CN114883233A - Continuous feeding mechanism of insert machine - Google Patents

Continuous feeding mechanism of insert machine Download PDF

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Publication number
CN114883233A
CN114883233A CN202210456156.5A CN202210456156A CN114883233A CN 114883233 A CN114883233 A CN 114883233A CN 202210456156 A CN202210456156 A CN 202210456156A CN 114883233 A CN114883233 A CN 114883233A
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CN
China
Prior art keywords
conveying
silicon wafer
clamping
shaft
frame
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Pending
Application number
CN202210456156.5A
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Chinese (zh)
Inventor
顾韻
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Wuxi Nanya Technology Co ltd
Original Assignee
Wuxi Nanya Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Nanya Technology Co ltd filed Critical Wuxi Nanya Technology Co ltd
Priority to CN202210456156.5A priority Critical patent/CN114883233A/en
Publication of CN114883233A publication Critical patent/CN114883233A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a continuous feeding mechanism of a wafer inserting machine, which comprises a frame, wherein a silicon wafer conveying line and a supporting and dragging platform are arranged in the frame, a silicon wafer feeding clamping mechanism is arranged above the silicon wafer conveying line, a silicon wafer feeding righting mechanism is arranged on one side of the silicon wafer feeding clamping mechanism, and water knives are arranged on two sides of the silicon wafer feeding righting mechanism; one end of the bearing and dragging platform is tightly attached to the end part of the silicon wafer conveying line, and the other end of the bearing and dragging platform is provided with a silicon wafer baffle; the silicon chip conveying line comprises a conveying motor and a conveying frame, the two ends of the conveying frame are horizontally rotated and provided with a driving conveying shaft and a driven conveying shaft, the driving conveying shaft and the driven conveying shaft are connected through a conveying belt, and the conveying motor drives the driving conveying shaft. The invention has simple structure and small occupied space; safety, environmental protection, structure: simple and reliable. The maintenance cost of the later equipment structure is low; the unmanned production can be truly achieved by matching with a truss or a six-shaft mechanical arm, and the intelligent manufacturing degree is high. And reduces the labor cost.

Description

Continuous feeding mechanism of insert machine
Technical Field
The invention belongs to the technical field of new energy solar photovoltaics, and relates to a continuous feeding mechanism of a sheet inserting machine.
Background
In a modern photovoltaic solar silicon wafer production line, a special machine device, namely a full-automatic silicon wafer inserting machine, is used. Due to the process requirements of the existing silicon wafers, in the production process, the silicon wafers are manually taken out of the degumming machine to be sorted and then put into a material box of a film inserting machine to be inserted, and the existing process equipment does not realize full-automatic feeding. At present, the manual feeding beat is slow, the personnel and purchase costs are high, and the fault tolerance rate is low.
Disclosure of Invention
The invention aims to provide a continuous feeding mechanism of a wafer inserting machine, which can effectively overcome the defects and the defects of slow feeding beat, high labor cost and purchasing cost, low fault tolerance rate and the like of the conventional solar silicon wafer inserting machine.
According to the technical scheme provided by the invention: a continuous feeding mechanism of a wafer inserting machine comprises a frame, wherein a silicon wafer conveying line and a supporting platform are installed in the frame, a silicon wafer feeding clamping mechanism is arranged above the silicon wafer conveying line, a silicon wafer feeding righting mechanism is arranged on one side of the silicon wafer feeding clamping mechanism, and water knives are installed on two sides of the silicon wafer feeding righting mechanism; one end of the bearing and dragging platform is tightly attached to the end part of the silicon wafer conveying line, and the other end of the bearing and dragging platform is provided with a silicon wafer baffle.
As a further improvement of the silicon wafer conveying line, the silicon wafer conveying line comprises a conveying motor and a conveying frame, a driving conveying shaft and a driven conveying shaft are horizontally and rotatably arranged at two ends of the conveying frame, the driving conveying shaft and the driven conveying shaft are connected through a conveying belt, and the conveying motor drives the driving conveying shaft.
As a further improvement of the invention, the output shaft of the conveying motor is provided with a driving wheel and is connected with the driving conveying shaft through a conveying transmission belt.
As a further improvement of the invention, the number of the conveying belts is 2, the conveying belts are arranged in parallel, and conveying gaps are reserved among the conveying belts.
As a further improvement of the invention, the silicon wafer feeding clamping mechanisms are symmetrically arranged and positioned at two sides of the silicon wafer conveying line; the silicon wafer feeding and clamping mechanism comprises a clamping cylinder, a cylinder body of the clamping cylinder is fixedly arranged on a frame, a piston end of the clamping cylinder is fixedly connected with the clamping frame, two ends of the clamping frame are vertically and rotatably provided with a driving clamping shaft and a driven clamping shaft respectively, the driving clamping shaft and the driven clamping shaft are connected through a clamping conveyer belt, and the driving clamping shaft is driven by a clamping and conveying motor.
As a further improvement of the invention, linear bearing fixing plates are arranged on two sides of the clamping cylinder in parallel, a linear bearing with a seat is arranged at the bottom of each linear bearing fixing plate, the upper part of the clamping slide rail is arranged in each linear bearing with a seat in a sliding mode, the lower part of the clamping slide rail is fixedly connected with a clamping frame through a frame connecting plate, and the piston end of the cylinder is connected with the end part of the clamping slide rail through a slide rail connecting plate.
As a further improvement of the invention, a limit block is arranged on one side of the clamping slide rail; the limiting block is arranged on the moving end of the hydraulic buffer; the fixed end of the hydraulic buffer is arranged on the side surface of the linear bearing with the seat.
As a further improvement of the invention, the silicon wafer feeding and righting mechanisms are symmetrically arranged and are positioned at two sides of the silicon wafer conveying line; the silicon wafer feeding and centering mechanism comprises a centering conveying motor and a centering frame, wherein a driving centering shaft and a driven centering shaft are vertically and rotatably mounted at two ends of the centering frame respectively, the driving centering shaft and the driven centering shaft are connected through a centering conveying belt, and the driving centering shaft is driven by the centering conveying motor.
The positive progress effect of this application lies in:
1. the invention has simple structure and small occupied space; safety, environmental protection, structure: simple and reliable. The maintenance cost of the later equipment structure is low; and the unmanned production can be truly achieved by matching with a truss or a six-axis manipulator, and the intelligent manufacturing degree is high. And reduces the labor cost.
2. The invention cancels the existing silicon chip material box, saves the time for workers to load the silicon chip into the material box, greatly improves the production efficiency and reduces the production purchase cost.
3. The invention has no material box, and the continuous feeding has no time for waiting for placing the silicon material box, thereby greatly improving the production beat.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a front elevation view of the silicon wafer transfer line of the present invention.
FIG. 3 is a top view of the silicon wafer transfer line of the present invention.
FIG. 4 is a schematic structural diagram of a silicon wafer loading and clamping mechanism according to the present invention.
FIG. 5 is a schematic structural diagram of a silicon wafer loading and centering mechanism according to the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the invention herein. Furthermore, "including" and "having," and like terms, mean that "including" and "having," in addition to those already recited in "including" and "having," other content not already recited in the list; for example, a process, method, system, article, or apparatus that may comprise a list of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not explicitly listed or inherent to such process, method, article, or apparatus.
In the figure 1-5, the silicon wafer feeding device comprises a frame 1, a silicon wafer conveying line 2, a conveying motor 2-1, a conveying frame 2-2, a driving conveying shaft 2-3, a driven conveying shaft 2-4, a conveying belt 2-5, a conveying gap 2-6, a silicon wafer feeding clamping mechanism 3, a clamping cylinder 3-1, a clamping frame 3-2, a driving clamping shaft 3-3, a driven clamping shaft 3-4, a clamping conveying motor 3-5, a linear bearing fixing plate 3-6, a linear bearing with a seat 3-7, a clamping slide rail 3-8, a frame connecting plate 3-9, a slide rail connecting plate 3-10, a limiting block 3-11, a hydraulic buffer 3-12, a cylinder mounting plate 3-13, a universal joint 3-14, a silicon wafer feeding righting mechanism 4, a righting conveying motor 4-1, a silicon wafer feeding righting mechanism 4-14, a silicon wafer feeding clamping mechanism 3-3, a clamping slide rail 3-3, a driving clamping shaft 3-4, a linear bearing fixing plate 3-6, a linear bearing fixing plate 3-7, a linear bearing, a clamping slide rail connecting plate 3-8, a clamping slide rail connecting plate, a hydraulic buffer 3-9, a silicon wafer feeding device, a silicon wafer feeding device, a silicon wafer feeding device, a silicon wafer, a, A righting frame 4-2, a driving righting shaft 4-3, a driven righting shaft 4-4, a righting conveyer belt 4-5, a water jet cutter 5, a bearing and dragging platform 6 and the like.
As shown in figure 1, the invention is a continuous feeding mechanism of a sheet inserting machine, which comprises a frame 1, wherein a silicon wafer conveying line 2 and a supporting platform 6 are arranged in the frame 1, a silicon wafer feeding clamping mechanism 3 is arranged above the silicon wafer conveying line 2, a silicon wafer feeding righting mechanism 4 is arranged on one side of the silicon wafer feeding clamping mechanism 3, and water knives 5 are arranged on two sides of the silicon wafer feeding righting mechanism 4; one end of the supporting and dragging platform 6 is tightly attached to the end part of the silicon wafer conveying line 2, and a silicon wafer baffle is installed at the other end of the supporting and dragging platform.
As shown in fig. 2-3, the silicon wafer conveying line 2 comprises a conveying motor 2-1 and a conveying frame 2-2, wherein a driving conveying shaft 2-3 and a driven conveying shaft 2-4 are horizontally and rotatably arranged at two ends of the conveying frame 2-2, the driving conveying shaft 2-3 and the driven conveying shaft 2-4 are connected through a conveying belt 2-5, and an output shaft of the conveying motor 2-1 is provided with a driving wheel and is connected with the driving conveying shaft 2-3 through a conveying driving belt.
The number of the conveying belts 2-5 is 2, the conveying belts are arranged in parallel, and conveying gaps 2-6 are reserved among the 2-5 conveying belts.
The conveying motor 2-1 is fixed on the frame 1 through a motor mounting seat. The conveying motor 2-1 is positioned above the conveying frame 2-2.
As shown in fig. 4, the silicon wafer feeding clamping mechanisms 3 are symmetrically arranged and located at two sides of the silicon wafer conveying line 2. The silicon wafer feeding and clamping mechanism 3 comprises a clamping cylinder 3-1, a cylinder body of the clamping cylinder 3-1 is fixedly arranged on a frame 1, a piston end of the clamping cylinder 3-1 is fixedly connected with a clamping frame 3-2, two ends of the clamping frame 3-2 are respectively and vertically and rotatably provided with a driving clamping shaft 3-3 and a driven clamping shaft 3-4, the driving clamping shaft 3-3 and the driven clamping shaft 3-4 are connected through a clamping conveyer belt, and the driving clamping shaft 3-3 is driven by a clamping conveyer motor 3-5.
In order to enhance the connection strength between the piston end of the clamping cylinder 3-1 and the clamping frame 3-2, linear bearing fixing plates 3-6 are arranged on two sides of the clamping cylinder 3-1 in parallel, a linear bearing with a seat 3-7 is mounted at the bottom of the linear bearing fixing plate 3-6, the upper part of a clamping slide rail 3-8 is slidably mounted in the linear bearing with a seat 3-7, the lower part of the clamping slide rail 3-8 is fixedly connected with the clamping frame 3-2 through a frame connecting plate 3-9, and the piston end of the cylinder 3-1 is connected with the end part of the clamping slide rail 3-8 through a slide rail connecting plate 3-10.
In order to prevent the clamping slide rail 3-8 from sliding out of the linear bearing with the seat 3-7, a limiting block 3-11 is arranged on one side of the clamping slide rail 3-8. The limiting blocks 3-11 are arranged on the moving ends of the hydraulic buffers 3-12. The fixed end of the hydraulic buffer 3-12 is arranged on the side surface of the linear bearing 3-7 with a seat.
The linear bearing fixing plates 3-6 are hung in the frame 1. The clamping cylinder 3-1 is mounted in the frame 1 by means of a cylinder mounting plate 3-13.
The clamping conveying motor 3-5 is arranged on the clamping frame 3-2, and an output shaft of the clamping conveying motor 3-5 drives the active clamping shaft 3-3 through a universal joint 3-14.
As shown in fig. 5, the silicon wafer feeding and centering mechanisms 4 are symmetrically arranged and located at two sides of the silicon wafer conveying line 2. The silicon wafer feeding and centering mechanism 4 comprises a centering conveying motor 4-1 and a centering frame 4-2, a shell of the centering conveying motor 4-1 and the lower part of the centering frame 4-2 are fixedly arranged on the frame 1, a driving centering shaft 4-3 and a driven centering shaft 4-4 are respectively and vertically and rotatably arranged at two ends of the centering frame 4-2, the driving centering shaft 4-3 and the driven centering shaft 4-4 are connected through a centering conveying belt 4-5, and the driving centering shaft 4-3 is driven by the centering conveying motor 4-1.
An output shaft of the centralizing conveying motor 4-1 drives the active centralizing shaft 4-3 through a second universal joint 4-6 and a transmission belt.
The centralizing conveying motor 4-1 is positioned above the centralizing frame 4-2.
In order to enhance the connection of the driving conveying shaft 2-3 and the driven conveying shaft 2-4 with the conveying belt 2-5, the driving clamping shaft 3-3 and the driven clamping shaft 3-4 are connected with the clamping conveying belt, the driving righting shaft 4-3 and the driven righting shaft 4-4 are connected with the righting conveying belt 4-5, and a synchronous belt wheel is sleeved outside the driving conveying shaft 2-3, the driven conveying shaft 2-4, the driving clamping shaft 3-3, the driven clamping shaft 3-4, the driving righting shaft 4-3 and the driven righting shaft 4-4.
One end of the supporting platform 6 extends into the conveying frame 2-2, the conveying gap 2-6 and the conveying surface of the conveying belt 2-5.
The working process of the invention is as follows:
firstly, putting a finished stack (800 plus materials) of silicon wafers into a stopped silicon wafer conveying line 2 through a robot 7, extending out a clamping cylinder 3-1 to drive a clamping conveying belt to approach from two sides to the middle, clamping and aligning the silicon wafers, starting a conveying motor 2-1 and a clamping conveying motor 3-5, driving the silicon wafers to advance by the clamping conveying belt and the conveying belt 2-5, starting the centering conveying motor 4-1 when the silicon wafers enter a silicon wafer feeding and centering mechanism 4, driving the silicon wafers to advance by the centering conveying belt 4-5 and the conveying belt 2-5 until the silicon wafers are moved to a bearing and dragging platform 6 from the conveying belt 2-5, instantly separating the silicon wafers by water flow blown out by a water knife 5, and conveying the separated silicon wafers into a line body insert sheet by a vacuum negative pressure adsorption system.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (8)

1. A continuous feeding mechanism of a wafer inserting machine is characterized by comprising a frame (1), wherein a silicon wafer conveying line (2) and a supporting platform (6) are installed in the frame (1), a silicon wafer feeding clamping mechanism (3) is arranged above the silicon wafer conveying line (2), a silicon wafer feeding righting mechanism (4) is arranged on one side of the silicon wafer feeding clamping mechanism (3), and water knives (5) are installed on two sides of the silicon wafer feeding righting mechanism (4); one end of the supporting platform (6) is tightly attached to the end part of the silicon wafer conveying line (2), and the other end of the supporting platform is provided with a silicon wafer baffle.
2. The continuous feeding mechanism of the insert machine as claimed in claim 1, wherein the silicon wafer conveying line (2) comprises a conveying motor (2-1) and a conveying frame (2-2), a driving conveying shaft (2-3) and a driven conveying shaft (2-4) are horizontally and rotatably arranged at two ends of the conveying frame (2-2), the driving conveying shaft (2-3) and the driven conveying shaft (2-4) are connected through a conveying belt (2-5), and the conveying motor (2-1) drives the driving conveying shaft (2-3).
3. The continuous feeder mechanism of claim 2, wherein the output shaft of the transport motor (2-1) is mounted to the drive wheel and is connected to the drive transport shaft (2-3) by a transport belt.
4. The continuous feeding mechanism of the sheet inserting machine as claimed in claim 1, wherein the number of the conveying belts (2-5) is 2, the conveying belts are arranged in parallel, and conveying gaps (2-6) are reserved among the (2) conveying belts (2-5).
5. The continuous feeding mechanism of the wafer inserting machine as claimed in claim 1, characterized in that the silicon wafer feeding clamping mechanisms (3) are symmetrically arranged and are positioned at two sides of the silicon wafer conveying line (2); the silicon wafer feeding clamping mechanism (3) comprises a clamping cylinder (3-1), a cylinder body of the clamping cylinder (3-1) is fixedly installed on a frame (1), a piston end of the clamping cylinder (3-1) is fixedly connected with a clamping frame (3-2), two ends of the clamping frame (3-2) are respectively and vertically rotatably provided with a driving clamping shaft (3-3) and a driven clamping shaft (3-4), the driving clamping shaft (3-3) and the driven clamping shaft (3-4) are connected through a clamping conveying belt, and the driving clamping shaft (3-3) is driven by a clamping conveying motor (3-5).
6. The continuous feeding mechanism of the insert machine as claimed in claim 5, characterized in that linear bearing fixing plates (3-6) are arranged in parallel at two sides of the clamping cylinder (3-1), a linear bearing with a seat (3-7) is installed at the bottom of the linear bearing fixing plate (3-6), the upper part of the clamping slide rail (3-8) is installed in the linear bearing with a seat (3-7) in a sliding manner, the lower part of the clamping slide rail (3-8) is fixedly connected with the clamping frame (3-2) through a frame connecting plate (3-9), and the piston end of the cylinder (3-1) is connected with the end part of the clamping slide rail (3-8) through a slide rail connecting plate (3-10).
7. The continuous feeding mechanism of the insert machine as claimed in claim 6, characterized in that one side of the clamping slide rail (3-8) is provided with a limit block (3-11); the limiting blocks (3-11) are arranged on the moving ends of the hydraulic buffers (3-12); the fixed end of the hydraulic buffer (3-12) is arranged on the side surface of the linear bearing (3-7) with the seat.
8. The continuous feeding mechanism of the wafer inserting machine as claimed in claim 1, wherein the silicon wafer feeding and centering mechanisms (4) are symmetrically arranged and are positioned at two sides of the silicon wafer conveying line (2); the silicon wafer feeding and centering mechanism (4) comprises a centering conveying motor (4-1) and a centering frame (4-2), a driving centering shaft (4-3) and a driven centering shaft (4-4) are vertically and rotatably mounted at two ends of the centering frame (4-2) respectively, the driving centering shaft (4-3) and the driven centering shaft (4-4) are connected through a centering conveying belt (4-5), and the driving centering shaft (4-3) is driven by the centering conveying motor (4-1).
CN202210456156.5A 2022-04-28 2022-04-28 Continuous feeding mechanism of insert machine Pending CN114883233A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210456156.5A CN114883233A (en) 2022-04-28 2022-04-28 Continuous feeding mechanism of insert machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210456156.5A CN114883233A (en) 2022-04-28 2022-04-28 Continuous feeding mechanism of insert machine

Publications (1)

Publication Number Publication Date
CN114883233A true CN114883233A (en) 2022-08-09

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ID=82672434

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210456156.5A Pending CN114883233A (en) 2022-04-28 2022-04-28 Continuous feeding mechanism of insert machine

Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024087773A1 (en) * 2022-10-27 2024-05-02 Tcl Zhonghuan Renewable Energy Technology Co., Ltd. Three-side conveyor equipment for silicon wafers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024087773A1 (en) * 2022-10-27 2024-05-02 Tcl Zhonghuan Renewable Energy Technology Co., Ltd. Three-side conveyor equipment for silicon wafers

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