CN207911147U - A kind of pcb board - Google Patents
A kind of pcb board Download PDFInfo
- Publication number
- CN207911147U CN207911147U CN201820225889.7U CN201820225889U CN207911147U CN 207911147 U CN207911147 U CN 207911147U CN 201820225889 U CN201820225889 U CN 201820225889U CN 207911147 U CN207911147 U CN 207911147U
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- copper
- hole
- pcb
- daughter boards
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Abstract
The utility model provides a kind of pcb board, for alternating-current charging pile, the pcb board includes the upper layer PCB daughter boards, core material and lower layer's PCB daughter boards for stacking pressing successively, being made by first time plating on the core material has inner line figure, the upper layer PCB daughter boards and lower layer's PCB daughter boards to have outer-layer circuit figure by being electroplated to make for the second time；It is further opened at least two on the pcb board through the pcb board and avoids the drawing copper hole of the inner line figure；Described one end for drawing copper hole hole copper is connect with the face copper of outer-layer circuit figure, the outer-layer circuit figure for drawing the other end of copper of copper hole hole copper the to avoid other side setting；The graph area of the outer-layer circuit figure is also covered with tin layers against corrosion.Pcb board provided by the utility model can avoid the copper face of outer-layer circuit figure from warping and wait integrity problems, ensure that the Assembly stability with alternating-current charging pile.
Description
Technical field
The utility model is related to PCB technical fields more particularly to a kind of pcb boards.
Background technology
With flourishing for charging pile industry, the development of domestic charging pile PCB has also been driven.With common PCB phases
Than charging pile is larger with the electric current that PCB is carried, and voltage is higher, and charging pile need to be high pressure resistant with PCB, and thickness of insulating layer is also big
A bit.Therefore, charging pile wants wider with the conducting wire of PCB, and is mostly thick copper coin, it is thicker than common PCB very much, if it is
Thin plate, it is easy to which fever is blown, and thick copper coin could carry electronic components not only more but also heavy after encapsulating, and avoids PCB deformation damages
Wound.
But since charging pile is thicker with the copper thickness and plate thickness of PCB, in the case where temperature is increased sharply, the charging pile poles PCB
It is also easy to produce copper face a series of integrity problems such as to warp, causes surface irregularity, influence performance and the assembly of line pattern layer.
Utility model content
The purpose of this utility model is to provide a kind of pcb board that reliability is high, can be good at solving charging pile PCB
Plate copper face such as warps at a series of integrity problems.
The technical solution that the utility model is proposed with regard to above-mentioned technical problem is as follows：A kind of pcb board is provided, is filled for exchanging
Electric stake, the pcb board include the upper layer PCB daughter boards, core material and lower layer's PCB daughter boards for stacking pressing successively, the internal layer
Being made by first time plating on core plate has inner line figure, the upper layer PCB daughter boards and lower layer's PCB daughter boards by second
Plating, which makes, outer-layer circuit figure；
It is further opened at least two on the pcb board through the pcb board and avoids the drawing copper of the inner line figure
Hole；Described one end for drawing copper hole hole copper is connect with the face copper of outer-layer circuit figure, the other end of copper for drawing copper hole hole copper
Avoid the outer-layer circuit figure setting of other side；
The graph area of the outer-layer circuit figure is also covered with tin layers against corrosion.
In the above-mentioned pcb board of the utility model, the drawing copper hole includes at least first and copper hole and second is drawn to draw copper hole, described
One end of first drawing copper hole hole copper is connect with the face copper of the outer-layer circuit figure of the upper layer PCB daughter boards, and described first draws copper hole
The other end of hole copper avoids the outer-layer circuit figure of the lower layer PCB daughter boards；
One end of the second drawing copper hole hole copper is connect with the face copper of the outer-layer circuit figure of the lower layer PCB daughter boards, institute
The other end for stating the second drawing copper hole hole copper avoids the outer-layer circuit figure of the upper layer PCB daughter boards.
In the above-mentioned pcb board of the utility model, the drawing copper hole further includes that third draws copper hole, the third to draw copper hole hole copper
One end connect with the face copper of the upper layer PCB daughter boards or the outer-layer circuit figure of lower layer's PCB daughter boards, the third draws copper hole hole
The other end of copper connects the face copper of independent pad.
In the above-mentioned pcb board of the utility model, the outer-layer circuit figure of the upper layer PCB daughter boards and lower layer's PCB daughter boards
Face copper thickness is 4OZ；The face copper thickness of the inner line figure of the core material is 2OZ.
In the above-mentioned pcb board of the utility model, the upper layer PCB daughter boards include the first outer copper foil and are pressed together on described
The first prepreg between first outer copper foil and core material；
The lower layer PCB daughter boards include the second outer copper foil and be pressed together on second outer copper foil and core material it
Between the second prepreg.
In the above-mentioned pcb board of the utility model, the sawing sheet size of the core material is 576mm x470mm.
In the above-mentioned pcb board of the utility model, first outer copper foil, the second outer copper foil, the first prepreg,
The corresponding position of two prepregs and the core material offers target position hole, is used for lamination contraposition.
In the above-mentioned pcb board of the utility model, first prepreg and the second prepreg be 1080 models or
The prepreg of 2116 models.
Pcb board provided by the utility model has the following technical effect that：It is provided on the outer-layer circuit figure of the PCB
At least two drawing copper hole can hold the face copper of outer-layer circuit figure, avoid warping, keep product surface smoothness and
Solderability.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is the sectional view for the pcb board that the utility model embodiment provides；
Fig. 2 is the production method flow diagram for the pcb board that the utility model embodiment provides.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only explaining this
Utility model is not used to limit the utility model.
As shown in Figure 1, it includes stacking pressing successively that the utility model embodiment, which is provided for the pcb board of alternating-current charging pile,
Upper layer PCB daughter boards 11, prepreg 13, core material 10, prepreg 13 and lower layer's PCB daughter boards 12, on core material 10
Being made by first time plating has inner line figure, passes through second of electricity on upper layer PCB daughter boards 11 and lower layer's PCB daughter boards 12
Plating, which makes, outer-layer circuit figure；
It is further opened at least two on the outer-layer circuit figure through the PCB and avoids the inner line figure
Draw copper hole；Described drawing copper hole one end Kong Tong is connect with the face copper of outer-layer circuit figure, and the other end for drawing copper hole hole copper is kept away
Open the outer-layer circuit figure of other side；
The graph area of the outer-layer circuit figure is covered with tin layers against corrosion.
Further, first one end of 31 hole copper of copper hole is drawn to connect with the face copper 41 of the outer-layer circuit figure of upper layer PCB daughter boards
Conducting is connect, the other end of 31 hole copper of the first drawing copper hole avoids the outer-layer circuit figure of lower layer's PCB daughter boards；Meanwhile first draws copper
Hole 31 must avoid the inner line figure of PCB, prevent from leading to unnecessary interlayer conduction while adding drawing copper hole；
Second draws the setting in copper hole 32 and first to draw copper hole 31 exactly the opposite, i.e., second draws one end of 32 hole copper of copper hole under
The copper 42 of the outer-layer circuit figure of layer PCB daughter boards connects, and the other end of 32 hole copper of the second drawing copper hole avoids upper layer PCB daughter boards
Outer-layer circuit figure so, it is possible to hold the face copper of upper layer PCB daughter boards and lower layer PCB daughter board outer-layer circuit figures, avoid
It warps.
In some embodiments of the utility model, the big copper face region of one end and outer-layer circuit figure of copper hole hole copper is drawn
Copper connection, draw copper hole hole copper other end fall in the non-conduction area of other side outer-layer circuit figure, big copper face region is
A kind of common layout-designs of PCB, the non-graphic area of outer-layer circuit figure are the non-conduction area of outer-layer circuit or without copper area.
In some embodiments of the utility model, it is additionally provided with third and copper hole 33, third is drawn to draw the one of 33 hole copper of copper hole
End connect conducting with the copper of outer-layer circuit figure, and third draws the other end of 33 hole copper of copper hole to connect the face that independent pad 43 is connected
The face copper of copper, independent pad does not connect conducting with the face copper of outer-layer circuit figure, and the utility model equally may be implemented and draw copper hole
To the pulling fixed function of one side copper.
Further, in conjunction with shown in Fig. 2, the production method of the pcb board provided in this embodiment includes the following steps：
Step S10：One core material 10 is provided, first time plating is carried out to the core material 10, and make internal layer
Line pattern；
In the present embodiment, step S10 is specifically included：
S11, the PCB core plate manufactured as base material using FR-4 epoxy resin is provided, and to the PCB core plates according to pre-
The fixed drying-plate time and drying-plate temperature is toasted；Wherein, the drying-plate time is 4h, and drying-plate temperature is 150 DEG C, described in exclusion
Steam in PCB core plate, further makes resin solidification, eliminates the Stress of plate interior of the PCB core plate；
S12, sawing sheet is carried out according to sawing sheet size design to the PCB core plate, forms core material 10；Wherein, internal layer core
The sawing sheet size of plate 10 is 576mm x470mm, is more than the finished size 550mm x442.4mm of the PCB, in core material
10 surrounding leaves technique edges, facilitates lamination contraposition, plating folder point of follow-up production process etc.；
S13, first time plating is carried out to core material 10, the finished surface copper copper thickness of the first time plating of core material 10 is
2OZ can meet the copper thickness requirement of alternating-current charging pile pcb board carrying high current；Wherein, the copper thickness of core material 10 is
1OZ, for the first time plating need to add the copper of plating 1OZ thick so that the completion copper thickness of core material 10 reaches the requirement of 2OZ；
In some embodiments of the utility model, core material 10 can be the tabula rasa without copper foil, straight by tabula rasa
It connects plating and thickeies the external copper layer for arriving 2OZ, to meet the requirement of carrying high current.
S14, the inner figure film is made, and the core material 10 after first time plating is carried out according to the inner figure film
Etching, to make inner line figure.
Further, the production method of the PCB further includes step S20：Matched prepreg is selected according to gummosis amount,
And core material 10, prepreg, upper layer PCB daughter boards and lower layer's PCB daughter boards are pressed and to form the PCB；
In the present embodiment, the PCB is four-sheet structure, and the upper layer PCB daughter boards and lower layer's PCB daughter boards are with one
Determine the copper foil of copper thickness, the step S20 is specifically included：
S21, the first outer copper foil 11, the second outer copper foil 12 and two prepregs 13 are provided；Wherein, the first outer layer copper
The thickness of foil 11 and the second outer copper foil is 1OZ, and two prepregs 13 are calculated according to gummosis amount, 1080 models of selection
Prepreg, the other prepreg of 2116 models of selection, to reduce the risk of PCB layer pressure layering；
S22, in the first outer copper foil 11, pair of the second outer copper foil 12 and two prepregs 13 and core material 10
It answers position to produce target position hole, to ensure the exactitude position of the figure after being laminated between layers, dislocation open circuit is avoided to influence production
The reliability of product；
S23, according to the first outer copper foil 11, prepreg 12, core material 10, prepreg 12 and the second outer layer copper
The sequence that stacks of foil 12 is stacked；
S24, the multi-layer coreboard stacked is pressed stage by stage, forms the PCB.
In the present embodiment, it is put into the bonding phase after laminating press to the multi-layer coreboard stacked and specifically includes：
First pressing section, it is 21psi that pressing pressure, which is arranged, in laminating press, and pressing-in temp is arranged 140 DEG C and rises to 150 DEG C, holds
The continuous time is 6min；
Second pressing section, it is 37psi that pressing pressure, which is arranged, in laminating press, and pressing-in temp remains 160 DEG C, and the duration is
3min；
Third pressing section, it is 43psi that pressing pressure, which is arranged, in laminating press, and pressing-in temp remains 180 DEG C, and the duration is
6min；
4th pressing section, it is 81psi that pressing pressure, which is arranged, in laminating press, and pressing-in temp is arranged 190 DEG C and rises to 210 DEG C, holds
The continuous time is 75min；
5th pressing section, it is 49psi that pressing pressure, which is arranged, in laminating press, and pressing-in temp is down to 160 DEG C by 210 DEG C, is continued
Time is 10min.
The above lamination process for pressing, can be obviously improved the practical material temperature temperature difference of core material 10 and lamina rara externa, make internal layer
The laminated state of core plate and lamina rara externa reaches unanimity, and ensures the quality stability of the PCB, ensure that internal layer core after product lamination
Plate is consistent with the stress of lamina rara externa, prevents product warpage.
In some embodiments of the utility model, it can also be stacked by several PCB in the upper and lower surface of core material 10
PCB daughter boards made of core plate pressing can pass through prepreg or other materials bonding between every PCB core plate.
Further, the production method of the PCB further includes step S30：Drilling is carried out to the PCB and second is electroplated
To make outer-layer circuit figure and at least two through the PCB and avoid the drawing copper hole of the inner line figure；It is described
One end of copper hole hole copper is drawn to be connect with the face copper of the outer-layer circuit figure, in addition the other end for drawing copper hole hole copper is avoided
The outer-layer circuit figure of side；
In the present embodiment, step S30 is specifically included：
To drilling on the PCB, is at least formed and draw copper hole 31 and second to draw copper hole 32 through the first of the PCB；
Second is carried out according to predetermined electroplating time and scheduled current to the PCB to be electroplated, complete the PCB outer layers copper,
First draws copper hole 31 and described second to draw the plating of 32 hole copper of copper hole；The finished surface copper copper thickness of second of PCB plating is
4OZ；
In the present embodiment, the predetermined electroplating time of second of plating is 6h, scheduled current 1.6ASF, by the PCB
The face copper of outer-layer circuit figure complete copper thickness and be plated to 40Z, to ensure the high current bearing capacity of the PCB.
Further, the production method of the PCB further includes step S40：It is carried out after the PCB is baked to predetermined temperature
Tin is sprayed, tin layers against corrosion are covered in the graph area of the outer-layer circuit figure.
Specifically, after the PCB is first baked to 150 DEG C of predetermined temperature with oven, then lead-free tin spray is carried out at once,
Tin layers against corrosion are covered on the outer graphics region of the PCB.Technical solution provided in this embodiment first will before lead-free tin spray
The PCB is baked to predetermined temperature, can enhance the binding force of tin layers against corrosion and PCB outer-layer circuits graphics field, avoid PCB
The bubble on surface is layered so that PCB surface coating is smooth, colour stable, good weldability.
It is had the advantages that in conclusion implementing the utility model above-described embodiment：
(1) the finished surface copper copper thickness being electroplated for the first time in the present embodiment is 2OZ, and the finished surface copper copper thickness of second of plating is
4OZ is met the requirements of the standard, and can carry the high current of alternating-current charging pile；
(2) the present embodiment is according to the selection of gummosis amount and the matched prepreg of core material, and the multi-layer coreboard to stacking
It is pressed stage by stage, core material and the laminated state of outer layer daughter board is made to reach unanimity, ensure that internal layer core after product lamination
Plate is consistent with the stress of outer layer daughter board, effectively prevents warpage, is laminated the defects of layering；
(3) the present embodiment is provided at least two drawing copper hole on pcb board, can be by the PCB outer-layer circuits figure
Face copper hold, the face copper of avoiding warps, and keeps the surface smoothness of product, good weldability；
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, for this
For the technical staff in field, various modifications and changes may be made to the present invention.It is all in the spirit and principles of the utility model
Within, any modification, equivalent replacement, improvement and so on should be included within the right of the utility model.
Claims (8)
1. a kind of pcb board is used for alternating-current charging pile, which is characterized in that the pcb board includes the upper layer PCB for stacking pressing successively
Daughter board, core material and lower layer's PCB daughter boards, being made by first time plating on the core material has inner line figure,
The upper layer PCB daughter boards and lower layer's PCB daughter boards are made by second of plating outer-layer circuit figure；
It is further opened at least two on the pcb board through the pcb board and avoids the drawing copper hole of the inner line figure；Institute
It states and one end of copper hole hole copper is drawn to be connect with the face copper of outer-layer circuit figure, the other end of copper for drawing copper hole hole copper is avoided separately
The outer-layer circuit figure of outer side is arranged；
The graph area of the outer-layer circuit figure is also covered with tin layers against corrosion.
2. pcb board according to claim 1, which is characterized in that the drawing copper hole includes at least first and draws copper hole and second
Copper hole is drawn, one end of the first drawing copper hole hole copper is connect with the face copper of the outer-layer circuit figure of the upper layer PCB daughter boards, described
The other end of first drawing copper hole hole copper avoids the outer-layer circuit figure of the lower layer PCB daughter boards；
One end of the second drawing copper hole hole copper is connect with the face copper of the outer-layer circuit figure of the lower layer PCB daughter boards, and described the
The other end of two drawing copper hole hole copper avoids the outer-layer circuit figure of the upper layer PCB daughter boards.
3. pcb board according to claim 2, which is characterized in that the drawing copper hole further includes that third draws copper hole, the third
One end of copper hole hole copper is drawn to be connect with the face copper of the upper layer PCB daughter boards or the outer-layer circuit figure of lower layer's PCB daughter boards, described the
The other end of three drawing copper hole hole copper connects the face copper of independent pad.
4. pcb board according to claim 1, which is characterized in that the outer layer of the upper layer PCB daughter boards and lower layer's PCB daughter boards
The face copper thickness of line pattern is 4OZ；The face copper thickness of the inner line figure of the core material is 2OZ.
5. pcb board according to claim 1, which is characterized in that the upper layer PCB daughter boards include the first outer copper foil and
The first prepreg being pressed together between first outer copper foil and core material；
The lower layer PCB daughter boards include the second outer copper foil and are pressed together between second outer copper foil and core material
Second prepreg.
6. pcb board according to claim 1, which is characterized in that the sawing sheet size of the core material is 576mm
x470mm。
7. pcb board according to claim 5, which is characterized in that first outer copper foil, the second outer copper foil, first
The corresponding position of prepreg, the second prepreg and the core material offers target position hole, is used for lamination contraposition.
8. pcb board according to claim 5, which is characterized in that first prepreg and the second prepreg are
The prepreg of 1080 models or 2116 models.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820225889.7U CN207911147U (en) | 2018-02-08 | 2018-02-08 | A kind of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820225889.7U CN207911147U (en) | 2018-02-08 | 2018-02-08 | A kind of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207911147U true CN207911147U (en) | 2018-09-25 |
Family
ID=63559773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820225889.7U Active CN207911147U (en) | 2018-02-08 | 2018-02-08 | A kind of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207911147U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235605A (en) * | 2018-02-08 | 2018-06-29 | 深圳市通为信电路科技有限公司 | The production method and PCB of a kind of PCB |
| CN111010808A (en) * | 2019-12-31 | 2020-04-14 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN112954914A (en) * | 2021-01-29 | 2021-06-11 | 深圳市强达电路有限公司 | Manufacturing method of voltage-resistant reinforced printed circuit board |
-
2018
- 2018-02-08 CN CN201820225889.7U patent/CN207911147U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235605A (en) * | 2018-02-08 | 2018-06-29 | 深圳市通为信电路科技有限公司 | The production method and PCB of a kind of PCB |
| CN108235605B (en) * | 2018-02-08 | 2024-03-19 | 深圳市通为信电路科技有限公司 | PCB manufacturing method and PCB |
| CN111010808A (en) * | 2019-12-31 | 2020-04-14 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN111010808B (en) * | 2019-12-31 | 2022-05-13 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN112954914A (en) * | 2021-01-29 | 2021-06-11 | 深圳市强达电路有限公司 | Manufacturing method of voltage-resistant reinforced printed circuit board |
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