CN209249429U - Wafer heat device - Google Patents
Wafer heat device Download PDFInfo
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- CN209249429U CN209249429U CN201821986937.0U CN201821986937U CN209249429U CN 209249429 U CN209249429 U CN 209249429U CN 201821986937 U CN201821986937 U CN 201821986937U CN 209249429 U CN209249429 U CN 209249429U
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- silicon
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Abstract
The utility model discloses a kind of wafer heat devices, wafer heat device includes that silicon wafer enters box device, silicon box conveying device, thermal treatment unit and silicon wafer go out box device, silicon wafer enters box device for silicon wafer to be placed in empty silicon box, silicon box conveying device is used to receive silicon wafer and enters the silicon box with silicon wafer of box device output and the battery case with silicon wafer is driven to be delivered to thermal treatment unit to carry out silicon wafer heat treatment, silicon wafer goes out box device for will take out from silicon box by the silicon wafer of thermal treatment unit, it includes silicon wafer handling device that silicon wafer, which goes out box device, silicon box transfer device and silicon box exhausting line, silicon wafer handling device is used to take out silicon wafer from silicon box and forms empty silicon box, silicon box transfer device is used to empty silicon box being transported to silicon box exhausting line, silicon box exhausting line be used for by empty silicon box send back to silicon wafer enter it is box-packed It sets.
Description
Technical field
The utility model relates to a kind of wafer heat mode more particularly to a kind of wafer heat devices.
Background technique
Now wafer heat mode is mostly that silicon wafer is obtained silicon wafer from preceding diatom and silicon wafer is placed in silicon wafer on the market
In box, multiple silicon box push-in annealing device is heat-treated by manpower, it will be through Overheating Treatment after heat treatment
Silicon wafer taken out from silicon box, silicon wafer is flowed into subsequent processing, while the empty silicon box for taking silicon wafer being moved back to, continuing will not
The silicon wafer of processing is placed in sky silicon box.
This heat treatment mode is time-consuming and laborious, and also difficulty avoids causing because of manual operation fault while waste is a large amount of artificial
It is the case where die crack, manually also extremely laborious in the operation for carrying empty silicon box.
Utility model content
The case where inefficiency caused by order to avoid because of manual operation and material are damaged, the technology of the utility model
Scheme provides a kind of wafer heat device.Technical solution is as follows:
In a first aspect, the utility model provides a kind of wafer heat device, wafer heat device includes that silicon wafer enters
Box device, silicon box conveying device, thermal treatment unit and silicon wafer go out box device, and silicon wafer enters box device for silicon wafer to be placed in empty silicon
In film magazine, silicon box conveying device is used to receive silicon wafer and enters the silicon box with silicon wafer of box device output and drive with silicon wafer
Battery case be delivered to thermal treatment unit carry out silicon wafer heat treatment, silicon wafer go out box device for will pass through thermal treatment unit silicon
Piece takes out from silicon box, and it includes silicon wafer handling device, silicon box transfer device and silicon box exhausting line, silicon that silicon wafer, which goes out box device,
Piece handling device is used to take out silicon wafer from silicon box and forms empty silicon box, and silicon box transfer device is for transporting empty silicon box
It send to silicon box exhausting line, silicon box exhausting line enters box device for sending empty silicon box back to silicon wafer.
By silicon wafer enter box device, silicon box conveying device, thermal treatment unit and silicon wafer go out box device realize silicon wafer from
The automatic operation that silicon wafer is moved out to silicon box after entering silicon box to heat treatment, avoids artificial participation, greatly speeds up
Working efficiency and human cost is saved, while by silicon wafer handling device, silicon box transfer device and silicon box exhausting line,
It realizes silicon box and is back to the operation that silicon wafer enters box device after being taken silicon wafer, avoid manual handling silicon box, realize
Silicon box has saved manpower while recycling, also therefore greatly accelerates production efficiency.
In the first possible implementation of the first aspect, silicon wafer handling device includes that silicon wafer carries clamping jaw and drive
Silicon wafer carries the carrying clamping jaw power device of clamping jaw movement, and silicon wafer carries clamping jaw and is used to silicon wafer be moved away to silicon box and by silicon box
It is carried to silicon box transfer device.
The setting of clamping jaw is carried by silicon wafer, so that silicon wafer handling device realizes carrying empty silicon while carrying silicon wafer
The function of film magazine has saved the setting of silicon box handling device while having saved design space.
With reference to first aspect or the first possible implementation of first aspect, second in first aspect are possible
In implementation, silicon box transfer device includes silicon box conveyer table and the transport power dress for driving the movement of silicon box conveyer table
Set, transporting power device includes lifting power plant and traversing power device, lifting power plant driving silicon box conveyer table into
Row lifting action possesses different height in the different haulage stages for meeting silicon box conveyer table, and traversing power device is driven
Dynamic silicon box conveyer table carries out traversing movement, carries clamping jaw and silicon box exhausting line in the position of horizontal plane for meeting silicon wafer
Difference.
The setting of silicon box conveyer table that can be traversing by liftable realizes while docking silicon box conveying device
Also silicon wafer can be docked and carry clamping jaw and silicon box exhausting line, it is empty to have saved also compact complete machine in the case where multiple handling devices
Between.
With reference to first aspect to second of possible implementation of first aspect, the third in first aspect is possible
In implementation, silicon wafer handling device further includes at least two silicon box neatening devices and silicon box jacking apparatus, silicon box rule
Engagement positions are distributed in that silicon box conveying device is regular for carrying out to the position of silicon box, and silicon box jacking apparatus is placed in silicon box
Conveying device bottom is used to jack silicon box in order to which silicon wafer carrying clamping jaw obtains the silicon wafer in silicon box.
By silicon box neatening device position of the silicon box in silicon box conveying device is stabilized, so that it is determined that silicon wafer
Position, enable silicon wafer carry clamping jaw get silicon wafer, by the setting of silicon box jacking apparatus so that silicon wafer conveying clamp
Pawl can save the movement that silicon wafer carries clamping jaw, accelerate productive temp in fixed position acquisition to silicon wafer.
With reference to first aspect to the third possible implementation of first aspect, the 4th kind in first aspect is possible
In implementation, silicon box exhausting line includes the first exhausting line and the second exhausting line, and the first exhausting line is used for from silicon wafer conveying clamp
Pawl goes to obtain empty silicon box and empty silicon box is delivered to silicon box transfer device, and the second exhausting line is used to fill from silicon wafer cassette transporter
The place of setting, which obtains empty silicon box and empty silicon box is delivered to silicon wafer, enters box device.
Solving by the setting of two exhausting lines in silicon box reflux is that not caused enough the silicon box of beat conveys congestion
The case where, two exhausting lines accelerate the back-flow velocity of silicon box to greatly accelerate production efficiency.
Detailed description of the invention
The drawings herein are incorporated into the specification and constitutes part of specification, shows the reality for meeting the utility model
Example is applied, and is used to explain the principles of the present invention together with specification, in which:
Fig. 1 is the top view of wafer heat device shown in the utility model embodiment；
Fig. 2 is the top view of two-wire annealing device shown in the utility model another embodiment；
Fig. 3 is the schematic perspective view that silicon wafer enters box device and part silicon box conveying device in the utility model；
Fig. 4 is the stereochemical structure of the silicon box neatening device and silicon box jacking apparatus in a kind of embodiment of the utility model
Schematic diagram；
Fig. 5 is the schematic perspective view of the silicon wafer carrying clamping jaw in a kind of embodiment of the utility model；
Fig. 6 is the schematic perspective view of the silicon box transfer device in a kind of embodiment of the utility model.
Specific embodiment
Following disclosure provides many different embodiments or example is used to realize the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, the example of various specific techniques and material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Now wafer heat mode on the market is mostly that silicon wafer is obtained silicon wafer from preceding diatom and silicon wafer is placed in silicon
In film magazine, by manpower by multiple silicon box push-in annealing device be heat-treated, will be through overheat after heat treatment at
The silicon wafer of reason takes out from silicon box, silicon wafer is flowed into subsequent processing, while the empty silicon box for taking silicon wafer being moved back to, continue by
Untreated silicon wafer is placed in sky silicon box.
This heat treatment mode is time-consuming and laborious, and also difficulty avoids causing because of manual operation fault while waste is a large amount of artificial
It is the case where die crack, manually also extremely laborious in the operation for carrying empty silicon box.
In order to realize the automation of wafer heat, the utility model provides a kind of wafer heat device, skill
Art scheme is as follows:
The utility model is described in further details below according to attached drawing 1 to attached drawing 6.
As depicted in figs. 1 and 2, the utility model provides a kind of wafer heat device, including silicon wafer enters box device 1,
Silicon box conveying device 2, thermal treatment unit 3 and silicon wafer go out box device 4, and silicon wafer enters box device 1 for silicon wafer to be placed in empty silicon wafer
In box, silicon box conveying device 2 is used to receive silicon wafer and enters the silicon box with silicon wafer of the output of box device 1 and drive with silicon wafer
Battery case be delivered to thermal treatment unit 3 and carry out silicon wafer heat treatment, silicon wafer goes out box device 4 for will pass through thermal treatment unit 3
Silicon wafer taken out from silicon box, silicon wafer go out box device 4 include silicon wafer handling device 41, silicon box transfer device 42 and silicon wafer
Box exhausting line 43, silicon wafer handling device 41 are used to take out silicon wafer from silicon box and form empty silicon box, silicon box transfer device
42 for being transported to silicon box exhausting line 43 for empty silicon box, and silicon box exhausting line 43 enters box for sending empty silicon box back to silicon wafer
Device 1.
Certainly, in order to adapt to the production of higher rhythm, meet higher production efficiency, it can will be at the silicon wafer heat of such as Fig. 1
Reason device is set as two-wire production model as shown in Figure 2, and two wafer heat devices share same silicon box exhausting line
43, the productive temp that had not only met but also complete machine space occupied can be saved.
Entering box device 1, silicon box conveying device 2, thermal treatment unit 3 and silicon wafer by silicon wafer and going out box device 4 realizes silicon
Silicon wafer is moved out the automatic operation of silicon box after enter silicon box to heat treatment by piece, avoids artificial participation, significantly
It accelerates working efficiency and has saved human cost, while passing through silicon wafer handling device 41, silicon box transfer device 42 and silicon wafer
Box exhausting line 43 realizes silicon box and is back to the operation that silicon wafer enters box device 1 after being taken silicon wafer, avoids manual handling
Silicon box realizes while silicon box is recycled and has saved manpower, also therefore greatly accelerates production efficiency.
Silicon wafer handling device 41 includes that silicon wafer carries clamping jaw 411 and silicon wafer is driven to carry the carrying clamping jaw that clamping jaw 411 acts
Power device 412, silicon wafer carry clamping jaw 411 for silicon wafer to be moved away from silicon box and silicon box is carried to silicon box transfer device
42。
In order to realize unitized production, the silicon wafer that silicon wafer enters box device 1 carries use and goes out box device 4 similarly with silicon wafer
Silicon wafer carries clamping jaw 411 and silicon wafer is driven to carry the power device 412 that clamping jaw 411 acts, as shown in Fig. 3 Fig. 5, silicon wafer conveying clamp
Using absorption type feeding mode on pawl 411, in the embodiments of the present invention, using sucker, sucker has soft
Contact surface, so as to avoid the broken of silicon wafer caused by hard contact, while in order to accelerate production efficiency, the implementation of the utility model
Clamping jaw 411 is carried in single silicon wafer in example and uses three suckers, and three suckers are uniformly mounted in power device 412, each
The three-pawl type mounting means that the connection of sucker and power device 412 is all made of, at the adsorption plane using three pawl arms stabilization suckers
In in approximately the same plane, guarantee that the adsorption plane of sucker is still being in after prolonged while increasing adsorption capacity significantly
On same plane, the case where avoiding the out-of-flatness of adsorption plane leads to sucker gas leakage to reduce adsorption capacity, while three-pawl type
Mounting means can adsorb silicon box for sucker and provide hardware condition.
As shown in fig. 6, silicon box transfer device 42 includes silicon box conveyer table 421 and drives silicon box conveyer table 421 dynamic
The transport power device 422 of work, transporting power device 422 includes lifting power plant 423 and traversing power device 424, lifting
Power device 423 drives silicon box conveyer table 421 to carry out lifting action, for meeting silicon box conveyer table 421 in different fortune
The defeated stage possesses different height, and traversing power device 424 drives silicon box conveyer table 421 to carry out traversing movement, for meeting
Silicon wafer carries clamping jaw 411 and silicon box exhausting line 43 in the alternate position spike of horizontal plane.
As shown in figure 4, silicon wafer handling device 41 further includes at least two silicon box neatening devices 413 and silicon box jacking dress
414 are set, silicon box neatening device 413 is distributed in silicon box conveying device 2 and carries out regular, silicon box for the position to silicon box
Jacking apparatus 414 is placed in 2 bottom of silicon box conveying device for jacking silicon box in order to which silicon wafer carrying clamping jaw 411 is right
Silicon wafer in silicon box is obtained.
Silicon box neatening device 413 drives gripping block to realize folder to the silicon box in silicon box conveying device 2 using cylinder
Tight movement, so that position of the silicon box in silicon box conveying device 2 is fixed, silicon box jacking apparatus 414 includes
Jacking motor and the raising plate being mounted on jacking motor activity end, after the position of silicon box is fixed, jacking motor drives top
Lift slab jacks the silicon box for fixing position upwards and jacks the position that can be got to silicon wafer carrying clamping jaw 411, jacking electricity
Machine can be with real-time control top lifting height, to guarantee that a piece of silicon wafer of the top in silicon box is in same level height always
Degree, as long as so silicon wafer carries clamping jaw 411 and runs to designated position every time and can get silicon wafer, certain jacking apparatus can be with
Using servo motor equal power device, will not be repeated here here.
Silicon box exhausting line 43 includes the first exhausting line 431 and the second exhausting line 432, and the first exhausting line 431 is used for from silicon
Piece carries clamping jaw 411 and goes to obtain empty silicon box and empty silicon box is delivered to silicon box transfer device 42, and the second exhausting line 432 is used
Enter box device 1 in obtaining empty silicon box from silicon box transfer device 42 and empty silicon box being delivered to silicon wafer.
As shown in Figure 1, 2, in the embodiments of the present invention, silicon box exhausting line 43 further includes third exhausting line 433,
Third exhausting line 433 is mounted on silicon wafer and enters at box device 1, carries clamping jaw 411 using silicon wafer and carries silicon from third exhausting line 433
Film magazine, and silicon box is transported to progress silicon wafer in silicon box conveying device 2 and enters box, while also being set on third exhausting line 433
It is equipped with silicon box neatening device 413, for position of the regular silicon box on third exhausting line 433, consequently facilitating silicon wafer is carried
Clamping jaw 411 obtains the silicon box on third exhausting line 433.
Unless otherwise defined, the technical term or scientific term used herein is should be in the utility model fields
The ordinary meaning that personage with general technical ability is understood.Make in the utility model patent application specification and claims
" first ", " second " and similar word do not represent any sequence, quantity or importance, and are used only to distinguish not
Same component part.It equally " connects " word that either " connected " etc. is similar and is not limited to physics or mechanical connection,
But may include electrical connection, it is either direct or indirect." one end ", " other end " only indicate opposite position
Relationship, after the absolute positional relation for the object being described changes, then this thinks that corresponding positional relationship also changes accordingly.In addition
The "at least one" said in text include one, two or more.
Those skilled in the art will readily occur to this after considering specification and practicing the utility model of utility model here
Other embodiments of utility model.This application is intended to cover any variations, uses, or adaptations of the utility model,
These variations, uses, or adaptations follow the general principle of the utility model and this technology including the utility model
Common knowledge or conventional techniques in field.The description and examples are only to be considered as illustrative, the utility model it is true
Positive scope and spirit are pointed out by claim.
It should be understood that the utility model is not limited to the accurate knot for being described above and being shown in the accompanying drawings
Structure, and various modifications and changes may be made without departing from the scope thereof.The scope of the utility model is only wanted by appended right
It asks to limit.
Claims (5)
1. a kind of wafer heat device, which is characterized in that the wafer heat device includes that silicon wafer enters box device, silicon box
Conveying device, thermal treatment unit and silicon wafer go out box device, and the silicon wafer enters box device and is configured in from previous process acquisition silicon wafer
And silicon wafer is placed in empty silicon box, the silicon box conveying device, which is configured in, receives the band that the silicon wafer enters box device output
There is the silicon box of silicon wafer and the battery case with silicon wafer is driven to be delivered to the thermal treatment unit and carries out silicon wafer heat treatment, it is described
Silicon wafer goes out box device and is configured in the silicon wafer for taking out from silicon box and passing through the thermal treatment unit, and the silicon wafer goes out box device and includes
Silicon wafer handling device, silicon box transfer device and silicon box exhausting line, the silicon wafer handling device are configured in from silicon box
It takes out silicon wafer and forms empty silicon box, the silicon box transfer device, which is configured in, is transported to the silicon box time for empty silicon box
Take-up, the silicon box exhausting line, which is configured in, sends empty silicon box back to the silicon wafer and enters box device.
2. wafer heat device according to claim 1, which is characterized in that the silicon wafer handling device includes that silicon wafer is removed
It transports clamping jaw and the silicon wafer is driven to carry the carrying clamping jaw power device that clamping jaw acts, the silicon wafer is carried clamping jaw and is used for silicon wafer
It moves away from silicon box and silicon box is carried to the silicon box transfer device.
3. wafer heat device according to claim 2, which is characterized in that the silicon box transfer device includes silicon wafer
Cassette transporter platform and the transport power device for driving the silicon box conveyer table movement, the transport power device includes lifting drive
Device and traversing power device, the lifting power plant drives the silicon box conveyer table to carry out lifting action, for meeting
Silicon box conveyer table possesses different height in the different haulage stages, and the traversing power device drives the silicon wafer cassette transporter
Platform carries out traversing movement, carries clamping jaw and the silicon box exhausting line in the alternate position spike of horizontal plane for meeting the silicon wafer.
4. wafer heat device according to claim 2, which is characterized in that the silicon wafer handling device further includes at least
Two silicon box neatening devices and silicon box jacking apparatus, the silicon box neatening device are distributed in the silicon box conveying device
For to silicon box position carry out it is regular, the silicon box jacking apparatus be placed in silicon box conveying device bottom for will
Silicon box is jacked in order to which silicon wafer carrying clamping jaw obtains the silicon wafer in silicon box.
5. wafer heat device according to claim 2, which is characterized in that the silicon box exhausting line includes first time
Take-up and the second exhausting line, first exhausting line are used to carry clamping jaw from the silicon wafer and go to obtain empty silicon box and by empty silicon wafer
Box is delivered to the silicon box transfer device, and second exhausting line is used to obtain empty silicon wafer from the silicon box transfer device
Empty silicon box is simultaneously delivered to the silicon wafer and enters box device by box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821986937.0U CN209249429U (en) | 2018-11-29 | 2018-11-29 | Wafer heat device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821986937.0U CN209249429U (en) | 2018-11-29 | 2018-11-29 | Wafer heat device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209249429U true CN209249429U (en) | 2019-08-13 |
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ID=67530642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821986937.0U Active CN209249429U (en) | 2018-11-29 | 2018-11-29 | Wafer heat device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209249429U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378290A (en) * | 2018-11-29 | 2019-02-22 | 无锡市江松科技有限公司 | Wafer heat device and silicon box circulation method |
| CN111206237A (en) * | 2020-02-19 | 2020-05-29 | 无锡市江松科技有限公司 | ALD silicon chip loading and unloading device |
-
2018
- 2018-11-29 CN CN201821986937.0U patent/CN209249429U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378290A (en) * | 2018-11-29 | 2019-02-22 | 无锡市江松科技有限公司 | Wafer heat device and silicon box circulation method |
| CN109378290B (en) * | 2018-11-29 | 2024-02-20 | 无锡江松科技股份有限公司 | Silicon wafer heat treatment device and silicon wafer box circulation method |
| CN111206237A (en) * | 2020-02-19 | 2020-05-29 | 无锡市江松科技有限公司 | ALD silicon chip loading and unloading device |
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| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No.208 Changjiang East Road, Shuofang, Xinwu District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Jiangsong Technology Co.,Ltd. Address before: 214028 plot c20-2, phase V, Shuofang industrial concentration zone, New District, Wuxi City, Jiangsu Province Patentee before: WUXI JIANGSONG SCIENCE AND TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |