CN206674305U - Soft or hard combination printed circuit board (PCB) - Google Patents
Soft or hard combination printed circuit board (PCB) Download PDFInfo
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- CN206674305U CN206674305U CN201720198033.0U CN201720198033U CN206674305U CN 206674305 U CN206674305 U CN 206674305U CN 201720198033 U CN201720198033 U CN 201720198033U CN 206674305 U CN206674305 U CN 206674305U
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Abstract
The utility model discloses a kind of soft or hard combination printed circuit board (PCB), it includes compound core plate；The compound core plate includes hardboard core plate and soft board core plate, and the thickness of soft board core plate is less than the thickness of hardboard core plate；The hardboard core plate is provided with windowing, and the soft board core plate is embedded in the windowing of hardboard core plate and closed with hardboard core plate by gluing；The outer surface of the compound core plate is electroplate with the 3rd metal level so that the soft board core plate is electrically connected with hardboard core plate.The utility model saves the use of soft board material, reduces material cost；Soft board core plate is embedded in hardboard with small size, the dimensionally stable of integral slab, reduces the difficulty of processing of plate；Process difficulty of processing is reduced, so as to lift the quality of overall process；Hardboard core plate and soft board core plate are combined together by implantation technique, hardboard core plate and soft board core plate is turned into an entirety by electroplating technology, make Rigid Flex design can be according to the design of existing soft or hard combination, any change that it goes without doing.
Description
Technical field
It the utility model is related to circuit board making technical field, more particularly to a kind of soft or hard combination printed circuit board (PCB).
Background technology
Printed circuit board can be divided into three classes according to current using Material texture：Hardboard, soft board and Rigid Flex.It is existing
In the industry cycle layer where soft board is all using soft board material in made Rigid Flex, i.e., in the hardboard region of circuit board, instrument
Side and SET and SET join domains have soft board, and these regions do not need soft board, and Rigid Flex really needs soft board
Region is the bending region for connecting hardboard.Flood uses soft board, reduces the utilization rate of soft board material, and soft board material cost is
More than 3 times of stiff board material cost, it is not necessary to which soft board region adds the cost of Rigid Flex using soft board.
Soft board is mainly polyimides using material, and the easy hygroscopic deformation of polyimides, its deformation extent is much larger than hardboard,
Typically contain glass fibre in stiff board material, glass fibre is not allowed yielding, and its dimensional stability and pattern precision are higher than soft
Plate.Soft board material and stiff board material prepreg, which combine, makes Rigid Flex, or soft board material and it is pure it is cementing close make it is soft
Harden plywood, because polyimides and the property difference of prepreg and pure glue are big (matrix resin is different), in terms of reliability
It is unstable, by unleaded thermal shock or three times above reflow soldering above three times, easy plate bursting layering.Polyimides and half
The multilayer dielectric layer that the pressing of the material such as cured sheets or pure glue forms process such as desmear, heavy copper plating after drilling, drilling adds
Work is extremely difficult, because these processes are easily processed to monolayer insulating layer, when insulating barrier is two layers or more than two layers material,
Difficulty of processing is very big, hole wall depression easily occurs, bottom hole cull, electroplates the defects of empty.
Utility model content
The purpose of this utility model is to provide a kind of soft or hard combination printed circuit board (PCB), reduction soft and hard combined printed wiring board
Cost, improve the quality especially reliability of soft and hard combined printed wiring board, reduce manufacture difficulty, improving production efficiency.
To use following technical scheme up to this purpose, the utility model：
A kind of soft or hard combination printed circuit board (PCB), it includes compound core plate；
The compound core plate includes hardboard core plate and soft board core plate, and the thickness of soft board core plate is less than the thickness of hardboard core plate
Degree；The hardboard core plate is provided with windowing, and the soft board core plate is embedded in the windowing of hardboard core plate and passes through gluing with hardboard core plate
Close；
The outer surface of the compound core plate is electroplate with the 3rd metal level so that the soft board core plate electrically connects with hardboard core plate
Connect.
Optionally, the windowing shape of the hardboard core plate is identical with the soft board core plate shape, and window size is softer than described
The unilateral big 25um-200um of plate core plate.
Optionally, the hardboard core plate includes the first insulating barrier and the first metal positioned at the first insulating barrier upper and lower surface
Layer；The soft board core plate includes the second insulating barrier and the second metal layer positioned at the second insulating barrier upper and lower surface；
3rd metal level cover the first metal layer of the hardboard core plate, the soft board core plate second metal layer,
The surface for being used to bond the glue of hardboard core plate and soft board core plate；
Or the second metal layer of the soft board core plate is specially rolled copper foil, while the 3rd metal level covers institute
State the first metal layer of hardboard core plate, the soft board core plate second metal layer non-bending region, described be used to bond hardboard
The surface of the glue of core plate and soft board core plate.
Optionally, the surface of the soft board core plate is additionally provided with diaphragm, positioned at the outer layer of the 3rd metal level.
Optionally, if the one side of the compound core plate or two-sided also pressing have other core plates of dried layer.
Optionally, the hardboard core plate is one side hardboard or two-sided hardboard；The soft board core plate be one side soft board or
Double surface soft board.
Optionally, it is described to be used for that to bond hardboard core plate and the glue of soft board core plate to be specially epoxy glue or acrylate glue.
Optionally, the diaphragm is specially cover layer or soft soldering-resistance layer.
Optionally, hole is offered on the hardboard core plate and/or soft board core plate, the hole is through hole or blind hole.
Optionally, the 4th metal level is electroplate with the hole or has filled in conducting resinl.
The utility model uses the method that soft board core plate is embedded in the windowing of hardboard core plate that soft and hard combined printed wiring is made
Plate, have the advantages that：
1) use of soft board material is saved, reduces material cost；
2) soft board core plate is embedded in hardboard with small size, and soft board core plate change in size is small in manufacturing process, hardboard core plate
Change in size is also small, the dimensionally stable of integral slab, reduces the difficulty of processing of plate；
3) hardboard core plate need not handle multilayer dielectric layer in processes such as drilling, desmear, heavy copper plating, reduce process
Difficulty of processing, so as to lift the quality of overall process；
4) hardboard core plate and soft board core plate are combined together by implantation technique, make hardboard core plate and soft by electroplating technology
Plate core plate turns into an entirety, makes Rigid Flex design can be according to the design of existing soft or hard combination, any change that it goes without doing.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, before creative labor is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the preparation method flow chart for the soft or hard combination printed circuit board (PCB) that the utility model embodiment one provides；
Fig. 2 is the topology view after the hardboard core plate sawing sheet that the utility model embodiment one provides；
Fig. 3 is the topology view after the hardboard core plate windowing that the utility model embodiment one provides；
Fig. 4 is that the soft board core plate that the utility model embodiment one provides is coated with the topology view after thickening layer；
Fig. 5 is the topology view after the soft board core plate cutting that the utility model embodiment one provides；
Fig. 6 is the topology view that the soft board core plate that the utility model embodiment one provides is put into the windowing of hardboard core plate；
Fig. 7 is the knot for the compound core plate after dispensing, solidification drying, visual examination that the utility model embodiment one provides
Structure view；
Fig. 8 is that the compound core plate that the utility model embodiment one provides removes the topology view after thickening layer；
Fig. 9 is the topology view of the compound core plate of the offer of the utility model embodiment one after piercing；
Figure 10 is the topology view of the compound core plate of the offer of the utility model embodiment one after plating；
Figure 11 is topology view of the compound core plate of the offer of the utility model embodiment one after graphic making；
Figure 12 is structure of the compound core plate of the offer of the utility model embodiment one after soft board bends region pasting protective film
View；
Figure 13 is that the compound core plate that the utility model embodiment one provides regards with the structure after insulating barrier and metal level lamination
Figure；
Figure 14 be the compound core plate that the utility model embodiment one provides pressed by insulating barrier and metal level to be formed it is more
The topology view of laminate；
Figure 15 is the topology view of the multi-layer sheet of the offer of the utility model embodiment one after piercing；
Figure 16 is the topology view of the multi-layer sheet of the offer of the utility model embodiment one after plating；
Figure 17 is topology view of the multi-layer sheet of the offer of the utility model embodiment one after the first graphic making；
Figure 18 is topology view of the multi-layer sheet of the offer of the utility model embodiment one after second of graphic making；
Figure 19 is the preparation method flow chart for the soft or hard combination printed circuit board (PCB) that the utility model embodiment two provides；
Illustrate：
Hardboard core plate 1, the first insulating barrier 11, the first metal layer 12, windowing 13, soft board core plate 2, the second insulating barrier 21, the
Two metal levels 22, thickening layer 23, glue 3, hole 4, the 3rd metal level 5, diaphragm 6, the 4th insulating barrier 7, the 4th metal level 8.
Embodiment
, below will knot to enable purpose of utility model of the present utility model, feature, advantage more obvious and understandable
The accompanying drawing in the utility model embodiment is closed, the technical scheme in the embodiment of the utility model is clearly and completely described,
Obviously, the embodiments described below are only the utility model part of the embodiment, and not all embodiment.Based on this reality
With the embodiment in new, those of ordinary skill in the art are obtained all other under the premise of creative work is not made
Embodiment, belong to the scope of the utility model protection.
Core concept of the present utility model is：Different using the mode of soft board from traditional flood, the utility model uses
Rigid Flex, and the Rigid Flex is formed by being embedded to its thickness in hardboard uplifting window position less than the soft board of hardboard,
Reduce the use of soft board material.
Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by embodiment.
Embodiment one
A kind of soft or hard combination printed circuit board (PCB) is provided in the present embodiment, it includes compound core plate, with reference to Fig. 2 to Figure 15 institutes
Show, the compound core plate is made up of hardboard core plate 1 and soft board core plate 2.
Wherein, the thickness of soft board core plate 2 is less than the thickness of hardboard core plate 1, and hardboard core plate 1 is provided with windowing, soft board core plate 2
In the windowing of embedded hardboard core plate 1, and the edge side of soft board core plate 2 and the windowing side of hardboard core plate 1 by glue 3 bind with
It is integrally formed soft board core plate 2 and hardboard core plate 1；
The outer surface of compound core plate is electroplate with the 3rd metal level 5, the 3rd metal level 5 covering hardboard core plate 1, soft board core plate
2 and the outer surface of glue 3, realize electrically connecting for the first metal layer 12 of hardboard core plate 1 and the second metal layer 22 of soft board core plate 2
Connect, so that hardboard core plate 1 and soft board core plate 2 are formed as an entirety, can be considered a core plate；
Hole 4 can be provided with hardboard core plate 1 and soft board core plate 2, metal level is electroplate with hole 4, to realize levels core plate
It is electrically connected with；
Compound core plate can also carry out one step press by the 4th insulating barrier 7 and the 4th metal level 8, form multi-layer sheet, may be used also
High multi-layer sheet is formed to carry out repeatedly pressing again on the basis of multi-layer sheet, is connected between layers by hole 4.
The concrete structure of each composition is described more fully below：
(1) above-mentioned soft board core plate 2, can be one side soft board or double surface soft board, the second of soft board core plate 2 insulate
Layer 21 is usually polyimides, polyester either liquid crystal high polymer material, and second metal layer 22 is usually copper on soft board core plate 2
Layer.Hardboard core plate 1 can be one side hardboard or two-sided hardboard, and the first insulating barrier 11 of hardboard core plate 1 is usually to contain
Epoxide resin material, Teflon or the liquid crystal high polymer material of glass fabric, the first metal layer 12 of hardboard core plate 1 are general
It is layers of copper.The thickness of the soft board core plate 2 is less than the thickness of hardboard core plate 1, and both difference in thickness are not more than 100um；Hardboard core
The windowing shape of plate 1 is identical with the shape for the soft board core plate 2 to be embedded in, and the windowing size of hardboard core plate 1 is than soft board core plate 2
The unilateral big at least 25um of window size, but no more than 200um, if the big inconvenient soft board core plate 2 such as size is embedded in, if firmly
Plate window size is excessive, and gap is too big after soft board core plate 2 is embedded in, and influences the adhesion of soft board and hardboard.It is above-mentioned to cohere soft board core
The glue 3 of plate 2 and hardboard core plate 1, can be the glue that epoxy glue, acrylate glue etc. has insulating property (properties), and this glue 3 can be with by heating
Solidification, solid states are formed after solidification；There is diaphragm 6 on the soft board core plate 2, diaphragm 6 can be that cover layer is either soft
Property welding resistance, the cover layer can have glue cover layer or without glue cover layer.
(2) the 3rd metal level 5 of the outer surface of compound core plate, the layer of metal layer formed generally by plating, typically
Specially layers of copper, the metal level is through hardboard core plate 1, soft board core plate 2 and the glue 3 of connection hardboard core plate 1 and soft board core plate 2
Surface.
(3) hole 4 opened up on soft board core plate 2 and hardboard core plate 1, can be through hole or blind hole, can be with hole 4
Metal level in plating, the materials such as conducting resinl can also be filled in by way of consent, form conductive metal layer；Conducting resinl can be
The electric conductivity gelatin substance such as conductive copper glue, conductive silver glue；There can be hole on soft board core plate 2 and hardboard core plate 1, can also not have
Hole.
(4) in the operation that compound core plate is pressed by the 4th insulating barrier 7 and the 4th metal level 8, the described 4th is exhausted
Edge layer 7, can be the material of the insulating properties semi-cured states such as prepreg, pure glue, and the 4th metal level 8 is usually copper foil；
The pressing is the process of a heating pressurization, and the material such as prepreg, pure glue can change from semi-cured state in this process
For solid state；4th metal level 8 can also be other one side core plate or two-sided core plate, contain metal on core plate
Layer, multi-layer sheet is formed by pressing；The repeatedly pressing, that is, complete one step press and then carry out second to press, third time
Pressing, form the high multi-layer sheet of needs.
(5) for multi-layer sheet, electrically connected between layers by hole 4, this can be through hole or blind hole；In hole
It can electroplate to form metal level, conducting resinl can also be filled in and form metal level, so as to realize electric connection between layers.
As shown in figure 1, the preparation method of above-mentioned soft or hard combination printed circuit board (PCB) is：
Step S101, the sawing sheet of hardboard core plate 1
The sawing sheet method of the hardboard core plate 1, required hardboard size is processed into generally by the method for cutting, such as
Shown in Fig. 2, the cutting method can be machine cuts, laser cutting, mould punching, graduating with cutter mode.
Step S102, hardboard core plate 1 is opened a window, and soft board core plate 2 is cut
The hardboard core plate 1 opens a window, as shown in figure 3, can be mechanical-moulded mode, laser cutting mode, mould punching
Mode or graduating with cutter mode.
Step S103, in the lower surface of soft board core plate 2 patch or coating thickening layer 23, cutting
The thickening layer 23, can be adhesive or ink；The thickness of thickening layer 23 be hardboard core plate 1 with
The half of the thickness difference of soft board core plate 2, soft board core plate 2 lower surface patch or apply thickening layer 23 after as shown in Figure 4.
Soft board core plate 2 is cut, and can be mechanical-moulded mode, laser cutting mode, mould punching mode or graduating with cutter side
Formula, after cutting as shown in Figure 5.
Step S104, soft board core plate 2 is transplanted in the windowing 13 of hardboard core plate 1
The transplanting of the soft board core plate 2, generally comprise four steps：Contraposition → dispensing → solidification drying → visual examination；
The contraposition, as shown in fig. 6, being that soft board core plate 2 is put into the windowing 13 of hardboard core plate 1, position is directed at, can be put manually
Put, can also be placed by plant equipment, can also be placed by the plant equipment with CCD, lift aligning accuracy；The point
Glue, continuously clicked and entered by automatic dispensing machine in the gap that soft board core plate 2 and hardboard core plate 1 open a window；The solidification can lead to
The mode of oven cooking cycle is crossed, can also be by way of Reflow Soldering, the hardness at least 6H of cured glue 3, soft board core plate 2 and hardboard
The adhesion of core plate 1 is in more than 5kg/cm2；The visual examination, it is main to confirm soft board core plate 2 and the whether smooth nothing of hardboard core plate 1
Dislocation, bubble-free in glue 3 in gap, stick up etc. without glue stain, without deformed plate it is bad；After dispensing, solidification drying, visual examination operation
Compound core plate it is as shown in Figure 7.
Step S105, thickening layer 23 is removed
The removal thickening layer 23, adhesive is manually taken off, and ink is removed by modes such as developments, is removed
It is as shown in Figure 8 afterwards.
Step S106, drill
As shown in figure 9, the drilling can be formed by way of machine drilling, laser drill or punching, aperture is big
It is small between 0.025mm-6.5mm.
Step S107, electroplate
The plating, as shown in Figure 10, it can be electroplated by level, or vertical plating mode realizes that plating is mainly
In the hole 4 and the metal level 5 of electroplating surface last layer the 3rd.
Step S108, graphic making
The graphic making, as shown in figure 11, that is, unwanted part on the 3rd metal level 5 is removed, leave the portion of needs
Point；The graphic making mainly includes six steps：Plate face pre-treatment → pad pasting → exposure → development → etching → striping, it is described
Plate face pre-treatment is to say that metal level is roughened, and is prepared for follow-up pad pasting, the pad pasting be sticked on the surface of the 3rd metal level 5 or
Person is coated with last layer photosensitive etch resistant layer, is typically chosen patch dry film, the exposure, is that photosensitive, sense is carried out to photosensitive etch resistant layer
Chemical change occurs for light part, and the development is by photosensitive part or not photosensitive part resistant layer removes, and is exposed following
Metal level, the etching, be that the metal level that will expose is removed by way of chemical reaction, resistant layer protection metal level by
It in the stop for having resistant layer, will not chemically react, i.e., will not be removed, the striping, be by unreacted metal
Resistant layer on layer is got rid of.
Step S109, the bending region pasting protective film 6 of soft board core plate 2
As shown in figure 12, region pasting protective film 6 is bent in the soft board, can be pressed by press, the fast ram compression of fast press
Conjunction, vacuum pressing-combining, roller pad pasting mode or soft board bend region coating or printing layer protecting film 6.
Step S110, lamination
The lamination, it is that the plate that will be pressed is folded in advance, i.e., before pressing, first by graphic making as shown in figure 13
Compound core plate, the 4th insulating barrier 7 and the 4th metal level 8 finished is put well according to the order of regulation.
Step S111, press
As shown in figure 14, the compound core plate stacked in advance, the 4th insulating barrier 7 and the one step press of the 4th metal level 8 are turned into
Multi-layer sheet.The pressing, is pressed generally by press, and press can be electric press or hydraulic press, press
Journey is the process of a heating pressurization, and semi-solid preparation insulating materials is completed to turn from semi-cured state to solid state in the process
Become.
Step S112, drill
Drilled on multiple-plate outer layer core plate, as shown in figure 15, machine drilling, laser drill or punching can be passed through
Mode formed, pore size is between 0.025mm-6.5mm.
Step S113, electroplate
In the metal level 5 of electroplating surface the 3rd of multiple-plate outer layer core plate, as shown in figure 16, plating can pass through horizontal electricity
Plating or vertical plating mode realize that plating is mainly in hole and electroplating surface last layer metal level.
Step S114, graphic making
Carry out graphic making on multiple-plate outer layer core plate, as shown in Figure 17 and Figure 18, the method for graphic making with it is upper
The graphic making process stated in step S108 is the same, repeats no more.
Step S115, other work flows
Other above-mentioned work flows, including the process such as surface treatment, mechanical-moulded, electrical measurement, with traditional Rigid Flex phase
Together, no longer describe herein.
Embodiment two
Another soft or hard combination printed circuit board (PCB) is provided in the present embodiment, is mainly used in the product that high bending requires, it is curved
Number is rolled over more than 100,000 times, and copper foil used in the bending region of soft board core plate 2 is rolled copper foil, the bending region of this type plate
Do not electroplate.
The soft or hard combination printed circuit board (PCB) of the present embodiment includes compound core plate, and the compound core plate is by hardboard core plate 1 and soft
Plate core plate 2 forms.Soft board core plate 2 is included positioned at the bending region at middle part, and is used to cohere with hardboard core plate 1 positioned at both ends
Fixed non-bending region.
Wherein, the thickness of soft board core plate 2 is less than the thickness of hardboard core plate 1, and both difference in thickness are not more than 100um；Hardboard
Core plate 1 is provided with windowing 13, and soft board core plate 2 is embedded in the windowing 13 of hardboard core plate 1, and the edge side of soft board core plate 2 and hard
The windowing side of plate core plate 1 is binded by glue 3 so that soft board core plate 2 and hardboard core plate 1 are integrally formed；
The outer surface of compound core plate is electroplate with the 3rd metal level 5, the non-bending of the 3rd metal level 5 covering soft board core plate 2
The outer surface in region, hardboard core plate 1 and glue 3, realize the second metal layer 22 of soft board core plate 2 and the first gold medal of hardboard core plate 1
Belong to the electric connection of layer 12, so that soft board core plate 2 and hardboard core plate 1 are formed as an entirety, can be considered a core plate；It is soft
The second metal layer 22 of plate core plate 2 uses rolled copper foil, and it bends region without plating；
Hole 4 can be provided with soft board core plate 2 and hardboard core plate 1, metal level is electroplate with hole 4, to realize levels core plate
It is electrically connected with；
Compound core plate can also carry out one step press by the 4th insulating barrier 7 and the 4th metal level 8, form multi-layer sheet, may be used also
High multi-layer sheet is formed to carry out repeatedly pressing again on the basis of multi-layer sheet, is connected between layers by hole.
The concrete structure of each composition is described more fully below：
(1) above-mentioned soft board core plate 2, can be one side soft board or double surface soft board, the second of soft board core plate 2 insulate
Layer 21 is usually polyimides, polyester either liquid crystal high polymer material, the second metal layer 22 of soft board core plate 2 generally by
The copper foil that calendering technology is formed, the copper foil can realize the bending of at least 100,000 times.Hardboard core plate 1 can be one side hardboard,
Can be two-sided hardboard, the first insulating barrier 11 of hardboard core plate 1 is usually the epoxide resin material containing glass fabric, Teflon
Dragon or liquid crystal high polymer material, the first metal layer 12 of hardboard core plate 1 is usually layers of copper.The soft board core plate 2 is than hardboard core
Plate 1 is thin, and both difference in thickness are not more than 100um；The windowing shape of hardboard core plate 1 and the shape for the soft board core plate 2 to be embedded in are complete
It is exactly the same, the windowing of hardboard core plate 1 size big at least 25um more unilateral than soft board core plate 2, but no more than 200um, if size etc.
Big inconvenient soft board core plate 2 is embedded in, if hardboard window size is excessive, gap is too big after soft board core plate 2 is embedded in, influence soft board with
The adhesion of hardboard.The above-mentioned glue 3 for cohering soft board core plate 2 and hardboard core plate 1, can be that epoxy glue, acrylate glue etc. has absolutely
The glue of edge property, above-mentioned glue 3 can be solidified by heating, and solid states are formed after solidification.There is diaphragm 6 on soft board core plate 2, protect
Cuticula 6 can be cover layer either soft welding resistance, and the cover layer can be had glue cover layer or covered without glue
Film.
(2) the 3rd metal level 5 on compound core plate surface, the layer of metal layer formed generally by plating, passes through the gold
Category layer makes soft board core plate 2 and hardboard core plate 1 realize electrical connection；It should be noted that the metal level need to avoid the curved of soft board core plate 2
The bending region in folding area domain, i.e. soft board core plate not electroplated；Above-mentioned 3rd metal level 5 is usually the layers of copper electroplated.
(3) above-mentioned hole 4, it can be through hole or blind hole, can electroplate metal level in hole 4, plug can also be passed through
The mode in hole fills in the materials such as conducting resinl, forms conductive metal layer, conducting resinl can be the electric conductivity such as conductive copper glue, conductive silver glue
Gelatin substance；There can be hole on soft board core plate 2 and hardboard core plate 1, can also there is no hole；
(4) in compound core plate by the 4th insulating barrier 7 and the stitching operation of the 4th metal level 8, the 4th insulating barrier 7 can be
The material of the insulating properties semi-cured states such as prepreg, pure glue, the 4th metal level 8 are usually copper foil；Above-mentioned pressing is one and added
Heat pressurization process, in this process the material such as prepreg, pure glue can be changed into solid state from semi-cured state；Above-mentioned
Four metal levels 8 can also be other one side core plate or two-sided core plate, contain metal level on core plate, and multilayer is formed by pressing
Plate；Above-mentioned repeatedly pressing, that is, after completing one step press, pressed carrying out second, third time presses, and the height for forming needs is more
Laminate.
(5) for multi-layer sheet, electrically connected between layers by hole 4, this can be through hole or blind hole；In hole 4
It can electroplate to form metal level, conducting resinl can also be filled in and form metal level, so as to realize electric connection between layers.
As shown in figure 19, the preparation method of above-mentioned soft or hard combination printed circuit board (PCB) is：
Step S201, the sawing sheet of hardboard core plate 1
The sawing sheet method of the hardboard core plate 1, required hardboard size, institute are processed into generally by the method for cutting
It can be machine cuts, laser cutting, mould punching, graduating with cutter mode to state cutting method.
Step S202, hardboard core plate 1 is opened a window, and soft board core plate 2 is cut
The hardboard core plate 1 opens a window, and can be mechanical-moulded mode, laser cutting mode, mould punching mode or knife
Quarter mode；
Step S203, soft board core plate 2 pastes or is coated with thickening layer 23, cutting
Thickening layer 23, can be adhesive or ink；The thickness of thickening layer 23 is hardboard core plate 1 and soft board
The half of the thickness difference of core plate 2；Soft board core plate 2 is cut, and can be mechanical-moulded mode, laser cutting mode, mould punching side
Formula or graduating with cutter mode.
Step S204, soft board core plate 2 is transplanted in hardboard windowing
The transplanting of the soft board core plate 2, generally comprise four steps：Contraposition → dispensing → solidification drying → visual examination；
The contraposition, it is that soft board core plate 2 is put into the windowing 13 of hardboard core plate 1, is directed at position, can manually place, can also lead to
Plant equipment placement is crossed, can also be placed by the plant equipment with CCD, lift aligning accuracy；The dispensing, it is by certainly
Dynamic point gum machine is continuously clicked and entered in the gap between soft board core plate 2 and hardboard core plate 1；The solidification can pass through oven cooking cycle
Mode, can also be by way of Reflow Soldering, and the hardness at least 6H of cured glue, soft board core plate 2 and the adhesion of hardboard core plate 1 exist
More than 5kg/cm2；The visual examination, main to confirm soft board core plate 2 and the whether smooth dislocation-free of hardboard core plate 1, glue 3 in gap
Interior bubble-free, stick up etc. without glue stain, without deformed plate it is bad.
Step S205, thickening layer 23 is removed
The removal thickening layer 23, adhesive is manually taken off, and ink is removed by modes such as developments.
Step S206, drill
The drilling can be formed by way of machine drilling, laser drill or punching, and pore size exists
Between 0.025mm-6.5mm.
Step S207, the bending region patch or coating plating resist layer 9 of soft board core plate 2
The patch plating resist layer 9, can be pressed by press, fast press quick pressing, vacuum pressing-combining, the side of roller pad pasting
Formula or the bending region coating or printing layer protecting film in soft board core plate 2；The plating resist layer 9, can be peelable
From glue or dry film, or resist ink.
Step S208, electroplate
The plating, it can be electroplated by horizontal, or vertical plating mode is realized, plating is mainly in hole and surface
Electroplate the metal level 5 of last layer the 3rd.
Step S209, plating resist layer 9 is removed
The striping, plating resist layer is removed by manual mode, or chemical reaction mode.
Step S210, graphic making
Graphic making described above, that is, unwanted part on metal level is removed, leave the part of needs；The figure system
Work mainly includes six steps：Plate face pre-treatment → pad pasting → exposure → development → etching → striping, the plate face pre-treatment are
Metal level is roughened, prepared for follow-up pad pasting, the pad pasting is to stick or be coated with last layer on the surface of the 3rd metal level 5
Photosensitive etch resistant layer, patch dry film is typically chosen, the exposure, is that photosensitive, photographic department distribution biochemistry is carried out to photosensitive etch resistant layer
Change is learned, the development is by photosensitive part or not photosensitive part resistant layer removes, and exposes following metal level, the erosion
Carve, be that the metal level that will expose is removed by way of chemical reaction, the metal level of resistant layer protection is due to there is resistant layer
Stop, will not chemically react, i.e., will not be removed, the striping, being will be anti-etching on unreacted metal level
Layer is got rid of.
Step S211, in the bending region pasting protective film 6 of soft board core plate 2
The bending region pasting protective film 6, it can be pressed by press, fast press quick pressing, vacuum pressing-combining, roller patch
The mode of film or the bending region coating or printing layer protecting film 6 in soft board core plate 2.
Step S212, lamination
The lamination, be that the plate that will be pressed is folded in advance, i.e., before pressing, the composite core that first finishes graphic making
Plate, the 4th insulating barrier 7 and the 4th metal level 8 are put well according to the order of regulation.
Step S213, press
The compound core plate stacked in advance, the 4th insulating barrier 7 and the one step press of the 4th metal level 8 are turned into multi-layer sheet.The pressure
Close, pressed generally by press, press can be electric press or hydraulic press, and bonding processes are a heating
The process of pressurization, the 4th insulating barrier 7 complete the transformation from semi-cured state to solid state in the process.
Step S214, drill
Drill, can be formed by way of machine drilling, laser drill or punching on multiple-plate outer layer core plate,
Pore size is between 0.025mm-6.5mm.
Step S215, electroplate
In the metal level 5 of electroplating surface the 3rd of multiple-plate outer layer core plate, plating can pass through level plating or vertical
Plating mode realizes that plating is mainly in hole and electroplating surface last layer metal level.
Step S216, graphic making
Graphic making, method and the figure in above-mentioned steps S210 of graphic making are carried out on multiple-plate outer layer core plate
Manufacturing process is the same, repeats no more.
Step S217, other work flows
Other above-mentioned work flows, including surface treatment, mechanical-moulded, the process such as electrical measurement, with traditional Rigid Flex phase
Together, no longer describe herein.
Embodiment three
In embodiment one and embodiment two, when making multi-layer sheet, using compound core plate as core material, outer layer core plate
Using common hardboard.
And in actual applications, in multi-layer sheet manufacturing process, compound core plate can also be used as outer layer core plate, in compound core plate
One side pressing multi-layer coreboard, now soft board core plate 2 is in multiple-plate side.
In other embodiments, the high multi-layer sheet for including MULTILAYER COMPOSITE core plate can also be produced.
Described above, above example is only to illustrate the technical solution of the utility model, rather than its limitations；Although ginseng
The utility model is described in detail according to previous embodiment, it will be understood by those within the art that：It is still
Technical scheme described in foregoing embodiments can be modified, or which part technical characteristic is equally replaced
Change；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the utility model technical scheme
Spirit and scope.
Claims (10)
1. a kind of soft or hard combination printed circuit board (PCB), it is characterised in that it includes compound core plate；
The compound core plate includes hardboard core plate and soft board core plate, and the thickness of soft board core plate is less than the thickness of hardboard core plate；Institute
State hardboard core plate and be provided with windowing, the soft board core plate is embedded in the windowing of hardboard core plate and closed with hardboard core plate by gluing；
The outer surface of the compound core plate is electroplate with the 3rd metal level so that the soft board core plate is electrically connected with hardboard core plate.
2. soft or hard combination printed circuit board (PCB) according to claim 1, it is characterised in that the windowing shape of the hardboard core plate
Identical with the soft board core plate shape, window size is more unilateral big 25um-200um than the soft board core plate.
3. soft or hard combination printed circuit board (PCB) according to claim 1, it is characterised in that it is exhausted that the hardboard core plate includes first
Edge layer and the first metal layer positioned at the first insulating barrier upper and lower surface；The soft board core plate includes the second insulating barrier and positioned at second
The second metal layer of insulating barrier upper and lower surface；
3rd metal level covers the second metal layer, described of the first metal layer of the hardboard core plate, the soft board core plate
For the surface for the glue for bonding hardboard core plate and soft board core plate；
Or the second metal layer of the soft board core plate is specially rolled copper foil, while the 3rd metal level covering is described hard
The first metal layer of plate core plate, the soft board core plate second metal layer non-bending region, it is described be used for bond hardboard core plate
With the surface of the glue of soft board core plate.
4. soft or hard combination printed circuit board (PCB) according to claim 3, it is characterised in that the surface of the soft board core plate is also set
There is diaphragm, positioned at the outer layer of the 3rd metal level.
5. soft or hard combination printed circuit board (PCB) according to claim 1, it is characterised in that the one side of the compound core plate or
If two-sided also pressing has other core plates of dried layer.
6. soft or hard combination printed circuit board (PCB) according to claim 1, it is characterised in that the hardboard core plate is one side hardboard
Or two-sided hardboard；The soft board core plate is one side soft board or double surface soft board.
7. soft or hard combination printed circuit board (PCB) according to claim 1, it is characterised in that it is described be used for bond hardboard core plate and
The glue of soft board core plate is specially epoxy glue or acrylate glue.
8. soft or hard combination printed circuit board (PCB) according to claim 4, it is characterised in that the diaphragm is specially cover layer
Or soft soldering-resistance layer.
9. soft or hard combination printed circuit board (PCB) according to claim 1, it is characterised in that the hardboard core plate and/or soft board
Hole is offered on core plate, the hole is through hole or blind hole.
10. soft or hard combination printed circuit board (PCB) according to claim 9, it is characterised in that the 4th gold medal is electroplate with the hole
Category layer has filled in conducting resinl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720198033.0U CN206674305U (en) | 2017-03-02 | 2017-03-02 | Soft or hard combination printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720198033.0U CN206674305U (en) | 2017-03-02 | 2017-03-02 | Soft or hard combination printed circuit board (PCB) |
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| Publication Number | Publication Date |
|---|---|
| CN206674305U true CN206674305U (en) | 2017-11-24 |
Family
ID=60378516
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020124956A1 (en) * | 2018-12-17 | 2020-06-25 | 盐城维信电子有限公司 | Via hole entire-board copper electroplating method for flexible circuit board |
| CN112437545A (en) * | 2019-08-24 | 2021-03-02 | 王定锋 | Novel double-layer wire guide plate and manufacturing method thereof |
-
2017
- 2017-03-02 CN CN201720198033.0U patent/CN206674305U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020124956A1 (en) * | 2018-12-17 | 2020-06-25 | 盐城维信电子有限公司 | Via hole entire-board copper electroplating method for flexible circuit board |
| CN112437545A (en) * | 2019-08-24 | 2021-03-02 | 王定锋 | Novel double-layer wire guide plate and manufacturing method thereof |
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