SG11201710329TA - Substrate processing system and substrate processing method - Google Patents
Substrate processing system and substrate processing methodInfo
- Publication number
- SG11201710329TA SG11201710329TA SG11201710329TA SG11201710329TA SG11201710329TA SG 11201710329T A SG11201710329T A SG 11201710329TA SG 11201710329T A SG11201710329T A SG 11201710329TA SG 11201710329T A SG11201710329T A SG 11201710329TA SG 11201710329T A SG11201710329T A SG 11201710329TA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate processing
- processing system
- processing method
- substrate
- processing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 2
- 238000003672 processing method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015123461A JP6454611B2 (en) | 2015-06-19 | 2015-06-19 | Substrate processing system and substrate processing method |
PCT/JP2016/067666 WO2016204143A1 (en) | 2015-06-19 | 2016-06-14 | Substrate processing system and substrate processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201710329TA true SG11201710329TA (en) | 2018-01-30 |
Family
ID=57546188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201710329TA SG11201710329TA (en) | 2015-06-19 | 2016-06-14 | Substrate processing system and substrate processing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US10186436B2 (en) |
JP (1) | JP6454611B2 (en) |
KR (1) | KR20180017183A (en) |
CN (1) | CN107636807B (en) |
SG (1) | SG11201710329TA (en) |
TW (1) | TWI687988B (en) |
WO (1) | WO2016204143A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102389689B1 (en) * | 2017-09-04 | 2022-04-22 | 가부시키가이샤 코쿠사이 엘렉트릭 | Substrate processing apparatus, abnormal monitoring method of substrate processing apparatus, and program stored in recording medium |
JP6994899B2 (en) * | 2017-10-20 | 2022-01-14 | 東京エレクトロン株式会社 | Board processing equipment, board processing method and storage medium |
JP7198595B2 (en) * | 2018-05-31 | 2023-01-04 | 東京エレクトロン株式会社 | SUBSTRATE LIQUID PROCESSING METHOD, SUBSTRATE LIQUID PROCESSING APPARATUS AND STORAGE MEDIUM |
KR102461911B1 (en) * | 2018-07-13 | 2022-10-31 | 삼성전자주식회사 | Plasma generator, cleaning liquid processing apparatus, semiconductor cleaning apparatus and cleaning liquid processing method |
US11532493B2 (en) * | 2018-07-30 | 2022-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wet bench and chemical treatment method using the same |
JP2021034561A (en) | 2019-08-23 | 2021-03-01 | キオクシア株式会社 | Semiconductor manufacturing device |
JP7413113B2 (en) * | 2020-03-24 | 2024-01-15 | 株式会社Screenホールディングス | Processing liquid temperature control method, substrate processing method, processing liquid temperature control device, and substrate processing system |
KR102646484B1 (en) * | 2020-12-29 | 2024-03-12 | 세메스 주식회사 | Apparatus for supplying chemical and apparatus for processing substrate having the same |
CN113964067B (en) * | 2021-11-26 | 2022-10-25 | 江苏威森美微电子有限公司 | Wafer etching equipment |
DE102022124098A1 (en) * | 2022-09-20 | 2024-03-21 | Rösler Holding Gmbh | Method and device for chemical smoothing |
CN115376915A (en) * | 2022-10-27 | 2022-11-22 | 合肥新晶集成电路有限公司 | Selective etching method and apparatus |
KR102676373B1 (en) * | 2023-08-07 | 2024-06-19 | 유윤상 | Wet surface treatment apparatus |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0448630A (en) * | 1990-06-14 | 1992-02-18 | Sony Corp | Etching method |
JPH0799175A (en) * | 1993-06-04 | 1995-04-11 | Nippon Steel Corp | Method and apparatus for supplying treatment liquid |
JPH11226387A (en) * | 1998-02-13 | 1999-08-24 | Karasawa Fine:Kk | Treatment by fluid and device therefor |
JPH11253894A (en) * | 1998-03-16 | 1999-09-21 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
US6167891B1 (en) * | 1999-05-25 | 2001-01-02 | Infineon Technologies North America Corp. | Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers |
TW512131B (en) * | 2000-06-08 | 2002-12-01 | Mosel Vitelic Inc | Apparatus and method for controlling boiling conditions of hot phosphoric acid solution with pressure adjustment |
JP3891776B2 (en) | 2000-11-20 | 2007-03-14 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP2003266033A (en) * | 2002-03-15 | 2003-09-24 | Seiko Epson Corp | Washing method and washing apparatus |
EP2055411A1 (en) * | 2007-11-02 | 2009-05-06 | TSW Trierer Stahlwerk GmbH | Method and device for continuous casting of steel |
WO2010073141A1 (en) * | 2008-12-22 | 2010-07-01 | Koninklijke Philips Electronics, N.V. | Liquid oxygen production device and method |
CN102206028B (en) * | 2011-03-28 | 2013-01-02 | 上海百泉生物技术有限公司 | Full-automatic device of producing and purifying biogas and application thereof |
US10964559B2 (en) * | 2014-06-30 | 2021-03-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer etching apparatus and method for controlling etch bath of wafer |
-
2015
- 2015-06-19 JP JP2015123461A patent/JP6454611B2/en active Active
-
2016
- 2016-06-14 WO PCT/JP2016/067666 patent/WO2016204143A1/en active Application Filing
- 2016-06-14 US US15/737,641 patent/US10186436B2/en not_active Expired - Fee Related
- 2016-06-14 CN CN201680029785.2A patent/CN107636807B/en not_active Expired - Fee Related
- 2016-06-14 KR KR1020187001291A patent/KR20180017183A/en active IP Right Grant
- 2016-06-14 SG SG11201710329TA patent/SG11201710329TA/en unknown
- 2016-06-16 TW TW105118889A patent/TWI687988B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN107636807A (en) | 2018-01-26 |
TW201717272A (en) | 2017-05-16 |
JP6454611B2 (en) | 2019-01-16 |
US10186436B2 (en) | 2019-01-22 |
US20180158700A1 (en) | 2018-06-07 |
KR20180017183A (en) | 2018-02-20 |
JP2017011051A (en) | 2017-01-12 |
WO2016204143A1 (en) | 2016-12-22 |
CN107636807B (en) | 2021-06-04 |
TWI687988B (en) | 2020-03-11 |
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