CN109836885A - Liquid photosensitive ink, PCB and preparation method of PCB inner layer plate - Google Patents
Liquid photosensitive ink, PCB and preparation method of PCB inner layer plate Download PDFInfo
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- CN109836885A CN109836885A CN201910048758.5A CN201910048758A CN109836885A CN 109836885 A CN109836885 A CN 109836885A CN 201910048758 A CN201910048758 A CN 201910048758A CN 109836885 A CN109836885 A CN 109836885A
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Abstract
The invention provides liquid photosensitive ink, a PCB and a preparation method of the PCB. The invention provides liquid photosensitive ink which comprises, by weight, 1-50 parts of modified o-cresol epoxy resin acrylate, 1-50 parts of polymethacrylate copolymer, 2-80 parts of styrene acrylate copolymer, 5-30 parts of photoinitiator, 2-20 parts of acrylic monomer, 1-30 parts of pure polyester curing agent, 0.05-5 parts of sensitizer and 15-50 parts of other auxiliary agents. The liquid photosensitive ink, the PCB and the preparation method of the PCB provided by the invention have the advantage of simplifying the PCB manufacturing process.
Description
Technical field
The invention belongs to technical field of ink, and in particular to the preparation side of a kind of liquid photosensitive ink, pcb board and pcb board
Method.
Background technique
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important
Electronic component, be the supporter of electronic component, be electronic component electrical connection carrier.Since it is using electronic seal
The production of brush art, therefore referred to as " print " circuit board.
PCB is after carrying out ink coating, it is also necessary to be exposed, develop, etch, move back film and brownification.Exposure:
Traditional exposure needs to be rinsed exposure using the film；Development: according to the characteristic of the antiacid not alkali resistant of ink, unexposed monomer
Ink reacts with sodium carbonate, is rinsed out by liquid medicine, and the copper of unnecessary portion is exposed；Etching: the copper exposed after development
Angryization-reduction reaction is issued in the catalytic action of PC-581F with HCL, is etched；It moves back film: utilizing highly basic and protection copper face
Condensate ink react, strip off surface ink, obtain a piece of complete inner plating；Brownification: in brownification slot, due to
H2O2Microcorrosion effect, so that matrix copper surface is formed a kind of rubble shape microstructure, while deposition is upper immediately a thin layer of has
Machine metal film forms the pile-like configuration of brown due to the chemical bonds of organic metal film and matrix copper surface, makes it and glues
The adhesive force of sheeting greatly improves.
Existing PCB ink also needs the step of moving back film to obtain desired figure after usage, and move back film also needs later
Carrying out brownification makes substrate copper face have one layer of uniform villus, to increase substrate and the binding force of PP, to avoid being layered quick-fried
The problems such as plate, so that PCB processing procedure is relatively complicated.Now need to provide a kind of PCB ink that can simplify PCB processing procedure, so that PCB system
Standby efficiency has biggish one promotion.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provide a kind of a kind of liquid photosensitive ink that can simplify PCB processing procedure,
The preparation method of pcb board and pcb board.
The present invention provides a kind of liquid photosensitive ink, by weight, including modified o-cresol epoxy resin acrylate
1-50 parts, 1-50 parts of polymethacrylate copolymer, 2-80 parts of styrene-acrylic copolymer, 5-30 parts of photoinitiator,
2-20 parts of acrylic monomers, polyester solidifying agent 1-30 parts pure, 0.05-5 parts of sensitizer and 15-50 parts of other auxiliary agents.
Preferably, described pure polyester solidifying agent 1-20 parts.
Preferably, described pure polyester solidifying agent 5-10 parts.
Preferably, the photoinitiator is high wavelength photoinitiator, including photoinitiator 369, photoinitiator 819 and light draw
Send out one or more of agent 784.
Preferably, the acrylic monomers includes trifunctional acrylic monomers and four-functional group acrylic monomers, described
The weight ratio of trifunctional acrylic monomers and four-functional group acrylic monomers is 4-12:0.5-4.
Preferably, other described auxiliary agents include polymerization inhibitor, solvent, color-change powder, fumed silica, wetting agent, defoaming agent
And filler, it is preferable that institute's filler is talcum powder of the partial size less than 10000 mesh.
The present invention also provides a kind of liquid photosensitive ink, by weight, by modified o-cresol epoxy resin acrylate
1-50 parts, 1-50 parts of polymethacrylate copolymer, 2-80 parts of styrene-acrylic copolymer, 5-30 parts of photoinitiator,
2-20 parts of acrylic monomers, polyester solidifying agent 1-30 parts pure, 0.05-5 parts of sensitizer, 0.05-1 parts of polymerization inhibitor, solvent 0.5-20
Part, 0.05-5 parts of color-change powder, 0.05-5 parts of fumed silica, 0.05-5 parts of wetting agent, 0.05-10 parts of defoaming agent and talcum powder
1-50 parts of compositions.
Preferably, the acrylic monomers is made of trifunctional acrylic monomers and four-functional group acrylic monomers, institute
The weight ratio for stating trifunctional acrylic monomers and four-functional group acrylic monomers is 4-12:0.5-4.
Preferably, the photoinitiator is made of photoinitiator 369, photoinitiator 819 and photoinitiator 784.
Preferably, the weight ratio of the photoinitiator 369, photoinitiator 819 and photoinitiator 784 is 1-6:1-6:1-6.
The present invention also provides a kind of pcb board, including PCB inner plating, the PCB inner plating includes substrate, is set to substrate
The layers of copper of one or both sides covers the film surface that the liquid photosensitive ink as described above on the outside of layers of copper is formed.
Preferably, the pcb board includes multiple PCB inner plating stacked combinations.
The present invention also provides a kind of preparation methods of pcb board, include the following steps:
1) pre-treatment is carried out to the substrate with layers of copper；
2) it is coated with liquid photosensitive ink as described above in the layers of copper, forms film surface；
3) it is exposed, obtains pcb board after developing, etch and pressing.
The preparation method that the present invention provides a kind of liquid photosensitive ink, pcb board and pcb board can have simplified PCB processing procedure
The advantages of.
Detailed description of the invention
It is more particularly described by the preferred embodiment of the present invention shown in the drawings, the above and other purpose of the present invention, feature
It will be become more fully apparent with advantage.Identical appended drawing reference indicates identical part in all the attached drawings, and not deliberately by real
Size equal proportion scaling in border draws attached drawing, it is preferred that emphasis is shows this purport.
Fig. 1 is the PCB internal board structure schematic diagram that the embodiment of the present invention 1 provides.
Specific embodiment
Technical solution of the present invention is described in further detail combined with specific embodiments below, so that the technology of this field
Personnel can better understand the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
The embodiment of the present invention provides a kind of liquid photosensitive ink, by weight, including modified o-cresol epoxy resin third
1-50 parts of olefin(e) acid ester, 1-50 parts of polymethacrylate copolymer, 2-80 parts of styrene-acrylic copolymer, photoinitiator 5-
30 parts, 2-20 parts of acrylic monomers, polyester solidifying agent 1-30 parts pure, 0.05-5 parts of sensitizer and 15-50 parts of other auxiliary agents.
Liquid photosensitive ink of the embodiment of the present invention is etching ink, and the ink of preparation is made by the way that pure polyester solidifying agent is added
When being applied to PCB, it is possible to reduce the production process of PCB.PCB can be made not need to move back film during the preparation process, do not needed
The step of brownification, reduce process, accelerate production efficiency, reduction moves back film liquid waste processing, reduces environmental pollution, save material at
This, cost of labor, and save equipment investment and save production site, it is of great significance for PCB manufacturer.
The liquid photosensitive ink of preparation of the embodiment of the present invention does not need to move back film when being applied to PCB in PCB preparation process,
The tunic can play effect identical with brownification step, therefore the step of capable of also saving brownification.
The embodiment of the present invention selects modified o-cresol epoxy resin acrylate, polymethacrylate copolymer, benzene second
Alkene acrylate copolymer compounding so that ink have preferable quick-drying performance, can be applied to LDI technology without generate compared with
Big scrappage.Traditional ink exposure needs to use the film, and the ink of the present embodiment does not need to be exposed with the film, application
It is exposed in LDI technology (laser direct imaging), while the solidification of generic halogen light source or LED light solidification can also be applied to,
Both it had been able to satisfy the application that old technology is also able to satisfy new technology (LDI technology).The application means of ink have been widened significantly.
In a preferred embodiment, modified 1-30 parts of o-cresol epoxy resin acrylate, changes in further preferred embodiments
1-20 parts of o-cresol epoxy resin acrylate of property.
In a preferred embodiment, polymethacrylate copolymer 1-30 parts, poly- methyl-prop in further preferred embodiments
1-20 parts of olefin(e) acid ester copolymer.
In a preferred embodiment, styrene-acrylic copolymer 2-50 parts, styrene third in further preferred embodiments
10-40 parts of olefin(e) acid ester copolymer.
In a preferred embodiment, photoinitiator 5-20 parts.
In a preferred embodiment, sensitizer 0.05-2 parts.
In a preferred embodiment, pure polyester solidifying agent 1-20 parts.In further preferred embodiments, pure polyester solidifying agent 5-
10 parts.
In a preferred embodiment, photoinitiator is high wavelength photoinitiator, including photoinitiator 369,819 and of photoinitiator
One or more of photoinitiator 784.
To guarantee ink sensitivity with higher, photoinitiator should select the photoinitiator with upper wavelength.This
Applicant by many experiments obtain these types of photoinitiator cooperate in the present embodiment modified o-cresol epoxy resin acrylate,
Polymethacrylate copolymer, styrene-acrylic copolymer resin are used in compounding, and have preferable photosensitive effect, so that
Ink is easy illumination rapid curing.Photoinitiator 369, photoinitiator 819 and photoinitiator 784 respectively emit light wave in high-pressure sodium lamp
Molar extinction coefficient be shown in Table 1.
Table 1
In a preferred embodiment, acrylic monomers includes trifunctional acrylic monomers and four-functional group acrylic monomers,
The weight ratio of trifunctional acrylic monomers and four-functional group acrylic monomers is 4-12:0.5-4.Trifunctional acrylic monomers
Cooperate the formula of the embodiment of the present invention with four-functional group acrylic monomers, crosslinking curing effect is more preferable.
In a preferred embodiment, other auxiliary agents include polymerization inhibitor, solvent, color-change powder, fumed silica, wetting agent, disappear
Infusion and filler, in a preferred embodiment, institute's filler are talcum powder of the partial size less than 10000 mesh.
The present invention also provides a kind of liquid photosensitive ink, by weight, by modified o-cresol epoxy resin acrylate
1-50 parts, 1-50 parts of polymethacrylate copolymer, 2-80 parts of styrene-acrylic copolymer, 5-30 parts of photoinitiator,
2-20 parts of acrylic monomers, polyester solidifying agent 1-30 parts pure, 0.05-5 parts of sensitizer, 0.05-1 parts of polymerization inhibitor, solvent 0.5-20
Part, 0.05-5 parts of color-change powder, 0.05-5 parts of fumed silica, 0.05-5 parts of wetting agent, 0.05-10 parts of defoaming agent and talcum powder
1-50 parts of compositions.
By the way that compounding for pure polyester solidifying agent and other components is added, obtained etching ink is being applied to the present embodiment
In PCB preparation process, the film surface after ink solidification can play effect same with brownification layer, guarantee that pcb board is not easy to be layered, because
This can be saved the step of moving back film and brownification, improved preparation efficiency, saved more cost.
Talcum powder is 12000 mesh superfine talcum powders in the present embodiment, and solvent is quick-dry type solvent PMA
In a preferred embodiment, acrylic monomers is by trifunctional acrylic monomers and four-functional group acrylic monomers group
At the weight ratio of trifunctional acrylic monomers and four-functional group acrylic monomers is 4-12:0.5-4.
In a preferred embodiment, photoinitiator is high wavelength photoinitiator, by photoinitiator 369, photoinitiator 819 and light
Initiator 784 forms.
In a preferred embodiment, the weight ratio of photoinitiator 369, photoinitiator 819 and photoinitiator 784 is 1-6:1-6:
1-6.The present inventor is found through experiments that the resin of this 3 kinds of initiator compounding cooperation the present embodiment can have preferable photosensitive
Property, curing rate is very fast.The yield that ink is applied to LDI technology can preferably be improved.
In a preferred embodiment, modified 1-30 parts of o-cresol epoxy resin acrylate, changes in further preferred embodiments
1-20 parts of o-cresol epoxy resin acrylate of property.
In a preferred embodiment, polymethacrylate copolymer 1-30 parts, poly- methyl-prop in further preferred embodiments
1-20 parts of olefin(e) acid ester copolymer.
In a preferred embodiment, styrene-acrylic copolymer 2-50 parts, styrene third in further preferred embodiments
10-40 parts of olefin(e) acid ester copolymer.
In a preferred embodiment, photoinitiator 5-20 parts.
In a preferred embodiment, sensitizer 0.05-2 parts.
In a preferred embodiment, pure polyester solidifying agent 1-20 parts.In further preferred embodiments, pure polyester solidifying agent 5-
10 parts.
With reference to Fig. 1, the embodiment of the present invention also provides a kind of pcb board, including PCB inner plating, and the PCB inner plating includes base
Plate 1, the layers of copper 2 for being set to substrate one or both sides cover the film that the liquid photosensitive ink as described above in 2 outside of layers of copper is formed
Face 3.The step of ink detachment after solidifying coating after etching in traditional PCB preparation process namely moves back film, this implementation
Pcb board in example does not need to move back film, therefore can also have film surface in PCB inner plating.Film surface is capable of increasing in PCB in the present embodiment
The adhesive force of laminate and bonding sheet etc., so that PCB inner plating needs not move through brownification step.PCB internal layer in the present embodiment
3 two sides of film surface of plate can also press PP layers.
In a preferred embodiment, the pcb board includes multiple PCB inner plating stacked combinations.Traditional PCB inner plating needs
Brownification is carried out, the pile structure of brown is formed, will appear that bonding is insecure to be easily layered after avoiding multiple inner plating laminations from pressing
Situation, a PCB inner plating in the present embodiment does not include brownification layer, and the etching ink of coating can play identical with brownification layer
Effect, the pcb board material being prepared are stronger.Be not easy to be layered, at the same can also less PCB preparation cost.
The embodiment of the present invention also provides a kind of preparation method of pcb board, includes the following steps:
1) pre-treatment is carried out to the substrate with layers of copper；Such as polish-brush, oil removing, microetch, pickling, the pre-treatments such as washing and drying.
2) it is coated with liquid photosensitive ink as described above in the layers of copper, forms film surface；
3) it is exposed, PCB inner plating is obtained after developing, etch and pressing.
Traditional PCB preparation method is to carry out pre-treatment to 1. pairs of substrates；2. being coated with ink；3. the patch film is exposed；
4. development；5. etching；6. moving back film；7. brownification；8. pressing.The preparation method of the PCB inner plating of the present embodiment be 1. pairs of substrates into
Row pre-treatment；2. being coated with ink；3. directly exposure (not needing the patch film)；4. development；5. etching；6. pressing, obtains PCB internal layer
Plate.The preparation method of the PCB inner plating of the present embodiment does not need to move back film after the etching, that is, does not need after being coated with solidification
The step of film surface removes.The step of brownification forms brownification film is not needed simultaneously yet.PCB inner plating can be obtained, due to this implementation
The particularity of liquid photosensitive ink in example, the cementability between film surface and PP or bonding sheet is preferable, so that PCB inner plating exists
It is preferable with the caking property of PP in bonding processes, preferable adhesive effect can be played, the pcb board being prepared is not easy to be layered.
In order to have further understanding and understanding to technical solution of the present invention, several preferred embodiments pair are now enumerated
It is described in further details.
Table 2
It is formulated, the formula material of embodiment 1 to embodiment 3, comparative example 1 to comparative example 3 is mixed, in three rollers according to table 2
It is ground in machine, is allowed to form uniform mixed phase, then filtered with screen cloth to get relevant inks.
By embodiment 1 to embodiment 3, the ink that comparative example 1 to comparative example 4 obtains uses will sage directional light interior stratotype automatically
UVIA-5KD exposure machine is exposed.Then the wiring board after exposure is tested for the property.
1. appearance after observation solidification, if surface of the paint film is dry and comfortable, tack-free.
2. adhesion test method: drawing baige method, adhesive tape removing draws compartment away from 1mm.
3. pencil hardness: IS C 5012-1993.8.6.3 pencil test, pencil: on Mitsubishi's pencil, copper and substrate
Film；IPC-TM-650 2.4.27.2, minimum " F ".
4. viscosity is tested: 25 DEG C, viscosimeter/Viscometer VT-06.
Specific test result is as shown in table 3.
Table 3
It is not added in the ink and comparative example 1 prepared by the present embodiment 1 it can be seen from the data of table 3 to embodiment 3 pure poly-
The ink performance of ester curing agent preparation is suitable, and all with lower viscosity and with the performance of quick-drying, it is direct to be suitable for laser
Imaging technique.There is preferable adhesive force and pencil hardness after solidification.And it joined more pure polyester solidifying agent in comparative example 2
With the proportion of curing agent in comparative example 3 and other components not within the scope of inventive formulation, the performance of obtained ink is opposite
It is poor.Illustrate the present invention by the reasonable cooperation of addition pure polyester solidifying agent and other components, obtained ink has preferable
Performance.
The ink that embodiment 1-3 and comparative example 1-3 are prepared is applied to the preparation of pcb board, and preparation process is as follows:
Substrate copper facing: one layer of substrate with layers of copper is formed in the copper facing of substrate two sides；
It opens oil: being added after uncapping and open grease hand operated mixing 3-5min, be then allowed to stand 5-10min and coating machine use is added i.e.
It can；
Substrate pre-treatment with layers of copper: the step of carrying out polish-brush, oil removing, microetch, pickling, washing and drying, (microetch speed
For 40-60 μ in, pickling H2SO4Concentration: 3%-5%)
Coating: in the ink that the base plate coating embodiment 1-3 with layers of copper and comparative example 1-3 are prepared, roller coating production speed
Spend about 4.5-5.0m/min, coating wheel: 420 mesh, film thickness monitoring: 12-15 μm.
Pre-baked: 80-85-90-90-70 DEG C of 9-10min completes exposure and imaging in 24 hours after pre-baked.
Exposure: the wavelength of LDI laser: 405nm；LDI exposure machine, 25-35mj/cm2,7-9 grade；The laser scanning time: 10-
14 seconds (size that the length of sweep time depends on pcb board).
Development: Na2CO3Concentration: 0.8-1.2%；Temperature: 28-32 DEG C；Spray pressure: 0.5-1.2kg/cm2；Time: 40-
60sec。
Etching: acid: generally acidic cupric chloride solutions, temperature: 48-52 DEG C, spray pressure: 1.5-2.5kg/cm2, when
Between 40-50sec.Alkalinity: generally alkaline copper chloride solution, temperature: 48-52 DEG C, spray pressure: 1.5-2.5kg/cm2, the time
40-50sec。
It is pre-buried: it is pre- folded by folded structure design progress, it is embedded in copper core；The dimensional tolerance for being embedded into part is controlled in 0.05mm.
Pressing: the technical parameter of pressing are as follows: heating rate obtains pcb board in 2.8 DEG C/min, hot pressing time 155min.
The pcb board prepared after ink coating is corresponded to embodiment 1-3 and comparative example 1-3 respectively to be tested as follows:
1.X-Ray is checked: whether being had filler cavity situation using X-Ray machine check, and is made micro- sections observation.
2. thermal stress is tested: taking containing the force fit plate for burying copper core, dimensions is 10cm*10cm, do drift tin test, condition
Are as follows: 288 ± 5 DEG C * 10s*3 times, check whether appearance has blistering, delamination, and make micro- sections observation.
Specific test result is as shown in table 4.
Table 4
The ink prepared by the present embodiment 1-3 it can be seen from the data of table 4, can in the preparation process for being applied to pcb board
Not have to decorporate in the ink after solidifying, the pcb board obtained without brownification still being capable of reliability with higher.Illustrate this
The pcb board of the corresponding preparation of the ink of embodiment 1-3 preparation has the advantages that simplified PCB processing procedure, on the basis for guaranteeing pcb board performance
Upper reduction manufacturing cost.
In comparative example 1, ink formulations do not add pure polyester solidifying agent, obtain after reducing the step of moving back film and brownification
Pcb board reliability it is poor, X-Ray inspection has a cavity, and plate bursting layering, plate face foaming phenomena occurs in thermal stress test.
In comparative example 2, ink formulations add the pure polyester solidifying agent of more ratio, after reducing the step of moving back film and brownification
The reliability of obtained pcb board is poor, and X-Ray inspection has cavity, and plate bursting layering, plate face foaming phenomena occurs in thermal stress test.
In comparative example 3, the proportion between ink each component is changed, reduces and obtains after the step of moving back film and brownification
Pcb board thermal stress tests plate face blistering.
Illustrate that the ink formulations of the present embodiment 1-3 are reasonable, the preparation process that the ink being prepared is applied to pcb board can
Simplify pcb board production procedure, promotes PCB manufacture efficiency.
The above is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (10)
1. a kind of liquid photosensitive ink, which is characterized in that by weight, including modified o-cresol epoxy resin acrylate 1-
50 parts, 1-50 parts of polymethacrylate copolymer, 2-80 parts of styrene-acrylic copolymer, 5-30 parts of photoinitiator, third
2-20 parts of acrylic monomer, polyester solidifying agent 1-30 parts pure, 0.05-5 parts of sensitizer and 15-50 parts of other auxiliary agents.
2. liquid photosensitive ink as described in claim 1, which is characterized in that described pure polyester solidifying agent 1-20 parts.
3. liquid photosensitive ink as described in claim 1, which is characterized in that described pure polyester solidifying agent 5-10 parts.
4. liquid photosensitive ink as described in claim 1, which is characterized in that the photoinitiator is high wavelength photoinitiator,
Including one or more of photoinitiator 369, photoinitiator 819 and photoinitiator 784.
5. liquid photosensitive ink as described in claim 1, which is characterized in that the acrylic monomers includes trifunctional propylene
Acid monomers and four-functional group acrylic monomers, the weight ratio of the trifunctional acrylic monomers and four-functional group acrylic monomers
For 4-12:0.5-4.
6. liquid photosensitive ink as described in claim 1, which is characterized in that other described auxiliary agents include polymerization inhibitor, solvent, change
Toner, fumed silica, wetting agent, defoaming agent and filler, it is preferable that institute's filler is talcum powder of the partial size less than 10000 mesh.
7. a kind of liquid photosensitive ink, which is characterized in that by weight, by modified o-cresol epoxy resin acrylate 1-50
Part, 1-50 parts of polymethacrylate copolymer, 2-80 parts of styrene-acrylic copolymer, 5-30 parts of photoinitiator, propylene
2-20 parts of acid monomers, 0.05-1 parts of polymerization inhibitor, 0.5-20 parts of solvent, become polyester solidifying agent 1-30 parts pure, 0.05-5 parts of sensitizer
0.05-5 parts of toner, 0.05-5 parts of fumed silica, 0.05-5 parts of wetting agent, 0.05-10 parts of defoaming agent and talcum powder 1-50
Part composition.
8. a kind of pcb board, which is characterized in that including PCB inner plating, the PCB inner plating includes substrate, is set to substrate side
Or two sides layers of copper, covering layers of copper on the outside of liquid photosensitive ink as claimed in any one of claims 1 to 6 formed film surface.
9. pcb board as claimed in claim 8, which is characterized in that including multiple PCB inner plating stacked combinations.
10. a kind of preparation method of pcb board, which comprises the steps of:
1) pre-treatment is carried out to the substrate with layers of copper；
2) it is coated with liquid photosensitive ink as claimed in any one of claims 1 to 6 on the outside of the layers of copper, forms film surface；
3) it is exposed, obtains pcb board after developing, etch and pressing.
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| CN111849242A (en) * | 2020-07-14 | 2020-10-30 | 深圳市德贝尔光电材料有限公司 | High-performance photosensitive wet film for LDI (laser direct immersion) and preparation method thereof |
| CN113263763A (en) * | 2021-04-23 | 2021-08-17 | 深圳万利科技有限公司 | Manufacturing method of mobile phone backboard with variable colors |
| CN113980510A (en) * | 2021-10-28 | 2022-01-28 | 江西超洋科技有限公司 | LDI high-sensitivity solder-resistant matte black ink and preparation method thereof |
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| CN110982348A (en) * | 2019-12-18 | 2020-04-10 | 江门市阪桥电子材料有限公司 | Matte black PCB character inkjet ink and preparation method thereof |
| CN111712057A (en) * | 2020-07-02 | 2020-09-25 | 江西景旺精密电路有限公司 | PCB inner layer processing method |
| CN111849242A (en) * | 2020-07-14 | 2020-10-30 | 深圳市德贝尔光电材料有限公司 | High-performance photosensitive wet film for LDI (laser direct immersion) and preparation method thereof |
| CN111849242B (en) * | 2020-07-14 | 2022-04-22 | 深圳市德贝尔光电材料有限公司 | High-performance photosensitive wet film for LDI (laser direct immersion) and preparation method thereof |
| CN113263763A (en) * | 2021-04-23 | 2021-08-17 | 深圳万利科技有限公司 | Manufacturing method of mobile phone backboard with variable colors |
| CN113980510A (en) * | 2021-10-28 | 2022-01-28 | 江西超洋科技有限公司 | LDI high-sensitivity solder-resistant matte black ink and preparation method thereof |
| CN114716868A (en) * | 2022-04-19 | 2022-07-08 | 广州市红太电子科技有限公司 | Photo-curing printing ink for printed circuit board |
| CN114716868B (en) * | 2022-04-19 | 2023-06-20 | 广州市红太电子科技有限公司 | Photo-curing ink for printed circuit board |
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