CN110148576B - Mechanical clamping device for semiconductor wafer transmission - Google Patents
Mechanical clamping device for semiconductor wafer transmission Download PDFInfo
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- CN110148576B CN110148576B CN201910444186.2A CN201910444186A CN110148576B CN 110148576 B CN110148576 B CN 110148576B CN 201910444186 A CN201910444186 A CN 201910444186A CN 110148576 B CN110148576 B CN 110148576B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductor wafer transmission. A mechanical clamping device for conveying a semiconductor wafer comprises a frame, a first slide rail, a second slide rail, a first clamping plate moving plate, a second clamping plate moving plate, a third clamping plate moving plate, a fourth clamping plate moving plate, a driving assembly and five clamping plates; the first sliding rail is arranged on the inner wall of one side of the front part of the frame; the second slide rail is arranged on the inner wall of the other side of the front part of the frame; the first clamping plate moving plate and the second clamping plate moving plate are respectively arranged on the first slide rail, the third clamping plate moving plate and the fourth clamping plate moving plate are respectively arranged on the second slide rail, and the five clamping plates are respectively arranged on the four clamping plate moving plates; the driving assembly is used for driving the five clamping plates to clamp or unclamp. The clamping device has the beneficial effects of solving the problems that the semiconductor wafer is easily damaged due to inward extrusion of two sides of the semiconductor wafer in the clamping process of the existing clamping device, the surface of the semiconductor wafer is abraded in the clamping process, and the clamping efficiency is low.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer transmission, in particular to a mechanical clamping device for semiconductor wafer transmission.
Background
At present, most of semiconductor wafer clamping devices are devices with one end rigidly fixed and the other end driven by a cylinder and the like to clamp a semiconductor wafer. When clamping the semiconductor wafer, one side of the semiconductor wafer is placed on the step of the static end, and the semiconductor wafer is smoothly contacted with the static end through the clamping action of the movable end, so that the semiconductor wafer is clamped through the combined action of the movable end and the static end. For example, disclose a clamping device is electroplated to semiconductor wafer in the chinese utility model patent that publication number is CN207498498U bulletin day 2018.06.15, including holding rod, a supporting rod and No. two supporting rods, holding rod one side swing joint has a supporting rod, holding rod opposite side swing joint has No. two supporting rods, the inside press lever that is equipped with of holding rod, press lever surface is equipped with the spring, be equipped with according to the gland on the press lever, holding rod upper end one side is equipped with the buckle, a supporting rod surface is equipped with a push rod, No. two clamping rod surfaces are equipped with No. two push rods, a supporting rod and No. two supporting rod lower extreme inboards all are equipped with the exposed core, exposed core one side is equipped with convex draw-in groove, be equipped with the semiconductor wafer between the exposed core. The utility model discloses simple structure, the centre gripping operation to semiconductor wafer is swift, simple and convenient, has wide marketing application prospect.
The following problems exist in the current clamping device: firstly, the semiconductor wafer is mostly clamped at two sides of the semiconductor wafer at present, the semiconductor wafer is very easy to be damaged in the clamping process, and the semiconductor wafer is very easy to fall off in the conveying process; secondly, the existing clamping is basically realized by clamping one piece, so that the conveying efficiency is low, and the production efficiency is influenced; and thirdly, the surface of the semiconductor wafer generates sliding friction with the step surface of the static end in the clamping process, so that the surface of the semiconductor wafer is abraded.
Disclosure of Invention
The invention aims to solve the problems that the existing clamping device extrudes the two sides of a semiconductor wafer inwards in the clamping process to easily cause damage to the semiconductor wafer, the surface of the semiconductor wafer is abraded in the clamping process, and the clamping efficiency is low. The device is convenient to better realize the transmission action through the driving component; the clamping or loosening action is carried out through the clamping plates, so that a plurality of semiconductor wafers can be conveniently and simultaneously conveyed, and the conveying efficiency is improved; the mechanical clamping device for transferring the semiconductor wafer is used for driving the clamping plate to move better through the sliding rail and reducing abrasion of the semiconductor wafer in the transferring process due to the matching of the clamping plate and the semiconductor wafer.
For the purpose of the invention, the following technical scheme is adopted for realizing the purpose: a mechanical clamping device for conveying a semiconductor wafer comprises a frame, a first slide rail, a second slide rail, a first clamping plate moving plate, a second clamping plate moving plate, a third clamping plate moving plate, a fourth clamping plate moving plate, a driving assembly and five clamping plates; the first sliding rail is arranged on the inner wall of one side of the front part of the frame; the second slide rail is arranged on the inner wall of the other side of the front part of the frame; the first clamping plate moving plate and the second clamping plate moving plate are respectively arranged on the first slide rail, and the second clamping plate moving plate is positioned below the first clamping plate moving plate; the third clamping plate moving plate and the fourth clamping plate moving plate are respectively arranged on the second slide rail, and the fourth clamping plate moving plate is positioned below the third clamping plate moving plate; the five clamping plates are respectively arranged on the four clamping plate moving plates; the driving assembly comprises a main hinge rod, a first hinge rod, a second hinge rod, a third hinge rod, a fourth hinge rod and a driving motor; the main hinge rod is provided with a first main hinge hole at the front part, a second main hinge hole at the middle front part, a third main hinge hole at the middle part, a fourth main hinge hole at the middle rear part and a fifth main hinge hole at the rear part; the first main hinge hole is hinged with the inner side of the first clamping plate moving plate; the second main hinge hole is hinged with one end of the first hinge rod, and the other end of the first hinge rod is hinged with the inner side of the third splint moving plate; the third main hinge hole is hinged with one end of the second hinge rod; the other end of the second hinge rod is hinged to the middle part of the frame through a hinge column; the fourth main hinge hole is hinged with one end of a third hinge rod, and the other end of the third hinge rod is hinged with the inner side of the fourth splint moving plate; the fifth main hinge hole is hinged with one end of a fourth hinge rod, and the other end of the fourth hinge rod is hinged with the inner side of the second clamping plate moving plate; the driving motor is arranged on the second hinge rod. The device improves the clamping efficiency and prevents the semiconductor wafer from being worn.
Preferably, the five clamping plates comprise a first clamping plate, a second clamping plate, a third clamping plate, a fourth clamping plate and a fifth clamping plate; the first clamping plate is arranged on the top surface of the first clamping plate moving plate; the second clamping plate is arranged on the top surface of the third clamping plate moving plate, and the third clamping plate is arranged on the bottom surface of the third clamping plate moving plate; the fourth clamping plate is arranged on the top surface of the fourth clamping plate moving plate; the five clamping plates are arranged on the second clamping plate moving plate. Carry out polylith centre gripping conveying through polylith splint, promote conveying efficiency.
Preferably, the five clamping plates are all in a U-shaped flat shape. The semiconductor wafer can be matched with the semiconductor wafer better, and the abrasion of the semiconductor wafer is reduced.
Preferably, the first slide rail and the second slide rail are both two, and the first slide rail and the second slide rail are vertically and symmetrically arranged on the inner walls of the left side and the right side of the frame. Facilitating better clamping or unclamping.
Preferably, the cross sections of the first clamping plate moving plate, the second clamping plate moving plate, the third clamping plate moving plate and the fourth clamping plate moving plate are all in an L shape, vertical plates of the four clamping plate moving plates are slidably connected with the slide rail, and transverse plates of the four clamping plate moving plates are fixedly connected with the clamping plates.
Preferably, the hinge points of the first clamping plate moving plate, the second clamping plate moving plate, the third clamping plate moving plate and the fourth clamping plate moving plate are respectively provided with a hinge shaft sleeve for hinge fit. Facilitating better hinging fit.
A method for holding and transporting a semiconductor wafer, comprising the steps of: the driving motor drives the second hinge rod to rotate clockwise, so that the second hinge rod drives the main hinge rod to rotate, and the joint included angle between the main hinge rod and the fourth hinge rod is smaller and smaller; the main hinge rod drives the clamping plates on each clamping plate moving plate to move downwards on the sliding rail through the first hinge rod, the second hinge rod and the third hinge rod respectively, so that gaps between the five clamping plates are reduced, and finally, the semiconductor wafer between each two clamping plates is clamped and conveyed.
Compared with the prior art, the invention has the beneficial effects that: five hinged rods in the driving assembly are hinged and matched to drive five clamping plates to move up and down, so that the semiconductor wafer between the clamping plates is clamped, the transmission efficiency between the hinged rods is improved, and the clamping effect is improved; the plurality of clamping plates are used for simultaneously transmitting the plurality of semiconductor wafers, so that the transmission efficiency is improved, and the production efficiency is increased; the clamping plate can move better through the first sliding rail and the second sliding rail, abrasion to the semiconductor wafer in the clamping process is prevented, the transmission quality of the semiconductor wafer is ensured, and finally the device can prevent the semiconductor wafer from being damaged in the clamping process, prevent the surface of the semiconductor wafer from being abraded in the clamping process and transmit a plurality of semiconductor wafers together.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an exploded view of the present invention.
The labels in the figures are: the frame 1, the first slide rail 2, the second slide rail 21, the first splint moving plate 3, the second splint moving plate 4, the third splint moving plate 5, the fourth splint moving plate 6, the driving assembly 7, the main hinge rod 71, the first main hinge hole 711, the second main hinge hole 712, the third main hinge hole 713, the fourth main hinge hole 714, the fifth main hinge hole 715, the first hinge rod 72, the hinge post 721, the second hinge rod 73, the third hinge rod 74, the fourth hinge rod 75, the driving motor 76, the five splints 8, the first splint 81, the second splint 82, the third splint 83, the fourth splint 84, the fifth splint 85, and the hinge sleeve 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the drawings, are used only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
As shown in fig. 1 and 2, a mechanical clamping device for transferring a semiconductor wafer includes a frame 1, a first slide rail 2, a second slide rail 21, a first clamp moving plate 3, a second clamp moving plate 4, a third clamp moving plate 5, a fourth clamp moving plate 6, a driving assembly 7, and five clamps 8; the number of the first slide rails 2 is two, and the two first slide rails 2 are vertically arranged on the inner wall of the left side of the front part of the frame 1; the number of the second slide rails 21 is two, and the two second slide rails 21 are vertically arranged on the right inner wall of the front part of the frame 1; first slide rail 2 and the symmetrical setting of second slide rail 21 further promote the transmission nature through four slide rails to better support that slides, promote support intensity. The first clamping plate moving plate 3 and the second clamping plate moving plate 4 are respectively arranged on the two first sliding rails 2, the second clamping plate moving plate 4 is located below the first clamping plate moving plate 3, the first clamping plate moving plate 3 and the second clamping plate moving plate 4 respectively slide on the first sliding rails 2, the third clamping plate moving plate 5 and the fourth clamping plate moving plate 6 are respectively arranged on the second sliding rails 21, the fourth clamping plate moving plate 6 is located below the third clamping plate moving plate 5, the third clamping plate moving plate 5 and the fourth clamping plate moving plate 6 respectively slide on the second sliding rails 21, and better clamping control clamping plates can be conveniently clamped through sliding. The cross sections of the first clamping plate moving plate 3, the second clamping plate moving plate 4, the third clamping plate moving plate 5 and the fourth clamping plate moving plate 6 are all in an L shape, vertical plates and sliding rails of the four clamping plate moving plates are connected in a sliding mode, transverse plates and clamping plates 8 of the four clamping plate moving plates are fixedly connected, occupied space is further saved through the L-shaped clamping plate moving plates, the better clamping plate moving plates are in sliding fit with the sliding rails, and the better clamping plates 8 are convenient to fix.
As shown in fig. 2, five clamping plates 8 are respectively arranged on the four clamping plate moving plates, and the five clamping plates 8 are all U-shaped and flat. The five clamping plates 8 include a first clamping plate 81, a second clamping plate 82, a third clamping plate 83, a fourth clamping plate 84 and a fifth clamping plate 85; the first clamp plate 81 is arranged on the top surface of the first clamp moving plate 3; the second clamping plate 82 is arranged on the top surface of the third clamping plate moving plate 5, and the third clamping plate 83 is arranged on the bottom surface of the third clamping plate moving plate 5; the fourth clamp plate 84 is arranged on the top surface of the fourth clamp moving plate 6; five clamping plates 8 are arranged on the second clamping plate moving plate. More semiconductor wafers are convenient to clamp through the five clamping plates 8, the clamping quantity is increased, and the conveying efficiency is improved.
As shown in fig. 2, the driving assembly is used for driving the clamping plate 8 to clamp or unclamp, and the driving assembly 7 comprises a main hinge rod 71, a first hinge rod 72, a second hinge rod 73, a third hinge rod 74, a fourth hinge rod 75 and a driving motor 76; the main hinge lever 71 is provided with a front first main hinge hole 711, a middle front second main hinge hole 712, a middle third main hinge hole 713, a middle rear fourth main hinge hole 714 and a rear fifth main hinge hole 715; the first main hinge hole 711 is hinged with the inner side of the first splint moving plate 3; the second main hinge hole 712 is hinged to one end of the first hinge rod 72, and the other end of the first hinge rod 72 is hinged to the inner side of the third splint moving plate 5; the third main hinge hole 713 is hinged to one end of the second hinge lever 73; the other end of the second hinge rod 73 is hinged to the middle of the frame 1 through a hinge column 721; the fourth main hinge hole 714 is hinged to one end of the third hinge rod 74, and the other end of the third hinge rod 74 is hinged to the inner side of the fourth clamping moving plate 6; the fifth main hinge hole 715 is hinged to one end of the fourth hinge lever 75, and the other end of the fourth hinge lever 75 is hinged to the inner side of the second clamp moving plate 4; the driving motor 76 is provided on the second hinge lever 73. The hinged parts of the first clamping plate moving plate 3, the second clamping plate moving plate 4, the third clamping plate moving plate 5 and the fourth clamping plate moving plate 6 are respectively provided with a hinged shaft sleeve 9 for being hinged and matched, the better clamping plate moving plates can be matched with the hinged rods through the hinged shaft sleeves 9, and the transmission effect is improved. Through the ingenious structural design of drive assembly 7 and the articulated cooperation of many hinge bars, realized the effect with the disposable conveying of multi-disc semiconductor wafer, improved conveying efficiency to promote transmission efficiency and promote and press from both sides tight effect.
In the clamping and conveying method of the semiconductor wafer, the driving motor 76 drives the second hinge rod 73 to rotate clockwise, so that the second hinge rod 73 drives the main hinge rod 71 to rotate, and the joint angle between the main hinge rod 71 and the fourth hinge rod 75 is smaller and smaller; the main hinge rod 71 drives the clamp plates 8 on each clamp plate moving plate to move downwards on the slide rails through the first hinge rod 72, the second hinge rod 73 and the third hinge rod 74, so that the gap between the clamp plates 8 is reduced, and finally the semiconductor wafer between each two clamp plates 8 is clamped for transmission.
In conclusion, the device drives the five clamping plates 8 to move up and down in a hinged manner through the five hinged rods in the driving assembly 7 in a hinged and matched manner, so that the semiconductor wafer between the clamping plates 8 is clamped, the transmission efficiency between the hinged rods is improved, and the clamping effect is improved; a plurality of semiconductor wafers are simultaneously conveyed through the clamping plates 8, so that the conveying efficiency is improved, and the production efficiency is increased; the clamping plate 8 can move better through the first sliding rail 2 and the second sliding rail 21, abrasion to the semiconductor wafer in the clamping process is prevented, the conveying quality of the semiconductor wafer is ensured, and finally the device can prevent the semiconductor wafer from being damaged in the clamping process, prevent the surface of the semiconductor wafer from being abraded in the clamping process and convey multiple semiconductor wafers together.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention, including any reference to the above-mentioned embodiments. Various modifications to these embodiments will be readily apparent to those skilled in the art. The general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. A mechanical clamping device for conveying a semiconductor wafer is characterized in that a manipulator comprises a frame (1), a first slide rail (2), a second slide rail (21), a first clamp plate moving plate (3), a second clamp plate moving plate (4), a third clamp plate moving plate (5), a fourth clamp plate moving plate (6), a driving assembly (7) and five clamp plates (8); the first sliding rail (2) is arranged on the inner wall of one side of the front part of the frame (1); the second sliding rail (21) is arranged on the inner wall of the other side of the front part of the frame (1); the first clamping plate moving plate (3) and the second clamping plate moving plate (4) are respectively arranged on the first sliding rail (2), and the second clamping plate moving plate (4) is positioned below the first clamping plate moving plate (3); the third clamping plate moving plate (5) and the fourth clamping plate moving plate (6) are respectively arranged on the second slide rail (21), and the fourth clamping plate moving plate (6) is positioned below the third clamping plate moving plate (5); the five clamping plates (8) are respectively arranged on the four clamping plate moving plates; the driving assembly (7) comprises a main hinge rod (71), a first hinge rod (72), a second hinge rod (73), a third hinge rod (74), a fourth hinge rod (75) and a driving motor (76); the main hinge rod (71) is provided with a first main hinge hole (711) at the front part, a second main hinge hole (712) at the middle front part, a third main hinge hole (713) at the middle part, a fourth main hinge hole (714) at the middle rear part and a fifth main hinge hole (715) at the rear part; the first main hinge hole (711) is hinged with the inner side of the first splint moving plate (3); the second main hinge hole (712) is hinged with one end of the first hinge rod (72), and the other end of the first hinge rod (72) is hinged with the inner side of the third splint moving plate (5); the third main hinge hole (713) is hinged with one end of the second hinge rod (73); the other end of the second hinge rod (73) is hinged at the middle part of the frame (1) through a hinge column (721); the fourth main hinge hole (714) is hinged with one end of a third hinge rod (74), and the other end of the third hinge rod (74) is hinged with the inner side of the fourth splint moving plate (6); the fifth main hinge hole (715) is hinged with one end of a fourth hinge rod (75), and the other end of the fourth hinge rod (75) is hinged with the inner side of the second splint moving plate (4); the driving motor (76) is arranged on the second hinged rod (73).
2. A mechanical clamping device for semiconductor wafer transfer as claimed in claim 1 wherein said five clamping plates (8) comprise a first clamping plate (81), a second clamping plate (82), a third clamping plate (83), a fourth clamping plate (84) and a fifth clamping plate (85); the first clamping plate (81) is arranged on the top surface of the first clamping plate moving plate (3); the second clamping plate (82) is arranged on the top surface of the third clamping plate moving plate (5), and the third clamping plate (83) is arranged on the bottom surface of the third clamping plate moving plate (5); the fourth clamping plate (84) is arranged on the top surface of the fourth clamping plate moving plate (6); the five clamping plates (8) are arranged on the second clamping plate moving plate.
3. A mechanical clamping device for semiconductor wafer transfer as claimed in claim 1 wherein each of said five clamping plates (8) is U-shaped flat.
4. The mechanical clamping device for conveying the semiconductor wafer as recited in claim 1, wherein the first slide rail (2) and the second slide rail (21) are two, and the first slide rail (2) and the second slide rail (21) are vertically and symmetrically arranged on the inner walls of the left side and the right side of the frame (1).
5. The mechanical clamping device for transferring semiconductor wafers as claimed in claim 1, wherein the first clamping plate moving plate (3), the second clamping plate moving plate (4), the third clamping plate moving plate (5) and the fourth clamping plate moving plate (6) are all L-shaped in cross section, the vertical plates of the four clamping plate moving plates are slidably connected with the slide rails, and the horizontal plates of the four clamping plate moving plates are fixedly connected with the clamping plates (8).
6. The mechanical clamping device for transferring the semiconductor wafer as claimed in claim 1, wherein the first clamping plate moving plate (3), the second clamping plate moving plate (4), the third clamping plate moving plate (5) and the fourth clamping plate moving plate (6) are respectively provided with a hinge shaft sleeve (9) for hinge fit at the hinge joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910444186.2A CN110148576B (en) | 2019-05-27 | 2019-05-27 | Mechanical clamping device for semiconductor wafer transmission |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910444186.2A CN110148576B (en) | 2019-05-27 | 2019-05-27 | Mechanical clamping device for semiconductor wafer transmission |
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| Publication Number | Publication Date |
|---|---|
| CN110148576A CN110148576A (en) | 2019-08-20 |
| CN110148576B true CN110148576B (en) | 2020-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910444186.2A Active CN110148576B (en) | 2019-05-27 | 2019-05-27 | Mechanical clamping device for semiconductor wafer transmission |
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| CN (1) | CN110148576B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115513109B (en) * | 2022-11-03 | 2023-10-27 | 泓浒(苏州)半导体科技有限公司 | Clamping and conveying device for semiconductor wafer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101390197A (en) * | 2006-02-22 | 2009-03-18 | 株式会社荏原制作所 | Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device |
| CN106449510A (en) * | 2016-09-26 | 2017-02-22 | 天津华海清科机电科技有限公司 | Wafer transmission device |
| CN109003934A (en) * | 2017-06-06 | 2018-12-14 | 泰姆普雷斯艾普公司 | Wafer clamper assembly, system and application thereof |
| CN109346429A (en) * | 2018-11-16 | 2019-02-15 | 罗博特科智能科技股份有限公司 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010283334A (en) * | 2009-05-01 | 2010-12-16 | Hitachi Kokusai Electric Inc | Substrate processing apparatus, and semiconductor device manufacturing method |
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2019
- 2019-05-27 CN CN201910444186.2A patent/CN110148576B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101390197A (en) * | 2006-02-22 | 2009-03-18 | 株式会社荏原制作所 | Substrate treating device, substrate convey device, substrate grasping device, and chemical solution treating device |
| CN106449510A (en) * | 2016-09-26 | 2017-02-22 | 天津华海清科机电科技有限公司 | Wafer transmission device |
| CN109003934A (en) * | 2017-06-06 | 2018-12-14 | 泰姆普雷斯艾普公司 | Wafer clamper assembly, system and application thereof |
| CN109346429A (en) * | 2018-11-16 | 2019-02-15 | 罗博特科智能科技股份有限公司 | A kind of direct plugging-in silicon wafer inserted sheet slice getting device |
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| Publication number | Publication date |
|---|---|
| CN110148576A (en) | 2019-08-20 |
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