CN116909108A - Non-contact exposure equipment and exposure method - Google Patents
Non-contact exposure equipment and exposure method Download PDFInfo
- Publication number
- CN116909108A CN116909108A CN202310947550.3A CN202310947550A CN116909108A CN 116909108 A CN116909108 A CN 116909108A CN 202310947550 A CN202310947550 A CN 202310947550A CN 116909108 A CN116909108 A CN 116909108A
- Authority
- CN
- China
- Prior art keywords
- module
- exposure
- feeding
- positioning
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 230000003287 optical effect Effects 0.000 claims abstract description 40
- 230000000007 visual effect Effects 0.000 claims abstract description 16
- 238000005259 measurement Methods 0.000 claims abstract description 14
- 238000012545 processing Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 10
- 238000007664 blowing Methods 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 7
- 230000003749 cleanliness Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 238000003384 imaging method Methods 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 238000000059 patterning Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The application provides non-contact exposure equipment and an exposure method, which belong to the field of copper plating imaging of batteries in the photovoltaic industry, wherein the exposure equipment comprises a mask support module, a feeding module, an exposure optical module, a positioning camera module, a thickness measuring module and a control module which are arranged on a chassis; the feeding module is used for leveling, transmitting, positioning and heightening the product relative to the mask supporting module; the positioning camera module is arranged on the exposure optical module and used for positioning the product below; the thickness detection module detects the thickness of the product on the feeding module; the exposure method comprises the steps of no-load leveling, feeding, thickness measurement, visual positioning, product plane alignment, height adjustment, exposure and the like. The scheme of the application has the advantages of simple structure, easy implementation, convenient maintenance, low cost and high precision, and can be popularized and applied in the field of battery piece imaging.
Description
Technical Field
The application belongs to the field of battery copper plating patterning in the photovoltaic industry, and particularly relates to non-contact exposure equipment and an exposure method.
Background
Currently, in the photovoltaic industry, as a P-type battery approaches an efficiency limit, an N-type battery gradually expands to replace the P-type battery. The proportion of the N type in the production expansion planning published in 2022 is definitely 56%, the cost proportion of the slurry end is raised along with the production expansion and landing of the N type battery, meanwhile, the limited silver ore yield cannot support the rapid increase of the photovoltaic silver demand, and the industry is promoted to continuously perform silver reduction and silver removal exploration.
The electroplated copper is used as a final stage technology of silver removal, which is not only a cost reduction technology, but also an effect improvement technology. The HJT battery adopts a low-temperature process due to the film layer, only low-temperature silver paste can be adopted, and the low-temperature silver paste is a mixture of pure silver and organic matters, so that the conductivity is poor, and the consumption of silver paste is high; the silver-coated copper slurry is expected to be produced in mass in the early stages of the present year, but the problem of silver consumption still cannot be thoroughly solved; the pure copper electrode prepared by the copper electroplating process has the advantages of obviously smaller resistance than low-temperature silver paste containing organic impurities, larger aspect ratio, less shading, hopeful line width reduction below 20m, and higher conversion efficiency while 'desilverization'.
The patterning link is a core breakthrough point of the copper electroplating technology and can be realized by mask photoetching or laser. Mask lithography is mainly to etch grooves in the plating area by exposure and development on the surface of a substrate coated with a photosensitive material. The mask lithography has the advantages that once the pattern scheme is determined, the exposure pattern precision and the exposure uniformity are solved, the mask lithography has great capacity improvement potential, is beneficial to reducing the equipment investment of the electroplating process and is beneficial to the popularization of the electroplating process in the photovoltaic industry.
The current market does not aim at the related mature exposure equipment with high resolution and high productivity in the photovoltaic industry, so the patterning process such as copper electroplating and the like is oriented, and the exposure equipment which can be produced in batch, has low cost and is convenient for later maintenance needs to be designed.
Disclosure of Invention
In order to overcome the defects in the prior art, the application aims to provide a non-contact exposure device and an exposure method, which can solve the problems.
A non-contact exposure device comprises a mask supporting module, a feeding module, an exposure optical module, a positioning camera module, a thickness measuring module and a control module which are arranged on a chassis; the mask supporting module is used for supporting and positioning the mask plate; the feeding module is used for leveling, transmitting, positioning and heightening the product to be exposed relative to the mask supporting module; the exposure optical module is used for providing an exposure light source for the mask supporting module; a positioning camera module is arranged on the exposure optical module and used for positioning the product below; the thickness measuring module is used for detecting the thickness of the product on the feeding module; the control module is in telecommunication connection with the feeding module, the exposure optical module, the positioning camera module and the thickness measuring module and is used for controlling equipment.
Further, the mask support module is fixed to the chassis, and a material level processing chamber is formed below the mask support module; the material loading module is equipped with material loading position and processing position in material transmission's X upwards, is used for placing the product at the material loading position, and the processing position is located the processing room department that the mask supported the module below and is used for the location and the heightening of product.
Further, the exposure optical module is arranged at one side of the mask supporting module and is used for providing exposure light sources emergent in parallel.
Further, the positioning camera module is mounted at the front end of the exposure optical module, and the positioning camera module moves along the X direction or the X direction and the Z direction and cooperates with the exposure optical module to realize visual positioning of the product.
Further, the control module of the non-contact exposure device comprises a controller and a control button group, and is used for controlling the operation of the feeding module, the exposure optical module and the positioning camera module.
Further, the control module of the non-contact exposure equipment further comprises a display console for adjusting and displaying the operation parameters of the equipment.
Further, a pattern proportioning lens is arranged between the mask supporting module and the feeding module and is used for scaling the mask pattern to the surface of the product to be exposed.
Furthermore, a protective layer in a blowing and/or sucking mode is arranged below the mask support module or the pattern proportioning lens and is used for ensuring the cleanliness between the lower surface of the mask plate and the upper surface of a product to be exposed.
The application also provides an exposure method, which comprises the following steps.
S1, no-load leveling, namely leveling a carrier of a feeding module in a no-load state and recording data;
s2, feeding, wherein the feeding module receives the battery piece to be exposed.
S3, thickness measurement is carried out on the battery piece on the feeding module through the thickness measurement module, if the thickness is within the current exposure set thickness range, the feeding is judged to be OK, and the next step is carried out; and if the thickness exceeds the current exposure set thickness range, determining feeding NG, returning the feeding module to the feeding position for feeding again for thickness measurement until the feeding is OK.
S4, performing visual positioning, wherein the positioning camera module performs image acquisition on the characteristic positions of the battery pieces to complete the visual positioning.
And S5, aligning the product plane, and adjusting the battery piece relative to the mask plate in the horizontal plane according to the visual positioning result to finish alignment.
S6, adjusting the height of the battery piece to be a processing height according to the thickness measurement data and the alignment data by the feeding module.
And S7, exposing, namely moving the exposure optical module to an exposure position to start an exposure light source, and completing exposure of the battery piece below.
And S8, repeating the steps S2-S7, and continuously exposing the battery pieces until the exposure of the battery pieces with the required number is completed.
The application has the beneficial effects that: the non-contact exposure equipment disclosed by the application has the advantages of simple structure, convenience in maintenance, low cost, high precision and large productivity, and can be popularized and applied in the field of battery piece patterning.
Drawings
FIG. 1 is a schematic view of a structure of a noncontact exposure apparatus;
FIG. 2 is a schematic diagram of an apparatus for cooling a light source using a chiller;
FIG. 3 is a schematic view showing a part of the structure of an exposure apparatus provided with a protective layer;
FIG. 4 is a schematic view showing a part of the structure of an exposure apparatus provided with a pattern proportioning lens and a protective layer;
fig. 5 is a flow chart of the exposure method.
In the drawing the view of the figure,
1000. a chassis;
100. a mask support module; 110. a protective layer; 120. a graphic proportioning lens;
200. a feeding module;
300. an exposure optical module; 310. an exposure head;
400. positioning a camera module;
500. a thickness measuring module;
600. a control button group;
700. a display console;
800. and a water chiller.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be appreciated that "apparatus," "device," "unit," and/or "module" as used in this specification is a means for distinguishing between different components, elements, parts, portions, or assemblies at different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.
As used in this specification and the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus.
A flowchart is used in this specification to describe the operations performed by the system according to embodiments of the present specification. It should be appreciated that the preceding or following operations are not necessarily performed in order precisely. Rather, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.
Exposure apparatus
Referring to fig. 1, the non-contact exposure apparatus includes a mask support module 100, a loading module 200, an exposure optical module 300, a positioning camera module 400, a thickness measuring module 500, and a control module, which are mounted on a chassis 1000.
Arrangement and function of each part: the mask support module 100 is used for supporting and positioning a mask; the feeding module 200 is used for leveling, transmitting, positioning and heightening a product to be exposed relative to the mask supporting module 100; the exposure optical module 300 is used for providing an exposure light source for the mask support module 100; a positioning camera module 400 mounted on the exposure optical module 300 for positioning the product below; the thickness measuring module 500 is arranged above the feeding stroke of the feeding module 200 and is used for detecting the thickness of a product on the feeding module 200; the control module is in telecommunication connection with the feeding module 200, the exposure optical module 300, the positioning camera module 400 and the thickness measuring module 500 and is used for controlling equipment.
Wherein the mask support module 100 is fixed to the bottom frame 1000, and a level processing chamber is formed below the mask support module 100. During processing, the product to be processed is placed in the level processing chamber.
The mask support module 100 generally includes a gantry or pi-type mask frame on which a mask plate supporting a mask is horizontally disposed. The material level processing chamber is formed by the mask frame, and the mask frame is provided with a processing inlet and outlet door from two opposite sides, and the feeding module 200 enters and exits.
Wherein, the feeding module 200 is provided with a feeding position and a processing position in the X direction of the material transfer, wherein the feeding position is used for placing a product, and the processing position is located in a processing chamber below the mask supporting module 100 and is used for positioning and heightening the product. Here, the working distance corresponding to the height adjustment is defined as a gap between the product to be processed and the equipment module (specifically, the mask support module 100), and the working distance is preset to be 0-200mm.
Specifically, the feeding module 200 includes a feeding driving assembly, a carrier adjusting assembly and a carrier, the feeding driving assembly adopts a motor-screw-slide rail slider mechanism, the carrier adjusting assembly includes a multi-degree-of-freedom adjusting member, and the carrier adopts a mechanical or vacuum adsorption supporting mode, preferably vacuum adsorption.
The exposure optical module 300 is disposed at one side of the mask support module 100, and the exposure head 310 of the exposure optical module 300 is close to or far from the mask support module 100 in the Y direction, for providing an exposure light source that emits vertically downward and in parallel. Of course, the light source emitting direction is not limited to being vertically arranged downwards, and other feasible schemes such as horizontal, inclined and the like can be adopted.
Specifically, the exposure optical module 300 includes a light source mounting frame, a light source driving assembly, an exposure light source, a light source anti-collision assembly, and a light source displacement monitoring assembly. The light source mounting frame is fixed on one side of the mask supporting module 100, the exposure light source is arranged on the light source mounting frame in a driving mode through the light source driving assembly, and the moving direction of the exposure light source is perpendicular to the feeding and discharging moving direction of the feeding module 200.
The positioning camera module 400 is mounted at the front end of the exposure optical module 300, and the positioning camera module 400 moves along the X direction or the X direction and the Z direction and cooperates with the Y direction of the exposure optical module 300 to realize visual positioning of the product below.
Specifically, the positioning camera module 400 performs image acquisition on three feature positions of the battery plate below by using three points, so as to complete visual positioning.
Referring to fig. 1, the thickness measuring module 500 is fixedly disposed at a side of the mask supporting module 100, specifically, a feeding end, and the thickness measuring module 500 protrudes from the feeding end of the mask supporting module 100 for thickness detection of a product on the lower feeding module 200.
The thickness measuring module 500 has various forms, including a contact type sensor with a contact, and a non-contact type thickness measuring sensor such as an eddy current thickness sensor, a magnetic thickness sensor, a capacitance thickness sensor, an ultrasonic thickness sensor, a nuclear radiation thickness sensor, an X-ray thickness sensor, a microwave thickness sensor, etc., and in this example, a non-contact type thickness measuring meter is preferably used. If contact type is adopted, the reduction of contact scratch is considered, and roller contacts and the like are adopted.
Further, the control module of the non-contact exposure apparatus includes a controller and a control button group 600 for manually controlling the operations of the feeding module 200, the exposure optical module 300, and the positioning camera module 400.
Specifically, the control button group 600 includes buttons for switching, feeding, alignment, thickness measurement, exposure, scram, etc. using different colors or shapes. And will not be described in detail herein. The device is mainly used for controlling the feeding module 200, the exposure optical module 300, the positioning camera module 400 and the thickness measuring module 500.
Further, the control module of the non-contact exposure apparatus further includes a display console 700 for adjusting and displaying the operation parameters of the apparatus. The display console 700 specifically includes a mouse for input, a keyboard, a display for display, and the like.
Further, referring to fig. 3 and 4, a protective layer 110 for blowing and/or sucking is disposed under the mask support module 100 or the pattern proportioning lens, so as to ensure the cleanliness between the lower surface of the mask plate or the pattern proportioning lens and the upper surface of the product to be exposed.
The air blowing and/or air suction modes are an air knife mode, a multi-row air nozzle mode and the like, and the arrangement mode can be single-side single-group arrangement, opposite-side two-group arrangement or four-side rectangular arrangement. The arrangement modes of suction, blowing and combination of blowing and suction can be adopted. The gas medium for blowing is pure compressed air, nitrogen, inert gas and the like, and can be selected adaptively according to the cost or working environment.
Further, referring to fig. 4, a pattern scaling lens 120 is disposed between the mask support module 100 and the loading module 200 for scaling the mask pattern to the surface of the product to be exposed. Correspondingly, a protective layer 110 of air blowing and/or air sucking modes is arranged below the pattern proportioning lens 120, so as to ensure the cleanliness between the pattern proportioning lens 120 and the upper surface of the product to be exposed.
The pattern proportioning lens 120 can be independently arranged or integrated below the mask supporting module 100, and the scaling ratio of the pattern proportioning lens can be adjusted.
The working distance definition of 0-200mm is further defined as the distance between the upper surface of the product and the lower surface of the mask plate or the pattern proportioning lens, and 0-200mm is only an exemplary distance, and can be specifically selected according to actual products and machine types, such as 1um, 10um, … …, 100um, 200um, 300um … …, 1mm, 5mm, … …, 200mm and the like, and the stepless continuous adjustment can be realized by setting the working distance to be multiple-stage adjustment.
The device supports one or more simultaneous exposure, that is, the feeding module 200 can support products with different specifications and sizes, for example, the sizes of silicon wafers are as follows: 182 half pieces, 210 half pieces, 230 x 230 whole pieces, 159 x 159 whole pieces of silicon wafers and the like can simultaneously support single pieces or multiple pieces of the same or different models for exposure processing.
The ratio of reticle pattern to projected pattern may be 1: n (N.gtoreq.1), the projection ratio is preferably 1:1.
of course, for high-precision high-energy processing, N is 1 (N is more than or equal to 1), and the processing precision range is selected according to practical adaptation.
Further, referring to fig. 2, a schematic diagram of an embodiment of a non-contact exposure apparatus equipped with a chiller 800 is provided, where the chiller 800 is used to control the operating temperature of the exposure optical module 300. Of course, the air-cooled light source does not need to be equipped with the water chiller, and further, a cooling mechanism is not required, depending on the actual requirement of the exposure optical module 300.
Exposure method
Referring to fig. 5, the exposure method based on the aforementioned non-contact exposure apparatus includes:
s1, no-load leveling, namely leveling the carrier of the feeding module 200 in a no-load state and recording data.
Specifically, the loading module 200 is moved from the loading position to a processing position directly below the mask support module 100 in an empty load, levels the carrier of the loading module 200, and records data.
The leveling here can be manual or automatic, preferably automatically, to increase the efficiency. The loading platform of the feeding module 200 adopts vacuum adsorption to the battery piece to be exposed, and is compatible with 159/166mm whole piece and 182/210mm half piece/230 mm whole piece.
Before this, the mask supporting module 100 is replaced with a mask corresponding to the lot of the battery cells to be exposed. The Mask support module 100 is required to perform the replacement of the Mask within 10 minutes as a whole.
S2, feeding, wherein the feeding module 200 receives a battery piece to be exposed; specifically, the loading module 200 is moved to the loading position, and the battery piece to be exposed is placed on the stage of the loading module 200.
S3, thickness measurement is carried out on the battery piece on the feeding module 200 through the thickness measurement module 500, if the thickness is within the current exposure set thickness range, the feeding is judged to be OK, and the next step is carried out; and if the thickness exceeds the current exposure set thickness range, determining feeding NG, and returning the feeding module 200 to the feeding position for feeding again for thickness measurement until the feeding is OK.
The feeding module 200 moves the supported battery piece to a thickness measuring station, and thickness detection is performed on the battery piece below through the thickness measuring module 500 at the thickness measuring station.
S4, performing visual positioning, namely performing image acquisition on three characteristic positions of the battery piece by using the positioning camera module 400, and completing the visual positioning. Specifically, the loading module 200 moves the battery piece to the processing position, the exposure optical module 300 drives the positioning camera module 400 to move to the upper part of the mask supporting module 100, and the visual positioning is completed by performing image acquisition on three characteristic positions of the battery piece.
S5, aligning the product plane, and adjusting the battery piece relative to the mask in the plane according to the visual positioning result to finish alignment;
according to the visual positioning result, the carrier of the feeding module 200 moves in the X-Y plane and rotates around the Z axis, so that the battery piece is adjusted in the plane relative to the mask on the mask supporting module 100, and alignment is completed.
S6, adjusting the height of the battery piece to be a processing height according to the thickness measurement data and the alignment data by the feeding module 200. Finally, the distance between the lower surface of the mask support module 100 and the adhesive surface of the battery piece is controlled to be 80+ -20 um, and more precisely 70+ -20 um, 60+ -15 um, etc. are preferable.
And S7, exposing, namely moving the exposure optical module 300 to an exposure position to start an exposure light source, and completing exposure of the battery piece below. The lower surface of the mask of the exposure optical module 300 and the mask supporting module 100 has an included angle smaller than 1 deg., and the smaller the parallelism is, the more accurate is. The exposure optical module 300 employs a 12 inch light source, although other larger size light sources are contemplated as technology advances.
And S8, repeating the steps S2-S7, and continuously exposing the battery pieces until the exposure of the battery pieces with the required number is completed.
Storage medium
The present application also provides a computer readable storage medium having stored thereon computer instructions which, when executed, perform the steps of the aforementioned exposure method. The method is described in detail in the foregoing section, and will not be described in detail here.
Those of ordinary skill in the art will appreciate that all or a portion of the steps in the various methods of the above-described embodiments may be implemented by a program that instructs associated hardware, the program may be stored on a computer readable storage medium, including non-transitory and non-transitory, removable and non-removable media, and the information storage may be implemented by any method or technique. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of storage media for a computer include, but are not limited to, phase change memory (PRAM), static Random Access Memory (SRAM), dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), read Only Memory (ROM), electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium, which can be used to store information that can be accessed by a computing device. Computer-readable media, as defined herein, does not include transitory computer-readable media (transshipment) such as modulated data signals and carrier waves.
Terminal
The application also provides a terminal comprising a memory and a processor, the memory having stored thereon data provider information and computer instructions capable of being executed on the processor, the processor executing the steps of the aforementioned method when executing the computer instructions. The method is described in detail in the foregoing section, and will not be described in detail here.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (9)
1. A noncontact exposure apparatus characterized by: the non-contact exposure equipment comprises a mask supporting module (100), a feeding module (200), an exposure optical module (300), a positioning camera module (400), a thickness measuring module (500) and a control module, wherein the mask supporting module (100), the feeding module (200), the exposure optical module (300) and the positioning camera module are arranged on a chassis (1000);
the mask supporting module (100) is used for supporting and positioning a mask;
the feeding module (200) is used for leveling, transmitting, positioning and heightening a product to be exposed relative to the mask supporting module (100);
the exposure optical module (300) is used for providing an exposure light source for the mask supporting module (100);
a positioning camera module (400) is installed on the exposure optical module (300) and is used for positioning the lower product;
the thickness measuring module (500) is used for detecting the thickness of the product on the feeding module (200);
the control module is in telecommunication connection with the feeding module (200), the exposure optical module (300), the positioning camera module (400) and the thickness measuring module (500) and is used for controlling equipment.
2. The noncontact exposure apparatus according to claim 1, characterized in that:
the mask support module (100) is fixed on the underframe (1000) and forms a material level processing chamber below the mask support module (100); the feeding module (200) is provided with a feeding position and a processing position in the X direction of material transmission, the feeding position is used for placing products, and the processing position is located in a processing chamber below the mask supporting module (100) and used for positioning and heightening the products.
3. The noncontact exposure apparatus according to claim 2, characterized in that:
the exposure optical module (300) is arranged at one side of the mask supporting module (100) and is used for providing exposure light sources emergent in parallel.
4. The noncontact exposure apparatus according to claim 1, characterized in that:
the positioning camera module (400) is mounted at the front end of the exposure optical module (300), and the positioning camera module (400) moves along the X direction or the X direction and the Z direction and cooperates with the exposure optical module (300) to realize visual positioning of the product.
5. The noncontact exposure apparatus according to claim 1, characterized in that:
the control module of the non-contact exposure equipment comprises a controller and a control button group (600) and is used for controlling the operation of the feeding module (200), the exposure optical module (300) and the positioning camera module (400).
6. The noncontact exposure apparatus according to claim 1, characterized in that:
the control module of the non-contact exposure apparatus further comprises a display console (700) for adjusting and displaying the operating parameters of the apparatus.
7. The noncontact exposure apparatus according to claim 1, characterized in that:
and a pattern proportioning lens is arranged between the mask supporting module (100) and the feeding module (200) and is used for scaling the mask pattern to the surface of the product to be exposed.
8. The noncontact exposure apparatus according to claim 1 or 7, characterized in that:
and a protective layer in a blowing and/or sucking mode is arranged below the mask support module (100) or the pattern proportioning lens and is used for ensuring the cleanliness between the lower surface of the mask plate and the upper surface of a product to be exposed.
9. An exposure method based on the noncontact exposure apparatus according to any one of claims 1 to 8, characterized in that the exposure method comprises:
s1, no-load leveling, namely leveling a carrier of a feeding module (200) in a no-load state and recording data;
s2, feeding, wherein a feeding module (200) receives a battery piece to be exposed;
s3, thickness measurement is carried out on the battery piece on the feeding module (200) through the thickness measurement module (500), if the thickness is within the current exposure set thickness range, feeding OK is confirmed, and the next step is carried out; if the thickness exceeds the current exposure set thickness range, feeding NG is determined, and the feeding module (200) returns to the feeding position to feed again for thickness measurement until the feeding is OK;
s4, performing visual positioning, wherein the positioning camera module (400) performs image acquisition on three characteristic positions of the battery piece to complete the visual positioning;
s5, aligning the product plane, and adjusting the battery piece relative to the mask in the plane according to the visual positioning result to finish alignment;
s6, adjusting the height of the battery piece to be a processing height according to the thickness measurement data and the alignment data by the feeding module (200);
s7, exposing, namely moving the exposure optical module (300) to an exposure position to start an exposure light source, and completing exposure of the battery piece below;
and S8, repeating the steps S2-S7, and continuously exposing the battery pieces until the exposure of the battery pieces with the required number is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310947550.3A CN116909108A (en) | 2023-07-31 | 2023-07-31 | Non-contact exposure equipment and exposure method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310947550.3A CN116909108A (en) | 2023-07-31 | 2023-07-31 | Non-contact exposure equipment and exposure method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116909108A true CN116909108A (en) | 2023-10-20 |
Family
ID=88364697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310947550.3A Pending CN116909108A (en) | 2023-07-31 | 2023-07-31 | Non-contact exposure equipment and exposure method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116909108A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117406559A (en) * | 2023-11-03 | 2024-01-16 | 苏州天准科技股份有限公司 | Exposure equipment and exposure method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6970228B1 (en) * | 1999-07-16 | 2005-11-29 | Nikon Corporation | Exposure method and system |
| CN106066580A (en) * | 2016-05-31 | 2016-11-02 | 深圳市矽电半导体设备有限公司 | A kind of workbench self adaptation levelling device |
| CN206209288U (en) * | 2016-09-30 | 2017-05-31 | 上海微电子装备有限公司 | The device and exposure device for preventing exposure light shield from polluting |
| CN208432850U (en) * | 2018-08-10 | 2019-01-25 | 上海微电子装备（集团）股份有限公司 | A kind of exposure device |
| CN111352312A (en) * | 2020-04-29 | 2020-06-30 | 中国科学院光电技术研究所 | Multifunctional photoetching device |
| CN219246647U (en) * | 2023-01-09 | 2023-06-23 | 苏州太阳井新能源有限公司 | Solar cell patterning device |
-
2023
- 2023-07-31 CN CN202310947550.3A patent/CN116909108A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6970228B1 (en) * | 1999-07-16 | 2005-11-29 | Nikon Corporation | Exposure method and system |
| CN106066580A (en) * | 2016-05-31 | 2016-11-02 | 深圳市矽电半导体设备有限公司 | A kind of workbench self adaptation levelling device |
| CN206209288U (en) * | 2016-09-30 | 2017-05-31 | 上海微电子装备有限公司 | The device and exposure device for preventing exposure light shield from polluting |
| CN208432850U (en) * | 2018-08-10 | 2019-01-25 | 上海微电子装备（集团）股份有限公司 | A kind of exposure device |
| CN111352312A (en) * | 2020-04-29 | 2020-06-30 | 中国科学院光电技术研究所 | Multifunctional photoetching device |
| CN219246647U (en) * | 2023-01-09 | 2023-06-23 | 苏州太阳井新能源有限公司 | Solar cell patterning device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117406559A (en) * | 2023-11-03 | 2024-01-16 | 苏州天准科技股份有限公司 | Exposure equipment and exposure method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN116909108A (en) | Non-contact exposure equipment and exposure method | |
| US20070252966A1 (en) | Exposure Apparatus, Operation Decision Method, Substrate Processing System, Maintenance Management Method, and Device Manufacuring Method | |
| EP1788618A1 (en) | Substrate processing method | |
| US7364376B2 (en) | Substrate processing apparatus | |
| KR20090120397A (en) | Substrate processing system | |
| CN116974152A (en) | Material conveying device with multiple degrees of freedom leveling and non-contact exposure equipment | |
| JP3571243B2 (en) | Proximity exposure method and apparatus | |
| CN109240048A (en) | A kind of multistation work stage single exposure molding direct-write photoetching system | |
| CN111273521A (en) | Automatic material loading and unloading single-table-board double-station exposure machine | |
| JP2007293376A (en) | Exposure device and method for manufacturing substrate | |
| JP2000031010A (en) | Gap control method for mask and work for proximity exposure and proximity aligner | |
| US7525650B2 (en) | Substrate processing apparatus for performing photolithography | |
| CN101978488A (en) | Control device and control method | |
| JP4020261B2 (en) | Exposure method, exposure apparatus, and substrate manufacturing method | |
| CN106802537B (en) | Bearing machine platform and exposure method | |
| JP4312247B2 (en) | Proximity exposure apparatus and substrate manufacturing method | |
| JP2007298680A (en) | Rubbing device and rubbing method | |
| CN107024832B (en) | Mask inspection device and method thereof | |
| KR101098927B1 (en) | Exposure apparatus | |
| CN114077162A (en) | Photoetching system, substrate handover system and exposure method | |
| JP4312248B2 (en) | Proximity exposure apparatus and substrate manufacturing method | |
| EP3485515A1 (en) | Micro led array as illumination source | |
| JP2009258195A (en) | Proximity exposure device, substrate moving method for proximity exposure device, and method of manufacturing display panel | |
| CN109884860B (en) | Multi-station flexible tape exposure device and exposure method | |
| JP2013205709A (en) | Exposure device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |