SG10202008872VA - Etching method, plasma processing apparatus, and substrate processing system - Google Patents
Etching method, plasma processing apparatus, and substrate processing systemInfo
- Publication number
- SG10202008872VA SG10202008872VA SG10202008872VA SG10202008872VA SG10202008872VA SG 10202008872V A SG10202008872V A SG 10202008872VA SG 10202008872V A SG10202008872V A SG 10202008872VA SG 10202008872V A SG10202008872V A SG 10202008872VA SG 10202008872V A SG10202008872V A SG 10202008872VA
- Authority
- SG
- Singapore
- Prior art keywords
- etching method
- processing apparatus
- processing system
- substrate processing
- plasma processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
- H01L21/31122—Etching inorganic layers by chemical means by dry-etching of layers not containing Si, e.g. PZT, Al2O3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019167063 | 2019-09-13 | ||
JP2020121613A JP2021048390A (en) | 2019-09-13 | 2020-07-15 | Etching method, plasma processing apparatus, and substrate processing system |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202008872VA true SG10202008872VA (en) | 2021-02-25 |
Family
ID=74758385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202008872VA SG10202008872VA (en) | 2019-09-13 | 2020-09-11 | Etching method, plasma processing apparatus, and substrate processing system |
Country Status (2)
Country | Link |
---|---|
US (1) | US11476123B2 (en) |
SG (1) | SG10202008872VA (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7323409B2 (en) * | 2019-10-01 | 2023-08-08 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING METHOD AND PLASMA PROCESSING APPARATUS |
US20230058831A1 (en) * | 2021-08-20 | 2023-02-23 | Applied Materials, Inc. | Molecular layer deposition liner for 3d nand |
WO2023177594A1 (en) * | 2022-03-14 | 2023-09-21 | Lam Research Corporation | Sidewall passivation using aldehyde or isocyanate chemistry for high aspect ratio etch |
US20240112919A1 (en) * | 2022-09-29 | 2024-04-04 | Tokyo Electron Limited | Low-Temperature Etch |
US20240112887A1 (en) * | 2022-09-30 | 2024-04-04 | Tokyo Electron Limited: | In-Situ Adsorbate Formation for Plasma Etch Process |
US20240112888A1 (en) * | 2022-09-30 | 2024-04-04 | Tokyo Electron Limited | In-Situ Adsorbate Formation for Dielectric Etch |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8277670B2 (en) * | 2008-05-13 | 2012-10-02 | Lam Research Corporation | Plasma process with photoresist mask pretreatment |
US8598016B2 (en) * | 2011-06-15 | 2013-12-03 | Applied Materials, Inc. | In-situ deposited mask layer for device singulation by laser scribing and plasma etch |
JP6185305B2 (en) | 2013-06-28 | 2017-08-23 | 東京エレクトロン株式会社 | Plasma etching method and plasma etching apparatus |
US9997373B2 (en) * | 2014-12-04 | 2018-06-12 | Lam Research Corporation | Technique to deposit sidewall passivation for high aspect ratio cylinder etch |
JP2018200925A (en) * | 2017-05-25 | 2018-12-20 | 東京エレクトロン株式会社 | Etching method and etching device |
US10256320B1 (en) * | 2017-10-06 | 2019-04-09 | International Business Machines Corporation | Vertical field-effect-transistors having a silicon oxide layer with controlled thickness |
US10978301B2 (en) * | 2018-08-31 | 2021-04-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Morphology of resist mask prior to etching |
-
2020
- 2020-09-09 US US17/015,088 patent/US11476123B2/en active Active
- 2020-09-11 SG SG10202008872VA patent/SG10202008872VA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US11476123B2 (en) | 2022-10-18 |
US20210082713A1 (en) | 2021-03-18 |
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