CN109729651B - Solder resist process for reducing ghost of white core material circuit board - Google Patents
Solder resist process for reducing ghost of white core material circuit board Download PDFInfo
- Publication number
- CN109729651B CN109729651B CN201910018122.6A CN201910018122A CN109729651B CN 109729651 B CN109729651 B CN 109729651B CN 201910018122 A CN201910018122 A CN 201910018122A CN 109729651 B CN109729651 B CN 109729651B
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- China
- Prior art keywords
- solder resist
- resist ink
- circuit board
- developing
- screen printing
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- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000011162 core material Substances 0.000 title claims abstract description 17
- 238000007650 screen-printing Methods 0.000 claims abstract description 18
- 238000000227 grinding Methods 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 7
- 238000001029 thermal curing Methods 0.000 claims abstract description 7
- 238000005406 washing Methods 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000005507 spraying Methods 0.000 claims abstract description 4
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 238000007790 scraping Methods 0.000 claims description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 abstract description 3
- 235000017550 sodium carbonate Nutrition 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The invention discloses a solder resist process for reducing ghost images of a white core material circuit board, which comprises the following steps in sequence: (a) grinding a plate, (b) screen printing solder resist ink, (c) thermosetting solder resist ink, (d) exposure, (e) developingShadow, (f) detection; when the solder resist ink is subjected to silk-screen printing, the solder resist ink with the viscosity of 130-150 Pa & s is prepared by mixing the ink and boiled oil water, and the thickness of a silk-screen printing film is 15-25 mu m; when the thermal curing solder resist ink is carried out, the working temperature of an oven is 70-75 ℃, and the time lasts for 38-40 min; when exposure is carried out, the vacuumizing negative pressure of the exposure machine is 85 to 90Kpa, and the exposure energy is 8 to 9 levels; when developing, the concentration of Na2CO3 in the developer is 1.0-1.2%, and the developing pressure is 1.8-2.0 Kg/cm2Downward spraying 2.0-2.5 Kg/cm2The temperature of the developing solution is 30-35 ℃, the developing speed is 2.0m/min, and the washing pressure is 1.5-1.8 Kg/cm2The initial drying temperature is 50-60 ℃; ghost appears when reducing the solder mask of the circuit board of white core base plate, improves production efficiency.
Description
Technical Field
The invention relates to a solder mask process of a circuit board, in particular to a solder mask process for reducing ghost images of a white core material circuit board.
Background
The circuit board is a support body of the electronic component and a carrier for electrical connection. The production of the single-layer circuit board comprises the following procedures: opening the board → drilling the slot hole → depositing copper → plating the whole board → making the outer layer circuit → making the solder mask layer → surface treatment → shaping. The solder mask layer is manufactured by coating a layer of solder mask ink on the circuit board of which the outer layer circuit is manufactured except for the positions of a pad, a hole and the like for welding and curing the solder mask ink, so that the circuit board is protected and prevented from being welded. For a circuit board with high light transmittance for a special occasion, a white core material is generally used as a base material for the circuit board of the type, because the circuit board using the white core material as the base material is easy to generate ghost in the exposure process when a solder mask is manufactured, and the performance of the circuit board is affected.
The invention is researched and proposed aiming at the defects of the prior art.
Disclosure of Invention
The invention aims to provide a solder mask process for reducing ghost images of a white core material circuit board, which can reduce the ghost images when a solder mask layer of the circuit board of a white core substrate is manufactured and improve the production efficiency.
In order to solve the technical problem, the invention provides a solder mask process for reducing ghost occurrence of a white core material circuit board, which comprises the following steps in sequence:
(a) grinding a plate;
(b) and (3) screen printing solder resist ink: when the solder resist ink is subjected to silk-screen printing, the solder resist ink with the viscosity of 130-150 Pa & s is prepared by mixing the ink and boiled oil water, and the thickness of a silk-screen printing film is 15-25 mu m;
(c) thermal curing solder resist ink: when the thermal curing solder resist ink is carried out, the working temperature of an oven is 70-80 ℃, and the time lasts for 40-50 min;
(d) exposure: when exposure is carried out, the vacuumizing negative pressure of the exposure machine is 85 to 90kpa, and the exposure energy is 8 to 9 levels;
(e) and (3) developing: when developing, the concentration of Na2CO3 in the developer is 1.0-1.2%, and the developing pressure is 1.8-2.0 kg/cm2Downward spraying 2.0-2.5 kg/cm2The temperature of the developing solution is 30-35 ℃, the developing speed is 2.0m/min, and the washing pressure is 1.5-1.8 kg/cm2The initial drying temperature is 50-60 ℃;
(f) and (6) detecting.
The solder mask process for reducing the occurrence of the ghost image of the white core material circuit board is characterized by comprising the following steps of: when the solder resist ink is subjected to silk-screen printing in the step (b), the Shore hardness of the scraper is 75 ℃, and the silk-screen printing pressure is 2.5-3.0 kg/cm2The scraping degree is 60-65 degrees.
The solder mask process for reducing the occurrence of the ghost image of the white core material circuit board is characterized by comprising the following steps of: when the plate is ground in the step (a), the width of a grinding crack is 10-15 mm, the plate grinding speed is 2.4m/min, and the washing pressure is 1.5-1.8 kg/cm2And the drying temperature is 90-95 ℃.
Compared with the prior art, the invention has the following advantages:
1. the invention can reduce the phenomenon of ghost image when the solder mask of the circuit board of the white core substrate is manufactured, and improve the production efficiency.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
The solder mask process for reducing the occurrence of the ghost image of the white core material circuit board comprises the following steps of:
(a) grinding a plate: placing the circuit board in a board grinding machine, cleaning and roughening the surface of the circuit board, wherein the bonding force between the surface of the circuit board and solder resist ink is improved, the width of a grinding trace is 10-15 mm, the board grinding speed is 2.4m/min, and the washing pressure is 1.5-1.8 kg/cm during board grinding2And the drying temperature is 90-95 ℃.
(b) And (3) screen printing solder resist ink: placing the circuit board in a screen printing machine, uniformly coating solder resist ink on the circuit board, and when carrying out screen printing solder resist ink, preparing the solder resist ink with the viscosity of 130-150 Pa.s by using ink and boiled oil water, wherein the thickness of a screen printing film is 15-25 mu m, the Shore hardness of a scraper is 75, the screen printing pressure is 0.4-0.6 mpa, and the scraping glue degree is 60-65 degrees;
(c) thermal curing solder resist ink: moving the circuit board into an oven for pre-baking to dry the solder resist ink on the circuit board, so that the solder resist ink is primarily cured on the circuit board to form a solder resist ink layer; when the thermal curing solder resist ink is carried out, the working temperature of an oven is 70-75 ℃, and the time lasts for 38-40 min;
(d) exposure: moving the circuit board into an exposure machine, wherein the vacuumizing negative pressure of the exposure machine is 85-90 kpa during exposure, the exposure energy is 8-9 levels, and the amount of the exposure energy can be controlled to control a 21-level exposure ruler meter to display 8 full 9 residues;
(e) and (3) developing: moving the circuit board into a developing machine, wherein the concentration of Na2CO3 in the developing solution is 1.0-1.2%, and the developing pressure is 1.8-2.0 kg/cm2Downward spraying 2.0-2.5 kg/cm2The temperature of the developing solution is 30-35 ℃, the developing speed is 2.0m/min, and the washing pressure is 1.5-1.8 kg/cm2The drying temperature is 50-60 ℃;
(f) and (3) detection: the detection comprises the following steps: visually inspecting the appearance of the circuit board, testing whether the solder resist ink falls off by using 3M adhesive paper, testing whether the thickness of the line edge of the solder resist layer is more than 12 mu M and the line surface is more than 15 mu M, and performing a copper chloride test; and during detection, the detection is executed according to the complete and sufficient requirements of development, and if the residual image exists, the return process treatment is required.
In this embodiment, the circuit board substrate is a white substrate with a model of KB-6150C, manufactured by butazier rod gmbh.
The ink is KSM-S6188-KG25 ink produced by Jiangsu Guangxin photosensitive new material GmbH and matched boiled oil water, 70ml of boiled oil water is added into each kilogram of ink, the mixture is fully stirred for 30min and is kept stand for 20-30 min.
Claims (3)
1. A solder mask process for preventing a white core material circuit board from generating ghost images comprises the following steps of:
(a) grinding a plate;
(b) and (3) screen printing solder resist ink: when the solder resist ink is subjected to silk-screen printing, the solder resist ink with the viscosity of 130-150 Pa & s is prepared by mixing the ink and boiled oil water, and the thickness of a silk-screen printing film is 15-25 mu m;
(c) thermal curing solder resist ink: when the thermal curing solder resist ink is carried out, the working temperature of an oven is 70-75 ℃, and the time lasts for 38-40 min;
(d) exposure: when exposure is carried out, the vacuumizing negative pressure of the exposure machine is 85-90 kpa, and the exposure energy is 8-9 levels;
(e) and (3) developing: when developing, Na in the developer2CO3The concentration of the developer is 1.0-1.2%, and the developing pressure is 1.8-2.0 kg/cm2Downward spraying 2.0-2.5 kg/cm2The temperature of the developing solution is 30-35 ℃, the developing speed is 2.0m/min, and the washing pressure is 1.5-1.8 kg/cm2The initial drying temperature is 50-60 ℃;
(f) and (6) detecting.
2. The solder mask process for preventing the white core material circuit board from generating the ghost image according to claim 1, wherein the solder mask process comprises the following steps: when the solder resist ink is subjected to silk-screen printing in the step (b), the Shore hardness of the scraper is 75, the silk-screen printing pressure is 0.4-0.6 mpa, and the scraping degree is 60-65 degrees.
3. The solder mask process for preventing the white core material circuit board from generating the ghost image according to claim 1, wherein the solder mask process comprises the following steps: when the plate is ground in the step (a), the width of a grinding crack is 10-15 mm, the plate grinding speed is 2.4m/min, and the washing pressure is 1.5-1.8 kg/cm2The drying temperature is 90-95 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910018122.6A CN109729651B (en) | 2019-01-09 | 2019-01-09 | Solder resist process for reducing ghost of white core material circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910018122.6A CN109729651B (en) | 2019-01-09 | 2019-01-09 | Solder resist process for reducing ghost of white core material circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109729651A CN109729651A (en) | 2019-05-07 |
| CN109729651B true CN109729651B (en) | 2020-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910018122.6A Expired - Fee Related CN109729651B (en) | 2019-01-09 | 2019-01-09 | Solder resist process for reducing ghost of white core material circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113365436A (en) * | 2021-06-16 | 2021-09-07 | 珠海中京电子电路有限公司 | Production method for solving solder resist ink inlet hole |
| CN114449764A (en) * | 2021-12-31 | 2022-05-06 | 广东兴达鸿业电子有限公司 | Circuit board silk-screen method |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2013111478A1 (en) * | 2012-01-25 | 2013-08-01 | 株式会社カネカ | Novel resin composition for insulating film, and use thereof |
| WO2013111481A1 (en) * | 2012-01-25 | 2013-08-01 | 株式会社カネカ | Novel resin composition for pigment-containing insulating film, and use thereof |
| CN103929883B (en) * | 2013-01-15 | 2017-01-25 | 南京尚孚电子电路有限公司 | Method for manufacturing monocrystal COB packaging aluminum substrate of bowl hole shape |
| CN103117228A (en) * | 2013-02-26 | 2013-05-22 | 佘利宁 | Manufacturing method for COB (chip on board) packaging aluminum substrate |
| CN104883825B (en) * | 2015-05-15 | 2018-04-06 | 江门崇达电路技术有限公司 | A kind of method for making solder mask in the circuit board |
| CN105228363A (en) * | 2015-08-28 | 2016-01-06 | 江门崇达电路技术有限公司 | A kind of manufacture method of solder mask |
| CN105208791B (en) * | 2015-10-09 | 2018-04-24 | 深圳崇达多层线路板有限公司 | A kind of production method of printed circuit board character |
| CN206442608U (en) * | 2017-01-04 | 2017-08-25 | 信丰利裕达电子科技有限公司 | Wiring board resistance welding milling board assembly line |
| CN108289386A (en) * | 2017-12-29 | 2018-07-17 | 东莞市合鼎电路有限公司 | A kind of printed wiring board anti-welding printing method |
| CN108116031B (en) * | 2017-12-29 | 2021-07-06 | 东莞市合鼎电路有限公司 | Circuit board character printing method |
| CN208175114U (en) * | 2018-04-28 | 2018-11-30 | 涟水县苏杭科技有限公司 | A kind of anti-ghost welding resistance mechanism of two-sided equity windowing pcb board |
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Granted publication date: 20200728 |