腔
135‧‧‧載具返回模組
140‧‧‧直線型輸送帶
145‧‧‧緩衝站
200‧‧‧載具
205‧‧‧框架
210‧‧‧陶瓷桿
215‧‧‧升降裝置
220‧‧‧晶圓
223‧‧‧承載盤
224‧‧‧承載盤
225‧‧‧輸送軌道
227‧‧‧機械式的彈簧裝載夾鉗或夾具
235‧‧‧叉形配置
240‧‧‧磁性傳動桿
245‧‧‧凹槽
250‧‧‧載具接觸組件
251‧‧‧導電延伸
252‧‧‧腔室接觸組件
260‧‧‧絕緣桿
262‧‧‧接觸刷
264‧‧‧絕緣彈簧
267‧‧‧磁化滾輪
268‧‧‧轉軸
269‧‧‧腔室壁
301‧‧‧輸送帶
303‧‧‧輸送帶
305‧‧‧基板拾取機構
307‧‧‧吸盤
311‧‧‧載具
312‧‧‧凹口
313‧‧‧載具
316‧‧‧載具
317‧‧‧載具
318‧‧‧載具
319‧‧‧載具
320‧‧‧基板
321‧‧‧光罩升降裝置
329‧‧‧對準銷
331‧‧‧升降銷
333‧‧‧輸送帶
336‧‧‧滾輪
341‧‧‧旋轉推入銷
345‧‧‧吸盤
400‧‧‧真空加工腔
401‧‧‧馬達
402‧‧‧磁化滾輪
404‧‧‧惰輪
406‧‧‧滾輪
407‧‧‧滾輪
412‧‧‧進入口
413‧‧‧離開口
414‧‧‧閘閥
422‧‧‧開口
424‧‧‧載具
501‧‧‧光罩組件
503‧‧‧光罩載具
505‧‧‧基板載具
507‧‧‧導引銷
512‧‧‧切口
517‧‧‧吸盤
519‧‧‧基板對準銷
600‧‧‧腔室
601‧‧‧單一加工源
603A‧‧‧加工源
603B‧‧‧加工源
603C‧‧‧加工源
700‧‧‧載具支撐
705‧‧‧單晶圓載具
710‧‧‧承載盤框架
715‧‧‧抬升器
725‧‧‧輸送軌道
730‧‧‧基座
732‧‧‧框架
735‧‧‧凹槽
740‧‧‧袋
745‧‧‧外部光罩
750‧‧‧內部光罩
752‧‧‧晶圓抬升器
805‧‧‧基座
820‧‧‧晶圓
830‧‧‧框架
832‧‧‧凹槽
834‧‧‧磁體
836‧‧‧光罩框架
840‧‧‧袋
845‧‧‧外部光罩
850‧‧‧內部光罩
945‧‧‧外部光罩
952‧‧‧外部邊緣
1105‧‧‧單晶圓承載盤
1132‧‧‧凹槽
1134‧‧‧磁體
1160‧‧‧對準銷
1245‧‧‧外部光罩
1262‧‧‧對準孔
1336‧‧‧頂部框架
1362‧‧‧縱向桿
1364‧‧‧橫向桿
1366‧‧‧袋
1368‧‧‧對準孔
1534‧‧‧磁體
1600‧‧‧載具
1602‧‧‧開口
1605‧‧‧框架
1610‧‧‧晶圓承載板
1611‧‧‧密封件
1612‧‧‧磁體
1613‧‧‧真空台座
1614‧‧‧吸引孔
1618‧‧‧緩衝環
1619‧‧‧空氣通道
1620‧‧‧基板
1632‧‧‧輸送帶
1633‧‧‧輸送帶
1635‧‧‧升降器
1645‧‧‧光罩
1647‧‧‧真空幫浦
1649‧‧‧光罩配置
1650‧‧‧內光罩
1662‧‧‧升降機構
1664‧‧‧台架
1667‧‧‧吸引孔
1668‧‧‧吸引孔
1669‧‧‧裝載台
1670‧‧‧相機
1671‧‧‧控制器
1672‧‧‧座板
1674‧‧‧座板
1682‧‧‧收集槽
100‧‧‧ system
105‧‧‧ Loading / unloading stations
107‧‧‧ Lifting device
110‧‧‧ Vehicle return station
112‧‧‧Valve
113‧‧‧Valve
114‧‧‧ Valve
115‧‧‧Buffer Station (Flipover Station)
116‧‧‧Valve
120‧‧‧Low Vacuum Loading Chamber
125‧‧‧High Vacuum Loading Chamber
130‧‧‧Processing cavity
135‧‧‧ Vehicle Return Module
140‧‧‧Straight Conveyor Belt
145‧‧‧Buffer Station
200‧‧‧ Vehicle
205‧‧‧Frame
210‧‧‧Ceramic rod
215‧‧‧Lifting device
220‧‧‧ wafer
223‧‧‧carriage tray
224‧‧‧carry tray
225‧‧‧Conveyor track
227‧‧‧Mechanical spring loaded clamps or clamps
235‧‧‧ Fork configuration
240‧‧‧ Magnetic Transmission Rod
245‧‧‧Groove
250‧‧‧ Vehicle contact assembly
251‧‧‧Conductive extension
252‧‧‧ chamber contact assembly
260‧‧‧Insulation rod
262‧‧‧contact brush
264‧‧‧Insulated Spring
267‧‧‧Magnetized Roller
268‧‧‧Shaft
269‧‧‧ chamber wall
301‧‧‧ conveyor belt
303‧‧‧Conveyor
305‧‧‧ substrate picking mechanism
307‧‧‧ Suction cup
311‧‧‧ Vehicle
312‧‧‧notch
313‧‧‧ Vehicle
316‧‧‧ Vehicle
317‧‧‧ Vehicle
318‧‧‧ Vehicle
319‧‧‧ Vehicle
320‧‧‧ substrate
321‧‧‧Photomask lifting device
329‧‧‧Alignment Pin
331‧‧‧lift pin
333‧‧‧ conveyor belt
336‧‧‧roller
341‧‧‧Rotary push pin
345‧‧‧ Suction cup
400‧‧‧Vacuum processing cavity
401‧‧‧motor
402‧‧‧Magnetized Roller
404‧‧‧Idler
406‧‧‧roller
407‧‧‧roller
412‧‧‧ entrance
413‧‧‧ exit
414‧‧‧Gate Valve
422‧‧‧ opening
424‧‧‧ Vehicle
501‧‧‧Mask assembly
503‧‧‧Mask carrier
505‧‧‧ substrate carrier
507‧‧‧Guide Pin
512‧‧‧ incision
517‧‧‧ Suction cup
519‧‧‧ substrate alignment pin
600‧‧‧ chamber
601‧‧‧ single processing source
603A‧‧‧Processing source
603B‧‧‧Processing source
603C‧‧‧Processing source
700‧‧‧ vehicle support
705‧‧‧Single wafer carrier
710‧‧‧carriage tray frame
715‧‧‧Lifter
725‧‧‧Conveyor track
730‧‧‧ base
732‧‧‧Frame
735‧‧‧groove
740‧‧‧bag
745‧‧‧External Mask
750‧‧‧Internal mask
752‧‧‧ Wafer Lifter
805‧‧‧ base
820‧‧‧wafer
830‧‧‧Frame
832‧‧‧groove
834‧‧‧Magnet
836‧‧‧Mask frame
840‧‧‧ bags
845‧‧‧External Mask
850‧‧‧ Internal Mask
945‧‧‧External Mask
952‧‧‧outer edge
1105‧‧‧Single wafer carrier tray
1132‧‧‧Groove
1134‧‧‧Magnet
1160‧‧‧Alignment Pin
1245‧‧‧External Mask
1262‧‧‧Alignment hole
1336‧‧‧Top Frame
1362‧‧‧Vertical rod
1364‧‧‧cross bar
1366‧‧‧bag
1368‧‧‧Alignment hole
1534‧‧‧Magnet
1600‧‧‧ Vehicle
1602‧‧‧ opening
1605‧‧‧Frame
1610‧‧‧ Wafer Carrier Board
1611‧‧‧Seal
1612‧‧‧Magnet
1613‧‧‧Vacuum stand
1614‧‧‧ Attraction hole
1618‧‧‧Buffer Ring
1619‧‧‧Air channel
1620‧‧‧ substrate
1632‧‧‧Conveyor belt
1633‧‧‧Conveyor belt
1635‧‧‧Lifter
1645‧‧‧Mask
1647‧‧‧Vacuum Pump
1649‧‧‧Mask configuration
1650‧‧‧Inner reticle
1662‧‧‧Lifting mechanism
1664‧‧‧bench
1667‧‧‧ Attraction hole
1668‧‧‧ Attraction hole
1669‧‧‧Loading table
1670‧‧‧Camera
1671‧‧‧controller
1672‧‧‧seat
1674‧‧‧ seat plate
1682‧‧‧ collection tank

所附的圖式納入本件專利說明書中,並成為其一部份,是用來例示本發明的實施例,並與本案的說明內容共同用來說明及展示本發明的原理。圖式的目的旨在以圖型方式例示本發明實施例的主要特徵。圖式並不是用來顯示實際上的範例的全部特徵,也不是用來表示其中每一個元件之相對尺寸,或其比例。The attached drawings are incorporated in and become a part of this patent specification, and are used to illustrate the embodiments of the present invention, and together with the description of this case, used to explain and show the principles of the present invention. The purpose of the drawings is to illustrate the main features of the embodiments of the present invention in a graphical manner. The drawings are not intended to show all of the features of the actual paradigm, nor are they intended to indicate the relative dimensions of each of the elements, or their proportions.

圖1顯示本發明多基板加工系統的一種實施例,其中的傳送載具可支持以線形排列的基板,但對基板的加工則是對排列成二維陣列的基板進行。 圖1A顯示本發明系統的一種範例,其中的載具在傳送和加工的過程中都保持在水平的朝向,而圖1B則展示一種範例,其中的載具在傳送和裝載/卸載的過程中是保持水平,但在加工過程中則保持垂直。 圖2顯示根據本發明多晶圓載具的一種實施例,圖2A則顯示其部分橫截面圖。 圖2B顯示本發明使用在矽晶圓加工的載具的一種實例,而圖2C則顯示本發明使用在玻璃基板加工的載具的一種實例。 圖3A顯示根據本發明的裝載/卸載機構的一個實施例的頂視圖,而圖3B是其側面圖。圖3C顯示基板對準機構的一種實施例。 圖4顯示本發明真空加工腔室400的一種實施例,該加工腔可使用在本發明所揭示之系統。 圖5顯示本發明光罩與載具組件的一種實施例。 圖6A-6C顯示三種實施例,用以說明將真空腔室安裝在不同尺寸和結構的不同加工源上的方式。 圖7A-7E顯示本發明具有雙光罩配置的多晶圓載具數種實施例的立體圖與側視圖。 圖8顯示根據本發明一種實施例中的框架、外光罩和內光罩的部分放大橫截面,而圖8A則顯示根據另一個實施例中,框架、外光罩和內光罩的部分放大橫截面。 圖9顯示本發明外光罩的一種實施例,該外光罩有內光罩嵌套於其中。 圖10顯示本發明用於邊緣隔離的內光罩的一種實施例。 圖11顯示本發明單晶圓載具的一種實施例。 圖12顯示從底面觀察的本發明外光罩的一種實施例。 圖13顯示本發明支撐該內、外光罩的頂部框架的一種實施例。 圖14顯示用於在晶圓中形成多個孔的內光罩的一種實施例。 圖15顯示與圖9的光罩一起使用的承載盤的實施例。 圖16A-16D顯示本發明一種實施例,其中的晶圓承載板是附接到載具的底面,而雙光罩配置則附接到載具的頂面。 圖16E顯示根據本發明雙光罩配置的一種實施例。 圖16F是根據本發明一種實施例的系統的部分橫截面,並以放大圖顯示其部分結構。 圖16G顯示根據本發明另一種實施例的晶圓承載板,該晶圓承載板具有真空台座和外圍墊片。 圖16H顯示根據本發明一種實施例的裝載對準台的頂部。 圖16I顯示根據本發明一種實施例的卸載台的頂部。FIG. 1 shows an embodiment of a multi-substrate processing system according to the present invention. The transfer carrier can support substrates arranged in a line, but the processing of the substrate is performed on the substrates arranged in a two-dimensional array. FIG. 1A shows an example of the system of the present invention, in which the carriers are kept in a horizontal orientation during conveyance and processing, while FIG. 1B shows an example in which the carriers are conveyed and loaded / unloaded during Keep it horizontal, but keep it vertical during processing. FIG. 2 shows an embodiment of a multi-wafer carrier according to the present invention, and FIG. 2A shows a partial cross-sectional view thereof. FIG. 2B shows an example of a carrier used in silicon wafer processing according to the present invention, and FIG. 2C shows an example of a carrier used in glass substrate processing according to the present invention. Fig. 3A shows a top view of one embodiment of a loading / unloading mechanism according to the present invention, and Fig. 3B is a side view thereof. FIG. 3C shows an embodiment of the substrate alignment mechanism. FIG. 4 shows an embodiment of the vacuum processing chamber 400 of the present invention, which can be used in the system disclosed in the present invention. FIG. 5 shows an embodiment of a photomask and a carrier assembly according to the present invention. 6A-6C show three embodiments for explaining the manner in which the vacuum chamber is mounted on different processing sources of different sizes and structures. 7A-7E are perspective and side views of several embodiments of a multi-wafer carrier having a dual photomask configuration according to the present invention. FIG. 8 shows a partially enlarged cross-section of a frame, an outer mask, and an inner mask according to an embodiment of the present invention, and FIG. 8A shows a partially enlarged cross-section of a frame, an outer mask, and an inner mask according to another embodiment Cross section. FIG. 9 shows an embodiment of an outer mask according to the present invention. The outer mask has an inner mask nested therein. FIG. 10 shows an embodiment of an inner reticle for edge isolation according to the present invention. FIG. 11 shows an embodiment of a single wafer carrier according to the present invention. FIG. 12 shows an embodiment of the outer mask of the present invention viewed from the bottom surface. FIG. 13 shows an embodiment of a top frame supporting the inner and outer photomasks according to the present invention. FIG. 14 shows one embodiment of an inner reticle for forming a plurality of holes in a wafer. FIG. 15 shows an embodiment of a carrier tray for use with the photomask of FIG. 9. 16A-16D show an embodiment of the present invention in which a wafer carrier board is attached to the bottom surface of the carrier, and a dual photomask configuration is attached to the top surface of the carrier. FIG. 16E shows an embodiment of a dual photomask configuration according to the present invention. FIG. 16F is a partial cross-section of a system according to an embodiment of the present invention, and shows a partial structure thereof in an enlarged view. FIG. 16G shows a wafer carrier board according to another embodiment of the present invention, the wafer carrier board having a vacuum stage and a peripheral gasket. Figure 16H shows the top of a loading alignment table according to one embodiment of the invention. FIG. 16I shows the top of an unloading station according to one embodiment of the invention.

100‧‧‧系統 100‧‧‧ system

105‧‧‧裝載/卸載站 105‧‧‧ Loading / unloading stations

110‧‧‧載具返回站 110‧‧‧ Vehicle return station

112‧‧‧閥門 112‧‧‧Valve

113‧‧‧閥門 113‧‧‧Valve

114‧‧‧閥門 114‧‧‧ Valve

115‧‧‧緩衝站(翻轉站) 115‧‧‧Buffer Station (Flipover Station)

116‧‧‧閥門 116‧‧‧Valve

120‧‧‧低真空裝載腔 120‧‧‧Low Vacuum Loading Chamber

125‧‧‧高真空裝載腔 125‧‧‧High Vacuum Loading Chamber

130‧‧‧加工腔 130‧‧‧Processing cavity

135‧‧‧載具返回模組 135‧‧‧ Vehicle Return Module

Claims (28)

一種用於在真空加工腔室中加工晶圓的系統,包括: 多個載具,每個載具包括具有多個開口的框架,每個開口配置為可容納一個晶圓; 一傳送機構,配置為可在整個系統中傳送多個載具; 多個晶圓承載板,每個晶圓承載板配置為可支撐一個晶圓; 一附接機構,用於將多個晶圓承載板附接到各個載具,其中每個晶圓承載板是附接到相應載具的底面的對應位置,使得每個位在晶圓載具之一上的晶圓,是定位在該載具的多個開口中的一個之內; 多個光罩,每個光罩附接在該載具的多個開口中的一個的前側上; 一對準台,配置為可在該載具的多個開口中的一個的下方支撐其中一個晶圓承載板,該對準台並配置為可平移,旋轉和升降; 一相機,定位成可對該多個光罩中的一個光罩進行成像,且在該晶圓承載板位於該對準台上時,可對位於其中一個晶圓承載板上的一個晶圓進行成像; 一控制器,用以從該相機接收影像,並將對準信號發送到該對準台。A system for processing a wafer in a vacuum processing chamber includes: a plurality of carriers, each carrier including a frame having a plurality of openings, each opening configured to accommodate a wafer; a transfer mechanism, configured In order to be able to transfer multiple carriers throughout the system; multiple wafer carrier boards, each wafer carrier board is configured to support one wafer; an attachment mechanism for attaching multiple wafer carrier boards to Each carrier, where each wafer carrier board is attached to a corresponding position on the bottom surface of the corresponding carrier, such that each wafer located on one of the wafer carriers is positioned in a plurality of openings of the carrier Within one of; a plurality of reticles, each reticle being attached to the front side of one of the plurality of openings in the vehicle; an alignment stage configured to be accessible in one of the plurality of openings in the vehicle One of the wafer supporting plates is supported under the wafer, and the alignment stage is configured to be capable of being translated, rotated and lifted; a camera is positioned to image one of the plurality of masks, and is loaded on the wafer; When the board is on the alignment table, it can be aligned An imaging is performed on a wafer on one of the wafer carrying boards; a controller is used for receiving an image from the camera and sending an alignment signal to the alignment table. 如申請專利範圍第1項的系統,其中,該多個光罩包括: 多個內光罩,每個內光罩配置為可放置在該載具上的多個開口中的一個的頂部,該內光罩具有一開口形狀,用於遮蔽晶圓的部分並暴露該晶圓的其餘部分;及 多個外光罩,每個外光罩配置為可放置在一個相應的內光罩的頂部,該外光罩具有一開口,該開口配置為可部分覆蓋該內光罩。The system of claim 1, wherein the plurality of photomasks include: a plurality of inner photomasks, each of which is configured to be placed on top of one of a plurality of openings on the carrier, the The inner reticle has an opening shape for shielding a portion of the wafer and exposing the rest of the wafer; and a plurality of outer reticles, each of which is configured to be placed on top of a corresponding inner reticle, The outer photomask has an opening configured to partially cover the inner photomask. 如申請專利範圍第1項的系統,其中,每個晶圓承載板包括由鋁製成的平板。For example, the system of claim 1, wherein each wafer carrier plate includes a flat plate made of aluminum. 如申請專利範圍第3項的系統,其中,該附接機構包括多個磁體,附接到該多個晶圓承載板中的各個晶圓承載板。The system of claim 3, wherein the attachment mechanism includes a plurality of magnets attached to each of the plurality of wafer carrier plates. 如申請專利範圍第4項的系統,其中,該多個晶圓承載板中的每一個晶圓承載板,另包括有吸引孔。For example, the system according to item 4 of the patent application, wherein each of the plurality of wafer carrier plates further includes a suction hole. 如申請專利範圍第1項的系統,另包括一輸送帶,該輸送帶配置成用於將該晶圓承載板傳送到該相機的視場內的一個位置。For example, the system of claim 1 includes a conveyor belt configured to transfer the wafer carrier board to a position within the field of view of the camera. 如申請專利範圍第1項的系統,其中,該傳送機構包括一第一線性傳送器,配置成可傳送該載具,以及一第二線性傳送器,配置成可在該晶圓承載板從該載具分離後,傳送該晶圓承載板。For example, the system of claim 1, wherein the transfer mechanism includes a first linear conveyor configured to transfer the carrier, and a second linear conveyor configured to transfer the load from the wafer carrier board. After the carrier is separated, the wafer carrier board is transferred. 如申請專利範圍第5項的系統,其中,該對準台包括一座板,該座板具有第一組吸引孔,與該晶圓承載板的吸引孔對準,以及第二組吸引孔,設置成可傳送吸力以將該晶圓承載板保持在該座板上。For example, the system of claim 5 in which the alignment table includes a plate having a first set of suction holes aligned with the suction holes of the wafer carrier plate, and a second set of suction holes. A suction force can be transmitted to hold the wafer carrier plate on the seat plate. 如申請專利範圍第5項的系統,另包括一卸載台,該卸載台包括一卸載座板,該卸載座板配置成可封閉該晶圓承載板的吸引孔,從而防止流體與該吸引孔連通,該卸載座板包括一組吸引孔,設置成可傳送吸力以將該晶圓承載板保持在該卸載座板上。For example, the system of claim 5 includes an unloading station including an unloading base plate configured to close the suction hole of the wafer carrier plate, thereby preventing fluid from communicating with the suction hole. The unloading base plate includes a set of suction holes arranged to transmit suction to hold the wafer carrier plate on the unloading base plate. 如申請專利範圍第1項的系統,另包括一基板卸載站,具有一個用於將晶圓承載板在一個容器上方傾斜至垂直方向的機構,該容器用於從該晶圓承載板收集晶圓破片。For example, the system of claim 1 includes a substrate unloading station with a mechanism for tilting a wafer carrier plate to a vertical direction above a container for collecting wafers from the wafer carrier plate. scrap. 一種用於加工晶圓的系統,包括: 一裝載站,具有可在垂直方向上移動的裝載台,並具有裝載座板,該裝載座板具有第一組吸引孔; 一對準站,具有可沿x-y-z和旋轉方向移動的對準台,並具有對準座板,該對準座板具有第二組吸引孔和第三組吸引孔; 一卸載台,具有可在垂直和傾斜方向上移動的卸載台,並具有卸載座板,該卸載座板具有第四組吸引孔,當該卸載台沿傾斜方向移動時,該卸載座板呈現垂直朝向; 至少一個真空加工腔室,位於該對準站和該卸載站之間; 多個晶圓承載板,每個晶圓承載板均配置為用於支撐一個晶圓,並具有第五組吸引孔,該組吸引孔配置為可向位於該晶圓承載板上的晶圓施加真空; 一傳送機構,配置為可將連續該多個晶圓承載板從該裝載站傳送到該對準站,到該真空加工腔室,到該卸載站,及回送到該裝載站; 其中該第一組吸引孔,第二組吸引孔和第四組吸引孔配置為可向該晶圓承載板施加真空,且該第三組吸引孔與第五組吸引孔對齊並提供流體連通。A system for processing a wafer includes: a loading station having a loading table movable in a vertical direction and a loading base plate having a first set of suction holes; an alignment station having a Alignment table moving in xyz and rotation direction, and having an alignment seat plate, the alignment seat plate has a second set of suction holes and a third set of suction holes; a unloading table having a movable in vertical and tilt directions An unloading table with a unloading seat plate having a fourth set of suction holes. When the unloading table moves in an oblique direction, the unloading seat plate is oriented vertically; at least one vacuum processing chamber is located at the alignment station. And the unloading station; multiple wafer carrier plates, each wafer carrier plate is configured to support a wafer, and has a fifth set of suction holes configured to be located on the wafer; Vacuum is applied to the wafers on the carrier board; a transfer mechanism configured to transfer the continuous wafer carrier boards from the loading station to the alignment station, to the vacuum processing chamber, to the unloading station, Back to the loading station; wherein the first set of suction holes, the second set of suction holes and the fourth set of suction holes are configured to apply a vacuum to the wafer carrier plate, and the third set of suction holes and the fifth set of suction holes Align and provide fluid communication. 如申請專利範圍第11項的系統,另包括多個載具,每個載具均配置為可從該載具的底面支撐多個晶圓承載板。For example, the system under the scope of patent application No. 11 further includes a plurality of carriers, and each carrier is configured to support a plurality of wafer carrier plates from the bottom surface of the carrier. 如申請專利範圍第12項的系統,另包括多個光罩,每個光罩附接在該多數載具中的一個的頂表面上。The system of claim 12 includes a plurality of photomasks, each of which is attached to the top surface of one of the plurality of carriers. 如申請專利範圍第11項的系統,其中,每個晶圓承載板包括三個台座,每個台座容納該吸引孔中的一個。For example, the system of claim 11 in which each wafer carrier plate includes three pedestals, and each pedestal accommodates one of the suction holes. 如申請專利範圍第14項的系統,其中,每個台座另包括圍繞該吸引孔的密封件。For example, the system of claim 14 wherein each pedestal further includes a seal surrounding the suction hole. 如申請專利範圍第14項的系統,其中,每個晶圓承載板還包括緩衝環和附接到該緩衝環的多個磁體。As in the system of claim 14, wherein each wafer carrier plate further includes a buffer ring and a plurality of magnets attached to the buffer ring. 如申請專利範圍第11項的系統,另包括一個容器,配置成可在該卸載站沿傾斜方向移動時,從該晶圓承載板接收晶圓破片。For example, the system of claim 11 includes a container configured to receive a wafer fragment from the wafer carrier plate when the unloading station moves in an oblique direction. 如申請專利範圍第13項的系統,其中,該對準站另包括一台相機,該相機對準放置於該對準台的晶圓承載板上的晶圓,以進行成像,並可對附接到該載具的光罩進行成像。For example, the system of claim 13 of the patent application, wherein the alignment station further includes a camera for aligning a wafer placed on a wafer carrier plate of the alignment station for imaging, and attaching The photomask attached to the vehicle is used for imaging. 如申請專利範圍第18項的系統,另包括一控制器,以從該相機接收影像,並將對準信號發送到該對準台,以將該晶圓對準該光罩。For example, the system of claim 18 includes a controller to receive an image from the camera and send an alignment signal to the alignment table to align the wafer to the photomask. 如申請專利範圍第12項的系統,其中,該傳送機構包括一第一輸送帶,配置為可傳送該載具,以及一第二輸送帶,配置為可傳送該晶圓承載板。For example, the system of claim 12, wherein the transfer mechanism includes a first conveyor belt configured to transfer the carrier, and a second conveyor belt configured to transfer the wafer carrier plate. 一種用於在真空加工腔室中加工晶圓的方法,包括以下步驟: 將一個光罩附接在一個載具的頂表面上,使該光罩覆蓋該載具中的一個開口; 將一個晶圓裝載到一個晶圓承載板的頂表面上; 將具有晶圓的晶圓承載板傳送到一個對準站,並將該晶圓承載板放置在該對準台上; 啟動一台相機,以對該對準台上的晶圓成像; 將載有光罩的載具傳送到該對準站; 啟動該相機以對該光罩成像; 使用該晶圓和光罩的影像來計算偏差量,並啟動該對準台,以將該晶圓對準該光罩; 在該晶圓與該光罩對準後,抬升該對準台,以將該晶圓承載板附接到該載具的底面,使該晶圓定位在該載具的開口內; 降低該對準台;將該載具傳送到該真空加工腔室,以加工該晶圓。A method for processing a wafer in a vacuum processing chamber includes the steps of: attaching a photomask on a top surface of a carrier so that the photomask covers an opening in the carrier; attaching a crystal Round loading onto the top surface of a wafer carrier board; transferring the wafer carrier board with the wafer to an alignment station, and placing the wafer carrier board on the alignment stage; starting a camera to Image the wafer on the alignment table; transfer the carrier carrying the mask to the alignment station; start the camera to image the mask; use the image of the wafer and the mask to calculate the deviation, and Activate the alignment stage to align the wafer with the mask; after the wafer is aligned with the mask, raise the alignment stage to attach the wafer carrier board to the bottom surface of the carrier To position the wafer in the opening of the carrier; lower the alignment table; transfer the carrier to the vacuum processing chamber to process the wafer. 如申請專利範圍第21項的方法,另包括在該晶圓承載板位在該對準台時,對該晶圓施加吸力的步驟。For example, if the method of claim 21 is applied, the method further includes the step of applying suction to the wafer when the wafer carrying plate is at the alignment table. 如申請專利範圍第21項的方法,其中,該固定光罩的步驟包括將該內光罩附接到該載具,及將該外光罩附接到該內光罩上的步驟。For example, the method of claim 21, wherein the step of fixing the photomask includes the steps of attaching the inner photomask to the carrier and attaching the outer photomask to the inner photomask. 如申請專利範圍第21項的方法,其中,將該晶圓承載板附接到該載具的底面的步驟包括在該晶圓承載板和該載具之間施加磁力的步驟。The method of claim 21, wherein the step of attaching the wafer carrier to the bottom surface of the carrier includes the step of applying a magnetic force between the wafer carrier and the carrier. 如申請專利範圍第24項的方法,另包括將該磁力施加到該光罩的步驟。The method of claim 24 includes the step of applying the magnetic force to the photomask. 一種用於在真空加工腔室中加工晶圓的方法,包括以下步驟: 將一個晶圓承載板傳送到一裝載位置,並將一片晶圓裝載到該晶圓承載板上; 將該晶圓承載板移動到一個對準站,並將該晶圓承載板放置在該對準台上; 施加吸力以將該晶圓保持在該晶圓承載板上; 使用一台相機對該晶圓進行成像,並根據該相機的影像計算該晶圓的x軸和y軸; 將一個載具運送到該對準站中,並將該載具定位在該晶圓承載板上方,使該載具中的一開口位於該晶圓承載板上方,其中一個具有光罩開口的光罩位於該載具的上方; 抬升該載具以將該載具定位在一個機械性固定的靜止位置; 啟動該相機以對該載具上的該光罩開口成像,並計算該光罩開口的x軸和y軸; 啟動該對準台以移動該晶圓承載板,使該晶圓的x軸和y軸與該光罩開口的x軸和y軸重合; 抬升該晶圓承載板直到該晶圓承載板接觸並附接到該載具,以使該晶圓定位在該載具的開口內; 釋放真空;以及, 將該載有晶圓承載板的載具傳送到該真空加工腔室中。A method for processing a wafer in a vacuum processing chamber includes the following steps: transferring a wafer carrier plate to a loading position, and loading a wafer onto the wafer carrier plate; and carrying the wafer The plate is moved to an alignment station and the wafer carrier plate is placed on the alignment stage; suction is applied to hold the wafer on the wafer carrier plate; the wafer is imaged using a camera, And calculate the x-axis and y-axis of the wafer according to the image of the camera; transport a carrier to the alignment station, and position the carrier above the wafer carrier plate, so that one of the carriers The opening is located above the wafer carrier plate, and a photomask having a photomask opening is located above the carrier; the carrier is lifted to position the carrier in a mechanically fixed stationary position; the camera is activated to the The mask opening on the carrier is imaged, and the x-axis and y-axis of the mask opening are calculated; the alignment stage is activated to move the wafer carrier plate so that the x-axis and y-axis of the wafer and the mask The x-axis and y-axis of the opening coincide ; Lifting the wafer carrier board until the wafer carrier board contacts and is attached to the carrier so that the wafer is positioned in the opening of the carrier; release the vacuum; and, the wafer carrier board carrying the The carrier is transferred into the vacuum processing chamber. 如申請專利範圍第26項的方法,其中,該施加吸力的步驟包括施加吸力以將該晶圓保持在該晶圓承載板上,並將該晶圓承載板保持在該對準台上的步驟。The method of claim 26, wherein the step of applying suction includes the step of applying suction to hold the wafer on the wafer carrier plate and holding the wafer carrier plate on the alignment table. . 如申請專利範圍第26項的方法,另包括將該載具傳送出該真空加工腔室,並將該晶圓承載板裝載到一個卸載台上,以及啟動該卸載台以傾斜該晶圓承載板,從而移除位在該晶圓承載板上的晶圓破片的步驟。If the method of applying for the scope of patent application No. 26, the method further comprises transferring the carrier out of the vacuum processing chamber, loading the wafer carrier board on an unloading stage, and activating the unloading stage to tilt the wafer carrier board. , Thereby removing the wafer fragmentation step located on the wafer carrier board.
TW105131864A 2015-10-01 2016-10-03 Wafer plate and mask arrangement for substrate fabrication TWI611998B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562235898P 2015-10-01 2015-10-01
US62/235,898 2015-10-01

Publications (2)

Publication Number Publication Date
TW201722822A TW201722822A (en) 2017-07-01
TWI611998B true TWI611998B (en) 2018-01-21

Family

ID=58427960

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131864A TWI611998B (en) 2015-10-01 2016-10-03 Wafer plate and mask arrangement for substrate fabrication

Country Status (8)

Country Link
JP (1) JP6816132B2 (en)
KR (1) KR102447219B1 (en)
CN (1) CN108290694B (en)
MY (1) MY190638A (en)
PH (1) PH12018500685A1 (en)
SG (1) SG10201906641WA (en)
TW (1) TWI611998B (en)
WO (1) WO2017059373A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI703403B (en) * 2018-08-14 2020-09-01 台灣積體電路製造股份有限公司 Mask, method for forming the same, and method for using the same
TWI730862B (en) * 2020-08-03 2021-06-11 國立陽明交通大學 Method of fabricating a thin film with a varying thickness

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6914600B2 (en) * 2017-10-24 2021-08-04 住重アテックス株式会社 Fixing device and ion irradiation method
WO2019225838A1 (en) 2018-05-25 2019-11-28 주식회사 엘지화학 Battery housing and battery module comprising same
DE102018006259A1 (en) * 2018-06-14 2019-12-19 Robert Bosch Gmbh Conveyor device for conveying at least one wafer
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
KR20210081794A (en) * 2019-12-24 2021-07-02 캐논 톡키 가부시키가이샤 Rotation driving apparatus, film-forming system including the same, manufacturing method of electronic device and carrier for carrying subjectto be carried used in the film-forming apparatus
WO2022002385A1 (en) * 2020-07-01 2022-01-06 Applied Materials, Inc. Apparatus for moving a substrate, deposition apparatus, and processing system
CN111933557B (en) * 2020-10-19 2021-02-09 晶芯成(北京)科技有限公司 Method and system for correcting center of wafer
CN117976510B (en) * 2024-04-02 2024-06-25 浙江求是创芯半导体设备有限公司 Wafer driving structure and workpiece taking and adjusting method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3498711A (en) * 1967-10-18 1970-03-03 Texas Instruments Inc Step and repeat camera
US20030087471A1 (en) * 2001-09-04 2003-05-08 Max Shtein Self-aligned hybrid deposition
US20090324379A1 (en) * 2008-05-30 2009-12-31 Alta Devices, Inc. Methods and apparatus for a chemical vapor deposition reactor
TW201241575A (en) * 2010-12-14 2012-10-16 Mapper Lithography Ip Bv Lithography system and method of processing substrates in such a lithography system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7191512B2 (en) * 1998-09-29 2007-03-20 Applied Kinetics, Inc. Tray system for holding and positioning components
JP2004012598A (en) * 2002-06-04 2004-01-15 Adtec Engineeng Co Ltd Projection aligner
US7234584B2 (en) * 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
KR20070048650A (en) * 2004-08-31 2007-05-09 가부시키가이샤 니콘 Aligning method, processing system, substrate loading repeatability measuring method, position measuring method, exposure method, substrate processing apparatus, measuring method and measuring apparatus
WO2012029130A1 (en) * 2010-08-31 2012-03-08 株式会社アドバンテスト Wafer tray, semiconductor wafer testing apparatus, and semiconductor wafer testing method
JP5704402B2 (en) * 2011-08-30 2015-04-22 日新イオン機器株式会社 Substrate holding member and method for adjusting position of semiconductor substrate attached to semiconductor holding member
SG10201508582WA (en) * 2011-11-08 2015-11-27 Intevac Inc Substrate processing system and method
SG10201608512QA (en) * 2012-04-19 2016-12-29 Intevac Inc Dual-mask arrangement for solar cell fabrication
JP6231078B2 (en) * 2012-04-26 2017-11-15 インテヴァック インコーポレイテッド System configuration for vacuum process
US10062600B2 (en) * 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
CN203185174U (en) * 2013-03-30 2013-09-11 歌尔声学股份有限公司 Vacuum absorption fixing platform
JP6133128B2 (en) * 2013-05-23 2017-05-24 株式会社アルバック Vacuum processing equipment, vibration control equipment
SG11201606935VA (en) * 2014-02-20 2016-10-28 Intevac Inc System and method for bi-facial processing of substrates

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3498711A (en) * 1967-10-18 1970-03-03 Texas Instruments Inc Step and repeat camera
US20030087471A1 (en) * 2001-09-04 2003-05-08 Max Shtein Self-aligned hybrid deposition
US20090324379A1 (en) * 2008-05-30 2009-12-31 Alta Devices, Inc. Methods and apparatus for a chemical vapor deposition reactor
TW201241575A (en) * 2010-12-14 2012-10-16 Mapper Lithography Ip Bv Lithography system and method of processing substrates in such a lithography system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI703403B (en) * 2018-08-14 2020-09-01 台灣積體電路製造股份有限公司 Mask, method for forming the same, and method for using the same
US11137675B2 (en) 2018-08-14 2021-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Mask and method for forming the same
TWI730862B (en) * 2020-08-03 2021-06-11 國立陽明交通大學 Method of fabricating a thin film with a varying thickness

Also Published As

Publication number Publication date
TW201722822A (en) 2017-07-01
JP2018531510A (en) 2018-10-25
MY190638A (en) 2022-04-29
KR102447219B1 (en) 2022-09-23
JP6816132B2 (en) 2021-01-20
SG10201906641WA (en) 2019-09-27
CN108290694A (en) 2018-07-17
KR20180059804A (en) 2018-06-05
WO2017059373A1 (en) 2017-04-06
CN108290694B (en) 2021-05-04
PH12018500685A1 (en) 2018-10-15

Similar Documents

Publication Publication Date Title
TWI611998B (en) Wafer plate and mask arrangement for substrate fabrication
US10679883B2 (en) Wafer plate and mask arrangement for substrate fabrication
US10115617B2 (en) System architecture for vacuum processing
TWI696231B (en) System and method for bi-facial processing of substrates
US10062600B2 (en) System and method for bi-facial processing of substrates
JP2018531510A6 (en) Wafer plate and mask apparatus for substrate manufacture
JP6243898B2 (en) Double mask device for solar cell manufacturing
KR101401516B1 (en) Tray aligner and solar cell manufacturing device comprising the same and tray aligning method using the same
KR20150042743A (en) Workpiece handling system and methods of workpiece handling
TWI462212B (en) Processing system and processing methods
JP5606546B2 (en) Work processing device
CN110416137B (en) Substrate conveying mechanism for semiconductor process and film forming system
US9437392B2 (en) High-throughput ion implanter
JP2004119627A (en) Semiconductor device manufacturing apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees