CN109240048A - A kind of multistation work stage single exposure molding direct-write photoetching system - Google Patents
A kind of multistation work stage single exposure molding direct-write photoetching system Download PDFInfo
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- CN109240048A CN109240048A CN201811313133.9A CN201811313133A CN109240048A CN 109240048 A CN109240048 A CN 109240048A CN 201811313133 A CN201811313133 A CN 201811313133A CN 109240048 A CN109240048 A CN 109240048A
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- work stage
- direct
- exposure
- write
- workbench
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a kind of multistation work stage single exposures to form direct-write photoetching system, belongs to the quick scan exposure technical field of direct-write type lithography machine.Two table tops no longer carry out stepping during exposure, a table top is during single exposure is molding simultaneously, another table top carries out the operating processes such as upper and lower plates, alignment, highly shortened the time for exposure, has significant increase than the production capacity of current mainstream write-through exposure machine.And no longer frequently left and right moves back and forth light path system, so as to avoid solving since frequently left and right moves back and forth bring and reduces working efficiency, optimal production capacity is not achieved light path system, and easily lead to light path system it is unstable caused by reduce the problem of exposure quality and yield etc..Achieve the effect that improve working efficiency and best production capacity and exposure quality and yield.
Description
Technical field
The present invention relates to a kind of multistation work stage single exposures to form direct-write photoetching system, and it is fast to belong to direct-write type lithography machine
Fast scan exposure technical field.
Background technique
Write-through photoetching technique is that development in recent years is faster, straight to substitute the image of the board-like photoetching technique of traditional exposure mask
Transfer techniques are connect, have increasingly consequence in semiconductor and PCB production field.Relative to traditional board-like light of exposure mask
Lithography, write-through photoetching technique can shorten process flow, and reduce manufacturing cost.
There are mainly two types of for the multi-work piece platform direct-write type lithography machine of mainstream currently on the market: first is that using vertical mode into
Row design, i.e., two work stages are up-down structure.Due to mesa thickness and the needs of mounting structure, two work stages are vertical
Biggish drop is needed on direction, requires focus module and alignment modules must when being focused and being aligned at this time
Need carry out it is large range of move up and down, usually several hundred millimeters of strokes increase structure design difficulty in this way, and frequently
Move up and down, will lead to the reduction of alignment precision and to increase alignment time-consuming.Excessively compact lifting workpiece platform structure also causes
Vacuum system is difficult to install, and substrate movement of the warpage and work stage of substrate itself resulted in high-speed motion can all reduce exposure
Light quality and yield.
Another kind is designed using horizontal direction, i.e., two work stages are tiled configuration.Two work stages are each
From working region in do not interfere with each other, shifting can be controlled by being mounted on step direction motion guide rail to the light path system of base plate exposure
It is dynamic.For one work stage during scan exposure, another work stage carries out the operating processes such as upper and lower plates, alignment.But it is such
In design, accurate light path system need to be moved back and forth frequently left and right, can reduce working efficiency, optimal production capacity is not achieved, and
It is unstable to easily lead to light path system, can also reduce exposure quality and yield.
Summary of the invention
In order to solve presently, there are light path system frequently left and right move back and forth bring reduce working efficiency, be not achieved most
Good production capacity, and the unstable caused problem for reducing exposure quality and yield etc. of light path system is easily led to, the present invention provides
A kind of multistation work stage single exposure forms direct-write photoetching system
The first purpose of this invention is to provide a kind of multistation work stage single exposure molding direct-write photoetching system, institute
State the combined optical path system in system including dual stage face and fixation；For convenience of description, the dual stage face is referred to as A work
Platform and B workbench；The A workbench can be realized the movement in X-direction, Y-direction and Z-direction, and the B workbench can be realized
Movement in Y-direction and Z-direction, the combined optical path system are located in support construction.
Optionally, the mobile range of the A workbench in z-direction is less than the B workbench in z-direction removable
Dynamic range.
Optionally, two row of optical path unit of the combined optical path system is arranged in chiasma type.
Optionally, two motion guide rails of Y-direction are provided in the system, the dual stage face passes through liftable platform respectively
It is arranged on two motion guide rails to realize the movement of the dual stage face in the Y direction respectively, the liftable platform is to realize
The movement of the dual stage face in z-direction, and the movement being additionally provided in X-direction on the motion guide rail where the A workbench is led
Rail is to realize the A workbench in the movement of X-direction.
Optionally, the dual stage face is for carrying substrate to be exposed, and there is drop in z-direction.
Optionally, waterway circulating cooling system or software supervision device are equipped in the optical path unit.
Optionally, the support construction is gantry structure.
Second object of the present invention is to provide a kind of multistation work stage single exposure molding direct-write type lithography machine, institute
Stating litho machine has a kind of above-mentioned multistation work stage single exposure molding direct-write photoetching system.
Third object of the present invention is to provide a kind of single exposure molding direct-writing photo-etching method, and the method is using upper
A kind of multistation work stage single exposure molding direct-write photoetching system stated or a kind of above-mentioned multistation work stage single exposure
Form direct-write type lithography machine.
Optionally, it is realized the method includes single-station and multistation realizes two kinds of implementations.
The medicine have the advantages that
Multistation work stage direct-write photoetching system provided by the invention significantly reduces the complexity of gantry structure.Two platforms
Face no longer carries out stepping during exposure, while a table top is during single exposure is molding, another table top into
The operating processes such as row upper and lower plates, alignment, highly shortened the time for exposure, and the production capacity than current mainstream write-through exposure machine has
It is significant to increase.And no longer frequently left and right moves back and forth light path system, so as to avoid solving since light path system is frequently left
Right reciprocating movement bring reduces working efficiency, optimal production capacity is not achieved, and it is unstable caused to easily lead to light path system
Reduce the problem of exposure quality and yield etc..The effect for improving working efficiency and best production capacity and exposure quality and yield is reached
Fruit.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is agent structure schematic diagram of the present invention, and 7 be A workbench, and 8 be B workbench, and 9 be light path system, and 10 be alignment
System, 11 be gantry structure；
Fig. 2 is combined optical path system arrangement schematic diagram of the present invention；
Fig. 3 is multistation work stage direct-write photoetching system working method schematic diagram one of the present invention；
Fig. 4 is multistation work stage direct-write photoetching system working method schematic diagram two of the present invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
Embodiment one:
The present embodiment provides a kind of multistation work stage single exposures to form direct-write type lithography machine, which includes multiplexing
Position work stage direct-write photoetching system includes the combined optical path system of dual stage face and fixation in the system；For convenience of description, will
The dual stage face is referred to as A workbench and B workbench；The A workbench can be realized in X-direction, Y-direction and Z-direction
Mobile, the B workbench can be realized the movement in Y-direction and Z-direction, and the combined optical path system is located in support construction.
The mobile range of the A workbench in z-direction is less than the mobile range of the B workbench in z-direction.
Two row of optical path unit of the combined optical path system is arranged in chiasma type；Including multiple combinations mode, Fig. 2 is listed
Several combinations therein.
For realize A workbench in X-direction, Y-direction and Z-direction movement, B workbench in the Y direction with the shifting in Z-direction
It is dynamic, referring to Fig. 1, two motion guide rails of Y-direction are provided in the system, the dual stage face passes through liftable platform respectively and is arranged
To realize the movement of the dual stage face in the Y direction respectively on two motion guide rails, the liftable platform is described to realize
The movement of dual stage face in z-direction, and be additionally provided on the motion guide rail where the A workbench motion guide rail in X-direction with
Realize the A workbench in the movement of X-direction.
There is drop in z-direction for carrying substrate to be exposed in the dual stage face.
Waterway circulating cooling system or software supervision device are equipped in the optical path unit.
The support construction is gantry structure.
Multistation work stage direct-write lithography machine provided by the invention significantly reduces the complexity of gantry structure.Two table tops
Stepping is no longer carried out during exposure, while a table top, during single exposure is molding, another table top carries out
The operating processes such as upper and lower plates, alignment, highly shortened the time for exposure, have than the production capacity of current mainstream write-through exposure machine aobvious
The increase of work.And light path system is no longer frequently controlled and is moved back and forth, so as to avoid solving since light path system frequently controls
Moving back and forth bring reduces working efficiency, optimal production capacity is not achieved, and easily leads to the unstable caused drop of light path system
The problem of low exposure quality and yield etc..The effect for improving working efficiency and best production capacity and exposure quality and yield is reached
Fruit.
Embodiment two
The present embodiment provides a kind of single exposures to form direct-writing photo-etching method, using the multistation work provided in embodiment one
Part platform single exposure forms direct-write type lithography machine, realizes the method includes single-station and multistation realizes two kinds of implementations,
Possible two kinds of implementations are exemplified below, are introduced separately below:
Embodiment one, in the embodiment, the initial position relationship of A workbench and B workbench is overlying relation,
And there is drop in z-direction in the two, can single-station realize, please refer in Fig. 3 shown in 1；
The described method includes:
(1) A work stage 7 starts feeding for after upper sheet stock blanking；Substrate to be exposed is put to A work stage 7, such as
In Fig. 3 shown in 1；
(2) A work stage Y-direction movement alignment, B work stage Z-direction movement rise, by upper sheet stock blanking after, start on
Material, as shown in 2 in Fig. 3；It, may be because of wait expose during being aligned to Barebone 10 to A work stage in the step
The difference of photopolymer substrate thickness needs that a small range is mobile in z-direction by lifting platform, usual moving range be tens millimeters with
It is interior；And B work stage needs to rise after the movement of A work stage Y-direction blanking, feeding, the usually several hundred millis of moving range in the Z-direction
Rice；
(3) after the completion of A work stage 7 is aligned, X is covered by light path system 9 to moving to longitudinal extent, starts to expose, such as Fig. 3
In shown in 3；
(4) X is exited to movement after the exposure of A work stage, B work stage Y-direction movement alignment, exposure, as shown in 4 in Fig. 3,
Equally, in this step, B work stage Y-direction moves to longitudinal extent and is covered by light path system 9, is carrying out to Barebone 10 to it pair
In quasi- process, it is also possible to which because the difference of substrate thickness to be exposed is needed, by lifting platform, a small range is moved in z-direction
It is dynamic；
(5) A work stage Y-direction movement is exited, in B work stage exposure process, as shown in 5 in Fig. 3；
(6) A work stage X carries out blanking, feeding to discharge position up and down is moved to, as shown in 6 in Fig. 3；
(7) process of (1)-(6) is repeated.
Embodiment two, in the embodiment, the initial position relationship of A workbench and B workbench is left and right juxtaposed positions
Relationship, and the two is in z-direction without drop, can double-station realize, please refer in Fig. 4 shown in 1；
The described method includes:
(1) B work stage starts feeding for after upper sheet stock blanking, after A work stage is by upper sheet stock blanking,
Start feeding, as shown in 1 in Fig. 4；In actual mechanical process, A work stage and B work stage can independent upper and lower plates, it is non-interference；
(2) B work stage Y-direction movement alignment；In the step, B work stage Y-direction moves to longitudinal extent and is covered by light path system 9
Lid may need to pass through liter because of the difference of substrate thickness to be exposed during being directed at it Barebone 10
Dropping platform, a small range is mobile in z-direction, and usual moving range is within tens millimeters, as shown in 2 in Fig. 4；
(3) B work stage exposes, the movement alignment of A work stage Y-direction；Equally, in the step, A work stage is right to Barebone 10
During it is aligned, it may be needed because of the difference of substrate thickness to be exposed through lifting platform small model in z-direction
Interior movement is enclosed, usual moving range is within tens millimeters, as shown in 3 in Fig. 4；
(4) exposure of B work stage finishes Z-direction movement and reduces, and A work stage X is exposed to movement；In the step, A work stage X to
It moves to longitudinal extent to be covered by light path system 9, the exposure of B work stage finishes Z-direction movement and reduces, and moving range is logical in z-direction
Normal several hundred millimeters, as shown in 4 in Fig. 4.
(5) blanking is exited in B work stage Y-direction movement, prepares a sheet stock up and down, and the exposure of A work stage finishes X to movement, such as Fig. 4
In shown in 5；
(6) blanking is exited in A work stage Y-direction movement, prepares a sheet stock up and down, as shown in 6 in Fig. 4；
(7) process of (1)-(6) is repeated.
It needs to be illustrated, single-station is also possible in above embodiment two and is realized, but single-station realization side
Formula is compared with double-station implementation real work low efficiency.
The multistation work stage that single exposure molding direct-writing photo-etching method provided by the invention is provided using embodiment one is straight
The write lithography machine litho machine significantly reduces the complexity of gantry structure.In its exposure process no matter two platforms of which kind of embodiment
Face no longer carries out stepping, while a table top, during single exposure is molding, another table top carries out upper and lower plates, alignment etc.
Operating process highly shortened the time for exposure, have significant increase than the production capacity of current mainstream write-through exposure machine.And light
No longer frequently left and right moves back and forth road system, so as to avoid solving since frequently left and right moves back and forth bring to light path system
Reduce working efficiency, optimal production capacity be not achieved, and easily lead to light path system it is unstable caused by reduce exposure quality and good
The problem of rate etc..Achieve the effect that improve working efficiency and best production capacity and exposure quality and yield.
Part steps in the embodiment of the present invention, can use software realization, and corresponding software program can store can
In the storage medium of reading, such as CD or hard disk.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of multistation work stage single exposure forms direct-write photoetching system, which is characterized in that include dual stage in the system
The combined optical path system of face and fixation；For convenience of description, the dual stage face is referred to as A workbench and B workbench；It is described
A workbench can be realized the movement in X-direction, Y-direction and Z-direction, and the B workbench can be realized in Y-direction and Z-direction
Mobile, the combined optical path system is located in support construction.
2. a kind of multistation work stage direct-write photoetching system according to claim 1, which is characterized in that the A workbench
Mobile range in z-direction is less than the mobile range of the B workbench in z-direction.
3. a kind of multistation work stage direct-write photoetching system according to claim 1 or 2, which is characterized in that the combination
Two row of optical path unit of light path system is arranged in chiasma type.
4. a kind of multistation work stage direct-write photoetching system according to claim 1 to 3, which is characterized in that the system
Two motion guide rails of Y-direction are provided in system, the dual stage face passes through liftable platform respectively and is arranged on two motion guide rails
To realize the movement of the dual stage face in the Y direction respectively, the liftable platform is to realize the dual stage face in z-direction
It is mobile, and the motion guide rail in X-direction is additionally provided on the motion guide rail where the A workbench to realize the A workbench in X
The movement in direction.
5. a kind of multistation work stage direct-write photoetching system according to claim 1 to 4, which is characterized in that described double
There is drop in z-direction for carrying substrate to be exposed in table top.
6. -5 any a kind of multistation work stage direct-write photoetching system according to claim 1, which is characterized in that the light
Waterway circulating cooling system or software supervision device are equipped in the unit of road.
7. -6 any a kind of multistation work stage direct-write photoetching system according to claim 1, which is characterized in that the branch
Support structure is gantry structure.
8. a kind of multistation work stage single exposure forms direct-write type lithography machine, which is characterized in that the litho machine has right
It is required that a kind of any multistation work stage single exposure of 1-7 forms direct-write photoetching system.
9. a kind of single exposure forms direct-writing photo-etching method, which is characterized in that the method is any described using claim 1-7
A kind of multistation work stage single exposure molding direct-write photoetching system or multistation work stage according to any one of claims 8 once expose
Seterolithography direct-write type lithography machine.
10. a kind of single exposure according to claim 9 forms direct-writing photo-etching method, which is characterized in that the method packet
Single-station is included to realize and multistation two kinds of implementations of realization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313133.9A CN109240048A (en) | 2018-11-06 | 2018-11-06 | A kind of multistation work stage single exposure molding direct-write photoetching system |
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|---|---|---|---|
| CN201811313133.9A CN109240048A (en) | 2018-11-06 | 2018-11-06 | A kind of multistation work stage single exposure molding direct-write photoetching system |
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| CN110187608A (en) * | 2019-05-21 | 2019-08-30 | 苏州源卓光电科技有限公司 | A kind of exposure method of write-through exposure machine |
| CN112077999A (en) * | 2020-09-17 | 2020-12-15 | 佛山市南海鑫隆机工机械有限公司 | Hollow mould grouting device |
| CN112147849A (en) * | 2019-06-28 | 2020-12-29 | 上海微电子装备（集团）股份有限公司 | Exposure device, photoetching equipment and exposure method |
| CN112698549A (en) * | 2019-10-22 | 2021-04-23 | 苏州源卓光电科技有限公司 | Double-table-board direct-writing type exposure machine and exposure method thereof |
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| CN112077999A (en) * | 2020-09-17 | 2020-12-15 | 佛山市南海鑫隆机工机械有限公司 | Hollow mould grouting device |
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