CN103327748A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
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- CN103327748A CN103327748A CN2012100736590A CN201210073659A CN103327748A CN 103327748 A CN103327748 A CN 103327748A CN 2012100736590 A CN2012100736590 A CN 2012100736590A CN 201210073659 A CN201210073659 A CN 201210073659A CN 103327748 A CN103327748 A CN 103327748A
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Abstract
The invention provides a manufacturing method of a circuit board. The manufacturing method of the circuit board comprises the steps that a circuit substrate with a product zone and a waste zone is offered and the circuit substrate comprises a substrate body, an insulating layer and a copper foil layer which are sequentially stacked; the circuit substrate is etched, so that an electricity conductive circuit is formed on the copper foil layer of the product zone, a plurality of air guiding grooves penetrating through the copper foil layer are formed in the waste zone, the air guiding grooves are mutually adjacent and mutually parallel and extend in the direction far away from the product zone from a border of the product zone and the waste zone; a covering film provided with at least one air guiding through hole is attached to the copper foil layer, so that the covering film is attached to the surface of the electricity conductive circuit and covers the air guiding grooves, and each air guiding groove is communicated with one air guiding through hole. The invention further provides the circuit board manufactured through the manufacturing method.
Description
Technical field
The present invention relates to circuit board technology, relate in particular to a kind of circuit board with better product quality and preparation method thereof.
Background technology
Along with the progress of science and technology, the widely application that circuit board obtains at electronic product.Application about circuit board sees also document Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992,15 (4): 418-425.
The circuit of circuit board surface is generally protected by coverlay, and coverlay generally is fitted in the circuit surface by the method for pressing.Yet; in the applying process; be very easy between coverlay and circuit, produce bubble; it is like this then so that the applying effect of coverlay is bad; not only so that can't being effectively protected, circuit is easy to oxidation; also can be increased in the danger of plate bursting in the postorder operation, also affect in addition the outward appearance of circuit board product.That is to say, the applying effect of coverlay not good general causes the circuit board product quality to reduce.
Summary of the invention
Therefore, be necessary to provide a kind of circuit board with better product quality and preparation method thereof.
Below will a kind of circuit board and preparation method thereof be described with embodiment.
A kind of manufacture method of circuit board comprises step: circuit substrate is provided, and described circuit substrate comprises substrate, insulating barrier and the first copper foil layer that stacks gradually, the garbage area that described circuit substrate has product zone and is connected with product zone; The etched circuit substrate, form the conducting wire with the first copper foil layer with described product zone, and form a plurality of the first air slots that run through the first copper foil layer at described garbage area, described a plurality of the first air slot is adjacent one another are and be parallel to each other, and a plurality of the first air slots all extend to the direction away from product zone from the boundary of product zone and garbage area; And first coverlay that will have at least one the first air guide through hole fits in the first copper foil layer of circuit substrate, so that the first coverlay is fitted in the surface of the conducting wire of product zone, and covering a plurality of first air slots of garbage area, each first air slot all is connected with first an air guide through hole.
Preferably, the width of each the first air slot is 0.1 millimeter to 0.3 millimeter, and the spacing of adjacent two the first air slots is 0.1 millimeter to 0.3 millimeter.
Preferably, described circuit substrate also comprises the first adhesive-layer that is arranged between insulating barrier and the first copper foil layer, and described a plurality of the first air slots run through the first copper foil layer and the first adhesive-layer.
Preferably, after circuit substrate is provided, also be included in the step of offering a plurality of the first registration holes on the circuit substrate; Before the first coverlay is fitted in the first copper foil layer of circuit substrate, in the first coverlay, offer a plurality of the first openings, a plurality of the second registration holes and described at least one first air guide through hole, described a plurality of the first opening is corresponding to edge connector and the pad of the conducting wire of the first copper foil layer, and described a plurality of the second registration holes are corresponding with a plurality of the first registration holes; In the first coverlay, offered after a plurality of the second registration holes before the first coverlay is fitted in the first copper foil layer of circuit substrate, by the cooperation of a plurality of the first registration holes and a plurality of the second registration holes the first coverlay is alignd with circuit substrate.
Preferably, the substrate of described circuit substrate comprises the second copper foil layer; When the first copper foil layer of etched circuit substrate, described the second copper foil layer of etching also, form the conducting wire with the second copper foil layer with described product zone, and form a plurality of the second air slots that run through the second copper foil layer at described garbage area, described a plurality of the second air slot is adjacent one another are and be parallel to each other, and a plurality of the second air slots all extend to the direction away from product zone from the boundary of product zone and garbage area; After the first coverlay is fitted in the first copper foil layer of circuit substrate, the second coverlay with at least one second air guide through hole is provided, and the second coverlay is fitted in the second copper foil layer surface of circuit substrate, so that the second coverlay covers a plurality of second air slots of garbage area, each second air slot all is connected with second an air guide through hole.
Preferably, the width of each the second air slot is 0.1 millimeter to 0.3 millimeter, and the spacing of adjacent two the second air slots is 0.1 millimeter to 0.3 millimeter.
A kind of circuit board, it comprises the substrate that stacks gradually, insulating barrier, the first copper foil layer and the first coverlay, the garbage area that described circuit board has product zone and is connected with product zone, the first copper foil layer of described product zone is formed with the conducting wire, described garbage area is formed with a plurality of the first air slots that run through the first copper foil layer and covered by the first coverlay, described a plurality of the first air slot is adjacent one another are and be parallel to each other, a plurality of the first air slots all extend to the direction away from product zone from the boundary of product zone and garbage area, the garbage area of described the first coverlay is formed with at least one first air guide through hole, and each first air slot all is connected with first an air guide through hole.
Preferably, the width of each the first air slot is 0.1 millimeter to 0.3 millimeter, and the spacing of adjacent two the first air slots is 0.1 millimeter to 0.3 millimeter.
Preferably, described substrate comprises the second copper foil layer, described circuit board also comprises and is arranged on the second copper foil layer away from the second coverlay of insulating barrier one side, the second copper foil layer of described product zone also is formed with the conducting wire, described garbage area also is formed with a plurality of the second air slots that run through the second copper foil layer and covered by the second coverlay, described a plurality of the second air slot is adjacent one another are and be parallel to each other, a plurality of the second air slots all extend to the direction away from product zone from the boundary of product zone and garbage area, the garbage area of described the second coverlay is formed with at least one second air guide through hole, and each second air slot all is connected with second an air guide through hole.
Preferably, the width of each the second air slot is 0.1 millimeter to 0.3 millimeter, and the spacing of adjacent two the second air slots is 0.1 millimeter to 0.3 millimeter.
The manufacture method of the technical program circuit board has following advantage: in the technical program, when making the conducting wire, the product zone etching of circuit substrate forms a plurality of the first air slots in the garbage area etching simultaneously, and before the conducting wire of circuit substrate surface pressing the first coverlay, in the first coverlay, offered at least one first air guide through hole, so, when conducting wire surface pressing the first coverlay, gas between circuit substrate and the first coverlay can be derived by a plurality of the first air slots, and finally overflows from the first air guide through hole that is communicated with the first air slot.And a plurality of the first air slots are closely adjacent, and the first coverlay can not be collapsed upon within any one first air slot, and are like this then fully guaranteed the air guide performance of the first air slot.Therefore, the technical program has been avoided producing bubble between the first coverlay and circuit substrate in the pressing process, so that the first coverlay and circuit substrate close contact have improved pressing effect and final circuit board end properties.The circuit board of the technical program has good product quality and smooth outward appearance.
Description of drawings
The schematic flow sheet of the manufacture method of the circuit board that Fig. 1 provides for the technical program execution mode.
The front view of the circuit substrate that Fig. 2 provides for the technical program execution mode.
The vertical view of the circuit substrate that Fig. 3 provides for the technical program execution mode.
The schematic top plan view of the first copper foil layer behind the etched circuit substrate that Fig. 4 provides for the technical program execution mode.
Fig. 5 is that Fig. 4 is along the cutaway view of V-V line.
The elevational schematic view of the second copper foil layer behind the etched circuit substrate that Fig. 6 provides for the technical program execution mode.
The schematic top plan view of the first coverlay that Fig. 7 provides for the technical program execution mode.
The first coverlay that Fig. 8 provides for the technical program execution mode is fitted in behind the first copper foil layer surface of circuit substrate the cross-sectional schematic in the first air slot position.
The first coverlay that Fig. 9 provides for the technical program execution mode is fitted in behind the first copper foil layer surface of circuit substrate the front elevational schematic in the first air slot position.
The elevational schematic view of the second coverlay that Figure 10 provides for the technical program execution mode.
Figure 11 is the front elevational schematic of the circuit board of the technical program execution mode acquisition.
The main element symbol description
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10 |
| The first |
11 |
| The first adhesive- |
12 |
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| The second adhesive- |
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| The second |
15 |
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100 |
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| Garbage |
102 |
| The |
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| The |
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| The |
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111 |
| The first pad | 112 |
| The first circuit | 113 |
| The |
151 |
| The |
152 |
| The |
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| The first opening | 161 |
| The first air guide through |
162 |
| The second registration holes | 163 |
| The |
17 |
| The second opening | 171 |
| The second air guide through |
172 |
| The |
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Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with drawings and Examples, the manufacture method of the circuit board that the technical program is provided and the circuit board of making are described in further detail.
See also Fig. 1, the manufacture method of the circuit board that the technical program provides comprises step:
The first step sees also Fig. 2 and Fig. 3, and circuit substrate 10 is provided.In the present embodiment, described circuit substrate 10 is the two-sided soft copper-clad plate of glue that has, and it comprises the first copper foil layer 11, the first adhesive-layer 12, insulating barrier 13, the second adhesive-layer 14 and the second copper foil layer 15 that sets gradually from top to bottom.Described insulating barrier 13 is played a supporting role, its the most frequently used material is polyimides (Polyimide, PI), but also can be polyethylene terephthalate glycol (Polyethylene Terephtalate, PET) or be Polyethylene Naphthalate (poly (ethylene naphthalate), PEN).Described the second adhesive-layer 14 and the second copper foil layer 15 consist of substrate 100.
Certainly, it will be understood by those skilled in the art that circuit substrate 10 can be other structures.For example, circuit substrate 10 can for two-sided glue-free soft copper-clad plate, be the structure that only comprises the first copper foil layer 11, insulating barrier 13 and the second copper foil layer 15, and not comprise the first adhesive-layer 12 and the second adhesive-layer 14.Again for example, circuit substrate 10 can be multilager base plate, that is, substrate 100 is the structure that comprises copper foil layer and the insulating barrier of multilayer alternative arrangement.
The garbage area 102 that described circuit substrate 10 has product zone 101 and is connected with product zone 101.Product zone 101 is used for the forming circuit board finished product, and garbage area 102 is the forming circuit board finished product not, is used for playing the effect of supporting subsidiary products district 101 in the manufacturing process of circuit board finished product, will be removed before making the circuit board finished product.In the present embodiment, product zone 101 is rectangle, and garbage area 102 is positioned at around the product zone 101, and around connecting product zone 101.Product zone 101 all has identical stacked structure with garbage area 102,, includes the part of the first copper foil layer 11, the first adhesive-layer 12, insulating barrier 13, the second adhesive-layer 14 and the second copper foil layer 15 that is.
Before carrying out next step, can also carry out the steps such as perforate, copper facing to circuit substrate 10, forming the via of conducting the first copper foil layers 11 and the second copper foil layer 15 in the product zone 101 of circuit substrate 10, and leave a plurality of the first registration holes 103 for follow-up contraposition at garbage area 102.
Second step, see also Fig. 4 to Fig. 6, etched circuit substrate 10 all forms the conducting wire with the first copper foil layer 11 and the second copper foil layer 15 with described product zone 101, and forms a plurality of the first air slots 104 and a plurality of the second air slot 105 at described garbage area 102.
Need to prove, the specific design of conducting wire needs to decide according to the demand of specific product, in Fig. 4, only is schematically to draw conducting wire structure in the present embodiment.In the present embodiment, the conducting wire of the first copper foil layer 11 comprises a plurality of edge connectors 111, a plurality of the first pad 112 and many first circuits 113, and the conducting wire of certain the first copper foil layer 11 can also comprise the All other routes element.The conducting wire of the second copper foil layer 15 comprises a plurality of the second pads 151 and many second circuits 152, certainly can also comprise the All other routes element.In addition, the chemical etching liquor that is used for etched circuit substrate 10 has stronger etching performance, in general, thereby can also etching remove part adhesive- layer 12,14 when etching removes part copper foil layer 11,15 to form the conducting wire.That is to say, generally speaking, be the insulating barrier 13 that exposes between the conducting wire, and air slot 104,105 also exposes insulating barrier 13.
Each first air slot 104 all runs through the first copper foil layer 11 and the first adhesive-layer 12, and exposes insulating barrier 13.Described a plurality of the first air slot 104 is adjacent one another are and be parallel to each other.Each second air slot 105 all runs through the second copper foil layer 15 and the second adhesive-layer 14, and exposes insulating barrier 13.A plurality of the second air slots 105 are also adjacent one another are and be parallel to each other.A plurality of the first air slots 104 and a plurality of the second air slot 105 all extend to the direction away from product zone 101 from product zone 101 and the boundary of garbage area 102.Particularly, a plurality of the first air slots 104 extend to garbage area 102 from a corner of product zone 101, and a plurality of the second air slots 105 extend to garbage area 102 from a limit of product zone 101.The quantity of the first air slot 104 and the second air slot 105 is not limit, in the present embodiment, the quantity of the first air slot 104 and the second air slot 105 is 5, each air slot 104,105 width are about 0.11mm, the width of adjacent two the first air slots 104 is 0.1mm, and the width of adjacent two the second air slots 105 is 0.1mm.In actual applications, each air slot 104,105 width range are 0.1mm to 0.3mm.The width range of adjacent two the first air slots 104 is 0.1mm to 0.3mm, and the width range of adjacent two the second air slots 105 is 0.1mm to 0.3mm.
The degree of depth of each the first air slot 104 be the thickness of the first copper foil layer 11 and the first adhesive-layer 12 thickness add and, in the present embodiment, be about 30 μ m.Usually in actual applications, the thickness range of the first copper foil layer 11 is about 12 μ m-30 μ m, and the thickness of the first adhesive-layer 12 is about 10 μ m-25 μ m, and therefore, the depth bounds of the first air slot 104 is 22 μ m-55 μ m.The degree of depth of the second air slot 105 be the thickness of the second copper foil layer 15 and the second adhesive-layer 14 thickness add and, the second air slot 105 depth boundses are 22 μ m-55 μ m.
It will be appreciated by those skilled in the art that, when circuit substrate 10 when not comprising adhesive- layer 12,14 two-sided glue-free soft copper-clad plate, the first air slot 104 only runs through the first copper foil layer 11 and exposes insulating barrier 13, and its thickness range is equivalent to the thickness range of the first copper foil layer 11; The second air slot 105 only runs through the second copper foil layer 15 and exposes insulating barrier 13, and its thickness range is equivalent to the thickness range of the second copper foil layer 15.
The 3rd step saw also Fig. 7 to Fig. 9, the first coverlay 16 is provided, and the first coverlay 16 is fitted in the surface of the first copper foil layer 11 of circuit substrate 10.
The size shape of the first coverlay 16 is corresponding with circuit substrate 10.Before fitting, need by the first perforate in the first coverlay 16 of the modes such as stamp or boring, in the first coverlay 16, offering a plurality of the first openings 161 corresponding to the zone of product zone 101, and in the first coverlay 16, offer at least one first air guide through hole 162 and a plurality of the second registration holes 163 corresponding to the zone of garbage area 102.A plurality of the first openings 161 are used for exposing product zone 101 and need to carry out the surface-treated zone at postorder, such as golden finger zone, pad etc.Described at least one first air guide through hole 162 is corresponding with a plurality of the first air slots 104, described a plurality of the second registration holes 163 is corresponding with a plurality of the first registration holes 103, is used for when fitting the first coverlay 16 so that the first coverlay 16 cooperates contraposition with circuit substrate 10.
Cooperate contraposition by a plurality of the second registration holes 163 with a plurality of the first registration holes 103, can be so that the first coverlay 16 and circuit substrate 10 alignment so, get final product so that the first coverlay 16 can be fitted in by the method for pressing the surface of the first copper foil layer 11.Particularly, in product zone 101, the first coverlay 16 is fitted in the surface of the conducting wire of the first copper foil layer 11, and a plurality of the first openings 161 expose in the conducting wire of the first copper foil layer 11 need to carry out the surface-treated zone at postorder, such as edge connector 111, the first pad 112 etc.; Cover a plurality of first air slots 104 of garbage area 102 at garbage area 102, the first coverlays 16, go back so that each first air slot 104 all is connected with first an air guide through hole 162, as shown in Figure 9 simultaneously.In the present embodiment, described at least one first air guide through hole 162 is that 162, five the first air slots 104 of first an air guide through hole all are communicated with this first air guide through hole 162.The diameter range of this first air guide through hole 162 is 1mm to 4mm.Need to prove, the quantity of the first air guide through hole 162 is not limit, and the quantity of the first air slot 104 that is communicated with first an air guide through hole 162 is not limit yet, and only needs so that each first air slot 104 all is connected with first an air guide through hole 162 gets final product.For example, can offer two the first air guide through holes 162 at the first coverlay 16 so that two the first air slots 104 respectively with the 162 corresponding connections of first an air guide through hole, in addition three the first air slots 104 and another the first air guide through hole 162 corresponding connections.Again for example, in other embodiments, can offer five the first air guide through holes 162 at the first coverlay 16 so that each first air slot 104 respectively with the 162 corresponding connections of first an air guide through hole.Again for example, the length of each the first air slot 104 can be inconsistent, and so, the distributing position of five the first air guide through holes 162 can be decided according to the length of each the first air slot 104.
It will be appreciated by those skilled in the art that, the first coverlay 16 is fitted in the process on surface of the first copper foil layer 11, be very easy between the surface of the first coverlay 16 and the first copper foil layer 11, produce micro-bubble, especially the first coverlay 16 corresponding to the zone of product zone 101 in away from the position of the first opening 161.In the present embodiment, the first opening 161 concentrates on upside and the right side of product zone 101, thereby, be easy in the pressing process, produce bubble in the lower-left of product zone 101 side.Yet, in the technical program, because the lower-left side of product zone 101 has the existence of a plurality of the first air slots 104 that extend from garbage area 102, can so that the gas that is easy to produce bubble in the lower-left of product zone 101 side in the pressing process is derived by a plurality of the first air slots 104, and finally overflow from the first air guide through hole 162.And, because the width of each the first air slot 104 is less, a plurality of the first air slots 104 are closely adjacent, and the first coverlay 16 can't be collapsed upon within any one first air slot 104, as shown in Figure 8, like this then fully guaranteed the air guide performance of the first air slot 104.Therefore, the technical program has been avoided producing bubble between the first coverlay 16 and the first copper foil layer 11 in the pressing process, so that the first coverlay 16 and the first copper foil layer 11 close contacts have improved pressing effect and final circuit board end properties.
According to the above description, it will be understood by those skilled in the art that offering the position and offering quantity and do not limit of the first air slot 104, preferably be opened in away from carrying out the surface-treated zone at postorder in the conducting wire of the first copper foil layer 11.In fact, in the present embodiment, except the lower-left side in the product zone 101 of the first copper foil layer 11 is offered a plurality of the first air slots 104, can also all offer a plurality of the first air slots 104 at left side and the downside of the product zone 101 of the first copper foil layer 11, so can better play the effect of air guide.
In addition, it may be noted that the first air guide through hole 162 can be various holes, for example can be tooling hole, in the effect of playing tooling hole, also play the effect of air guide.
The 4th step, with circuit substrate 10 turn-overs of first coverlay 16 of having fitted, and as shown in figure 10 the second coverlays 17 of fitting on the second copper foil layer 15 surface of circuit substrate 10.
The size shape of the second coverlay 17 is also corresponding with circuit substrate 10.Before fitting, need by the first perforate in the second coverlay 17 of the modes such as stamp or boring, in the second coverlay 17, offering a plurality of the second openings 171 corresponding to the zone of product zone 101, and in the second coverlay 17, offer at least one second air guide through hole 172 and a plurality of the 3rd registration holes 173 corresponding to the zone of garbage area 102.A plurality of the second openings 171 are used for exposing the conducting wire of the second copper foil layer 15 of product zone 101 need to carry out the surface-treated zone at postorder, such as the second pad 151 etc.Described at least one second air guide through hole 172 is corresponding with a plurality of the second air slots 105, described a plurality of the 3rd registration holes 173 is corresponding with a plurality of the first registration holes 103, is used for when fitting the second coverlay 17 so that the second coverlay 17 cooperates contraposition with circuit substrate 10.
The attaching process of the attaching process of the second coverlay 17 and the first coverlay 16 is close, can be fitted in by the method for pressing the surface of the second copper foil layer 15.Particularly, be fitted in the surface of the conducting wire of the second copper foil layer 15 at product zone 101, the second coverlays 17, a plurality of the second openings 171 expose and need to carry out the surface-treated zone at postorder; Cover a plurality of second air slots 105 of garbage area 102 at garbage area 102, the second coverlays 16, go back so that each second air slot 105 all is connected with second an air guide through hole 172 simultaneously.
It will be appreciated by those skilled in the art that, in the second coverlay 17 processes of fitting, be very easy between the surface of the second coverlay 17 and the second copper foil layer 15, produce micro-bubble, especially the second coverlay 17 corresponding to the zone of product zone 101 in away from the position of the second opening 171.In the present embodiment, the second opening 171 concentrates on upper left side and the lower-left side of product zone 101, thereby, be easy in the pressing process, produce bubble in the left side of product zone 101.Yet, in the technical program, because the left side of product zone 101 has the existence of a plurality of the second air slots 105 that extend from garbage area 102, can be so that be easy to produce the gas of bubble in the pressing process derive by a plurality of the second air slots 105 on the right side of product zone 101, and finally overflow from the second air guide through hole 172.So, then avoided in the pressing process, between the second coverlay 17 and the second copper foil layer 15, producing bubble.
In addition, it is pointed out that the technical program can not comprise the step in the 4th step when substrate 100 during for the individual layer that included coverlay, bilayer or sandwich construction.
After second coverlay 17 of fitting, circuit substrate 10 can be made circuit board 108.Need to prove, the step of second coverlay 17 of fitting also can be finished simultaneously with the step of first coverlay 16 of fitting.Those skilled in the art know, and after second coverlay 17 of fitting, can also carry out to circuit board 108 treatment process such as gold-plated, stamp, finally obtain the circuit board finished product.
See also Fig. 1 to Figure 11, the circuit board 108 of making by above-mentioned technique comprises the second coverlay 17, substrate 100, insulating barrier 13, the first adhesive-layer 12, the first copper foil layer 11 and the first coverlay 16 that stacks gradually from bottom to top.The garbage area 102 that described circuit board 108 has product zone 101 and is connected with product zone 101, the first copper foil layer 11 of described product zone 101 is formed with the conducting wire, described garbage area 102 is formed with a plurality of the first air slots 104 that run through the first copper foil layer 11 and covered by the first coverlay 16, described a plurality of the first air slot 104 is adjacent one another are and be parallel to each other, and a plurality of the first air slots 104 all extend to the direction away from product zone 101 from product zone 101 and the boundary of garbage area 102.The first coverlay 16 of described garbage area 102 is formed with at least one first air guide through hole 162, and each first air slot 104 all is connected with first an air guide through hole 162.
In the present embodiment, substrate 100 is the single layer structure that comprises one deck copper foil layer, and in other embodiments, substrate 100 can be for comprising the dielectric base of copper foil layer, also can be for comprising the sandwich construction of two-layer above copper foil layer.In the present embodiment, substrate 100 does not comprise coverlay, in other embodiments, substrate 100 can be for comprising the sandwich construction of dielectric film, for example, substrate 100 can be for comprising the structure of the second adhesive-layer 14, the second copper foil layer 15 and the second coverlay 17, perhaps can be the multilayer copper foil layer that comprises alternative arrangement and the structure of multilayer dielectric layer and one deck coverlay.So, the second coverlay 17 in the circuit board 108 is not to be essential features.
It will be appreciated by those skilled in the art that, in the technical program, when making the conducting wire, product zone 101 etchings of circuit substrate 10 form a plurality of the first air slots 104 and a plurality of the second air slot 105 in garbage area 102 etchings simultaneously, and before the conducting wire of circuit substrate 10 both sides surface pressing the first coverlay 16 and the second coverlay 17, in the first coverlay 16 and the second coverlay 17, offer respectively in advance at least one first air guide through hole 162 and the second air guide through hole 172, so, when circuit substrate 10 both sides pressings the first coverlay 16 and the second coverlay 17, gas between circuit substrate 10 and the first coverlay 16 can be derived by a plurality of the first air slots 104, and finally overflow from the first air guide through hole 162 that is communicated with the first air slot 104, gas between circuit substrate 10 and the second coverlay 17 can be derived by a plurality of the second air slots 105, and finally overflows from the second air guide through hole 172 that is communicated with the second air slot 105.And, because the width of each first air slot 104 and the second air slot 105 is less, a plurality of the first air slots 104 are closely adjacent, a plurality of the second air slots 105 are also closely adjacent, the first coverlay 16 can't be collapsed upon within any one first air slot 104, the second coverlay 17 is not collapsed upon within any one second air slot 105 yet, and is like this then fully guaranteed the air guide performance of the first air slot 104 and the second air slot 105.Therefore, the technical program avoided in the pressing process coverlay 16,17 and circuit substrate 10 between produce bubble so that coverlay 16,17 and the circuit substrate close contact has improved pressing effect and final circuit board end properties.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. the manufacture method of a circuit board comprises step:
Circuit substrate is provided, and described circuit substrate comprises substrate, insulating barrier and the first copper foil layer that stacks gradually, the garbage area that described circuit substrate has product zone and is connected with product zone;
The etched circuit substrate, form the conducting wire with the first copper foil layer with described product zone, and form a plurality of the first air slots that run through the first copper foil layer at described garbage area, described a plurality of the first air slot is adjacent one another are and be parallel to each other, and a plurality of the first air slots all extend to the direction away from product zone from the boundary of product zone and garbage area; And
First coverlay that will have at least one the first air guide through hole fits in the first copper foil layer of circuit substrate, so that the first coverlay is fitted in the surface of the conducting wire of product zone, and covering a plurality of first air slots of garbage area, each first air slot all is connected with first an air guide through hole.
2. the manufacture method of circuit board as claimed in claim 1 is characterized in that, the width of each the first air slot is 0.1 millimeter to 0.3 millimeter, and the spacing of adjacent two the first air slots is 0.1 millimeter to 0.3 millimeter.
3. the manufacture method of circuit board as claimed in claim 1 is characterized in that, described circuit substrate also comprises the first adhesive-layer that is arranged between insulating barrier and the first copper foil layer, and described a plurality of the first air slots run through the first copper foil layer and the first adhesive-layer.
4. the manufacture method of circuit board as claimed in claim 1 is characterized in that, after circuit substrate is provided, also is included in the step of offering a plurality of the first registration holes on the circuit substrate; Before the first coverlay is fitted in the first copper foil layer of circuit substrate, in the first coverlay, offer a plurality of the first openings, a plurality of the second registration holes and described at least one first air guide through hole, described a plurality of the first opening is corresponding to the edge connector in the conducting wire of the first copper foil layer and pad, and described a plurality of the second registration holes are corresponding with a plurality of the first registration holes; In the first coverlay, offer after a plurality of the second registration holes and before the first coverlay is fitted in the first copper foil layer of circuit substrate, by the cooperation of a plurality of the first registration holes and a plurality of the second registration holes the first coverlay is alignd with circuit substrate.
5. the manufacture method of circuit board as claimed in claim 1 is characterized in that, the substrate of described circuit substrate comprises the second copper foil layer; When the first copper foil layer of etched circuit substrate, described the second copper foil layer of etching also, form the conducting wire with the second copper foil layer with described product zone, and form a plurality of the second air slots that run through the second copper foil layer at described garbage area, described a plurality of the second air slot is adjacent one another are and be parallel to each other, and a plurality of the second air slots all extend to the direction away from product zone from the boundary of product zone and garbage area; After the first coverlay is fitted in the first copper foil layer of circuit substrate, the second coverlay with at least one second air guide through hole is provided, and the second coverlay is fitted in the second copper foil layer surface of circuit substrate, so that the second coverlay covers a plurality of second air slots of garbage area, each second air slot all is connected with second an air guide through hole.
6. the manufacture method of circuit board as claimed in claim 5 is characterized in that, the width of each the second air slot is 0.1 millimeter to 0.3 millimeter, and the spacing of adjacent two the second air slots is 0.1 millimeter to 0.3 millimeter.
7. circuit board, it comprises the substrate that stacks gradually, insulating barrier, the first copper foil layer and the first coverlay, the garbage area that described circuit board has product zone and is connected with product zone, the first copper foil layer of described product zone is formed with the conducting wire, described garbage area is formed with a plurality of the first air slots that run through the first copper foil layer and covered by the first coverlay, described a plurality of the first air slot is adjacent one another are and be parallel to each other, a plurality of the first air slots all extend to the direction away from product zone from the boundary of product zone and garbage area, the garbage area of described the first coverlay is formed with at least one first air guide through hole, and each first air slot all is connected with first an air guide through hole.
8. circuit board as claimed in claim 7 is characterized in that, the width of each the first air slot is 0.1 millimeter to 0.3 millimeter, and the spacing of adjacent two the first air slots is 0.1 millimeter to 0.3 millimeter.
9. circuit board as claimed in claim 7, it is characterized in that, described substrate comprises the second copper foil layer, described circuit board also comprises and is arranged on the second copper foil layer away from the second coverlay of insulating barrier one side, the second copper foil layer of described product zone also is formed with the conducting wire, described garbage area also is formed with a plurality of the second air slots that run through the second copper foil layer and covered by the second coverlay, described a plurality of the second air slot is adjacent one another are and be parallel to each other, a plurality of the second air slots all extend to the direction away from product zone from the boundary of product zone and garbage area, the garbage area of described the second coverlay is formed with at least one second air guide through hole, and each second air slot all is connected with second an air guide through hole.
10. circuit board as claimed in claim 9 is characterized in that, the width of each the second air slot is 0.1 millimeter to 0.3 millimeter, and the spacing of adjacent two the second air slots is 0.1 millimeter to 0.3 millimeter.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210073659.0A CN103327748B (en) | 2012-03-20 | 2012-03-20 | Circuit board and preparation method thereof |
| TW101110698A TWI444116B (en) | 2012-03-20 | 2012-03-28 | Printed circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210073659.0A CN103327748B (en) | 2012-03-20 | 2012-03-20 | Circuit board and preparation method thereof |
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| Publication Number | Publication Date |
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| CN103327748A true CN103327748A (en) | 2013-09-25 |
| CN103327748B CN103327748B (en) | 2016-12-14 |
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| CN201210073659.0A Active CN103327748B (en) | 2012-03-20 | 2012-03-20 | Circuit board and preparation method thereof |
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| Country | Link |
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| CN (1) | CN103327748B (en) |
| TW (1) | TWI444116B (en) |
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| CN104470257A (en) * | 2014-12-12 | 2015-03-25 | 东莞市康庄电路有限公司 | Machining method for improving pluggable position precision of PCB golden fingers |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN111385962A (en) * | 2018-12-29 | 2020-07-07 | 广东生益科技股份有限公司 | PCB and preparation method thereof |
| CN112739075A (en) * | 2020-12-08 | 2021-04-30 | 深圳市祺利电子有限公司 | Manufacturing method for preventing tin spraying and explosion of circuit board |
| CN113329556A (en) * | 2021-05-19 | 2021-08-31 | 景旺电子科技(龙川)有限公司 | Flexible circuit board and manufacturing method thereof |
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| CN104470257A (en) * | 2014-12-12 | 2015-03-25 | 东莞市康庄电路有限公司 | Machining method for improving pluggable position precision of PCB golden fingers |
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| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
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| CN112739075B (en) * | 2020-12-08 | 2022-05-24 | 深圳市祺利电子有限公司 | Manufacturing method for preventing tin spraying and explosion of circuit board |
| CN113329556A (en) * | 2021-05-19 | 2021-08-31 | 景旺电子科技(龙川)有限公司 | Flexible circuit board and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201340804A (en) | 2013-10-01 |
| CN103327748B (en) | 2016-12-14 |
| TWI444116B (en) | 2014-07-01 |
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Effective date of registration: 20170811 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Address before: 066000 Qinhuangdao economic and Technological Development Zone, Hebei Tengfei Road, No. 18 Co-patentee before: Zhending Technology Co., Ltd. Patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. |
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