CN211429681U - Press fitting die - Google Patents
Press fitting die Download PDFInfo
- Publication number
- CN211429681U CN211429681U CN201922279030.1U CN201922279030U CN211429681U CN 211429681 U CN211429681 U CN 211429681U CN 201922279030 U CN201922279030 U CN 201922279030U CN 211429681 U CN211429681 U CN 211429681U
- Authority
- CN
- China
- Prior art keywords
- mold
- printed circuit
- positioning
- circuit board
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a pressing mould, which comprises a first mould, a second mould and a positioning piece, wherein the first mould is positioned on the second mould, a plurality of pressing areas for accommodating a multilayer printed circuit board are arranged between the first mould and the second mould, and the edge positions of the first mould and the second mould in each pressing area are provided with positioning holes; and each layer of core board of each multilayer printed circuit board is provided with a through hole at the position opposite to the positioning hole, and the positioning piece penetrates through the positioning hole and the through hole and is used for positioning the multilayer printed circuit board in the pressing area. The utility model discloses a when compression moulding utensil helped promoting multilayer printed circuit board pressfitting quality, can promote pressfitting efficiency again, reduce multilayer printed circuit board's manufacturing cost.
Description
Technical Field
The utility model relates to a printed circuit board makes technical field, in particular to pressfitting module suitable for multilayer printed circuit board.
Background
Printed Circuit Boards (PCBs) are also called PCBs and are providers of electrical connections between electronic components.
The multilayer printed circuit board is different from a single-sided printed circuit board and a double-sided printed circuit board, a plurality of core boards are arranged in the multilayer printed circuit board, each core board is provided with a circuit pattern, and the circuit patterns of all layers are communicated through preset connecting holes. In the process of manufacturing the multilayer printed circuit board, the lamination is one of the very critical processes, and the precision of the lamination mainly depends on the lamination mold, so the lamination mold is the key for determining the lamination quality of the multilayer printed circuit board. At present, as shown in fig. 1, a pressing mold generally used for pressing a multi-layer printed circuit board 50 includes a first mold 10 and a second mold 20, before pressing, core boards of different layers in the multi-layer printed circuit board 50 need to be fixed by fasteners 70 (such as rivets) or other means, then the second mold 20 is used as a substrate, a plurality of multi-layer printed circuit boards can be placed at the same time, then the first mold 10 is used as a cover board, and finally pressing is performed.
However, although the pressing mold in the prior art has high pressing efficiency, the stability of the offset between the layers is low, and the pressing mold is only suitable for the multi-layer printed circuit board with lower end and lower layer. Therefore, a pressing mold capable of ensuring the pressing quality of the multi-layer printed circuit board and improving the pressing efficiency is urgently needed.
SUMMERY OF THE UTILITY MODEL
The utility model provides a press fitting die utensil when helping promoting multilayer printed circuit board pressfitting quality, can promote pressfitting efficiency again, reduces multilayer printed circuit board's manufacturing cost.
The utility model provides a press fitting die utensil, it includes: the positioning device comprises a first die, a second die and a positioning piece, wherein the first die is positioned above the second die, a plurality of pressing areas for accommodating a multilayer printed circuit board are arranged between the first die and the second die, and positioning holes are formed in the edge positions of the first die and the second die in each pressing area; and each layer of core board of each multilayer printed circuit board is provided with a through hole at the position opposite to the positioning hole, and the positioning piece penetrates through the positioning hole and the through hole and is used for positioning the multilayer printed circuit board in the press-fit area.
In the pressing mold, optionally, a gap exists between the multiple layers of printed circuit boards in two adjacent pressing regions, and the pressing regions are arranged in an array on the pressing mold.
The press-fit mold as described above, optionally, a plurality of first layout areas are distributed on the first mold, a plurality of second layout areas corresponding to the first layout areas are distributed on the second mold, and when the first mold is located on the second mold, the press-fit area is formed between the first layout areas and the second layout areas.
In the press-fit mold described above, optionally, each of the press-fit regions has the same size.
Optionally, the positioning hole of the first mold is a first positioning hole, the positioning hole of the second mold is a second positioning hole, and the positioning element sequentially penetrates through the first positioning hole, the through hole, and the second positioning hole.
Optionally, in the press-fit mold according to any of the above items, there are a plurality of positioning holes in each press-fit region, and the plurality of positioning holes are uniformly distributed at an edge position of the press-fit region.
In the pressing mold, optionally, the number of the positioning holes and the through holes in each pressing region is 4.
The press-fitting mold according to any one of the above aspects, optionally, the first mold and the second mold are mirror stainless steel plates.
In the pressing mold as described above, optionally, the first mold and the second mold have the same thickness.
In the pressing mold, optionally, the positioning element is a positioning pin, and the positioning hole is a pin hole matched with the positioning element structure.
The utility model provides a press-fit mold, at first through set up the locating hole in the border position in every pressfitting region, every layer of core of every multilayer printed circuit board all is equipped with the through hole with locating hole relative position department, when carrying out the pressfitting to multilayer printed circuit board, the setting element runs through position hole and through hole, make press-fit mold and multilayer printed circuit board fixed each other when the pressfitting, thereby realize fixing a position the multilayer printed circuit board in the pressfitting region, mutual skew between first mould, second mould and the multilayer printed circuit board when avoiding the pressfitting, and then guarantee multilayer printed circuit board pressfitting quality; on this basis, through the setting of a plurality of pressfitting regions on the pressfitting mould for same group's pressfitting mould can be simultaneously to a plurality of multilayer printed circuit board pressfitting, and pressfitting efficiency increases at double, on the basis of multilayer printed circuit board pressfitting quality, improvement pressfitting efficiency that can be very big, the manufacturing cost of reduction multilayer printed circuit board at double. Therefore, the utility model provides a when the compression moulding utensil helps promoting multilayer printed circuit board pressfitting quality, can raise the efficiency again, reduce multilayer printed circuit board's manufacturing cost.
Drawings
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the second side will briefly introduce the drawings needed to be used in the description of the embodiments or the prior art, and obviously, the drawings in the description of the second side are some embodiments of the present invention, and for those skilled in the art, second, other drawings can be obtained according to these drawings without inventive laboriousness.
FIG. 1 is a schematic diagram of a press mold according to the prior art;
fig. 2 is a schematic structural view of a press-fit mold according to an embodiment of the present invention;
fig. 3 is a top view of a press mold according to an embodiment of the present invention;
fig. 4 is a top view of a pressing area in the pressing mold according to an embodiment of the present invention.
The attached drawings indicate the following:
a first mold-10;
a first layout area-11;
a second mold-20;
second layout area-21
A pressing area-30;
edge position-31;
positioning holes-40;
a first positioning hole-40 a;
a second positioning hole-40 b;
multilayer printed circuit board-50;
a core plate-61;
through-hole-52;
positioning element-60;
a gap-L;
fastener-70.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the second surface will combine with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by the second person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
The printed circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of layers of the circuit board. The multilayer printed circuit board is different from a single-sided printed circuit board and a double-sided printed circuit board, a plurality of core boards are arranged in the multilayer printed circuit board, each core board is provided with a circuit pattern, and the circuit patterns of the core boards are communicated through preset connecting holes.
As described in the background art, in the manufacturing process of the multi-layer printed circuit board 50, the lamination is one of the very critical processes, the offset between the cores of the multi-layer printed circuit board will directly affect the reliability problems of the multi-layer printed circuit board, such as signal transmission and electrical performance, etc., and the rejection of the multi-layer printed circuit board 50 will be directly caused by the excessive offset, so that the lamination mold is the key for determining the lamination quality of the multi-layer printed circuit board. As shown in fig. 1, a pressing mold generally used for pressing a multi-layer printed circuit board 50 includes a first mold 10 and a second mold 20, before pressing, core boards of different layers in the multi-layer printed circuit board 50 are fixed by fasteners 70 (such as rivets) or other methods (such as a combination of welding and riveting), then the second mold 20 is used as a substrate, a plurality of multi-layer printed circuit boards 50 can be placed on the second mold 20 at the same time, then the first mold 10 is used as a cover board, and finally pressing is performed. However, although the pressing mold in the prior art has high pressing efficiency, when pressing, because the offset stability between the core boards is low, that is, the core boards may have offsets and dislocations, the pressing mold in the prior art is only suitable for pressing the multi-layer printed circuit boards at lower ends and lower layers, that is, the pressing mold in the prior art is only suitable for a scenario where the pressing quality requirement for the multi-layer printed circuit boards is low or the number of layers of the multi-layer printed circuit boards is small (for example, the number of layers of the multi-layer printed circuit boards is less than or equal to 4).
Therefore, a pressing mold capable of ensuring the pressing quality of the multi-layer printed circuit board and improving the pressing efficiency is urgently needed.
Therefore, the embodiment of the utility model provides a pressing mold helps promoting when multilayer printed circuit board pressfitting quality, can promote pressfitting efficiency again, reduces multilayer printed circuit board's manufacturing cost.
Examples
Fig. 2 is the utility model provides a press fitting die's structural schematic diagram, fig. 3 is the utility model provides a press fitting die's top view, fig. 4 is the utility model provides an in the press fitting die who provides a pressfitting region's top view.
Referring to fig. 2 to 4, an embodiment of the present invention provides a press-fit mold, which includes: the multi-layer printed circuit board laminating machine comprises a first die 10, a second die 20 and a positioning piece 60, wherein the first die 10 is positioned on the second die 20, a plurality of laminating areas 30 for accommodating multi-layer printed circuit boards 50 are arranged between the first die 10 and the second die 20, and positioning holes 40 are formed in edge positions 31 of the first die 10 and the second die 20 in each laminating area 30; each core board 61 of each multi-layer printed circuit board 50 is provided with a through hole 52 at a position opposite to the positioning hole 40, and the positioning member 60 penetrates through the positioning hole 40 and the through hole 52 and is used for positioning the multi-layer printed circuit board 50 in the press-fit area 30.
Thus, by the arrangement of the positioning holes 40 in each press-fit region 30 and the arrangement of the through holes 52 in each core board 61 of each multi-layer printed circuit board 50, the positioning members 60 penetrate through the positioning holes 40 and the through holes 52, so that the pressing mold and the multi-layer printed circuit board 50 are fixed to each other during pressing, thereby positioning the multi-layer printed circuit board 50 in the pressing area 30, the quality abnormality such as deviation of the multi-layer printed circuit board 50 caused by slide plate and deviation will not occur during pressing, compared with the pressing mold in the prior art, the offset stability among the core plates 61 of each layer is improved, further, the lamination quality and the lamination power of the multilayer printed circuit board 50 are ensured, so that the lamination mold in this embodiment can be applied to a scenario where the lamination quality requirement on the multilayer printed circuit board 50 is high or the number of layers of the multilayer printed circuit board 50 is large (for example, the number of layers of the multilayer printed circuit board 50 is greater than 4).
It should be noted that the pressing power in this embodiment refers to the number of the multi-layer printed circuit boards 50 that meet the industry requirement range of each index (such as the offset between the core boards 61) after being pressed by the pressing mold, and is a ratio of the pressing number of the total multi-layer printed circuit boards 50. Since the lamination requirements of different industries for the multi-layer printed circuit board 50 are different, in the present embodiment, the lamination requirements for the multi-layer printed circuit board 50 are not further limited.
Specifically, the present embodiment enables the same set of pressing molds to simultaneously press the plurality of pressing regions 30 for accommodating the plurality of printed circuit boards 50 between the first mold 10 and the second mold 20 by arranging the plurality of pressing regions 30 for accommodating the plurality of printed circuit boards 50. Because the positioning element 60 penetrates through each pressing area 30, the positions of the first die 10 and the second die 20 are relatively fixed through the positioning elements 60, so that quality abnormalities such as deviation of pressing of the multilayer printed circuit board 50 and the like caused by sliding plates, deviation and the like can not be generated during pressing, on the basis of the pressing quality of the multilayer printed circuit board 50, the pressing efficiency is increased in a multiple mode, the pressing efficiency can be greatly improved, and correspondingly, the manufacturing cost of the multilayer printed circuit board 50 is reduced in a multiple mode.
Specifically, in the present embodiment, the first mold 10 is located above the second mold 20, and the multi-layer printed circuit board 50 is located in the pressing area 30 between the first mold 10 and the second mold 20, so that the first mold 10 can be understood as an upper mold of the pressing mold, and the second mold 20 can be understood as a lower mold of the pressing mold. During the pressing process, the second mold 20 may serve as a substrate of the multi-layer printed circuit board 50, and the first mold 10 may serve as a cover plate of the multi-layer printed circuit board 50, and a pressing device (such as a hot press or the like) is used to perform a press molding on the multi-layer printed circuit board 50 in the pressing area 30 of the pressing mold, and then the next process is performed.
It should be noted that, referring to fig. 2 to 4, in the present embodiment, the edge position 31 in the stitching region 30 refers to a position in the stitching region 30 corresponding to an edge region of the multi-layer printed circuit board 50 in the stitching region 30. Thus, when the through-hole 52 is formed in each core board 61 of the multilayer printed circuit board 50, the circuit pattern at the center of the core board 61 is not disturbed.
The utility model discloses at first set up locating hole 40 through border position 31 in every pressfitting region 30, every layer core 61 of every multilayer printed circuit board 50 all is equipped with through hole 52 with locating hole 40 relative position department, when pressfitting multilayer printed circuit board 50, setting element 60 runs through locating hole 40 and through hole 52, make pressfitting mould and multilayer printed circuit board 50 mutual stationary when pressfitting, thereby realize fixing a position multilayer printed circuit board 50 in pressfitting region 30, avoid the mutual skew between first mould 10, second mould 20 and multilayer printed circuit board 50 when pressfitting, and then guarantee multilayer printed circuit board 50 pressfitting quality; on this basis, through the setting of a plurality of pressfitting regions 30 on the pressfitting mould for same group's pressfitting mould can be simultaneously pressfitting to a plurality of multilayer printed circuit board 50, on the basis of the 50 pressfitting qualities of multilayer printed circuit board, improvement pressfitting efficiency that can be very big, the manufacturing cost of reduction multilayer printed circuit board 50 by multiples. Therefore, the utility model provides a when the compression moulding utensil helps promoting 50 pressfitting qualities of multilayer printed circuit board, can raise the efficiency again, reduce multilayer printed circuit board 50's manufacturing cost.
Referring to fig. 2 and 3, a gap L exists between the multi-layer printed circuit boards 50 in two adjacent press-fit areas 30, and the press-fit areas 30 are arranged in an array on the press-fit mold.
Referring to fig. 2 and 3, a gap L exists between the multiple layers of printed circuit boards 50 in two adjacent press-fit regions 30, so that on one hand, the multiple layers of printed circuit boards 50 in the press-fit mold are independent from each other during press-fit, and on the other hand, air between the core boards 61 of the multiple layers of printed circuit boards 50 is exhausted during press-fit, and simultaneously, adhesive sheets (not shown in the figures) between the core boards 61 of the multiple layers of printed circuit boards 50 can flow out through the gap L after being melted in at high temperature during press-fit. In this embodiment, the gap L is not further limited as long as the distance of the gap L is such that when the two adjacent layers of printed circuit boards are pressed together, the two adjacent layers of printed circuit boards are independent from each other, and the air between the multiple layers of printed circuit boards 50 can be conveniently exhausted.
It should be noted that the adhesive sheet in this embodiment may be a glass sheet, a sheet structure made of Polypropylene (PT) or other resin insulation sheets, and the adhesive sheet plays a role of adhesion and insulation between each layer of the core boards 61 of the multi-layer printed circuit board 50, and in this embodiment, the specific preparation material of the adhesive sheet and the distribution in the multi-layer printed circuit board 50 are not further described.
Specifically, referring to fig. 2 and fig. 3, in this embodiment, the pressing areas 30 are arranged in an array on the pressing mold, so that on one hand, the pressing mold can be reasonably utilized to improve the utilization rate of the pressing mold, and on the other hand, the multi-layer printed circuit boards 50 in the pressing areas 30 can be uniformly arranged in the pressing areas 30, so that the multi-layer printed circuit boards 50 in the pressing areas 30 are more uniformly stressed during pressing.
For example, referring to fig. 3, in the present embodiment, the pressing regions 30 may be arranged on the pressing mold in a square array, that is, a plurality of pressing regions 30 may be respectively arranged in the transverse direction and the longitudinal direction of the pressing mold to form square arrays with different shapes, so that the space utilization rate on the pressing mold is higher. In this embodiment, the square array may be rectangular or square, and in practical application, the array distribution shape of the stitching regions 30 on the stitching mold may be selected according to the size of the multi-layer printed circuit board 50 to be stitched and the gap L between two adjacent stitching regions 30.
Further, referring to fig. 2 and 3, a plurality of first layout areas 11 are distributed on the first mold 10, a plurality of second layout areas 21 corresponding to the first layout areas 11 are distributed on the second mold 20, when the first mold 10 is positioned on the second mold 20, a pressing area 30 is formed between the first layout areas 11 and the second layout areas 21, thus, on one hand, a plurality of stitching regions 30 are formed between the first layout region 11 and the second layout region 21, and the multilayer printed circuit board 50 is disposed in different stitching regions 30, the multi-layer printed circuit board 50 in all the pressing areas 30 in the same pressing mold can be simultaneously pressed and molded through the pressing device (such as a hot press) during pressing, the pressing efficiency can be greatly improved, the manufacturing cost of the multi-layer printed circuit board 50 is reduced by times, and the structure of the pressing mold is simpler on the other hand.
Referring to fig. 2, in the present embodiment, the first mold 10 and the second mold 20 may be both plate-shaped structures, and correspondingly, the first layout region 11 and the second layout region 21 may be understood as dividing the first mold 10 and the second mold 20 into regions, and making two adjacent first layout regions 11 or second layout regions 21 independent from each other. When the first mold 10 is located on the second mold 20, the first layout region 11 is located above the corresponding second layout region 21, and a stitching region 30 is formed between the first layout region 11 and the second layout region 21, that is, the stitching region 30 is an intermediate layer between the first layout region 11 and the second layout region 21.
Further, referring to fig. 3, in order to facilitate the uniform lamination quality of the multi-layer printed circuit board 50 in the lamination mold, in this embodiment, the size of each lamination area 30 is the same, that is, the same layout size is set in the lamination mold, so that the same lamination mold of this embodiment is only suitable for multi-layer printed circuit boards 50 with one size. During pressing, the stress on the multiple multilayer printed circuit boards 50 in the same pressing mold can be more uniform, and more uniform pressing quality can be obtained. Meanwhile, the number of the pressing areas 30 in the pressing mold can also be determined according to the size of the pressing areas 30.
It should be noted that the size of the stitching region 30 in this embodiment may be a typesetting size commonly used in the PCB manufacturing industry, that is, a general size of the multi-layer printed circuit board 50, so that the stitching mold of this embodiment has certain versatility. Alternatively, the size of the stitching region 30 in this embodiment may be set independently according to the actual usage requirement, so as to set the non-conventional typesetting size in the PCB manufacturing industry. In the present embodiment, the size of the nip region 30 is not further limited.
Illustratively, the typical typographical dimensions within the PCB manufacturing industry may be 18.42x24.42 inches, 21.42x24.42 inches, 16.42x21.42 inches, 16.42x18.42 inches, 21.42x27.42 inches, or 24.42x30.42 inches.
In order to facilitate better distinguishing the positioning holes 40 on the pressing mold, referring to fig. 3, in this embodiment, the positioning hole 40 on the first mold 10 may be a first positioning hole 40a, the positioning hole 40 on the second mold 20 may be a second positioning hole 40b, and the positioning element 60 sequentially penetrates through the first positioning hole 40a, the through hole 52 and the second positioning hole 40b to position the multilayer printed circuit board 50 in the pressing region 30, so that the multilayer printed circuit board 50 in the pressing region 30 is fixed relative to the pressing mold, thereby preventing mutual offset between the first mold 10, the second mold 20 and the multilayer printed circuit board 50 during pressing, and further ensuring the pressing quality of the multilayer printed circuit board 50.
Further, in order to improve the positioning effect on the printed circuit board, referring to fig. 3 and 4, a plurality of positioning holes 40 may be provided in each pressing region 30, and the plurality of positioning holes 40 are uniformly distributed at the edge position 31 of the pressing region 30, so that the positioning effect can be achieved in each direction of the edge position 31 of the pressing region 30, and during pressing, quality abnormalities such as pressing deviation of the multilayer printed circuit board 50 caused by sliding plates, deviation and the like can not be generated, that is, relative deviation between the first mold 10 and the second mold 20 relative to the multilayer printed circuit board 50 and between the core plates 61 of the multilayer printed circuit board 50 can be avoided, and further, the pressing quality of the multilayer printed circuit board 50 can be ensured.
Illustratively, as shown in fig. 3 and 4, the number of the positioning holes 40 and the through holes 52 in each pressing area 30 may be 4 or an even number greater than 4, that is, in the present embodiment, the number of the positioning holes 40 and the through holes 52 in each pressing area 30 includes, but is not limited to, 4.
Specifically, in the present embodiment, the first mold 10 and the second mold 20 may be stainless steel plates or plate-shaped structures made of other materials that have certain strength and pressure resistance and are not prone to rust, that is, in the present embodiment, the first mold 10 and the second mold 20 include, but are not limited to, stainless steel plates. Through the arrangement of the stainless steel plates of the first die 10 and the second die 20, on one hand, the first die 10 and the second die 20 have certain strength and pressure resistance, and on the other hand, because the stainless steel plates are not easy to oxidize and rust, the pollution to the multilayer printed circuit board 50 to be pressed can be avoided on the stainless steel plates during pressing.
On the basis of the above, in order to make the attaching effect between the first mold 10 and the second mold 20 and the multilayer printed circuit board 50 better, in the embodiment, the first mold 10 and the second mold 20 may be mirror stainless steel plates. In this embodiment, the mirror surface refers to a surface state of stainless steel, that is, a laminated surface (i.e., a surface close to the multilayer printed circuit board 50) of the stainless steel plate is a mirror surface (i.e., a horizontal surface) without any pits or protrusions.
Further, in order to make the first mold 10 and the second mold 20 have the same pressure resistance and strength, in the present embodiment, the thicknesses of the first mold 10 and the second mold 20 are the same. For example, the thickness of the first mold 10 and the second mold 20 may be 2mm to 4mm, such as 3mm, which on one hand can make the first mold 10 and the second mold 20 have certain strength and pressure resistance, and are not easily deformed during pressing; on the other hand, when the first mold 10 and the second mold 20 are limited within the above range, the pressure of the first mold 10 and the second mold 20 on the multi-layer printed circuit board 50 is not too large, so that the pressing effect on the multi-layer printed circuit board 50 is not affected.
Specifically, in this embodiment, the positioning element 60 may be a positioning pin or other fastening element 70, and correspondingly, the positioning hole 40 may be a pin hole or other positioning hole 40 adapted to the positioning pin. That is, in the present embodiment, the positioning member 60 includes, but is not limited to, a positioning pin, and the positioning hole 40 includes, but is not limited to, a pin hole. For example, in the present embodiment, the positioning pin may be a straight cylindrical positioning pin, and the positioning hole 40 may be a rectangular pin hole with a rounded corner, a semicircular pin hole, or other pin holes adapted to the positioning pin structure.
The utility model discloses a border position in every pressfitting region sets up the locating hole, and every layer of core board of every multilayer printed circuit board all is equipped with the through hole in the relative position department with the locating hole, and the setting element runs through a position hole and a through hole for pressfitting mould and multilayer printed circuit board are fixed each other when pressfitting, and then guarantee multilayer printed circuit board pressfitting quality; on the basis, the arrangement of the plurality of pressing areas on the pressing die enables the pressing efficiency to be increased in multiples, and the manufacturing cost of the multilayer printed circuit board is reduced in multiples.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "first", "second", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integral to one another; either directly or indirectly through intervening media, such as through internal communication or through an interaction between two elements. The specific meaning of the first-mentioned term in the present invention can be understood according to the specific situation by those skilled in the art. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
Finally, it should be noted that: the first embodiments are only used for illustrating the technical solution of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A compression mold, comprising: the positioning device comprises a first die, a second die and a positioning piece, wherein the first die is positioned above the second die, a plurality of pressing areas for accommodating a multilayer printed circuit board are arranged between the first die and the second die, and positioning holes are formed in the edge positions of the first die and the second die in each pressing area; and each layer of core board of each multilayer printed circuit board is provided with a through hole at the position opposite to the positioning hole, and the positioning piece penetrates through the positioning hole and the through hole and is used for positioning the multilayer printed circuit board in the press-fit area.
2. The compression mold as claimed in claim 1, wherein a gap exists between the multi-layer printed circuit boards in two adjacent compression regions, and the compression regions are arranged in an array on the compression mold.
3. A press-fit mould according to claim 2, wherein a plurality of first layout areas are distributed on the first mould, a plurality of second layout areas corresponding to the first layout areas are distributed on the second mould, and the press-fit area is formed between the first layout areas and the second layout areas when the first mould is positioned on the second mould.
4. A press-fit mould according to claim 2, characterised in that each of the press-fit areas is of the same size.
5. The press-fitting mold according to any one of claims 1 to 4, wherein the positioning hole of the first mold is a first positioning hole, the positioning hole of the second mold is a second positioning hole, and the positioning member sequentially penetrates through the first positioning hole, the through hole and the second positioning hole.
6. The press-fit mold according to any one of claims 1 to 4, wherein the number of the positioning holes in each press-fit region is plural, and the plural positioning holes are uniformly distributed at the edge position of the press-fit region.
7. The compression mold as claimed in claim 6, wherein the number of the positioning holes and the through holes in each compression region is 4.
8. A press according to any one of claims 1-4, wherein the first and second moulds are mirror stainless steel plates.
9. The compression mold of claim 8, wherein the first mold and the second mold are the same thickness.
10. A press-fitting mould according to any one of the claims 1-4, characterised in that the positioning element is a positioning pin and the positioning hole is a pin hole adapted to the structure of the positioning element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922279030.1U CN211429681U (en) | 2019-12-18 | 2019-12-18 | Press fitting die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922279030.1U CN211429681U (en) | 2019-12-18 | 2019-12-18 | Press fitting die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211429681U true CN211429681U (en) | 2020-09-04 |
Family
ID=72250488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922279030.1U Active CN211429681U (en) | 2019-12-18 | 2019-12-18 | Press fitting die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211429681U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113966081A (en) * | 2021-10-15 | 2022-01-21 | 西安微电子技术研究所 | Bonding die and bonding method for cold plate printed board |
-
2019
- 2019-12-18 CN CN201922279030.1U patent/CN211429681U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113966081A (en) * | 2021-10-15 | 2022-01-21 | 西安微电子技术研究所 | Bonding die and bonding method for cold plate printed board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3082385B1 (en) | Rigid-flexible circuit board having flying-tail structure and method for manufacturing same | |
| CN101309557A (en) | Presetting positioning fusion process for inner central layer of printed circuit board | |
| CN211429681U (en) | Press fitting die | |
| CN201957347U (en) | Die for laminating rigid and flexible combined multilayer printed circuit board | |
| CN111565523A (en) | Manufacturing method of second-order copper block-buried circuit board | |
| CN209897357U (en) | PCB pressfitting structure | |
| CN103796416A (en) | Circuit board combining flexible board with hard board and method for manufacturing same | |
| CN111885856A (en) | Fusion method and tool for improving interlayer alignment precision of multilayer circuit board | |
| CN104797095B (en) | A kind of rivet machine table top and the printed circuit board (PCB) lamination method using it | |
| CN210053671U (en) | Positioning structure of inner core plate | |
| CN113021921A (en) | Manufacturing method of inner shrinking rubber reinforced steel sheet | |
| CN214592110U (en) | Multilayer printed circuit board, mould and interlayer offset measuring mechanism | |
| CN111278240A (en) | Design product structure and method for manufacturing 5G circuit board | |
| CN211744852U (en) | Glue outlet circuit board | |
| CN210202165U (en) | PCB (printed circuit board) capable of preventing layer deviation based on fusion module | |
| CN110650597B (en) | Circuit board, manufacturing method thereof and electronic equipment | |
| CN210781602U (en) | Printed circuit board laminating die | |
| JP3736450B2 (en) | Circuit board manufacturing method | |
| JPH0546996B2 (en) | ||
| JPH05121875A (en) | Manufacture of multilayer printed wiring board | |
| CN207820299U (en) | A kind of high multilayer mixing second order HDI printed circuit board alignment systems | |
| CN219876240U (en) | Auxiliary edge structure of PCB | |
| CN219107792U (en) | High-density antibacterial LVS substrate with close fitting function | |
| CN213718283U (en) | Boss type metal-based sandwich rigid-flex board | |
| CN220493250U (en) | PCB multilayer stacks production with covering pressure equipment device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220622 Address after: 401332 Chongqing city Shapingba District No. 367 West Xi Yong Zhen Yong Lu Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee after: New founder holdings development Co., Ltd Address before: 401332 founder PCB Industrial Park, Xiyong micro electronics industrial park, Shapingba District, Chongqing Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. |