CN217847902U - Slicing output device of monocrystalline silicon wafer degumming equipment - Google Patents
Slicing output device of monocrystalline silicon wafer degumming equipment Download PDFInfo
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- CN217847902U CN217847902U CN202221114104.1U CN202221114104U CN217847902U CN 217847902 U CN217847902 U CN 217847902U CN 202221114104 U CN202221114104 U CN 202221114104U CN 217847902 U CN217847902 U CN 217847902U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The utility model discloses a burst output device of monocrystalline silicon piece equipment that comes unstuck, include: the box body is provided with slide rails symmetrically arranged on two sides of the bottom of the box body; the driving mechanism is arranged on one side of the top surface of the box body; the lifting mechanism is arranged in the box body; the roller line is arranged on the top surface of the box body; and the grabbing mechanism is arranged on one side of the box body and used for grabbing the silicon wafers lifted by the lifting mechanism and placing the silicon wafers on the roller line. The utility model discloses a burst output device can be automatically with the silicon chip of expecting in the frame output one by one, the effectual intensity of labour who has reduced the workman, output efficiency is high.
Description
Technical Field
The utility model relates to a monocrystalline silicon piece technical field that comes unstuck especially relates to a monocrystalline silicon piece equipment that comes unstuck burst output device.
Background
In the production process of the monocrystalline silicon wafer, the semiconductor wafer is bonded on the material seat, then the monocrystalline silicon wafer is cut into the silicon wafer by cutting equipment, the silicon wafer and the material seat are arranged in the material frame together, heating and degumming treatment are carried out along with the material frame, and the silicon wafer is taken off from the material seat. After the silicon wafer is degummed, the silicon wafer needs to be taken out and put into a material basket, so that the subsequent automatic processing is facilitated. The silicon chips in the material frame are manually taken out, so that the efficiency is low, and the labor intensity of workers is high.
SUMMERY OF THE UTILITY MODEL
In view of the above defects or shortcomings in the prior art, it is desirable to provide a slicing output device for a single crystal silicon wafer degumming device, which can automatically output silicon wafers in a material frame one by one, effectively reduce the labor intensity of workers, and have high output efficiency.
The utility model provides a pair of burst output device of monocrystalline silicon piece equipment that comes unstuck for to accomplish the burst output of the back splendid attire in the silicon chip of expecting the frame that comes unstuck, the area has been seted up to the one end of material frame and has been less than the window of silicon chip, burst output device includes:
the top surface of the box body is open, the box body is provided with a first end and a second end which are opposite, the direction from the first end to the second end is a first direction, and sliding rails are symmetrically arranged at the bottom in the box body and positioned at two sides of the first direction;
the driving mechanism is arranged on one side of the top surface of the box body and is used for driving the material frame to move along a first direction;
the lifting mechanism is arranged in the box body, is positioned between the first end and the second end and is used for penetrating through the window to lift the silicon wafers one by one;
the roller line is arranged on the top surface of the box body, is positioned on one side of the lifting mechanism, which is far away from the first end, and is used for conveying and outputting the silicon wafers;
and the grabbing mechanism is arranged on one side of the box body and used for grabbing the silicon wafer lifted by the lifting mechanism and placing the silicon wafer on the roller line.
Further, the driving mechanism includes:
the linear motor is fixedly arranged on one side of the top surface of the box body in parallel to the first direction;
the sliding plate is arranged on the top surface of the linear motor, and the linear motor drives the sliding plate to move along a first direction;
the transmission frame is arranged in the box body and close to the first end, one end of the transmission frame is fixedly connected with the top surface of the sliding plate, and the other end of the transmission frame extends to the bottom of the box body and is positioned between the two sliding rails;
and the hook is fixedly connected to one side, close to the second end, of the bottom end of the transmission frame.
Further, snatch the mechanism including set up in the six arms of box one side, the end connection of six arms has the mounting panel, install vacuum chuck on the mounting panel.
Further, the lifting mechanism includes:
the first mounting frame is fixedly arranged in the box body and is positioned on the moving track of the window, and the area of the first mounting frame is smaller than that of the window;
the transmission rollers are symmetrically arranged on two sides of the first mounting frame through shaft levers, a plurality of belt grooves are uniformly distributed on the transmission rollers, a transmission belt is sleeved between the adjacent transmission rollers on the same side, and the transmission belt protrudes out of one side, close to the first end, of the first mounting frame;
the driving motor is in transmission connection with the transmission rollers through a transmission assembly and is used for driving the transmission rollers to synchronously rotate;
many installation poles, parallel fixed set up in the box, be located in the vertical face of first mounting bracket top, lie in on the installation pole the top of first mounting bracket is rotated and is cup jointed the backing roll.
Further, a first drying mechanism is arranged on one side of the material frame in the box body; the first drying mechanism comprises a second mounting frame fixedly arranged in the box body, and electric heating pipes are uniformly arranged on the second mounting frame.
Further, a second drying mechanism is arranged on the roller line; the second drying mechanism comprises a packaging box arranged on the roller line, a conveying channel for the silicon wafers to pass through is arranged on the packaging box along the first direction, and air knives are symmetrically arranged on the upper side and the lower side of the roller line in the packaging box.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) The utility model discloses a burst output device is provided with actuating mechanism, hoist mechanism, cylinder line and snatchs the mechanism. When the silicon wafer is output, the driving mechanism drives the material frame to move towards the lifting mechanism along the sliding rail, along with the movement of the material frame, the lifting mechanism penetrates through the window and extends into the material frame, the silicon wafer is attached to the lifting mechanism, the lifting mechanism drives the silicon wafer to move upwards, then the grabbing mechanism grabs and places the silicon wafer on a roller line, and the silicon wafer is output through the roller line. After the first silicon wafer is taken away by the grabbing mechanism, the driving mechanism drives the material frame to continue moving, so that the second silicon wafer is attached to the lifting mechanism to be lifted and output, and the silicon wafers in the material frame are output one by one. The silicon wafers in the material frame are automatically output one by one, the labor intensity of workers is effectively reduced, and the output efficiency is high.
(2) The utility model discloses a burst output device still is provided with first stoving mechanism and second stoving mechanism. In the process that the material frame moves to the lifting mechanism, drying the silicon wafers in the material frame through the first drying mechanism, and drying water remained after the silicon wafers are degummed; when the silicon wafers are transmitted on the roller line, the silicon wafers pass through the second drying mechanism to be dried one by one, so that the drying effect of the silicon wafers is ensured. And the subsequent processing treatment is prevented from being influenced.
It should be understood that what is described in this summary section is not intended to limit key or critical features of embodiments of the invention, nor is it intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:
FIG. 1 is a schematic structural view of a material frame;
FIG. 2 is a schematic diagram of a slicing output device;
FIG. 3 is a schematic structural view of the internal structure of the case;
FIG. 4 is a schematic structural view of a driving mechanism;
FIG. 5 is a schematic view of the lifting mechanism (drive belt not shown);
fig. 6 is a schematic structural view of the grasping mechanism.
The reference numbers in the figures: 1. material frame; 2. a silicon wafer; 3. a box body; 4. a drive mechanism; 5. a lifting mechanism; 6. a roller line; 7. a grabbing mechanism; 8. a first drying mechanism; 9. a second drying mechanism;
11. a window;
31. a first end; 32. a second end; 33. a slide rail;
41. a linear motor; 42. a sliding plate; 43. a transmission frame; 44. hooking;
51. a first mounting bracket; 52. a driving roller; 53. a drive motor; 54. a transmission assembly; 55. mounting a rod; 56. a support roll;
71. a six-axis mechanical arm; 72. mounting a plate; 73. a vacuum chuck;
81. a second mounting bracket; 82. an electric heating tube;
91. packaging the box; 92. a delivery channel; 93. and (4) an air knife.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Referring to fig. 1 to 6, an embodiment of the present invention provides a slicing output device of a single crystal silicon wafer degumming device, for completing slicing output of a silicon wafer 2 contained in a material frame 1 after degumming, wherein a window 11 having an area smaller than that of the silicon wafer 2 is disposed at one end of the material frame 1, and the slicing output device includes:
the top surface of the box body 3 is open, the box body 3 is provided with a first end 31 and a second end 32 which are opposite, the direction from the first end 31 to the second end 32 is a first direction, and slide rails 33 are symmetrically arranged at two sides of the bottom in the box body 3 in the first direction;
the driving mechanism 4 is arranged on one side of the top surface of the box body 3 and is used for driving the material frame 1 to move along the first direction;
the lifting mechanism 5 is arranged in the box body 3, is positioned between the first end 31 and the second end 32, and is used for penetrating through the window 11 to lift the silicon wafers 2 one by one;
the roller line 6 is arranged on the top surface of the box body 3, is positioned on one side of the lifting mechanism 5 away from the first end 31, and is used for conveying and outputting the silicon wafers 2;
and the grabbing mechanism 7 is arranged on one side of the box body 3 and is used for grabbing the silicon wafer lifted by the lifting mechanism 5 and placing the silicon wafer on the roller line 6.
In this embodiment, when the silicon wafer 2 is degummed in the automatic degumming device, the silicon wafer is placed in the material frame 1, so as to facilitate the transportation and transfer of the silicon wafer 2 among various processes in the degumming process. The silicon chip 2 is filled in the material frame 1 after the degumming treatment is finished. When the silicon wafer 2 is output, the material frame 1 containing the silicon wafer 2 is placed into the box body 3 through the mechanical arm and is in transmission connection with the driving mechanism 4. Then, the driving mechanism 4 drives the material frame 1 to move towards the lifting mechanism 5 along the sliding rail 33, along with the movement of the material frame 1, the lifting mechanism 5 penetrates through the window 11 and extends into the material frame 1, the silicon wafer closest to the lifting mechanism 5 in the material frame 1 is firstly attached to the lifting mechanism 5, and the lifting mechanism 5 drives the silicon wafer 2 to move upwards and lift the silicon wafer, so that most of the silicon wafer is higher than the material frame. The silicon wafer 2 is then gripped and placed on the roller line 6 by the gripping mechanism 7, and is discharged through the roller line 6.
When the grabbing mechanism 7 transports the silicon wafer 2, the driving mechanism 4 drives the material frame 1 to move continuously, so that the second silicon wafer 2 is attached to the lifting mechanism 5. After the grabbing mechanism 7 is reset, the lifting mechanism 5 lifts the second silicon wafer 2 for the grabbing mechanism 7 to grab and transfer. Thus, all the silicon wafers 2 in the material frame 1 are output one by one. The silicon wafers 2 in the material frame 1 are automatically output one by one, the labor intensity of workers is effectively reduced, and the output efficiency is high.
In a preferred embodiment, as shown in fig. 3 and 4, the drive mechanism 4 comprises:
a linear motor 41 fixedly disposed on one side of the top surface of the case 3 in parallel to the first direction;
a sliding plate 42 disposed on the top surface of the linear motor 41, the linear motor 41 driving the sliding plate 42 to move in a first direction;
the transmission frame 43 is arranged in the box body 3 and close to the first end 31, one end of the transmission frame 43 is fixedly connected with the top surface of the sliding plate 42, and the other end of the transmission frame 43 extends to the bottom of the box body 3 and is positioned between the two sliding rails 33;
and the hook 44 is fixedly connected to one side of the bottom end of the transmission frame 43 close to the second end 32.
In this embodiment, when the material frame 1 is placed in the box body 3, the material frame 1 falls on the two slide rails 33, the bottom of one end of the material frame is clamped in the groove of the hook 44, and the window 11 is opened at the other end. The linear motor 41 drives the sliding plate 42 to move, so that the material frame 1 is driven by the transmission frame 43 and the hook 44 to move along the sliding rail 33 to the lifting mechanism 5. The outer side of the sliding rail 33 is provided with a baffle plate, which limits the moving track of the material frame 1 and ensures that the lifting mechanism 5 accurately passes through the window 11 and enters the material frame 1. Providing a basis for the slicing output of the silicon wafer 2.
After the silicon wafer 2 is completely output, the hook 44 drives the material frame 1 to move to the first end 31 for resetting, the empty material frame 1 is taken away through the manipulator, the next full material frame 1 is waited to be driven again, and the continuity is good.
In a preferred embodiment, as shown in fig. 2 and 6, the gripping mechanism 7 comprises a six-axis robot arm 71 disposed at one side of the box 3, a mounting plate 72 is connected to an end of the six-axis robot arm 71, and a vacuum chuck 73 is mounted on the mounting plate 72.
In this embodiment, the six-axis robot arm 71 can flexibly adjust the direction and angle of the vacuum chuck 73, so as to ensure that the vertical silicon wafer 2 can be accurately picked up and then placed on the roller line 6. The silicon wafer 2 is effectively prevented from being damaged by grabbing the silicon wafer 2 by the vacuum chuck 73.
In a preferred embodiment, as shown in fig. 3 and 5, the lifting mechanism 5 comprises:
the first mounting rack 51 is fixedly arranged in the box body 3 and is positioned on the moving track of the window 11, and the area of the first mounting rack 51 is smaller than that of the window 11;
the plurality of driving rollers 52 are symmetrically arranged on two sides of the first mounting frame 51 through shaft levers, a plurality of belt grooves are uniformly distributed on the driving rollers 52, a driving belt is sleeved between the adjacent driving rollers 52 on the same side, and the driving belt protrudes out of one side, close to the first end 31, of the first mounting frame 51;
the driving motor 53 is in transmission connection with the driving rollers 52 through a transmission assembly 54 and is used for driving the driving rollers 52 to rotate synchronously;
and the mounting rods 55 are fixedly arranged in the box body 3 in parallel and are positioned in a vertical plane above the first mounting rack 51, and supporting rollers 56 are rotatably sleeved above the first mounting rack 51 on the mounting rods 55.
In this embodiment, the first mounting bracket 51 is supported by a structure that does not interfere with the projection of the material frame 1 through the window 11. If the bottom end of the first mounting rack 51 is supported by a supporting column, an opening is formed below the matched window 11 for the supporting column to pass through; or the back of the first mounting bracket 51 is supported by a cross member.
After the first mounting frame 51 extends into the material frame 1, the silicon wafer 2 at the foremost end in the material frame 1 is closely attached to the transmission belt, and under the driving action of the driving motor 53, the transmission belt drives the silicon wafer 2 at the foremost end to ascend for the vacuum chuck 73 to adsorb and grab. When the vacuum chuck 73 grabs the silicon wafer 2, the supporting roller 56 plays a supporting role on the back surface of the silicon wafer 2, and ensures smooth adsorption of the vacuum chuck 73.
The transmission assembly 54 is formed by conventional transmission assemblies such as a transmission shaft, a transmission wheel, a synchronous belt and the like, as shown in fig. 5. The installation avoids the moving track of the material frame 1, and the purpose of driving the driving roller 52 to rotate is achieved under the condition that the movement of the material frame 1 is not influenced.
In a preferred embodiment, as shown in fig. 3, a first drying mechanism 8 is disposed at one side of the material frame 1 in the box body 3; the first drying mechanism 8 comprises a second mounting rack 81 fixedly arranged in the box body 1, and electric heating pipes 82 are uniformly arranged on the second mounting rack 81. In the process that the material frame 1 moves towards the lifting mechanism 5, the silicon wafers 2 in the material frame 1 are dried through the electric heating pipe 82, and residual water after the silicon wafers 2 are degummed is dried, so that subsequent processing is prevented from being influenced.
In a preferred embodiment, as shown in fig. 2 and 3, the drum line 6 is provided with a second drying mechanism 9; the second drying mechanism 9 comprises a packaging box 91 arranged on the roller line 6, a conveying channel 92 for the silicon wafer 2 to pass through is arranged on the packaging box 91 along the first direction, and air knives 93 are symmetrically arranged on the upper side and the lower side of the roller line 6 in the packaging box 91.
In this embodiment, when the silicon wafers 2 are transported on the roller line 6 and pass through the transportation channel 92, the air knife 93 dries the silicon wafers 2 one by one, thereby improving the drying effect of the silicon wafers. Two air knives 93 of longitudinal symmetry are a set, for further improving the stoving effect, can increase the setting group number of air knives 93 according to the demand.
In the description of the present specification, the terms "connect", "mount", "fix", and the like are to be understood broadly, for example, "connect" may be a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as the case may be.
In the description of the present application, the description of the terms "one embodiment," "some embodiments," etc. means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (6)
1. A slicing output device of a single crystal silicon wafer degumming device is used for outputting the sliced silicon wafers which are contained in a material frame after degumming, wherein one end of the material frame is provided with a window with the area smaller than that of the silicon wafers, and the slicing output device is characterized by comprising:
the top surface of the box body is open, the box body is provided with a first end and a second end which are opposite, the direction from the first end to the second end is a first direction, and sliding rails are symmetrically arranged on the bottom in the box body and positioned on two sides of the first direction;
the driving mechanism is arranged on one side of the top surface of the box body and is used for driving the material frame to move along a first direction;
the lifting mechanism is arranged in the box body, is positioned between the first end and the second end and is used for penetrating through the window to lift the silicon wafers one by one;
the roller line is arranged on the top surface of the box body, is positioned on one side of the lifting mechanism, which is far away from the first end, and is used for conveying and outputting the silicon wafers;
and the grabbing mechanism is arranged on one side of the box body and used for grabbing the silicon wafer lifted by the lifting mechanism and placing the silicon wafer on the roller line.
2. The slicing output device of the single crystal silicon wafer degumming equipment according to claim 1, wherein the driving mechanism comprises:
the linear motor is parallel to the first direction and is fixedly arranged on one side of the top surface of the box body;
the sliding plate is arranged on the top surface of the linear motor, and the linear motor drives the sliding plate to move along a first direction;
the transmission frame is arranged in the box body and close to the first end, one end of the transmission frame is fixedly connected with the top surface of the sliding plate, and the other end of the transmission frame extends to the bottom of the box body and is positioned between the two sliding rails;
and the hook is fixedly connected to one side, close to the second end, of the bottom end of the transmission frame.
3. The slicing output device of single crystal silicon wafer degumming equipment according to claim 2, wherein the grabbing mechanism comprises six mechanical arms arranged at one side of the box body, the end parts of the six mechanical arms are connected with a mounting plate, and the mounting plate is provided with a vacuum chuck.
4. The wafer output device of the single-crystal silicon wafer degumming equipment according to claim 3, wherein the lifting mechanism comprises:
the first mounting frame is fixedly arranged in the box body and is positioned on the moving track of the window, and the area of the first mounting frame is smaller than that of the window;
the transmission rollers are symmetrically arranged on two sides of the first mounting frame through shaft levers, a plurality of belt grooves are uniformly distributed on the transmission rollers, a transmission belt is sleeved between the adjacent transmission rollers on the same side, and the transmission belt protrudes out of one side, close to the first end, of the first mounting frame;
the driving motor is in transmission connection with the transmission rollers through a transmission assembly and is used for driving the transmission rollers to synchronously rotate;
many installation poles, parallel fixed set up in the box, be located in the vertical face of first mounting bracket top, lie in on the installation pole the top of first mounting bracket is rotated and is cup jointed the backing roll.
5. The slicing output device of the single crystal silicon wafer degumming equipment according to claim 4, wherein a first drying mechanism is arranged at one side of the material frame in the box body; the first drying mechanism comprises a second mounting frame fixedly arranged in the box body, and electric heating pipes are uniformly arranged on the second mounting frame.
6. The wafer output device of the monocrystalline silicon wafer degumming equipment according to claim 5, wherein a second drying mechanism is arranged on the roller line; the second drying mechanism comprises a packaging box arranged on the roller line, a conveying channel for silicon wafers to pass through is arranged on the packaging box along the first direction, and air knives are symmetrically arranged on the upper side and the lower side of the roller line in the packaging box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221114104.1U CN217847902U (en) | 2022-05-11 | 2022-05-11 | Slicing output device of monocrystalline silicon wafer degumming equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221114104.1U CN217847902U (en) | 2022-05-11 | 2022-05-11 | Slicing output device of monocrystalline silicon wafer degumming equipment |
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| CN217847902U true CN217847902U (en) | 2022-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221114104.1U Active CN217847902U (en) | 2022-05-11 | 2022-05-11 | Slicing output device of monocrystalline silicon wafer degumming equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115889318A (en) * | 2022-12-07 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | Device and equipment for degumming silicon wafer |
| CN117259319A (en) * | 2023-11-23 | 2023-12-22 | 苏州晨晖智能设备有限公司 | Automatic degumming equipment for monocrystalline silicon wafer production |
-
2022
- 2022-05-11 CN CN202221114104.1U patent/CN217847902U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115889318A (en) * | 2022-12-07 | 2023-04-04 | 西安奕斯伟材料科技有限公司 | Device and equipment for degumming silicon wafer |
| CN117259319A (en) * | 2023-11-23 | 2023-12-22 | 苏州晨晖智能设备有限公司 | Automatic degumming equipment for monocrystalline silicon wafer production |
| CN117259319B (en) * | 2023-11-23 | 2024-01-26 | 苏州晨晖智能设备有限公司 | Automatic degumming equipment for monocrystalline silicon wafer production |
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