CN103929883B - Method for manufacturing monocrystal COB packaging aluminum substrate of bowl hole shape - Google Patents
Method for manufacturing monocrystal COB packaging aluminum substrate of bowl hole shape Download PDFInfo
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- CN103929883B CN103929883B CN201310013931.0A CN201310013931A CN103929883B CN 103929883 B CN103929883 B CN 103929883B CN 201310013931 A CN201310013931 A CN 201310013931A CN 103929883 B CN103929883 B CN 103929883B
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- aluminium
- copper
- bowl
- temperature
- aluminium base
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 90
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 90
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 title claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 238000003801 milling Methods 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 7
- 239000004411 aluminium Substances 0.000 claims description 72
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 239000007822 coupling agent Substances 0.000 claims description 18
- 238000003466 welding Methods 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 11
- 230000003647 oxidation Effects 0.000 claims description 11
- 238000007254 oxidation reaction Methods 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000010008 shearing Methods 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 8
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 230000033116 oxidation-reduction process Effects 0.000 claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000002604 ultrasonography Methods 0.000 claims description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 238000010009 beating Methods 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 3
- 238000005238 degreasing Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 235000011194 food seasoning agent Nutrition 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- -1 insulating barrier Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims 2
- 241000218202 Coptis Species 0.000 claims 1
- 235000002991 Coptis groenlandica Nutrition 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000005553 drilling Methods 0.000 abstract 3
- 238000003754 machining Methods 0.000 abstract 2
- 238000004506 ultrasonic cleaning Methods 0.000 abstract 1
- 239000003921 oil Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 6
- 238000005457 optimization Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- NWYRNCMKWHKPAI-UHFFFAOYSA-N C(=O)=O.[Na] Chemical compound C(=O)=O.[Na] NWYRNCMKWHKPAI-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 206010023126 Jaundice Diseases 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 235000014593 oils and fats Nutrition 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000004017 vitrification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to a method for manufacturing a monocrystal COB packaging aluminum substrate of a bowl hole shape. The manufacturing process comprises the steps of (1) preparing an aluminum-base copper-clad plate, (2) manufacturing an aluminum substrate circuit graph in a solder resisting mode, (3) processing the surface of a routing bonding pad, (4) drilling a datum hole, (5) drilling a bowl hole, (6) conducting ultrasonic cleaning and attaching a protection film, (7) drilling and milling the shape in a numerical control mode and (8) conducting checkout and delivery. Products machined through the method are good in lighting effect, the bottom of the bowl hole is bright and smooth, no machining knife lines exist, the machining depth error is small, and therefore the uniformity of light emitting angles of an LED chip is guaranteed; the method is reasonable in process and high in practicability, thereby having quite good market application prospect.
Description
Technical field
The present invention relates to the manufacture method that a kind of monocrystalline cob encapsulates the poroid aluminium base of bowl.
Background technology
Cob (encapsulation of chip on board chip on board) is one of bare chip mounting technology, leads in field of semiconductor package
It is often that semiconductor chip handing-over is mounted on circuit base plate, the electrical connection of chip and substrate is realized with wire bonding method,
And covered with resin to guarantee reliability, but the encapsulation to LED light source chip has its particularity, is mainly setting up chip
Between, on the basis of the physical connection between chip substrate in addition it is also necessary to keep led chip reflecting rate, existing encapsulation technology, absolutely
Edge layer is using the pressing of epoxy resin prepreg, and epoxy resin layer is usually faint yellow, reflective bad, and its tg only has
140 DEG C, LED light source in use, the temperature of central point at 100 degree about, life-time service, insulating barrier can be easily yellow
Become, color burn, the light efficiency of light source will be had a strong impact on.And the processing of the poroid crystal bonding area of existing aluminium base surface bowl, it is direct
Aluminium base is fixed on workbench and is holed, so operation not only wastes the substantial amounts of time in fixing aluminium base, and
And press is aluminium base surrounding, in the middle of plate or other do not have pressurized place, however it remains fit not with work top
Closely phenomenon, the product therefore processing often occurs the portion's out-of-flatness of bowl bottom hole, has processing knife mark, in 200*300
Area in, the depth error of processing is more than the phenomenons such as +/- 0.05mm, thus it cannot be guaranteed that led chip light-emitting angle consistent
Property.
Content of the invention
The purpose of the present invention is the defect overcoming prior art to exist, and provides a kind of monocrystalline cob encapsulation poroid aluminium base of bowl
The manufacture method of plate.
The technical scheme realizing the object of the invention is: the manufacture method that a kind of monocrystalline cob encapsulates the poroid aluminium base of bowl, bag
Include following steps:
(1) aluminum-based copper-clad plate prepares；
(2) aluminium base line pattern and welding resistance make；
(3) routing bond pad surface is processed；
(4) bore datum hole；
(5) bore bowl hole；
(6) ultrasound wave cleaning and laminating protecting film；
(7) numerical control drilling-milling profile；
(8) check shipment.
As optimization, described each step is as follows respectively:
(1) aluminum-based copper-clad plate prepares:
(a) sawing sheet: with electronic shearing machine, whole aluminium is cut into and produce the dimensions needing, from southwestern Aluminum
5052h34 aluminium；
(b) brush board: use one side brush plate machine, the oxide layer of aluminium material surface is thrown and brushes off, brush roll mesh number is 320 mesh；
(c) surface degreasing: the aqueous solution soaking aluminium of the naoh with 10%～30% 10～20 minutes, temperature 20～30
DEG C, remove oxidation, the debris of oils and fatss of aluminium material surface；
(d) anodic oxidation: the aluminium after oil removing is placed on 20%～30% h2so4In aqueous solution, carry out 20～40 minutes
Anodic oxidation, 20～25 DEG C of temperature, electric current density 2～5a/dm2；
(e) cleaning, drying: with the aluminium after clean water anodic oxidation, then it is placed on and dries on dehydrator, drying temperature 80
～100 DEG C；
F () applies coupling agent: be coated in the one side of aluminium with epoxy radicals coupling agent kh-560；
G () dries: the aluminium having coated coupling agent is placed in baking oven and toasts 10 minutes, temperature is 170 DEG C；
H () lamination presses: lamination order is Copper Foil, insulating barrier, aluminium, and pressing condition is pressure 6～12kg/cm2, temperature
180～190 DEG C, the time is 120 minutes；
(i) cutting edge: according to product size, with electronic shearing machine, the pressing plate material marginal portion after pressing is removed；
J () pastes aluminum surface protective film: on the aluminium at the aluminum-based copper-clad plate back side having pressed, with laminator patch last layer protection
Film, the damage of aluminium during prevention following process；
(2) aluminium base line pattern and welding resistance make:
(a) secondary sawing sheet: with electronic shearing machine, whole aluminum-based copper-clad plate is cut into and produce the dimensions needing；
(b) secondary brush board: use one side brush plate machine, the oxide layer on copper-clad plate surface is thrown and brushes off, brush roll mesh number is 500 mesh；
C () prints wet film: with the method for silk screen printing, uniformly one layer of coating on the copper-clad plate surface Copper Foil after secondary brush board
Photosensitive wet film；
(d) preliminary drying: the copper-clad plate of printed wet film is placed and toasts in an oven, 70～80 DEG C of baking temperature, the time
For 20～30 minutes；
(e) single exposure: the circuit egative film that light in advance is painted covers in pre-baked copper-clad plate, is exposed with 8kw ultraviolet
Ray machine exposes so that the line pattern on egative film is transferred in copper-clad plate, and energy setting value is 350 MJs；
F () is once developed: the copper-clad plate after single exposure is developed through developing machine, developer solution 1%-3% Carbon Dioxide
Sodium, temperature is 28～32 DEG C, and the time is 1～2 minute, and spray pressure is 1～5kg/cm2；
G () is checked: the integrity of detection line pattern；
H () etches: eroded, with acid copper chloride etching liquid, the layers of copper not covered by wet film, retain the circuit needing
Copper Foil, the condition of etching solution: copper content is 140～180g/l, acid is measured as 2～3n, and oxidation-reduction potential is 450～550mv, temperature
Spend for 49～54 DEG C；
(i) striping: the circuit surface wet film after etching is removed clean by the sodium hydroxide solution with 3%～5%；
(j) three brush boards: use one side brush plate machine, the oxide layer on circuit base plate surface is thrown and brushes off, brush roll mesh number is 500
Mesh；
K () prints welding resistance white oil: with the method for silk screen printing, uniformly one layer of the coating of the circuit base plate surface after three brush boards
Circuit base plate surface after secondary brush board uniformly coats the photosensitive solder resist white oil of one layer of model Solar p sr2000ce800w；
(l) secondary preliminary drying: by printed welding resistance white oil circuit base plate place toast in an oven, baking temperature 70～80
DEG C, the time is 20～30 minutes；
(m) re-expose: the welding resistance egative film that light in advance is painted, cover on secondary pre-baked circuit base plate, use 8kw
Ultraviolet exposure machine exposes so that the welding resistance figure on egative film is transferred in copper-clad plate, and energy setting value is 950 MJs；
(n) redevelopment: the circuit base plate after re-expose is developed through developing machine, the anhydrous carbon of developer solution 1%～3%
Sour sodium, temperature is 28～32 DEG C, and the time is 1～2 minute, and spray pressure is 1～5kg/cm2；
(o) solidify afterwards: the circuit base plate after redevelopment is positioned over baking in baking oven, welding resistance white oil is thoroughly solidified,
150 DEG C of baking temperature, the time is 60 minutes；
(3) routing bond pad surface is processed: employs Atotech universal asf ii chemistry NiPdAu system, is beating gold
The coating surface one lamination gold plate of wire bonding disk；
(4) bore datum hole: first identify the figure of circuit location hole using full-automatic image puncher, then bore location hole,
Aperture is 2.0mm；
(5) bore bowl hole: after shop bolt plus vacuum cup co-located, with high-speed precise machine tool szx5540- and
Rough diamond single-blade milling cutter bores milling bowl shape hole, and the cutting edge of rough diamond single-blade milling cutter is horizontal by 2 ° of angles；
(6) ultrasound wave cleaning and laminating protecting film: use cleanout fluid rs-1609, cleaning in ultrasonic washing unit is drilled bowl
The substrate of cup aperture, after cleaning 30～60 seconds, takes out and washes through three-level clear water, then be more than or equal to 6kg/cm with pressure2One-level high pressure
Washing, then crosses cold wind, after 80～90 DEG C of hot-air seasoning, then in circuit surface viscosity protecting film in hot-pressing roller patch；
(7) numerical control drilling-milling profile；
(8) check shipment.
As optimization, the coupling agent that the step (f) in described step (1) applies coupling agent employing is 2%～4% epoxy radicals
The ethanol solution of coupling agent kh-560, kh-560 epoxy radicals coupling agent is coated on aluminium base surface, as aluminium base surface
Modifying agent, enhance the adhesion between aluminium base and insulating barrier.
As optimization, in step (h) the lamination pressing in described step (1), Copper Foil is the electrolytic copper foil of 35 μ m thick, absolutely
Edge layer selects bt (bismaleimide triazine, bismaleimide-triazine resin) resin prepreg, bt color of resin
It is positive white, lights after chip package, and do not interfere with the colour temperature of light source, the tg of bt resin is high, for a long time at a temperature of 100 degree
Use, variable color of will not turning to be yellow.
As optimization, the etching solution that the step (h) in described step (2) etches is copper content is 160g/l, and acid is measured and is
2.5n, oxidation-reduction potential is 475mv, and temperature is 51.6 DEG C.
The Chemical nickel and palladium plating process adopting when processing as optimization, described step (3) routing bond pad surface, thickness of coating
Ni for ni be 5～8 μm, pd be 2～8 μ ", au be 2～6 μ ".
As optimization, when described step (5) bores bowl hole, first with shop bolt, aluminium base is positioned on vacuum suction table,
With adhesive tape, the suction hole not covered by aluminium base in aluminium base surrounding and vacuum suction table is pasted again and cover, open vacuum pump, treat
When aluminium base fully fits fixing with work top, then carry out boring bowl hole.
The present invention has positive effect: bt resin is just white and tg is high, and vitrification point can reach 230 DEG C, for a long time
Use at a temperature of 100 DEG C, will not turn to be yellow variable color and affect colour temperature and the light efficiency of light source.Boring bowl hole Mohs' hardness is 10
Rough diamond single-blade milling cutter and high-speed precise machine tool szx5540- carrys out chip processing it is ensured that aluminium base machined surface smooth
No knife mark, and cutting edge is horizontal by 2 ° of angles, chip process gets final product chip removal, it is to avoid crystal bonding area occurs irregular existing
As, processed product shop bolt and vacuum cup co-located, fixation of fitting with work top tightr, bore milling bowl
The concordance of Kong Shiqi depth has obtained good control, and its depth error can control between +/- 0.015mm, the present invention
Method rational technology, practical, there is very strong market application foreground.
Specific embodiment
Realize the manufacture method that a kind of present invention monocrystalline cob encapsulates the poroid aluminium base of bowl, cob (chip on board plate
Upper chip package) it is one of bare chip mounting technology, manufacture method is as follows:
(1) aluminum-based copper-clad plate prepares:
(a) sawing sheet: with electronic shearing machine, whole aluminium is cut into and produce the dimensions needing, from southwestern Aluminum
5052h34 aluminium；
(b) brush board: use one side brush plate machine, the oxide layer of aluminium material surface is thrown and brushes off, brush roll mesh number is 320 mesh；
(c) surface degreasing: the aqueous solution soaking aluminium of the naoh with 10%～30% 10～20 minutes, temperature 20～30
DEG C, remove oxidation, the debris of oils and fatss of aluminium material surface；
(d) anodic oxidation: the aluminium after oil removing is placed on 20%～30% h2so4In aqueous solution, carry out 20～40 minutes
Anodic oxidation, 20～25 DEG C of temperature, electric current density 2～5a/dm2；
(e) cleaning, drying: with the aluminium after clean water anodic oxidation, then it is placed on and dries on dehydrator, drying temperature 80
～100 DEG C；
F () applies coupling agent: be coated in the one side of aluminium with epoxy radicals coupling agent kh-560, coupling agent is 2%～4% ring
The ethanol solution of epoxide coupling agent kh-560, kh-560 epoxy radicals coupling agent is coated on aluminium base surface, as aluminium base
The modifying agent on surface, enhances the adhesion between aluminium base and insulating barrier.；
G () dries: the aluminium having coated coupling agent is placed in baking oven and toasts 10 minutes, temperature is 170 DEG C；
H () lamination presses: lamination order is Copper Foil, insulating barrier, aluminium, and pressing condition is pressure 6～12kg/cm2, temperature
180～190 DEG C, the time is 120 minutes, and wherein Copper Foil is the electrolytic copper foil of 35 μ m thick, and insulating barrier selects bt
(bismaleimide triazine, bismaleimide-triazine resin) resin prepreg, bt color of resin is positive white,
Light after chip package, and do not interfere with the colour temperature of light source, the tg of bt resin is high, uses for a long time at a temperature of 100 degree, will not
Jaundice variable color；
(i) cutting edge: according to product size, with electronic shearing machine, the pressing plate material marginal portion after pressing is removed；
J () pastes aluminum surface protective film: on the aluminium at the aluminum-based copper-clad plate back side having pressed, with laminator patch last layer protection
Film, the damage of aluminium during prevention following process；
(2) aluminium base line pattern and welding resistance make:
(a) secondary sawing sheet: with electronic shearing machine, whole aluminum-based copper-clad plate is cut into and produce the dimensions needing；
(b) secondary brush board: use one side brush plate machine, the oxide layer on copper-clad plate surface is thrown and brushes off, brush roll mesh number is 500 mesh；
C () prints wet film: with the method for silk screen printing, uniformly one layer of coating on the copper-clad plate surface Copper Foil after secondary brush board
Photosensitive wet film；
(d) preliminary drying: the copper-clad plate of printed wet film is placed and toasts in an oven, 70～80 DEG C of baking temperature, the time
For 20～30 minutes；
(e) single exposure: the circuit egative film that light in advance is painted covers in pre-baked copper-clad plate, is exposed with 8kw ultraviolet
Ray machine exposes so that the line pattern on egative film is transferred in copper-clad plate, and energy setting value is 350 MJs；
F () is once developed: the copper-clad plate after single exposure is developed through developing machine, developer solution 1%-3% Carbon Dioxide
Sodium, temperature is 28～32 DEG C, and the time is 1～2 minute, and spray pressure is 1～5kg/cm2；
G () is checked: the integrity of detection line pattern；
H () etches: eroded, with acid copper chloride etching liquid, the layers of copper not covered by wet film, retain the circuit needing
Copper Foil, the condition of etching solution: copper content is 160g/l, acid is measured as 2.5n, and oxidation-reduction potential is 475mv, and temperature is 51.6 DEG C；
(i) striping: the circuit surface wet film after etching is removed clean by the sodium hydroxide solution with 3%～5%；
(j) three brush boards: use one side brush plate machine, the oxide layer on circuit base plate surface is thrown and brushes off, brush roll mesh number is 500
Mesh；
K () prints welding resistance white oil: with the method for silk screen printing, uniformly one layer of the coating of the circuit base plate surface after three brush boards
Circuit base plate surface after secondary brush board uniformly coats the photosensitive solder resist white oil of one layer of model Solar p sr2000ce800w；
(l) secondary preliminary drying: by printed welding resistance white oil circuit base plate place toast in an oven, baking temperature 70～80
DEG C, the time is 20～30 minutes；
(m) re-expose: the welding resistance egative film that light in advance is painted, cover on secondary pre-baked circuit base plate, use 8kw
Ultraviolet exposure machine exposes so that the welding resistance figure on egative film is transferred in copper-clad plate, and energy setting value is 950 MJs；
(n) redevelopment: the circuit base plate after re-expose is developed through developing machine, the anhydrous carbon of developer solution 1%～3%
Sour sodium, temperature is 28～32 DEG C, and the time is 1～2 minute, and spray pressure is 1～5kg/cm2；
(o) solidify afterwards: the circuit base plate after redevelopment is positioned over baking in baking oven, welding resistance white oil is thoroughly solidified,
150 DEG C of baking temperature, the time is 60 minutes；
(3) routing bond pad surface is processed: employs Atotech universal asf ii chemistry NiPdAu system, is beating gold
The coating surface one lamination gold plate of wire bonding disk, thickness of coating ni is 5～8 μm, pd is 2～8 μ ", au be 2～6 μ "；
(4) bore datum hole: first identify the figure of circuit location hole using full-automatic image puncher, then bore location hole,
Aperture is 2.0mm；
(5) bore bowl hole: after shop bolt plus vacuum cup co-located, with high-speed precise machine tool szx5540- and
Rough diamond single-blade milling cutter bores milling bowl shape hole, and the cutting edge of rough diamond single-blade milling cutter, horizontal by 2 ° of angles, bores bowl
Kong Shixian shop bolt is positioned at aluminium base on vacuum suction table, then with adhesive tape in aluminium base surrounding and vacuum suction table not by
The suction hole that aluminium base covers is pasted and is covered, and opens vacuum pump, when aluminium base fully fits fixing with work top, then carries out
Bore bowl hole.；
(6) ultrasound wave cleaning and laminating protecting film: use cleanout fluid rs-1609, cleaning in ultrasonic washing unit is drilled bowl
The substrate of cup aperture, after cleaning 30～60 seconds, takes out and washes through three-level clear water, then be more than or equal to 6kg/cm with pressure2One-level high pressure
Washing, then crosses cold wind, after 80～90 DEG C of hot-air seasoning, then in circuit surface viscosity protecting film in hot-pressing roller patch；
(7) numerical control drilling-milling profile；
(8) check shipment.
Bt resin is just white and tg is high, and vitrification point can reach 230 DEG C, uses for a long time at a temperature of 100 DEG C, will not
Jaundice variable color and affect colour temperature and the light efficiency of light source.Bore the rough diamond single-blade milling cutter that bowl hole Mohs' hardness is 10 and high speed
Precision machine tool szx5540- carrys out chip processing it is ensured that aluminium base machined surface smooth no knife mark, and cutting edge and level
Face is in 2 ° of angles, and chip process gets final product chip removal, it is to avoid irregular phenomenon, processed product shop bolt in crystal bonding area
With vacuum cup co-located, fixation of fitting with work top tightr, when boring milling bowl hole, the concordance of its depth obtains
Good control, its depth error can control between +/- 0.015mm, method of the present invention rational technology, practicality
By force, there is very strong market application foreground.
Particular embodiments described above, has carried out detailed further to the purpose of the present invention, technical scheme and beneficial effect
Describe in detail bright, be should be understood that the specific embodiment that the foregoing is only the present invention, be not limited to the present invention, all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvement done etc., should be included in the guarantor of the present invention
Within the scope of shield.
Claims (6)
1. a kind of monocrystalline cob encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that: comprise the following steps:
(1) aluminum-based copper-clad plate prepares:
(a) sawing sheet: with electronic shearing machine, whole aluminium is cut into and produce the dimensions needing；
(b) brush board: use one side brush plate machine, the oxide layer of aluminium material surface is thrown and brushes off, brush roll mesh number is 320 mesh；
(c) surface degreasing: the aqueous solution soaking aluminium of the naoh being 10%～30% with percent by volume 10～20 minutes, temperature
20～30 DEG C；
(d) anodic oxidation: the aluminium after oil removing is placed on the h that percent by volume is 20%～30%2so4In aqueous solution, carry out 20
The anodic oxidation of～40 minutes, 20～25 DEG C of temperature, electric current density 2～5a/dm2；
(e) cleaning, drying: with the aluminium after clean water anodic oxidation, then it is placed on and dries on dehydrator, drying temperature 80～100
℃；
F () applies coupling agent: be coated in the one side of aluminium with epoxy radicals coupling agent kh-560；
G () dries: the aluminium having coated coupling agent is placed in baking oven and toasts 10 minutes, temperature is 170 DEG C；
H () lamination presses: lamination order is Copper Foil, insulating barrier, aluminium, and pressing condition is pressure 6～12kg/cm2, temperature 180～
190 DEG C, the time is 120 minutes；
(i) cutting edge: according to product size, with electronic shearing machine, the pressing plate material marginal portion after pressing is removed；
J () pastes aluminum surface protective film: on the aluminium at the aluminum-based copper-clad plate back side having pressed, stick layer protecting film with laminator；
(2) aluminium base line pattern and welding resistance make:
(a) secondary sawing sheet: with electronic shearing machine, whole aluminum-based copper-clad plate is cut into and produce the dimensions needing；
(b) secondary brush board: use one side brush plate machine, the oxide layer on copper-clad plate surface is thrown and brushes off, brush roll mesh number is 500 mesh；
C () prints wet film: with the method for silk screen printing, on the copper-clad plate surface Copper Foil after secondary brush board, uniformly one layer of coating is photosensitive
Wet film；
(d) preliminary drying: the copper-clad plate of printed wet film is placed and toasts in an oven, 70～80 DEG C of baking temperature, the time is 20
～30 minutes；
(e) single exposure: the circuit egative film that light in advance is painted covers in pre-baked copper-clad plate, uses 8kw ultraviolet exposure machine
Exposure, energy setting value is 350 MJs；
F () is once developed: the copper-clad plate after single exposure is developed through developing machine, developer solution is percent by volume is 1%-
3% natrium carbonicum calcinatum, temperature is 28～32 DEG C, and the time is 1～2 minute, and spray pressure is 1～5kg/cm2；
G () is checked: the integrity of detection line pattern；
H () etches: eroded, with acid copper chloride etching liquid, the layers of copper not covered by wet film, retain the circuit copper needing
Paper tinsel, the condition of etching solution: copper content is 140～180g/l, acid is measured as 2～3n, and oxidation-reduction potential is 450～550mv, temperature
For 49～54 DEG C；
(i) striping: the circuit surface wet film after etching is removed dry by the sodium hydroxide solution being 3%～5% with percent by volume
Only；
(j) three brush boards: use one side brush plate machine, the oxide layer on circuit base plate surface is thrown and brushes off, brush roll mesh number is 500 mesh；
K () prints welding resistance white oil: with the method for silk screen printing, uniformly one layer of coating is photosensitive for the circuit base plate surface after three brush boards
Welding resistance white oil；
(l) secondary preliminary drying: by printed welding resistance white oil circuit base plate place toast in an oven, 70～80 DEG C of baking temperature,
Time is 20～30 minutes；
(m) re-expose: the welding resistance egative film that light in advance is painted, cover on secondary pre-baked circuit base plate, use 8kw ultraviolet
Exposure machine exposes, and energy setting value is 950 MJs；
(n) redevelopment: the circuit base plate after re-expose is developed through developing machine, developer solution is percent by volume is 1%
～3% natrium carbonicum calcinatum, temperature is 28～32 DEG C, and the time is 1～2 minute, and spray pressure is 1～5kg/cm2；
(o) solidify afterwards: the circuit base plate after redevelopment is positioned over baking in baking oven, 150 DEG C of baking temperature, the time is 60 points
Clock；
(3) routing bond pad surface is processed: is beating the coating surface one lamination gold plate of gold thread pad；
(4) bore datum hole: first identify the figure of circuit location hole using full-automatic image puncher, then bore location hole, aperture
For 2.0mm；
(5) bore bowl hole: after shop bolt plus vacuum cup co-located, with high-speed precise machine tool szx5540- and natural
Diamond single-blade milling cutter bores milling bowl shape hole, and the cutting edge of rough diamond single-blade milling cutter is horizontal by 2 ° of angles；
(6) ultrasound wave cleaning and laminating protecting film: use cleanout fluid rs-1609, cleaning in ultrasonic washing unit is drilled bowl hole
Substrate, cleaning 30～60 seconds after, take out wash through three-level clear water, then with pressure be more than or equal to 6kg/cm2One-level high-pressure washing,
Then cross cold wind, after 80～90 DEG C of hot-air seasoning, then in circuit surface viscosity protecting film in hot-pressing roller patch；
(7) numerical control drilling-milling profile；
(8) check shipment.
2. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that:
The coupling agent that step (f) in described step (1) applies coupling agent employing is that the epoxy radicals that percent by volume is 2%～4% are coupled
The ethanol solution of agent kh-560.
3. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that:
In step (h) lamination pressing in described step (1), Copper Foil is the electrolytic copper foil of 35 μ m thick, and insulating barrier selects bt
(bismaleimide triazine) resin prepreg.
4. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that:
The etching solution of step (h) etching in described step (2) is copper content is 160g/l, and acid is measured as 2.5n, oxidation-reduction potential
For 475mv, temperature is 51.6 DEG C.
5. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that:
The Chemical nickel and palladium plating process that described step (3) routing bond pad surface adopts when processing, thickness of coating ni is 5～8 μm, pd is 2
～8 μ ", au be 2～6 μ ".
6. a kind of monocrystalline cob according to claim 1 encapsulate the poroid aluminium base of bowl manufacture method it is characterised in that:
When described step (5) bores bowl hole, first with shop bolt, aluminium base is positioned on vacuum suction table, then with adhesive tape aluminium base four
The suction hole not covered by aluminium base on week and vacuum suction table is pasted and is covered, and opens vacuum pump, treats that aluminium base is filled with work top
When dividing laminating fixing, then carry out boring bowl hole.
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| CN110246932A (en) * | 2018-03-09 | 2019-09-17 | 深圳市聚能达业光电科技有限公司 | A kind of ceramic specular aluminium COB bracket and production method of LED encapsulation linear light source |
| CN109729651B (en) * | 2019-01-09 | 2020-07-28 | 深圳市江霖电子科技有限公司 | Solder resist process for reducing ghost of white core material circuit board |
| WO2021026959A1 (en) * | 2019-08-14 | 2021-02-18 | 广州硅能照明有限公司 | Cob encapsulation device |
| CN110641053A (en) * | 2019-09-25 | 2020-01-03 | 贵州天义电器有限责任公司 | Processing technique of thin film part |
| CN111048651B (en) * | 2019-12-27 | 2021-12-17 | 广州市鸿利秉一光电科技有限公司 | High-reflectivity UVLED substrate and production method |
| CN112616265B (en) * | 2020-12-04 | 2021-12-14 | 景旺电子科技(珠海)有限公司 | Printed circuit board and manufacturing method thereof |
| CN112687781A (en) * | 2020-12-22 | 2021-04-20 | 珠海市沃德科技有限公司 | Processing method of LED mirror lamp panel for COB packaging |
| CN114068794A (en) * | 2021-11-11 | 2022-02-18 | 深圳市中美欧光电科技有限公司 | COB (chip on board) packaging mirror surface aluminum substrate and processing technology thereof |
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Effective date of registration: 20200410 Address after: 211600 Kanglou Road, Dailou Town, Jinhu County, Huai'an City, Jiangsu Province Patentee after: Jiangsu Shangfu Electronics Co.,Ltd. Address before: 210000 Cai Lane Industrial Zone, Gan Xiang lane, Qixia District, Nanjing, Jiangsu Patentee before: NANJING SUNFULL ELECTRONIC CIRCUIT Co.,Ltd. |
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Address after: Kanglou Road, Industrial Concentration Zone, Dailou Town, Jinhu County, Huai'an City, Jiangsu Province, 211600 Patentee after: Jiangsu Shangfu Electronics Co.,Ltd. Address before: 211600 Kanglou Road, Industrial Concentration Zone, Dalou Town, Jinhu County, Huai'an City, Jiangsu Province Patentee before: Jiangsu Shangfu Electronics Co.,Ltd. |