CN216648253U - Non-contact wafer carrying mechanism - Google Patents
Non-contact wafer carrying mechanism Download PDFInfo
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- CN216648253U CN216648253U CN202123272057.1U CN202123272057U CN216648253U CN 216648253 U CN216648253 U CN 216648253U CN 202123272057 U CN202123272057 U CN 202123272057U CN 216648253 U CN216648253 U CN 216648253U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a non-contact mechanism for carrying wafers, which belongs to the technical field of wafer transportation equipment and comprises a four-way moving mechanism, a linkage batch clamping device and a material pushing device, wherein the linkage batch clamping device is arranged on the four-way moving mechanism, the material pushing device is arranged on the linkage batch clamping device, the linkage batch clamping device comprises a linkage assembly and clamping assemblies, the linkage assembly is arranged above the four-way moving mechanism, the clamping assemblies are provided with a plurality of clamping assemblies, every two clamping assemblies are in one group, and each group of clamping assemblies are arranged on the linkage assembly at equal intervals; the device solves the problems that the wafers are transported in batches under the condition that the wafers are not stacked mutually, and meanwhile, the transportation cost is saved.
Description
Technical Field
The utility model relates to the technical field of wafer transportation equipment, in particular to a non-contact mechanism for carrying wafers.
Background
Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are dominated by 8 inches and 12 inches.
When wafers are transported, in order to avoid damage to the surfaces of the wafers, a non-contact type transporting method is generally adopted, that is, a semiconductor wafer is transported by a gas blowing method, and a layer of air gap is formed between the semiconductor wafer and an end effector of a manipulator, so that damage to the surfaces of the wafers by the manipulator during transportation is avoided.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a mechanism for carrying wafers in a non-contact manner, and aims to solve the technical problem that equipment for carrying the wafers in batches under the condition that the wafers are not stacked with each other and simultaneously saving carrying cost is lacked in the prior art.
The embodiment of the utility model adopts the following technical scheme: including quadriversal moving mechanism, still press from both sides in batches including the linkage and get device and blevile of push, the linkage is pressed from both sides in batches and is got the device setting on quadriversal moving mechanism, blevile of push sets up on the device is got in batches in the linkage, the linkage is pressed from both sides in batches and is got the device and include linkage subassembly and press from both sides the subassembly, the linkage subassembly sets up in quadriversal moving mechanism's top, it has a plurality of, per two to press from both sides the subassembly of getting is a set of, and the setting of subassembly equidistance is got on the linkage subassembly to every group clamp.
Further, the linkage subassembly includes mounting box, first motor, linkage spout axle, first spout and second spout, one side that the mounting box is vertical setting and mounting box is equipped with the opening, the linkage spout axle is vertical setting and the both ends of linkage spout axle rotate with the upper and lower both ends of mounting box respectively and is connected, first motor setting is connected with the one end of linkage spout axle in the output of the upper end of mounting box and first motor and the second spout, first spout and second spout have a plurality of, every first spout and a second spout are a set of, in every group first spout and second spout are symmetry and wind the setting on the linkage spout axle aslope, every group first spout and second spout set up on the linkage spout axle equidistance.
Further, every all be provided with one on first spout and the second spout and press from both sides and get the subassembly, every it all includes carriage, slide bar and the clamp board of getting of air-blowing to press from both sides the subassembly, the one end and the first spout sliding fit of slide bar, the carriage cover is established at the epaxial and other end with the slide bar of linkage slide groove and is connected, the air-blowing presss from both sides gets one side that the mounting box was kept away from at the carriage to the board setting, the both sides of carriage respectively with the inside both sides sliding fit of mounting box.
Furthermore, the pushing devices are provided with a plurality of pushing devices, every two pushing devices form a group, each group of pushing devices are symmetrically arranged on two sides of one sliding frame, each pushing device comprises an electric push rod and an air blowing pushing plate, the electric push rods are horizontally arranged at the side ends of the mounting box, and the air blowing pushing plates are arranged at the output ends of the electric push rods.
Further, still include the second motor, the second motor sets up on four-way moving mechanism, the output of second motor is connected with the bottom of mounting box.
The embodiment of the utility model adopts at least one technical scheme which can achieve the following beneficial effects:
one of them, per two clamp get the board and be a set of for pressing from both sides the air-blowing clamp in the subassembly, at first place a batch wafer in proper order and press from both sides to get between the board every group air-blowing, the work of the first motor of control drives the rotation of linkage spout axle, two air-blowing clamps in every group get the board and set up respectively on a first spout and second spout, through first spout, the cooperation of second spout and slide bar, make two carriages in every group slide toward the contralateral direction simultaneously, get the board and carry out the centre gripping to the wafer until two air-blowing clamps, thereby realize only needing the synchronous centre gripping operation of a drive to a plurality of wafers, the handling cost of wafer has been reduced by a wide margin.
And secondly, after the wafer is conveyed to the designated position, electric push rods in the two material pushing devices are controlled to work to drive the two air-blowing material pushing plates to move to the two sides of the wafer respectively, the clamping assembly is controlled to release clamping of the wafer, and meanwhile, the air-blowing material pushing plates are controlled to push the wafer to the designated area, so that the wafer is conveyed.
And thirdly, the linkage batch clamping device and the pushing device can be driven to rotate through the work of the second motor, so that the linkage batch clamping device and the pushing device are controlled to clamp or discharge wafers in different directions, a four-way moving mechanism does not need to be controlled to operate, and the carrying cost is further saved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a top view of a portion of the structure of the present invention;
FIG. 3 is a schematic perspective view of the batch gripper of the present invention;
FIG. 4 is a schematic view of a portion of the linkage assembly of the present invention;
fig. 5 is a schematic perspective view of the linked chute shaft according to the present invention.
Reference numerals
The device comprises a four-way moving mechanism 1, a linkage batch clamping device 2, a linkage assembly 21, a mounting box 211, a first motor 212, a linkage sliding groove shaft 213, a first sliding groove 214, a second sliding groove 215, a clamping assembly 22, a sliding frame 221, a sliding rod 222, an air-blowing clamping plate 223, a pushing device 3, an electric push rod 31, an air-blowing pushing plate 32 and a second motor 4.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
The embodiment of the utility model provides a non-contact wafer carrying mechanism, which comprises a four-way moving mechanism 1, and further comprises a linkage batch clamping device 2 and a pushing device 3, wherein the linkage batch clamping device 2 is arranged on the four-way moving mechanism 1, the pushing device 3 is arranged on the linkage batch clamping device 2, the linkage batch clamping device 2 comprises a linkage assembly 21 and clamping assemblies 22, the linkage assembly 21 is arranged above the four-way moving mechanism 1, the clamping assemblies 22 are provided with a plurality of clamping assemblies 22, every two clamping assemblies 22 form a group, and each group of clamping assemblies 22 is arranged on the linkage assembly 21 at equal intervals; when a wafer is transported, in order to avoid damage to the surface of the wafer, a non-contact type transporting method is usually adopted, that is, a gas blowing method is adopted to transport the semiconductor wafer, a layer of air gap is formed between the semiconductor wafer and an end effector of a manipulator, so that the surface of the wafer is prevented from being damaged by the manipulator during transportation, but when a large number of wafers are transported by a common transporting device, if a mode of stacking and transporting the wafers together is adopted, the overlapped part between the wafers is also scratched, so that a plurality of manipulators or transporting devices are required to transport the wafers in batches, the transportation cost is high, the device firstly places a plurality of wafers to be transported between a plurality of groups of clamping assemblies 22 in a linkage batch transporting device 2 on the basis of non-contact wafer transportation, and then only needs one driving part of a linkage assembly 21, the clamping assemblies 22 can be driven to simultaneously clamp the wafers, so that the effect of carrying a plurality of wafers at one time is achieved, the carrying cost is reduced, the clamped wafers are controlled to move to a designated area through the four-way moving mechanism 1, and the wafers are discharged through the material pushing device 3, the clamping assemblies 22 and the material pushing device 3 in the device are both designed in a gas blowing non-contact mode, and the clamping or material pushing operation of the wafers is guaranteed to be achieved under the condition that the wafers are not contacted; the device solves the problems that wafers are transported in batches under the condition that the wafers are not stacked mutually, and meanwhile, the transportation cost is saved.
Preferably, the linkage assembly 21 includes mounting box 211, first motor 212, linkage sliding chute axle 213, first spout 214 and second spout 215, one side that mounting box 211 is vertical setting and mounting box 211 is equipped with the opening, linkage sliding chute axle 213 is vertical setting and the both ends of linkage sliding chute axle 213 rotate with the upper and lower both ends of mounting box 211 respectively and is connected, first motor 212 sets up the output of the upper end of mounting box 211 and first motor 212 and is connected with the one end of linkage sliding chute axle 213, first spout 214 and second spout 215 have a plurality of, every first spout 214 and a second spout 215 are a set of, in every group first spout 214 and second spout 215 are symmetry and slope winding setting on linkage sliding chute axle 213, every group first spout 214 and second spout 215 equidistance set up on linkage sliding chute axle 213.
Preferably, each of the first sliding chute 214 and the second sliding chute 215 is provided with one clamping assembly 22, each clamping assembly 22 comprises a sliding frame 221, a sliding rod 222 and an air blowing clamping plate 223, one end of the sliding rod 222 is in sliding fit with the first sliding chute 214, the sliding frame 221 is sleeved on the linkage sliding chute shaft 213 and is connected with the other end of the sliding rod 222, the air blowing clamping plate 223 is arranged on one side of the sliding frame 221 away from the installation box 211, and two sides of the sliding frame 221 are in sliding fit with two sides inside the installation box 211 respectively; the air-blowing clamping plates 223 in every two clamping assemblies 22 are a group, firstly, a batch of wafers are sequentially placed between each group of air-blowing clamping plates 223, the first motor 212 is controlled to work to drive the linkage sliding groove shaft 213 to rotate, the two air-blowing clamping plates 223 in each group are respectively arranged on the first sliding groove 214 and the second sliding groove 215, and through the cooperation of the first sliding groove 214, the second sliding groove 215 and the sliding rod 222, the two sliding frames 221 in each group simultaneously slide towards the opposite side direction until the two air-blowing clamping plates 223 clamp the wafers, so that synchronous clamping operation of only one drive on a plurality of wafers is realized, and the carrying cost of the wafers is greatly reduced.
Preferably, there are a plurality of pushing devices 3, each two pushing devices 3 form a group, each group of pushing devices 3 is symmetrically arranged on two sides of one sliding frame 221, each pushing device 3 includes an electric push rod 31 and an air-blowing pushing plate 32, the electric push rod 31 is horizontally arranged at the side end of the mounting box 211, and the air-blowing pushing plate 32 is arranged at the output end of the electric push rod 31; after the wafer is sent to the designated position, the electric push rods 31 in the two pushing devices 3 are controlled to work to drive the two air-blowing pushing plates 32 to respectively move to the two sides of the wafer, the clamping assembly 22 is controlled to release the clamping of the wafer, and meanwhile, the air-blowing pushing plates 32 are controlled to push the wafer to the designated area, so that the wafer is transported.
Preferably, the device further comprises a second motor 4, the second motor 4 is arranged on the four-way moving mechanism 1, and an output end of the second motor 4 is connected with the bottom end of the mounting box 211; the linkage batch clamping device 2 and the pushing device 3 can be driven to rotate through the work of the second motor 4, so that the linkage batch clamping device is controlled to clamp or discharge wafers in different directions, the four-way moving mechanism 1 does not need to be controlled to operate, and the carrying cost is further saved.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (5)
1. The utility model provides a mechanism of non-contact transport wafer, includes quadriversal moving mechanism (1), its characterized in that still gets device (2) and blevile of push (3) including linkage batch clamp, linkage batch clamp is got device (2) and is set up on quadriversal moving mechanism (1), blevile of push (3) set up and get on device (2) in linkage batch clamp, linkage batch clamp is got device (2) and is got subassembly (22) including linkage subassembly (21) and clamp, linkage subassembly (21) set up the top in quadriversal moving mechanism (1), it has a plurality of to get subassembly (22) to press from both sides subassembly (22) and be a set of, and the equidistance setting of subassembly (22) is got to every group clamp on linkage subassembly (21).
2. The mechanism of claim 1, wherein the linkage assembly (21) comprises a mounting box (211), a first motor (212), a linkage sliding groove shaft (213), a first sliding groove (214) and a second sliding groove (215), the mounting box (211) is vertically arranged, an opening is formed in one side of the mounting box (211), the linkage sliding groove shaft (213) is vertically arranged, two ends of the linkage sliding groove shaft (213) are respectively and rotatably connected with the upper end and the lower end of the mounting box (211), the first motor (212) is arranged at the upper end of the mounting box (211), an output end of the first motor (212) is connected with one end of the linkage sliding groove shaft (213), the first sliding groove (214) and the second sliding groove (215) are provided with a plurality of grooves, each of the first sliding groove (214) and one of the second sliding grooves (215) is a group, and the first sliding groove (214) and the second sliding groove (215) in each group are symmetrically and obliquely wound around the linkage sliding groove (215) And on the shaft (213), the first sliding chute (214) and the second sliding chute (215) of each group are equidistantly arranged on the linkage sliding chute shaft (213).
3. The mechanism of claim 2, wherein each of the first sliding groove (214) and the second sliding groove (215) is provided with a clamping assembly (22), each of the clamping assemblies (22) comprises a sliding frame (221), a sliding rod (222) and an air-blowing clamping plate (223), one end of the sliding rod (222) is slidably engaged with the first sliding groove (214), the sliding frame (221) is sleeved on the linkage sliding groove shaft (213) and is connected with the other end of the sliding rod (222), the air-blowing clamping plate (223) is disposed on one side of the sliding frame (221) away from the mounting box (211), and two sides of the sliding frame (221) are slidably engaged with two sides inside the mounting box (211), respectively.
4. The mechanism for non-contact wafer handling according to claim 3, wherein there are several pushing devices (3), each two pushing devices (3) form a group, each group of pushing devices (3) is symmetrically disposed on two sides of a sliding frame (221), each pushing device (3) includes an electric push rod (31) and an air-blowing pushing plate (32), the electric push rod (31) is horizontally disposed on a side end of the mounting box (211), and the air-blowing pushing plate (32) is disposed on an output end of the electric push rod (31).
5. The mechanism for non-contact type handling of wafers as claimed in claim 2, further comprising a second motor (4), wherein the second motor (4) is disposed on the four-way moving mechanism (1), and an output end of the second motor (4) is connected with a bottom end of the mounting box (211).
Priority Applications (1)
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CN202123272057.1U CN216648253U (en) | 2021-12-23 | 2021-12-23 | Non-contact wafer carrying mechanism |
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CN202123272057.1U CN216648253U (en) | 2021-12-23 | 2021-12-23 | Non-contact wafer carrying mechanism |
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CN216648253U true CN216648253U (en) | 2022-05-31 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115547908A (en) * | 2022-11-29 | 2022-12-30 | 浙江果纳半导体技术有限公司 | Loading system |
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2021
- 2021-12-23 CN CN202123272057.1U patent/CN216648253U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115547908A (en) * | 2022-11-29 | 2022-12-30 | 浙江果纳半导体技术有限公司 | Loading system |
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