MY181905A - System and method for bi-facial processing of substrates - Google Patents
System and method for bi-facial processing of substratesInfo
- Publication number
- MY181905A MY181905A MYPI2016703040A MYPI2016703040A MY181905A MY 181905 A MY181905 A MY 181905A MY PI2016703040 A MYPI2016703040 A MY PI2016703040A MY PI2016703040 A MYPI2016703040 A MY PI2016703040A MY 181905 A MY181905 A MY 181905A
- Authority
- MY
- Malaysia
- Prior art keywords
- substrates
- carriers
- processing
- chambers
- facial processing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 239000000969 carrier Substances 0.000 abstract 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
A system for processing substrates (1801) in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers (1701, 1702, 1703). The system?s chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor (2010), placed above or below the system?s chambers, returns the carriers to the system?s entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461942594P | 2014-02-20 | 2014-02-20 | |
US201461943999P | 2014-02-24 | 2014-02-24 | |
PCT/US2015/016799 WO2015127191A1 (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
MY181905A true MY181905A (en) | 2021-01-13 |
Family
ID=53879007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2016703040A MY181905A (en) | 2014-02-20 | 2015-02-20 | System and method for bi-facial processing of substrates |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP3108030B1 (en) |
JP (1) | JP6522667B2 (en) |
KR (1) | KR102327286B1 (en) |
CN (1) | CN106460164B (en) |
MY (1) | MY181905A (en) |
SG (3) | SG10201807710WA (en) |
TW (1) | TWI696231B (en) |
WO (1) | WO2015127191A1 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6243898B2 (en) | 2012-04-19 | 2017-12-06 | インテヴァック インコーポレイテッド | Double mask device for solar cell manufacturing |
SG11201406893XA (en) | 2012-04-26 | 2014-11-27 | Intevac Inc | System architecture for vacuum processing |
US10062600B2 (en) | 2012-04-26 | 2018-08-28 | Intevac, Inc. | System and method for bi-facial processing of substrates |
JP6607923B2 (en) | 2014-08-05 | 2019-11-20 | インテヴァック インコーポレイテッド | Implant mask and alignment |
SG10201906641WA (en) * | 2015-10-01 | 2019-09-27 | Intevac Inc | Wafer plate and mask arrangement for substrate fabrication |
US10453728B2 (en) | 2016-11-18 | 2019-10-22 | Applied Materials, Inc. | Exchange and flip chamber design for heterojunction solar cell formation |
TW201836720A (en) * | 2016-12-19 | 2018-10-16 | 英商P2I有限公司 | Improvements relating to surface modification |
DE102017106373A1 (en) * | 2017-03-24 | 2018-09-27 | Nexwafe Gmbh | Process chamber guide, process chamber and method for guiding a substrate carrier to a process position |
CN107245755B (en) * | 2017-04-21 | 2019-05-21 | 深圳技术大学 | Light assisted electrochemical etching device suitable for the synchronous experiment of Multi-example |
KR102006435B1 (en) * | 2017-09-01 | 2019-08-01 | 주식회사 한화 | Boat device |
TWI679506B (en) * | 2018-09-14 | 2019-12-11 | 富揚鋼構有限公司 | Planning method for turning over steel construction materials |
CN108315697B (en) * | 2018-01-16 | 2019-12-10 | 电子科技大学 | Preparation method of double-sided biaxial texture MgO film |
KR101962738B1 (en) * | 2018-04-23 | 2019-03-27 | (주)에이디엠 | Sheet Separating Apparatus and Mask Manufacturing System Having The Same |
WO2019205351A1 (en) * | 2018-04-24 | 2019-10-31 | 君泰创新(北京)科技有限公司 | Double-sided coating apparatus and carrier plate processing unit thereof |
CN108766916A (en) * | 2018-04-28 | 2018-11-06 | 东莞帕萨电子装备有限公司 | Ion implanting runs sheet devices and ion implanting runs piece method |
CN112204164B (en) * | 2018-05-29 | 2022-10-04 | 应用材料公司 | Method for processing a mask in a vacuum system, and vacuum system |
KR102549429B1 (en) * | 2018-05-31 | 2023-06-28 | 어플라이드 머티어리얼스, 인코포레이티드 | Multi-Substrate Processing on Digital Lithography Systems |
CN110600412A (en) * | 2018-06-12 | 2019-12-20 | 君泰创新(北京)科技有限公司 | Positioning transmission mechanism and positioning transmission production system |
TWI693871B (en) * | 2019-01-29 | 2020-05-11 | 友威科技股份有限公司 | Vertical continuous etching machine |
US20220181194A1 (en) | 2019-03-27 | 2022-06-09 | Yaskawa Europe Technology Ltd. | Semiconductor flipper |
KR20210081794A (en) * | 2019-12-24 | 2021-07-02 | 캐논 톡키 가부시키가이샤 | Rotation driving apparatus, film-forming system including the same, manufacturing method of electronic device and carrier for carrying subjectto be carried used in the film-forming apparatus |
KR102593602B1 (en) * | 2021-01-06 | 2023-10-23 | 한화솔루션 주식회사 | Wafer boat and plate for wafer boat |
CN112631087B (en) * | 2021-01-25 | 2022-04-22 | 苏州源卓光电科技有限公司 | Double-face processing system and processing method |
CN114005775A (en) * | 2021-10-29 | 2022-02-01 | 德鸿半导体设备(浙江)有限公司 | Substrate processing system and method |
CN114750057B (en) * | 2022-06-13 | 2022-09-02 | 富芯微电子有限公司 | Back thinning equipment and process for producing composite fast recovery diode |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3775644A (en) * | 1972-09-20 | 1973-11-27 | Communications Satellite Corp | Adjustable microstrip substrate holder |
US5641054A (en) * | 1992-07-07 | 1997-06-24 | Ebara Corporation | Magnetic levitation conveyor apparatus |
JP3732250B2 (en) * | 1995-03-30 | 2006-01-05 | キヤノンアネルバ株式会社 | In-line deposition system |
US6083566A (en) * | 1998-05-26 | 2000-07-04 | Whitesell; Andrew B. | Substrate handling and processing system and method |
US6753534B2 (en) * | 2000-12-08 | 2004-06-22 | Nikon Corporation | Positioning stage with stationary and movable magnet tracks |
US6783534B2 (en) * | 2002-07-29 | 2004-08-31 | Hamid M. Mehdizadeh | Bone wax applicator |
KR100707390B1 (en) * | 2005-12-19 | 2007-04-13 | 주식회사 아바코 | Apparatus for carring glass |
US20090194026A1 (en) * | 2008-01-31 | 2009-08-06 | Burrows Brian H | Processing system for fabricating compound nitride semiconductor devices |
NL2001910C (en) * | 2008-08-22 | 2010-03-10 | Otb Solar Bv | Conveyor assembly and method for conveying a substrate. |
JP5170912B2 (en) * | 2010-03-30 | 2013-03-27 | 住友化学株式会社 | Substrate transport mechanism, polarizing film laminating apparatus, and liquid crystal display manufacturing system including the same |
JP5582895B2 (en) * | 2010-07-09 | 2014-09-03 | キヤノンアネルバ株式会社 | Substrate holder stocker apparatus, substrate processing apparatus, and substrate holder moving method using the substrate holder stocker apparatus |
TW201327712A (en) * | 2011-11-01 | 2013-07-01 | Intevac Inc | System architecture for plasma processing solar wafers |
SG11201403609QA (en) * | 2011-12-27 | 2014-07-30 | Intevac Inc | System architecture for combined static and pass-by processing |
TW201346050A (en) * | 2012-02-06 | 2013-11-16 | Tokyo Electron Ltd | Film-forming apparatus and film-forming method |
JP6243898B2 (en) * | 2012-04-19 | 2017-12-06 | インテヴァック インコーポレイテッド | Double mask device for solar cell manufacturing |
SG11201406893XA (en) * | 2012-04-26 | 2014-11-27 | Intevac Inc | System architecture for vacuum processing |
KR20150048089A (en) * | 2012-04-26 | 2015-05-06 | 인테벡, 인코포레이티드 | Narrow source for physical vapor deposition processing |
-
2015
- 2015-02-20 CN CN201580018902.0A patent/CN106460164B/en not_active Expired - Fee Related
- 2015-02-20 SG SG10201807710WA patent/SG10201807710WA/en unknown
- 2015-02-20 JP JP2016570916A patent/JP6522667B2/en not_active Expired - Fee Related
- 2015-02-20 SG SG10201807691XA patent/SG10201807691XA/en unknown
- 2015-02-20 WO PCT/US2015/016799 patent/WO2015127191A1/en active Application Filing
- 2015-02-20 KR KR1020167024317A patent/KR102327286B1/en active IP Right Grant
- 2015-02-20 SG SG11201606935VA patent/SG11201606935VA/en unknown
- 2015-02-20 EP EP15751417.5A patent/EP3108030B1/en not_active Not-in-force
- 2015-02-20 MY MYPI2016703040A patent/MY181905A/en unknown
- 2015-02-24 TW TW104105775A patent/TWI696231B/en active
Also Published As
Publication number | Publication date |
---|---|
EP3108030A4 (en) | 2017-08-23 |
TWI696231B (en) | 2020-06-11 |
JP6522667B2 (en) | 2019-05-29 |
JP2017512386A (en) | 2017-05-18 |
EP3108030B1 (en) | 2018-09-12 |
SG10201807710WA (en) | 2018-10-30 |
EP3108030A1 (en) | 2016-12-28 |
SG10201807691XA (en) | 2018-10-30 |
SG11201606935VA (en) | 2016-10-28 |
KR102327286B1 (en) | 2021-11-16 |
KR20160137989A (en) | 2016-12-02 |
CN106460164B (en) | 2019-02-22 |
CN106460164A (en) | 2017-02-22 |
TW201541546A (en) | 2015-11-01 |
WO2015127191A1 (en) | 2015-08-27 |
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