CN206742197U

CN206742197U - Substrate turnover device and the base plate processing system comprising the substrate turnover device

Info

Publication number: CN206742197U
Application number: CN201720315036.8U
Authority: CN
Inventors: 雷仲礼
Original assignee: Individual
Current assignee: Individual
Priority date: 2017-03-28
Filing date: 2017-03-28
Publication date: 2017-12-12
Anticipated expiration: 2027-03-28

Abstract

This application discloses a kind of substrate turnover device, in addition, disclosed herein as well is a kind of base plate processing system.Eversion chamber is provided with the base plate processing system, substrate turnover device is provided with the eversion chamber.After the completion of a surface treatment of substrate, the substrate is sent to eversion chamber by the base plate transfer device in transfer chamber, the upset of substrate can be realized under vacuum conditions using the substrate turnover device in eversion chamber, after upset, process reaction chamber is sent to by the base plate transfer device in transfer chamber again, another surface of substrate is handled, the processing of completing substrate just, on back of the body two sides.So, overturn by the base plate processing system that the application provides without substrate is sent to outside system, the substrate turnover device in eversion chamber and eversion chamber included by it allows for substrate and upset is completed in base plate processing system, therefore, the base plate processing system provided by the application can improve substrate processing efficiency, reduce substrate contamination probability.

Description

Substrate turnover device and the base plate processing system comprising the substrate turnover device

Technical field

The application is related to substrate processing technique field, more particularly to a kind of substrate turnover device and includes substrate upset The base plate processing system of device.

Background technology

For front and back is both needed to substrate to be processed such as photovoltaic solar cell substrate, substrate is being handled , it is necessary to which substrate is turned after simultaneously, then another side is handled again.Existing substrate upset is needed at by substrate Substrate turnover device outside reason system is completed, in this way, substrate after completing one side and handling, it is necessary to cool down, be sent to processing substrate Overturn, then put it to again on a new substrate placing stage in substrate turnover device outside system, in addition, entering Another substrate process reative cell carries out needing to preheat substrate again before the processing of another side.Such process causes substrate Processing efficiency is relatively low, and increases the probability of substrate contamination.

Utility model content

In order that obtain substrate completes upset in base plate processing system, this application provides a kind of substrate turnover device and side Method.

The substrate turnover device provided based on the application, present invention also provides a kind of base for including the substrate turnover device Plate processing system.

In order to solve the above-mentioned technical problem, the utility model employs following technical scheme：

A kind of substrate turnover device, the substrate include chip of the multiple row in row arrangement, and each column chip includes more wafers, The substrate turnover device includes：For bearing wafer, the multiple lift pins that can move up and down and for holding chip The edge grippers at edge, the multiple lift pin is corresponding with multiple chips on substrate to be lifted, and the lift pin Surface be less than wafer surface, each moving up and down for the lift pin can drive the chip being placed on it to move up and down；

The edge grippers include multiple hold assemblies being parallel to each other, and each hold assembly includes about more The clamping rod being oppositely arranged, described about the more clamping rods being oppositely arranged are used for the edge for clamping the upper and lower surface of a row chip Region；

Described about the more clamping rod in the vertical directions being oppositely arranged can move, or, about the more phases The clamping rod of setting can be moved on vertically and horizontally.

Alternatively, the multiple lift pin is arranged in column, and the substrate turnover device also includes lift pin motion control portion Part, the lift pin control parts of motion are used to control on all lift pins, a row lift pin or mutual non-conterminous row Multiple row lift pin moves up and down simultaneously.

Alternatively, the substrate turnover device also includes the pedestal for bearing substrate, and the pedestal can be to being placed on Substrate thereon is heated.

Alternatively, the substrate turnover device also includes substrate transmission fork positioning element, the substrate transmission fork location division Part is used to position the free end of each bifurcated, so that each chip and each self-corresponding lift pin on the substrate of transmission It is aligned up and down.

Alternatively, each hold assembly is used for the chip for clamping a row, between the two neighboring hold assembly Spacing d is the width of n chip in the row direction, wherein, n is positive integer.

A kind of base plate processing system, the substrate include chip of the multiple row in row arrangement, and each column chip includes more wafers, The base plate processing system includes：For loading the load chamber of substrate, the transfer chamber for transmitting substrate, for processing substrate Process reaction chamber, the eversion chamber for substrate upset and detaching chamber for dismantling substrate, the transfer chamber respectively with it is described Connected between unloading chamber, the process reaction chamber, the eversion chamber and the detaching chamber and be provided with isolating valve；

The substrate turnover device as described in above-mentioned any embodiment is provided with the eversion chamber.

Alternatively, base plate transfer device is provided with the transfer chamber, the base plate transfer device includes：

Transfer robot, substrate transmission fork is provided with the transfer robot, and the substrate transmission fork includes a master The dry and a plurality of bifurcated being parallel to each other, one end of every bifurcated are connected on the trunk, and the other end is free end；

Multiple grooves are provided with every bifurcated, multiple grooves on every adjacent two bifurcateds are relative to be set Put；

Every two neighboring groove on every bifurcated is collectively forming with two grooves on the other side on adjacent prongs Support the wafer support structure of a wafer.

Alternatively, the side wall of the groove is slope.

Alternatively, the system also includes the substrate loading device for being arranged on the load chamber front end, and the substrate loads Device is identical with the structure of the base plate transfer device.

Alternatively, the system also includes the substrate provision for disengagement for being arranged on the detaching chamber rear end, the substrate dismounting The structure of device is identical with the structure of the base plate transfer device.

A kind of substrate method for turning, it is characterised in that the substrate method for turning is based on described in any of the above-described embodiment Substrate turnover device, the substrate method for turning include：

Step A：After on the lift pin that each chip on substrate is sent in eversion chamber, it is determined that current chip to be flipped Affiliated row；The current chip to be flipped is the row chip on substrate or the chip on mutual non-conterminous row；

Step B, lift pin corresponding to the current chip to be flipped and/or non-present chip to be flipped is controlled in vertical side Motion upwards, make the current chip to be flipped and non-present chip to be flipped not in same level, and make institute Current chip to be flipped is stated to be between the clamping rod being oppositely arranged up and down；

Step C, closure edge clamper, the clamping rod for making to be oppositely arranged up and down clamp the current chip to be flipped respectively Upper and lower surface fringe region, control lift pin corresponding to the current chip to be flipped to move down；

Step D, the current chip to be flipped for clamping clamped rod overturns 180 degree；

Step E, the edge grippers are opened, make the clamping rod in the vertical direction being oppositely arranged up and down backwards to fortune Dynamic, control lift pin corresponding with the current chip to be flipped moves up, so that described with the currently chip pair to be flipped The lift pin answered withstands the lower surface area of the current chip to be flipped, and then, the relative up and down of clamping same row chip sets The clamping rod put is in the horizontal direction backwards to moving, and then, the chip after control upset is moved to predeterminated position；

Step F, row belonging to current chip to be flipped are redefined in the chip not being reversed from substrate；

Step G, step B to step F is repeated, until all wafers on substrate realize upset.

A kind of substrate method for turning, the substrate method for turning overturn dress based on the substrate described in any of the above-described embodiment Put, the substrate method for turning includes：

Step A '：After on the lift pin that each chip on substrate is sent in eversion chamber, carrying for bearing wafer is controlled Pin in the vertical direction movement is risen, so that the chip being placed on lift pin is between the clamping rod being oppositely arranged up and down；

Step B ', closure edge clamper, the clamping rod for making to be oppositely arranged up and down clamp the upper following table of each chip respectively The fringe region in face；

Step C ', all lift pins of control move down；

Each chip upset 180 degree on step D ', control base board；

Step E ', the clamping rod in the vertical direction being oppositely arranged up and down are under each chip in motion, control base board Move, and be parked in the top of lower clamping rod；

Step F ', lift pin are moved up to carry each chip after overturning, and each chip after upset are moved to pre- If position.

Compared with prior art, the application at least has advantages below：

As seen through the above technical solutions, the base plate processing system provided in the application includes one and is specifically used to substrate The eversion chamber of upset, after the completion of a surface treatment of substrate, the substrate is sent to by the base plate transfer device in transfer chamber Eversion chamber, the upset of substrate can be realized under vacuum conditions using the substrate turnover device in eversion chamber, after upset, then by passing Send interior base plate transfer device be sent to process reaction chamber, another surface of substrate is handled, such completing substrate just, Carry on the back the processing on two sides.In this way, turned over by the base plate processing system that the application provides without substrate is sent to outside system Turn, the substrate turnover device in eversion chamber and eversion chamber included by it allows for substrate in base plate processing system Upset is completed, therefore, the base plate processing system provided by the application can improve substrate processing efficiency, and it is several to reduce substrate contamination Rate.

Brief description of the drawings

, below will be to embodiment or existing in order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this Some embodiments described in application, for those of ordinary skill in the art, on the premise of not paying creative work, Other accompanying drawings can also be obtained according to these accompanying drawings.

Fig. 1 is a kind of base plate processing system block schematic illustration that the embodiment of the present application provides；

Fig. 2 is the structural representation for the substrate transmission fork that the embodiment of the present application provides；

Fig. 3 is that the structure that fork support is transmitted by substrate is pitched in the substrate transmission that places a substrate in that the embodiment of the present application provides Schematic diagram；

Fig. 4 is the substrate turnover device structural representation that the embodiment of the present application provides；

Fig. 5 is the structural representation for the edge grippers that the embodiment of the present application provides；

Fig. 6 is the schematic flow sheet of the first embodiment of the substrate method for turning that the embodiment of the present application provides；

Fig. 7 is the schematic flow sheet of second of embodiment of the substrate method for turning that the embodiment of the present application provides；

Fig. 8 is the schematic flow sheet for the substrate transfer approach that the embodiment of the present application provides.

Reference

11：Substrate loader device people (ATM loading robot), 12：Substrate loading device, 13, load chamber, 141：The One transfer chamber, 142：Second transfer chamber, 151：First process reaction chamber, 152：Second process reaction chamber, 153：3rd technique is anti- Answer room, 154：4th process reaction chamber, 16：Eversion chamber, 17：Detaching chamber, 18：Substrate provision for disengagement, 19：Substrate teardown of engine people (ATM unloading robot), 110：Isolating valve；

21：Trunk, 22：Bifurcated；

41：Pedestal, 42：Edge grippers, 43：Lift pin；

421：Hold assembly, 422：Support.

Embodiment

In order that those skilled in the art more fully understand application scheme, below in conjunction with the embodiment of the present application Accompanying drawing, the technical scheme in the embodiment of the present application is clearly and completely described, it is clear that described embodiment is only this Apply for part of the embodiment, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art exist The every other embodiment obtained under the premise of creative work is not made, belongs to the scope of the application protection.

It is to be appreciated that the substrate described in the embodiment of the present application includes chip of the multiple row in row arrangement, each column chip includes more Wafer.

Fig. 1 is the base plate processing system block schematic illustration that the embodiment of the present application provides.As shown in figure 1, the processing substrate system System includes：

Substrate loader device people (ATM loading robot) 11, the substrate loading device 12 for loading substrate, it is used for Load load chamber 13, the first transfer chamber 141 for transmitting substrate and the second transfer chamber 142 of substrate, for processing substrate The process reaction chamber 152 of first process reaction chamber 151 to the 4th, for substrate upset eversion chamber 16, for dismantling tearing open for substrate Unload room 17 and substrate provision for disengagement 18, and substrate teardown of engine people (ATM unloading robot) 19；

The chip of each chip for bearing substrate is respectively provided with the load chamber 13 and the detaching chamber 17 Bolster stake；It is to be appreciated that a crystal chip bearing post is used to carry a wafer；In this way, how many wafer on carried base board of entertaining, Just need to set how many individual crystal chip bearing posts in load chamber 13 and detaching chamber 16.

The substrate loading device 12 is arranged on the front end of load chamber 13, and it is used for substrate loader device people 11 from holding The substrate taken out in the can of chip is loaded into load chamber 13, and more specifically, the chip being loaded into load chamber 13 is held Carry on post.

The substrate provision for disengagement 18 is arranged on the rear end of detaching chamber 17, and it is used for the chip out of detaching chamber 17 by substrate Taken away on bolster stake and be transferred to substrate teardown of engine people 19, contained each chip on substrate by substrate teardown of engine people 19 It is put into wafer metal box.

Wherein, between the load chamber 13 and first transfer chamber 141, first transfer chamber 141 respectively with it is described Between first process reaction chamber 151, the second process reaction chamber 152 and eversion chamber 16, second transfer chamber 142 is respectively with turning over Turn to be respectively communicated with and be provided between room 16, the 3rd process reaction chamber 153, the 4th process reaction chamber 154 and detaching chamber 17 every From valve 110.

As the specific embodiment of the application, the process reaction chamber of the first process reaction chamber 151 to the 4th described above 154 interior shape can be circle, and the inside can improve plasma rf for circular process reaction chamber 151 to 154 Source and the uniformity of gas flow.

In order to reduce the volume of base plate processing system, its floor space is reduced, in the embodiment of the present application, the He of load chamber 13 17 placement stacked on top of one another of detaching chamber.In order to further reduce the volume of base plate processing system, the placement location of the load chamber 13 Placement location with the detaching chamber 17 is in 90 degree of deflections.As another embodiment of the application, load chamber 13 and detaching chamber 17 Can also horizontal parallel placement.

The internal structure of the first transfer chamber 141 and the second transfer chamber 142 is described below.

In the base plate processing system that the application provides, it is provided with its transfer chamber 142 of the first transfer chamber 141 and second At least a set of base plate transfer device, the base plate transfer device can not directly transmit substrate by board bearing plate.The substrate passes Send device to include transfer robot, substrate transmission fork is provided with the transfer robot, wherein, the structure of substrate transmission fork is shown It is intended to as shown in Fig. 2 substrate transmission fork includes a trunk 21 and a plurality of bifurcated 22 being parallel to each other, every bifurcated 22 one end is connected on trunk 21, and the other end is free end；Generally, substrate be generally polygonal in shape or circle Shape, it is adapted with the shape of substrate, trunk 21 can be arc-shaped trunk.

Multiple grooves (not shown in Fig. 2) are provided with every bifurcated 22, it is more on every adjacent two bifurcateds The individual groove is oppositely arranged；

Every two neighboring groove on every bifurcated 22 and the common shape of two grooves on the other side on adjacent prongs Into the wafer support structure of one wafer of support.In this way, the same of the adjacent two groove support chip on same bifurcated The fringe region on side.The lower surface central area that its sky reserves can facilitate lift pin to withstand chip below chip, so as to The transmit process of completing substrate.

The wafer support structure formed by the groove on adjacent prongs enables to chip solid securely in transmit process It is scheduled on base plate transfer device, so as to realize the stable transmission of substrate.

Structural representation such as Fig. 3 institutes of fork support are transmitted by substrate as an example, placing a substrate on substrate transmission fork Show.In figure 3, quadrangle represents a piece of wafer one by one.

It is to be appreciated that in the embodiment of the present application, the transfer robot on base plate transfer device can do stretch, shrink with And move up and down, in order to which substrate is sent to target location by base plate transfer device.In the embodiment of the present application, the first transfer chamber Substrate can be sent to the first process reaction chamber 151, the second process reaction chamber by the base plate transfer device in 141 from load chamber 13 152 to be handled, and substrate can also be sent to eversion chamber 16, to carry out the upset of substrate.

Substrate can be sent to the 3rd process reaction chamber by the base plate transfer device in the second transfer chamber 142 out of eversion chamber 153rd, substrate can also be sent to detaching chamber 17 by the 4th process reaction chamber 154 to be handled.

Further, removed for the ease of chip from groove, the side wall of groove described above is slope, in this way, working as Need by chip from transmission fork on remove when, chip by the slope can from transmission fork on slide, so can easily from Chip is removed on bifurcated.In addition, the chip being placed in it can be stuck in the upper of the wafer support structure fork pockets that is formed by groove Between under shed, so it is also possible that chip is securely fixed in wafer support structure in transmit process.In addition, side wall Chip stabilization is also beneficial in the central area of wafer support structure for the groove on slope.

It is to be appreciated that in the embodiment of the present application, because chip is quadrangle, and its turning is generally fillet, so, The structure of the bearing wafer formed by four grooves on two neighboring bifurcated can be regarded as hollow truncated rectangular pyramids structure.And And the corner angle of the truncated rectangular pyramids structure are fillet, the fringe region of chip is stuck in the truncated rectangular pyramids structure.

In addition, in order to improve the yield of base plate processing system processing substrate, in the first transfer chamber 141 and the second transfer chamber Two sets of base plate transfer devices can be respectively arranged with 142, wherein, the two sets of substrates transmission being arranged in the first transfer chamber 141 In device, wherein a set of base plate transfer device is used to pending substrate being sent to the first process reaction chamber out of load chamber 13 151, another set of base plate transfer device is used for another substrate after the first process reaction chamber 151 is handled from the first technological reaction Take away and be sent to the second process reaction chamber 152 in room 151.Thus, it can be caused to second using two sets of base plate transfer devices Transmission substrate and take substrate out of first process reaction chamber 151 away process can and then first in process reaction chamber 152 After carry out, during which without waiting for load on base plate transfer device, so, two sets of biographies are provided with the first transfer chamber 141 Device is sent to reduce the opening time of the first process reaction chamber 151 and the isolating valve on the second process reaction chamber 152, so that The non-reacting treatment time obtained in the first process reaction chamber 151 and the second process reaction chamber 152 minimizes.

Further, when being provided with two sets of base plate transfer devices in the first transfer chamber 141, eversion chamber can also be reduced The opening time of 16 isolating valve.

Based on same principle, when being provided with two sets of base plate transfer devices in the second transfer chamber 142, in the 3rd technique Any one isolating valve in the process reaction chamber 154 of reative cell 153 and the 4th and eversion chamber 16 opens room, can be directly to it Inside transmission substrate, it is not necessary to wait to load on base plate transfer device, it can reduce by the 3rd process reaction chamber the 153, the 4th The opening time of process reaction chamber 154 and the isolating valve of eversion chamber 16, enable to the 3rd process reaction chamber 153 and the 4th work Non- reacting treatment time in skill reative cell 154 minimizes.

In addition, in order to improve base plate processing system processing substrate yield, reduce load chamber 13 isolating valve opening when Between, the substrate loading device for being arranged on the front end of load chamber 13 can be two sets, wherein, when a set of substrate loading device loads upper base When plate transmits substrate into load chamber 13, load robot 11 and substrate is taken out of can that hold substrate and places the substrate To another set of substrate loading device.In this way, after the isolating valve of load chamber 13 is again turned on, directly base can will be had been placed in Substrate on plate loading attachment is sent in load chamber 13, in this way, when the isolating valve opening mouth of load chamber 13, does not just have to wait again Substrate is placed on to substrate loading device, it is thus possible to is reduced the opening time of the isolating valve of load chamber 13, is advantageous to improve base The yield of plate processing system.

Based on same principle, the substrate provision for disengagement 18 for being arranged on the rear end of detaching chamber 17 can also be two sets, wherein, when Be placed on the substrate of a set of substrate provision for disengagement by unload robot 19 remove be put into can when, another set of substrate dismounting Device load in detaching chamber 17, it so, it is possible to reduce the opening time of the isolating valve of detaching chamber 17, be advantageous to improve at substrate The yield of reason system.

It is to be appreciated that in embodiment is applied for, substrate loading device 12 and substrate provision for disengagement 18 can be can be linear The structure of the base plate transfer device of motion, the substrate loading device 12 and substrate provision for disengagement 18 can be with being arranged in transfer chamber Base plate transfer device structure it is identical.

Substrate is loaded on base plate transfer device in order to coordinate and removes substrate from aforesaid substrate conveyer, Respectively it is provided with the process reaction chamber 154 of the first process reaction chamber of aforesaid substrate processing system 151 to the 4th for carrying The pedestal of substrate.Multiple lift pins are provided with the pedestal, are arranged on the lift pin on pedestal and the crystalline substance on substrate to be lifted Piece is corresponding, and the surface of lift pin is less than wafer surface.Each lift pin is by withstanding the close center of chip lower surface Domain lifts the chip being placed on pedestal from pedestal, and so as to expose the lower surface edge region of chip, and then sky reserves Fringe region facilitates the groove on bifurcated to support chip.In this way, the arrangement mode for the lift pin being arranged on pedestal can be with crystalline substance Arrangement mode of the piece on substrate is identical, and specifically, lift pin can include more on pedestal in row arrangement, each column lift pin Individual lift pin.

Wherein, being arranged on lift pin on the pedestal in the process reaction chamber 154 of the first process reaction chamber 151 to the 4th can be with Move up and down, moving up and down for the lift pin can drive the chip being placed on it to move up and down.As an example, lift pin The upper and lower surface of pedestal can be run through.

As the specific embodiment of the application, in the above-mentioned process reaction chamber 154 of first process reaction chamber 151 to the 4th Substrate transmission fork positioning element is also provided with, the substrate transmission fork positioning element is used to enter the free end of each bifurcated Row positions, so that each self-corresponding lift pin on each chip and pedestal on the substrate of transmission is aligned up and down.More specifically Say, the effect of substrate transmission fork positioning element is in order to which the substrate is sent to each technological reaction by the base plate transfer device The surface of indoor pedestal and each wafer are located at the surface of its corresponding lift pin respectively, so as to realize each chip With the alignment up and down of lift pin.

In addition, the pedestal being arranged in the process reaction chamber 154 of the first process reaction chamber 151 to the 4th can also be to being placed on Substrate thereon is heated, so that base temperature reaches treatment temperature.

Because in the embodiment of the present application, substrate is directly placed on pedestal, because the quality of substrate is smaller, thus it is possible to Enough temperature that more quickly temperature of substrate can be just heated to need.In addition, when base plate processing system is PECVD system, Pedestal generally as plasma reaction system bottom electrode, and by applying RF between two electrodes up and down into technological reaction room Plasma reaction generation priming reaction particle occurs in technological reaction room for power or dc power.

In addition, the base plate processing system between upper/lower electrode is placed on compared to board bearing plate of the prior art, by The electric field uncertain factor between upper/lower electrode can be produced in board bearing plate, in the processing substrate system that the embodiment of the present application provides Pending substrate, can be placed directly between the upper/lower electrode of plasma reaction system by system, thus will not be in upper/lower electrode Between produce electric field uncertain factor, therefore the application provide base plate processing system there is very high process repeatability.

It is anti-in the technique of the first process reaction chamber 151 to the 4th in order to reduce substrate as the alternative embodiment of the application The technological reaction time in room 154 is answered, the crystal chip bearing post being arranged in load chamber 13 can enter to the substrate being placed on it Row heating, makes the substrate temperature after heating close to substrate process temperature.In order to accelerate the substrate after cooling treatment, as the application Another alternative embodiment, the crystal chip bearing post being arranged in the detaching chamber 17 can cool down to the substrate that it is carried.

It is to be appreciated that in the base plate processing system shown in Fig. 1, according to the PROCESS FOR TREATMENT mode of the substrate pre-set, Same treatment process condition can be used to substrate in the first process reaction chamber 151 and the second process reaction chamber 152 to substrate Handled, substrate can also be handled using different treatment process conditions.Equally, in the 3rd process reaction chamber 153 In the 4th process reaction chamber 154, substrate can be handled substrate using same treatment process condition, can also used Different treatment process conditions are handled substrate.

As the specific embodiment of the application, the knot of substrate loading device 12 described above and substrate provision for disengagement 18 Structure can be identical with the structure of base plate transfer device described above.So, it is possible substrate load and dismantle when also without Board bearing plate need to be used.

The concrete structure for the substrate turnover device being arranged in eversion chamber 16 is described below.Fig. 4 shows that the application provides Substrate turnover device structural representation.As shown in figure 4, the substrate turnover device includes：For bearing substrate pedestal 41 with And the edge grippers 42 for holding chip edge, multiple lift pins 43 are provided with the pedestal 41, are arranged on substrate Lift pin it is corresponding with the chip on substrate to be lifted, and the surface of lift pin is less than wafer surface.It is arranged on pedestal 41 On the arrangement mode of lift pin 43 can be identical with arrangement mode of the chip on substrate, specifically, lift pin 43 can be with Include multiple lift pins in row arrangement, each column lift pin on pedestal 41.Each lift pin is by withstanding the close center of chip Region lifts the chip being placed on pedestal from pedestal, and so as to expose the lower surface edge region of chip, and then sky stays Go out fringe region and facilitate the holding chip of edge grippers 42.

In the embodiment of the present application, lift pin 43 can run through the upper and lower surface of pedestal 41 and can move up and down, lift pin 43 move up and down can drive the chip being placed on it to move up and down.

In order to reduce processing time of the substrate in technological reaction room, the pedestal being arranged in the eversion chamber can be to putting Put the substrate thereon to be heated, make substrate temperature close to subsequent substrate treatment temperature.

It is to be appreciated that another embodiment as the application, can also be not provided with pedestal, in this feelings in eversion chamber 16 Under condition, each chip come from the transmission of the first transfer chamber 142 is placed on lift pin, moreover, after each chip completes upset, It is also disposed on lift pin.

The concrete structure of edge grippers 42 is described below.

Fig. 5 shows the structural representation of edge grippers 42.As shown in figure 5, the edge grippers 42 include multiple phases Mutual parallel hold assembly 421 and the support 422 being connected with the both ends of each hold assembly 421, each hold assembly 421 are used In the chip of the row of clamping one.Each hold assembly 421 includes about the more clamping rods being oppositely arranged, and this is upper and lower to be oppositely arranged Clamp the fringe region that rod is used to clamp the upper and lower surface of a row chip；Described about the more clamping rods being oppositely arranged are vertical It can be moved on direction, or, described about the more clamping rods being oppositely arranged can on vertically and horizontally Motion, to realize the clamping to chip in chip switching process and loosen.

It is to be appreciated that one embodiment as the application, chip on substrate in switching process, it is necessary to around exist Certain space, so, once inside out process can only overturn the chip on mutual non-conterminous row, specifically, in once inside out During, chip to be flipped can be the either rank chip on substrate or the multiple row chip on mutual non-conterminous row.It is in this way, adjacent Spacing d between two hold assemblies is the width of n chip in the row direction, wherein, n is positive integer.Fig. 5 examples Go out, the spacing between two neighboring hold assembly 421 is the width of a chip in the row direction.

In order to which substrate is accurately transmitted on the lift pin of eversion chamber, as the specific embodiment of the application, Substrate turnover device described above can also include substrate transmission fork positioning element, and the substrate transmission fork positioning element is used for The free end of each bifurcated is positioned so that transmission substrate on each chip and with its each self-corresponding lift pin Lower alignment.More specifically, the effect of substrate transmission fork positioning element is in order to which the base plate transfer device passes the substrate The surface (when being provided with pedestal in eversion chamber) for the pedestal delivered in eversion chamber and each wafer carry positioned at each respectively The surface of pin is risen, so as to realize the alignment up and down of the corresponding lift pin of each chip.

Further, since moving up and down for chip is to move up and down drive by lift pin below, so, in order to control System moves up and down, it is necessary to control lifting corresponding to the chip during once inside out simultaneously in the chip during once inside out Pin can move up and down simultaneously.Therefore, substrate turnover device described above can also include lift pin control parts of motion, institute Lift pin control parts of motion is stated to be used to control the multiple row lift pin on all lift pins, a row lift pin or mutual non-conterminous row Move up and down simultaneously, to drive the chip in the multiple row on all lift pins, a row lift pin or mutual non-conterminous row can be same When move up and down.

As the alternative embodiment of the application, in order to realize the preheating to substrate, the base plate processing system can be with Including the preheating chamber (not shown) for being arranged on the front end of load chamber 13 and being connected with the load chamber 13, the preheating chamber Isolating valve is provided between the load chamber 13.The pedestal for bearing substrate, the pedestal are provided with the preheating chamber On be provided with multiple lift pins, the multiple lift pin is corresponding with multiple chips on substrate to be lifted, and lift pin Surface is less than wafer surface, and each lift pin can lift the chip being placed on it from the pedestal.

In order to realize the cooling to the substrate after processing, the base plate processing system can also include being arranged on the dismounting Room rear end and the cooling chamber (not shown) connected with the detaching chamber, are set between the cooling chamber and the detaching chamber 7 There is isolating valve；

The pedestal for bearing substrate is provided with the cooling chamber, multiple lift pins are provided with the pedestal, it is described Multiple lift pins are corresponding with multiple chips on substrate to be lifted, and the surface of lift pin is less than wafer surface, Mei Gesuo Lift pin is stated the chip being placed on it can be lifted from the pedestal.

The embodiment of the base plate processing system provided above for the embodiment of the present application.

It is to be appreciated that in the embodiment of the present application, each chamber can arrange shape with ring style in base plate processing system , can also the linearly aligned base plate processing system of arrangement form in a linear fashion into clustering formula (cluster) system.Wherein, adopt Floor space is advantageously reduced with the based process system of clustering formula (cluster) system architecture.

As an example, base plate processing system described above can be PECVD (plasma-enhancement Chemical vapor deposition, plasma enhanced chemical vapor deposition) technology processing system.

When base plate processing system is pecvd process processing system, the process reaction chamber of the first process reaction chamber 151 to the 4th Two electrodes opposing upper and lower are respectively provided with 154.Substrate is placed on pedestal (being usually bottom electrode).Pedestal is to placing Substrate thereon is heated, and reaches film deposition temperature.In application of solar energy, film deposition temperature typically exists 180 degree is between 250 degree.Reacting gas and inert gas spray in spray head above and are distributed to substrate surface.In work In skill reative cell 151 to 154, plasma can be produced between pedestal and spray head using radio-frequency power, in this way, in substrate Surface deposition last layer or plural layers.

The base plate processing system that the embodiment of the present application provides can apply to hetero-junction solar cell substrate such as photovoltaic cell substrate Surface treatment process.

When base plate processing system described above is applied to the deposition of hetero-junction solar cell structure, as an example, the first work Skill reative cell 151 to the 4th process reaction chamber 154 may be respectively used for producing the doped layer and undoped layer of photovoltaic devices Each layer, such as p-type doping (silicon layer as adulterated boron), I types (such as intrinsic silicon layer) and n-type doping (silicon layer as adulterated phosphorus).

It is to be appreciated that the base plate processing system shown in Fig. 1 includes two transfer chambers and four process reaction chambers, wherein, pass It is only example to send the quantity of room and process reaction chamber, should not be understood as the limitation of the base plate processing system of the application offer.It is real On border, the base plate processing system that the application provides can only include a transfer chamber and a process reaction chamber, can also include The transfer chamber and process reaction chamber of other quantity.In actual applications, transfer chamber and process reaction chamber in base plate processing system Quantity can be set according to being actually needed.As long as in this way, comprising transfer chamber described herein and technological reaction cell structure Base plate processing system the application protection domain row.

Handling process of the substrate in the base plate processing system described in above-described embodiment is specific as follows：

Substrate is sent on substrate loading device 12 by substrate loader device people 11, and then, substrate loading device 12 is by base Plate is sent to the surface of the crystal chip bearing post of load chamber 13, and each chip on substrate and corresponding chip are held Carry post alignment after, each chip on substrate is dropped on each self-corresponding crystal chip bearing post, then substrate loading device 12 from Removed in load chamber 13, close the isolating valve of the front end of load chamber 13.

Then, substrate is respectively sent to the He of the first process reaction chamber 151 by the base plate transfer device in the first transfer chamber 141 After second process reaction chamber 152, a surface of substrate is handled, when anti-in the first process reaction chamber 151 and the second technique Answer in room 152 after completion processing, then substrate is sent to eversion chamber 16 by the base plate transfer device in the first transfer chamber 141, profit Substrate is overturn with the substrate turnover device in eversion chamber 16, so that one handled is face-down, untreated one Up.Then, substrate is respectively sent to the 3rd process reaction chamber 153 by the base plate transfer device in the second transfer chamber 142 In the 4th process reaction chamber 154, another surface of substrate is handled, after having been handled after the two sides of substrate, then by base Plate is sent to detaching chamber 17.From above-mentioned flow, the substrate transfer system for including eversion chamber provided using the application Can inside processing substrate processing system can completing substrate upset, so without substrate is sent to outside processing system Can completing substrate upset.Therefore, treatment process flow can be simplified based on the base plate processing system, reduces the friendship of substrate Pitch the possibility of pollution.

The substrate turnover device provided based on above-described embodiment, present invention also provides the first of a kind of substrate method for turning Kind embodiment.

It is to be appreciated that in the embodiment of the present application, once inside out process can only be to a row or mutual non-conterminous multiple row chip Overturn.In this way, by the embodiment, it is necessary to by all wafers on multiple switching process ability completing substrate Upset.

Fig. 6 is the schematic flow sheet of the first embodiment of the substrate method for turning that the embodiment of the present application provides. As shown in fig. 6, the substrate method for turning comprises the following steps：

S601：After on the lift pin that each chip on substrate is sent in eversion chamber, it is determined that current chip to be flipped Affiliated row；The current chip to be flipped is the chip at interval of a row chip on substrate：

This step is specially：In order to receive by the first transfer chamber 141 base plate transfer device transmit Lai base Plate, the lift pin being arranged in eversion chamber 16 move up certain altitude (this is highly properly termed as substrate transmission height), make it in advance Reach the convenient position for receiving the substrate by base plate transfer device transmission (position is properly termed as substrate transfer position).Work as substrate After being sent on the lift pin of eversion chamber 16, base plate transfer device is removed into eversion chamber 16, and closes the biography of eversion chamber 16 and first The isolating valve between room 141 is sent, so that keeping vacuum environment in eversion chamber.

Each chip on substrate is sent on advance in eversion chamber by base plate transfer device in the first transfer chamber 141 On the lift pin of shifting, then using at interval of the chip of a row chip as current chip to be flipped.

S602, the control current chip to be flipped and/or lift pin corresponding to non-present chip to be flipped are in vertical side Motion upwards, make the current chip to be flipped and non-present chip to be flipped not in same level, and make institute Current chip to be flipped is stated to be between the clamping rod being oppositely arranged up and down：

It is to be appreciated that the lift pin in the vertical direction being arranged in eversion chamber can move up and down.In order to currently to treat Overturning chip and enough upset space is provided, current chip to be flipped and non-present chip to be flipped are needed not in sustained height, Therefore, lift pin in the vertical direction corresponding to current chip to be flipped and/or non-present chip to be flipped is controlled to move up and down, Make both not in same level, and the current chip to be flipped is between the clamping rod being oppositely arranged up and down.

In general, turning height (residing height when chip is overturn) is generally greater than transmission height, so, as showing Example, control lift pin in the vertical direction corresponding to current chip to be flipped to move up, control corresponding to non-present chip to be flipped Lift pin in the vertical direction moves down, so that both are not in same level.It is current to be flipped alternatively, it is also possible to only control Lift pin moves up corresponding to chip, can also only control lift pin corresponding to non-present chip to be flipped to move down, be stated so as to reach Current chip to be flipped and non-present chip to be flipped make the current chip to be flipped not in same level Between the clamping rod being oppositely arranged up and down.

S603, closure edge clamper, the clamping rod for making to be oppositely arranged up and down clamp the current chip to be flipped respectively Upper and lower surface fringe region, control lift pin corresponding to the current chip to be flipped to move down：

It is to be appreciated that after edge grippers close, the clamping rod being oppositely arranged up and down clamps current crystalline substance to be flipped respectively The fringe region of the upper and lower surface of piece, in this way, current chip to be flipped is just carried by the clamping rod in edge grippers, now, Current chip to be flipped can depart from lift pin.

Therefore, in order to provide the upset space of lower section for current chip to be flipped, it is necessary to control currently chip pair to be flipped The lift pin answered moves down.

S604, the current chip to be flipped for clamping clamped rod overturn 180 degree.

S605, the edge grippers are opened, make the clamping rod in the vertical direction being oppositely arranged up and down backwards to fortune Dynamic, control lift pin corresponding with the current chip to be flipped moves up so that it is described with the currently chip to be flipped Corresponding lift pin withstands the lower surface area of the current chip to be flipped, then, clamps the relative up and down of same row chip The clamping rod of setting is in the horizontal direction backwards to moving, and then, the chip after control upset is moved to predeterminated position：

It is to be appreciated that in the embodiment of the present application, the movement of lift pin can drive the movement for the chip being placed on it, Therefore, the chip after control upset is moved to predeterminated position, is specifically as follows：Lift pin fortune corresponding to chip after control upset It is dynamic, so that the chip after upset is moved to predeterminated position.

It is to be appreciated that after substrate upset, it is also necessary to be sent to the 3rd via the base plate transfer device in the second transfer chamber 142 Process reaction chamber or the 4th process reaction chamber continue to handle, so, predeterminated position described herein can be the second biography The base plate transfer device in room 142 is sent conveniently to capture the position of substrate, it is also assumed that being substrate transfer position.

, can be with when being provided with the pedestal for bearing substrate in eversion chamber as the alternative embodiment of the application Chip after upset is transferred on pedestal, when pedestal can heat to the substrate being placed on it, can also be utilized Pedestal heats to the chip after upset.

Row belonging to current chip to be flipped are redefined in S606, the chip not being reversed from substrate；

S607, step S602 is repeated to step S606, so that all wafers on substrate realize upset.

It is to be appreciated that in the embodiment of the present application, due to certain space be present around chip, turning over for chip could be realized Turn, in order to provide enough upset spaces for the upset of chip, adjacent two chips arranged can not be overturn simultaneously.Therefore, Above-described embodiment will carry out first time upset simultaneously at interval of chip corresponding to a row chip, and remaining chip carries out the simultaneously again Secondary upset, so that all wafers on substrate realize upset.

The embodiment of aforesaid substrate method for turning is achieved that all wafers on substrate by switching process twice Upset, therefore, the upset efficiency of the embodiment is higher.

It is to be appreciated that the extension as the embodiment of the present application, in fact, in a chip switching process, so long as not Upset can be achieved in chip in adjacent column.So during once inside out, chip to be flipped can be not limited to be interval Chip on one row, it can be the chip in the multiple row of interval, and it can also be the either rank chip on substrate, in short, During once inside out, chip to be flipped can be that the either rank chip on substrate or the multiple row on mutual non-conterminous row are brilliant Piece.When chip to be flipped is either rank chip on substrate or mutually multiple row chip on non-conterminous row, in order to realize substrate On all wafers upset, it may be necessary to more than switching process more times twice.

It is to be appreciated that in the embodiment of the present application, the transporting substrates, device in the first transfer chamber 141 and the second transfer chamber 142 Substrate can be transmitted and be captured from any surface of eversion chamber by putting.

In addition, present invention also provides a kind of second of embodiment of substrate method for turning.Fig. 7 is the application reality The schematic flow sheet of second of embodiment of the substrate method for turning of example offer is provided.As shown in fig. 7, the specific embodiment party Formula may comprise steps of：

S701：After on the lift pin that each chip on substrate is sent in eversion chamber, the lifting of bearing wafer is controlled In the vertical direction movement is sold, so that the chip on lift pin is between the clamping rod being oppositely arranged up and down：

S702, closure edge clamper, the clamping rod for making to be oppositely arranged up and down clamp each chip on substrate respectively The fringe region of upper and lower surface.

S703, all lift pins of control move down：

It is to be appreciated that after chip is clamped by the clamping rod being oppositely arranged up and down, chip can depart from the carrying of lift pin, And in order to provide space for the upset of chip, the lift pin of all bearing wafers is controlled to move down.

Each chip upset 180 degree on S704, control base board.

S705, the edge grippers are opened, the clamping rod in the vertical direction for making to be oppositely arranged up and down is controlled backwards to moving Each chip on substrate processed moves down, and is parked in the top of lower clamping rod.

S706, lift pin are moved up to carry each chip after overturning, and each chip after upset are moved to default Position：

Second of embodiment of the substrate method for turning provided above for the embodiment of the present application.Pass through the specific reality The mode of applying can be with once inside out all wafers.When realizing the upset of substrate by the embodiment, when the first transfer chamber 141 and second transfer chamber 142 base plate transfer device can only pass through eversion chamber it is relative two faces transmission and crawl substrate.

Two kinds of embodiments of the substrate method for turning provided above for the embodiment of the present application are specific by this two kinds Embodiment, the upset of substrate can be realized under vacuum conditions.

It should be noted that for substrate for the whole flow process in base plate processing system, the substrate is to complete After processing simultaneously, then the processing of another side is carried out before, it is necessary to realize upset.In this way, after one side processing has been carried out, it is necessary to Substrate is sent in eversion chamber out of technological reaction room.In this way, the specific embodiment as the application, base described above Plate method for turning can also include before step S601 or step S701：

Substrate is sent to by eversion chamber by the base plate transfer device in the first transfer chamber 141.

Substrate is sent to the specific of eversion chamber by 8 pairs by the base plate transfer device in the first transfer chamber below in conjunction with the accompanying drawings Implementation.

Fig. 8 is that substrate is sent into eversion chamber from process reaction chamber by the base plate transfer device in the first transfer chamber 141 On method flow schematic diagram.As shown in figure 8, this method comprises the following steps：

Lift pin on S801, the pedestal being arranged in technological reaction room lifts chip disposed thereon from pedestal, So as to expose the fringe region of chip lower surface：

Crystalline substance of the groove support on bifurcated that S802, substrate transmission are pitched on the lift pin on the pedestal of process reaction chamber The fringe region of the lower surface of piece.

The substrate for being supported by chip transmission fork is sent to eversion chamber 16 by S803, transfer robot.

Each bifurcated on substrate transmission fork of the substrate transmission fork positioning element to transmitting chip in S804, eversion chamber 16 Free end positioned so that each chip and its each self-corresponding lift pin moved up in advance are aligned up and down.

Each chip reduction on substrate is placed into each self-corresponding with its in eversion chamber 16 by S805, substrate transmission fork On the lift pin moved up in advance, then substrate transmission fork is removed from the lower surface of chip：

It is to be appreciated that in order to after each chip on substrate is put into lift pin by substrate transmission fork, facilitate substrate to transmit Fork is detached from the lower surface of substrate, it is necessary to before chip is placed on lift pin, will be lifted in advance corresponding to each chip Pin lifts.

Lift pin in the vertical direction movement in S806, control eversion chamber 16, so as to which chip is sent into transmission position：

It is to be appreciated that when being provided with pedestal in eversion chamber 16, chip can also be sent on pedestal.

The embodiment of the substrate transfer approach provided above for the embodiment of the present application.

From the foregoing, it will be observed that the application provide base plate transfer device in, on every bifurcated per two neighboring groove with adjacent point Pitch two grooves on the other side be collectively forming one be used for support a wafer wafer support structure, in this way, often it is adjacent Multiple wafer support structures that groove on two bifurcateds is formed can support a row chip, in substrate transmit process, by crystalline substance After piece is placed in groove, chip can be securely fixed on base plate transfer device in transmit process.Meanwhile utilize this Shen The base plate transfer device that please be provided and the pedestal in matched each chamber and the lift pin being arranged on pedestal, can To coordinate substrate that transmission of the substrate in base plate processing system can be achieved without substrate placing stage, for example, being transmitted from load chamber To process reaction chamber.

In addition, the base plate transfer device, transfer approach and the base being arranged in technological reaction room that are provided based on the application Lift pin on seat and pedestal, substrate can be directly placed on the pedestal of process reaction chamber, in this way, pedestal can be directly right Substrate is heated, and because the quality of substrate is smaller, therefore pedestal can heat the substrate to place in a short period of time Temperature is managed, in this way, being advantageous to improve treatment effeciency.

Further, since substrate can be directly placed on pedestal, without using substrate placing stage in substrate processing process, Therefore, the trouble of periodic cleaning substrate placing stage is eliminated.In addition, substrate to be processed is both needed to for front and back, due to processing Process is also not in the cross pollution brought due to substrate placing stage therefore, therefore, based on this Shen without substrate placing stage Base plate transfer device, transfer approach and the base plate processing system that please provide can reduce the cross pollution of substrate, improve substrate Yield.

In addition, after complete to processing substrate, after substrate is sent into detaching chamber, directly substrate can be cooled down, by Smaller in its quality, therefore, its cooldown rate is very fast, in this way, can also accelerate the handling process of substrate.

To sum up, the base plate transfer device and base plate processing system provided using the application can not have to substrate placing stage The transmission and processing to substrate are completed, substrate is transmitted and located using board bearing plate in the prior art in this way, overcoming The defects of reason, therefore, the base plate transfer device and base plate processing system provided using the application, can simplify substrate processing program, Improve processing substrate efficiency.

It is described above, only it is the preferred embodiment of the application, not makees any formal limitation to the application.Though Right the application is disclosed above with preferred embodiment, but is not limited to the application.It is any to be familiar with those skilled in the art Member, in the case where not departing from technical scheme ambit, all using the methods and technical content of the disclosure above to the application Technical scheme makes many possible changes and modifications, or is revised as the equivalent embodiment of equivalent variations.Therefore, it is every without departing from The content of technical scheme, the technical spirit according to the application is to any simple modification made for any of the above embodiments, equivalent Change and modification, still fall within technical scheme protection in the range of.

Claims

1. a kind of substrate turnover device, it is characterised in that the substrate includes chip of the multiple row in row arrangement, and each column chip includes More wafers, the substrate turnover device include：For bearing wafer, the multiple lift pins that can move up and down and be used for The edge grippers at holding chip edge, the multiple lift pin is corresponding with multiple chips on substrate to be lifted, and institute The surface for stating lift pin is less than wafer surface, and each moving up and down for the lift pin can be driven on the chip being placed on it Lower movement；

The edge grippers include multiple hold assemblies being parallel to each other, and each hold assembly is relative including about more The clamping rod of setting, described about the more clamping rods being oppositely arranged are used for the marginal zone for clamping the upper and lower surface of a row chip Domain；

Described about the more clamping rod in the vertical directions being oppositely arranged can move, or, described about more set relatively The clamping rod put can move on vertically and horizontally.

2. substrate turnover device according to claim 1, it is characterised in that the multiple lift pin is arranged in column, described Substrate turnover device also includes lift pin control parts of motion, and the lift pin control parts of motion is used to controlling all described carry Rise pin, a row lift pin or mutually the multiple row lift pin on non-conterminous row moves up and down simultaneously.

3. substrate turnover device according to claim 1, it is characterised in that the substrate turnover device also includes being used to hold The pedestal of carried base board, the pedestal can heat to the substrate being placed on it.

4. substrate turnover device according to claim 1, it is characterised in that the substrate turnover device also includes substrate and passed Fork positioning element is sent, the substrate transmission fork positioning element is used to position the free end of each bifurcated, so that transmission Each chip and each self-corresponding lift pin on substrate are aligned up and down.

5. according to the substrate turnover device described in claim any one of 1-4, it is characterised in that each hold assembly is used for The chip of the row of clamping one, the spacing d between the two neighboring hold assembly is the width of n chip in the row direction, wherein, N is positive integer.

6. a kind of base plate processing system, it is characterised in that the substrate includes chip of the multiple row in row arrangement, and each column chip includes More wafers, the base plate processing system include：For loading the load chamber of substrate, the transfer chamber for transmitting substrate, being used for The process reaction chamber of processing substrate, the eversion chamber for substrate upset and the detaching chamber for dismantling substrate, the transfer chamber Connected respectively between the load chamber, the process reaction chamber, the eversion chamber and the detaching chamber and be provided with every From valve；

Substrate turnover device described in just like claim any one of 1-5 is set in the eversion chamber.

7. base plate processing system according to claim 6, it is characterised in that be provided with transporting substrates, device in the transfer chamber Put, the base plate transfer device includes：

Transfer robot, is provided with substrate transmission fork in the transfer robot, the substrate transmission fork include a trunk with The a plurality of bifurcated being parallel to each other, one end of every bifurcated are connected on the trunk, and the other end is free end；

Multiple grooves are provided with every bifurcated, multiple grooves on every adjacent two bifurcateds are oppositely arranged；

Every two neighboring groove on every bifurcated is collectively forming support with two grooves on the other side on adjacent prongs The wafer support structure of one wafer.

8. base plate processing system according to claim 7, it is characterised in that the side wall of the groove is slope.

9. according to the base plate processing system described in claim any one of 7-8, it is characterised in that the system also includes being arranged on The substrate loading device of the load chamber front end, the substrate loading device are identical with the structure of the base plate transfer device.

10. according to the base plate processing system described in claim any one of 7-8, it is characterised in that the system also includes setting Substrate provision for disengagement in the detaching chamber rear end, the structure of the substrate provision for disengagement and the structure of the base plate transfer device It is identical.