CN109922612A - A kind of HDI board manufacturing method and HDI plate - Google Patents
A kind of HDI board manufacturing method and HDI plate Download PDFInfo
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- CN109922612A CN109922612A CN201910222434.9A CN201910222434A CN109922612A CN 109922612 A CN109922612 A CN 109922612A CN 201910222434 A CN201910222434 A CN 201910222434A CN 109922612 A CN109922612 A CN 109922612A
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Abstract
The invention discloses a kind of HDI board manufacturing method and HDI plates, after the present invention handles core plate by core plate processing step, brownification is carried out on core plate after treatment, after pasting prepreg and protective film, drilling is carried out in the position of the micropore of corresponding core plate and carries out filling perforation using conductive paste to obtain interconnection unit, finally, press multiple interconnection units disposably to realize that random layer interconnects, HDI plate is made, utilize conductive paste filling perforation, filling perforation is high-efficient, in addition, the core plate of conductive paste and prepreg will be covered with as an interconnection unit, multiple interconnection units, which disposably press, is made HDI plate, without successively overlapping production plank, effectively increase the producing efficiency of HDI plate, overcome and utilizes conventional layered manner technique production HDI plate in the prior art, process flow is extremely long, cause the producing efficiency of HDI plate very low The technical issues of.
Description
Technical field
The present invention relates to PCB technical field, especially a kind of HDI board manufacturing method and HDI plate.
Background technique
HDI is the abbreviation of high density interconnection (High Density Interconnector), is production printed circuit board
A kind of (technology), uses a kind of circuit board that route distribution density is relatively high of micro- blind buried via hole technology.
With the development of science and technology, board production realizes automation, the production efficiency of circuit board is dramatically improved.
However, for the production process of HDI plate, it is known that in technology, made of conventional layered manner technique, process flow pole
It is long, cause the producing efficiency of HDI plate still very low, therefore, needs to improve this problem.
Summary of the invention
The present invention is directed to solve at least some of the technical problems in related technologies.For this purpose, of the invention
One purpose is to provide a kind of HDI board manufacturing method, for improving the producing efficiency of HDI plate.
For this purpose, utilizing HDI plate made from the HDI board manufacturing method a second object of the present invention is to provide a kind of.
The technical scheme adopted by the invention is that:
In a first aspect, the present invention provides a kind of HDI board manufacturing method, comprising:
Core plate processing step carries out brill micropore to core plate, blind hole plating is filled and led up and pattern transfer；
Interconnection unit obtaining step, after carrying out brownification, patch prepreg and protective film to the core plate, in the semi-solid preparation
The position that piece corresponds to the micropore of the core plate drills, and carries out consent to the prepreg using conductive paste and is heating and curing
The conductive paste, the core plate after removing the protective film are an interconnection unit；
Step is pressed, multiple interconnection units is obtained and carries out disposable superposition pressing, realized by the conductive paste more
Random layer interconnection is between a interconnection unit to be made HDI plate.
Further, the pressing step includes:
Sub-step is pressed, according to copper foil, prepreg, multiple interconnection units, the prepreg, copper foil being sequentially overlapped
Overlay order disposably pressed；
Sub-step is interconnected, drilling is carried out in the position of the micropore of corresponding outer layer of outermost layer and blind hole plating is filled and led up to be made
The HDI plate.
Further, the pressing step further include:
Heat sub-step, heating according to copper foil, prepreg, the multiple interconnection units being sequentially overlapped, prepreg,
The quadrangle for the plank that the overlay order of copper foil overlaps is with the fixation plank.
Further, the HDI board manufacturing method further include:
New interconnection unit obtaining step, after carrying out brownification, patch prepreg and protective film to the HDI plate, described half
The position that cured sheets correspond to the micropore of the HDI plate drills, and carries out consent to the prepreg using conductive paste and adds
Conductive paste described in heat cure, the HDI plate after removing the protective film are a new interconnection unit；
High-order presses step, obtains multiple new interconnection units and carries out disposable superposition pressing, passes through the conductive paste
Realize that random layer interconnection is between multiple new interconnection units to be made high-order HDI plate.
Further, the HDI board manufacturing method further include:
Registration holes step is bored, brill registration holes are carried out to the core plate.
Further, the HDI board manufacturing method further include:
Holes drilled through step carries out holes drilled through and via metal to the HDI plate.
Further, blind hole plating fill and lead up the following steps are included:
Heavy copper step carries out heavy copper to the micropore to realize hole metallization；
Step of membrane sticking pastes photoetching film on the surface of the core plate；
Blind hole windowing step is exposed the photoetching film, develops, and in the position uplifting window of the correspondence micropore,
The diameter that opens a window is bigger than the diameter of the micropore；
Step is filled and led up, plating is carried out to the micropore and is filled and led up；
Nog plate takes off film step, carries out band film nog plate to the position filled and led up of plating to take off film after grinding off convex portion.
Further, the protective film is wheat membrane.
Second aspect, the present invention provide a kind of HDI plate, and the HDI plate is made according to the HDI board manufacturing method.
The beneficial effects of the present invention are:
Brownification, patch prepreg are carried out after the present invention handles core plate by core plate processing step, on core plate after treatment
After protective film, drilling is carried out and using conductive paste progress filling perforation in the position of the micropore of corresponding core plate to obtain interconnection unit,
Finally, pressing multiple interconnection units disposably to realize that random layer interconnects, HDI plate is made, utilizes conductive paste filling perforation, filling perforation efficiency
Height, in addition, the core plate of conductive paste and prepreg will be covered with as an interconnection unit, multiple interconnection units disposably press system
HDI plate is obtained, successively overlapping is not necessarily to and makes plank, effectively increase the producing efficiency of HDI plate, overcome and utilize routine in the prior art
Layered manner technique make HDI plate, process flow is extremely long, the technical problem for causing the producing efficiency of HDI plate very low.
In addition, the present invention also connects the outermost layer and time outer layer of HDI plate, plating by using the mode that blind hole plating is filled and led up
The mode filled and led up guarantees that the surface-stable performance of HDI plate is good, not will receive the influence such as acid, alkali in air.
Detailed description of the invention
Fig. 1 is an a kind of specific embodiment method flow diagram of HDI board manufacturing method in the present invention；
Fig. 2 a, Fig. 2 b, Fig. 2 c, Fig. 2 d, Fig. 2 e, Fig. 2 f, Fig. 2 g, Fig. 2 h, Fig. 2 i, Fig. 2 j are a kind of HDI plates in the present invention
One specific embodiment schematic diagram of the core plate processing step of production method；
Fig. 3 is an a kind of specific embodiment schematic diagram of the brill registration holes step of HDI board manufacturing method in the present invention；
Fig. 4 a, Fig. 4 b, Fig. 4 c, Fig. 4 d, Fig. 4 e are that a kind of interconnection unit of core plate in HDI board manufacturing method in the present invention obtains
Take a specific embodiment schematic diagram of step；
Fig. 5 a, Fig. 5 b, Fig. 5 c, Fig. 5 d, Fig. 5 e, Fig. 5 f are a kind of pressing step 1 of HDI board manufacturing method in the present invention
Specific embodiment schematic diagram；
Fig. 6 is a kind of another specific embodiment schematic diagram of the pressing step of HDI board manufacturing method in the present invention.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
Embodiment 1
A kind of HDI board manufacturing method is an a kind of specific implementation of HDI board manufacturing method in the present invention with reference to Fig. 1, Fig. 1
Example method flow diagram；Include:
Core plate processing step carries out brill micropore to core plate, blind hole plating is filled and led up and pattern transfer；
Interconnection unit obtaining step corresponds to core in prepreg after carrying out brownification, patch prepreg and protective film to core plate
The position of the micropore of plate drills, and carries out consent and the conductive paste that is heating and curing to prepreg using conductive paste, removes protection
Core plate after film is an interconnection unit；In the present embodiment, protective film uses wheat membrane；
Step is pressed, multiple interconnection units is obtained to carry out disposably being superimposed pressing, multiple interconnections is realized by conductive paste
Random layer interconnection is between unit to be made HDI plate.If the outermost layer of the HDI plate after pressing is conductive paste, it is easy by sky
Acid, alkali in gas etc. influence, stability is poor, and in subsequent handling to outermost layer copper foil carry out pattern transfer circuit etching when will
Using acidic materials, acidic materials can also destroy conductive paste, and therefore, in the present embodiment, pressing step includes:
Press sub-step, according to copper foil, prepreg, the multiple interconnection units being sequentially overlapped, prepreg, copper foil it is folded
Sequence is added disposably to be pressed, copper slurry, which should be pressed in plate, to be attacked with isolation by extraneous moisture and liquid medicine；
Sub-step is interconnected, drilling is carried out in the position of the micropore of corresponding outer layer of outermost layer and blind hole plating is filled and led up to be made
HDI plate；The outermost layer and time outer layer that HDI plate is connected in such a way that blind hole plating is filled and led up, are electroplated the mode filled and led up and guarantee HDI plate
Surface-stable performance it is good.
HDI board manufacturing method utilizes conductive paste filling perforation, and filling perforation is high-efficient, in addition, conductive paste and prepreg will be covered with
Multiple interconnection units are disposably pressed and HDI plate are made by core plate as an interconnection unit, make plate without successively overlapping
Son, effectively increases the producing efficiency of HDI plate, and avoids generating multiple bit errors when multiple layer-by-layer preparation, overcomes existing
HDI plate is made using conventional layered manner technique in technology, process flow is extremely long, causes the producing efficiency of HDI plate very low
The technical issues of.
HDI board manufacturing method is specifically described below:
1, core plate processing step:
Sawing sheet: Fig. 2 a, Fig. 2 b, Fig. 2 c, Fig. 2 d, Fig. 2 e, Fig. 2 f, Fig. 2 g, Fig. 2 h, Fig. 2 i, Fig. 2 j are a kind of in the present invention
One specific embodiment schematic diagram of the core plate processing step of HDI board manufacturing method；With reference to Fig. 2 a, it is covered in the front and back sides of dielectric layer
Copper foil obtains core plate, and the thickness range of dielectric layer is 0.05mm-0.1mm, copper foil with a thickness of 1/3oz.
Drilling: referring to Fig. 2 b, location hole drilled out on core plate, for the laser drilling and pattern transfer in subsequent technique
It positions, in the present embodiment, is provided with tetra- location holes of A, B, C, D, wherein location hole A, B and C are on x, the direction y apart from edges of boards
It is 0.5inch, location hole D, apart from edges of boards 1inch, is used apart from edges of boards 0.5inch, location hole D in y-direction on the x of direction
In the direction for determining plank.
Brownification: keep copper face coarse, prepare for laser drilling.
Laser drill 1: referring to Fig. 2 c, and the micropore that diameter is 3-5mil is drilled out on core plate, is 4mil with micro-pore diameter
For the micropore of (0.1mm), surface layer copper foil and substrate medium layer are only bored, retains bottom copper foil, nog plate removal palm fibre after laser drill
Change layer.
Heavy copper: referring to Fig. 2 d, carries out heavy copper (electroless copper) to micropore to realize hole metallization.
Electric plating of whole board: the copper that electroplating thickness range is 5-10 microns is to protect electroless copper plating layer.
Pad pasting: referring to Fig. 2 e, pastes photoetching film on the surface of core plate to protect copper face, in the present embodiment, photoetching film is selected
Dry film.
Blind hole windowing: referring to Fig. 2 f, be exposed, develop to dry film, and (blind hole plating is needed to fill out in the position of corresponding micropore
Flat region) uplifting window, since there are bit errors for exposure machine, so windowing diameter is bigger than the diameter of micropore, windowing is larger
To guarantee that windowing is accurately aimed at micropore；In the present embodiment, open a window diameter big 1mil more unilateral than micropore, i.e., windowing diameter is 6mil
(0.11mm)。
It fills and leads up: with reference to Fig. 2 g, plating being carried out to micropore and is filled and led up.
Nog plate takes off film: the position filled and led up of plating carried out with dry film nog plate to take off film after grinding off the convex portion on copper face,
Fig. 2 h is obtained, due to route precision, therefore the copper thickness of electric plating of whole board need to be controlled, band dry film nog plate prevents nog plate to protect copper face
After Local Copper occur thick insufficient.
Pattern transfer: using photoetching film, and pad pasting exposes, and development, etching obtains required route on copper face, with reference to Fig. 2 i.
In addition, design radium-shine contraposition cursor point with reference to Fig. 2 j in the route Accessorial Tools Storage of plank at this time and X-ray wad cutter aligns cursor point,
The radium-shine positioning for boring contraposition cursor point for laser drill 2 in subsequent handling, wherein the radium-shine brill of lower right aligns light in Fig. 2 j
Punctuate is for direction fool proof, and the radium-shine brill contraposition cursor point than lower left moves up 0.5inch in the Y direction.And X-ray wad cutter
L2 layer of the contraposition cursor point only in pressing has setting, and the X-ray wad cutter contraposition cursor point of the second layer is for boring positioning after pressing
Kong Yong.
Bore registration holes: referring to Fig. 3, Fig. 3 be a kind of the brills registration holes step of HDI board manufacturing method in the present invention one specifically
Embodiment schematic diagram；Brill registration holes (registration holes of contraposition rivet) are carried out to core plate, specifically, drill out contraposition with optical registration
The registration holes of rivet act on to press and passing through the positioning that the tooling hole carries out core plate using rivet with clock synchronization, guarantee subsequent thermal
It is not in that layer has dislocation with interlayer when molten.
2, interconnection unit obtaining step:
Brownification: brownification is so that the copper face of core plate is coarse, the binding force of enhancing and prepreg, for the work for guaranteeing brownification film
Property, 24 hours domestic demands are pressed after brownification.
Prepreg cutting: referring to Fig. 4 a, and Fig. 4 a, Fig. 4 b, Fig. 4 c, Fig. 4 d, Fig. 4 e are a kind of HDI plate production in the present invention
A specific embodiment schematic diagram of the interconnection unit obtaining step of core plate in method；It opens a window, exposes in line map to prepreg
The registration holes of the radium-shine brill contraposition cursor point and contraposition rivet that design in shape, the size of windowing are more unilateral than cursor point and registration holes
Big 0.1mm.
Fitting: being referred to Fig. 4 b, be bonded by the structure of wheat membrane, prepreg, wheat membrane using vacuum laminator, temperature
80-100 DEG C of degree, pressure 3-5kg, speed 0.1-1.0m/min, wheat membrane is as protective film.
Laser drill 2: referring to Fig. 4 c, is drilled on prepreg using radium-shine brill contraposition cursor point.
Conductive paste consent: Fig. 4 d is referred to, conductive paste (also known as conducting resinl) is filled in hole using vacuum taphole machine, needs to guarantee
It absolutely fills up, due to the protection of wheat membrane, scraper will not scratch route when consent, while conductive paste contact route being stopped to be led
Route is caused short circuit occur.
Drying-plate: 95 DEG C of bakings allow conductive paste primary solidification for 15 minutes, increase mechanical strength to conductive paste to keep pattern,
It needs to be immediately fed into dustless of pressing after the completion of the step, and need to be pressed in 6 hours.
It removes protective film: referring to Fig. 4 e, wheat membrane is removed before pairing (it should be noted that the thickness of wheat membrane is negligible
Disregard, Fig. 4 e is only schematic diagram), the core plate so far handled is as an interconnection unit.
3, step is pressed:
Pairing: after multiple core plates (i.e. interconnection unit) is made according to above-mentioned steps, with reference to Fig. 4 e, Fig. 5 a and Fig. 5 b, figure
5a, Fig. 5 b, Fig. 5 c, Fig. 5 d, Fig. 5 e are a kind of pressing step 1 specific embodiment signals of HDI board manufacturing method in the present invention
Figure, according to copper foil, prepreg, the multiple interconnection units being sequentially overlapped, prepreg, copper foil overlay order lamination, be used in combination
It aligns rivet to position, in the present embodiment, be illustrated by taking the HDI random layer interconnection board of 12 layer of 5 rank as an example.
Heating: the quadrangle of the plank after heating pairing overlapping is to fix plank, and with reference to Fig. 5 a, each core plate has hot melt
Unit, fuse unit heat the prepreg of quadrangle with the plank of fixed overlapping, guarantee not move when plank pressing, play positioning
Function, the positioning accuracy of the HDI plate after improving pressing.
Pressing: the plank after heating is pressed to obtain the structure of Fig. 5 c, with reference to Fig. 2 i, connects the pad of conductive paste
The minimum dimension of PAD is 8mil not overflow pad and lead to short circuit after ensureing conductive paste pressing.
Interconnection: simultaneously interconnection is not implemented in the outermost layer of the plank after pressing and time outer layer, therefore, utilizes the X-ray target of Fig. 2 j
Hole aligns cursor point and drills in the position (tow sides) of the micropore of corresponding outer layer of outermost layer, with reference to Fig. 5 d, then to micro-
Hole carries out blind hole plating and fills and leads up HDI plate is made, as depicted in fig. 5e.
HDI plate is interconnected using the random layer that HDI plate can make higher order as unit, is one kind in the present invention with reference to Fig. 6, Fig. 6
The another specific embodiment schematic diagram of the pressing step of HDI board manufacturing method, comprising the following steps:
New interconnection unit obtaining step: similarly with HDI obtained above, brownification, patch prepreg and guarantor are carried out to HDI plate
It after cuticula, drills in the position that prepreg corresponds to the micropore of HDI plate, consent is carried out simultaneously to prepreg using conductive paste
Be heating and curing conductive paste, and the HDI plate after removing protective film is a new interconnection unit.
High-order presses step, obtains multiple new interconnection units and carries out disposable superposition pressing and (is carried out pair using contraposition rivet
Position), realize that random layer interconnection is between multiple new interconnection units to be made high-order HDI plate by conductive paste.To have 3 new interconnections
For unit (new interconnection unit 1, new interconnection unit 2, new interconnection unit 3), likewise, stablizing since outermost layer is conductive paste
Performance is poor, therefore, with reference to Fig. 6, is pressed with the sequence of copper foil, prepreg, multiple new interconnection units, prepreg and copper foil
It closes, then realizes the interconnection of outermost layer and time outer layer by way of drilling and blind hole plating is filled and led up.
In addition, also can be carried out holes drilled through and via metalization operation to the HDI plate after Fig. 5 e and Fig. 6 pressing, and make outer
Sandwich circuit figure coats solder mask, is surface-treated to obtain finished product, with reference to Fig. 5 f.
Embodiment 2
A kind of HDI plate, HDI plate are made according to HDI board manufacturing method described in embodiment 1.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (9)
1. a kind of HDI board manufacturing method characterized by comprising
Core plate processing step carries out brill micropore to core plate, blind hole plating is filled and led up and pattern transfer；
Interconnection unit obtaining step, after carrying out brownification, patch prepreg and protective film to the core plate, in the prepreg pair
It answers the position of the micropore of the core plate to drill, consent is carried out to the prepreg using conductive paste and is heating and curing described
Conductive paste, the core plate after removing the protective film are an interconnection unit；
Step is pressed, multiple disposable superposition pressings of the interconnection units progress is obtained, is realized by the conductive paste multiple mutual
Random layer interconnection is between receipts or other documents in duplicate member to be made HDI plate.
2. HDI board manufacturing method according to claim 1, which is characterized in that the pressing step includes:
Press sub-step, according to copper foil, prepreg, the multiple interconnection units being sequentially overlapped, prepreg, copper foil it is folded
Sequence is added disposably to be pressed；
Sub-step is interconnected, drilling is carried out in the position of the micropore of corresponding outer layer of outermost layer and blind hole plating is filled and led up to be made described
HDI plate.
3. HDI board manufacturing method according to claim 2, which is characterized in that the pressing step further include:
Sub-step is heated, is heated according to copper foil, prepreg, multiple interconnection units, the prepreg, copper foil being sequentially overlapped
The quadrangle of plank that overlaps of overlay order with the fixation plank.
4. HDI board manufacturing method according to claim 2 or 3, which is characterized in that the HDI board manufacturing method further include:
New interconnection unit obtaining step, after carrying out brownification, patch prepreg and protective film to the HDI plate, in the semi-solid preparation
The position that piece corresponds to the micropore of the HDI plate drills, and carries out consent to the prepreg using conductive paste and heats solid
Change the conductive paste, the HDI plate after removing the protective film is a new interconnection unit；
High-order presses step, obtains multiple new interconnection units and carries out disposable superposition pressing, is realized by the conductive paste
Random layer interconnection is between multiple new interconnection units to be made high-order HDI plate.
5. HDI board manufacturing method according to any one of claims 1 to 3, which is characterized in that the HDI board manufacturing method
Further include:
Registration holes step is bored, brill registration holes are carried out to the core plate.
6. HDI board manufacturing method according to any one of claims 1 to 3, which is characterized in that the HDI board manufacturing method
Further include:
Holes drilled through step carries out holes drilled through and via metal to the HDI plate.
7. HDI board manufacturing method according to any one of claims 1 to 3, which is characterized in that packet is filled and led up in the blind hole plating
Include following steps:
Heavy copper step carries out heavy copper to the micropore to realize hole metallization；
Step of membrane sticking pastes photoetching film on the surface of the core plate；
Blind hole windowing step is exposed the photoetching film, develops, and in the position uplifting window of the correspondence micropore, windowing
Diameter is bigger than the diameter of the micropore；
Step is filled and led up, plating is carried out to the micropore and is filled and led up；
Nog plate takes off film step, carries out band film nog plate to the position filled and led up of plating to take off film after grinding off convex portion.
8. HDI board manufacturing method according to any one of claims 1 to 3, which is characterized in that the protective film is wheat drawing
Film.
9. a kind of HDI plate, which is characterized in that the HDI plate HDI board manufacturing method according to any one of claims 1 to 8
And it is made.
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| CN111542178A (en) * | 2020-05-13 | 2020-08-14 | 上海泽丰半导体科技有限公司 | Manufacturing process of multilayer circuit board and multilayer circuit board |
| CN112533357A (en) * | 2020-11-17 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board |
| CN112543550A (en) * | 2020-11-17 | 2021-03-23 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board, board body and processing method thereof |
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| CN112867251A (en) * | 2020-12-30 | 2021-05-28 | 高德(苏州)电子有限公司 | Manufacturing method of multilayer circuit board |
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| CN111542178B (en) * | 2020-05-13 | 2021-07-16 | 上海泽丰半导体科技有限公司 | Manufacturing process of multilayer circuit board and multilayer circuit board |
| CN112533357A (en) * | 2020-11-17 | 2021-03-19 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board |
| CN112543550A (en) * | 2020-11-17 | 2021-03-23 | 惠州市特创电子科技股份有限公司 | Multilayer circuit board, board body and processing method thereof |
| CN112714547A (en) * | 2020-11-17 | 2021-04-27 | 惠州市特创电子科技股份有限公司 | Circuit board, board body and preparation method thereof |
| CN112601377A (en) * | 2020-11-30 | 2021-04-02 | 景旺电子科技(珠海)有限公司 | Manufacturing method of copper paste hole plugging printed board and manufacturing method of FPC board |
| CN112867251A (en) * | 2020-12-30 | 2021-05-28 | 高德(苏州)电子有限公司 | Manufacturing method of multilayer circuit board |
| CN114980498A (en) * | 2022-05-09 | 2022-08-30 | 江西福昌发电路科技有限公司 | High-density interconnection printed board and processing method thereof |
| CN114980498B (en) * | 2022-05-09 | 2024-04-02 | 江西福昌发电路科技有限公司 | High-density interconnection printed board and processing method thereof |
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Application publication date: 20190621 |