CN105632940B - A kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board - Google Patents
A kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board Download PDFInfo
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- CN105632940B CN105632940B CN201511031067.2A CN201511031067A CN105632940B CN 105632940 B CN105632940 B CN 105632940B CN 201511031067 A CN201511031067 A CN 201511031067A CN 105632940 B CN105632940 B CN 105632940B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
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Abstract
The invention discloses a kind of polycrystalline COB to encapsulate mirror-surface aluminum base board, belongs to COB encapsulation technologies field, technical points include the following steps：(1) preparation of circuit base plate；(2) preparation of PP prepregs；(3) preparation of specular aluminium；(4) riveted；(5) plate-laying；(6) it presses；(7) shape fabricating；The present invention is intended to provide a kind of process more simplifies, product yield is higher and manufactures the production method that lower-cost polycrystalline COB encapsulates mirror-surface aluminum base board；Mirror-surface aluminum base board is encapsulated for making polycrystalline COB.
Description
Technical field
The present invention relates to a kind of aluminum substrate preparation methods, and more specifically more particularly to a kind of polycrystalline COB encapsulates specular aluminium
The production method of substrate.
Background technology
COB encapsulation is chip On board, and exactly bare chip conduction or non-conductive adhesive are adhered on interconnection substrates,
Then it carries out wire bonding and realizes its electrical connection.If bare chip is directly exposed in air, vulnerable to pollution or artificial damage,
Chip functions are influenced or destroyed, then just chip and bonding wire are encapsulated with glue.People are also referred to as this packing forms
Soft Roll seals.And mirror-like silver aluminum substrate is the raw material for being most suitable for COB encapsulation.Currently, the system of existing COB encapsulation mirror-surface aluminum base board
Make method, after needing glued membrane vacation to be attached to circuit base plate->Bore datum hole positioning->Milling crystal bonding area internal model->Precuring->It will post again
The circuit base plate vacation of glued membrane is labelled on minute surface aluminium sheet->Finally pressing working procedure is carried out again.Haves the shortcomings that tedious process complexity.
Invention content
More simplify it is an object of the invention in view of the above shortcomings of the prior art, providing a kind of process, product yield
Production method that is higher and manufacturing lower-cost polycrystalline COB encapsulation mirror-surface aluminum base board.
The technical proposal of the invention is realized in this way：A kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board, including
Following steps：(1) preparation of circuit base plate；(2) preparation of PP prepregs；(3) preparation of specular aluminium；(4) riveted；(5) it arranges
Plate；(6) it presses；(7) preparation of shape fabricating, wherein step (2) the PP prepregs is specially：(a) selection：It selects conventional
The low flow prepreg of FR-4PP or NF-PP；(b) it cuts：Low flow prepreg is pressed to the size of step (1) circuit base plate
Cut into the dimensions that production needs；
(c) internal model figure in crystal bonding area is molded：Exposed figure is made using punching machine and diel；Exposed size is more than line
The internal model figure of road plate, while producing location hole and rivet hole；
Step (4) described riveted is specially：Wiring board, PP semi-solid preparations are overlapped, and are combined using fuse machine rivet hot
Form COB plates；Its riveted parameter is：Heating temperature is 180~205 DEG C, 10~30 seconds heating times.
In a kind of production method of above-mentioned polycrystalline COB encapsulation mirror-surface aluminum base boards：The preparation of step (1) described circuit base plate
Specially：
(a) sawing sheet：Single-side coated copper plate is cut into the dimensions that production needs；
(b) brush board：By the oxide layer on copper-clad plate surface and foreign matter jettisoning；
(c) it is coated with light-sensitive surface：One layer of light-sensitive surface is uniformly coated on the copper foil of copper-clad plate surface；
(d) preliminary drying：The copper-clad plate placement of printed wet film is toasted in an oven, 90~100 DEG C of temperature, 10~15 points of time
Clock；
(e) it exposes：The circuit egative film that advance light has been painted is covered in pre-baked copper-clad plate, is exposed with ultraviolet exposure machine
Light, energy setting value are 150 millijoules；
(f) develop：Copper-clad plate after single exposure is developed by developing machine, developer solution is the nothing of weight ratio 1%~3%
Aqueous sodium carbonate aqueous solution, temperature are 25~35 DEG C, and the time is 0.5~1 minute；
(g) AOI is examined：Automatic optical checking machine detects the integrality of line pattern；
(h) it etches：It will not eroded by the layers of copper that wet film covers with acid copper chloride etching liquid, retain the circuit of needs
Copper foil, the condition of etching solution：Copper content is 120~150g/l, and acid amount is 2~3N, and oxidation-reduction potential is 300~500mv, temperature
Degree is 40~50 DEG C；
(i) striping：The circuit surface wet film after etching is removed with the sodium hydroxide solution of a concentration of weight ratio 3~5%
Totally；
(j) pre-treatment：Brush grinding machine or sand-blasting machine can be used, the oxide layer throwing on circuit base plate surface is brushed off；
(k) welding resistance white oil is printed：With the method for silk-screen printing, the circuit base plate surface after pretreatment cleaning uniformly coats sense
Light white oil；Welding resistance oil prebake conditions：The circuit base plate placement of printed welding resistance white oil is toasted in an oven, baking temperature 70~80
DEG C, the time is 20~30 minutes；
(m) welding resistance exposes：The welding resistance egative film that advance light has been painted is covered on secondary pre-baked circuit base plate, with 7~
10KW ultraviolet exposure machines expose, and energy setting value is 750~950 millijoules；
(n) welding resistance is developed：Circuit base plate after re-expose is developed by developing machine, developer solution is weight ratio 2~3%
Carbon Dioxide sodium water solution, temperature be 25~35 DEG C, the time be 0.5~1.5 minute；
(o) 150~165 DEG C of baking-curing baking temperature, time are 50~70 minutes afterwards；
(p) chemical NiPdAu：In the one laminated gold plate of coating surface for beating gold thread pad；
(q) datum hole and rivet hole are bored：The figure that circuit location hole is first identified using full-automatic image puncher, is then bored
Location hole and rivet hole；
(r) crystal bonding area internal model：It is positioned using the location hole being drilled, circuit base plate processes required mirror on accurate punching machine
The exposed figure in face makes exposed figure using stamping mode；
In a kind of production method of above-mentioned polycrystalline COB encapsulation mirror-surface aluminum base boards：The preparation of step (3) described specular aluminium has
Body is：Using total reflectivity>98%, diffusing reflection rate<5% mirror-surface aluminum base board is cut to required size.
In a kind of production method of above-mentioned polycrystalline COB encapsulation mirror-surface aluminum base boards：Step (5) described plate-laying is specially：By
Sequentially by the good COB plates of steel plate, brown paper, high temperature resistant release film, riveted and mirror-surface aluminum base board arrangement overlapping under.
In a kind of production method of above-mentioned polycrystalline COB encapsulation mirror-surface aluminum base boards：Step (6) it is described pressing be specially：
On Vacuum Heat pressing machine, point seven stepwise heating pressurizations are sequentially：Stage one：80~100psi of pressure, temperature 120~130
DEG C, 8~12 minutes time；Stage two：120~150psi of pressure, 130~140 DEG C of temperature, 8~12 minutes time；Stage three：
250~280psi of pressure, 135~145 DEG C of temperature, 8~12 minutes time；Stage four：300~320psi of pressure, temperature 160~
170 DEG C, 15~20 minutes time；Stage five：330~350psi of pressure, 190~200 DEG C of temperature, 8~12 minutes time；Rank
Section six：330~350psi of pressure, 200~210 DEG C of temperature, 50~60 minutes time；Stage seven：180~200psi of pressure, temperature
140~160 DEG C of degree, 30~40 minutes time；Each stage continuously performs.
In a kind of production method of above-mentioned polycrystalline COB encapsulation mirror-surface aluminum base boards：Step (7) described shape fabricating is specific
For：It is molded using numerical control drilling-milling shape or using stamping mode according to shape requirement selection.
In a kind of production method of above-mentioned polycrystalline COB encapsulation mirror-surface aluminum base boards：Step (1) (c) described light-sensitive surface is sense
Light wet film or photosensitive dry film.
After the present invention uses above-mentioned technique, compared with prior art, have the advantages that following：
(1) present invention uses the prepreg that conventional multilayer circuit board is used to be bonded material as circuit base plate and specular aluminium
Material, while using processing procedure/equipment of hardboard PCB.Since processing procedure/equipment/material of PCB FPC that compares is more universal, have in cost
Standby advantage.
(2) using the pressing manufacturing procedure of conventional multilayer circuit board；It has reduced or remitted complicated glued membrane vacation and has been attached to circuit base plate
Afterwards->Bore datum hole positioning->Milling crystal bonding area internal model->Precuring->The circuit base plate vacation for posting glued membrane is labelled to minute surface aluminium sheet again
Upper->Finally pressing working procedure is carried out again.Since process simplification improves product yield and manufactures cost.
(3) mold forming is optimized using accurate stamping, and according to gummosis direction when being expected to press in making prepreg
The shape of prepreg.Therefore the method can make the COB mirror-surface aluminum base boards of minute surface internal model complexity
(4) process simplified and the advantage for using ripe equipment also to realize product mass production.
Specific implementation mode
With reference to specific embodiment, the present invention is described in further detail, but does not constitute to any of the present invention
Limitation.
A kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base boards of the present invention, includes the following steps：
(1) preparation of circuit base plate；Specially：
(a) sawing sheet：Single-side coated copper plate is cut into the dimensions that production needs；
(b) brush board：By the oxide layer on copper-clad plate surface and foreign matter jettisoning；
(c) it is coated with light-sensitive surface：One layer of light-sensitive surface is uniformly coated on the copper foil of copper-clad plate surface；The light-sensitive surface is photosensitive wet
Film or photosensitive dry film；Preferably lower-cost photosensitive wet film；
(d) preliminary drying：The copper-clad plate placement of printed wet film is toasted in an oven, 90~100 DEG C of temperature, 10~15 points of time
Clock；
(e) it exposes：The circuit egative film that advance light has been painted is covered in pre-baked copper-clad plate, is exposed with ultraviolet exposure machine
Light, energy setting value are 150 millijoules；
(f) develop：Copper-clad plate after single exposure is developed by developing machine, developer solution is the nothing of weight ratio 1%~3%
Aqueous sodium carbonate aqueous solution, temperature are 25~35 DEG C, and the time is 0.5~1 minute；
(g) AOI is examined：Automatic optical checking machine detects the integrality of line pattern；
(h) it etches：It will not eroded by the layers of copper that wet film covers with acid copper chloride etching liquid, retain the circuit of needs
Copper foil, the condition of etching solution：Copper content is 120~150g/l, and acid amount is 2~3N, and oxidation-reduction potential is 300~500mv,
Temperature is 40~50 DEG C；
(i) striping：The circuit surface wet film after etching is removed with the sodium hydroxide solution of a concentration of weight ratio 3~5%
Totally；
(j) pre-treatment：Brush grinding machine or sand-blasting machine can be used, the oxide layer throwing on circuit base plate surface is brushed off；
(k) welding resistance white oil is printed：With the method for silk-screen printing, the circuit base plate surface after pretreatment cleaning uniformly coats sense
Light white oil；Welding resistance oil prebake conditions：The circuit base plate placement of printed welding resistance white oil is toasted in an oven, baking temperature 70~80
DEG C, the time is 20~30 minutes；
(m) welding resistance exposes：The welding resistance egative film that advance light has been painted is covered on secondary pre-baked circuit base plate, with 7~
10KW ultraviolet exposure machines expose, and energy setting value is 750~950 millijoules；
(n) welding resistance is developed：Circuit base plate after re-expose is developed by developing machine, developer solution is weight ratio 2~3%
Carbon Dioxide sodium water solution, temperature be 25~35 DEG C, the time be 0.5~1.5 minute；
(o) 150~165 DEG C of baking-curing baking temperature, time are 50~70 minutes afterwards；
(p) chemical NiPdAu：In the one laminated gold plate of coating surface for beating gold thread pad；
(q) datum hole and rivet hole are bored：The figure that circuit location hole is first identified using full-automatic image puncher, is then bored
Location hole and rivet hole；
(r) crystal bonding area internal model：It is positioned using the location hole being drilled, circuit base plate processes required mirror on accurate punching machine
The exposed figure in face makes exposed figure using stamping mode；
(2) preparation of PP prepregs；Specially：
(a) selection：Select the low flow prepreg of routine FR-4PP or NF-PP；
(b) it cuts：Low flow prepreg is cut into the size that production needs by the size of step (1) circuit base plate to advise
Lattice；
(c) internal model figure in crystal bonding area is molded：Exposed figure is made using punching machine and diel；Exposed size is more than line
The internal model figure of road plate, while producing location hole and rivet hole；
(3) preparation of specular aluminium；Specially：Using total reflectivity>98%, diffusing reflection rate<5% mirror-surface aluminum base board is cut out
It cuts to required size.
(4) riveted；Specially：Wiring board, PP semi-solid preparations are overlapped, and are combined to form COB using fuse machine rivet hot
Plate；Its riveted parameter is：Heating temperature is 180~205 DEG C, 10~30 seconds heating times.Using the hot riveting technique, precision is reachable
It to+/~1mil (0.025mm), can be accurately positioned, be conducive to make the relative complex COB products of figure.
(5) plate-laying；Specially：From top to bottom sequentially by the good COB plates of steel plate, brown paper, high temperature resistant release film, riveted and
Mirror-surface aluminum base board arrangement overlapping.
(6) it presses；Specially：On Vacuum Heat pressing machine, point seven stepwise heating pressurizations are sequentially：Stage one：Pressure
80~100psi, 120~130 DEG C of temperature, 8~12 minutes time；Stage two：120~150psi of pressure, temperature 130~140
DEG C, 8~12 minutes time；Stage three：250~280psi of pressure, 135~145 DEG C of temperature, 8~12 minutes time；Stage four：
300~320psi of pressure, 160~170 DEG C of temperature, 15~20 minutes time；Stage five：330~350psi of pressure, temperature 190
~200 DEG C, 8~12 minutes time；Stage six：330~350psi of pressure, 200~210 DEG C of temperature, 50~60 minutes time；Rank
Section seven：180~200psi of pressure, 140~160 DEG C of temperature, 30~40 minutes time；Each stage continuously performs.Stage one is in temperature
Degree is started the clock when rising to 120 DEG C.
(7) shape fabricating, specially：According to shape requirement selection using numerical control drilling-milling shape or using stamping mode at
Type.
Embodiment 1
A kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board, includes the following steps：
(1) preparation of circuit base plate；Specially：
(a) sawing sheet：Single-side coated copper plate is cut into the dimensions that production needs；
(b) brush board：By the oxide layer on copper-clad plate surface and foreign matter jettisoning；
(c) it is coated with light-sensitive surface：One layer of light-sensitive surface is uniformly coated on the copper foil of copper-clad plate surface；The light-sensitive surface is photosensitive wet
Film or photosensitive dry film；Preferably lower-cost photosensitive wet film；
(d) preliminary drying：The copper-clad plate placement of printed wet film is toasted in an oven, 90 DEG C of temperature, 15 minutes time；
(e) it exposes：The circuit egative film that advance light has been painted is covered in pre-baked copper-clad plate, is exposed with ultraviolet exposure machine
Light, energy setting value are 150 millijoules；
(f) develop：Copper-clad plate after single exposure is developed by developing machine, developer solution is the anhydrous carbon of weight ratio 1%
Acid sodium aqueous solution, temperature are 25 DEG C, and the time is 1 minute；
(g) AOI is examined：Automatic optical checking machine detects the integrality of line pattern；
(h) it etches：It will not eroded by the layers of copper that wet film covers with acid copper chloride etching liquid, retain the circuit of needs
Copper foil, the condition of etching solution：Copper content is 120g/l, and acid amount is 3N, and oxidation-reduction potential 500mv, temperature is 50 DEG C；
(i) striping：The circuit surface wet film after etching is removed totally with the sodium hydroxide solution of a concentration of weight ratio 3；
(j) pre-treatment：Brush grinding machine or sand-blasting machine can be used, the oxide layer throwing on circuit base plate surface is brushed off；
(k) welding resistance white oil is printed：With the method for silk-screen printing, the circuit base plate surface after pretreatment cleaning uniformly coats sense
Light white oil；Welding resistance oil prebake conditions：The circuit base plate placement of printed welding resistance white oil is toasted in an oven, 70 DEG C of baking temperature, when
Between be 30 minutes；
(m) welding resistance exposes：The welding resistance egative film that advance light has been painted is covered on secondary pre-baked circuit base plate, uses 7KW
Ultraviolet exposure machine exposes, and energy setting value is 950 millijoules；
(n) welding resistance is developed：Circuit base plate after re-expose is developed by developing machine, developer solution is weight ratio 2%
Carbon Dioxide sodium water solution, temperature are 25 DEG C, and the time is 1.5 minutes；
(o) 150 DEG C of baking-curing baking temperature, time are 70 minutes afterwards；
(p) chemical NiPdAu：In the one laminated gold plate of coating surface for beating gold thread pad；
(q) datum hole and rivet hole are bored：The figure that circuit location hole is first identified using full-automatic image puncher, is then bored
Location hole and rivet hole；
(r) crystal bonding area internal model：It is positioned using the location hole being drilled, circuit base plate processes required mirror on accurate punching machine
The exposed figure in face makes exposed figure using stamping mode；
(2) preparation of PP prepregs；Specially：
(a) selection：Select the low flow prepreg of routine FR-4PP；
(b) it cuts：Low flow prepreg is cut into the size that production needs by the size of step (1) circuit base plate to advise
Lattice；
(c) internal model figure in crystal bonding area is molded：Exposed figure is made using punching machine and diel；Exposed size is more than line
The internal model figure of road plate, while producing location hole and rivet hole；
(3) preparation of specular aluminium；Specially：Using total reflectivity>98%, diffusing reflection rate<5% mirror-surface aluminum base board is cut out
It cuts to required size.
(4) riveted；Specially：Wiring board, PP semi-solid preparations are overlapped, and are combined to form COB using fuse machine rivet hot
Plate；Its riveted parameter is：Heating temperature is 180 DEG C, 30 seconds heating times.
(5) plate-laying；Specially：From top to bottom sequentially by the good COB plates of steel plate, brown paper, high temperature resistant release film, riveted and
Mirror-surface aluminum base board arrangement overlapping.
(6) it presses；Specially：On Vacuum Heat pressing machine, point seven stepwise heating pressurizations are sequentially：Stage one：Pressure
80psi, 130 DEG C of temperature, 12 minutes time；Stage two：Pressure 120psi, 140 DEG C of temperature, 12 minutes time；Stage three：Pressure
250psi, 145 DEG C of temperature, 12 minutes time；Stage four：Pressure 300psi, 170 DEG C of temperature, 20 minutes time；Stage five：Pressure
Power 330psi, 200 DEG C of temperature, 12 minutes time；Stage six：Pressure 330psi, 210 DEG C of temperature, 60 minutes time；Stage seven：
Pressure 180psi, 160 DEG C of temperature, 40 minutes time；Each stage continuously performs.
(7) shape fabricating, specially：According to shape requirement selection using numerical control drilling-milling shape or using stamping mode at
Type.
Embodiment 2
A kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board, includes the following steps：
(1) preparation of circuit base plate；Specially：
(a) sawing sheet：Single-side coated copper plate is cut into the dimensions that production needs；
(b) brush board：By the oxide layer on copper-clad plate surface and foreign matter jettisoning；
(c) it is coated with light-sensitive surface：One layer of light-sensitive surface is uniformly coated on the copper foil of copper-clad plate surface；The light-sensitive surface is photosensitive wet
Film or photosensitive dry film；Preferably lower-cost photosensitive wet film；
(d) preliminary drying：The copper-clad plate placement of printed wet film is toasted in an oven, 100 DEG C of temperature, 10 minutes time；
(e) it exposes：The circuit egative film that advance light has been painted is covered in pre-baked copper-clad plate, is exposed with ultraviolet exposure machine
Light, energy setting value are 150 millijoules；
(f) develop：Copper-clad plate after single exposure is developed by developing machine, developer solution is the anhydrous carbon of weight ratio 3%
Acid sodium aqueous solution, temperature are 25 DEG C, and the time is 0.5 minute；
(g) AOI is examined：Automatic optical checking machine detects the integrality of line pattern；
(h) it etches：It will not eroded by the layers of copper that wet film covers with acid copper chloride etching liquid, retain the circuit of needs
Copper foil, the condition of etching solution：Copper content is 150g/l, and acid amount is 2N, and oxidation-reduction potential 300mv, temperature is 40 DEG C；
(i) striping：The circuit surface wet film after etching is removed with the sodium hydroxide solution of a concentration of weight ratio 5% and is done
Only；
(j) pre-treatment：Brush grinding machine or sand-blasting machine can be used, the oxide layer throwing on circuit base plate surface is brushed off；
(k) welding resistance white oil is printed：With the method for silk-screen printing, the circuit base plate surface after pretreatment cleaning uniformly coats sense
Light white oil；Welding resistance oil prebake conditions：The circuit base plate placement of printed welding resistance white oil is toasted in an oven, 80 DEG C of baking temperature, when
Between be 20 minutes；
(m) welding resistance exposes：The welding resistance egative film that advance light has been painted is covered on secondary pre-baked circuit base plate, is used
10KW ultraviolet exposure machines expose, and energy setting value is 750 millijoules；
(n) welding resistance is developed：Circuit base plate after re-expose is developed by developing machine, developer solution is weight ratio 3%
Carbon Dioxide sodium water solution, temperature are 25 DEG C, and the time is 0.5 minute；
(o) 165 DEG C of baking-curing baking temperature, time are 50 minutes afterwards；
(p) chemical NiPdAu：In the one laminated gold plate of coating surface for beating gold thread pad；
(q) datum hole and rivet hole are bored：The figure that circuit location hole is first identified using full-automatic image puncher, is then bored
Location hole and rivet hole；
(r) crystal bonding area internal model：It is positioned using the location hole being drilled, circuit base plate processes required mirror on accurate punching machine
The exposed figure in face makes exposed figure using stamping mode；
(2) preparation of PP prepregs；Specially：
(a) selection：Select the low flow prepreg of routine NF-PP；
(b) it cuts：Low flow prepreg is cut into the size that production needs by the size of step (1) circuit base plate to advise
Lattice；
(c) internal model figure in crystal bonding area is molded：Exposed figure is made using punching machine and diel；Exposed size is more than line
The internal model figure of road plate, while producing location hole and rivet hole；
(3) preparation of specular aluminium；Specially：Using total reflectivity>98%, diffusing reflection rate<5% mirror-surface aluminum base board is cut out
It cuts to required size.
(4) riveted；Specially：Wiring board, PP semi-solid preparations are overlapped, and are combined to form COB using fuse machine rivet hot
Plate；Its riveted parameter is：Heating temperature is 205 DEG C, 10 seconds heating times.
(5) plate-laying；Specially：From top to bottom sequentially by the good COB plates of steel plate, brown paper, high temperature resistant release film, riveted and
Mirror-surface aluminum base board arrangement overlapping.
(6) it presses；Specially：On Vacuum Heat pressing machine, point seven stepwise heating pressurizations are sequentially：Stage one：Pressure
100psi, 120 DEG C of temperature, 8 minutes time；Stage two：Pressure 150psi, 130 DEG C of temperature, 8 minutes time；Stage three：Pressure
280psi, 135 DEG C of temperature, 8 minutes time；Stage four：Pressure 320psi, 160 DEG C of temperature, 15 minutes time；Stage five：Pressure
350psi, 190 DEG C of temperature, 8 minutes time；Stage six：Pressure 350psi, 200 DEG C of temperature, 50 minutes time；Stage seven：Pressure
200psi, 140 DEG C of temperature, 30 minutes time；Each stage continuously performs.
(7) shape fabricating, specially：According to shape requirement selection using numerical control drilling-milling shape or using stamping mode at
Type.
Embodiment 3
A kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board, includes the following steps：
(1) preparation of circuit base plate；Specially：
(a) sawing sheet：Single-side coated copper plate is cut into the dimensions that production needs；
(b) brush board：By the oxide layer on copper-clad plate surface and foreign matter jettisoning；
(c) it is coated with light-sensitive surface：One layer of light-sensitive surface is uniformly coated on the copper foil of copper-clad plate surface；The light-sensitive surface is photosensitive wet
Film or photosensitive dry film；Preferably lower-cost photosensitive wet film；
(d) preliminary drying：The copper-clad plate placement of printed wet film is toasted in an oven, 95 DEG C of temperature, 12 minutes time；
(e) it exposes：The circuit egative film that advance light has been painted is covered in pre-baked copper-clad plate, is exposed with ultraviolet exposure machine
Light, energy setting value are 150 millijoules；
(f) develop：Copper-clad plate after single exposure is developed by developing machine, developer solution is the anhydrous carbon of weight ratio 2%
Acid sodium aqueous solution, temperature are 30 DEG C, and the time is 0.8 minute；
(g) AOI is examined：Automatic optical checking machine detects the integrality of line pattern；
(h) it etches：It will not eroded by the layers of copper that wet film covers with acid copper chloride etching liquid, retain the circuit of needs
Copper foil, the condition of etching solution：Copper content is 130g/l, and acid amount is 2.5N, and oxidation-reduction potential 400mv, temperature is 45 DEG C；
(i) striping：The circuit surface wet film after etching is removed with the sodium hydroxide solution of a concentration of weight ratio 4% and is done
Only；
(j) pre-treatment：Brush grinding machine or sand-blasting machine can be used, the oxide layer throwing on circuit base plate surface is brushed off；
(k) welding resistance white oil is printed：With the method for silk-screen printing, the circuit base plate surface after pretreatment cleaning uniformly coats sense
Light white oil；Welding resistance oil prebake conditions：The circuit base plate placement of printed welding resistance white oil is toasted in an oven, baking temperature 70~80
DEG C, the time is 20~30 minutes；
(m) welding resistance exposes：The welding resistance egative film that advance light has been painted is covered on secondary pre-baked circuit base plate, uses 8KW
Ultraviolet exposure machine exposes, and energy setting value is 850 millijoules；
(n) welding resistance is developed：Circuit base plate after re-expose is developed by developing machine, developer solution is weight ratio 2.5%
Carbon Dioxide sodium water solution, temperature be 30 DEG C, the time be 1 minute；
(o) 160 DEG C of baking-curing baking temperature, time are 60 minutes afterwards；
(p) chemical NiPdAu：In the one laminated gold plate of coating surface for beating gold thread pad；
(q) datum hole and rivet hole are bored：The figure that circuit location hole is first identified using full-automatic image puncher, is then bored
Location hole and rivet hole；
(r) crystal bonding area internal model：It is positioned using the location hole being drilled, circuit base plate processes required mirror on accurate punching machine
The exposed figure in face makes exposed figure using stamping mode；
(2) preparation of PP prepregs；Specially：
(a) selection：Select the low flow prepreg of routine NF-PP；
(b) it cuts：Low flow prepreg is cut into the size that production needs by the size of step (1) circuit base plate to advise
Lattice；
(c) internal model figure in crystal bonding area is molded：Exposed figure is made using punching machine and diel；Exposed size is more than line
The internal model figure of road plate, while producing location hole and rivet hole；
(3) preparation of specular aluminium；Specially：Using total reflectivity>98%, diffusing reflection rate<5% mirror-surface aluminum base board is cut out
It cuts to required size.
(4) riveted；Specially：Wiring board, PP semi-solid preparations are overlapped, and are combined to form COB using fuse machine rivet hot
Plate；Its riveted parameter is：Heating temperature is 195 DEG C, 20 seconds heating times.
(5) plate-laying；Specially：From top to bottom sequentially by the good COB plates of steel plate, brown paper, high temperature resistant release film, riveted and
Mirror-surface aluminum base board arrangement overlapping.
(6) it presses；Specially：On Vacuum Heat pressing machine, point seven stepwise heating pressurizations are sequentially：Stage one：Pressure
90psi, 125 DEG C of temperature, 10 minutes time；Stage two：Pressure 135psi, 135 DEG C of temperature, 10 minutes time；Stage three：Pressure
265psi, 140 DEG C of temperature, 10 minutes time；Stage four：Pressure 310psi, 165 DEG C of temperature, 18 minutes time；Stage five：Pressure
Power 340psi, 195 DEG C of temperature, 10 minutes time；Stage six：Pressure 340psi, 205 DEG C of temperature, 55 minutes time；Stage seven：
Pressure 190psi, 150 DEG C of temperature, 35 minutes time；Each stage continuously performs.
(7) shape fabricating, specially：According to shape requirement selection using numerical control drilling-milling shape or using stamping mode at
Type.
Embodiment provided above is the better embodiment of the present invention, only is used for facilitating illustrating the present invention, not to this hair
It is bright to make any form of restriction, any those of ordinary skill in the art, if not departing from the put forward skill of the present invention
In the range of art feature, using the equivalent embodiment for locally changing or modifying made by disclosed technology contents, and
Without departing from the technical feature content of the present invention, in the range of still falling within the technology of the present invention feature.
Claims (7)
1. a kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board, includes the following steps：(1) preparation of circuit base plate；(2)
The preparation of PP prepregs；(3) preparation of specular aluminium；(4) riveted；(5) plate-laying；(6) it presses；(7) shape fabricating, feature exist
In,
The preparation of step (2) the PP prepregs is specially：(a) selection：Select the low gummosis half of routine FR-4PP or NF-PP
Cured sheets；(b) it cuts：Low flow prepreg is cut into the size that production needs by the size of step (1) circuit base plate to advise
Lattice；
(c) internal model figure in crystal bonding area is molded：Exposed figure is made using punching machine and diel；Exposed size is more than wiring board
Internal model figure, while producing location hole and rivet hole；
Step (4) described riveted is specially：Wiring board, PP semi-solid preparations are overlapped, and are combined to be formed using fuse machine rivet hot
COB plates；Its riveted parameter is：Heating temperature is 180~205 DEG C, 10~30 seconds heating times.
2. a kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board according to claim 1, it is characterised in that：Step
(1) preparation of the circuit base plate is specially：
(a) sawing sheet：Single-side coated copper plate is cut into the dimensions that production needs；
(b) brush board：By the oxide layer on copper-clad plate surface and foreign matter jettisoning；
(c) it is coated with light-sensitive surface：One layer of light-sensitive surface is uniformly coated on the copper foil of copper-clad plate surface；
(d) preliminary drying：The copper-clad plate placement of printed wet film is toasted in an oven, 90~100 DEG C of temperature, 10~15 minutes time；
(e) it exposes：The circuit egative film that advance light has been painted is covered in pre-baked copper-clad plate, is exposed with ultraviolet exposure machine, energy
Amount setting value is 150 millijoules；
(f) develop：Copper-clad plate after single exposure is developed by developing machine, uses the nothing that developer solution is weight ratio 1%~3%
Aqueous sodium carbonate aqueous solution, temperature are 25~35 DEG C, and the time is 0.5~1 minute；
(g) AOI is examined：Automatic optical checking machine detects the integrality of line pattern；
(h) it etches：It will not eroded by the layers of copper that wet film covers with acid copper chloride etching liquid, retain the circuit copper of needs
Foil, the condition of etching solution：Copper content is 120~150g/l, and acid amount is 2~3N, and oxidation-reduction potential is 300~500mv, temperature
It is 40~50 DEG C；
(i) striping：The circuit surface wet film after etching is removed with the sodium hydrate aqueous solution of a concentration of weight ratio 3~5% and is done
Only；
(j) pre-treatment：Brush grinding machine or sand-blasting machine can be used, the oxide layer throwing on circuit base plate surface is brushed off；
(k) welding resistance white oil is printed：With the method for silk-screen printing, the circuit base plate surface after pretreatment cleaning uniformly coats photosensitive white
Oil；Welding resistance oil prebake conditions：The circuit base plate placement of printed welding resistance white oil is toasted in an oven, 70~80 DEG C of baking temperature, when
Between be 20~30 minutes；
(m) welding resistance exposes：The welding resistance egative film that advance light has been painted is covered on secondary pre-baked circuit base plate, with 7~10KW
Ultraviolet exposure machine exposes, and energy setting value is 750~950 millijoules；
(n) welding resistance is developed：Circuit base plate after re-expose is developed by developing machine, developer solution is the nothing of weight ratio 2~3%
Aqueous sodium carbonate aqueous solution, temperature are 25~35 DEG C, and the time is 0.5~1.5 minute；
(o) 150~165 DEG C of baking-curing baking temperature, time are 50~70 minutes afterwards；
(p) chemical NiPdAu：In the one laminated gold plate of coating surface for beating gold thread pad；
(q) datum hole and rivet hole are bored：The figure of circuit location hole is first identified using full-automatic image puncher, then bores positioning
Hole and rivet hole；
(r) crystal bonding area internal model：It is positioned using the location hole being drilled, it is naked that circuit base plate processes required minute surface on accurate punching machine
Dew figure makes exposed figure using stamping mode.
3. a kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board according to claim 1, it is characterised in that：Step
(3) preparation of the specular aluminium is specially：Using total reflectivity>98%, diffusing reflection rate<5% mirror-surface aluminum base board is cut to institute
Need size.
4. a kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board according to claim 1, it is characterised in that：Step
(5) plate-laying is specially：From top to bottom sequentially by steel plate, brown paper, high temperature resistant release film, riveted good COB plates and minute surface
Aluminum substrate arrangement overlapping.
5. a kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board according to claim 1, it is characterised in that：Step
(6) described press is specially：On Vacuum Heat pressing machine, point seven stepwise heating pressurizations are sequentially：Stage one：Pressure 80~
100psi, 120~130 DEG C of temperature, 8~12 minutes time；Stage two：120~150psi of pressure, 130~140 DEG C of temperature, when
Between 8~12 minutes；Stage three：250~280psi of pressure, 135~145 DEG C of temperature, 8~12 minutes time；Stage four：Pressure
300~320psi, 160~170 DEG C of temperature, 15~20 minutes time；Stage five：330~350psi of pressure, temperature 190~200
DEG C, 8~12 minutes time；Stage six：330~350psi of pressure, 200~210 DEG C of temperature, 50~60 minutes time；Stage seven：
180~200psi of pressure, 140~160 DEG C of temperature, 30~40 minutes time；Each stage continuously performs.
6. a kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board according to claim 1, it is characterised in that：Step
(7) shape fabricating is specially：It is molded using numerical control drilling-milling shape or using stamping mode according to shape requirement selection.
7. a kind of production method of polycrystalline COB encapsulation mirror-surface aluminum base board according to claim 2, it is characterised in that：Step
(1) (c) described light-sensitive surface is photosensitive wet film or photosensitive dry film.
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| CN103855036A (en) * | 2012-11-30 | 2014-06-11 | 南京尚孚电子电路有限公司 | Manufacture method of polycrystalline chip on board (COB) encapsulation mirror surface aluminum substrate |
| CN204792890U (en) * | 2015-06-30 | 2015-11-18 | 深圳市可瑞电子实业有限公司 | Novel COB base plate |
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| CN103855036A (en) * | 2012-11-30 | 2014-06-11 | 南京尚孚电子电路有限公司 | Manufacture method of polycrystalline chip on board (COB) encapsulation mirror surface aluminum substrate |
| CN204792890U (en) * | 2015-06-30 | 2015-11-18 | 深圳市可瑞电子实业有限公司 | Novel COB base plate |
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