CN109346429A - A kind of direct plugging-in silicon wafer inserted sheet slice getting device - Google Patents
A kind of direct plugging-in silicon wafer inserted sheet slice getting device Download PDFInfo
- Publication number
- CN109346429A CN109346429A CN201811368971.6A CN201811368971A CN109346429A CN 109346429 A CN109346429 A CN 109346429A CN 201811368971 A CN201811368971 A CN 201811368971A CN 109346429 A CN109346429 A CN 109346429A
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- CN
- China
- Prior art keywords
- silicon wafer
- component
- comb teeth
- inserted sheet
- getting device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The present invention relates to technical field of automation equipment, disclose a kind of direct plugging-in silicon wafer inserted sheet slice getting device comprising set middle component and horizontal drive component including comb teeth component, lifting driving assembly, two；Comb teeth component includes two groups and is parallel to each other and spaced comb teeth, comb teeth includes several carding tooth plates being arranged successively, and interval trough is equipped between adjacent fingers piece, and the top of carding tooth plate is equipped with holding tank, for clamping to product, lifting driving assembly is gone up and down holding tank for driving comb；Two set the two sides that middle component is respectively arranged on comb teeth component, and setting middle component includes setting middle plate, during horizontal drive component is set for driving two to set middle plate respectively from two sides to intermediary movements, by product.It realizes in the setting of silicon wafer and marshalling, convenient for carrying out inserted sheet operation to it, and carries out inserted sheet by way of support clamping and take piece, reduce the breakage rate in silicon wafer transfer process, while improving production efficiency.
Description
Technical field
The present invention relates to silicon wafer production equipment technology, in particular to a kind of direct plugging-in silicon wafer inserted sheet slice getting device.
Background technique
In solar silicon wafers recipe step, need first to carry out inserted sheet operation, i.e., spaced reciprocally by multi-disc silicon wafer
Be placed on quartz boat, then carry out process, then carry out that piece is taken to operate, i.e., again the silicon wafer by process after complete from stone
It is taken out in Ying Zhou, in case subsequent technological operation.Mainly silicon wafer is grabbed using three kinds of grasp modes at present, it may be assumed that clamping
Formula, electromagnetic adsorption type, vacuum cap type.Wherein, since silicon wafer thickness is very thin, material is more crisp, clipping that silicon wafer is be easy to cause to damage
Bad, electromagnetic adsorption type and vacuum adsorption type structure are complex, and part difficulty of processing is larger, and vacuum adsorption type is due to its sucker
Aspirating hole is in sucker center, and in the moment of vacuum suction and inflation, gas can cause biggish local assault to silicon wafer, and
And in order to obtain enough adsorption capacities, the contact area of sucker and silicon wafer is often reduced, concentrates the vacuum suction chamber to be formed
At sucker center, it will cause silicon wafer center stressed in this way and concentrate and cause silicon wafer damaged.Therefore, it is necessary to a kind of new device,
Safely and efficiently to realize silicon wafer inserted sheet and piece taken to operate.
Summary of the invention
In view of the deficiencies of the prior art, it is an object of that present invention to provide a kind of safe and efficient, can before inserted sheet to silicon wafer into
The silicon wafer inserted sheet slice getting device of row adjustment, adopts the following technical scheme that
A kind of direct plugging-in silicon wafer inserted sheet slice getting device comprising comb teeth component, lifting driving assembly, two set middle component and water
Flat driving assembly；
The comb teeth component is parallel to each other including two groups and spaced comb teeth, the comb teeth include several be arranged successively
Carding tooth plate, interval trough is equipped between the adjacent carding tooth plate, the top of the carding tooth plate is equipped with holding tank, and the holding tank is used
It is clamped in product, the lifting driving assembly is for driving the comb teeth to go up and down；
Described two set the two sides that middle component is respectively arranged on the comb teeth component, and described to set middle component include setting middle plate, described
During horizontal drive component is set for driving two to set middle plate respectively from two sides to intermediary movements, by product.
As a further improvement of the present invention, the lifting driving assembly includes upright guide rail, lifting seat, lifting motor,
The lifting seat is set on the upright guide rail, and the lifting motor drives the lifting seat lifting, and the comb teeth component is set to
On the lifting seat.
As a further improvement of the present invention, the comb teeth bottom is equipped with the first support frame, first support frame and liter
Drop seat is fixedly connected.
As a further improvement of the present invention, the horizontal drive component includes horizontal rail, horizontal base, horizontal air cylinder,
The horizontal base is set on the horizontal guide rail, and the horizontal air cylinder drives the horizontal base horizontal movement, described to set middle component
On the horizontal base.
As a further improvement of the present invention, described to set middle board bottom portion equipped with the second support frame, second support frame with
The horizontal base is fixedly connected.
As a further improvement of the present invention, described to set middle plate equipped with several product holding tanks being arranged successively.
As a further improvement of the present invention, described set is symmetrically arranged with upper limit plate and lower limiting board on middle plate, described
Upper limit plate is worked in coordination with lower limiting board.
As a further improvement of the present invention, the opening of the holding tank is equipped with product lead-in chamfered.
As a further improvement of the present invention, the depth of the interval trough is greater than the depth of the holding tank.
Beneficial effects of the present invention:
Direct plugging-in silicon wafer inserted sheet slice getting device of the invention sets middle group by setting comb teeth component, lifting driving assembly, two
Part and horizontal drive component, lifting driving assembly are gone up and down for driving comb component, and comb teeth component includes two groups and is parallel to each other simultaneously
Spaced comb teeth, comb teeth include several carding tooth plates being arranged successively, and are equipped with interval trough between adjacent fingers piece, carding tooth plate
Top is equipped with holding tank, and by holding tank for clamping to silicon wafer, lifting driving assembly is gone up and down for driving comb, realizes
Inserted sheet and take piece.
Meanwhile two set the two sides that middle component is respectively arranged on comb teeth component, setting middle component includes setting middle plate, horizontal drive component
For driving two to set middle plate respectively from two sides to intermediary movements, silicon wafer set.It realizes in the setting of silicon wafer and marshalling, is convenient for
Inserted sheet operation is carried out to it.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And it can be implemented in accordance with the contents of the specification, and in order to allow above and other objects, features and advantages of the invention can
It is clearer and more comprehensible, it is special below to lift preferred embodiment, and cooperate attached drawing, detailed description are as follows.
Detailed description of the invention
Fig. 1 is the structural schematic diagram one of direct plugging-in silicon wafer inserted sheet slice getting device in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram two of direct plugging-in silicon wafer inserted sheet slice getting device in the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of comb teeth component in the embodiment of the present invention；
Fig. 4 is the partial structural diagram of comb teeth in the embodiment of the present invention；
Fig. 5 is the structural schematic diagram that driving assembly is gone up and down in the embodiment of the present invention；
Fig. 6 is the structural schematic diagram that middle component and horizontal drive component are set in the embodiment of the present invention；
Fig. 7 is the structural schematic diagram that middle plate is set in the embodiment of the present invention.
Description of symbols: 100, comb teeth component；110, comb teeth；111, carding tooth plate；112, interval trough；113, holding tank；114,
Product lead-in chamfered；120, the first support frame；200, driving assembly is gone up and down；210, upright guide rail；220, lifting seat；230, it goes up and down
Motor；300, middle component is set；310, middle plate is set；311, upper limit plate；312, upper limit plate；313, product holding tank；320,
Two support frames；400, horizontal drive component；410, horizontal rail；420, horizontal base；430, horizontal air cylinder；500, silicon wafer.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It more fully understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
As shown in figs. 1-7, be direct plugging-in silicon wafer inserted sheet slice getting device in the present embodiment, the device include comb teeth component 100,
Lifting driving assembly 200, two sets middle component 300 and horizontal drive component 400.
As shown in Figure 3-4, comb teeth component 100 is parallel to each other including two groups and spaced comb teeth 110, comb teeth 110 wrap
Several carding tooth plates 111 being arranged successively are included, are equipped with interval trough 112 between adjacent fingers piece 111, the top of carding tooth plate 111 is equipped with
Holding tank 113, holding tank 113 is for clamping product.In the present embodiment, the depth of interval trough 112 is greater than holding tank
The opening of 113 depth, holding tank 113 is equipped with product lead-in chamfered 114, convenient for clamping to product.
As shown in figure 5, lifting driving assembly 200 is connect with comb teeth component 100, gone up and down for driving comb 110.Specifically
, lifting driving assembly 200 includes upright guide rail 210, lifting seat 220, lifting motor 230, and lifting seat 220 is set to upright guide rail
On 210, lifting motor 230 drives lifting seat 220 to go up and down, and 110 bottom of comb teeth is equipped with the first support frame 120, the first support frame 120
It is fixedly connected with lifting seat 220.
As shown in fig. 6-7, two the two sides that middle component 300 is respectively arranged on comb teeth component 100 are set, setting middle component 300 includes setting
Middle plate 310 sets middle 310 bottom of plate equipped with the second support frame 320, and the second support frame 320 is connect with horizontal drive component 400.?
In the present embodiment, middle plate 310 is set equipped with several product holding tanks 313 being arranged successively, sets and is symmetrically arranged on middle plate 310
Limit plate 311 and lower limiting board 312, upper limit plate 311 are worked in coordination with lower limiting board 312, for abutting with product, by product
In setting.
Horizontal drive component 400 includes horizontal rail 410, horizontal base 420, horizontal air cylinder 430, and horizontal base 420 is in level
On guide rail 410, horizontal air cylinder 430 drives 420 horizontal movement of horizontal base, and the second support frame 320 is set on horizontal base 420 and and water
Flat seat 420 is fixedly connected.
In the present embodiment, product is silicon wafer 500, and in other embodiments of the invention, which may be used also
Pick-and-place and transport for other products.
When inserted sheet, silicon wafer 500 is placed in holding tank 113, is clamped silicon wafer 500 by adjacent carding tooth plate 111, level is driven
Dynamic component 400 is started to work, and is stretched out by the telescopic rod of horizontal air cylinder 430, and driving horizontal base 420 moves, and drive is set middle plate 310 and transported
It is dynamic, silicon wafer is clamped from two sides using product holding tank 313, and continue with upper limit plate 311 and lower limiting board 312 for silicon wafer
500 clamp in juxtaposition.At this point, lifting motor 230 drives lifting seat 220 to rise, silicon wafer is placed on quartz boat, completes inserted sheet
Operation.When taking piece, silicon wafer 500 is clamped also with adjacent carding tooth plate 111, and lifting seat 220 is driven by lifting motor 230
Decline, completion take piece to operate.Inserted sheet is carried out by way of support clamping and takes piece, is reduced broken in silicon wafer transfer process
Loss rate, while improving production efficiency.
Direct plugging-in silicon wafer inserted sheet slice getting device of the invention sets middle group by setting comb teeth component, lifting driving assembly, two
Part and horizontal drive component, lifting driving assembly are gone up and down for driving comb component, and comb teeth component includes two groups and is parallel to each other simultaneously
Spaced comb teeth, comb teeth include several carding tooth plates being arranged successively, and are equipped with interval trough between adjacent fingers piece, carding tooth plate
Top is equipped with holding tank, and by holding tank for clamping to silicon wafer, lifting driving assembly is gone up and down for driving comb, realizes
Inserted sheet and take piece.
Meanwhile two set the two sides that middle component is respectively arranged on comb teeth component, setting middle component includes setting middle plate, horizontal drive component
For driving two to set middle plate respectively from two sides to intermediary movements, silicon wafer set.It realizes in the setting of silicon wafer and marshalling, is convenient for
Inserted sheet operation is carried out to it.
Above embodiments are only to absolutely prove preferred embodiment that is of the invention and being lifted, and protection scope of the present invention is not
It is limited to this.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in guarantor of the invention
Within the scope of shield.Protection scope of the present invention is subject to claims.
Claims (9)
1. a kind of direct plugging-in silicon wafer inserted sheet slice getting device, which is characterized in that set including comb teeth component, lifting driving assembly, two
Component and horizontal drive component；
The comb teeth component is parallel to each other including two groups and spaced comb teeth, the comb teeth include several combs being arranged successively
Gear piece, is equipped with interval trough between the adjacent carding tooth plate, and the top of the carding tooth plate is equipped with holding tank, the holding tank for pair
Product is clamped, and the lifting driving assembly is for driving the comb teeth to go up and down；
Described two set the two sides that middle component is respectively arranged on the comb teeth component, described to set middle component including setting middle plate, the level
During driving assembly is set for driving two to set middle plate respectively from two sides to intermediary movements, by product.
2. direct plugging-in silicon wafer inserted sheet slice getting device as described in claim 1, which is characterized in that the lifting driving assembly includes
Upright guide rail, lifting seat, lifting motor, the lifting seat are set on the upright guide rail, and the lifting motor drives the liter
Seat lifting is dropped, and the comb teeth component is set on the lifting seat.
3. direct plugging-in silicon wafer inserted sheet slice getting device as claimed in claim 2, which is characterized in that the comb teeth bottom is equipped with first
Support frame, first support frame are fixedly connected with lifting seat.
4. direct plugging-in silicon wafer inserted sheet slice getting device as described in claim 1, which is characterized in that the horizontal drive component includes
Horizontal rail, horizontal base, horizontal air cylinder, the horizontal base are set on the horizontal guide rail, and the horizontal air cylinder drives the water
Flat seat horizontal movement, it is described to set middle component on the horizontal base.
5. direct plugging-in silicon wafer inserted sheet slice getting device as claimed in claim 4, which is characterized in that described to set middle board bottom portion and be equipped with the
Two support frames, second support frame are fixedly connected with the horizontal base.
6. direct plugging-in silicon wafer inserted sheet slice getting device as described in claim 1, which is characterized in that described to set middle plate equipped with several
The product holding tank being arranged successively.
7. direct plugging-in silicon wafer inserted sheet slice getting device as described in claim 1, which is characterized in that described set is symmetrical arranged on middle plate
There are upper limit plate and lower limiting board, the upper limit plate is worked in coordination with lower limiting board.
8. direct plugging-in silicon wafer inserted sheet slice getting device as described in claim 1, which is characterized in that the opening of the holding tank is set
There is product lead-in chamfered.
9. direct plugging-in silicon wafer inserted sheet slice getting device as described in claim 1, which is characterized in that the depth of the interval trough is greater than
The depth of the holding tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811368971.6A CN109346429A (en) | 2018-11-16 | 2018-11-16 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811368971.6A CN109346429A (en) | 2018-11-16 | 2018-11-16 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109346429A true CN109346429A (en) | 2019-02-15 |
Family
ID=65315657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811368971.6A Pending CN109346429A (en) | 2018-11-16 | 2018-11-16 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
Country Status (1)
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|---|---|
| CN (1) | CN109346429A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110148576A (en) * | 2019-05-27 | 2019-08-20 | 温州源利智能科技有限公司 | A kind of mechanical clamping device for semiconductor crystal wafer transmission |
| CN110867407A (en) * | 2019-11-20 | 2020-03-06 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Method for manufacturing comb-shaped bracket of silicon wafer supporting mechanism in diffusion process basket |
| CN110900182A (en) * | 2019-11-20 | 2020-03-24 | 上海至纯洁净系统科技股份有限公司 | Modularized guide sheet device capable of being freely installed in wet process equipment |
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| CN101553420A (en) * | 2006-11-24 | 2009-10-07 | 约纳斯雷德曼自动化技术有限公司 | Method for forming a back-to-back wafer batch to be positioned in a process boot, and handling system for forming the btb wafer batch |
| CN107482082A (en) * | 2017-07-21 | 2017-12-15 | 罗博特科智能科技股份有限公司 | A kind of silicon chip jacking broach mechanism |
| CN209071294U (en) * | 2018-11-16 | 2019-07-05 | 罗博特科智能科技股份有限公司 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
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2018
- 2018-11-16 CN CN201811368971.6A patent/CN109346429A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553420A (en) * | 2006-11-24 | 2009-10-07 | 约纳斯雷德曼自动化技术有限公司 | Method for forming a back-to-back wafer batch to be positioned in a process boot, and handling system for forming the btb wafer batch |
| CN107482082A (en) * | 2017-07-21 | 2017-12-15 | 罗博特科智能科技股份有限公司 | A kind of silicon chip jacking broach mechanism |
| CN209071294U (en) * | 2018-11-16 | 2019-07-05 | 罗博特科智能科技股份有限公司 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110148576A (en) * | 2019-05-27 | 2019-08-20 | 温州源利智能科技有限公司 | A kind of mechanical clamping device for semiconductor crystal wafer transmission |
| CN110148576B (en) * | 2019-05-27 | 2020-12-29 | 义柏应用技术（深圳）有限公司 | Mechanical clamping device for semiconductor wafer transmission |
| CN110867407A (en) * | 2019-11-20 | 2020-03-06 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Method for manufacturing comb-shaped bracket of silicon wafer supporting mechanism in diffusion process basket |
| CN110900182A (en) * | 2019-11-20 | 2020-03-24 | 上海至纯洁净系统科技股份有限公司 | Modularized guide sheet device capable of being freely installed in wet process equipment |
| CN110900182B (en) * | 2019-11-20 | 2021-07-06 | 上海至纯洁净系统科技股份有限公司 | Modularized guide sheet device capable of being freely installed in wet process equipment |
| CN110867407B (en) * | 2019-11-20 | 2023-04-18 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Method for manufacturing comb-shaped bracket of silicon wafer supporting mechanism in diffusion process basket |
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