CN101309557A - Presetting positioning fusion process for inner central layer of printed circuit board - Google Patents
Presetting positioning fusion process for inner central layer of printed circuit board Download PDFInfo
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- CN101309557A CN101309557A CNA2008100682749A CN200810068274A CN101309557A CN 101309557 A CN101309557 A CN 101309557A CN A2008100682749 A CNA2008100682749 A CN A2008100682749A CN 200810068274 A CN200810068274 A CN 200810068274A CN 101309557 A CN101309557 A CN 101309557A
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Abstract
The invention discloses a pre-aligning and positioning fusion process of a printed circuit board inner layer core plate. The pre-aligning and positioning fusion process comprise the steps that the inner layer core plate is punched, and the inner layer core plate is pre-aligned and fused, in the step of punching the inner layer core plate, four positioning holes are punched on the core plate and dispersed at the edge positions adjacent to the peripheries of the four core plate, four corresponding positioning pins are arranged on a fusion machine working table, and after being aligned, the inner layer core plate is hot pressed and fused. The positioning error resulted from the deformation of the positioning holes is reduced by positing a plurality of holes, thereby, the positioning precision of fusing the inner layer core plate is improved, and the offset of the inner layer core plate can be controlled within 3.0 mil, so as to satisfy the requirements of positioning and fusing the inner layer core plate of the multilayer fine wire printed circuit board, and 24-layer fine wire circuit board (Mass Lamination) can be produced in batch by utilizing the process of the invention.
Description
[technical field]
The present invention relates to the printed circuit board (PCB) process technology, relate in particular to a kind of presetting positioning fusion process of inner central layer of printed circuit board.
[background technology]
At present, printed substrate is had higher requirement to the level to level alignment degree towards high-rise, the direction fast development of fine rule road.Traditional MASS LAM internal layer pressing contraposition mode has two kinds, a kind of is with central layer and the prepreg riveted of rivet driver with the different numbers of plies, another kind is with two circular hole location, the central layer and the prepreg of the different numbers of plies are fused, these two kinds of walkthrough mode common characteristic are in advance core material to be punched with the automated optical puncher, and then utilize these two circular holes to locate, realize the purpose of different number of plies central layer location stacks.
Current internal layer pressing contraposition mode mainly has problems and is:
1, when core material is thin, by location, two holes heat fused mode walkthrough, in the plank cover round pin nail process, circular hole is easily pulled open; The plank angularity is big after the brown, causes aligning accuracy not high, and the interlayer skew is bigger;
2, by riveter nail mode contraposition walkthrough,, cause accumulated error bigger in the contraposition process, cause the interlayer alignment side-play amount big based on having repeatedly contraposition in the riveter nail process.
Above-mentioned two kinds of internal layer pressing locate modes, in the long-term production process, find, for thin plate and high number of plies plate walkthrough after the X-ray machine inspection, all there is core material skew in various degree, the side-play amount maximum reaches 7mil, and (mil is a mil, 7mil is equivalent to 0.18 millimeter) more than, the quality of the high number of plies high density of serious restriction fine circuit boards.
[summary of the invention]
The technical problem to be solved in the present invention provides a kind of positioning accuracy height, can reduce multi-layer sheet internal layer pressing skew, is fit to produce in batches the core material presetting positioning fusion process of multilayer fine printed circuit board (PCB).
In order to solve the problems of the technologies described above, the technical solution used in the present invention is, a kind of presetting positioning fusion process for inner central layer of printed circuit board, comprise that to the core material punching fusion of core material walkthrough is in the step of described core material punching, central layer is dashed 4 location holes, 4 location holes are dispersed in the edge of close 4 peripheries of central layer, and the Heat sealing machine workbench is provided with 4 corresponding alignment pins, hot pressing fusion behind row's plate.
Above-described presetting positioning fusion process for inner central layer of printed circuit board is characterized in that, described 4 location holes are distributed on 2 orthogonal straight lines of core material or near the straight line.Described 4 location holes are slotted hole, and described slotted hole is the rectangle slotted hole, the long limit of described slotted hole and slotted hole place or near straight line parallel.Described 2 straight lines are the axis of symmetry of central layer preferably, and in described 4 location holes, 3 location holes are positioned on the described axis of symmetry, and 1 is departed from the axis of symmetry.
Above-described presetting positioning fusion process for inner central layer of printed circuit board, described 4 slotted holes cooperate with 4 corresponding prolate pins on the Heat sealing machine workbench, slotted hole and prolate pin are a kind of interference fits of interference minimum or the matched in clearance of minim gap along short-axis direction, and slotted hole and prolate pin leave the gap along the long axis direction two ends.Slotted hole and prolate pin are not more than 0.02 millimeter along the gap of short-axis direction.
Central layer of the present invention dashes 4 location holes, 4 location holes are dispersed in the edge of 4 peripheries of central layer, reduced to be out of shape the position error that is caused because of location hole, improved the positioning accuracy of core material fusion, the core material side-play amount can be reduced in the 3mil (being equivalent to 0.076 millimeter), has satisfied the requirement of multilayer fine inner central layer of printed circuit board presetting positioning fusion.
[description of drawings]
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is the central layer location schematic diagram of inner central layer of printed circuit board positioning fusion process embodiment of the present invention.
[embodiment]
Multi-layer sheet internal layer machining process route is as follows:
Material → pre-treatment → internal layer D/F or sensitization oil → development/etching/move back film → AOI → black/brown oxidation → walkthrough (fusion, rivet) → row's plate → pressing plate → brill location hole → pressing plate moulding → outer layer process left by substrate.
The present invention relates generally to the core material punching, the fusion of core material walkthrough.Its characteristics are, in the step of core material punching, central layer are dashed 4 location holes, and 4 location holes disperse near at the position at the edge of 4 peripheries of central layer, and the Heat sealing machine workbench is provided with 4 corresponding alignment pins, hot pressing fusion behind the walkthrough.
In the embodiment of presetting positioning fusion process for inner central layer of printed circuit board of the present invention shown in Figure 1, automated optical contraposition perforating press is to use die punching, 4 7.112 * 4.762 millimeters the rectangle slotted hole of going out 1,2,3,4,3 location holes 1,3,4 are distributed in the edges on 2 orthogonal straight line aa and upper and lower, left 3 limits of the upward also close central layer of bb, 1 location hole 2 is positioned at straight line aa top in addition, near the edge on central layer the right.The distance, delta of location hole 2 off-straight aa, Δ is 4.775 millimeters in the present embodiment.Aa and bb are 2 orthogonal axis of symmetry on the central layer.Wherein, the long limit of rectangle slotted hole 1,2 is parallel with straight line aa, and the long limit of rectangle slotted hole 3,4 is parallel with straight line bb.4 rectangle slotted holes 1,2,3,4 cooperate with 4 corresponding rectangle prolate pins 5,6,7,8 on the Heat sealing machine workbench respectively.Be a kind of interference fits of interference minimum or the matched in clearance of minim gap along its short-axis direction between slotted hole and the prolate pin, as H/js, H/g, H/h, fit clearance is not more than 0.02 millimeter; Slotted hole and prolate pin leave the gap along its long axis direction two ends.Central layer of the present invention has compared with prior art increased by 2 location holes, and 4 location holes are dispersed in the edge of 4 peripheries of central layer, has reduced the position error because of location hole is out of shape and the central layer distortion is caused.Rectangle slotted hole 1,2 cooperates with rectangle prolate pin 5,6, at bb direction rectangle slotted hole 1,2 and rectangle prolate pin 5,6 micro-interference or slight clearance is only arranged, and plays the positioning action of central layer on the bb direction; Rectangle slotted hole 3,4 cooperates with rectangle prolate pin 7,8, at aa direction rectangle slotted hole 3,4 and rectangle prolate pin 7,8 micro-interference or slight clearance is only arranged, and plays the positioning action of central layer on the aa direction, thereby has improved the positioning accuracy of core material fusion.4 rectangle slotted hole location are than 2 circular hole location, the one, location hole quantity doubles, and rectangle slotted hole and rectangle prolate pin contacts area are big, it is little influenced by external force, in operating process, be not easy to be pulled open and be out of shape, the level to level alignment degree that effectively guarantees core material can be reduced in the 3mil core material side-play amount, has satisfied the requirement of multilayer fine inner central layer of printed circuit board positioning fusion, can volume production reaches wiring board more than 24 layers with technology of the present invention.
Claims (8)
1. presetting positioning fusion process for inner central layer of printed circuit board, comprise the core material punching, the fusion of core material walkthrough, it is characterized in that, in the step of described core material punching, central layer is dashed 4 location holes, 4 location holes are dispersed in the edge of close 4 peripheries of central layer, the Heat sealing machine workbench is provided with 4 corresponding alignment pins, hot pressing fusion behind row's plate.
2. presetting positioning fusion process for inner central layer of printed circuit board according to claim 1 is characterized in that, described 4 location holes are distributed on 2 orthogonal straight lines of core material or near the straight line.
3. presetting positioning fusion process for inner central layer of printed circuit board according to claim 2 is characterized in that, described location hole is a slotted hole.
4. presetting positioning fusion process for inner central layer of printed circuit board according to claim 3 is characterized in that, described slotted hole is a rectangular opening.
5. presetting positioning fusion process for inner central layer of printed circuit board according to claim 4 is characterized in that, the long limit of described slotted hole and slotted hole place or near straight line parallel.
6. presetting positioning fusion process for inner central layer of printed circuit board according to claim 5, it is characterized in that described 2 axis of symmetry that straight line is a central layer are in described 4 location holes, 3 location holes are positioned on the described axis of symmetry, and 1 is departed from the axis of symmetry.
7. according to claim 5 or 6 described presetting positioning fusion process for inner central layer of printed circuit board, it is characterized in that, described 4 location slotted holes cooperate with 4 corresponding prolate pins on the Heat sealing machine workbench, slotted hole and prolate pin are a kind of interference fits of interference minimum or the matched in clearance of minim gap along short-axis direction, and slotted hole and prolate pin leave the gap along the long axis direction two ends.
8. presetting positioning fusion process for inner central layer of printed circuit board according to claim 7 is characterized in that, slotted hole and prolate pin are not more than 0.02 millimeter along the gap of short-axis direction.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2008100682749A CN100574575C (en) | 2008-07-04 | 2008-07-04 | Presetting positioning fusion process for inner central layer of printed circuit board |
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| CNB2008100682749A CN100574575C (en) | 2008-07-04 | 2008-07-04 | Presetting positioning fusion process for inner central layer of printed circuit board |
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| CN101309557A true CN101309557A (en) | 2008-11-19 |
| CN100574575C CN100574575C (en) | 2009-12-23 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697001B (en) * | 2009-01-22 | 2011-07-13 | 依利安达(广州)电子有限公司 | Method for detecting positional deviation among layers of multilayer printed circuit board |
| CN102413636A (en) * | 2011-08-01 | 2012-04-11 | 东莞生益电子有限公司 | Pin positioning method for press fit of metal substrate |
| CN103200792A (en) * | 2013-03-14 | 2013-07-10 | 洛阳伟信电子科技有限公司 | Machining method of multilayer non-intersection blind buried hole circuit board |
| CN103917062A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Method for superposition positioning of multilayer circuit board |
| CN104519681A (en) * | 2014-11-19 | 2015-04-15 | 沪士电子股份有限公司 | Manufacturing method of ultralarge line-card type printed circuit boards with large layer number and high alignment degree |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
| CN105792518A (en) * | 2016-03-18 | 2016-07-20 | 奥士康科技股份有限公司 | Method for controlling size of high-precision finished product |
| CN107708285A (en) * | 2016-08-09 | 2018-02-16 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and multilayer circuit board |
| CN108323041A (en) * | 2018-03-15 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of edges of boards design method of multiple pressing HDI plates |
| CN109587977A (en) * | 2018-12-14 | 2019-04-05 | 深圳崇达多层线路板有限公司 | A kind of improvement fusion undesirable method of position making sheet |
| CN109922612A (en) * | 2019-03-22 | 2019-06-21 | 深圳明阳电路科技股份有限公司 | A kind of HDI board manufacturing method and HDI plate |
| CN113966081A (en) * | 2021-10-15 | 2022-01-21 | 西安微电子技术研究所 | Bonding die and bonding method for cold plate printed board |
| CN117998769A (en) * | 2024-04-03 | 2024-05-07 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
-
2008
- 2008-07-04 CN CNB2008100682749A patent/CN100574575C/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697001B (en) * | 2009-01-22 | 2011-07-13 | 依利安达(广州)电子有限公司 | Method for detecting positional deviation among layers of multilayer printed circuit board |
| CN102413636A (en) * | 2011-08-01 | 2012-04-11 | 东莞生益电子有限公司 | Pin positioning method for press fit of metal substrate |
| CN102413636B (en) * | 2011-08-01 | 2013-04-17 | 东莞生益电子有限公司 | Pin positioning method for press fit of metal substrate |
| CN103917062A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Method for superposition positioning of multilayer circuit board |
| CN103200792A (en) * | 2013-03-14 | 2013-07-10 | 洛阳伟信电子科技有限公司 | Machining method of multilayer non-intersection blind buried hole circuit board |
| CN104519681A (en) * | 2014-11-19 | 2015-04-15 | 沪士电子股份有限公司 | Manufacturing method of ultralarge line-card type printed circuit boards with large layer number and high alignment degree |
| CN104519681B (en) * | 2014-11-19 | 2018-01-09 | 沪士电子股份有限公司 | The preparation method of the high Aligning degree line card type printed circuit board of high-layer oversize |
| CN105392304B (en) * | 2015-10-21 | 2017-12-05 | 胜宏科技（惠州）股份有限公司 | A kind of circuit board pressing method |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
| CN105792518A (en) * | 2016-03-18 | 2016-07-20 | 奥士康科技股份有限公司 | Method for controlling size of high-precision finished product |
| CN107708285A (en) * | 2016-08-09 | 2018-02-16 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and multilayer circuit board |
| CN107708285B (en) * | 2016-08-09 | 2020-10-16 | 北大方正集团有限公司 | Multilayer circuit board and method for producing multilayer circuit board |
| CN108323041A (en) * | 2018-03-15 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of edges of boards design method of multiple pressing HDI plates |
| CN109587977A (en) * | 2018-12-14 | 2019-04-05 | 深圳崇达多层线路板有限公司 | A kind of improvement fusion undesirable method of position making sheet |
| CN109922612A (en) * | 2019-03-22 | 2019-06-21 | 深圳明阳电路科技股份有限公司 | A kind of HDI board manufacturing method and HDI plate |
| CN113966081A (en) * | 2021-10-15 | 2022-01-21 | 西安微电子技术研究所 | Bonding die and bonding method for cold plate printed board |
| CN117998769A (en) * | 2024-04-03 | 2024-05-07 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
| CN117998769B (en) * | 2024-04-03 | 2024-06-04 | 广州添利电子科技有限公司 | Positioning system and positioning method for improving continuous lamination alignment precision of HDI (high density interconnect) board |
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| CN100574575C (en) | 2009-12-23 |
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