CN109969792A - Dry Slicer for Semiconductor Wafers - Google Patents

Abstract

The present application discloses a dry slicing machine for semiconductor wafers, which includes a frame and a plurality of material frames, conveyor belts, transverse electric cylinders and longitudinal electric cylinders, and a plurality of material frames and conveyor belts arranged on the frame. They are arranged on the same line in sequence, the horizontal electric cylinder is arranged above the multiple material frames and the conveyor belt, the longitudinal cylinder is arranged under the multiple material frames, the horizontal cylinder is connected with a first cylinder through a slider, and the output end of the first cylinder is A plurality of suction cups are connected by connecting plates, the suction cups are arranged towards the top of the material frame, and the vertical electric cylinder is connected with a plurality of support rods through the slider, the support rods are set towards the bottom of the material frame, and the bottom of the material frame is provided with through holes for the support rods to pass through , the side of each material frame is provided with a nozzle facing the inside of the material frame, and the nozzle is connected with the frame through the second air cylinder. The dry slicing machine for semiconductor wafers realizes automatic dry slicing through cooperation between various structures, instead of the original manual slicing, has high efficiency and saves labor costs.

Description

Dry Slicer for Semiconductor Wafers

technical field

The present application relates to the field of semiconductor wafer equipment, in particular to a dry slicing machine for semiconductor wafers.

Background technique

In the existing semiconductor wafer production process, after the wafer cleaning and other processing are completed, dry slicing is performed manually by a robot equipped with a vacuum suction cup, which has low efficiency and high labor cost.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a dry slicing machine for semiconductor wafers to overcome the deficiencies in the prior art.

To achieve the above object, the present invention provides the following technical solutions:

The embodiment of the present application discloses a dry slicing machine for semiconductor wafers, which includes a frame and a plurality of material frames, conveyor belts, transverse electric cylinders and longitudinal electric cylinders arranged on the frame, the plurality of material frames and The conveyor belts are arranged on the same straight line in sequence, the horizontal electric cylinder is arranged above the multiple material frames and the conveyor belt, the longitudinal cylinder is arranged under the multiple material frames, and the horizontal cylinder is connected with the first block through the slider. Air cylinder, the output end of the first air cylinder is connected to a plurality of suction cups through a connecting plate, a plurality of the suction cups are arranged one by one with a plurality of material frames, the suction cups are arranged towards the top of the material frame, and the vertical electric cylinder is connected to The block is connected with a plurality of support rods, a plurality of the support rods are arranged in a one-to-one correspondence with a plurality of material frames, the support rods are arranged towards the bottom of the material frame, and the bottom of the material frame is provided with a through hole for the support rods to pass through, Each side of the material frame is provided with a nozzle disposed toward the inside of the material frame, and the nozzle is connected with the frame through a second air cylinder.

Preferably, in the above-mentioned dry slicing machine for semiconductor wafers, there are two said material frames, two said suction cups, and two said support rods.

Preferably, in the above-mentioned dry slicing machine for semiconductor wafers, the nozzle is arranged on the top of the side edge of the material frame.

Preferably, in the above-mentioned dry slicing machine for semiconductor wafers, the rack is provided with grooves for placing a plurality of material frames.

Compared with the prior art, the advantages of the present invention are:

The dry slicing machine for semiconductor wafers realizes automatic dry slicing through cooperation between various structures, instead of the original manual slicing, has high efficiency and saves labor costs.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments described in this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without any creative effort.

1 is a schematic structural diagram of a dry slicing machine for semiconductor wafers in a specific embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a material frame in a specific embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be described in detail below with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Referring to FIG. 1 , the dry slicing machine for semiconductor wafers in this embodiment includes a frame 1 and two material frames 2 , a conveyor belt 3 , a horizontal electric cylinder 4 and a longitudinal direction arranged on the frame 1 . Electric cylinder 5.

The two material frames 2 and the conveyor belt 3 are arranged on the same straight line in turn, the transverse electric cylinder 4 is arranged above the two material frames 2 and the conveyor belt 3, and the transverse cylinder 4 is connected with a first cylinder 6 through a slider. The output end of the air cylinder 6 is connected to two vacuum suction cups 7 through a connecting plate.

In this technical solution, the suction cup grabs the semiconductor wafer silicon wafer in the material frame under the action of the first cylinder, and is driven by the horizontal electric cylinder to place the semiconductor wafer silicon wafer on the conveyor belt for transportation.

Referring to Figures 1-2, the longitudinal cylinder 5 is arranged under the two material frames 2, and the longitudinal electric cylinder 5 is connected with two support rods 8 through the slider, and the two support rods 8 correspond to the two material frames 2 one-to-one. The support rod 8 is set toward the bottom of the material frame 2, and the bottom of the material frame 2 is provided with a through hole 9 through which the support rod 8 passes.

In this technical solution, the silicon wafers of the semiconductor wafers in the material frame are gradually reduced and the height is gradually reduced during the continuous grabbing process. At this time, the support plate is driven through the through holes at the bottom of the material frame by the vertical electric cylinder to support the wafers in the material frame. The semiconductor wafer is moved up to facilitate the gripping of the vacuum chuck.

As shown in FIG. 1 , the side of each material frame 2 is provided with a nozzle 10 disposed toward the inside of the material frame 2 , and the nozzle 10 is connected to the frame 1 through a second air cylinder 11 .

Further, the nozzle 10 is arranged on the top of the side of the material frame 2 .

In this technical solution, the nozzles spray the semiconductor wafer silicon wafers, which facilitates the separation of the silicon wafers, facilitates slicing, prevents sticking between the silicon wafers, and ensures single-chip slicing.

Referring to FIG. 1 , in one embodiment, the rack 1 is provided with grooves 12 for placing two material frames 2 .

In this technical solution, the material frame is fixed by the groove to prevent shaking during the grabbing process.

In other embodiments, the number of material frames, suction cups and support rods can be adjusted as required to ensure the speed of slicing.

To sum up, the dry slicing machine for semiconductor wafers realizes automatic dry slicing through cooperation between various structures, instead of the original manual slicing, which is efficient and saves labor costs.

Specific implementation principle:

1. Arrange the material frames loaded with semiconductor wafers into the grooves in sequence.

2. The nozzle is adjusted in position under the action of the second cylinder to spray the silicon wafer at the port of the material frame.

3. The first cylinder drives the suction cup to move down and grabs the silicon wafers on the top of the multiple material frames at the same time.

4. The horizontal electric cylinder drives the suction cup to transfer the silicon wafer to the top of the conveyor belt, and the captured silicon wafer is placed on the conveyor belt for transportation through the cooperation of the first cylinder and the suction cup.

5. The vertical electric cylinder drives the support rod to pass through the through hole at the bottom of the material frame, and then moves the silicon wafer in the material frame to the original height, and the horizontal electric cylinder drives the suction cup back to the initial position for the second grab.

It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any relationship between these entities or operations. any such actual relationship or sequence exists. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article, or device that includes the element.

The above are only specific embodiments of the present application. It should be pointed out that for those of ordinary skill in the art, some improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications should also be regarded as The protection scope of this application.

Claims (4)

1. a dry-type slicing machine for semiconductor wafers, characterized in that: comprising a frame and being arranged on a plurality of material frames, conveyor belts, transverse electric cylinders and longitudinal electric cylinders, a plurality of described materials The frame and the conveyor belt are arranged on the same line in sequence, the horizontal electric cylinder is arranged above the multiple material frames and the conveyor belt, the longitudinal cylinder is arranged under the multiple material frames, and the horizontal cylinder is connected with a slider through the slider. The first air cylinder, the output end of the first air cylinder is connected to a plurality of suction cups through a connecting plate, a plurality of the suction cups are arranged in a one-to-one correspondence with a plurality of material frames, the suction cups are arranged towards the top of the material frame, and the vertical electric cylinder is arranged on the top of the material frame. A plurality of support rods are connected through the sliding block, and the support rods are arranged in a one-to-one correspondence with the material frames. The support rods are arranged toward the bottom of the material frame, and the bottom of the material frame is provided with a passage for the support rods to pass through. The side of each material frame is provided with a nozzle disposed toward the inside of the material frame, and the nozzle is connected with the frame through a second air cylinder. 2 . The dry slicing machine for semiconductor wafers according to claim 1 , wherein there are two said material frames, two said suction cups, and two said support rods. 3 . 3 . The dry slicing machine for semiconductor wafers according to claim 1 , wherein the nozzle is arranged on the top of the side edge of the material frame. 4 . 4 . The dry slicing machine for semiconductor wafers according to claim 1 , wherein the rack is provided with grooves for placing a plurality of material frames. 5 .