SG11201710329TA - Substrate processing system and substrate processing method - Google Patents

Substrate processing system and substrate processing method

Info

Publication number
SG11201710329TA
SG11201710329TA SG11201710329TA SG11201710329TA SG11201710329TA SG 11201710329T A SG11201710329T A SG 11201710329TA SG 11201710329T A SG11201710329T A SG 11201710329TA SG 11201710329T A SG11201710329T A SG 11201710329TA SG 11201710329T A SG11201710329T A SG 11201710329TA
Authority
SG
Singapore
Prior art keywords
substrate processing
processing system
processing method
substrate
processing
Prior art date
Application number
SG11201710329TA
Inventor
Hirofumi SHOMORI
Atsuo Kimura
Original Assignee
J E T Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by J E T Co Ltd filed Critical J E T Co Ltd
Publication of SG11201710329TA publication Critical patent/SG11201710329TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
SG11201710329TA 2015-06-19 2016-06-14 Substrate processing system and substrate processing method SG11201710329TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015123461A JP6454611B2 (en) 2015-06-19 2015-06-19 Substrate processing system and substrate processing method
PCT/JP2016/067666 WO2016204143A1 (en) 2015-06-19 2016-06-14 Substrate processing system and substrate processing method

Publications (1)

Publication Number Publication Date
SG11201710329TA true SG11201710329TA (en) 2018-01-30

Family

ID=57546188

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201710329TA SG11201710329TA (en) 2015-06-19 2016-06-14 Substrate processing system and substrate processing method

Country Status (7)

Country Link
US (1) US10186436B2 (en)
JP (1) JP6454611B2 (en)
KR (1) KR20180017183A (en)
CN (1) CN107636807B (en)
SG (1) SG11201710329TA (en)
TW (1) TWI687988B (en)
WO (1) WO2016204143A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102389689B1 (en) * 2017-09-04 2022-04-22 가부시키가이샤 코쿠사이 엘렉트릭 Substrate processing apparatus, abnormal monitoring method of substrate processing apparatus, and program stored in recording medium
JP6994899B2 (en) * 2017-10-20 2022-01-14 東京エレクトロン株式会社 Board processing equipment, board processing method and storage medium
JP7198595B2 (en) * 2018-05-31 2023-01-04 東京エレクトロン株式会社 SUBSTRATE LIQUID PROCESSING METHOD, SUBSTRATE LIQUID PROCESSING APPARATUS AND STORAGE MEDIUM
KR102461911B1 (en) * 2018-07-13 2022-10-31 삼성전자주식회사 Plasma generator, cleaning liquid processing apparatus, semiconductor cleaning apparatus and cleaning liquid processing method
US11532493B2 (en) * 2018-07-30 2022-12-20 Taiwan Semiconductor Manufacturing Co., Ltd. Wet bench and chemical treatment method using the same
JP2021034561A (en) 2019-08-23 2021-03-01 キオクシア株式会社 Semiconductor manufacturing device
JP7413113B2 (en) * 2020-03-24 2024-01-15 株式会社Ｓｃｒｅｅｎホールディングス Processing liquid temperature control method, substrate processing method, processing liquid temperature control device, and substrate processing system
KR102646484B1 (en) * 2020-12-29 2024-03-12 세메스 주식회사 Apparatus for supplying chemical and apparatus for processing substrate having the same
CN113964067B (en) * 2021-11-26 2022-10-25 江苏威森美微电子有限公司 Wafer etching equipment
DE102022124098A1 (en) * 2022-09-20 2024-03-21 Rösler Holding Gmbh Method and device for chemical smoothing
CN115376915A (en) * 2022-10-27 2022-11-22 合肥新晶集成电路有限公司 Selective etching method and apparatus
KR102676373B1 (en) * 2023-08-07 2024-06-19 유윤상 Wet surface treatment apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448630A (en) * 1990-06-14 1992-02-18 Sony Corp Etching method
JPH0799175A (en) * 1993-06-04 1995-04-11 Nippon Steel Corp Method and apparatus for supplying treatment liquid
JPH11226387A (en) * 1998-02-13 1999-08-24 Karasawa Fine:Kk Treatment by fluid and device therefor
JPH11253894A (en) * 1998-03-16 1999-09-21 Dainippon Screen Mfg Co Ltd Substrate treating device
US6167891B1 (en) * 1999-05-25 2001-01-02 Infineon Technologies North America Corp. Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers
TW512131B (en) * 2000-06-08 2002-12-01 Mosel Vitelic Inc Apparatus and method for controlling boiling conditions of hot phosphoric acid solution with pressure adjustment
JP3891776B2 (en) 2000-11-20 2007-03-14 大日本スクリーン製造株式会社 Substrate processing equipment
JP2003266033A (en) * 2002-03-15 2003-09-24 Seiko Epson Corp Washing method and washing apparatus
EP2055411A1 (en) * 2007-11-02 2009-05-06 TSW Trierer Stahlwerk GmbH Method and device for continuous casting of steel
WO2010073141A1 (en) * 2008-12-22 2010-07-01 Koninklijke Philips Electronics, N.V. Liquid oxygen production device and method
CN102206028B (en) * 2011-03-28 2013-01-02 上海百泉生物技术有限公司 Full-automatic device of producing and purifying biogas and application thereof
US10964559B2 (en) * 2014-06-30 2021-03-30 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer etching apparatus and method for controlling etch bath of wafer

Also Published As

Publication number Publication date
CN107636807A (en) 2018-01-26
TW201717272A (en) 2017-05-16
JP6454611B2 (en) 2019-01-16
US10186436B2 (en) 2019-01-22
US20180158700A1 (en) 2018-06-07
KR20180017183A (en) 2018-02-20
JP2017011051A (en) 2017-01-12
WO2016204143A1 (en) 2016-12-22
CN107636807B (en) 2021-06-04
TWI687988B (en) 2020-03-11

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